JP2006205410A - Woody plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a woody plate constituted by sufficiently infiltrating a styrene-butadiene or acrylic type emulsion in a woody fiberboard such as a medium-duty fiberboard or the like or a particle board. <P>SOLUTION: The medium-duty fiberboard with a thickness of 2.7 mm is sliced into two parts in its thickness direction to form two medium-duty fiberboards with a thickness of 1.35 mm and sanding is applied to each of the divided surfaces of the medium-duty fiberboards to form a medium-duty fiberboard 10 with a thickness of 1.0 mm. Next, a styrene-butadiene type emulsion with a glass transition point (Tg) of -47°C, the lowest film forming temperature (MFT) of -47°C, viscosity of 400 mPa s and a surface tension of 33 mN/m is applied to the sanding surface of the medium duty fiberboard 10 with the thickness of 1.0 mm in an amount of 8.0 g/0.994 ft<SP>2</SP>and the coated fiberboard is pressed for 60 sec at 120°C under pressure of 784 kPa by a hot plate to manufacture the woody plate wherein the medium duty fiberboard 10 is impregnated with the styrene-butadiene type emulsion. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wood board obtained by impregnating a wood fiber board such as a medium fiber board or a particle board with a styrene-butadiene or acrylic emulsion.

  Conventionally, as a decorative board used for a floor board or the like, a surface of a base material made of plywood or the like is pasted with a surface decorative material such as a veneer, but in recent years, sufficient impact resistance is applied to the floor. Is based on a composite board in which a surface layer material made of medium fiberboard (MDF) having a high surface hardness and excellent surface smoothness is laminated on the surface of a wood substrate made of plywood or the like. It has come to be used as a material.

Japanese Patent No. 3442212

  By the way, wood fiberboards such as MDF have smooth surface properties and high surface hardness, but conversely, there are drawbacks that they are brittle and easily chipped. In order to improve such disadvantages, a material with high toughness, For example, it is conceivable to impregnate a styrene / butadiene or acrylic emulsion. However, such an emulsion has a problem that it is easy to form a film and is not easily impregnated into a wood fiber board.

  Accordingly, an object of the present invention is to provide a wood board in which a wood fiber board such as a medium fiber board or a particle board is sufficiently impregnated with a styrene / butadiene emulsion or an acrylic emulsion.

  In order to solve the above-mentioned problem, the invention according to claim 1 is a wood board in which a wood fiber board or particle board is impregnated with a styrene-butadiene or acrylic emulsion, and the emulsion has a minimum film-forming temperature. The present invention provides a wood board characterized by using a material having a viscosity of −55 ° C. or more and a viscosity of 400 mPa · s or less.

  The invention according to claim 2 is the wood board of the invention according to claim 1, wherein the minimum film-forming temperature of the emulsion is equal to or lower than the ambient temperature when filling the emulsion into the wood fiber board or particle board. The emulsion has a viscosity of 120 mPa · s or less.

  The invention according to claim 3 is the wood board of the invention according to claim 1, wherein when the viscosity of the emulsion is 130 mPa · s or more, the minimum film-forming temperature of the emulsion is the wood fiber board or the emulsion. We used a material whose temperature is higher than the ambient temperature when filling the particle board.

  According to a fourth aspect of the present invention, in the wood board according to the first, second, or third aspect, the emulsion has a surface tension of 50 mN / m or less.

The invention according to claim 5 is the wood board of the invention according to claim 1, 2, 3 or 4, wherein the emulsion is made of the wood fiber board or the solid fiber so that its solid content is 1 g / scale ² or more. It was applied to the particle board.

  As described above, in the wood board according to the first aspect of the present invention, the minimum film-forming temperature is −55 ° C. or more and the viscosity is 400 mPa · s, as a styrene / butadiene or acrylic emulsion to be impregnated into the wood fiber board or particle board. Since s or less was used, the amount of impregnation increased, and accordingly, the toughness of the wood fiber board and particle board was improved, the brittleness and chipping were improved, and the delamination strength was also increased. .

  In particular, in the wood board of the invention according to claim 2, when the minimum film-forming temperature of the emulsion is equal to or lower than the ambient temperature when the emulsion is filled in the wood fiber board or particle board, the viscosity of the emulsion is 120 mPa · s or less. Since the material is used, the emulsion is more easily filled into the wood fiber board or particle board.

  Further, in the wood board of the invention according to claim 3, when the viscosity of the emulsion is 130 mPa · s or more, the minimum film forming temperature of the emulsion is equal to or higher than the atmospheric temperature when filling the wood fiber board or particle board with the emulsion. Since the material is used, the emulsion is more easily filled into the wood fiber board or particle board.

  In the wood board of the invention according to claim 4, since the emulsion having a surface tension of 50 mN / m or less is used, the amount of the emulsion impregnated into the wood fiber board or particle board is further increased.

In the wood board of the invention according to claim 5, since the emulsion is applied to the wood fiber board or particle board so that the solid content thereof is 1 g / scale ² or more, the brittleness of the wood fiber board or particle board is reduced. A sufficient amount of impregnation can be ensured to improve the ease of chipping.

  Hereinafter, embodiments will be described with reference to the drawings. As shown in FIG. 1, this wood board 1 is obtained by impregnating a medium fiber board (MDF) 10 with a styrene / butadiene emulsion or an acrylic emulsion and then evaporating the water in the emulsion. It is manufactured as follows. In addition, the shaded display part in the figure shows the impregnated layer 20a of the emulsion after moisture has evaporated.

  First, as shown in FIG. 2, the medium fiber board 10A having a thickness of 2.7 mm is sliced so as to be divided into two in the thickness direction, whereby two medium fiber boards 10B having a thickness of 1.35 mm are obtained. As shown in FIG. 3, by sanding the divided surface side of the medium fiber board 10B, the medium fiber board 10 having a thickness of 1.0 mm is formed. In addition, the part shown with an oblique line in FIG. 3 is a part sanded in the medium fiber board 10B.

  Next, as shown in FIG. 4, in the state where the medium fiberboard 10 is impregnated by applying a styrene / butadiene emulsion or acrylic emulsion 20 to the sanding surface of the medium fiberboard 10, FIG. As shown in FIG. 1, when placed on a cradle PB with a polyethylene terephthalate film F and hot-pressed with a hot plate HP, the water in the styrene / butadiene emulsion or acrylic emulsion evaporates, as shown in FIG. Wooden board 1 is completed. The shaded display portion in FIG. 5 shows the emulsion impregnated layer 20b before the water evaporates.

  Examples of the present invention will be described below, but it goes without saying that the present invention is not limited to the following examples.

Example 1
As shown in Table 1, a glass transition point (Tg) of −47 ° C., a minimum film-forming temperature (MFT) of −47 ° C., and a viscosity of 400 mPa · s, a styrene-butadiene emulsion having a surface tension of 33 mN / m was applied at a rate of 8.0 g / scale ² and hot-pressed at 120 ° C. and a pressure of 784 kPa for 60 seconds using a hot plate HP. A wood board impregnated with 10 and a styrene-butadiene emulsion 20 was produced.

(Example 2)
As shown in Table 1, a styrene-butadiene emulsion having a glass transition point (Tg) of 50 ° C., a minimum film-forming temperature (MFT) of 50 ° C., a viscosity of 90 mPa · s, and a surface tension of 45 mN / m was used. Except for this point, a wood board was produced in the same manner as in Example 1.

(Example 3)
As shown in Table 1, a styrene-butadiene emulsion having a glass transition point (Tg) of 12 ° C., a minimum film-forming temperature (MFT) of 12 ° C., a viscosity of 130 mPa · s, and a surface tension of 50 mN / m was used. Except for this point, a wood board was produced in the same manner as in Example 1.

Example 4
As shown in Table 1, a styrene-butadiene emulsion having a glass transition point (Tg) of −55 ° C., a minimum film-forming temperature (MFT) of −55 ° C., a viscosity of 60 mPa · s, and a surface tension of 45 mN / m. A wood board was produced in the same manner as in Example 1 except for the points used.

(Example 5)
As shown in Table 1, a styrene / butadiene emulsion having a glass transition point (Tg) of −14 ° C., a minimum film-forming temperature (MFT) of −14 ° C., a viscosity of 120 mPa · s, and a surface tension of 38 mN / m. A wood board was produced in the same manner as in Example 1 except for the points used.

(Example 6)
As shown in Table 1, the point of using an acrylic emulsion having a glass transition point (Tg) of 15 ° C., a minimum film-forming temperature (MFT) of 15 ° C., a viscosity of 60 mPa · s, and a surface tension of 30 mN / m. Except for this, a wood board was produced in the same manner as in Example 1.

(Comparative example)
As shown in Table 1, a wood board made of a medium fiber board 10 having a thickness of 1.0 mm which was not impregnated with a styrene / butadiene emulsion or an acrylic emulsion was used as a comparative example.

  For each of the above Examples and Comparative Examples, the “peeling test” shown below was performed, and the delamination strength of the wood board was measured as a guideline indicating the amount of emulsion impregnation. The results are shown in Table 1. In addition, the atmospheric temperature at the time of manufacturing the wood board of Examples 1-6 mentioned above was 10 degreeC.

[Peel test]
First, as shown to Fig.6 (a), the test piece P formed by cut | disconnecting the manufactured wooden board into a 5 cm x 5 cm square is prepared. And as shown in the figure (b), the attachments A and B are fixed to the front and back surfaces of the test piece P by using a strong adhesive, and the facing attachments A and B are separated in the separating direction. The maximum load at which the test piece P, which was pulled at a load speed of 2 mm / min and the attachments A and B were bonded, caused delamination, was measured, and this maximum load was evaluated as delamination strength.

As can be seen from Table 1, 1.0 g / scale of styrene / butadiene emulsion or acrylic emulsion having a minimum film forming temperature of −55 ° C. or higher, a viscosity of 400 mPa · s or less, and a surface tension of 50 mN / m or less. The wood boards of Examples 1 to 6 that were hot-pressed after being applied ^two or more times had higher delamination strength than the comparative examples in which the emulsion was not applied at all, and the emulsion 20 was a medium fiber board 10. Is sufficiently impregnated.

  In particular, as can be seen from Examples 4 and 5, even when the minimum film-forming temperature of the emulsion 20 is equal to or lower than the atmospheric temperature (in this case, 10 ° C.) when the emulsion 20 is filled in the medium fiberboard 10, the emulsion If the viscosity of 20 is 120 mPa · s or less, it is assumed that the emulsion 20 is sufficiently impregnated in the medium fiberboard 10.

  On the other hand, when the minimum film-forming temperature of the emulsion 20 is higher than the ambient temperature (in this case, 10 ° C.) when the emulsion 20 is filled in the medium fiberboard 10, the viscosity of the emulsion 20 is 400 mPa · s or less. If so, it is assumed that the emulsion 20 is sufficiently impregnated in the medium fiberboard 10.

  As can be seen from Example 3, when the viscosity of the emulsion 20 is 130 mPa · s or more, the minimum film-forming temperature of the emulsion 20 is the atmospheric temperature when the emulsion 20 is filled in the medium fiber board 10 (in this case) 10 ° C.) or higher, it is assumed that the emulsion 20 is sufficiently impregnated into the medium fiberboard 10.

  On the other hand, when the viscosity of the emulsion 20 is lower than 130 mPa · s, it is assumed that the emulsion 20 is sufficiently impregnated in the medium fiberboard 10 if the minimum film-forming temperature of the emulsion 20 is −55 ° C. or higher. Is done.

  Further, as can be seen from Example 1, the minimum film-forming temperature of the emulsion 20 is equal to or lower than the atmospheric temperature (in this case, 10 ° C.) when the emulsion 20 is filled in the medium fiber board 10, and the viscosity of the emulsion 20 is 130 mPa. -Even if it is more than s, if the surface tension of the emulsion 20 is 35 or less, it is assumed that the emulsion 20 is sufficiently impregnated into the medium fiberboard 10.

  In the embodiment described above, the medium fiberboard coated with the emulsion is hot-pressed, but is not limited thereto, and the medium fiberboard coated with the emulsion is left in a heated atmosphere. You may make it evaporate the water | moisture content of an emulsion.

  In the embodiment described above, the emulsion is applied to the medium fiberboard to impregnate the medium fiberboard. However, the present invention is not limited to this, and the medium fiberboard is immersed in the emulsion. Or by suction, the medium fiberboard may be impregnated with the emulsion.

  In the above-described embodiment, the sliced medium fiberboard is used. However, the present invention is not limited to this, and the wood fiberboard such as a normal medium fiberboard or hard fiberboard that is not sliced is used. Alternatively, a particle board or the like can be used.

  In each of the above-described embodiments, a styrene / butadiene emulsion or an acrylic emulsion is used as the emulsion to be impregnated into the medium fiberboard. However, the present invention is not limited to this. For example, vinyl acetate It is also possible to use emulsions of the system.

It is sectional drawing which shows one Embodiment of the wooden board concerning this invention. It is process drawing which shows the manufacturing method of a wooden board same as the above. It is process drawing which shows the manufacturing method of a wooden board same as the above. It is process drawing which shows the manufacturing method of a wooden board same as the above. It is process drawing which shows the manufacturing method of a wooden board same as the above. (A) is a top view which shows the test piece used for the peeling test of a wooden board, (b) is a schematic explanatory drawing for demonstrating the method of a peeling test.

Explanation of symbols

1 Wood board 10, 10A, 10B Medium fiberboard (MDF)
20 Emulsion 20a, 20b Impregnated layer HP Hot plate F Polyethylene terephthalate film PB cradle P Test piece A, B Attachment

Claims (5)

A wood board in which a wood fiber board or particle board is impregnated with a styrene-butadiene or acrylic emulsion,
A wood board, wherein the emulsion has a minimum film-forming temperature of −55 ° C. or higher and a viscosity of 400 mPa · s or lower.   2. The emulsion according to claim 1, wherein the emulsion has a viscosity of 120 mPa · s or less when the minimum film-forming temperature of the emulsion is equal to or lower than the ambient temperature when the wood fiber board or particle board is filled with the emulsion. Wood board.   When the viscosity of the said emulsion is 130 mPa * s or more, the minimum film forming temperature of the said emulsion was used more than the atmospheric temperature at the time of filling the said emulsion into a wooden fiber board or particle board. Wood board.   The wood board according to claim 1, 2 or 3, wherein the emulsion has a surface tension of 50 mN / m or less. The wood board according to claim 1, 2, 3 or 4, wherein the coating amount of the emulsion is a solid content of 1 g / scale ² or more.

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