JP2006216348A - Contact unit and connector equipped with it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact whereby a connector can be miniaturized, its cost can be reduced, and yet impedance matching can be easily carried out. <P>SOLUTION: A grounding plate 32 is integrated with one surface of a bendable dielectric sheet 31, a conductive passage 33 for a signal is integrated with the other surface of the dielectric sheet 31, a conductive passage 34 for grounding is integrated with the other surface of the dielectric sheet 31 so as to hold the conductive passage 33 for the signal between them, and the conductive passage 34 for grounding is electrically connected to the grounding plate 32. At least one of the grounding plate 32, the conductive passage 33 for the signal, and the conductive passage 34 for grounding is formed by an elastic conductor on which its shape formed when it is bent is maintained. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a connector unit having a microstrip line structure and a connector including the same.

  As a conventional connector, a connector including a signal contact, a ground contact, and a housing is known (see Patent Document 1 below).

  The signal contact and the ground contact are formed by punching a metal plate. Contact portions and spring portions of the signal contact and the ground contact are inserted into grooves formed in the housing. Thereby, a dielectric is interposed between the contact portion and the spring portion of the signal contact and the contact portion and the spring portion of the ground contact, and a so-called microstrip line structure is established.

  As another conventional connector, a connector using an FPC (Flexible Printed Circuit) instead of a contact formed by punching a metal plate is known (see Patent Document 2 below).

  In this connector, a spring is provided on the housing to bring the FPC into contact with the mating contact.

The FPC has a microstrip line structure. The FPC has a flexible dielectric layer, a ground layer formed on the entire surface of the dielectric layer, and a signal conductive path formed on the other surface of the dielectric layer.
Japanese Patent Laid-Open No. 11-329612 (see paragraphs 0047 to 0049 and FIG. 7) Japanese Unexamined Patent Publication No. 2004-22547 (see paragraphs 0022 to 0024, FIG. 1)

  In the connector in which the signal contact and the ground contact are formed by punching the metal plate described above, the microstrip line structure is formed only by the contact portion and the spring portion of the contact, so that it is difficult to match the impedance. is there.

  On the other hand, the connector using the above-mentioned FPC has a microstrip line structure as a whole, so that impedance can be easily matched. However, a connector is required because a spring is required to contact the FPC with the mating contact. There is a problem that the size is increased and the manufacturing cost is increased.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a contact that can reduce the size and cost of a connector and can easily perform impedance matching.

  In order to solve the above-mentioned problems, a contact unit according to a first aspect of the present invention includes a foldable dielectric layer, a ground layer formed on one surface of the dielectric layer, and formed on the other surface of the dielectric layer. A signal conductive path, and a ground conductive path formed on the other surface of the dielectric layer so as to sandwich the signal conductive path and conducting to the ground layer, the ground layer, the signal conductive path And at least one of the ground conductive paths is a conductive plate having elasticity and maintaining a shape when bent.

  Since the microstrip line structure is used as described above, impedance matching is easy. In addition, since at least one of the ground layer, the signal conductive path, and the ground conductive path is a conductive plate that has elasticity and maintains its shape when bent, in order to obtain a contact force No special spring member is required.

  According to a second aspect of the present invention, there is provided a contact unit comprising: a foldable dielectric layer; a ground layer formed on one surface of the dielectric layer; and a signal conductive path formed on the other surface of the dielectric layer. And at least one of the ground layer and the signal conductive path is a conductive plate having elasticity and maintaining a shape when bent.

  Since the microstrip line structure is used as described above, impedance matching is easy. In addition, since at least one of the ground layer and the signal conductive path is a conductive plate that has elasticity and maintains its shape when bent, a dedicated spring member for obtaining contact force is unnecessary. Become.

  According to a third aspect of the present invention, there is provided a contact unit comprising a foldable dielectric layer, a ground layer formed so as to cover the entire surface of the dielectric layer, and a signal layer formed on the other surface of the dielectric layer. A conductive plate, wherein at least one of the ground layer and the signal conductive path is elastic and maintains a shape when bent, and both ends of the ground layer are on the other surface. The signal conductive path is sandwiched between both ends thereof.

  As described above, both ends of the ground layer are folded back to the other surface of the dielectric layer, and the signal conductive path is sandwiched between the both ends, so that both ends function as a ground conductive path. This eliminates the need for a dedicated conductive plate for producing the ground conductive path.

  A connector according to a fourth aspect of the present invention includes the contact unit according to any one of the first to third aspects, and a housing that holds the contact unit and fits into the mating connector. .

  As described above, according to the present invention, the connector can be reduced in size and cost, and impedance matching can be easily performed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a sectional view showing a use state of a connector provided with a contact unit according to the first embodiment of the present invention, FIG. 2 is a front view of the contact unit before being bent, and FIG. 3 is a plan view of the contact unit. is there.

  As shown in FIG. 1, the connector 1 includes a first contact unit 3, a second contact unit 3 ′, and a housing 5.

  As shown in FIGS. 2 and 3, the first and second contact units 3 and 3 ′ include dielectric sheets (dielectric layers) 31 and 31 ′, ground plates (ground layers) 32 and 32 ′, and signal conductors. Paths 33 and 33 'and ground conductive paths 34 and 34' are provided.

  The dielectric sheets 31, 31 ′ are formed by forming a bendable dielectric (for example, polyimide) in a sheet shape.

  The ground plates 32 and 32 'are conductive and elastic metal plates (eg, copper plates). The planar shape and dimensions of the ground plates 32 and 32 'are equal to the planar shape and dimensions of the dielectric sheets 31, 31'. The ground plates 32 and 32 'are fixed to the lower surface (one surface) of the dielectric sheets 31 and 31' with an adhesive.

  The signal conductive paths 33 and 33 'are two elongated metal plates having conductivity and elasticity. The signal conductive paths 33 and 33 ′ are fixed in parallel with an adhesive at the center of the upper surfaces (other surfaces) of the dielectric sheets 31 and 31 ′.

  The ground conductive paths 34 and 34 'are two elongated metal plates having conductivity and elasticity. The ground conductive paths 34 and 34 ′ are fixed in parallel to both ends of the upper surfaces (other surfaces) of the dielectric sheets 31 and 31 ′ with an adhesive. The ground conductive paths 34 and 34 'sandwich the signal conductive paths 33 and 33'. The ground conductive paths 34, 34 ′ are electrically connected to the ground plates 32, 32 ′ through through holes (not shown) formed in the dielectric sheets 31, 31 ′.

  The dielectric sheet 31, 31 ', the ground plates 32, 32', the signal conductive paths 33, 33 ', and the ground conductive paths 34, 34' form a planar line type microstrip line.

  As shown in FIG. 1, the first contact unit 3 is bent to form a contact portion 3a, a spring portion 3b, a terminal portion 3c, and a fixing portion 3d. In FIG. 1, the signal conductive path 33 and the ground conductive path 34 are located on the second contact unit 3 'side. The contact part 3 a is located at one end of the first contact unit 3. The spring part 3b continues to the contact part 3a. The terminal portion 3 c is located at the other end portion of the first contact unit 3. The fixed portion 3d is located between the spring portion 3b and the terminal portion 3c.

  When the first contact unit 3 is bent, the ground plate 32, the signal conductive path 33, and the ground conductive path 34 are plastically deformed, and the shape thereof is maintained. At this time, the dielectric sheet 31 is also deformed into the same shape, and the shape is maintained.

  As shown in FIG. 1, the second contact unit 3 ′ is different from the first contact unit 3 in terms of length and bending method, but the other points are the same. This common part is shown in parentheses in FIGS.

  The second contact unit 3 ′ is bent as shown in FIG. 1 to form a contact portion 3a ′, a spring portion 3b ′, a terminal portion 3c ′, and a fixing portion 3d ′. In FIG. 1, the signal conductive path 33 ′ and the ground conductive path 34 ′ of the second contact unit 3 ′ are located on the first contact unit 3 side. The contact portion 3a 'is located at one end of the second contact unit 3'. The contact portion 3 a ′ faces the contact portion 3 a of the first contact unit 3 in the height direction of the housing 5. The distance between the contact portion 3a and the contact portion 3a ′ is smaller than the thickness of the FPC 9 that is the connection object. The spring portion 3b ′ is continuous with the contact portion 3a ′. The terminal portion 3c ′ is located at the other end portion of the second contact unit 3 ′. The fixing portion 3d ′ is located between the spring portion 3b ′ and the terminal portion 3c ′.

  As shown in FIG. 1, the housing 5 has a receiving portion 51, a hole 52, a groove 53, a hole 54, and a groove 55.

  The receiving part 51 is open to the front of the housing 5. The receiving part 51 receives a part of the FPC 9.

  The hole 52 is formed in the upper surface of the housing 5 and communicates with the receiving portion 51. The hole 52 movably accommodates the contact portion 3a and the spring portion 3b of the first contact unit 3. A part of the contact portion 3 a enters the receiving portion 51 through the hole 52.

  The groove 53 is formed from the upper surface to the rear surface of the housing 5. The fixing portion 3d of the first contact unit 3 is press-fitted into the groove 53 and fixed.

  The hole 54 is formed below the receiving portion 51 and communicates with the receiving portion 51. The hole 54 movably accommodates the contact portion 3a ′ and the spring portion 3b ′ of the second contact unit 3 ′. Further, part of the contact portion 3 a ′ enters the receiving portion 51 through the hole 54.

  The groove 55 is formed on the front surface of the housing 5. The fixing portion 3d ′ of the second contact unit 3 ′ is press-fitted into the groove 55 and fixed.

  Next, a method for using the connector 1 will be described.

  First, the connector 1 is mounted on the printed circuit board 8. That is, the terminal portions 3 c and 3 c ′ of the first and second contact units 3 and 3 ′ are soldered to the printed board 8. At this time, the signal conductive paths 33 and 33 ′ are soldered to the signal conductive paths (not shown) of the printed circuit board 8, and the ground conductive paths 34 and 34 ′ are grounded to the ground conductive paths (not illustrated) of the printed circuit board 8. Solder).

  Next, the FPC 9 is pushed into the receiving portion 51. The tip of the pushed FPC 9 pushes away the contact portions 3a, 3a 'of the first and second contact units 3, 3'. At this time, the ground plates 32 and 32 ′, the signal conductive paths 33 and 33 ′, and the ground conductive paths 34 and 34 ′ are elastically deformed in the spring portions 3b and 3b ′ of the first and second contact units 3 and 3 ′. A spring force is generated. As a result, in the contact portions 3a and 3a ′, the signal conductive paths 33 and 33 ′ are pressed against the signal conductive path (not shown) of the FPC 9, and the ground conductive paths 34 and 34 ′ are ground conductive of the FPC 9. Pressed against a path (not shown), the printed circuit board 8 and the FPC 9 are electrically connected.

  According to this connector 1, the connector can be reduced in size and cost, and since it is a planar line type microstrip line structure, impedance matching can be performed more easily.

  For impedance matching, a method of changing the dielectric constant by changing the material of the dielectric sheet 31, a method of changing the interval between the signal conductive paths 33, or the ground plate 32, the signal conductive path 33, and the ground conductive path. There are methods for changing the thickness, width, and material of at least one of the above.

  Further, the material of the dielectric sheet 31 is not limited to polyimide, and any dielectric material that can be bent may be used.

  The material of the ground plate 32, the signal conductive path 33, and the ground conductive path 34 is a plastic plate that is plastically deformed when bent and maintains its shape, and is a conductive plate having elasticity against the deformation of the shape. Good.

  In the first embodiment, the ground plate 32, the signal conductive path 33, and the ground conductive path 34 of the first contact unit 3 are all formed of the above-described conductors. It is sufficient that at least one of the conductive path 33 and the ground conductive path 34 is formed of a conductor having the above properties. That is, when at least one of the ground plate 32, the signal conductive path 33, and the ground conductive path is bent, the dielectric sheet 31 is kept in a certain shape, and when the FPC 9 is inserted into the receiving portion 51, the elastic deformation Thus, it is sufficient that a spring force is generated. The second contact unit 3 ′ is the same as the first contact unit 3.

  In the first embodiment, the ground plate 32, the signal conductive path 33, and the ground conductive path 34 are fixed to the dielectric sheet 31 using an adhesive, but instead of this method, for example, a double-sided tape is used. The ground plate 32, the signal conductive path 33, and the ground conductive path 34 may be attached to the dielectric sheet 31.

  Moreover, in 1st Embodiment, although the connection target object of the connector 1 is FPC9, a connection target object is not restricted to FPC9, A printed circuit board etc. can also be used as a connection target object.

  FIG. 4 is a front view of the contact unit in a state before bending according to the second embodiment of the present invention, and FIG. 5 is a plan view of the contact unit.

  Portions common to the contact unit of the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences will be described below.

  In the contact unit 203 of the second embodiment, both ends of the ground plate 232 are folded back to the upper surface of the dielectric sheet 31, and two ground conductive paths 234 are formed at both ends.

  6 is a front view of the contact unit shown in FIG. 4 in the process of manufacturing, and FIG. 7 is a plan view of the contact unit.

  Next, a method for manufacturing the contact unit 203 will be described.

  As shown in FIGS. 6 and 7, first, a ground plate 232 wider than the dielectric sheet 31 is bonded to the lower surface of the dielectric sheet 31.

  Next, two signal conductive paths 33 are bonded in parallel to the central portion of the upper surface of the dielectric sheet 31.

  Thereafter, both end portions of the ground plate 232 are bent about 90 ° toward the upper surface of the dielectric sheet 31.

  Next, both end portions of the ground plate 232 are further bent by about 90 ° and are brought into close contact with the upper surface of the dielectric sheet 31. This portion becomes the ground conductive path 234.

  According to the second embodiment, since the ground plate 232 and the ground conductive path 34 are integrated, the contact unit can be easily manufactured and the function as the ground can be improved as compared with the separate structure.

  Further, according to this embodiment, the ground conductive path 34 can be easily formed.

  In the first and second embodiments, the ground conductive paths 34 and 234 are provided on the upper surface of the dielectric sheet 31. However, the ground conductive paths 34 and 234 are not necessarily provided. In the embodiment, a signal conductive path 33 may be provided instead of the ground conductive path 34.

  FIG. 8 is a perspective view of a connector provided with a contact unit according to the third embodiment, FIG. 9 is a perspective view of the contact unit shown in FIG. 8, and FIG. 10 is a perspective view of the contact unit shown in FIG. 11 is a perspective view showing a state before the contact unit shown in FIG. 9 is assembled in the housing, FIG. 12 is a perspective view showing an arrangement relationship between the contact unit and the contact in the connector shown in FIG. 8, and FIG. 13 is shown in FIG. It is a perspective view which shows the use condition of a connector.

  Since the contact unit according to the third embodiment is substantially the same as the contact unit according to the second embodiment, portions common to the contact unit according to the second embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 8, the connector 301 includes a contact unit 303, a housing 305, a contact 311, a contact 312, and a shield cover 314.

  In the contact unit 203 of the second embodiment, all the side edges of the ground plate 232 are folded back by about 180 ° to form the ground conductive path 234. However, as shown in FIGS. In the unit 303, press-fitting pieces 335 are formed on both side edges of the ground plate 232 in addition to the ground conductive path 234, and the press-fitting pieces 335 are bent by about 90 °.

  Cutouts 232 a and 232 b are formed in the portion of the ground plate 232 facing the contact portion 33 a and the terminal portion 33 c of the signal conductive path 33.

  The contact unit 303 is bent in the same manner as the contact unit 3 of the first embodiment.

  As shown in FIGS. 8 and 11, a receiving portion 351 is formed on the front surface of the housing 305. Concave portions 352 are formed at both ends of the housing 305 from the upper surface to the rear surface. The upper end portion of the recess 352 communicates with the receiving portion 351. A groove 356 is formed from the upper surface of the central portion of the housing 305 to the rear surface. A groove 357 is formed in the lower front portion of the housing 305.

  By press-fitting the press-fitting piece 335 of the contact unit 303 into a press-fitting hole (not shown) of the housing 305, the contact unit 303 is fixed to the housing 305 while being accommodated in the recess 352.

  The contact 311 has a press-fitting piece (not shown), and the contact 311 is fixed to the housing 305 in the groove 356 by press-fitting the press-fitting piece into a press-fitting hole (not shown) of the housing 305.

  As shown in FIG. 12, the contact 312 includes a contact portion 312a, a spring portion 312b, a terminal portion 312c, and a press-fit piece 312e. The contact 312 is fixed to the housing 305 in the groove 357 by press-fitting the press-fitting piece 312 e into a press-fitting hole (not shown) of the housing 305. The contact 312 faces the contact unit 303 or the contact 311.

  As shown in FIGS. 8 and 11, the shield cover 314 is attached to the housing 305 and covers the upper surface, the back surface, and the side surface of the housing 305.

  As shown in FIG. 13, the connector 301 is mounted on the printed circuit board 8. By inserting the FPC 9 into the receiving portion 351 of the connector 301, the printed circuit board 8 and the FPC 9 are electrically connected via the connector 301.

  According to the contact unit 303 of this embodiment, since there are only two press-fitting pieces 335, a protrusion (press-fitting) that impedes impedance matching rather than a contact 312 having a press-fitting piece formed on each contact. Since there are few pieces), impedance matching is easy. Moreover, since the notches 232a and 232b are provided in the ground plate 232 on the back side of the contact portion 33a and the terminal portion 33c of the signal conductive path 33, it is possible to prevent a drop in impedance and a deterioration in high frequency characteristics.

  In the connector 303, the contact 312 is used, but a contact unit may be used in the same manner as the connector 1 instead of the contact 312.

FIG. 1 is a sectional view showing a usage state of a connector provided with a contact unit according to the first embodiment of the present invention. FIG. 2 is a front view of the contact unit in a state before being bent. FIG. 3 is a plan view of the contact unit. FIG. 4 is a front view of the contact unit in a state before being bent according to the second embodiment of the present invention. FIG. 5 is a plan view of the contact unit. FIG. 6 is a front view of the contact unit shown in FIG. FIG. 7 is a plan view of the contact unit. FIG. 8 is a perspective view of a connector including a contact unit according to the third embodiment. FIG. 9 is a perspective view of the contact unit shown in FIG. FIG. 10 is a perspective view of the contact unit shown in FIG. 9 when viewed from the rear. FIG. 11 is a perspective view showing a state before the contact unit shown in FIG. 9 is assembled into the housing. 12 is a perspective view showing the positional relationship between contact units and contacts in the connector shown in FIG. FIG. 13 is a perspective view showing a usage state of the connector shown in FIG.

Explanation of symbols

1,303 Connector 3,3 ', 203,303 Contact unit 31 Dielectric sheet (dielectric layer)
32,232 Ground plate (ground layer)
33 Signal path 34,234 Ground path

Claims (4)

A bendable dielectric layer;
A ground layer formed on one surface of the dielectric layer;
A signal conductive path formed on the other surface of the dielectric layer;
A ground conductive path formed on the other surface of the dielectric layer so as to sandwich the signal conductive path and conducting to the ground layer;
The contact unit, wherein at least one of the ground layer, the signal conductive path, and the ground conductive path is a conductive plate that has elasticity and maintains a shape when bent. A bendable dielectric layer;
A ground layer formed on one surface of the dielectric layer;
A signal conductive path formed on the other surface of the dielectric layer,
The contact unit, wherein at least one of the ground layer and the signal conductive path is a conductive plate having elasticity and maintaining a shape when bent. A bendable dielectric layer;
A ground layer formed to cover the entire surface of the dielectric layer;
A signal conductive path formed on the other surface of the dielectric layer,
At least one of the ground layer and the signal conductive path is elastic, and is a conductive plate that maintains its shape when bent.
The contact unit, wherein both ends of the ground layer are folded back to the other surface, and the signal conductive path is sandwiched between the both ends. The contact unit according to any one of claims 1 to 3,
A connector that holds the contact unit and includes a housing that fits into the mating connector.

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