JP2006210624A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device 11 of stable optical characteristics by preventing peeling and deflection between a substrate 21 and a reflecting body 23. <P>SOLUTION: A reflective body 23 comprising a jointing part 37 to be jointed to a substrate 21 and a plurality of dimples 38 is formed on the substrate 21. A light-emitting diode 22 connected to the substrate 21 is arranged at a plurality of dimples 38. Trenches 39 and 40 are provided to the jointing part 37 of the reflecting body 23 which is jointed to the substrate 21, between the plurality of dimples 38. Provision of the trenches 39 and 40 reduces the effect of the difference in the linear expansion coefficients between the substrate 21 and the reflecting body 23, and peeling is prevented between the substrate 21 and the reflection body 23. The occurrence of the deflection of the substrate 21 is prevented which due to thermal contraction, when the reflecting body 23 of resin materia is integrally molded with the substrate 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light emitting device using a light emitting element.

  Conventionally, in a light emitting device using a light emitting diode as a light emitting element, for example, a circuit pattern is formed on one surface of a metal substrate via an insulating layer, and a plurality of light emitting diodes are formed on the circuit pattern of the substrate. It is disposed and electrically and mechanically connected, and a reflector composed of alumina particles or the like is formed so as to cover one surface of the substrate excluding the light emitting surface of each light emitting diode.

When the four corners of the board are screwed to a lighting fixture or the like, a light-emitting area in which a plurality of light-emitting diodes and reflectors are arranged is formed in the central area of one surface of the board, and the light emission of one surface is formed on the other surface of the board By forming a V-shaped groove section in a cross-beam shape except for the area, even if the four corners of the substrate are screwed, the substrate expands at the groove portion when the substrate is thermally expanded by the heat generated when the light emitting diode is turned on. The distortion applied to the light emitting area is reduced by absorbing the distortion of the light emitting diode, and peeling of the light emitting diode in the light emitting area is prevented (see, for example, Patent Document 1).
Japanese Patent Laying-Open No. 2004-140185 (page 8-9, FIG. 12 (a) (b))

  However, the effect of distortion due to thermal expansion of the substrate when the four corners of the substrate are screwed by the grooves formed on the other surface of the substrate can be reduced, but the effect of the difference in linear expansion coefficient between the substrate and the reflector is reduced. There is a problem that the substrate and the reflector peel off due to the difference in the linear expansion coefficient. This is because the reflector is formed over the entire region of the substrate where the plurality of light emitting diodes are arranged, and therefore the influence of the difference in linear expansion coefficient between the substrate and the reflector is likely to occur.

  In addition, when the position of a plurality of light emitting diodes on the substrate and the position of each of the light emitting diodes and the reflectors are shifted, the temperature distribution of the substrate when the light emitting diodes are lit varies. There is also a problem that peeling occurs between the substrate and the reflector due to the influence of the variation in temperature distribution.

  Further, when the reflector is integrally formed on the substrate, for example, by insert molding, there is a problem that the substrate is warped due to thermal contraction of the reflector during the molding, and the reflector is also affected by the warp.

  The reflector used in this light-emitting device is a precision component that greatly affects the optical characteristics, and there is a problem that the optical characteristics are not stabilized due to peeling or warping of the reflector.

  The present invention has been made in view of these points, and an object of the present invention is to provide a light-emitting device that can prevent peeling between a substrate and a reflector and stabilize optical characteristics.

  The light-emitting device according to claim 1 has a substrate; a plurality of light-emitting elements arranged on the substrate; and a bonding portion formed by bonding on the substrate, and the bonding portion stores a plurality of light-emitting elements. And a reflector having a groove formed between the plurality of depressions, and the groove of the reflector has a coefficient of linear expansion between the substrate and the reflector. Reduces the effects of differences, prevents peeling between the substrate and the reflector, and further prevents the substrate from warping due to thermal shrinkage when the reflector is integrally formed on the substrate, for example, and stabilizes the optical characteristics. . In addition, the groove part of a reflector includes the groove part which penetrated and opened in the thickness direction of the reflector, the groove part which thins the thickness of a reflector without penetrating opening.

  The light-emitting device according to claim 2 has a substrate; a plurality of light-emitting elements disposed on the substrate; a plurality of reflecting portions provided with recesses that accommodate the light-emitting elements; The reflector is formed on the substrate separately. The area of each reflection portion is reduced to reduce the influence of the difference in linear expansion coefficient between the substrate and the reflector. Separation from the reflecting portion is prevented, and further, for example, the substrate is prevented from warping due to thermal contraction when the reflector is integrally formed with the substrate, thereby stabilizing the optical characteristics. Note that the separation of the plurality of reflecting portions includes a state where the reflecting portions do not come into contact with each other or affect each other.

  A light-emitting device according to claim 3, comprising: a substrate; and a plurality of light-emitting elements arranged in a matrix on the substrate, arranged in a matrix along one direction and another direction intersecting the one direction. A bonding portion formed on the substrate is formed, and the bonding portion is formed with a plurality of depressions that accommodate the light emitting elements corresponding to the positions of the light emitting elements, and is arranged in one direction. A first groove portion that is continuous over a region where a plurality of recess portions in other directions are arranged is formed between the plurality of recess portions, and a first groove portion that is discontinuous with the first groove portion is formed between the plurality of recess portions arranged in the other direction. And a reflector having a connecting portion that integrally connects the joining portions at both ends in the longitudinal direction of the first groove portion and the second groove portion. The difference in the linear expansion coefficient between the substrate and the reflector due to the first groove and the second groove Reduce sound, to prevent delamination between the substrate and the reflector, further, such a reflector to prevent the warpage of the substrate caused by thermal contraction at the time of integrally molding the substrate to stabilize the optical properties. In addition, the reflector can be integrally formed by providing connection portions that integrally connect the joint portions at both ends in the longitudinal direction of the first groove portion and the second groove portion. In addition, the groove part of a reflector includes the groove part which penetrated and opened in the thickness direction of the reflector, the groove part which thins the thickness of a reflector without penetrating opening.

  The light-emitting device according to claim 4 is a substrate having a plurality of light-emitting element arrangement portions on one surface and a plurality of concave portions provided between the plurality of light-emitting element arrangement portions; A light emitting element; and a joint portion formed by being joined to one surface of the substrate, wherein the joint portion has a plurality of recesses for accommodating the light emitting elements and a plurality of recessed portions embedded in the concave portions of the substrate. A reflector having an embedded portion formed therein, which increases a contact area between the substrate and the reflector, prevents peeling between the substrate and the reflector, and stabilizes optical characteristics. Note that the concave portion of the substrate is a bottom having no through-opening through the substrate, and the contact area with the reflector is increased by the amount corresponding to the bottom of the concave portion compared with the case of through-opening, and the base and the reflector. And the bond strength is improved.

  The light-emitting device according to claim 5 includes: a substrate provided with a plurality of positioning portions; a plurality of light-emitting elements disposed on the substrate with reference to the plurality of positioning portions; and a plurality of depressions that accommodate the light-emitting elements. And having a reflector formed on the substrate with reference to a plurality of positioning portions of the substrate, accurately positioning each light emitting element and each recess of the reflector, The substrate and the reflector are prevented from being peeled off due to variations, and the optical characteristics are stabilized. In addition, the positioning part of a board | substrate contains mechanical things, optical things, such as a mark, etc., and what is necessary is two or more places, but when provided in three places, the vertical and horizontal directions and rotation of the board Position in the direction can be determined.

  In any case, the reflector includes a case where the reflector is formed integrally with the substrate, a case where the reflector is formed separately from the substrate, and the case where the reflector is bonded.

  According to the light emitting device of claim 1, a linear expansion coefficient between the substrate and the reflector is provided by providing a groove portion between the plurality of depressions in the junction portion of the reflector formed by being bonded to the substrate. Therefore, it is possible to prevent peeling between the substrate and the reflector, and further, for example, it is possible to prevent the substrate from warping due to thermal shrinkage when the reflector is integrally formed on the substrate, thereby improving the optical characteristics. It can be stabilized.

  According to the light emitting device of claim 2, the plurality of reflection portions of the reflector are separated and formed on the substrate, so that the area of each reflection portion is reduced and the difference in linear expansion coefficient between the substrate and the reflector is reduced. Can reduce the influence of the substrate, and can prevent the substrate and each reflective part from peeling off. In addition, for example, the substrate can be prevented from warping due to thermal contraction when the reflector is integrally formed with the substrate, thereby stabilizing the optical characteristics. Can be made.

  According to the light emitting device of the third aspect, the plurality of depressions in the other direction are arranged between the plurality of depressions arranged in one direction at the junction of the reflector formed by bonding to the substrate. A linear expansion of the substrate and the reflector is achieved by forming a first groove that is continuous over the region and forming a second groove that is discontinuous with the first groove between a plurality of recesses arranged in the other direction. Since the influence of the difference in coefficient can be reduced, peeling between the substrate and the reflector can be prevented, and further, for example, the substrate can be prevented from warping due to thermal shrinkage when the reflector is integrally formed on the substrate, and the optical characteristics. Can be stabilized. Moreover, a reflector can be integrally molded by providing the connection part which connects a junction part integrally in the both ends of the longitudinal direction of a 1st groove part and a 2nd groove part.

  According to the light emitting device of claim 4, the plurality of embedded portions of the junction portion of the reflector formed by bonding to the substrate in the plurality of concave portions provided between the plurality of light emitting element arrangement portions on one surface of the substrate. Is embedded, the contact area between the substrate and the reflector is increased, peeling between the substrate and the reflector can be prevented, and the optical characteristics can be stabilized.

  According to the light emitting device of claim 5, the light emitting elements are arranged on the substrate and the reflector is formed on the basis of the plurality of positioning portions of the substrate, and each light emitting element and each recess of the reflector are accurately arranged. Since positioning is possible, peeling between the substrate and the reflector due to variations in temperature distribution can be prevented, and optical characteristics can be stabilized.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 to 3 show a first embodiment, in which FIG. 1 is a front view of a light emitting device, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 in the light emitting device, and FIG. B sectional drawing and FIG. 4 are front views of the board | substrate of a light-emitting device.

  The light emitting device 11 includes a light emitting module 12, and the light emitting module 12 is detachably attached to a light emitting device main body (not shown) such as a fixture main body of a lighting fixture.

  The light emitting module 12 includes a substrate 21, a light emitting diode 22 that is a solid light emitting element as a plurality of light emitting elements disposed on one surface 21a of the substrate 21, a reflector 23 that reflects light from each of the light emitting diodes 22, and each light emitting element. A lens body 24 for controlling the light of the diode 22 is provided. In the present embodiment, three light emitting diodes 22 are arranged at equal intervals along one direction of the substrate 21 and along the other direction crossing this one direction, that is, arranged in a matrix.

  As shown in FIG. 4, the substrate 21 is made of a material having high thermal conductivity such as aluminum, or is made of a material having high thermal conductivity such as glass epoxy resin, engineering plastic, or aluminum nitride. The board 21 is provided with a mounting area 26 in which the plurality of light emitting diodes 22 are arranged, and an insertion part 27 that protrudes outward from one edge of the mounting area 26 and is connected to the light emitting device body. In the center of the insertion portion 27, a rectangular fitting groove 28 is formed for positioning and fitting to the light emitting device main body side.

  On one surface 21a of the substrate 21, there is an insulating layer 29 made of a material having insulating properties and thermal conductivity, such as an adhesive that is a thermosetting resin or thermoplastic resin such as polyimide resin or epoxy resin, or inorganic metal powder. Is formed.

  A wiring pattern 30 having conductivity such as copper, gold and nickel is formed on the insulating layer 29 of the substrate 21, and each light emitting diode 22 is electrically connected and mechanically fixed on the wiring pattern 30. Has been. The wiring pattern 30 is divided in correspondence with the light emitting diode arrangement part 31 as a light emitting element arrangement part for arranging each light emitting diode 22, and is formed in a pattern in which a plurality of light emitting diodes 22 can be connected in series. Yes. Among the adjacent wiring patterns 30, the light emitting diode 22 is mounted on the light emitting diode arrangement portion 31 of one wiring pattern 30, and one terminal of the light emitting diode 22 is electrically connected and mechanically fixed, while the other The other electrode of the light emitting diode 22 is electrically connected to the connection position 32 of the wiring pattern 30 by wire bonding.

  Each wiring pattern 30a located at both ends when a plurality of light emitting diodes 22 are connected in series is extended to the insertion part 27, and a terminal part 33 is formed on each wiring pattern 30a of the insertion part 27, respectively. ing.

  Positioning portions 34a, 34b, 34c that are cut out in an arc shape are formed at three locations, one end corner portion on the mounting area 26 side of the substrate 21 and the other central portion, that is, the central portion of the fitting groove 28. Is provided. The two positioning parts 34a, 34b on one side and the one positioning part 34c on the other side are arranged at equal intervals. The positioning portions 34a, 34b, 34c of the substrate 21 and the light emitting diode placement portions 31 are formed in a fixed positional relationship.

  A plurality of holes 35 are formed at positions surrounding the light emitting diode placement portions 31 of the substrate 21 so as to penetrate the substrate 21 from the one surface 21a to the other surface 21b.

  Further, as shown in FIGS. 1 to 3, the reflector 23 is formed by being integrally formed in the mounting area 26 of the one surface 21a of the substrate 21. For example, the reflector 23 is mounted on the one surface 21a of the substrate 21. A resin material having high heat resistance and high reflection characteristics such as polybutylene terephthalate (PBT), polycarbonate, polyphthalamide, and the like is poured into the rough surface of the region 26, and is integrated with the substrate 21 by insert molding.

  The reflector 23 has a plate-like joint portion 37 formed by joining substantially the entire mounting area 26 of the one surface 21a of the substrate 21, and the joint portion 37 corresponds to the position of each light emitting diode 22. A plurality of depressions 38 for accommodating the respective light emitting diodes 22, a first groove 39 and a second groove 40 as a groove located between the plurality of depressions 38 respectively arranged in one direction and the other direction, a substrate A plurality of embedded portions 41 embedded in the respective hole portions 35 of 21 are formed.

  Each depression 38 is formed with a reflecting surface 42 that spreads and reflects light on the surface side that is the lens body 24 side opposite to the substrate 21 side. Each hollow 38 is filled with a visible light conversion resin layer (not shown) so as to cover the light emitting diode 22, and this visible light conversion resin layer is a phosphor that converts ultraviolet rays from the light emitting diode 22 into visible light. For example, a visible light converting substance such as a silicone resin, an epoxy resin, and a modified epoxy resin are dispersed. A groove-like lens body fitting portion 43 that couples the lens body 24 is formed in an annular shape around each recess portion 38 on the surface of the reflector 23 opposite to the substrate 21.

  Each of the groove portions 39 and 40 is formed so as to have a through-opening in the thickness direction of the reflector 23, and is formed in a long shape in a direction intersecting with the adjacent direction of the recessed portion 38. A plurality of connecting portions 44 that integrally connect the joint portions 37 are formed at both ends in the longitudinal direction of the groove portions 39 and 40.

  The first groove 39 is continuously formed over the region where the plurality of depressions 38 in the other direction are arranged on the surface side of the reflector 23, and each embedded portion 41 is formed in the first groove 39. Corresponding portions 45 are formed with connecting portions 45. The second groove part 40 is formed discontinuously with the connection part 44 interposed between the first groove part 39 and the second groove part 40.

  Further, as shown in FIG. 2, the lens body 24 is disposed in the mounting area 26 of the one surface 21a of the substrate 21, and is formed of a resin material having translucency such as polycarbonate and acrylic resin. The lens body 24 has a plurality of lenses 48 arranged corresponding to the positions of the light emitting diodes 22, and each lens 48 receives light facing the light emitting diodes 22 and the reflecting surface 42 of the reflector 23. A concave incident surface 49 is formed, a reflecting surface 50 that reflects light incident from the incident surface 49, and an output surface 51 that emits light incident on the incident surface 49 and light reflected by the reflecting surface 50 are formed. ing. The plurality of lenses 48 are connected and formed integrally on the emission surface 51 side, and the light emission surface 52 of the lens body 24 is formed by the integral emission surface 51. Each lens 48 is fitted to the lens body fitting portion 43 of the reflector 23 and welded by laser welding, ultrasonic welding, or the like.

  Further, the lighting device is configured by combining the light emitting module 12 of the light emitting device 11, the light emitting device main body and the lighting device (not shown).

  And in order to form the light emitting module 12, the position of the board | substrate 21 in the vertical / horizontal direction and a rotation direction is positioned by engaging the pin etc. of a manufacturing apparatus with the some positioning part 34a, 34b, 34c of the board | substrate 21. FIG. The light emitting diodes 22 are disposed on the substrate 21 with the plurality of positioning portions 34a, 34b, 34c of the substrate 21 as a reference, and a resin reflector 23 is insert-molded on the substrate 21. Therefore, it is possible to accurately position each light emitting diode 22 and each recess 38 of the reflector 23.

  At the time of molding of the reflector 23, the joint portion 37 of the reflector 23 formed by being joined to the substrate 21 is formed with the groove portions 39 and 40 located between the plurality of recess portions 38, so that the reflector It is possible to reduce the occurrence of warping of the substrate 21 and the reflector 23 when the resin is thermally contracted after the 23 is integrally formed with the substrate 21. Therefore, the occurrence of warpage is reduced in the formed substrate 21 and reflector 23, so that the optical characteristics can be stabilized.

  Further, by supplying power to the light emitting module 12 from a lighting device (not shown), the plurality of light emitting diodes 22 of the light emitting module 12 are turned on.

  Heat generated when the plurality of light emitting diodes 22 are turned on is efficiently transmitted to the substrate 21 having excellent thermal conductivity, and is transmitted from the substrate 21 to the light emitting device body to be radiated.

  In addition, the heat of the light emitting diode 22 causes the temperature of the substrate 21, the reflector 23, etc., to easily affect the difference in linear expansion coefficient between the substrate 21 such as a metal material and the reflector 23 such as a resin material. Become.

  In this light emitting module 12, since the groove portions 39 and 40 are provided in the joint portion 37 of the reflector 23 formed by being joined to the substrate 21 so as to be positioned between the plurality of recess portions 38, the reflector 21 and the reflector 21 are reflected. The influence of the difference in linear expansion coefficient with the body 23 can be reduced. Therefore, peeling between the substrate 21 and the reflector 23 due to a difference in linear expansion coefficient can be prevented, and optical characteristics can be stabilized.

  When the light emitting module 12 is formed, the light emitting diode 22 is disposed on the substrate 21 and the reflector 23 is formed on the substrate 21 with the plurality of positioning portions 34a, 34b, 34c of the substrate 21 as a reference. And the recesses 38 of the reflector 23 can be accurately positioned, so that variations in temperature distribution can be reduced. For this reason, the substrate 21 and the reflector 23 can be prevented from being peeled off due to the variation in temperature distribution, and the optical characteristics can be stabilized.

  In addition, even when the grooves 39 and 40 are provided, the joining portion 37 of the reflector 23 is integrally connected by the plurality of connecting portions 44 and 45, so that the reflector 23 is insert-molded on the one surface 21a of the substrate 21. In this case, only one gate for injecting the resin of the molding die is required, and the structure of the die can be made simple and inexpensive.

  The groove portion of the reflector 23 may be a groove portion that reduces the thickness of the reflector 23 without through-opening, in addition to the groove portions 39 and 40 that penetrate and open in the thickness direction of the reflector 23.

  Further, the positioning portions 34a, 34b, 34c of the substrate 21 are not limited to three locations, and may be three locations or four or more locations. The positioning portions of the substrate 21 are mechanical parts such as positioning portions 34a, 34b, 34c. In addition to the above, optical positioning may be performed with a mark or the like shown on the substrate 21.

  Further, the reflector 23 may be formed integrally with the substrate 21 or may be formed separately from the substrate 21 and bonded via an adhesive layer.

  Next, FIG. 5 and FIG. 6 show a second embodiment, FIG. 5 is a front view of the light emitting device, and FIG. 6 is a side view of the light emitting device.

  The reflector 23 has a plurality of independent reflecting portions 61 for each recess 38, and the plurality of reflecting portions 61 are separately formed on the one surface 21a of the substrate 21. A gap 62 is formed between adjacent reflecting portions 61 so as to be separated from each other.

  When insert-molding the plurality of reflecting portions 61 on the one surface 21a of the substrate 21, each reflecting portion 61 is separated by using a gate for injecting resin corresponding to each reflecting portion 61 in the molding die. Thus, it can be formed on one surface 21a of the substrate 21.

  In this way, by separating the plurality of reflecting portions 61 of the reflector 23 and forming them on the substrate 21, the area of each reflecting portion 61 is reduced and the difference in linear expansion coefficient between the substrate 21 and the reflector 23 is reduced. Since the influence can be reduced, it is possible to prevent peeling between the substrate 21 and each reflecting portion 61, and further, it is possible to prevent the substrate 21 from warping due to thermal contraction when the reflector 23 is integrally formed with the substrate 21, and optical The characteristics can be stabilized.

  Next, FIG. 7 shows a third embodiment, and FIG. 7 is a cross-sectional view of the light emitting device.

  On one surface 21a of the substrate 21, a plurality of cylindrical recesses 65 that are open only on the one surface 21a are formed between the light emitting diode arrangement portions 31. The recess 65 is formed by press molding or by cutting.

  By insert-molding the reflector 23 on one surface 21a of the substrate 21, a plurality of embedded portions 66 embedded in the respective recesses 65 of the substrate are formed in the joint portion 37 of the reflector 23 formed by being bonded to the substrate 21. It is formed.

  As described above, the plurality of embedded portions of the joint portion 37 of the reflector 23 formed by joining the substrate 21 to the plurality of concave portions 65 provided between the plurality of light emitting diode arrangement portions 31 on the one surface 21a of the substrate 21. Since 66 is embedded, the contact area between the substrate 21 and the reflector 23 is large, the bonding strength is improved, the peeling between the substrate 21 and the reflector 23 can be prevented, and the optical characteristics can be stabilized.

  In particular, the concave portion 65 of the substrate 21 has a bottom that does not open through the substrate 21, and the contact area with the reflector 23 is increased by the amount of the bottom of the concave portion 65, compared to the case where the through hole is opened. The bonding strength between the base 21 and the reflector 23 can be improved.

  Next, FIG. 8 shows a fourth embodiment, and FIG. 8 is a perspective view of the light emitting device.

  A mounting portion 72 that can be attached to and detached from a light emitting device main body 71 such as a lighting fixture main body is integrally formed on the reflector 23 of the light emitting module 12. The mounting portions 72 are formed on opposite side portions of the reflector 23, protrude from the other surface 21b of the substrate 21, and a pair of claw pieces 73 project from the front ends thereof. Are provided with an inclined surface 74 for insertion and a claw portion 75 for retaining.

  In the light emitting device main body 71, a pair of mounting holes 76 into which the mounting portions 72 are inserted and locked are formed corresponding to the mounting positions of the light emitting module 12.

  Then, by inserting each mounting portion 72 of the light emitting module 12 into each mounting hole 76 of the light emitting device main body 71, the claw portion 75 of each mounting portion 72 is engaged with the edge portion penetrating the mounting hole 76, and the light emitting module Lock 12 in place. In this attached state, the other surface 21b of the substrate 21 is in close contact with the light emitting device main body 71, so that the heat of the light emitting module 12 can be efficiently transferred to the light emitting device main body 71, and heat dissipation can be improved.

  Further, the attachment portion 72 can be easily manufactured because it can be formed together when the reflector 23 is formed integrally with the substrate 21. Further, since the substrate 21 is held by the mounting portions 72 on both sides, the bonding strength between the substrate 21 and the reflector 23 can be improved, and the separation between the substrate 21 and the reflector 23 can be prevented.

It is a front view of the light-emitting device which shows the 1st Embodiment of this invention. It is AA sectional drawing of FIG. 1 in a light-emitting device same as the above. It is BB sectional drawing of FIG. 1 in a light-emitting device same as the above. It is a front view of the board | substrate of a light-emitting device same as the above. It is a front view of the light-emitting device which shows 2nd Embodiment. It is a side view of a light emitting device same as the above. It is sectional drawing of the light-emitting device which shows 3rd Embodiment. It is a perspective view of the light-emitting device which shows 4th Embodiment.

Explanation of symbols

11 Light emitting device
21 Board
22 Light-emitting diodes as light-emitting elements
31 Light-emitting diode placement part as light-emitting element placement part
34a, 34b, 34c Positioning part
37 joints
38 depression
39 First groove as groove
40 Second groove as groove
61 Reflector
65 recess
66 Embedded part

Claims (5)

A substrate;
A plurality of light emitting elements disposed on a substrate;
A reflection having a bonding portion formed by bonding on a substrate, and a plurality of depressions for accommodating each light emitting element are formed in the bonding portion and a groove is formed between the plurality of depressions. With the body;
A light-emitting device comprising: A substrate;
A plurality of light emitting elements disposed on a substrate;
A reflector having a plurality of reflecting portions provided with recesses for accommodating the respective light emitting elements, the plurality of reflecting portions being separated and formed on the substrate;
A light-emitting device comprising: A substrate;
A plurality of light-emitting elements arranged in a matrix on the substrate and arranged at intervals along one direction and another direction intersecting with the one direction;
A plurality of depressions for accommodating each light emitting element corresponding to the position of each light emitting element and formed in one direction; A first groove portion that is continuous over a region where a plurality of recess portions in the other direction are arranged is formed between the plurality of recess portions, and a second groove that is discontinuous with the first groove portion is formed between the plurality of recess portions arranged in the other direction. And a reflector having a connecting portion that integrally connects the joining portions at both ends in the longitudinal direction of the first groove portion and the second groove portion;
A light-emitting device comprising: A substrate having a plurality of light emitting element arrangement portions on one surface and a plurality of concave portions provided between the plurality of light emitting element arrangement portions;
A plurality of light emitting elements arranged in each light emitting element arrangement part of the substrate;
A bonding portion formed by bonding to one surface of the substrate is formed. The bonding portion includes a plurality of hollow portions that accommodate the light emitting elements, and a plurality of embedded portions that are embedded in the concave portions of the substrate. A reflector made of;
The light-emitting device according to claim 1. A substrate provided with a plurality of positioning portions;
A plurality of light emitting elements disposed on the substrate with reference to the plurality of positioning portions;
A reflector having a plurality of depressions for accommodating each light emitting element and formed on the substrate with reference to a plurality of positioning portions of the substrate;
A light-emitting device comprising:

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