JP2006228781A - Method for manufacturing resistance element for incorporating component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a resistance element for preventing the resistance element whose resistance value has been adjusted by trimming incorporated in a substrate from varying by heating due to reflow caused by the lamination process of a multilayer interconnection board and the packaging of packaging components in a later process. <P>SOLUTION: In the manufacturing method of the resistance element for incorporating components, the resistance element arranged at a wiring board incorporated inside the substrate or on the outermost layer is irradiated with laser beams having output for preventing the resistance element from being damaged by using a laser trimming apparatus, and then the resistance element is trimmed by laser beams whose output has been increased. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a printed wiring board having a resistance element therein, and relates to a method of manufacturing a printed wiring board having a built-in resistance element composed of a pair of electrodes and a resistor disposed therebetween on an insulating substrate. The present invention relates to a method of manufacturing a resistance element with higher accuracy of the resistor and less fluctuation due to heat than the conventional method.

In recent years, as devices such as mobile phones and digital cameras have become smaller and lighter, passive elements such as resistors, capacitors, and inductors mounted on printed wiring boards have been downsized and the spacing between these elements has been reduced. Conventional mounting techniques make it difficult to cope with, and as a configuration that can cope with these problems, a multilayer printed wiring board in which a passive element is built in a printed wiring board can be cited.
Multilayer printed wiring boards with passive elements built into the printed wiring board can easily satisfy the characteristics required by equipment manufacturers by embedding existing chip elements as passive elements (capacitors, resistors, inductors). However, there is a problem in that the substrate containing the passive element becomes thick.
Therefore, a printed wiring board incorporating a passive element that can satisfy sufficient characteristics with a thin component or a thin film element is required.

In a printed wiring board with a built-in passive element, as a method of creating a resistance element inside the printed wiring board, for example, in the case of a resistance element, a method of forming a resistance layer with a metal thin film on a copper foil, plating on an insulating substrate And a method of printing a resistive thick film polymer. It is necessary to select a forming method for this resistance element according to the use from the resistance value, accuracy, shape, price, and the like.
Specifically, a technique called trimming using laser processing is generally used to adjust the resistance value after a resistance element is formed on a substrate.
First, trimming is to cut a resistor portion by laser processing while measuring the resistance value of the formed resistance element, and to cut the resistance up to a target resistance value. At present, it is possible to adjust the accuracy of the resistance value to ± 3% accuracy with respect to the target value by trimming.
As a trimming technique, there is a method of adjusting a resistance value not only by cutting a resistor as in Patent Document 1, but also by heating. There has been a problem that the resistance value changes again due to heating by reflow when mounting the mounting component.
Japanese Patent Application No. 4-95350

  An object of the present invention is to provide a resistance element manufacturing method in which a resistance element whose resistance value is adjusted by trimming incorporated in a substrate does not fluctuate due to heating by reflow applied in a subsequent step of laminating a multilayer wiring board or mounting a mounting component Is to provide.

First, the invention according to claim 1 uses a laser trimming apparatus as a resistance element disposed on a wiring board built in the substrate or in the outermost layer, and uses a laser beam with an output that does not damage the resistance element as a resistance element. After the irradiation, the resistance element is trimmed with a laser beam whose output is increased.

According to a second aspect of the present invention, in the first aspect, the resistance element has a temperature of a portion irradiated with a laser beam having an output that is not damaged in a range of 100 ° C. to 1200 ° C. This is a manufacturing method of a component built-in resistor.

The invention according to claim 3 is the component according to claim 1 or 2, wherein the laser beam has a spot diameter of an output laser beam not damaged is larger than a spot diameter at the time of trimming. This is a method of manufacturing a built-in resistance element.

The invention described in claim 4 is the method of manufacturing a component built-in resistor element according to any one of claims 1 to 3, wherein the laser is a YAG laser or a carbon dioxide gas laser.

According to a fifth aspect of the present invention, in the method for manufacturing a component built-in resistance element according to any one of the first to fourth aspects, the resistive element is a mixture of a carbon filler and an organic resin. is there.

The invention according to claim 6 is characterized in that the resistance element is made of a metal foil containing any one of nickel, chromium and tungsten. It is a manufacturing method.

The invention according to claim 7 is characterized in that the laser irradiation is performed while blowing an inert gas containing at least one of nitrogen, helium, neon, and argon. It is a manufacturing method of the resistor element for built-in description of description.

As in the first aspect of the present invention, the resistance element is heated before trimming, thereby suppressing a change in resistance value after trimming due to a heat history applied to the resistor during the reflow process during the multilayer substrate lamination process or component mounting. I was able to.

As in the invention of claim 2, before trimming, the resistance element is heated to a temperature higher than the thermal history applied during the reflow process during the multi-layer substrate laminating process or component mounting. The value change could be suppressed more effectively.

When heating the resistance element as in the third aspect of the invention, the laser spot diameter is made larger than that at the time of trimming so that the heating area can be increased, and the time for heating the entire resistance element is processed in a short time. Made it possible.

Further, as in the invention of claim 4, by using a YAG laser or a carbon dioxide gas laser as a trimming laser, the resistance element can be efficiently heated, and at the same time, the running cost of the trimming laser can be suppressed.

Further, as in the sixth aspect of the present invention, the resistance element using a metal foil whose resistance change due to heating is remarkable is particularly effective.

  As in the seventh aspect of the invention, when the resistance element is heated by laser irradiation while being heated while blowing an inert gas containing any of nitrogen, helium, neon and argon, Thermal damage to the substrate can be reduced. In addition, the metal foil resistor has an effect of preventing surface oxidation during heating.

A method for manufacturing a resistance element of a wiring board according to the present invention will be described with reference to the drawings.
As shown in FIG. 1A, the manufacturing method of the component built-in resistor element of the present invention expands the laser spot of the trimming device after the resistor 20 is formed, and reduces the beam output to an energy at which the resistor element is not processed. The heating laser beam 30 is scanned to irradiate the entire surface of the resistor 20.
When the temperature of the portion irradiated to the resistor is in the range of 100 ° C. to 1200 ° C., the resistor is heated to a temperature higher than the heat history applied during the reflow process during the multi-layer substrate lamination process or component mounting in the subsequent steps. It is preferable.
Next, after the resistor 20 is sufficiently heated, the trimming laser beam 40 that has been returned to the spot diameter for trimming the laser spot is cut and adjusted so as to obtain a desired resistance value while measuring the resistance value, and the adjusting resistor 20a is formed.
At the time of irradiation with the heating laser beam, an inert gas such as nitrogen, helium, neon, and argon was blown to suppress thermal damage other than the laser irradiation portion and prevent oxidation of the resistor 20 due to heat.
The resistor 20 is made of a mixture of a carbon filler and an organic resin, or a metal foil containing nickel, chromium, or tungsten.
It has become possible to manufacture a component built-in resistance element in which the resistance value does not change due to heating such as a reflow process used for mounting a multilayer wiring board or mounting components after trimming.

Hereinafter, Example 1 will be described with reference to FIG.
1A is a resistor 20 formed on an electrode 22 of a wiring board by electroless nickel plating. The thickness of the resistor is 0.5 μm, the size of the resistor 20 is 0.2 mm in width, 0.4 mm in length, and the resistance value is about 400 ohms. Is shown.
The resistor 20 is a trimming apparatus using a YAG laser, and the spot diameter of the laser is 40 μmφ during normal trimming. However, in order to heat the resistor as shown in FIG. The beam energy was set at 100 μm and irradiated with 2 W.
In order to heat the entire resistor 20, the heating laser beam 30 was scanned, and the entire resistor 20 was heated until the peak temperature reached 280 ° C.
During the heating laser beam irradiation, nitrogen gas was blown to suppress thermal damage other than the laser irradiation portion and to prevent oxidation of the resistor 20 due to heat.
This heating lowered the resistance value, and the resistance value, which was 400Ω, decreased to about 50 to 100Ω.
After the heating of the resistor 20 is completed, as shown in FIG. 1C, the laser spot diameter is returned to 40 μmφ, and the trimming laser beam 40 with the beam energy raised to 2.5 W is applied to the electrode portions at both ends of the resistor. The probe for resistance measurement was dropped, and it was cut and adjusted by laser trimming until the resistance value became 120Ω while measuring the resistance value.
The trimming adjustment resistor was able to be adjusted within a resistance value range of 120 ohms ± 3%.
The resistance element trimmed by this method took a thermal history of 175 ° C. for 2 hours when an insulating layer was laminated in the process of the multilayer wiring board, but even in that case, the resistance value change was about 1%.
In addition, when lead-free solder was mounted, the resistance value change could be suppressed to 3% or less even when reflowing at 260 ° C. was applied.

Hereinafter, Example 2 will be described with reference to FIG.
2A uses a resistor formed on an electrode of a wiring board by screen printing of carbon paste, and a silver paste for reducing contact resistance between the wiring electrode 22 and the resistor 20 is used. Similarly, a silver paste layer 24 provided by screen printing is formed.
The resistor 20 has a thickness of 20 μm, a width of 0.4 mm, a length of 0.7 mm, and a resistance value of about 1 KΩ.
Next, the resistor 20 is a trimming apparatus using a YAG laser, and the spot diameter of the laser is 40 μmφ during normal trimming. The spot diameter is set to 80 μm to 100 μm to heat the resistor, and the beam The energy was irradiated at 1.8W.
In order to heat the entire resistor 20, the heating laser beam 30 was scanned as shown in FIG. 2B, and the entire resistor 20 was heated until the peak temperature reached 280 ° C.
At the time of laser beam irradiation during heating, nitrogen gas was blown to suppress thermal damage other than the laser irradiation part. The resistance value decreased by heating, and the resistance value, which was 1 KΩ, decreased to about 800 to 900Ω.
After the heating of the resistor 20 is completed, as shown in FIG. 2C, the laser spot diameter is returned to 40 μmφ, and the trimming laser beam 40 with the beam energy raised to 2.5 W is used. A resistance measurement probe was dropped on the electrode part, and the resistance value was measured and then cut by laser trimming until the resistance value became 1 KΩ again, thereby producing an adjustment resistor 20a.
The trimming adjustment resistor could be adjusted within a resistance value range of 1 KΩ ± 3%.
The resistance element trimmed by this method is used when the insulating layer is laminated in the process of the multilayer wiring board. The resistance element trimmed by this method is 175 ° C. for 2 hours when the insulating layer is laminated in the process of the multilayer wiring board. Although a heat history was applied, the resistance value change was about 1% even in that case.
In addition, when lead-free solder mounting was performed, the resistance value change could be suppressed to within 5% even when reflowing at 260 ° C. was applied.

(Comparative Example 1)
The resistance element is a metal resistor formed on the electrode 22 of the wiring board by electroless Ni—P—Fe plating. The film thickness of this resistor is 0.3 μm, the size of the resistor 20 is 0.2 mm in width, 0.4 mm in length, and the resistance value is This is a trimming device using a YAG laser, with a laser spot diameter of 40 μmφ and a beam energy of 2.5 W rimming laser beam 40 without performing heat treatment, and a resistance measurement probe is dropped on the electrodes at both ends of the resistor. While measuring the resistance value, it was cut and adjusted by laser trimming so that the resistance value was in the range of 1 KΩ ± 3%.
This resistive element had a resistance value of 40% because a thermal history of 175 ° C. for 2 hours was applied when an insulating layer was laminated in the multilayer wiring board process.

(Comparative Example 2)
In Example 2, an adjustment resistor was prepared by laser trimming without performing heat treatment and adjusting the resistance value within a range of 1 KΩ ± 3%.
When this adjustment resistor was subjected to reflow at 260 ° C. during lead-free solder mounting, the resistance value change was 5% or more.

Explanatory drawing which shows an example of the manufacturing method of this invention. Explanatory drawing which shows the other example of the manufacturing method of this invention.

Explanation of symbols

10... Wiring electrode 20... Resistor 20 a... Adjustment resistor 30. Beam 40 ... Laser beam for trimming

Claims (7)

  Using a laser trimming device, the resistive element placed on the wiring board built in the substrate or on the outermost layer is irradiated with a laser beam with an output that does not damage the resistive element. After heating, the output is increased. A method for manufacturing a component-embedded resistor element, wherein the resistor element is trimmed with a laser beam.   2. The method of manufacturing a component built-in resistance element according to claim 1, wherein the temperature of a portion irradiated with the laser beam having an output not damaged is in a range of 100 ° C. to 1200 ° C. 3.   3. The method of manufacturing a component built-in resistor element according to claim 1, wherein the laser beam has a spot diameter of an output laser beam that is not damaged and larger than a spot diameter at the time of trimming.   4. The method for manufacturing a component built-in resistor element according to claim 1, wherein the laser is a YAG laser or a carbon dioxide gas laser.   The method for manufacturing a component built-in resistor element according to any one of claims 1 to 4, wherein the resistor element is a mixture of a carbon filler and an organic resin.   The method of manufacturing a component built-in resistor element according to claim 1, wherein the resistor element is made of a metal foil containing any one of nickel, chromium, and tungsten.   6. The method of manufacturing a component built-in resistance element according to claim 1, wherein the laser irradiation is performed while blowing an inert gas containing at least one of nitrogen, helium, neon, and argon. .

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