JP2006220237A - High pressure fluid logic plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a logic plate having a large size, in particular, for completely preventing the leakage of fluid while sufficiently securing the passage sectional area of a fluid passage, when used for controlling high pressure fluid whose pressure reaches 20-30MPa. <P>SOLUTION: The logic plate comprises a grooved plate member having a groove and a cover plate member covering the groove to form a closed passage. The cover plate member is joined along the grooved plate member with friction stirring. Equipment is provided on the cover plate member, and it is mounted on the grooved plate member across the cover plate member. A reinforcing plate member is provided on another portion of the cover plate member facing the other passage, than a portion of the cover plate member facing the passage which is reinforced by the equipment, and it is connected to the grooved plate member across the cover plate member with a connection means. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a logic plate, and more particularly to a logic plate for high pressure fluid.

  In an apparatus for controlling the flow of fluid, a complicated control circuit is generally configured by combining valves and pipes that operate in response to signals such as electricity and fluid pressure. In that case, careful work has been required in order to surely join pipes and attach valves and prevent fluid leakage at the joints. Conventionally, in order to facilitate these operations, and to reduce the size of the pipe line and facilitate maintenance, valves are attached to circuit members with built-in fluid passages to integrate the fluid control device. Tended to be. However, even if a circuit member containing a complicated fluid passage is carefully cast with advanced casting technology, a hollow, crack, bubble, etc. can be formed and the passages communicate with each other, and the sand removal in the passage is completely performed. This makes it difficult to cause trouble in valves and fluid equipment.

  As means for solving these problems, a groove serving as a fluid passage is provided in the plate member, a fluid passage is formed by screwing the lid plate member to the plate member to cover the groove, and the fluid is formed in the plate member and the lid plate member. There has been disclosed a configuration in which holes communicating with the passages at required locations are provided, and various valves and pipe joints for fluid outflow are provided (see, for example, Patent Document 1). In addition, a plate member provided with a complicatedly shaped groove and a plate member formed by adhering a lid plate member with an adhesive and covering the groove to form a three-dimensional fluid circuit are laminated. Such a technique is also disclosed (for example, refer to Patent Document 2).

Further, in order to strengthen the bonding between the plate member provided with the groove and the cover plate member, and to ensure the sealing performance of the fluid passage formed by the groove of the plate member and the cover plate member, A method of friction stir welding the cover plate member along the same is disclosed (for example, Patent Document 3).
Furthermore, it has been proposed that the logic plate is made of a non-metallic material to prevent the corrosion of the flow path and the electric corrosion due to the corrosive fluid. In this case, in order to compensate for the insufficient strength of the non-metallic material, There is also disclosed a technique in which a support plate made of a non-metallic material capable of maintaining material or rigidity is screwed to the back surface of a lid plate member or a plate member provided with a groove (for example, Patent Document 4).

Japanese Patent Publication No.49-13651 JP 2002-305010 A Japanese Patent No. 3564430 JP 2004-316663 A

  Such logic plates include, for example, air brake devices for railway vehicles, devices having many pipes, solenoid valve units, cooling or hot plates, pneumatic / hydraulic / steam piping, thin pressure vessels, automotive / stationary fuels Used or about to be used in a wide range of devices such as batteries.

  However, when it is intended to be used for controlling a high-pressure fluid reaching a pressure of 20 to 30 MPa, the one disclosed in Patent Document 1 can be configured to withstand such a high pressure. Since the member and the cover plate member are screwed together, it is not easy to completely prevent leakage of the high-pressure fluid over the entire length of the fluid passage that is a complicated and long flow path. Moreover, the thing disclosed by patent document 2 has joined the groove plate member and the cover plate member with the adhesive agent, and cannot endure high pressure and high temperature.

  As described in Patent Document 3, if the lid plate member is friction stir welded along the groove of the groove plate member, leakage of fluid through the fluid passage is prevented against a considerably high pressure or high temperature fluid. However, since the thickness of the cover plate member capable of friction stir welding is limited to about 4 mm or less, when the groove width is large, the force due to the fluid pressure applied to the cover plate member becomes large and the cover plate member is joined. The strength of the part and the cover plate member itself is insufficient. If the groove width is reduced, the force due to the fluid pressure can be reduced. In this case, it is necessary to increase the depth of the groove in order to secure the necessary passage area of the fluid passage. As the thickness increases, the logic plate becomes thicker and the weight increases. The one disclosed in Patent Document 4 is configured such that the groove plate member and the cover plate member are made of a non-metallic material in order to improve the corrosion resistance, and is not configured to withstand the high pressure as described above.

  Accordingly, an object of the present invention is to provide a logic plate capable of completely preventing fluid leakage while sufficiently securing the cross-sectional area of the fluid passage when used for controlling a high-pressure fluid whose pressure reaches 20 to 30 MPa. Is to provide.

In order to achieve the above object, the present invention provides a logic plate comprising a groove plate member having a groove and a cover plate member covering the groove to form a closed passage, wherein the cover plate member is along the groove plate member. And a stiffening plate on the lid plate member portion facing the passage other than the portion where the device is mounted on the lid plate member and the lid plate member portion facing the passage is reinforced by the device. The present invention proposes a logic plate for high-pressure fluid, characterized in that a member is connected to the groove plate member by a connecting means with the lid plate member interposed therebetween.
Friction stir welding is often used for joining aluminum-based materials, but if configured in this way, a relatively thin lid plate member can be easily and inexpensively joined by friction stir welding to form the groove of the groove plate member and the groove plate member. Although it is possible to completely prevent fluid leakage through the fluid passage formed by the cover plate member, the cover plate member is made of aluminum material that is relatively thin and does not have sufficient strength. The portion of the lid plate member facing the groove, particularly the friction stir welded portion, is insufficient. If the reinforcing plate member is attached to the front surface of the upper surface of the lid plate member, this lack of strength can be resolved. However, in the case of a large logic plate, covering the entire surface with the reinforcing plate member is the work of attaching the reinforcing plate member, the logic plate It is not preferable from the viewpoint of an increase in cost associated with an increase in weight. The present invention attaches equipment attached to the logic plate as much as possible to the upper surface of the cover plate member, and bears reinforcement of the cover plate member portion facing the groove passing under the cover plate member with which the device is in contact. Thus, the reinforcing plate member tries to bear the portion where these devices do not come into contact with the lid plate member.

The reinforcing plate member does not need to cover the entire surface of the portion not covered with the device, and there may be a gap between the portion covered with the device and the portion covered with the reinforcing plate member. If the gap is long, the force applied to the portion of the lid plate member facing the groove due to the fluid pressure increases, and particularly the friction stir welded portion of the lid plate member is damaged. Therefore, the gap is the lid plate member in the gap. The gap is such that the portion of the cover plate member that faces the groove passing under is not damaged by the pressure of the fluid passing through the groove. That is, the logic plate according to the present invention has a space as described above with respect to a space occupied by a device that can be a reinforcing plate member to be attached to the upper surface of the lid plate member that is friction stir welded along the groove of the groove plate member. It can supply in the state which attached the reinforcement board member.
Therefore, the cover plate member of the logic plate is reinforced by the device attached to the upper surface of the cover plate member and the reinforcement plate member attached with a gap between the device without covering the entire upper surface with the reinforcement plate member. The groove width of the groove plate member can be sufficiently increased and the groove depth can be moderately suppressed, and an increase in the thickness of the groove plate member accompanying an increase in the groove depth for securing the flow path cross-sectional area can be suppressed. it can. In general, a shallow groove is easier to process than a deep groove, and the processing cost can be reduced.

  In a logic plate having a groove plate member having a groove and a cover material that is friction stir welded along the groove, when a high-pressure fluid passes through the groove, the device attached to the upper surface of the cover plate member By providing a part of the reinforcing role and attaching the reinforcing plate member to a portion that cannot be reinforced by the device, the area to be reinforced by the reinforcing plate member can be saved. In particular, in the case of a large logic plate, the area required for the reinforcing plate member is greatly reduced as compared with the entire area of the logic plate, so that the cost and weight of the logic plate can be reduced.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the invention will be described with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention unless otherwise specified, but are merely illustrative examples. Not too much.

  FIG. 1 is a partial perspective view of a logic plate comprising a groove plate member having a groove and a lid plate member that is friction stir welded along the groove, and FIG. 2 is a partial top view of the lid plate member of the logic plate of FIG. It is a fragmentary perspective view which shows the state which attached the apparatus to the said cover plate member upper surface of the logic plate of this invention which attaches a reinforcement board member to.

  1, reference numeral 10 denotes a logic plate in which a cover plate member 2 is friction stir welded along the grooves 1a, 1a,... Of the groove plate member 1, and the cover plate member 2 has the grooves 1a, 1a,. Are provided with communication holes 15, 15,. These communication holes are holes through which fluid passing through the groove (fluid passage formed by the cover plate member covering the groove) is introduced into a device attached to the upper surface of the cover plate member 2. In FIG. 2, reference numeral 11 denotes a reinforcing plate member, and 12 denotes an apparatus in which the reinforcing plate member 11 is attached to the groove plate member 1 with the lid plate member 2 sandwiched between the upper surface of the lid plate member 2. It is a clamping bolt attached to the groove plate member. Reference numeral 13 is a device, and 14 is a bolt for attaching the device 13 to the groove plate member 1 with the cover plate member 2 sandwiched between the upper surface of the cover plate member 2.

  Friction stir welding is often used for joining aluminum materials, but the thickness of the lid plate member to be joined is limited, and the thickness is currently limited to about 4 mm. Therefore, the flow path formed by covering the groove 1a of the groove plate member with the lid plate member and joining the lid plate member by friction stir welding along the groove has a limited thickness of the lid plate member. Therefore, it cannot withstand the pressure of the high-pressure fluid reaching 20-30 MPa, and the cover plate member is damaged. In order to withstand such a high pressure, one method is to cover the cover plate member with a reinforcing plate member that is connected to the groove plate member with the cover plate member sandwiched between the upper surface and the front surface of the cover plate member. In the case of a plate, it is not preferable from the viewpoints of the work of attaching the reinforcing plate member, the cost increase accompanying the increase in the weight of the logic plate, and the like.

  In the present invention, as shown in FIG. 2, if the device is attached to the upper surface of the cover plate member 2, the portion where the device is attached reinforces the flow path with the device, so the portion where the device is not attached A reinforcing plate member was attached only to the above. Even if there is an unreinforced portion between the reinforcing plate member and the device, the length is such that the lid plate member that forms the flow path, particularly the friction stir welding portion, is not damaged by the fluid pressure flowing through the flow path. Otherwise. The allowable interval is determined by the groove width, the thickness of the cover plate member, the pressure of the fluid flowing through the groove, and the like.

  In FIG. 2, the device 13 is attached only to the surface of the lid plate member 2, but it is needless to say that there may be a device attached to the back surface of the groove plate member 1. Since the device and the groove (flow path) communicate with each other through a communication hole, the mounting surface of the device and the surface of the logic plate are sealed by a sealing means such as an O-ring or packing. Is simply attached, and it is not necessary to provide a seal member between the cover plate member and the cover plate member. 2 shows only the device 13, it is needless to say that a plurality of devices, valves, inlet / outlet connectors and the like may be attached to the communication holes 15,.

  In particular, a logic plate suitable for use in controlling a high-pressure fluid that is large and has a pressure of 20 to 30 MPa can be provided.

It is a fragmentary perspective view of the logic plate which consists of the groove plate member which has a groove | channel, and the lid plate member friction-stir-joined along this groove | channel. It is a fragmentary perspective view which shows the state which attached the apparatus to the said cover plate member upper surface of the logic plate of this invention formed by attaching a reinforcement board member partially on the cover plate member upper surface of the logic plate of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Groove plate member 1a Groove 2 Cover plate member 10 Logic plate 11 Reinforcement plate member 12, 14 Bolt 13 Equipment 15 Communication hole

Claims (2)

  In a logic plate comprising a groove plate member having a groove and a lid plate member covering the groove and forming a closed passage, the lid plate member is friction stir welded along the groove plate member, and the lid plate member An apparatus is mounted on the lid plate member portion facing the passage other than the portion where the lid plate member portion facing the passage is reinforced by the device, and the reinforcing plate member is sandwiched between the grooves with the lid plate member interposed therebetween. A logic plate for high-pressure fluid, wherein the logic plate is connected to a plate member by connecting means.   In the logic plate in which the lid plate member is joined along the groove of the groove plate member by friction stir welding to form a closed passage, the lid plate member is friction stir welded along the groove plate member, and the lid plate member The gap between the outer peripheral surface of the device to be attached to the lid plate member and the outer peripheral surface of the reinforcing plate member attached adjacent to the device is the groove plate of the lid plate member at the gap portion. The high-pressure fluid is characterized in that the reinforcing plate member is disposed so as to maintain a distance at which a portion facing the groove of the member, in particular, the friction stir welding portion is not damaged by the pressure of the high-pressure fluid passing through the groove. Logic plate.

Images