JP2002305010A - Logic plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a logic plate of a device or the like of a fuel cell electric power generation system wherein a complicated piping, a part of parts and wiring or the like are make to be built in the plate, wherein assembling is made easier, the device is safe and its downsizing is enabled. SOLUTION: The logic plate is constituted by jointing at least 2 sheets of plates and connects an equipment 5 or the like with a groove 8 formed on a plate jointing face. Further, at least 6 sheets of plates are jointed to make a three-dimensional logic plate. A corrosion-preventive layer is formed on the groove. Otherwise, a corrosion-resistant piping is installed at the groove. Sealing is made at a position of a welding line to surround the groove. Plural pairs of the logic plates are integrated and made three-dimensional. This is made to be a heat insulating and three-dimensional module by interposing and installing a heat insulating material or a separating material between rear faces of the logic plates. Plural pairs of the logic plates are arranged and installed on the same pedestal while keeping heat insulating distances. A heat- blocking groove is installed between a high-temperature zone and a low- temperature zone. A control equipment or the like is also built in the logic plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a logic plate, and more specifically, to a logic unit for piping and wiring such as a fixed unit in which piping and wiring are incorporated in an apparatus, and a unit integrated so as to be assembled and transported. About the plate.

[0002]

2. Description of the Related Art The prior art of a fuel cell power generation system will be described as an application example of a fixed unit in which piping, wiring, and the like are incorporated in a device, and an integrated unit capable of being assembled and transported.

FIG. 40 shows an example of a flow chart of a conventional fuel cell power generation system. As shown in the figure, the liquid fuel 41a such as methanol is vaporized by using the exhaust heat of the reformer 49 in the vaporizer 42, heated in the heat exchanger 43, and then hydrogen-rich from the CO converter 46. The gas is introduced into the desulfurizer 44 together with a part of the gas to remove the sulfur content. In the case of a gaseous fuel 41b such as natural gas, the gaseous fuel 41b is supplied directly to the heat exchanger 43, bypassing the vaporizer 42. In the case of using a fuel with a low sulfur content, a desulfurizer 44 is used.
May be omitted.

[0004] The desulfurized fuel gas is heated in a heat exchanger 48 together with steam 47 generated in a steam separator 45 and then sent to a reformer 49. The reformer 49 reforms the fuel gas to generate a hydrogen-rich reformed gas. After the temperature of the reformed gas discharged from the reformer 49 is reduced by the heat exchanger 50, carbon monoxide in the reformed gas is changed to carbon dioxide in the CO converter 46.

[0005] After the temperature of the reformed gas exiting the CO converter 46 is further reduced by a heat exchanger 51, the reformed gas is introduced into a condenser 52, where unreacted steam is condensed and removed. The condensed water separated by the condenser 52 is sent to the steam separator 45, and is sent again to the reformer 49 as steam 47. After the temperature of the reformed gas exiting the condenser 52 is increased by the heat exchanger 53, the reformed gas is sent to the hydrogen electrode 55 of the fuel cell main body 54, and the hydrogen in the reformed gas is used for the cell reaction.

The fuel cell main body 54 is composed of a hydrogen electrode 55, an electrolyte 56 and an oxygen electrode 57. Hydrogen ions generated at the hydrogen electrode 55 move through the electrolyte 56 and move to the oxygen electrode 57.
And the air 58 supplied as an oxidant is
The battery temperature is raised at 9 and a battery reaction is performed with oxygen in the air 58 introduced into the oxygen electrode 57.

The temperature of the exhaust gas from the oxygen electrode 57 is reduced by the heat exchanger 60, and the generated water is condensed and removed by the condenser 61, and then discharged out of the system. The water generated here is also a steam-water separator 4.
5 and used as steam 47. Since the cell reaction in the fuel cell main body 54 is an exothermic reaction, the fuel cell main body 54 and peripheral devices are generally provided with a cooling device 62 using water or air as a refrigerant.

The DC power 63 generated by the fuel cell main body 54 is used as the DC power 63 in some cases.
5 and supplied to the load 66 in some cases.

On the other hand, the exhaust gas containing unreacted hydrogen from the hydrogen electrode 55 of the fuel cell body 54 passes through the flow divider 72 and is used together with the external air 68 as the heating fuel 67 of the reformer 49 which is an endothermic reaction. After being processed by the burner 73, it is discharged. At this time, the heating fuel 67
Is insufficient, a part of the outlet gas of the desulfurization device 44 is used as the auxiliary fuel 76. Part of the combustion exhaust gas from the reformer 49 is used as a heat source of the vaporizer 42.
Otherwise, after the temperature is reduced by the heat exchanger 74, the water is sent to the condenser 75, and the generated water is separated and released into the atmosphere, and the generated water is returned to the steam separator 45.

Next, an outline of control in the fuel cell power generation system will be described. First, the fuel cell body 54
The flow rate of the reformed gas supplied to is detected by the ammeter I of the load current with respect to the load 66, and the signal is sent to the control device 69.
Based on a signal from the control device 69, the control is performed by opening and closing the flow control valve 70a or 70b. Further, the supply amount of steam 47 necessary for reforming the fuel gas is detected by the flow meter F, and the opening and closing of the steam flow regulating valve 71 is controlled by a signal from the control device 69. The temperature in the reformer 49 is constantly monitored by the temperature sensor T, and the fuel 41a, 41
This is controlled by the flow control valves 71a and 70b of b.

[0011]

As described above,
A fuel cell power generation system is composed of many devices and components having various functions, some of which are exposed to high temperatures. In order for liquids or gas bodies of various properties, temperatures and pressures to flow continuously between these devices, large and small pipes are provided in a complicated manner both vertically and horizontally. Further, sensors and control devices for always operating the fuel cell system normally are provided, and a large number of wirings and the like necessary for these are provided. In particular, in a fuel cell power generation system that is transportably integrated and assembled for the purpose of mounting on a vehicle, etc., it is strongly required that the size of the device be reduced, so that many devices, parts, piping, etc. must be installed in a narrow space. Efforts have been made to place the density.

However, arranging the above-described components, sensors, control devices, and the like in a narrow space and connecting them with piping makes it difficult to reduce the size of the device.

Further, piping work in a narrow space is inefficient, requires much time, and requires a lot of time. In addition, in a case where piping is impossible in a narrow space, a fluid such as hydrogen leaks from a joint or the like. There were many problems, such as a high possibility of delivery.

Accordingly, in view of the above-mentioned circumstances, the present invention incorporates complicated piping, some parts, wiring, and the like in a plate, thereby facilitating assembly, making it possible to reduce the size of the apparatus safely and safely. It is another object of the present invention to provide a logic plate such as a device of a fuel cell power generation system.

[0015]

Means for Solving the Problems A first method for solving the above problems is described below.
The logic plate of the present invention is a logic plate formed by joining two or more plates, and a device or a component of an apparatus is disposed on one or both surfaces of the logic plate, and the plate is joined. A groove serving as a fluid flow path is formed on the surface, and one or more sets of logic plates configured to connect the devices or components are provided by the groove, and a corrosion-resistant layer is formed on the surface of the groove. And

According to a second aspect of the present invention, there is provided a logic plate according to the first aspect, wherein an anticorrosion layer is formed also on a joint surface of the plate.

Further, the logic plate of the third invention is characterized in that, in the logic plate of the first or second invention, the corrosion-resistant layer is formed by applying a fluororesin coating or a fluororesin lining.

The logic plate according to a fourth aspect of the present invention is the logic plate according to the first or second aspect, wherein the anticorrosion layer is formed by performing an aluminum oxide film treatment.

The logic plate according to the fifth aspect of the present invention includes
A logic plate formed by joining two or more plates, and a device or a component of the device is arranged on one or both surfaces of the logic plate, and a fluid flow path is formed on a joining surface of the plate. Forming one or more sets of logic plates configured to connect the devices or parts by the grooves, and welding the plate at a position of a welding line surrounding the periphery of the grooves; The part is configured to seal a fluid flowing through the groove.

Further, the logic plate according to the sixth aspect of the present invention is characterized in that
A logic plate formed by joining two or more plates, wherein components or components of the device are disposed on one surface of the logic plate, and a groove serving as a fluid flow path is formed on a joining surface of the plate. And a plurality of sets of logic plates configured to connect the devices or parts by the grooves are provided, and the plurality of sets of logic plates are integrally fixed in a state where the backs of the plurality of sets of logic plates are aligned. By doing so, a three-dimensional module is obtained.

A logic plate according to a seventh aspect of the present invention is the logic plate according to the sixth aspect, wherein a heat insulating material is provided between the back surfaces of the plurality of sets of the logic plates to form a heat insulating three-dimensional module.

The logic plate according to an eighth aspect of the present invention is the logic plate according to the sixth aspect, characterized in that a heat insulating three-dimensional module is provided by interposing a separating member between the back surfaces of the plurality of sets of logic plates.

A logic plate according to a ninth aspect of the present invention is the logic plate according to the eighth aspect, wherein a heat insulating material is provided between the back surfaces of the plurality of sets of logic plates and the spacer.

Further, a logic plate according to a tenth aspect of the present invention comprises:
A logic plate according to a sixth aspect of the present invention, wherein constituent devices or components of the device are interposed between the back surfaces of the plurality of sets of logic plates.

Further, the logic plate according to the eleventh invention is characterized in that:
In a logic plate according to a tenth aspect of the present invention, a heat insulating material is provided between the back surfaces of the plurality of sets of logic plates and components or components provided between the back surfaces.

Further, the logic plate according to the twelfth invention is characterized in that:
A logic plate formed by joining two or more plates, and a component or device of the apparatus is disposed on one of the surfaces of the logic plate, and a fluid flow path is formed on a joining surface of the plates. A plurality of sets of logic plates, each having a groove formed therein and configured to connect the device or component by the groove, are provided, and the plurality of sets of logic plates are arranged on the same stand while keeping adiabatic intervals. .

Further, a logic plate according to a thirteenth aspect of the present invention comprises:
In the logic plate according to a twelfth aspect, a heat insulating material is provided between the plurality of sets of logic plates and the mount.

The logic plate according to a fourteenth aspect of the present invention
A logic plate formed by joining two or more plates, wherein a component device or a component of the device is disposed on one or both surfaces of the logic plate, and a fluid flow path is provided on a joining surface of the plate. Forming a groove, and providing one or more sets of logic plates configured to connect the devices or components by the grooves, and disposing a high-temperature zone in which high-temperature devices or components are disposed, and a low-temperature device or components. A heat blocking groove is provided between the low temperature zone and the low temperature zone.

Further, a logic plate according to a fifteenth aspect of the present invention comprises:
A logic plate according to a fourteenth aspect of the present invention, wherein the heat insulating groove is filled with a heat insulating material.

A logic plate according to a sixteenth aspect of the present invention comprises:
In the logic plate according to a fourteenth aspect, a coolant is caused to flow through the heat blocking groove.

A logic plate according to a seventeenth aspect of the present invention comprises:
A logic plate formed by joining two or more plates, wherein a component device or a component of the device is disposed on one or both surfaces of the logic plate, and a fluid flow path is provided on a joining surface of the plate. One or more sets of logic plates configured to connect the devices or components by the grooves are provided, and any device, component, control device, electrical wiring, or the like that configures the device is included in any of the plates. Or characterized in that it is built in all.

Further, a logic plate according to an eighteenth aspect of the present invention comprises:
A logic plate formed by joining two or more plates, wherein a component device or a component of the device is disposed on one or both surfaces of the logic plate, and a fluid flow path is provided on a joining surface of the plate. A groove is formed, and one or more sets of logic plates configured to connect the devices or components are provided by the groove. Corrosion-resistant piping is accommodated in part or all of the groove, and the corrosion-resistant piping is A corrosive fluid is configured to flow.

The logic plate according to the nineteenth aspect of the present invention
In the logic plate according to the eighteenth aspect, a material having flexibility is used as a material of the corrosion-resistant pipe.

Further, the logic plate of the twentieth invention is
In the logic plate according to the eighteenth or nineteenth aspect, the end of the corrosion-resistant pipe has a first joining member having a through hole having a conical surface formed on an inner peripheral surface, and a second joining member having a conical surface formed on an outer peripheral surface. And using a member to support the outer diameter side of the end portion with a conical surface of the first joining member, and to support the inner diameter side of the end portion with a conical surface of the second joining member. Features.

Further, the logic plate of the twenty-first invention is
In the logic plate according to a twentieth aspect, the first joining member is formed integrally with the plate.

The logic plate according to the twenty-second invention is characterized in that:
In the logic plate according to a twentieth aspect, the second joining member is formed integrally with a device or a component.

The logic plate according to the twenty-third aspect of the present invention comprises:
In the logic plate according to a twentieth aspect, the first joining member is formed integrally with the plate, and the second joining member is formed integrally with a device or a component.

Further, a logic plate according to a twenty-fourth aspect of the present invention
In the logic plate according to the twentieth or twenty-second invention, the first joining member is divided into a plurality of parts.

Further, a logic plate according to a twenty-fifth aspect of the present invention comprises:
A logic plate formed by joining three or more plates, wherein components or components of the apparatus are disposed on one or both surfaces of the logic plate, and a fluid flow path is provided on the joining surface of the plates. And a plurality of sets of logic plates configured to connect the devices or components by the grooves.

Further, a logic plate according to a twenty-sixth aspect of the present invention comprises:
A logic plate according to a twenty-fifth aspect of the present invention is characterized in that a plurality of grooves formed on each plate joining surface are divided into a high-temperature zone and a low-temperature zone.

The logic plate used in the fuel cell power generation system according to the twenty-seventh aspect is a logic plate formed by joining two or more plates, and the surface of one or both of the logic plates is A component or component of the power generation system is provided, and a groove serving as a fluid flow path is formed on the joint surface of the plate, and a set of logic plates configured to connect the device or component with the groove is provided. It is characterized by comprising a plurality of sets.

[0042]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<Structure> FIG. 1 shows the structure of a logic plate according to an embodiment of the present invention. Based on this FIG.
The configuration of the logic plate according to the embodiment of the present invention will be described in detail using a fuel cell power generation system as an example.

As shown in FIG. 1, the logic plate 1
Is formed by bonding the plate 2 and the plate 3 with an appropriate adhesive 4, and the surface of the plate 3 (the upper surface in FIG. 1)
Components and parts (indicated by dashed lines in FIG. 1) including components 5 of the fuel cell power generation system arranged in 3a are integrally fixed together with plates 2 and 3 with studs 6 and nuts 7 and the like. It is composed.

The joining surface (upper surface in FIG. 1) 2a of the plate 2 with the plate 3 has a predetermined sectional area suitable for the speed of the corresponding fluid, and is arranged on the surface 3a of the plate 3. The groove 8 is formed in an appropriate length and direction corresponding to the position of the piping port of each component device such as the device 5 and the parts.
The groove 8 functions as a pipe through which a liquid or gas required for the fuel cell power generation system flows. Accordingly, the cross-sectional area of the groove 8 is determined by the properties of the flowing fluid, the flow velocity, the pressure loss, and the like, and the length and direction thereof are determined by the arrangement of components and components including the device 5 disposed on the plate 3.

In FIG. 1, the groove 8 is formed on the plate 2 side.
However, the groove 8 may be provided on the plate 3 side.
That is, the groove 8 may be provided on the joint surface (the lower surface in FIG. 1) 3a of the plate 3 with the plate 2. Although specific examples will be described later (see FIG. 3), the components and components of the fuel cell power generation system are arranged not only on the surface 3a of the plate 3 but also on the surface (the lower surface in FIG. 1) 2b of the plate 2. May be.
That is, each component device or component may be provided on one of the surface 2b of the plate 2 and the surface 3a of the plate 3, or may be provided on both.

The materials of the plates 2 and 3 are not particularly limited.
An aluminum plate and an aluminum alloy plate are the most effective for the purpose of reducing the weight for movement, and are easy to process the groove 8, but cast products are also effective because of the heat resistance and the ease of forming the groove 8. It is. Further, by using a synthetic resin or the like as a material for the plates 2 and 3, it is possible to further reduce the weight.

In this embodiment, the device 5 is placed on the plate 3.
A stud bolt 6 is provided to attach each constituent device and parts such as the above, and to tighten the plate 2 and the plate 3 to prevent leakage of the fluid flowing through the groove 8. However, the present invention is not limited to this. The fixing of each component device and parts and the fixing of the plate 2 and the plate 3 can be performed by a through bolt penetrating the plates 2 and 3 or other fixing means.

The plate 3 is a flat plate having an appropriate thickness, and a bolt hole 9 for inserting a stud 6 or the like at a predetermined position penetrates in the plate thickness direction. Equipment 5
Through holes 37 through which the studs 6 are inserted are formed in the respective components and components such as the above. The plate 3 is also provided with a communication hole 10 for allowing a fluid to flow by communicating each constituent device or component such as the device 5 attached to the surface 3 a with the groove 8 of the plate 2.

The assembly of the logic plate 1 is as follows.
First, the plate 2 and the plate 3 are bonded via the adhesive 4. As the adhesive 4, a commercially available thermosetting adhesive is usually used. However, depending on the type of fuel used for the fuel cell and the material of the plates 2 and 3, the plates 2 and 3 may be joined by welding, brazing or welding. 3 is also effective.

Next, the stud bolt 6 is inserted into the bolt hole 9 of the plate 3 to be implanted in the plate 2, and the stud bolt 6 is inserted into the through hole 37 of the device 5. By screwing,
The device 5 is fastened to the logic plate 1. Similar operations are sequentially performed on other components and components to complete the assembly.

FIG. 2 generally illustrates the structure of the logic plate from the cross-sectional structure. FIG. 2B is a cross-sectional view taken along line EE of FIG. 2A. The logic plate 1 shown in FIG.
And plate 2 and plate 3 with stud bolt 6
The nut 7 is fastened integrally so as to be integrally fixed.

Then, between the A device 11 and the B device 12,
Fluid can flow through the grooves 8 formed in the plate 2 and the communication holes 10 formed in the plate 3. That is, the A device 11 and the B device 12 are connected by the groove 8. Since the plate 2 and the plate 3 are in close contact with the adhesive 4, the fluid flowing through the groove 8 is sealed.
The space between each of the devices 11 and 12 and the plate 3 is sealed by an O-ring 13 or the like.

FIG. 3 shows an example in which devices are arranged on both surfaces of a logic plate. In the logic plate 1 shown in FIG. 3, devices 15 and 16 are provided on the surface 3a of the plate 3,
The devices 106 and 107 are also provided on the surface 2b of the plate 2. Grooves 8A, 8B, 8C serving as liquid flow paths are formed on the joint surface 2a of the plate 2, and these grooves 8A, 8B, 8C and the devices 105, 106, 107, 108 are formed on the plates 2 and 3. A communication hole 10 is formed for communicating with. That is, the device 105 on the plate 3 and the device 107 on the plate 2 are connected by the groove 8A, and the devices 107 and 108 on the plate 2 are connected to the groove 8B.
The device 106 on the plate 3 and the device 108 on the plate 2 are connected by a groove 8C.

Although illustration is omitted, no equipment or parts are provided on the surface 3a of the plate 3, and the surface 2b of the plate 2 is not provided.
Equipment and parts can be arranged only in

FIG. 4 shows an example of a logic plate on which a surface treatment is performed to form a corrosion-resistant layer. FIG. 4B is a cross-sectional view taken along line FF of FIG. 4A. In the logic plate 1 shown in FIG. 4, the joining surfaces (adhesion surfaces) 2a and 3b between the plate 2 and the plate 3, the grooves 8 serving as fluid flow paths, and the surfaces of the communication holes 10 are coated with a fluororesin such as polytetrafluoroethylene or the like. Fluororesin lining, or
The corrosion protection layer 29 is formed by performing an aluminum oxide film treatment or the like. By forming the anticorrosion layer 29 in this manner, a fluid flowing through the groove 8 or the communication hole 10,
Corrosion due to components in the adhesive 4 can be prevented, and the life of the logic plate 1 can be extended.

FIGS. 5 and 6 show plate 2 and plate 3
The following shows an example of welding. FIG. 6 is a sectional view taken along line AA of FIG. As shown by the solid line in FIG.
Along the groove 8 formed at a predetermined distance from the groove 8, a welding line 30 surrounding the groove 8 at an appropriate distance from the groove 8 is sequentially formed on the plate 2 and the plate 3 by a hybrid welding method of electromagnetic force control or the like. Are welded in a state where they are strongly pressed. As a result, the plate 2 and the plate 3 are welded at the position of the welding line 30 as shown in FIG. 6, and the fluid flowing through the groove 8 can be reliably sealed at the portion of the welding line 30.

FIG. 7 shows an example of a three-dimensional module as an application example of the logic plate. The three-dimensional module 15 shown in FIG. 7 has two logic plates 1A and 1B in a state where the back surfaces are aligned, that is, the surface 2b of the plate 2 in one logic plate 1A and the surface 2b of the plate 2 in the other logic plate 1B. And the through bolt 101 is inserted into the through hole 101 passing through the two sets of logic plates 1A and 1B (entire plates 2 and 3).
4 and the nuts 102 are screwed into both ends of the through bolts 14 so that two sets of logic plates 1A, 1
The three-dimensional structure is obtained by integrally fixing B.

In FIG. 7, the upper logic plate 1A in FIG.
The auxiliary parts or auxiliary equipment 26a, 26b, etc. are arranged on the lower logic plate 1B in the figure so as to be located on the back of each of the equipments 11, 12 provided in the figure, and are three-dimensionalized. Miniaturization is possible.

It should be noted that, in the logic plate 1, when devices and components are not disposed on the surface 3 a of the plate 3 and devices and components are disposed on the surface 2 b of the plate 2, of course,
The front surface 3a of the plate 3 serves as the back surface of the logic plate 1, and this surface serves as a coupling surface with another logic plate 1.

FIG. 7 shows two sets of logic plates 1.
A and 1B are integrated, but the present invention is not limited to this. Of course, a plurality of sets of logic plates such as three sets, four sets, and the like are integrated with the back surfaces of the sets being integrated (see FIGS. (Three-dimensional).

For example, the three-dimensional module 15A shown in FIG.
In the example, the relatively large logic plate 1A on which the devices 109, 110, 111, and 112 are disposed is arranged on the upper side in the figure, and the devices 113 and 114, the devices 115 and 116, and the devices 117 and 118 are disposed respectively. The relatively small logic plates 1B, 1C, 1D are arranged on the lower side in the figure,
These four sets of logic plates 1A, 1B, 1C, 1D
The four sets of logic plates 1A, 1B, 1C, and 1D are integrally fixed with the back surfaces 2b of each other being joined together to form a three-dimensional structure.

In the example of the three-dimensional module 15B shown in FIG. 9, large and small logic plates 1A, 1B and 1C in which the devices 119 and 120, the devices 121 and 122 and the devices 123 and 124 are respectively arranged at the upper side in the figure. Place and equipment 1
Large and small logic plates 1D and 1E, in which devices 25, 126 and devices 127, 128, 129 are respectively arranged, are arranged on the lower side in the figure, and these five sets of logic plates 1A, 1A are arranged.
The five sets of logic plates 1A, 1B, 1C, 1D, 1 with the back surfaces 2b of B, 1C, 1D, 1E together
E is integrally fixed to make it three-dimensional.

FIG. 10 shows an example of an adiabatic three-dimensional module as an application example of the logic plate. The heat insulating three-dimensional module 18A shown in FIG.
The backs 2a of the logic plates 1A and 1B (the surfaces of the plates 2 in the respective logic plates 1A and 1B) are joined together, and a suitable heat insulator 16a or the like is interposed between the backs 2b.
A through bolt 103 is inserted into a through hole 103 passing through these two sets of logic plates 1A and 1B (entire plates 2 and 3).
And a nut 104 is screwed into both ends of the through bolt 17 via a heat insulating material 16b, thereby
A set of logic plates 1A and 1B is integrally fixed to form a three-dimensional structure.

In this heat insulation three-dimensional module 18A, two sets of logic plates 1 are provided via heat insulation materials 16a and 16b.
A and 1B have a heat insulating layer, so that the heat of the high-temperature devices 27a and 27b disposed on the logic plate 1A on the upper side in FIG.
Since transmission to B can be blocked, other low-temperature devices 28a and 28b can be disposed on the logic plate 1B in close proximity to the high-temperature devices 27a and 27b disposed on the logic plate 1A.

Note that, in this case as well, the present invention is not limited to the two sets of logic plates 1A and 1B, and any two or more sets of logic plates can be integrated. For example, although not shown, the logic plate 1 shown in FIG.
A heat insulating material may be provided between the rear surface 2b of the logic plate 1A and the logic plates 1B, 1C, 1D, or the logic plate 1 shown in FIG.
A heat insulating material may be provided between the back surfaces 2b of the logic plates 1D, 1E and the logic plates 1D, 1E.

FIG. 11 shows another example of a heat-insulating three-dimensional module as an application example of the logic plate 1. In the heat-insulating three-dimensional module 18B shown in FIG. 11, the back surfaces (the surfaces of the plates 2 in each of the logic plates 1A and 1B) 2b of the two sets of logic plates 1 are joined together, and an appropriate length of separation is provided between the back surfaces 2b. The two sets of logic plates 1 </ b> A and 1 </ b> B are integrally connected and fixed by the separating member 31 to form a three-dimensional structure with a member 31 interposed therebetween. Further, a heat insulating material 130 is provided between the separation member 31 and the logic plates 1A and 1B.

In the heat insulating three-dimensional module 18B, by maintaining an appropriate interval between the two sets of logic plates 1A and 1B by the separating member 31, the high temperature part (high temperature equipment 27a, 27b) and the low temperature part (low temperature equipment 28a , 28b)
And at the same time, the device can be made three-dimensional and downsized. Further, by providing the heat insulating material 130 between the logic plates 1A and 1B and the separating material 31, the heat insulating effect can be further improved.

In other words, if a sufficient heat insulating effect can be obtained only by providing the insulating material 31, it is not always necessary to provide the insulating material 130, but it is necessary to block the heat transmitted through the insulating material 31. Is provided with a heat insulating material 130 between the separating member 31 and the logic plates 1A and 1B. In addition,
Between the separation member 31 and the logic plate 1A or the separation member 31
The heat insulating material 130 may be provided only in one of the area and the logic plate 1B.

Also in this case, two sets of logic plates 1
The present invention is not limited to A and 1B, and arbitrary plural sets of logic plates can be integrated. For example, FIG.
In the example of the heat insulating three-dimensional module 18B shown in FIG.
Cryogenic equipment 133a, 133b and cryogenic equipment 134a, 13
4b are arranged on the lower side in the figure, and the back surfaces 2b of these three sets of logic plates 1A, 1B, 1C are joined together.
In addition, a separation member 31 is interposed between the back surfaces 2b to
The set of logic plates 1A, 1B, 1C is
1 is integrally connected and fixed to make it three-dimensional.

FIG. 13 shows an example in which a device is interposed between logic plates in place of the separating member. The three-dimensional module 18C shown in FIG.
In the above, devices 139 and 140 are interposed between the back surfaces 2b of the logic plates 1A and 1B in place of the separation member 31. Although not shown, these devices 139, 1
40 is also the logic plate 1A or the logic plate 1
The connection may be made by a groove provided in B.

Also in this case, as in the case where the separating member 31 is interposed, the logic plates 1A and 1B are separated by the devices 139 and 140, so that a heat insulating effect can be expected.
In particular, as shown in the drawing, a remarkable heat insulating effect can be obtained by interposing the heat insulating material 130 between the devices 139 and 140 and the logic plates 1A and 1B. Moreover, in this case, the devices 139 and 139 are also provided between the logic plates 1A and 1B.
0, the logic plates 1A, 1B
Since the space is effectively used, the size of the apparatus can be further reduced.

In this case, too, of course, the present invention is not limited to the two sets of logic plates 1A and 1B, and an arbitrary plurality of sets of logic plates can be integrated.
For example, in the heat-insulating three-dimensional module 18B shown in FIG. 12, constituent devices or parts may be interposed instead of the spacers 31.

FIG. 14 shows an example in which a plurality of sets of logic plates are arranged on the same frame as an application example of the above-mentioned logic plate. In FIG. 14, a logic plate 1A provided with high-temperature devices 27a and 27b and low-temperature devices 28a and 28
The logic plate 1B on which the “b” is disposed is disposed on the same gantry 32 with an appropriate adiabatic distance L. The logic plates 1A and 1B are fixed to the gantry 32 by appropriate fixing means such as bolts and welding not shown. A heat insulating material 145 is provided between the logic plates 1A and 1B and the gantry 32.

By arranging the two sets of logic plates 1A and 1B while keeping the adiabatic distance L in this way, these logic plates 1 can mutually ignore (prevent) the influence of heat. Further, by interposing a heat insulating material 145 between the logic plates 1A, 1B and the gantry 32,
Further, the heat insulating effect can be enhanced.

In this case, too, of course, the present invention is not limited to the two sets of logic plates 1A and 1B, and an arbitrary plurality of sets of logic plates can be arranged on the same base. For example, in the example shown in FIG. 15, four sets of logic plates 1A, 1B, 1C, 1D, that is, the high-temperature equipment 141
a, a logic plate 1A provided with the low-temperature devices 142a, 142b.
B, a logic plate 1C provided with the high-temperature devices 143a and 143b, and a logic plate 1D provided with the low-temperature devices 144a and 144b are arranged on the same gantry 32 with an adiabatic distance L therebetween.

FIGS. 16 and 17 show an example in which a high-temperature device and a low-temperature device are arranged on the same logic plate. FIG. 17 is a sectional view taken along line BB of FIG. FIG.
6 and the logic plate 1 shown in FIG. 17, in the same logic plate 1, high-temperature devices 33a, 33b,
A high-temperature zone in which high-temperature devices and parts such as 33c are arranged;
A heat-blocking groove 35 is provided between each of the low-temperature devices such as the low-temperature devices 34a and 34b and the low-temperature zone in which the components are arranged. The heat blocking groove 35 is formed in the plate 2, and communication holes 36 communicating with both ends of the heat blocking groove 35 are formed in the plate 3.

According to the logic plate 1, the heat blocking groove 35 forms a heat insulating layer of air, and has a large resistance to heat conduction from the high temperature zone to the low temperature zone. Therefore, in the same logic plate 1, the high temperature devices 33a, 33
Even if the low-temperature devices 34a, 34b, etc. are arranged in close proximity to the components b, 33c, etc., they will not be affected by the heat.

Filling the heat insulation groove 35 with a suitable heat insulating material is also an effective means for preventing the influence of heat.

Further, in order to enhance the effect of the heat blocking groove 35, one of the communication holes 36 provided at both ends of the heat blocking groove 35 is formed by a refrigerant circulating means (not shown). It is also possible to adopt a configuration in which a cooling medium such as cooling air or cooling water is allowed to flow into the heat blocking groove 35 from the 36 to the other communication hole 36 to cool the heat blocking groove 35.

FIGS. 18, 19 and 20 show the solenoid valve 19.
An example is shown in which a component such as a printer, a control device 20 such as a print chip, an electric wiring 21 and the like are built in the logic plate 1 to save space. 19 is a cross-sectional view taken along line CC of FIG. 18, and FIG. 20 is a cross-sectional view taken along line DD of FIG.

As shown in these figures, the C device 22 and the D device 23 provided on the logic plate 1 are connected by a groove 8 provided on the plate 2. Pressure sensor 2 embedded in
5a, the detection signal of the pressure sensor 25a is transmitted to the control device 20 embedded in the plate 3, and furthermore, the control device 20 is embedded in the plate 3 via the electric wiring 21 embedded in the plate 3. By transmitting a control signal to the solenoid valve 19, the solenoid valve 19 is operated. Similarly, a flow rate sensor 25b for detecting the flow rate of the fluid flowing in the groove 8 and a temperature sensor 25c for detecting the temperature of the fluid are also embedded in the plate 3, and the detection signals of these sensors 25b and 25c are also electrically connected (not shown). Via the control device 20.

By incorporating the solenoid valve 19, the control device 20, the electric wiring 21 and the like in the logic plate 1 as described above, further space saving can be achieved. Electric components such as switches may be incorporated in the logic plate 1. Note that a print chip (print board) that can be embedded in the plate 3 is preferably used as the control device 20. Also, some parts and the like can be built in the plate 2. In this case, it is preferable that the plate 3 has an opening for assembling and checking parts. That is, the equipment, components, control equipment, electric wiring, and the like constituting the apparatus may be incorporated in one of the plates 2 and 3,
It may be built in both plates 2 and 3.

As described above, in the fuel cell power generation system and the like, the fluid flowing through the groove 8 serving as the flow path is various, and high-temperature and low-temperature fluids and corrosive substances are used. Some included. Above all, fluids containing corrosive substances (hereinafter referred to as "corrosive fluids")
, Special consideration is required for the flow path. Therefore, as described above with reference to FIG.
The surface of the groove 8 or the like is subjected to a fluorine resin coating such as polytetrafluoroethylene or a fluorine resin lining, or an aluminum oxide film treatment to form a corrosion-resistant layer 29.
By forming the groove, the groove 8 and the like have corrosion resistance to a corrosive fluid.

However, the technique of providing the anticorrosion layer may be difficult to apply when the arrangement of the grooves 8 (flow paths) is complicated. That is, in the unit of the fuel cell power generation system configured with a large number of devices and components as shown in FIG.
In addition, in order to incorporate small components such as valves, electric components such as sensors and switches, and electric wiring in the plate, for example, the number of grooves 8 becomes very large as shown in FIG.
Further, in order to prevent interference between the grooves 8, some grooves 8 (flow paths)
It is necessary to detour. For this reason, many grooves 8
In many cases, the (flow paths) are complicatedly intersected to form a maze-like state.

The work of applying a fluororesin coating or a fluororesin lining or an aluminum oxide film treatment to such a groove 8 requires an advanced processing technique and requires a great number of processing steps. Become. Further, if the groove 8 (flow path) has a complicated shape, there may be a case where the accuracy and reliability of the product are questioned. Therefore, in such a case, it is effective to provide a corrosion-resistant pipe instead of forming the corrosion-resistant layer 29 in the groove 8.

FIG. 22 is a configuration diagram of a logic plate provided with corrosion resistant piping. 23A is an enlarged plan view of a portion G in FIG. 22, FIG. 23B is a cross-sectional view taken along line HH of FIG. 23A, and FIG. 24A is an enlarged plan view of an I portion in FIG. 24
FIG. 24B is a cross-sectional view taken along line JJ of FIG. FIG. 25 is a sectional structural view of the logic plate, and FIG.
FIG. 6 is an enlarged sectional view taken along line KK of FIG.

The logic plate 1 shown in FIG. 22 is configured by joining a plate 2 and a plate 3 with an adhesive 4 or the like. A groove 8 is formed on the joint surface between the plate 2 and the plate 3 (the upper surface 2a of the plate 2 in the illustrated example). Then, on the upper surface 3a of the plate 3 (that is, the surface of the logic plate 1), various components 191 and components 192 (also indicated by a dashed line in FIG. 22) constituting the fuel cell power generation system are arranged. These devices 19
1 and the parts 192 are connected to the grooves 8 by the communication holes 10 formed in the plate 3. Thus, the device 191 and the component 192 are connected by the groove 8. Equipment 191 and parts 19
The space between the plate 2 and the plate 3 is sealed by a sealing material such as an O-ring (not shown). These structures are the same as those of the logic plate 1 shown in FIG.

Then, the logic plate 1 shown in FIG.
Then, the cross-sectional area of the groove 8 through which the corrosive fluid flows is made larger than the required cross-sectional area when the fluid is directly passed through the groove 8, and the groove 8 is made of a fluororesin tube such as polytetrafluoroethylene. By containing the corrosion-resistant pipe 151, the corrosion-resistant pipe 151 is used as a flow path of a corrosive fluid. The corrosion-resistant pipe 151 is not limited to a fluororesin pipe, and a pipe made of another corrosion-resistant material (such as vinyl chloride, synthetic rubber, or another synthetic resin) may be used according to the properties of the corrosive fluid. Good. However, logic plate 1
In some cases, the corrosion-resistant pipe 151 is inserted into the predetermined groove 8 after being integrated, or the corrosion-resistant pipe 151 is replaced. Therefore, a material having flexibility is selected as the material of the corrosion-resistant pipe 151. Is preferred.

Both ends of the corrosion-resistant pipe 151 housed in the groove 8 are joined by a metal receiving member 152 as a first joining member and a top-shaped part 153 as a second joining member. The top part 153 has a frusto-conical main body (joining part) 153b having a conical surface 153a formed on the outer peripheral surface, and has a head 153c on the main body 153b. Is shaped like a top.

As shown in FIG. 23 and FIG.
Reference numeral 2 denotes one receiver 152 for one corrosion-resistant pipe 151.
When using (FIG. 23), a plurality (two in the illustrated example)
There is a case in which one receiver 152 is used for the corrosion-resistant pipe 151. These receiving members 152 are fitted into fitting holes 3 f provided in the plate 3, and are fixed to the plate 2 by screws 155. The step 1 is provided on the outer peripheral surface of the receiver 152.
The step 152a is formed so that the step 152a contacts the step 3g formed on the inner peripheral surface of the fitting hole 3f. A through-hole 152b is formed in the center of the receiving metal 152, and a conical surface 152 is formed on a part of the inner peripheral surface of the through-hole 152b.
c is formed. Further, a step 152d is formed above the conical surface 152c by further widening the inner peripheral surface of the through hole 152b. Receipt 152 is 2 at the dividing line position.
Divided.

Then, the receiving money 152 and the top part 15
As a result, both ends of the corrosion-resistant pipe 151 are joined (fixed) as shown in FIGS. That is, the end of the corrosion-resistant pipe 151 is inserted into the through-hole 152b of the receiving metal 152, and the body 153b of the top-shaped component 153 is inserted into the end of the corrosion-resistant pipe 151 and pressurized. Corrosion-resistant piping 15 is formed by the conical surface 153a of the portion 153b.
2 and the conical surface 1 of the main body 153b.
53a is fitted to the conical surface 152c of the receiving metal 152. As a result, the outer end of the corrosion-resistant pipe 151 is
Is supported by the conical surface 152c of the
It is joined (fixed) while being supported by the third conical surface 153a. At this time, the head 153c of the top part 153
Is fitted to the step 152d of the receiving member 152. Thus, between the equipment 191 and the part 192, the corrosive fluid is
51, and at this time, the corrosive fluid can be prevented from leaking from the end of the corrosion-resistant pipe 151.

It is usually preferable that the receiving member 152 be formed integrally. However, when the corrosion-resistant pipe 151 made of a material having high rigidity is used, the end of the corrosion-resistant pipe 151 falls down as shown in FIG. State, and the plurality of corrosion-resistant pipes 151
In the case of joining with two receivers 152, the corrosion-resistant piping 15
Since the directions of the end portions are not uniform, it is difficult to join the end portions of the corrosion-resistant pipe 151 with the integral receiving piece 152 (the corrosion-resistant pipe 151 is made longer, and the corrosion-resistant pipe 151 is inserted into the receiving piece 152. There is a method of cutting the end of the flexible pipe 151, but it is a difficult operation because the cut position is inside the receiver 152). In such a case, the receiving piece 152 is divided into two parts as in the present embodiment. First, one receiving piece 152 is inserted into the fitting hole 3f, and then the other one-side receiving piece 15 is inserted.
By inserting 2 into the fitting hole 3f, the joining work efficiency is improved. Note that, in this case, the number of divisions of the receiving money 152 is not limited to two, and may be three or more.

FIGS. 28 and 29 show another example of joining the end of the corrosion-resistant pipe 151. FIG. These are useful when applied when the piping route (groove 8) is simple or when the corrosion-resistant piping 151 made of a material having low rigidity is used.

In the logic plate 1 shown in FIG. 28, the receiving plate 152 and the plate 3 shown in FIG. 26 are integrally formed. That is, a through hole 3c is formed in the plate 3, and a conical surface 3d is formed in a part of the inner peripheral surface of the through hole 3c. Above the conical surface 3d, a step 3e is formed by further widening the inner peripheral surface of the through hole 3c.

In this case, the end of the corrosion-resistant pipe 151 is inserted into the through hole 3c of the plate 3, and the main body 15 of the top-shaped component 153 is inserted into the end of the corrosion-resistant pipe 151.
3b is inserted and pressurized, so that the end of the corrosion-resistant pipe 152 is pushed open by the conical surface 153a of the main body 153b,
Further, the conical surface 153a of the main body 153b is fitted to the conical surface 3d of the plate 3. At this time, the top part 15
The third head 153c is fitted to the step 3e of the plate 3.
Thus, the end of the corrosion-resistant pipe 151 is supported on the outer diameter side by the conical surface 3d of the plate 3, and the inner diameter side is
While being supported by the third conical surface 153a, the connection is made firmly so that the fluid does not leak.

In the logic plate 1 shown in FIG. 29, the receiving metal 152 and the plate 3 shown in FIG.
In addition, the top part 153 and the device 191 or the part 192 are integrally formed. That is, plate 3
Has a through hole 3c, a conical surface 3d is formed on a part of the inner peripheral surface of the through hole 3c, and a conical surface 154a is formed on the outer peripheral surface on the lower surface of the device 191 or the component 192. The frusto-conical joint 154 is connected to the device 191 or the component 19.
2 and one piece.

In this case, the end of the corrosion-resistant pipe 151 is inserted into the through hole 3c of the plate 3, and the joint 154 of the device 191 or the component 192 is inserted into the end of the corrosion-resistant pipe 151. By applying pressure, the joint 15
4, the end of the corrosion-resistant pipe 152 is pushed out by the conical surface 154a, and the conical surface 154a of the joint 154 is connected to the plate 3
To the conical surface 3d. Thus, the corrosion-resistant piping 151
Are tightly joined such that fluid does not leak while the outer diameter side is supported by the conical surface 3d of the plate 3 and the inner diameter side is supported by the conical surface 154a of the joint 154.

Further, as described above, in the unit of the fuel cell power generation system composed of a large number of devices and parts as shown in FIG. For example, as shown in FIG. 21, the number of the grooves 8 becomes very large, and it is necessary to largely detour some of the grooves 8 in order to avoid intersection or contact between the grooves 8. In addition, these grooves 8 (flow paths) are designed by calculating their cross-sectional areas so as to secure an appropriate flow velocity according to the application. Therefore, there may be a case where a wide groove 8 is required. In this case, it is necessary to secure a sufficient space for forming the wide groove 8. Furthermore, these grooves 8
Since some of the fluids flowing through the (flow path) have different temperatures, it is necessary to secure an appropriate separation dimension so as not to affect each other.

For this reason, the groove 8 (flow path) is complicated, and in many cases, it is unavoidable that the arrangement is like a maze. In this case, the design and production (processing of the groove) of the logic plate become complicated, Further, the size of the plate, that is, the size of the logic plate may become very large in order to bypass the groove 8 or increase the width of the groove 8. Therefore, in the following, a configuration of a three-dimensional logic plate that can simplify the arrangement of the grooves 8 (flow paths) and make it compact even in such a case will be described with reference to FIGS. 30 to 35.

FIG. 30 is a structural view of a three-dimensional logic plate, FIG. 31 is a sectional view taken along line MM of FIG. 30, FIG. 32 is a sectional view taken along line NN of FIG. 30, and FIG. Is a configuration diagram of another three-dimensional logic plate, and FIG.
FIG. 35 is a cross-sectional view taken along the line P-P of FIG. 33.

In FIG. 30, an intermediate plate 161 is provided between the plate 2 and the plate 3, and these three plates 2, 3, 161 are joined together with an adhesive 4 or the like to form a three-dimensional type. The logic plate 1 is configured. On one surface of the three-dimensional logic plate 1 (the outer surface of the plate 3), the components 16 of the fuel cell power generation system are provided.
2A, the device 162B and the device 162C are arranged and fixed by fixing means such as stud bolts and nuts (not shown), and the other surface of the three-dimensional logic plate 1 (the outer surface of the plate 2) is provided with the components 162 of the fuel cell power generation system.
D, the component 162E, and the device 162F are arranged and fixed by fixing means such as studs and nuts (not shown).

Then, the plate 3 and the intermediate plate 161
Are formed on the joint surface (joint surface of the plate 3 in the illustrated example) and the joint surface of the plate 2 and the intermediate plate 161 (joint surface of the plate 2 in the illustrated example). Groove 8 and parts 162A, equipment 162B, equipment 162C, part 162D, part 162E and equipment 16
2F and the communication holes 10 formed in the plates 2, 3, 161
Connected by That is, the component 162 is three-dimensionally formed by the two upper and lower grooves 8 formed on the two plate joining surfaces.
A, device 162B, device 162C, component 162D, component 162E, and device 162F are connected. The cross-sectional area of the groove 8 is determined by appropriately calculating for each fluid.

In FIGS. 30, 31 and 32, the fluid supply port 164 → component 162A → device 162F → device 162B
→ device 162C → component 162E → component 162D → groove 8 serving as a path such as fluid outlet 165, and communication hole 10,
Component 162A, device 162B, device 162C, component 16
The example illustrates the arrangement relationship between 2D, component 162E, and device 162F. This route will be described in detail with reference to FIGS. 31 and 32. The route is as follows: fluid supply port 164 → groove 8A → communication hole 1
0A → component 162A → communication hole 10B → groove 8B → communication hole 1
0C → groove 8C → communication hole 10D → device 162F → communication hole 1
0E → groove 8D → communication hole 10F → device 162B → communication hole 1
0G → groove 8E → communication hole 10H → equipment 16C → communication hole 10
I → groove 8F → communication hole 10J → groove 8G → communication hole 10K → component 162E → communication hole 10L → groove 8H → communication hole 10M → component 162D → communication hole 10N → groove 8I → fluid outlet 165
It is like.

In FIG. 33, a three-dimensional logic is provided by providing an intermediate plate 161 between the plate 2 and the plate 3 and joining these three plates 2, 3, 161 with an adhesive 4 or the like. Constitutes the plate 1,
Only one surface of the three-dimensional logic plate 1 (the outer surface of the plate 3) has the components 166A of the fuel cell power generation system,
Device 166B, device 166C, component 166D, component 16
6E and the device 166F are arranged and fixed by fixing means such as stud bolts and nuts (not shown).

Then, the plate 3 and the intermediate plate 161
Are formed on the joint surface (joint surface of the plate 3 in the illustrated example) and the joint surface of the plate 2 and the intermediate plate 161 (joint surface of the plate 2 in the illustrated example). Groove 8 and parts 166A, equipment 166B, equipment 166C, part 166D, part 166E and equipment 16
6F and communication holes 10 formed in plates 2, 3, 161
Connected by That is, the component 166A is three-dimensionally formed by the two-step groove 8 formed on the two plate joining surfaces.
Device 166B, device 166C, component 166D, component 16
6E and the device 166F. The cross-sectional area of the groove 8 is determined by appropriately calculating for each fluid.

In FIGS. 33, 34 and 35, the fluid supply port 167 → component 166A → device 166F → device 166B
→ device 166C → component 166E → component 166D → groove 8 serving as a path such as fluid discharge port 168, and communication hole 10,
Component 166A, device 166B, device 166C, component 16
6D illustrates an example of the arrangement relationship between the component 166E and the device 166F. This route will be described in detail with reference to FIGS. 34 and 35. The route is as follows: fluid supply port 167 → groove 8A → communication hole 1
0A → part 166A → communication hole 10B → groove 8B → communication hole 1
0C → Equipment 166F → Communication hole 10D → Groove 8C → Communication hole 1
0E → device 166B → communication hole 10F → groove 8D → communication hole 1
0G → Equipment 166C → Communication hole 10H → Groove 8E → Communication hole 1
0I → part 166E → communication hole 10J → groove 8F → communication hole 1
0K → component 166D → communication hole 10L → groove 8G → fluid discharge port 168.

For comparison, FIG. 36 shows the components 162A, 162B, 162C and 16 shown in FIG.
FIG. 37 shows an example in which 2D, component 162E, and device 162F are arranged on logic plate 1 formed by joining two plates. FIG. 37 shows component 166A shown in FIG.
Device 166B, device 166C, component 166D, component 16
An example in which 6E and the device 166F are arranged on the logic plate 1 formed by joining two plates is shown.

In FIG. 36, the fluid supply port 169 → the groove 8A →
Communication hole A → component 162A → communication hole B → groove 8162B → communication hole 10C → device 162F → communication hole 10D → groove 8C → communication hole E → device 162B → communication hole F → groove 8D → communication hole 10.
G → device 162C → communication hole 10H → groove 8E → communication hole 10
I → part 162E → communication hole 10J → groove 8F → communication hole K →
Part 162D → communication hole 10L → groove 8G → fluid outlet 17
The path is 0. In FIG. 37, the fluid supply port 171 →
Groove 8A → communication hole A → component 166A → communication hole B → groove 816
2B → communication hole 10C → device 166F → communication hole 10D → groove 8C → communication hole E → device 166B → communication hole F → groove 8D → communication hole 10G → device 166C → communication hole 10H → groove 8E → communication hole 10I → component 166E → communication hole 10J → groove 8F → communication hole K → component 166D → communication hole 10L → groove 8G → fluid discharge port 172.

In the logic plate 1 in which the two plates are joined as described above, since all the grooves 8 (flow paths) are formed in one plane, it may be necessary to bypass the grooves 8 (flow paths). In some cases, the size of the logic plate 1 must be increased in order to bypass the groove 8.

In FIGS. 36 and 37, the number of devices and parts is small and the number of grooves 8 (flow paths) is small, so that the difference is not so remarkable. As shown in FIG. 21, the number of grooves 8 (flow paths) becomes large in order to connect them, and it becomes a maze. Therefore, it is possible to secure a necessary flow path cross-sectional area and to secure a separation dimension between fluids having different temperatures while maintaining a compact size. It is often difficult to put in On the other hand, in the three-dimensional logic plate 1 shown in FIGS. 30 to 35, since the devices and components are three-dimensionally connected by the two-stage grooves 8 (flow paths), the arrangement of the grooves 8 is simplified, and the devices and components are simplified. Can be arranged compactly. 30 to 35, the grooves 8 are provided on the joint surface on the plate 2 side and the joint surface on the plate 3 side, but the grooves 8 may be formed on the joint surface on the intermediate plate 161 side.

FIGS. 38 and 39 show an example of a configuration in which a high-temperature zone and a low-temperature zone are divided by using a three-dimensional logic plate.

In FIG. 38, one surface (the surface of the plate 3) of the three-dimensional logic plate 1 is provided with a low-temperature / high-temperature mixing device 181 and a low-temperature device 182 of the fuel cell power generation system.
A high-temperature mixing device 183 and a high-temperature device 184 are provided. Then, the groove 8 connecting these devices is inserted into the plate 3
(The intermediate plate 16 in the illustrated example)
1) and a joining surface between the plate 2 and the intermediate plate 161 (the joining surface of the plate 2 in the illustrated example) in two stages, and the upper groove 8 is a low-temperature zone through which a low-temperature fluid flows. The groove 8 is a high-temperature zone through which a high-temperature fluid flows.

In FIG. 39, a low-temperature / high-temperature mixing device 185, a low-temperature device 186, and a low-temperature / high-temperature mixing device 187 of the fuel cell power generation system are provided on one surface (the surface of the plate 3) of the three-dimensional logic plate 1, and the other is provided. A high-temperature device 188 and a high-temperature device 189 are disposed on the surface of the plate (the surface of the plate 2). Then, the groove 8 connecting these devices is formed by the joining surface of the plate 3 and the intermediate plate 161 (the joining surface of the intermediate plate 161 in the illustrated example) and the joining surface of the plate 2 and the intermediate plate 161 (the joining of the plate 2 in the illustrated example). The upper groove 8 is a low-temperature zone through which a low-temperature fluid flows, and the lower groove 8 is a high-temperature zone through which a high-temperature fluid flows.

In this case, although not shown, it is effective to provide a heat insulating material between the plate 2 and the intermediate plate 161.

Further, the case where one intermediate plate 161 is provided between the plate 2 and the plate 3 has been described above. However, the present invention is not limited to this, and two or more intermediate plates may be provided. 2 and the plate 3 may be provided. That is, four or more plates may be joined to form a three-dimensional logic plate. In the case where two or more intermediate plates are provided, the grooves 8 (flow paths) are also formed on the joint surface between the intermediate plates and the intermediate plates, so that more grooves 8 (flow paths) can be accommodated.

<Operation / Effect> As described above, according to the logic plate according to the embodiment of the present invention, since the components and parts are connected by the groove 8 provided in the plate 2 or the plate 3, the conventional piping is used. Are provided in the logic plate, and small components such as valves, electric components such as sensors and switches, and electric wiring can be incorporated in the plate 2 or the plate 3 or the plate 2 and the plate 3. For this reason, the whole device such as the fuel cell power generation system can be easily modularized, and the size can be reduced. Further, since each component device or component is merely assembled at a predetermined position, there is no complicated piping work in a narrow space, so that the assembling work is easy and the work efficiency is improved.
In addition, there are fewer seams and the risk of fluid leakage is reduced.

Further, the joining surface 2 of the plate 2 and the plate 3
a, 3b, grooves 8 and the like are coated with a fluororesin such as polytetrafluoroethylene or a fluororesin lining, or an aluminum oxide film treatment, etc.
By forming 9, corrosion of the groove 8 due to the corrosive fluid flowing through the groove 8 and corrosion of the plate joining surface due to components in the adhesive 4 can be prevented, and the life of the logic plate 1 can be extended. . The technique of providing the anticorrosion layer is, of course, not limited to one set of logic plates, but can be applied to a case where a plurality of sets of logic plates are provided. For example, although not shown, an anticorrosion layer may be provided on the groove or plate joining surface in the three-dimensional module of FIGS. 7 to 13 or an anticorrosion layer may be provided on the groove or plate joining surface of the gantry module in FIG. . Further, FIG.
Even in a three-dimensional logic plate provided with an intermediate plate as shown in FIGS. 0 to 35, 38, and 39, an anticorrosion layer can be applied to the groove or the plate joining surface.

By welding the plate 2 and the plate 3 at the position of the welding line 30 surrounding the periphery of the groove 8, the fluid flowing through the groove 8 at the portion of the welding line 30 can be reliably sealed. . Note that this welding sealing technique is not limited to the logic plate having the configuration shown in FIG. 5 and is not shown in the drawings. For example, the three-dimensional module shown in FIGS. 7 to 13, the gantry module shown in FIG.
The present invention can be applied to a logic plate having any configuration such as a three-dimensional logic plate shown in FIG.

Further, by making the rear surfaces of a plurality of sets of logic plates 1 (1A, 1B, etc.) in which the respective components and devices are assembled into a three-dimensional module, the size can be further reduced, and the fluid can be further reduced. The flow path and the control system can be shortened, and the response is quick and the control becomes easy.

Further, a plurality of sets of logic plates 1 (1A, 1B, etc.) are integrally fixed via a heat insulating material 16a to constitute the heat insulating three-dimensional module 18A, so that, for example, the high temperature Low-temperature equipment 2 such as a control equipment,
8a and 28b can be arranged on the logic plate 1B.

Further, by integrally connecting and fixing a plurality of sets of the logic plates 1 (1A, 1B, etc.) via the separating member 31, the heat insulating three-dimensional module 18B is constituted so that the high temperature devices 27a, 27b, etc. The disposed high-temperature side logic plate 1A and low-temperature devices 28a, 28
Since the low temperature side logic plate 1 provided with b and the like can be separated by the separation member 31, the mutual thermal influence can be avoided. Moreover, a plurality of sets of logic plates 1 (1
A, 1B, etc.) between the back surface 2b and the separating material 31
By providing 30, the heat insulation effect is further improved.

Also, a plurality of sets of logic plates 1 (1
A, 1B) between the back surface 2b of the device 139, 1
With the interposition of 40, the space between the logic plates is effectively used, and the device can be further downsized. Further, since the logic plates are separated by the constituent devices 139 and 140, a heat insulating effect can be expected.
By providing the heat insulating material 130 between the logic plates 39 and 140 and the logic plates 1A and 1B, the heat insulating effect becomes remarkable.

Also, a plurality of sets of logic plates 1 (1
A, 1B, etc.) are arranged on the same gantry 32 while keeping the heat insulation interval L, so that these logic plates 1 (1
A, 1B, etc.) can mutually ignore (prevent) thermal effects. Logic plate 1 (1A, 1B, etc.) and gantry 3
In the case where the heat insulating material 145 is interposed between the heat insulating material 2 and the heat insulating material 2, the heat insulating effect is further improved.

Further, in the same logic plate 1, a heat insulating groove 35 is provided between a high-temperature zone in which high-temperature devices 33a, 33b, 33c, etc. are disposed, and a low-temperature zone in which low-temperature devices 34a, 34b, etc. are disposed. As a result, heat from the high-temperature zone can be shut off so as not to affect the low-temperature zone. Furthermore, by filling the heat insulation groove 35 with a heat insulating material or flowing a refrigerant such as air or water, the heat insulation effect becomes extremely large.

Further, instead of forming an anticorrosion layer in the groove 8,
The corrosion resistant pipe 151 is housed in the groove 8 and the corrosion resistant pipe 15
By allowing the corrosive fluid to flow through 1, even if the grooves 8 (flow paths) are numerous and complicated, the corrosion resistance to the corrosive fluid can be easily secured without requiring advanced processing techniques. . Further, since the corrosion-resistant pipe 151 made of a material according to the properties of the corrosive fluid can be selected and used, the reliability of the corrosion-resistant performance is improved. Corrosion-resistant treatment limited to corrosive fluid flow paths (flow path formation by corrosion-resistant piping)
Therefore, the number of processing steps can be reduced, and the logic plate 1 can be provided at low cost. Further, when the corrosion resistance is deteriorated due to aging, the corrosion resistance can be restored by replacing only the corrosion resistant pipe 151 housed in the logic plate 1 instead of replacing the logic plate 1, thereby reducing the maintenance cost. be able to.

When the corrosion-resistant pipe 151 is made of a flexible material, the logic plate 1
Since the corrosion-resistant pipe 151 can be inserted into the groove 8 after being integrated, or the corrosion-resistant pipe 151 can be replaced.
Workability can be improved.

The end of the corrosion-resistant pipe 151 is formed by using a metal holder 152 having a through hole 152b having a conical surface 152c formed on the inner peripheral surface and a top-shaped part 153 having a conical surface 153a formed on the outer peripheral surface. By joining them, the joining work of the corrosion-resistant pipe 151 can be easily performed, and leakage of the fluid can be surely prevented. Further, FIG.
As shown in FIG. 29, the receiver 152 and the plate 3 are integrally formed, and as shown in FIG. 29, the device 191 or the component 192 and the top-shaped component 153 are integrally formed. And the joining operation becomes easy. Further, when the corrosion-resistant pipe 151 made of a material having high rigidity is used or when the pipe route is complicated, the joining work efficiency can be improved by dividing the receiver 152 into a plurality of pieces.

Also, three or more plates 2, 3, 161
To form the three-dimensional logic plate 1, the joint surface between the plate 2 and the intermediate plate 161, the joint surface between the plate 3 and the intermediate plate 161, and the intermediate plate 161 when two or more intermediate plates 161 are provided. By forming the grooves 8 on the joint surface of the intermediate plate 161, even when providing a large number of grooves 8 corresponding to a large number of devices and components, the arrangement of the grooves 8 is simplified and the devices and components are compactly arranged. be able to. Further, in the three-dimensional logic plate 1, as shown in FIGS. 38 and 39, the grooves 8 of a plurality of stages are divided into a high-temperature zone and a low-temperature zone, so that the mutual thermal influence can be eliminated.

In the above description, the studs 6 are used as mounting bolts for devices and components. However, the present invention is not limited to this, and general bolts and through bolts may be used. In the above description, an O-ring 1
3, but is not limited to this, and a gasket or the like may be used.

Although the fuel cell power generation system has been described above, the present invention is not limited to this. The present invention relates to a general industrial air or hydraulic control device, a combustion device, etc., in which piping, wiring, etc. are installed inside the device. The present invention is also effective for various devices such as a fixed unit incorporated in a device and a unit integrated so as to be assembled and transported.

Although the logic plates having various configurations have been described above, these configurations may be appropriately combined.

[0133]

As described above in detail with the embodiments of the present invention, according to the logic plate of the first invention, the logic plate is formed by joining two or more plates. A device or component of the device is disposed on one or both surfaces of the device, and a groove serving as a fluid flow path is formed on the joint surface of the plate, and the device or component is connected by the groove. Since one or more sets of logic plates are provided and a corrosion-resistant layer is formed on the surface of the groove, a flow path corresponding to a conventional pipe is provided in the logic plate, and the entire apparatus such as a fuel cell power generation system can be easily assembled into a module. And miniaturization. Further, since each component device or component is merely assembled at a predetermined position, there is no complicated piping work in a narrow space, so that the assembling work is easy and the work efficiency is improved. In addition, there are fewer seams and the risk of fluid leakage is reduced. Corrosion due to the fluid flowing in the groove is prevented by the anticorrosion layer, and the life of the logic plate can be extended.

Further, according to the logic plate of the second invention, in the logic plate of the first invention, the corrosion prevention layer is also formed on the joint surface of the plate, so that the corrosion by the component in the adhesive for joining the plates is prevented. This can be prevented by the anticorrosion layer, and the life of the logic plate can be extended.

In the logic plate according to the third or fourth aspect of the present invention, in the logic plate according to the first or second aspect of the present invention, the corrosion-resistant layer is formed by applying a fluororesin coating or a fluororesin lining, or an aluminum oxide film. Since it is formed by performing the treatment, the corrosion due to the fluid flowing in the groove and the components in the adhesive is prevented by the anticorrosion layer, and the life of the logic plate can be extended.

Further, according to the logic plate of the fifth invention, the logic plate is formed by joining two or more plates, and one or both surfaces of the logic plate are provided with components or components of the apparatus. A set or a plurality of logic plates, which are arranged and formed as a fluid flow path on the joint surface of the plate and connect the devices or components by the grooves, are provided. Welding the plate at the position of the welding line surrounding
Since the fluid flowing through the groove is sealed at the welding line portion, the fluid can be reliably sealed.

According to the logic plate of the sixth aspect of the present invention, the logic plate is formed by joining two or more plates, and the components or components of the device are disposed on one of the surfaces of the logic plate. In addition, a plurality of sets of logic plates configured to form a fluid passage on the joint surface of the plates and connect the devices or components by the grooves are provided. The three-dimensional module is formed by integrally fixing a plurality of sets of logic plates in a state where they are combined, so that the size of the device can be further reduced, the fluid flow path and the control system can be shortened, and the response is fast. Control becomes easy.

Further, according to the logic plate of the seventh invention, in the logic plate of the sixth invention, a heat insulating material is provided by interposing a heat insulating material between the back surfaces of the plurality of sets of logic plates. A low-temperature device such as a control device can be disposed on another logic plate by approaching the high-temperature device disposed on the logic plate.

According to the logic plate of the eighth invention, in the logic plate of the sixth invention, a heat insulating three-dimensional module is provided by providing a separating material between the back surfaces of the plurality of sets of logic plates, thereby achieving a high temperature. Since the logic plate on the high-temperature side where the devices are arranged and the logic plate on the low-temperature side where the low-temperature devices are arranged can be separated by the separating material, mutual thermal effects can be avoided.

According to the logic plate of the ninth invention, in the logic plate of the eighth invention, a heat insulating material is provided between the back surfaces of the plurality of sets of logic plates and the separating material, so that the heat insulating effect is further improved. improves.

Further, according to the logic plate of the tenth aspect, in the logic plate of the sixth aspect, the components or parts of the device are interposed between the back surfaces of the plurality of sets of logic plates, so that the logic plates are separated. It can be effectively used, and the size of the device can be further reduced. Also,
Since the logic plates are separated from each other by constituent devices or parts, a heat insulating effect can be expected.

According to the logic plate of the eleventh invention, in the logic plate of the tenth invention, a heat insulating material is provided between a back surface of the plurality of sets of logic plates and a component or component interposed between the back surfaces. The heat insulation effect becomes remarkable because of the interposition.

Further, according to the logic plate of the twelfth aspect, the logic plate is formed by joining two or more plates, and the components or components of the device are arranged on one of the surfaces of the logic plate. In addition, a plurality of sets of logic plates configured to form a fluid passage on the joint surface of the plate and connect the devices or components by the grooves are provided, and the plurality of sets of logic plates are separated by an adiabatic distance. The logic plates are arranged on the same frame while maintaining the above conditions, so that these logic plates can mutually ignore (prevent) the thermal influence.

Further, according to the logic plate of the thirteenth invention, in the logic plate of the twelfth invention, a heat insulating material is provided between the plurality of sets of logic plates and the mount, so that the heat insulating effect is further improved.

Further, according to the logic plate of the fourteenth aspect, the logic plate is formed by joining two or more plates, and one or both surfaces of the logic plate are provided with components or parts of the apparatus. A set or a plurality of logic plates, which are arranged and formed as grooves for fluid flow in the joint surface of the plate and connect the devices or components by the grooves, are provided. Since the heat insulation groove is provided between the high-temperature zone in which is disposed and the low-temperature zone in which the low-temperature equipment or parts are disposed, heat from the high-temperature zone is cut off so as not to affect the low-temperature zone. be able to.

Further, according to the logic plate of the fifteenth aspect, in the logic plate of the fourteenth aspect, since the heat insulating groove is filled with a heat insulating material, the heat insulating effect between the high temperature zone and the low temperature zone is further enhanced. .

According to the logic plate of the sixteenth aspect of the present invention, in the logic plate of the fourteenth aspect of the present invention, since the refrigerant is caused to flow through the heat blocking groove, the heat blocking effect between the high temperature zone and the low temperature zone is further enhanced. can do.

Further, according to the logic plate of the seventeenth aspect, the logic plate is formed by joining two or more plates, and one or both surfaces of the logic plate are provided with components or parts of the apparatus. In addition to the above, one or more sets of logic plates, which are formed so as to connect the devices or components by forming a groove serving as a fluid flow path on the joint surface of the plate and connect the device or component with the groove, constitute an apparatus. Since devices, components, control devices, electric wiring, and the like are incorporated in any or all of the plates, it is possible to further reduce the size of the entire device such as a fuel cell power generation system.

According to the logic plate of the eighteenth aspect of the present invention, the logic plate is formed by joining two or more plates, and one or both surfaces of the logic plate are provided with components or parts of the apparatus. A set or a plurality of sets of logic plates, which are provided and form a groove serving as a fluid flow path on the joint surface of the plate, and are configured to connect the devices or components by the grooves, are provided. Alternatively, the corrosion-resistant pipe is housed in all parts, and a corrosive fluid is caused to flow through the corrosion-resistant pipe. Therefore, even if the grooves (channels) are numerous and complicated, it is easy without requiring advanced processing technology. In addition, corrosion resistance to corrosive fluid can be ensured. Further, since corrosion-resistant piping made of a material suitable for the properties of the corrosive fluid can be selected and used, the reliability of the corrosion-resistant performance is improved. In addition, since the corrosion-resistant treatment (the formation of the flow path by the corrosion-resistant pipe) may be performed only for the flow path of the corrosive fluid, the number of processing steps can be reduced, and the logic plate can be provided at low cost. Further, when the corrosion resistance deteriorates due to aging, the corrosion resistance can be restored by replacing only the corrosion-resistant piping contained in the logic plate instead of replacing the logic plate, so that the maintenance cost can be reduced. .

Further, according to the logic plate of the nineteenth aspect, in the logic plate of the eighteenth aspect, since a material having flexibility is used as the material of the corrosion-resistant pipe, the corrosion resistance is improved after the logic plate is integrated. Since the flexible pipe can be inserted into the groove or the corrosion resistant pipe can be replaced, the workability can be improved.

Further, according to the logic plate of the twentieth invention, in the logic plate of the eighteenth or nineteenth invention, the end of the corrosion-resistant pipe has a first hole having a through-hole formed with a conical surface on an inner peripheral surface. Using a joining member and a second joining member having a conical surface formed on the outer peripheral surface, the conical surface of the first joining member supports the outer diameter side of the end portion, and the conical surface of the second joining member By joining the end portions so as to support the inner diameter side, the joining operation of the corrosion-resistant pipe can be easily performed, and the leakage of the fluid can be reliably prevented.

According to the logic plate of the twenty-first, twenty-second, or twenty-third invention, in the logic plate of the twentieth invention, the first joining member is formed integrally with the plate, or the second joining member is formed integrally with the plate. By forming the member integrally with the device or component, or by forming the first joining member integrally with the plate and forming the second joining member integrally with the device or component, the number of components is reduced. And the joining operation becomes easier.

Further, according to the logic plate of the twenty-fourth invention, in the logic plate of the twentieth or twenty-second invention, since the first joining member is divided into a plurality, the corrosion-resistant pipe made of a material having high rigidity is used. In the case where the piping route is complicated, the joining work efficiency can be improved.

According to the logic plate of the twenty-fifth aspect, the logic plate is formed by joining three or more plates, and one or both surfaces of the logic plate are provided with components or parts of the apparatus. Arranged and formed a groove serving as a fluid flow path on the joint surface of the plate, and by providing one or more sets of logic plates configured to connect the devices or parts by the grooves, a large number of Even when a large number of grooves are provided corresponding to the devices and components, the arrangement of the grooves can be simplified and the devices and components can be compactly arranged.

Further, according to the logic plate of the twenty-sixth aspect, in the logic plate of the twenty-fifth aspect, a plurality of grooves formed on each plate joining surface are divided into a high-temperature zone and a low-temperature zone, so that each of the grooves has a different shape. Thermal effects can be eliminated.

According to the logic plate used in the fuel cell power generation system of the twenty-seventh aspect, the logic plate is formed by joining two or more plates (the logic plate used in the fuel cell power generation system). A component or a component of the fuel cell power generation system is disposed on one or both surfaces of the logic plate, and a groove serving as a fluid flow path is formed on a joint surface of the plate, and the device or the component is formed by the groove. By providing one or more sets of logic plates configured to connect the above, it is possible to reduce the size and the like of the fuel cell power generation system.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a logic plate according to an embodiment of the present invention.

FIG. 2 is a cross-sectional structural view of a logic plate according to the embodiment of the present invention, and FIG. 2 (b) is a cross-sectional view taken along line EE of FIG.

FIG. 3 is a configuration diagram of a logic plate in which devices are arranged on both sides.

4A and 4B are configuration diagrams of a logic plate subjected to a surface treatment, and FIG. 4B is a cross-sectional view taken along line FF of FIG.

FIG. 5 is a configuration diagram of a logic plate having a welding structure.

FIG. 6 is a sectional view taken along line AA of FIG. 5;

FIG. 7 is a configuration diagram of a three-dimensional module.

FIG. 8 is a configuration diagram of a three-dimensional module including four sets of logic plates.

FIG. 9 is a configuration diagram of a three-dimensional module including five sets of logic plates.

FIG. 10 is a configuration diagram of a heat insulating three-dimensional module having a heat insulating layer.

FIG. 11 is a configuration diagram of a heat insulating three-dimensional module in which a high-temperature side logic plate and a low-temperature side logic plate are separated.

FIG. 12 is a configuration diagram of a heat insulating three-dimensional module including three sets of logic plates.

FIG. 13 is a configuration diagram of a three-dimensional module in which devices are interposed between logic plates.

FIG. 14 is a configuration diagram of a logic plate in which a high-temperature section and a low-temperature section are separated on the same gantry.

FIG. 15 is a configuration diagram when four sets of logic plates are arranged on the same gantry.

FIG. 16 is a configuration diagram of a logic plate having a heat blocking groove.

FIG. 17 is a sectional view taken along line BB of FIG. 16;

FIG. 18 is a configuration diagram of a logic plate including a control device and the like.

FIG. 19 is a sectional view taken along line CC of FIG. 18;

FIG. 20 is a cross-sectional view taken along the line DD of FIG. 18;

FIG. 21 is a plan view showing an example of a logic plate having a large number of grooves.

FIG. 22 is a configuration diagram of a logic plate provided with corrosion-resistant piping.

23 (a) is an enlarged plan view of a portion G in FIG. 22, and FIG. 23 (b) is a cross-sectional view taken along line HH of FIG.

24A is an enlarged plan view of a portion I in FIG. 22, and FIG. 24B is a cross-sectional view taken along line JJ of FIG.

FIG. 25 is a sectional structural view of the logic plate.

FIG. 26 is an enlarged sectional view taken along line KK of FIG. 25.

FIG. 27 is an explanatory diagram in the case of using a corrosion-resistant pipe made of a highly rigid material.

FIG. 28 is a cross-sectional view showing another example of joining the ends of the corrosion-resistant pipe.

FIG. 29 is a cross-sectional view showing another example of joining the ends of the corrosion-resistant pipe.

FIG. 30 is a configuration diagram of a three-dimensional logic plate.

FIG. 31 is a sectional view taken along line MM of FIG. 30;

FIG. 32 is a sectional view taken along line NN.

FIG. 33 is a configuration diagram of another three-dimensional logic plate.

FIG. 34 is a cross-sectional view taken along line OO of FIG. 33;

FIG. 35 is a sectional view taken along line PP of FIG. 33;

FIG. 36 is an explanatory diagram of a case where the devices and components shown in FIG. 30 are connected by grooves formed in one plane.

FIG. 37 is an explanatory diagram of a case where the devices and components shown in FIG. 33 are connected by a groove formed in one plane.

FIG. 38 is a configuration diagram in a case where a high-temperature zone and a low-temperature zone are divided using a three-dimensional logic plate.

FIG. 39 is another configuration diagram when a high-temperature zone and a low-temperature zone are divided using a three-dimensional logic plate.

FIG. 40 is an example of a flowchart of a conventional fuel cell power generation system.

[Description of Signs] 1, 1A, 1B, 1C, 1D, 1E Logic plate 2 Plate 2a Joining surface 2b Surface 3 Plate 3a Surface 3b Joining surface 3c Through hole 3d Conical surface 3e Step 3f Fitting hole 3g Step 4 Adhesion Agent 5 Device 6 Stud bolt 7 Nut 8, 8A-8I Groove 9 Bolt hole 10, 10A-10N Communication hole 11 A device 12 B device 13 O-ring 14 Through bolt 15, 15A, 15B Solid module 16a, 16b Insulation material 17 penetration Bolts 18A, 18B, 18C Insulated three-dimensional module 19 Solenoid valve 20 Control device 21 Electrical wiring 22 C device 23 D device 25a Pressure sensor 25b Flow rate sensor 25c Temperature sensor 26a, 26b Auxiliary device 27a, 27b High temperature device 28a, 28b Low temperature device 29 Corrosion prevention Layer 30 Welding line 31 Separator 32 Mount 33a, 33b, 33c High-temperature equipment 34a, 34b Low-temperature equipment 35 Heat-blocking groove 36 Communication hole 37 Through-hole 101 Through-hole 102 Nut 103 Through-hole 104 Nut 105-129 Equipment 130 Insulation material 131a, 131b High-temperature equipment 132a, 132b High-temperature Equipment 133a, 133b Low-temperature equipment 134a, 134b Low-temperature equipment 139, 140 Equipment 141a, 141b High-temperature equipment 142a, 142b Low-temperature equipment 143a, 143b High-temperature equipment 144a, 144b Low-temperature equipment 145 Insulation material 151 Corrosion-resistant pipe 152 Penetration 152a Hole 152c Conical surface 152d Step 153 Top-shaped component 153a Conical surface 153b Body (joining portion) 153c Head 154 Joint 154a Conical surface 155 Screw 161 Intermediate plate 162A 162B device 162C device 162D component 162E component 162F device 164 fluid supply port 165 fluid discharge port 166A component 166B device 166C device 166D component 166E component 166F device 167 fluid supply port 168 fluid discharge port 169 fluid discharge port 169 172 Fluid outlet 181 Low temperature / high temperature mixing device 182 Low temperature device 183 Low temperature / high temperature mixing device 184 High temperature device 185 Low temperature / high temperature mixing device 186 Low temperature device 187 Low temperature / high temperature mixing device 188 High temperature device 189 High temperature device 191 Device 192 Parts

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3J071 AA11 CC01 CC05 CC11 DD36 FF16 5H027 AA02 BA01 DD00 KK21 KK41 KK51 MM01

Claims (27)

[Claims] 1. A logic plate formed by joining two or more plates, wherein components or components of the apparatus are arranged on one or both surfaces of the logic plate, and a joining surface of the plate is provided. A groove serving as a fluid flow path is formed, a logic plate configured to connect the device or component by the groove is provided with one or more sets, and a corrosion-resistant layer is formed on the surface of the groove. Logic plate. 2. The logic plate according to claim 1, wherein an anticorrosion layer is also formed on a joint surface of the plate. 3. The logic plate according to claim 1, wherein the anticorrosion layer is formed by applying a fluororesin coating or a fluororesin lining. 4. The logic plate according to claim 1, wherein the anticorrosion layer is formed by performing an aluminum oxide film treatment. 5. A logic plate formed by joining two or more plates, wherein a component device or a component of the apparatus is disposed on one or both surfaces of the logic plate, and a joining surface of the plate is provided. A groove serving as a fluid flow path is formed in the groove, and one or more sets of logic plates configured to connect the devices or components are provided by the groove, and the plate is provided at a position of a welding line surrounding the periphery of the groove. A logic plate, which is welded to seal a fluid flowing in the groove at the welding line portion. 6. A logic plate formed by joining two or more plates, wherein components or components of the apparatus are arranged on one of the surfaces of the logic plate, and a fluid is provided on the joining surface of the plates. A plurality of sets of logic plates configured to connect the devices or components by the grooves, and the plurality of sets of logic plates are arranged in a state where the backs of the plurality of sets of logic plates are joined together. A logic plate, wherein the three-dimensional module is formed by integrally fixing the plate. 7. The logic plate according to claim 6, wherein a heat insulating material is provided between the back surfaces of the plurality of sets of logic plates to form a heat insulating three-dimensional module. 8. The logic plate according to claim 6, wherein a heat insulating three-dimensional module is provided by interposing a separating material between the back surfaces of the plurality of sets of logic plates. 9. The logic plate according to claim 8, wherein a heat insulating material is provided between the back surfaces of the plurality of sets of logic plates and the spacer. 10. The logic plate according to claim 6, wherein constituent devices or components of the device are interposed between the backs of the plurality of sets of logic plates. 11. The logic plate according to claim 10, wherein a heat insulating material is interposed between the back surfaces of the plurality of sets of logic plates and components or parts interposed between the back surfaces. Logic plate. 12. A logic plate formed by joining two or more plates, wherein a component device or a component of the apparatus is disposed on one of the surfaces of the logic plate, and a fluid is provided on a joining surface of the plate. A plurality of sets of logic plates, which are configured to connect the devices or components by the grooves, are provided, and the plurality of sets of logic plates are arranged on the same stand while keeping adiabatic intervals. A logic plate, characterized in that: 13. The logic plate according to claim 12, wherein a heat insulating material is interposed between said plurality of sets of logic plates and said gantry. 14. A logic plate formed by joining two or more plates, wherein components or components of an apparatus are disposed on one or both surfaces of the logic plate, and a joining surface of the plate is provided. A high-temperature zone in which a high-temperature device or component is provided, provided with one or more sets of logic plates formed with a groove serving as a fluid flow path and connecting the device or component with the groove, and a low-temperature device. Alternatively, a logic plate, wherein a heat-blocking groove is provided between the low-temperature zone in which the components are arranged. 15. The logic plate according to claim 14, wherein the heat insulating groove is filled with a heat insulating material. 16. The logic plate according to claim 14, wherein a coolant is caused to flow through the heat blocking groove. 17. A logic plate formed by joining two or more plates, wherein a component device or a component of the apparatus is disposed on one or both surfaces of the logic plate, and a joining surface of the plate is provided. A groove serving as a fluid flow path is formed in the apparatus, and one or more sets of logic plates configured to connect the devices or components by the grooves are provided, and the devices, components, control devices, electric wiring, and the like constituting the device are provided. A logic plate, which is incorporated in any or all of the plates. 18. A logic plate formed by joining two or more plates, wherein components or components of the apparatus are arranged on one or both surfaces of the logic plate, and a joining surface of the plate is provided. A groove serving as a fluid flow path is formed in the groove, and one or more sets of logic plates configured to connect the devices or components by the groove are provided, and a part or all of the groove contains a corrosion-resistant pipe, A logic plate characterized in that a corrosive fluid is caused to flow through the corrosion-resistant pipe. 19. The logic plate according to claim 18, wherein a material having flexibility is used as a material of the corrosion-resistant piping. 20. The logic plate according to claim 18, wherein an end of the corrosion-resistant pipe has a first joint member having a through hole having a conical surface formed on an inner peripheral surface, and a conical surface formed on an outer peripheral surface. And a second joint member formed with a conical surface of the first joint member to support an outer diameter side of the end portion, and a conical surface of the second joint member to support an inner diameter side of the end portion. A logic plate characterized by being joined together. 21. The logic plate according to claim 20, wherein the first joining member is formed integrally with the plate. 22. The logic plate according to claim 20, wherein the second joining member is formed integrally with a device or a component. 23. The logic plate according to claim 20, wherein the first connecting member is formed integrally with the plate, and the second connecting member is formed integrally with a device or a component. plate. 24. The logic plate according to claim 20, wherein the first joining member is divided into a plurality of pieces. 25. A logic plate formed by joining three or more plates, wherein components or components of the apparatus are disposed on one or both surfaces of the logic plate, and a joining surface of the plate is provided. A logic plate, comprising: a plurality of sets of logic plates, each of which has a groove serving as a fluid flow path, and is configured to connect the device or component with the groove. 26. The logic plate according to claim 25, wherein a plurality of grooves formed in each plate joining surface are divided into a high temperature zone and a low temperature zone. 27. A logic plate formed by joining two or more plates, wherein components or parts of a fuel cell power generation system are disposed on one or both surfaces of the logic plate, and A fuel plate power generation system, comprising: one or more sets of logic plates, each of which has a groove formed as a fluid flow path on the joint surface thereof and configured so as to connect the devices or components by the groove. Logic plate used for.