JP2006216870A - Manufacturing method of carrying member with cleaning function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrying member with a cleaning function excellent in transportability and foreign matter removability, by improving the surface smoothness of a cleaning layer composed of a heat-resistant resin obtained by making diamine and tetracarboxylic acid dianhydride react at the time of forming the cleaning layer. <P>SOLUTION: The carrying member is manufactured with the cleaning function provided with the cleaning layer on at least one surface of the carrying member; by (a) a process of obtaining the precursor solution of the heat-resistant resin by making diamine and tetracarboxylic acid dianhydride react in an organic solvent; and (b) a process of applying the precursor solution on the carrying member, heating and drying it, removing the organic solvent, thermally treating it at a high temperature, and forming the cleaning layer composed of the heat-resistant resin. At least one kind of the organic solvent whose boiling point is ≤170°C is used as the organic solvent at the time of obtaining the precursor solution of the heat-resistant resin in the process (a). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a method for manufacturing a conveying member with a cleaning function for cleaning and removing foreign substances adhering to a substrate processing apparatus.

In substrate processing apparatuses that dislike foreign matters such as metal impurities, such as semiconductor, flat panel display, and printed circuit board manufacturing apparatuses and inspection apparatuses, each of the transfer systems and the substrate are transferred in physical contact. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are successively contaminated. Therefore, it is necessary to periodically stop and clean the apparatus. For this reason, there existed a problem that the fall of an operation rate and a great effort were needed.

In order to solve these problems, a method of transporting a substrate having an adhesive substance fixed as a cleaning layer into a substrate processing apparatus and adhering the foreign substance adhering to the apparatus to the adhesive substance for cleaning removal (Patent Document) 1) or a method of removing a foreign substance adhering to the back surface of a substrate by conveying a plate-like member (see Patent Document 2).
JP-A-10-154686 (pages 2 to 4) Japanese Patent Laid-Open No. 11-87458 (pages 2 to 3)

The above proposed method is an effective method for avoiding a reduction in operating rate and a great amount of labor without having to stop the apparatus and performing a cleaning process, and in particular, a method for transporting a substrate to which an adhesive substance is fixed as a cleaning layer. Is excellent due to the removal of foreign matters. However, there is a problem that the adhesive substance as the cleaning layer adheres strongly to the apparatus, resulting in poor transportability.

In order to overcome this problem, the present inventors use a heat-resistant resin (polyimide resin) obtained by reacting diamine and tetracarboxylic dianhydride instead of the above-mentioned adhesive substance as the cleaning layer. As a result, it has already been found that the problem of poor transportability can be avoided, and good results can be obtained in the removal of foreign matters in the substrate processing apparatus.

However, according to the subsequent studies by the present inventors, in forming the above heat-resistant resin, when the precursor solution (polyamic acid resin solution) is applied onto the substrate as a conveying member by a spin coater, the periphery of the substrate It turns out that a crown (cradle-like swell) occurs at the part (wafer edge), and it is difficult to form a uniform cleaning layer, which causes a decrease in transportability to the substrate processing apparatus and removal of foreign matters. did.

In light of such circumstances, the present invention improves the surface smoothness of this cleaning layer when forming a cleaning layer made of a heat-resistant resin obtained by reacting diamine and tetracarboxylic dianhydride. It is an object of the present invention to obtain a transport member with a cleaning function that is excellent in transportability into a substrate processing apparatus and removal of foreign matters adhering in the apparatus.

A cleaning layer made of a heat-resistant resin (polyimide resin) obtained by reacting diamine and tetracarboxylic dianhydride is prepared by first reacting both of the above components in an organic solvent. (Polyamic acid resin solution) is obtained, applied onto a substrate as a conveying member, dried by heating to remove the organic solvent, and then heat treated at a high temperature to form. Here, as the organic solvent for obtaining the precursor solution, generally, a high boiling polar solvent such as N-methyl-2-pyrrolidone is often used.

The inventors of the present invention have the surface smoothness of the cleaning layer formed as described above affected by the organic solvent for obtaining the precursor solution, that is, the reason is not clear in the conventional high boiling polar solvent. However, it was thought that when a spin coater was applied onto the substrate, a crown was generated at the peripheral edge of the substrate, making it difficult to form a uniform cleaning layer.

Therefore, instead of the conventional high boiling polar solvent, a low boiling polar solvent such as N, N-dimethylacetamide is used, or a low boiling nonpolar solvent is used together with the conventional high boiling polar solvent. As a result, due to the viscosity characteristics of the precursor solution and the readily volatility of the organic solvent, the occurrence of crown at the peripheral edge of the substrate when applying with a spin coater is greatly reduced, and the surface smoothness is improved and uniform. A cleaning layer can be formed, and it has been found that a transport member with a cleaning function excellent in transportability into a substrate processing apparatus and removal of foreign matters adhering in the apparatus can be obtained, and the present invention is completed. It has come.

That is, the present invention includes (a) a step of reacting a diamine and tetracarboxylic dianhydride in an organic solvent to obtain a precursor solution of a heat resistant resin, and (b) the above precursor solution on the conveying member. A conveying member with a cleaning function having a cleaning layer on at least one surface of the conveying member by applying to the substrate, drying by heating and removing the organic solvent, and forming a cleaning layer made of a heat resistant resin by heat treatment at a high temperature. At the time of manufacturing, at least one organic solvent having a boiling point of 170 ° C. or lower is used as the organic solvent for obtaining the precursor solution of the heat resistant resin in the step (a). The present invention relates to a member manufacturing method.

In particular, the present invention has the above-described configuration in which in the step (a), a reaction in an organic solvent is performed at a temperature of 100 ° C. or less to obtain a precursor solution of a heat resistant resin having a solid content concentration of 30% by weight or less. A method for producing a conveying member with a cleaning function, and a method for producing a conveying member with a cleaning function having the above-described configuration comprising a terminal diamine containing a polyether structure in which the diamine is composed of an alkylene oxide in the step (a) can be provided. is there.

In addition, the present invention can provide a transport member with a cleaning function obtained by each of the above manufacturing methods, and in particular, the transport member with a cleaning function in which the cleaning layer has a tensile elastic modulus at room temperature of 10 to 2,000 MPa. Is. Furthermore, the present invention is characterized in that the transport member with the cleaning function is transported into the substrate processing apparatus, and the foreign matter adhering in the apparatus is adsorbed on the cleaning layer of the transport member to be removed by cleaning. A method for cleaning a substrate processing apparatus and a substrate processing apparatus cleaned by the cleaning method can be provided.

As described above, in the present invention, at least one organic solvent having a boiling point of 170 ° C. or lower is used to obtain a precursor solution of a heat resistant resin by reacting diamine and tetracarboxylic dianhydride in an organic solvent. As a result, the generation of a crown at the peripheral edge of the substrate during coating with a spin coater is greatly reduced, and a uniform cleaning layer with improved surface smoothness can be formed, thereby enabling transportability into the substrate processing apparatus. In addition, it is possible to obtain a conveying member with a cleaning function that is excellent in the removal of foreign matters adhering to the inside of the apparatus.

In addition, the use of the specific organic solvent can shorten the drying time after coating the substrate, further suppresses the surface whitening phenomenon caused by the hygroscopicity of the heat-resistant resin (polyimide resin), and allows drying. The foaming phenomenon due to the sudden evaporation of moisture that is sometimes absorbed is reduced, the occurrence of blisters and cracks is suppressed, and good results are obtained in terms of the aesthetics of the cleaning layer, and the original performance of the cleaning layer is improved. Can be expressed.

In the present invention, first, as step (a), a diamine and tetracarboxylic dianhydride are reacted in an organic solvent to obtain a heat-resistant resin precursor solution (polyamic acid resin solution). In this case, the present invention is characterized in that at least one organic solvent having a boiling point of 170 ° C. or lower is used as the organic solvent. As a result, the generation of a crown at the peripheral edge of the substrate during application to the conveying member in the subsequent step (b) is reduced, and a uniform cleaning layer with improved surface smoothness can be formed.

Examples of the organic solvent having a boiling point of 170 ° C. or lower include, as polar solvents, N, N-dimethylacetamide (boiling point: 165.5 ° C.), N, N-dimethylformamide (boiling point: 153 ° C.), tetrahydrofuran (boiling point: 64 to 65 ° C), cyclohexanone (boiling point: 155 ° C), and the like. Moreover, toluene (boiling point: 110 degreeC), xylene (boiling point: 135-145 degreeC) etc. can also be used as a nonpolar solvent.

Such an organic solvent having a boiling point of 170 ° C. or lower may be used alone or an organic solvent having a boiling point exceeding 170 ° C., for example, N-methyl-2-pyrrolidone (boiling point: 202 ° C.) which is a polar solvent. ) Etc. can also be used together.

In the above combined system, in order to obtain the effect of the present invention based on the use of an organic solvent having a boiling point of 170 ° C. or lower, the organic solvent having a boiling point of 170 ° C. or lower is preferably 10% by weight or more of the total organic solvent, preferably It should be 20% by weight or more.

However, when the organic solvent having a boiling point of 170 ° C. or less is a nonpolar solvent such as toluene or xylene, it is desirable that these nonpolar solvents be 30% by weight or less of the whole organic solvent. If too much of these non-polar solvents are used, the dissolving power due to the solvent may decrease, and the precursor polyamic acid resin may be precipitated.

In order to react diamine and tetracarboxylic dianhydride using such an organic solvent, the reaction may be performed at a reaction temperature of 100 ° C. or lower for 2 to 15 hours. In that case, the imidation ratio is desirably 2% or less (ring closure ratio of 98% or more).

In addition, the amount of the organic solvent used is selected to obtain a heat-resistant resin precursor solution (polyamic acid resin solution) having a solid content of 30% by weight or less, usually 10 to 30% by weight in the above reaction. desirable. If the solid content concentration becomes too high, the solution viscosity becomes high, causing not only a burden on stirring during the reaction, but also a possibility of not being able to perform a uniform reaction. There is a risk of streaking.

In step (a), the diamine, which is one of the reaction components, is a terminal diamine containing a polyether structure composed of alkylene oxide (hereinafter referred to as PE diamine), which makes it easy to control the storage elastic modulus of the cleaning layer. Therefore, it is particularly preferably used.

Examples of such a PE diamine include diamines represented by the following formulas (1) to (4), that is, diamines having a structure containing ethylene oxide, propylene oxide, polytetramethylene glycol, polyamine or a mixture thereof. It is done. The molecular weight of these diamines is not particularly limited, but the average molecular weight is usually 200 to 5,000.

_{H 2 N-CHCH 2 - (} OCH 2 CH 2) n-NH 2 ... (1)
｜ ｜
CH ₃ CH ₃


H ₂ N—CHCH ₂ — (OCHCH ₂ ) a— (OCH ₂ CH ₂ ) b— (OCH ₂ CH) c—NH ₂ (2)
｜ ｜ ｜
CH ₃ CH ₃ CH ₃


H ₂ N—CHCH ₂ — (OCH ₂ CH ₂ CH ₂ CH ₂ ) n—CH ₂ CH—NH ₂ (3)
｜ ｜
CH ₃ CH ₃


H ₂ N— (CH ₂ CH ₂ OCH ₂ CH ₂ OCH ₂ CH ₂ N) n—H (4)
｜
H

The above-mentioned PE diamine can be compounded up to the maximum stoichiometric amount with respect to tetracarboxylic dianhydride, but it is usually desirable to blend so as to be 5 to 60%. In that case, various aliphatic diamines and aromatic diamines are used in combination as other diamines, and they are blended so as to be equivalent to tetracarboxylic dianhydride. In some cases, it is possible to use only the other diamine without using the PE diamine.

Among other diamines, examples of the aliphatic diamine include ethylene diamine, hexamethylene diamine, 1,8-diaminooctane, 1,10-diaminodecane, 1,12-diaminododecane, 1,3-bis (3-amino Propyl) -1,1,3,3-tetramethyldisiloxane and the like.

Examples of the aromatic diamine include 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl ether, m-phenylenediamine, p-phenylenediamine, and 4,4′-diamino. Diphenylpropane, 3,3'-diaminodiphenylpropane, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 4,4 ' -Diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy ) Benzene, 1,3-bis (4-amino) Phenoxy) -2,2-dimethyl propane, 4,4'-diamino benzophenone.

Examples of the tetracarboxylic dianhydride to be reacted with the diamine include 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′-biphenyltetracarboxylic dianhydride, and the like. Anhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, 2,2', 3,3'-benzophenone tetracarboxylic dianhydride, 4,4'-oxydiphthalic dianhydride, 2,2-bis (2,3-dicarboxyphenyl) hexafluoropropane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA), bis (2,3 -Dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, bis (2,3-dicarboxyphenyl) sulfone dianhydride, bis (3 4-di-carboxyphenyl) sulfone dianhydride, pyromellitic dianhydride, ethylene glycol bis trimellitic dianhydride and the like. These may be used alone or in combination of two or more.

In the present invention, next, as the step (b), the above precursor solution is applied on the conveying member, dried by heating and then the organic solvent is removed, and then heat-treated at a high temperature to obtain a heat resistant resin (polyimide resin). A cleaning layer is formed. Thus, a transport member with a cleaning function having a cleaning layer on at least one surface of the transport member is manufactured.

Application to the conveying member is usually performed by a spin coating method. In addition, a known coating method such as a spray method or a roll coating method can also be employed. Here, by using the specific organic solvent described above as the organic solvent of the precursor solution (polyamic acid resin solution), generation of crown on the peripheral edge of the substrate is greatly reduced.

After the above application, the organic solvent is removed by heating and drying. However, the use of the specific organic solvent can shorten the drying time.
In addition, after heating and drying, a heat treatment is performed at a high temperature to form a cleaning layer made of a heat resistant resin (polyimide resin). At this time, the heat treatment temperature is preferably 200 ° C. or higher, and under a nitrogen atmosphere in order to prevent oxidative degradation of the resin. It is desirable to perform the treatment in an inert atmosphere such as in a vacuum. By such treatment, volatile components remaining in the resin can be completely removed.

Here, by using the specific organic solvent, the surface whitening phenomenon due to the hygroscopicity of the heat-resistant resin is suppressed, and the foaming phenomenon due to rapid evaporation of moisture absorbed during drying is reduced. The occurrence of blisters and cracks is also suppressed.

The transport member is not particularly limited, and various substrates are used according to the type of substrate processing apparatus that is a target for removing foreign matter.

Specific examples include semiconductor wafers, substrates for flat panel displays such as LCD and PDP, and other substrates such as compact disks and MR heads. In particular, since the transport member with a cleaning function of the present invention is suitably used for a semiconductor processing apparatus, a semiconductor wafer is mainly used in many cases.

Further, the thickness of the transport member is not particularly limited as long as it can be introduced into the substrate processing apparatus and does not affect the cleaning performance.

The cleaning layer made of the heat-resistant resin thus formed has excellent surface smoothness with reduced generation of crown at the time of application, and further, due to the hygroscopicity of the heat-resistant resin for the reasons described above. No appearance of whitening on the surface, no occurrence of foaming due to rapid evaporation of moisture absorbed during drying, suppression of blistering and cracking, appearance (aesthetics) and quality (original performance of the cleaning layer) It will be excellent.

Such a cleaning layer having excellent appearance and quality is not particularly limited with respect to its thickness. Generally, it is preferable that it is 1-100 micrometers on the single side | surface of a conveyance member (board | substrate), Especially preferably, it is 5-50 micrometers.

Further, the cleaning layer has a 180 degree peeling adhesive force (measured according to JIS Z0237) of 0.20 N / 10 mm width or less, preferably about 0.01 to 0.1 N / 10 mm width to the silicon wafer (mirror surface). There should be. By adopting such a low or non-adhesive configuration, that is, a configuration having substantially no adhesive force, it does not adhere to the contact portion in the apparatus during conveyance into the substrate processing apparatus and may cause a conveyance trouble. Absent.

Further, this cleaning layer preferably has a tensile elastic modulus at room temperature (test method: according to JIS K7127) of 10 to 2,000 MPa. When the tensile elastic modulus is 10 MPa or more, protrusion of the cleaning layer and cutting failure during label cutting can be suppressed, and a label sheet with a cleaning function free of contamination can be manufactured in the precut method. There is no worry of causing a transportation trouble by adhering to the inside contact part. Further, when the tensile elastic modulus is 2,000 MPa or less, good results can be obtained in the removability of foreign matters adhering to the substrate processing apparatus.

A protective film can be bonded to the surface of the cleaning layer having such characteristics as necessary for protecting the cleaning layer. The thickness of the protective film is usually about 10 to 100 μm.

The protective film is not particularly limited, and is polyvinyl chloride, a vinyl chloride copolymer, polyethylene terephthalate, which has been subjected to a release treatment with a release agent such as a silicone, a long chain alkyl, a fluorine, a fatty acid amide, or a silica. Plastic films made of polybutylene terephthalate, polyurethane, ethylene vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, etc. are used. .

In addition, since polyolefin films such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene have releasability without using a release agent, they can be used alone as a protective film.

In the present invention, the transport member with the cleaning function having the above-described configuration is transported into the substrate processing apparatus, and the foreign matter adhering to the substrate processing apparatus is adsorbed to the cleaning layer of the transport member to be removed by cleaning.

Here, the surface smoothness of the cleaning layer is excellent, and the surface whitening phenomenon due to the hygroscopicity of the heat-resistant resin and the foaming phenomenon due to the rapid evaporation of moisture absorption moisture are not observed, and the occurrence of blistering and cracking is observed. Since the appearance and quality are excellent, the adsorbing effect of the foreign matter is better expressed with good transportability, and the foreign matter in the substrate processing apparatus can be reliably removed.

In the present invention, the substrate processing apparatus to be cleaned is not particularly limited. For example, an exposure apparatus, a resist coating apparatus, a developing apparatus, an ashing apparatus, a dry etching apparatus, an ion implantation apparatus, a PVD apparatus, a CVD apparatus, and an external appearance. Various known substrate processing apparatuses such as an inspection apparatus and a wafer prober can be used.

In the present invention, each of the substrate processing apparatuses cleaned by the cleaning method can be provided.

Examples of the present invention will be described below in more detail. However, the present invention is not limited only to the following examples. In the following, “parts” means parts by weight. Moreover, dust removal (foreign substance removal) and transportability were performed as follows using a dry etcher manufactured by Tokyo Electron.

<Dust removal (foreign matter removal) and transportability evaluation method>
In order to remove dust, a new silicon wafer is transferred in advance with the mirror surface down, the initial number of particles (0.2 μm) is measured, a transfer member with a cleaning function is inserted, and a new silicon wafer is again inserted. The wafer was conveyed with the mirror surface down, the number of particles was measured, and the dust removal rate was determined from the difference. Further, the transportability is an observation of the behavior of the transport member with a cleaning function in the apparatus.

As the diamine, 147.6 g of polyether diamine (“XTJ-510 (D-4000)” manufactured by Sun Techno Chemical Co., Ltd.) and 45.61 g of p-phenylenediamine were used, and these were converted to N-methyl-2-pyrrolidone (hereinafter referred to as NMP). ) And xylene were dissolved in 684.09 g of a mixed solvent having a weight ratio of 8: 2. Next, 100.0 g of pyromellitic dianhydride (hereinafter referred to as PMDA) was added to this solution and reacted at 80 ° C. for 8 hours. After the reaction, the mixture was cooled to prepare a precursor solution (polyamic acid resin solution) A of a heat resistant resin having a solid content concentration of 30% by weight and a viscosity at room temperature of 1,000 cp.

Next, the precursor solution A thus prepared was applied to the mirror surface of an 8-inch silicon wafer as a conveying member by a spin coating method so that the thickness after drying was 20 μm, and the coating was performed at 90 ° C. for 15 minutes. Heat-dried. Thereafter, a cleaning layer made of a heat-resistant resin (polyimide resin) having a thickness of 20 μm was formed by heat-treating at 300 ° C. for 2 hours in a nitrogen atmosphere, and a transport member A with a cleaning function was manufactured.

The precursor solution A was applied on a glass plate, and a cleaning layer made of a heat-resistant resin (polyimide resin) having a thickness of 20 μm was formed in the same manner as described above. The cleaning layer was peeled off from the glass plate under pure water heating, and the 180 ° peel adhesive strength (according to JIS Z0237) to the silicon wafer (mirror surface) was measured. As a result, the width was 0.03 N / 10 mm. . Further, the tensile modulus at room temperature (according to JIS K7127) was measured and found to be 320 Mpa.

When the cleaning layer of the transport member A with a cleaning function produced by the above method was observed, the crown within 20 mm from the wafer edge was only about 3 μm and had good surface smoothness. In addition, there was no whitening phenomenon on the surface of the cleaning layer, no foaming phenomenon due to rapid evaporation of hygroscopic moisture, no blistering or cracking, etc., and the appearance (aesthetics) and quality were excellent. .

For this reason, when this transport member A with a cleaning function was used and put into a dry etcher apparatus as a substrate processing apparatus, it could be transported without problems. Moreover, it was found that the dust removal rate is 80% or more and the dust removal performance is high.

Conveying member with a cleaning function in the same manner as in Example 1 except that N, N-dimethylacetamide was used alone as an organic solvent for preparing a precursor solution of a heat resistant resin (polyamic acid resin solution). B was produced.

When the cleaning layer of the transport member B with the cleaning function thus prepared was observed, the size of the crown within 20 mm from the wafer edge was only about 2 μm, and it had good surface smoothness. In addition, there was no whitening phenomenon on the surface of the cleaning layer, no foaming phenomenon due to rapid evaporation of hygroscopic moisture, no blistering or cracking, etc., and the appearance (aesthetics) and quality were excellent. .

For this reason, when this conveyance member B with a cleaning function was used and put into a dry etcher apparatus as a substrate processing apparatus, it could be conveyed without any problems. It was also found that the dust removal rate was 85% or more and the dust removal performance was high.

Comparative Example 1
A transport member C with a cleaning function was produced in the same manner as in Example 1 except that NMP was used alone as an organic solvent for preparing the precursor solution of the heat resistant resin.

When the cleaning layer of the transport member C with the cleaning function thus produced was observed, the size of the crown within 20 mm from the wafer edge was about 15 μm, and the surface smoothness was poor. Further, the surface of the cleaning layer became cloudy and was unfavorable in appearance (aesthetic appearance).

For this reason, when this conveyance member C with a cleaning function was used and put into a dry etcher which is a substrate processing apparatus, it was found that the dust removal rate was 70% or less and the dust removal performance was lowered.

Comparative Example 2
Example 1 except that a mixed solvent of NMP and ethyl diglycol acetate (boiling point: 217.4 ° C.) in a weight ratio of 8: 2 was used as the organic solvent in preparing the precursor solution of the heat resistant resin. Similarly, a conveying member D with a cleaning function was produced.

When the cleaning layer of the transport member D with the cleaning function thus prepared was observed, the crown size within 20 mm from the wafer edge was about 12 μm, and the surface smoothness was poor. Moreover, the foaming phenomenon by the rapid evaporation of moisture absorption moisture was seen at the time of heat-drying, the swelling, the crack, etc. generate | occur | produced and it was inferior to the external appearance (aesthetics) and quality.

For this reason, when this conveyance member D with a cleaning function was used and put into a dry etcher which is a substrate processing apparatus, it was found that the dust removal rate was 60% or less and the dust removal performance was lowered.

Comparative Example 3
The precursor solution of the heat resistant resin was the same as in Example 1 except that a mixed solvent of NMP and xylene in a weight ratio of 5: 5 was used as the organic solvent when preparing the precursor solution of the heat resistant resin. Attempts were made to prepare However, since xylene, which is a nonpolar solvent, was used in an amount of 30% by weight or more based on the total amount of the organic solvent, the dissolving power by the solvent was lowered, and the precursor (polyamic acid resin) was precipitated, so that a stable reaction could not be performed. For this reason, the intended conveying member with a cleaning function could not be produced.

Comparative Example 4
As the diamine, 103.30 g of polyether diamine [“XTJ-510 (D-4000)” manufactured by Sun Techno Chemical Co., Ltd.] and 31.93 g of p-phenylenediamine were used, and these were mixed with NMP and 2-methoxyethanol (boiling point: 124). And 3 ° C) was dissolved in 307.84 g of a mixed solvent having a weight ratio of 8: 2. Thereafter, in the same manner as in Example 1, preparation of a heat-resistant resin precursor solution having a solid content of 40% by weight was attempted. However, gelation occurred during the reaction, and a stable reaction could not be performed. For this reason, the intended conveying member with a cleaning function could not be produced.

Claims (7)

(A) a step of reacting a diamine and tetracarboxylic dianhydride in an organic solvent to obtain a precursor solution of a heat-resistant resin; and (b) applying the precursor solution to a conveying member and drying by heating. And removing the organic solvent, and forming a cleaning layer made of a heat resistant resin by heat treatment at a high temperature to produce a transport member with a cleaning function having a cleaning layer on at least one side of the transport member. (A) The manufacturing method of the conveyance member with a cleaning function characterized by using at least 1 sort (s) of the organic solvent whose boiling point is 170 degrees C or less as an organic solvent at the time of obtaining the precursor solution of the heat resistant resin in a process.

The cleaning function according to claim 1, wherein in step (a), a reaction in an organic solvent is performed at a temperature of 100 ° C. or less to obtain a precursor solution of a heat resistant resin having a solid content concentration of 30% by weight or less. The manufacturing method of a conveyance member.

In the step (a), the diamine is a terminal diamine containing a polyether structure composed of an alkylene oxide. The method for producing a conveying member with a cleaning function according to claim 1 or 2.

The conveyance member with a cleaning function obtained by the manufacturing method in any one of Claims 1-3.

The conveyance member with a cleaning function according to claim 4, wherein the cleaning layer has a tensile elastic modulus at room temperature of 10 to 2,000 MPa.

A transport member with a cleaning function according to claim 4 or 5 is transported into a substrate processing apparatus, and foreign substances adhering to the interior of the apparatus are adsorbed on a cleaning layer of the transport member to be removed by cleaning. A cleaning method for a substrate processing apparatus.

A substrate processing apparatus cleaned by the cleaning method according to claim 6.