JP2006229297A - Strip line structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology capable of downsizing a passive circuit comprising a high frequency distributed constant circuit in a microstrip line structure or a strip line structure by circumventing constraints of the size of the passive circuit limited depending on a wavelength to be handled. <P>SOLUTION: The strip line structure employs a basic structure provided with: a signal line 3 arranged opposite to a ground conductor 1; and conductor poles 4 one-side ends of which are connected to the signal line 3 and which are extended in a direction of the ground conductor 1 located just beneath, and the other-side ends of which are arranged by maintaining a gap 5 with respect to the ground conductor 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a stripline structure having a high-frequency distributed constant circuit that is miniaturized by reducing the effective wavelength.

  Until now, high-frequency front-end circuits have always been required to be low-priced and downsized.

  Therefore, conventionally, a circuit configured by a multi-chip module has been made into a single chip, that is, MMIC (monolithic integrated circuit) or a chip size packaging technique has been introduced to meet the demand.

  However, for example, it can be seen that a power amplifier MMIC chip that is a part of a high-frequency front-end circuit is a passive element that occupies an overwhelmingly large area compared to a transistor part that is an active element. It is a matching circuit part.

  Therefore, in order to reduce the size of the MMIC chip, it is indispensable to reduce the size of the matching circuit portion. However, in the high frequency application using the distributed constant circuit, the size of the passive element portion depends on the wavelength handled there. Due to physical rules, there is a limit to miniaturization.

  In addition, the filter which is a passive component is the component which is most difficult to incorporate into the chip in the flow of making the high-frequency front-end circuit into one chip, and the reason is often constituted by using the chip component. In addition, when the chip component is not used, the size thereof is regulated according to the wavelength of the handling frequency as described above and depends on the fact that it cannot be miniaturized so as to be formed on the MMIC chip.

  Incidentally, in an inductor using a microstrip line structure, a structure is known in which columnar conductors connected to a ground conductor are provided on both sides of a signal line as an inductor for the purpose of obtaining a high Q value ( For example, see Patent Document 1.) 18A and 18B show a microstrip line structure disclosed in Patent Document 1, wherein FIG. 18A is a cutaway view of a main part, FIG. 18B is a front view of a main part cut. In FIG. Represents a dielectric, 33 represents a signal line, and 34 represents a conductor column. In the invention of Patent Document 1, since the conductor pillars 34 are provided on both sides of the signal line 33, the area cannot be reduced, and since the capacitance effect is small, the wavelength shortening effect is also small.

In addition, a structure in which a part of a signal line having a microstrip line structure and a ground conductor are connected by a conductor post is also known (see, for example, Patent Document 2). FIG. 19 is a cut-away side view of the main part showing the microstrip line structure disclosed in Patent Document 2, and the same symbols as those used in FIG. 18 represent the same parts or have the same meaning. In the invention of Patent Document 2, the conductor pillar 34 is connected to both the signal line 33 and the ground conductor 31, so that a good wavelength shortening effect cannot be obtained.
JP 2003-209437 A JP 2002-208806 A

  The present invention eliminates the restriction that the size of a passive circuit composed of a high-frequency distributed constant circuit in a stripline structure or a microstripline structure is regulated depending on the wavelength to be handled, thereby reducing the size. Try to be possible.

  In the stripline structure according to the present invention, the signal line disposed opposite to the ground conductor, one end connected to the signal line and extending in the direction of the ground conductor immediately below, and the other end is the ground. The configuration is basically provided with a conductor and a conductor column arranged with a gap maintained. In general, the stripline structure refers to the structure shown in FIG. 9 described later, and the structure shown in FIG. 1 is called a microstripline structure. The term “strip line structure” is used as a general concept including the line structure.

  By adopting the above means, when a resonant circuit made of a high frequency distributed constant circuit having a stripline structure according to the present invention having the same size as a resonant circuit made of a conventional high frequency distributed constant circuit is manufactured, the respective resonant frequencies are compared. Then, the resonance circuit composed of the high frequency distributed constant circuit having the stripline structure according to the present invention can be made 1/5 or less in size of the resonance circuit composed of the conventional high frequency distributed constant circuit.

  In other words, when a resonant circuit made up of a conventional high frequency distributed constant circuit having the same resonant frequency and a high frequency distributed constant circuit having a stripline structure according to the present invention is manufactured, according to the present invention, for example, open This means that the length of the stub can be reduced to 1/5 or less compared to the conventional one. Also, since a filter using a distributed constant normally uses a quarter wavelength resonance, the structure according to the present invention is used. By adopting it, the size can be drastically reduced.

  In addition to filters, there are various passive circuit elements using distributed constants such as power dividers, couplers, and matching circuits. All of these can be reduced in size by implementing the present invention. is there. For example, when applied to the rat race coupler described with reference to FIG. 7 and the effective wavelength is shortened to 1/5, the size of the coupler can be reduced to 1/25 by simple calculation.

  In the high frequency distributed constant circuit of the stripline structure according to the present invention, a conductor column for reducing the effective wavelength is interposed between the signal line and the ground conductor, and one end or both ends of the conductor column are provided. The structure is such that it does not come into direct contact with signal lines or ground conductors. Here, if only shortening the wavelength, and therefore miniaturization, is considered, the larger the capacitance, the better. Therefore, the smaller the distance between the conductor column and the signal line or the ground conductor, the better. However, one of the constraints on the interval is the film quality of the dielectric film existing in the interval, in other words, the breakdown voltage. That is, a dielectric film having a breakdown voltage required from the system side is required, and in the case of a dielectric film having a low breakdown voltage, it is necessary to increase the thickness. Considering only this point, the general minimum value of the interval is about 100 nm. Another limitation on the spacing is the characteristic impedance of the signal line required from the system side. The characteristic impedance of the signal line can be expressed as Z = sqrt (L / C). When there is a required impedance (for example, 50Ω) from the system side, increasing the capacitance by decreasing the interval increases the inductance to keep Z = sqrt (L / C) constant. That is, it is necessary to lengthen or narrow the conductor pillar. In consideration of MMIC, chip size package, etc., the thickness of the dielectric is 100 μm or less. Therefore, the upper limit of the length of the conductor pillar is also 100 μm or less, and the upper limit of the inductance is determined from this length and the dielectric constant of the dielectric. In order to keep the characteristic impedance of the signal line constant, the upper limit value of the capacitance is determined from the upper limit value of the inductance, and therefore the distance between the conductor column and the signal line is also determined. By the way, when showing typical values, the width of the signal line is about 10 μm to 100 μm, the distance from the conductor pillar is about 100 nm to 1 μm, the thickness of the dielectric is about 10 μm to 100 μm, the dielectric constant is about 3 to 10, and the conductor The thickness of the column is about 10 μm to 100 μm, and various combinations can be realized from these numerical ranges. Basically, the wavelength shortening effect increases as a material having a high dielectric constant is used.

  FIG. 1 is a cut perspective view of a main part showing the stripline structure of the first embodiment. In the figure, 1 is a ground conductor, 2 is a dielectric, 3 is a signal line, 4 is a conductor column, and 5 is an interval. Show.

  As is apparent from the figure, a conductor column 4 made of Cu or Al is disposed between the signal line 3 and the ground conductor 1, and the lower end of the conductor column 4, that is, the lower side facing the ground conductor 1. A space 5 is provided between the end faces.

  FIG. 2 is a cutaway side view for explaining the operating principle of the high frequency distributed constant circuit having the stripline structure shown in FIG. 1, and the same symbols as those used in FIG. It shall have the same meaning.

In the figure, reference numeral 6 denotes a high-frequency current path, and the effective series L component and ground C component as viewed from the high-frequency signal increase. The wavelength in the strip line is described by the following equation (1). If the effective L component and C component are increased, the effective wavelength is shortened. Therefore, it is possible to reduce the size of the passive circuit element in the high-frequency distributed constant circuit that is regulated by the wavelength.

  FIG. 3 is a cut-away side view of the main part showing the stripline structure of the second embodiment. The same symbols as those used in FIGS. 1 and 2 represent the same parts or have the same meaning.

  The difference between the second embodiment and the first embodiment is that the lower end of the conductor post 4 is connected to the ground conductor 1 and that there is a gap 5 between the upper end and the signal line 3. Even with a simple structure, the effective wavelength can be reduced by increasing the grounding C.

  FIG. 4 is a cutaway side view of the main part showing the stripline structure of the third embodiment. The same symbols as those used in FIGS. 1 to 3 represent the same parts or have the same meaning.

  Example 3 is different from Example 1 or Example 2 in that the lower end and upper end of the conductor column 4 are not connected to either the ground conductor 1 or the signal line 3, and therefore the lower end of the conductor column 4 and the ground conductor are not connected. 1 and a gap 5 is formed between the upper end and the signal line 3. Even in such a structure, for example, the gap between the signal line 3 and the conductor pillar 4 is sufficiently large. In other words, by increasing the capacitance between the conductor column 4 and the signal line 3, it is equivalent to the case where the conductor column 4 and the signal line 3 are connected at high frequencies such as microwaves and millimeter waves. An effect is obtained. Therefore, the effective wavelength can be reduced as in the first embodiment.

  In each stripline structure of the first to third embodiments, it is effective to use the conductor pillar 4 having a high aspect ratio in order to increase the L component, and the resistance value of the conductor pillar 4 itself is kept low. By using carbon nanotubes that can be used, it is possible to realize a low-loss conductor pillar having a high aspect ratio. In this case, the passive circuit element can be miniaturized without causing deterioration of characteristics.

  FIG. 5 and FIG. 6 are explanatory diagrams showing comparison results of the present invention and the conventional example regarding the simulation result of the resonance circuit using the 1 / 4λ open stub in the stripline structure, and FIG. 5 shows the present invention. 6 and FIG. 6 show conventional techniques. In any of the drawings, (A) shows the structure of the resonance circuit and (B) shows the characteristics. The conditions of the electromagnetic field simulation in Example 4 are a dielectric thickness of 100 μm, a signal line and stub line width of 20 μm, conductor pillars 20 × 20 × 99 μm, conductor pillar spacing of 20 μm, and a stub agency of 500 μm.

  The conventional resonance circuit has a structure in which a stripline structure is simply used and an open stub 3A is added to the signal line 3, and the resonance circuit of the present invention has a structure in which a conductor column 4 is connected directly below the open stub 3A. The size of the resonance circuit is the same for both.

  Comparing the characteristics seen in FIG. 5 and FIG. 6B, the resonance frequency in the resonance circuit of the stripline structure to which the present invention is applied is 10 GHz, whereas in the resonance circuit according to the prior art. The resonance frequency is 53 GHz, and it can be clearly seen that, according to the present invention, the resonance frequency is about 1/5 or less as compared with the prior art. Therefore, when compared with resonant circuits having the same resonant frequency, the size of the resonant circuit embodying the present invention can be reduced to about 1/5 or less than that of a resonant circuit according to the prior art.

  FIG. 7 is a plan view showing a rat race coupler. FIG. 7 shows the difference in size between the rat race coupler implementing the present invention shown in (A) and the conventional rat race coupler shown in (B). It is raised so that it can be grasped roughly.

  In the figure, 11 is a phase control line, 12 is an input section, 13 is a first output section, 14 is a second output section, and 15 is a 50Ω termination section. In the implemented rat race coupler, a conductor column similar to the conductor column described with reference to FIGS. 1 to 6 is disposed immediately below the phase control line 11.

  FIG. 8 is a cut perspective view of a principal part showing a strip line structure using a coupling conductor, and the same symbols as those used in FIGS. 1 to 6 represent the same parts or have the same meanings. And

  In the figure, reference numeral 7 denotes a coupling conductor, a conductor column 4 is fixed immediately below, and a gap 5 is provided between the lower end surface of the conductor column 4 and the ground conductor 1.

  FIG. 9 is a cut perspective view of a main part showing a strip line structure in which the present invention is applied to a normal strip line structure. Do the same symbols as those used in FIGS. 1 to 6 and 8 represent the same parts? Or it shall have the same meaning.

  In the figure, 4A is a conductor post disposed directly above the signal line 3, 2A is a dielectric, 1A is a ground conductor provided on the upper end side of the conductor post 4A, and 5A is an upper end surface of the conductor post 4A. The intervals between the ground conductor 1A are shown.

  The purpose and effect to be achieved by the seventh embodiment are exactly the same as those of the first embodiment. However, the ground conductors 1 and 1A are provided above and below the signal line 3, and the microstrip line structure of the first embodiment is used. The difference is that there is no original stripline structure.

  FIG. 10 and FIG. 11 are side sectional views showing the main part of the strip line structure at the main points of the process for explaining the process of manufacturing the strip line structure according to the present invention. To do.

See FIG. 10A (1)
A substrate 21 made of ceramic is prepared. The material of the substrate 21 is not limited to ceramic, and a low-loss material may be appropriately selected.

Refer to FIG. 10B (2)
For example, the ground conductor 22 made of an Al film having a thickness of about 1 μm is formed on the substrate 21 by applying a vacuum deposition method. The material of the ground conductor 22 is not limited to Al, and can be replaced with Au or Cu.

See FIG. 10C (3)
For example, by applying a sputtering method, an insulating film 23 made of SiO ₂ having a thickness of 0.2 μm is formed on the ground conductor 22, and then a bonding metal 24A is formed thereon. Note that SiO ₂ may be replaced with SiN, SOG, polyimide, or the like, and the point is that the film does not have conductivity.

Refer to FIG. 11A (4)
A resist pillar pattern is formed by applying a resist process in lithography technology, and then a conductive material made of Al, Au, or the like is deposited on the entire surface by applying a vapor deposition method to a thickness of about 1 μm. Conductor column base pattern is formed by lift-off that dissolves and peels off, then a resist process in lithography technology is applied to form a conductor column plating pattern with a thick resist film, and then a conductor made of Au or the like Plating column material. The height of the conductor pillar obtained by this is about 10 μm to 30 μm.

Refer to FIG. 11B (5)
By applying the spin coating method, the dielectric 25 made of spin-on-glass is formed to a thickness that sufficiently exceeds the height of the conductor column 24, and then applying the CMP (chemical mechanical polishing) method, The surface of the dielectric 25 is polished until the top surface of the pillar 24 is exposed. The spin-on glass can be replaced with other materials such as polyimide resin. Further, when it is desired to make the conductor pillar 24 high, this can be realized by repeating the above steps.

Refer to FIG. 11C (6)
By applying a vacuum deposition method and a normal lithography technique, a signal line 26 that contacts the top surface of each conductor column 24 and extends to the surface of the dielectric 25 is formed and completed.

  12 and 13 are sectional side views showing the main part of the stripline structure at the main points of the process for explaining the process of manufacturing the stripline structure according to the present invention. To do. Note that the structure of the lower part in the stripline structure of this embodiment is the same as the stripline structure described with reference to FIGS. 10 and 11, so that the description thereof will be omitted and the process of manufacturing the upper part will be described. The lower part is preferably prepared in advance.

See FIG. 12A (1)
A substrate 21A made of ceramic is prepared. The material of the substrate 21A is not limited to ceramic like the substrate 21, and a low-loss material may be appropriately selected.

Refer to FIG. 12 (B) (2)
By applying the vacuum deposition method, the signal line 22A made of an Al film having a thickness of about 1 μm is formed on the substrate 21A. The material of the signal line 22A is not limited to Al, and can be replaced by Au or Cu. Basically, there is no limitation as long as it is a metal.

See FIG. 12C (3)
Here, the conductor pillars 24 are formed, and the process may be the same as that of the eighth embodiment described with reference to FIGS.

See FIG. 13A (4)
The upper part manufactured as described above and the lower part prepared in advance are made to face each other, and both are coupled by flip chip bonding.

See FIG. 13B (5)
An underfill is injected between the upper part and the lower part to form the dielectric 25.

  14 and 15 are side sectional views showing the main part of the strip line structure at the main points of the process for explaining the process of manufacturing the strip line structure according to the present invention. To do.

See FIG. 14A (1)
A substrate 41 made of ceramic is prepared. The material of the substrate 41 is not limited to ceramic, and a low-loss material may be appropriately selected.

(2)
By applying the vacuum deposition method, a ground conductor 42 made of an Al film having a thickness of about 1 μm is formed on the substrate 41. The material of the ground conductor 42 is not limited to Al, but can be replaced with Au or Cu. Basically, there is no limitation as long as it is a metal.

(3)
By applying the sputtering method, an insulating film 43 made of SiO ₂ having a thickness of 0.2 μm is formed on the ground conductor 42. As a material for the insulating film, many materials such as SiN, SOG, and polyimide can be selected in addition to SiO ₂ . In short, it is necessary that the material is not a conductive material.

(4)
It consists of Ti / Co (about 1 nm / 1 nm) by applying a sputtering method after forming a resist film having a conductor column pattern opening by applying a resist process in lithography technology. A catalytic metal material film is formed, and a catalytic metal material film is patterned by applying a lift-off method of dissolving and peeling the resist film to form a carbon nanotube (CNT) growth catalyst 44.

See FIG. 14B (5)
By applying the CVD method, CNTs, that is, carbon nanotubes 45 are grown on the CNT growth catalyst 44. Needless to say, the CNT 45 forms a conductor column in the present invention. And this height (length) can be arbitrarily grown up to about 1 μm to 300 μm by controlling the CVD time.

See FIG. 15A (6)
By applying the spin coating method, a dielectric made of spin-on-glass is formed to a thickness that sufficiently exceeds the CNT 45, and then by applying the CMP method until the top surface of the CNT 45 is exposed. The insulating film 46 is polished. As a material of the insulating film 46, for example, polyimide resin or the like can be used in addition to spin-on-glass.

Refer to FIG. 15B (7)
By applying a vacuum deposition method and a normal lithography technique, a signal line 47 is formed as a contact on the top surface of each CNT 45 which is a conductor column and extending on the surface of the insulating film 46.

  FIG. 16 and FIG. 17 are side sectional views showing the main part of the stripline structure at the main points of the process for explaining the process of manufacturing the stripline structure according to the present invention. To do.

Refer to FIG. 16A (1)
By preparing a substrate 51 made of SiC and applying a sputtering method, a carbon film 52 having a thickness of about 100 nm is formed on the entire surface of the substrate 51 as a mask film for forming carbon nanotubes.

Refer to FIG. 16B (2)
By applying a resist process and a milling method in the photolithographic technique, an opening 52A is formed in the carbon film 52 covering the CNT formation scheduled portion.

See FIG. 16C (3)
Only the Si in the SiC substrate 51 is removed by heating the whole to a temperature of about 1500 ° C. in an O ₂ atmosphere, and carbon nanotubes 53 are formed in the remaining portion. The length of the carbon nanotube 53 can be arbitrarily set by controlling the time during which heat is applied, and a typical value is about 100 μm.

See FIG. 17A (4)
By removing the carbon film 52 by applying the milling method and then applying the vacuum deposition method, the back metal film 54 made of Au having a thickness of about 1 μm is formed on the entire back surface of the SiC substrate 51. Form. The back metal film 54 functions as a ground conductor. If the distance between the back metal film 54 acting as a ground conductor and the tip of the carbon nanotube 53 is to be precisely controlled to about 100 nm, for example, before the back metal film 54 is vacuum deposited, the SiC substrate 51 It is recommended that the back surface be polished and adjusted.

Refer to FIG. 17B (5)
By applying a vacuum deposition method and a normal lithography technique, a surface metal film 54 is formed which contacts the top surface of the carbon nanotube 53 and becomes a signal line extending on the surface of the SiC substrate 51. To complete.

  In the present invention, the present invention can be implemented in many forms including the above-described embodiment, which will be exemplified below as supplementary notes.

(Appendix 1)
A signal line arranged opposite to the ground conductor;
A strip line characterized in that one end is connected to the signal line and extends in the direction of the ground conductor immediately below, and the other end is provided with a conductor post disposed at a distance from the ground conductor. Construction.

(Appendix 2)
A signal line arranged opposite to the ground conductor;
A stub connected to the signal line; and a conductor post having one end connected to the stub and extending in the direction of the ground conductor immediately below, and the other end arranged to be spaced from the ground conductor. Stripline structure characterized by comprising

(Appendix 3)
A signal line arranged opposite to the ground conductor;
A coupling conductor attached to the signal line;
One end is connected to the coupling conductor and extends in the direction of the ground conductor immediately below, and the other end is provided with a conductor post disposed at a distance from the ground conductor. Stripline structure.

(Appendix 4)
A signal line arranged opposite to the ground conductor;
A strip line characterized in that one end is connected to the ground conductor and extends in the direction of the signal line directly above, and the other end is provided with a conductor post disposed at a distance from the signal line. Construction.

(Appendix 5)
A signal line arranged opposite to the ground conductor;
A stub connected to the signal line;
A stripline structure comprising: one end connected to the ground conductor, extending in the direction of the stub directly above, and the other end including a conductor post disposed at a distance from the stub.

(Appendix 6)
A signal line arranged opposite to the ground conductor;
A coupling conductor attached to the signal line;
One end is connected to the ground conductor and extends in the direction of the coupling conductor immediately above, and the other end is provided with a conductor post disposed at a distance from the coupling conductor. And stripline structure.

(Appendix 7)
A signal line arranged opposite to the ground conductor;
A strip line comprising conductor poles extending between the ground conductor and the signal line and having both ends disposed with a distance from the ground conductor and the signal line. Construction.

(Appendix 8)
A signal line arranged opposite to the ground conductor;
A stub connected to the signal line; and a conductor post extending between the ground conductor and the stub and having both ends disposed with a gap between the ground conductor and the signal line. Stripline structure characterized by comprising

(Appendix 9)
A signal line arranged opposite to the ground conductor;
A coupling conductor attached to the signal line;
A conductor post extending between the ground conductor and the coupling conductor and having both ends disposed with a distance from each of the ground conductor and the coupling conductor. And stripline structure.

(Appendix 10) A stripline structure according to (Appendix 7), comprising a switching element that is inserted between a conductor column and a signal line and controls the effective electrical length of the signal line by turning on and off. .

(Appendix 11)
The stripline structure according to (Appendix 7), further comprising a switching element that is inserted between the conductor pillar and the ground conductor and controls the effective electrical length of the signal line by turning on and off.

(Appendix 12)
The stripline structure according to (Appendix 8), further comprising a switching element that is inserted between the conductor pillar and the stub and controls the effective electrical length of the stub by turning on and off.

(Appendix 13)
The stripline structure according to (Appendix 8), further comprising a switching element that is inserted between the conductor pillar and the ground conductor and controls the effective electrical length of the stub by turning on and off.

(Appendix 14)
The stripline structure according to (Appendix 9), further comprising a switching element that is inserted between the conductor pillar and the coupling conductor and controls the effective electrical length of the coupling conductor by turning on and off.

(Appendix 15)
The stripline structure according to (Appendix 9), further comprising a switching element that is inserted between the conductor column and the ground conductor and is turned on / off to control the effective electrical length of the coupling conductor.

(Appendix 16)
The stripline structure according to any one of (Appendix 1) to (Appendix 15), characterized in that the conductor column is composed of carbon nanotubes.

(Appendix 17)
A signal line disposed between the opposing ground conductors;
One end of the signal line is connected to the signal line and directly or directly below the signal line, or extending in both directions of the signal line. And stripline structure.

(Appendix 18)
A signal line disposed between the opposing ground conductors;
A stub connected to the signal line;
One end of the stub is connected to the stub and directly or directly below the stub, or extending in both directions of the stub. Stripline structure.

(Appendix 19)
A signal line disposed between the opposing ground conductors;
A coupling conductor attached to the signal line;
One end of the coupling conductor is connected and directly above or below the coupling conductor, or extending in both directions thereof, and having a conductor column facing the ground conductor at a distance from the tip. A stripline structure characterized by

(Appendix 20)
A signal line disposed between the opposing ground conductors;
One end is connected to the ground conductor, and a conductor column is provided directly above or directly below the signal line, or extending in both directions thereof, and the tip thereof is opposed to the signal line while maintaining an interval. And stripline structure.

(Appendix 21)
A signal line disposed between the opposing ground conductors;
A stub connected to the signal line;
One end of the stub is connected to the ground conductor, and the stub extends in both directions. The tip of the stub is provided with a conductor column facing the stub while maintaining a gap. Stripline structure.

(Supplementary Note 22) A signal line disposed between opposing ground conductors;
A coupling conductor attached to the signal line;
One end is connected to the grounding conductor and directly or directly below the coupling conductor, or extending in both directions, and a tip of the conductor pole is provided to face the coupling conductor while maintaining a gap. A stripline structure characterized by

(Appendix 23)
A signal line disposed between the opposing ground conductors;
A strip line comprising conductor poles extending between the ground conductor and the signal line and having both ends disposed with a distance from the ground conductor and the signal line. Construction.

(Appendix 24)
A signal line disposed between the opposing ground conductors;
A stub connected to the signal line; and a conductor post extending between the ground conductor and the stub and having both ends disposed with a gap between the ground conductor and the signal line. Stripline structure characterized by comprising

(Appendix 25)
A signal line disposed between the opposing ground conductors;
A coupling conductor attached to the signal line;
A conductor column extending between the ground conductor and the coupling conductor and having both ends disposed with a distance from each of the ground conductor and the coupling conductor; A characteristic stripline structure.

(Appendix 26)
The stripline structure according to (Appendix 23), further comprising a switching element that is inserted between a conductor column and a signal line and controls an effective electrical length of the signal line by turning on and off.

(Appendix 27)
The stripline structure according to (Appendix 23), further comprising a switching element that is inserted between the conductor pillar and the ground conductor and controls the effective electrical length of the signal line by turning on and off.

(Appendix 28)
The stripline structure according to (Appendix 24), comprising a switching element that is inserted between the conductor pillar and the stub and that controls the effective electrical length of the stub by turning on and off.

(Appendix 29)
The stripline structure as set forth in (Appendix 24), comprising a switching element that is inserted between a conductor column and a ground conductor and is turned on / off to control the effective electrical length of the stub.

(Appendix 30)
The stripline structure according to (Appendix 25), comprising a switching element that is inserted between the conductor pillar and the coupling conductor and is turned on / off to control the effective electrical length of the coupling conductor.

(Appendix 31)
The stripline structure according to (Appendix 25), further comprising a switching element that is inserted between a conductor column and a ground conductor and controls an effective electrical length of the coupling conductor by turning on and off.

(Appendix 32)
The stripline structure according to any one of (Appendix 17) to (Appendix 31), characterized in that the conductor column is composed of carbon nanotubes.

FIG. 3 is a main part cutting slope view showing a stripline structure of Example 1. FIG. 2 is a cutaway side view of a main part for explaining an operation principle relating to a high-frequency distributed constant circuit having a stripline structure seen in FIG. It is a principal part cutting side view showing the stripline structure of Example 2. FIG. It is a principal part cutting side view showing the stripline structure of Example 3. FIG. It is explanatory drawing showing the simulation result of the resonant circuit using a 1 / 4lambda open stub. It is explanatory drawing showing the simulation result of the resonant circuit using a 1 / 4lambda open stub. It is a top view showing a rat race coupler. It is a principal part cutting slope figure showing the stripline structure using the conductor for coupling. It is a principal part cutting slope figure showing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is a principal part side view showing the stripline structure in the process important point for demonstrating the process of manufacturing a stripline structure. It is principal part explanatory drawing showing the conventional stripline structure. It is principal part explanatory drawing showing the conventional stripline structure.

Explanation of symbols

1 Grounding conductor 2 Dielectric 3 Signal line 4 Conductor pillar 5 Distance

Claims (5)

A signal line arranged opposite to the ground conductor;
A strip line characterized in that one end is connected to the signal line and extends in the direction of the ground conductor immediately below, and the other end is provided with a conductor post disposed at a distance from the ground conductor. Construction. A signal line arranged opposite to the ground conductor;
A strip line characterized in that one end is connected to the ground conductor and extends in the direction of the signal line directly above, and the other end is provided with a conductor post disposed at a distance from the signal line. Construction. A signal line arranged opposite to the ground conductor;
A strip line comprising conductor poles extending between the ground conductor and the signal line and having both ends disposed with a distance from the ground conductor and the signal line. Construction. A signal line disposed between the opposing ground conductors;
One end of the signal line is connected to the signal line and directly or directly below the signal line, or extending in both directions of the signal line. And stripline structure. A signal line disposed between the opposing ground conductors;
One end is connected to the ground conductor, and a conductor column is provided directly above or directly below the signal line, or extending in both directions thereof, and the tip thereof is opposed to the signal line while maintaining an interval. And stripline structure.

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