JP2006198713A - Powder for shot blast - Google Patents
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- JP2006198713A JP2006198713A JP2005012391A JP2005012391A JP2006198713A JP 2006198713 A JP2006198713 A JP 2006198713A JP 2005012391 A JP2005012391 A JP 2005012391A JP 2005012391 A JP2005012391 A JP 2005012391A JP 2006198713 A JP2006198713 A JP 2006198713A
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本発明は、プラズマディスプレイパネル等の研磨に用いるショットブラスト用金属粉末に関するものである。 The present invention relates to a metal powder for shot blasting used for polishing a plasma display panel or the like.
従来、プラズマディスプレイパネルのリブ溝加工には金属粉末を用いたショットブラスト法が使用されている。このショットブラスト用の粉末としては加工能力の大きい鉄系、例えばステンレス鋼系(以下、SUS系という)、耐熱鋼系(以下、SUH系という)等の金属粉末が一般的に利用されている。しかし、加工時に金属粉末とガラス基板の摩擦により基盤に静電気が帯電し、スパーク等により誘電体が破損するケースがある。すなわち、リブ材や電極が破損する場合があった。 Conventionally, shot blasting using metal powder has been used for processing rib grooves in plasma display panels. As the powder for shot blasting, metal powders having high processing capability, such as stainless steel (hereinafter referred to as SUS), heat-resistant steel (hereinafter referred to as SUH), etc. are generally used. However, there are cases where static electricity is charged on the substrate due to friction between the metal powder and the glass substrate during processing, and the dielectric is damaged by sparks or the like. That is, the rib material and the electrode may be damaged.
その発生する静電気を除去する手段として、例えば特開2001−345043号公報(特許文献1)に開示されているように、サンドブラスト装置のノズルから噴射される高圧混合流体によるプラズマディスプレイパネルの隔壁成形工程において、プラズマディスプレイパネルの複数のアドレス電極端子部を磁気発生体に付着させた導電性磁性体粉末を介して接地する静電気除去方法が提案されている。 As a means for removing the generated static electricity, for example, as disclosed in Japanese Patent Application Laid-Open No. 2001-345043 (Patent Document 1), a partition forming process of a plasma display panel using a high-pressure mixed fluid ejected from a nozzle of a sandblasting device Has proposed a static electricity removing method in which a plurality of address electrode terminal portions of a plasma display panel are grounded through a conductive magnetic powder adhered to a magnetic generator.
しかしながら、上述した特許文献1に開示されているように、基盤にアース等の静電気除去装置を接続したりする場合も多く提案されているが、この方法ではある程度の目的を達成しているがかならずしも十分と言うことができない。 However, as disclosed in the above-mentioned Patent Document 1, many cases have been proposed in which a static electricity removing device such as a ground is connected to the base, but this method achieves a certain purpose, but it is not necessarily done. I can't say enough.
上述したような問題を解消するために、発明者らは鋭意開発を進めた結果、金属粉末はガラスとの摩擦により陰極に帯電するのに対して、CaCO3 、Al2 O3 、ZrO、SiO2 等のセラミックスは陽極に帯電することから、両粉末を適切な配合比で混合することにより帯電量はキャンセルされて十分に低くなることを見出した。その発明の要旨とするところは、
(1)プラズマディスプレイパネルの加工用金属粉末において、Hv200〜400の金属粉末に対して、セラミックス粉末を1〜30mass%混合することを特徴とするショットブラスト用粉末。
In order to solve the above-described problems, the inventors have intensively developed, and as a result, the metal powder is charged to the cathode by friction with glass, whereas CaCO 3 , Al 2 O 3 , ZrO, SiO Since ceramics such as 2 are charged on the anode, it has been found that the charge amount is canceled and sufficiently reduced by mixing both powders at an appropriate blending ratio. The gist of the invention is that
(1) A metal powder for processing a plasma display panel, wherein 1-30 mass% of ceramic powder is mixed with metal powder of Hv 200-400.
(2)前記(1)に記載の金属粉末およびセラミックス粉末の最大粒径が加工する溝幅の0.2〜0.9倍であることを特徴とするショットブラスト用粉末。
(3)前記(1)に記載のセラミックス粉末を5〜20mass%混合することを特徴とするショットブラスト用粉末にある。
(2) A powder for shot blasting, wherein the maximum particle size of the metal powder and ceramic powder according to (1) is 0.2 to 0.9 times the width of the groove to be processed.
(3) A powder for shot blasting comprising 5 to 20 mass% of the ceramic powder according to (1).
以上述べたように、本発明によると従来技術に比べて帯電量が十分低く、極めて加工が良好に行うことが可能となる優れた効果を奏するものである。 As described above, according to the present invention, the charge amount is sufficiently lower than that of the prior art, and an excellent effect is obtained that enables extremely good processing.
以下、本発明について詳細に説明する。
本発明に係る金属粉末は、誘電体との摩擦により陰極に帯電するのに対し、セラミックス粉末は陽極に帯電することから、両粉末を適切な割合で混合することにより帯電量はキャンセルされて十分に低くなることを見出したものである。しかし、セラミックス粉末の混合量が1%未満では帯電量が十分に低減されない。また、30%を超えると金属の量が必然的に減るため生産的に加工が行なえない。従って、その範囲を1〜30%とする。さらに、好ましくは5〜20%とする。
Hereinafter, the present invention will be described in detail.
The metal powder according to the present invention is charged to the cathode by friction with the dielectric, whereas the ceramic powder is charged to the anode. Therefore, mixing the two powders at an appropriate ratio cancels the charge amount sufficiently. Has been found to be lower. However, when the mixing amount of the ceramic powder is less than 1%, the charge amount is not sufficiently reduced. Further, if it exceeds 30%, the amount of metal inevitably decreases, so that it cannot be productively processed. Therefore, the range is made 1-30%. Furthermore, it is preferably 5 to 20%.
金属粉末の組成は特に限定されないが、硬度がHvで200未満と低すぎると良好な加工が行えない。また、Hvが400を超えると誘電体が破損する場合があり好ましくない。従って、Hvで200〜400の材料が最適である。このような材料としては、SUS系およびSUH系がコスト、品質の両面から見て好ましい。金属粉粉末およびセラミックス粉末の最大粒径は加工する溝幅の0.2〜0.9倍となるように設定することが好ましい。しかし、0.2未満ではショット時の衝突エネルギーが小さく加工が行えない。また、0.9を超えると割れ欠けの要因となる。従って、その範囲を0.2〜0.9倍とする。好ましくは0.5〜0.8倍とする。 The composition of the metal powder is not particularly limited, but if the hardness is too low at Hv of less than 200, good processing cannot be performed. Further, if Hv exceeds 400, the dielectric may be damaged, which is not preferable. Therefore, a material having an Hv of 200 to 400 is optimal. As such a material, SUS type and SUH type are preferable in terms of both cost and quality. The maximum particle size of the metal powder powder and ceramic powder is preferably set to be 0.2 to 0.9 times the groove width to be processed. However, if it is less than 0.2, the impact energy at the time of a shot is small, and processing cannot be performed. On the other hand, if it exceeds 0.9, it will cause cracking. Therefore, the range is 0.2 to 0.9 times. Preferably it is 0.5 to 0.8 times.
セラミックス粉末の種類は特に限定しないが、コストを考慮すれば、CaCO3 、Al2 O3 、ZrO、SiO2 が最適である。また、これらのセラミックス粉末を2種以上混合して使用することも構わない。 The type of ceramic powder is not particularly limited, but considering cost, CaCO 3 , Al 2 O 3 , ZrO, and SiO 2 are optimal. Further, two or more kinds of these ceramic powders may be mixed and used.
以下、本発明について実施例によって具体的に説明する。
表1に示す各粉末を、ガス圧5MPa、ノズル径φ2mmなる条件のガスアトマイズにより作製し、−45μmに分級した。これに表1に掲げるセラミックス粉末をV型混合機にて混合時間30分の混合を行なった。その時の各混合量、金属粉末硬度Hv、最大粒径での混合体を低融点ガラスにショットし、幅50μmの溝加工を行った。その時の最大粒径/加工幅の場合での帯電量および割れ頻度の結果を表1に示す。
Hereinafter, the present invention will be specifically described with reference to examples.
Each powder shown in Table 1 was prepared by gas atomization under conditions of a gas pressure of 5 MPa and a nozzle diameter of φ2 mm, and classified to −45 μm. The ceramic powder listed in Table 1 was mixed with a V-type mixer for 30 minutes. Each mixture at that time, metal powder hardness Hv, and a mixture with the maximum particle size were shot on a low-melting glass, and groove processing with a width of 50 μm was performed. Table 1 shows the results of the charge amount and cracking frequency in the case of the maximum particle size / working width at that time.
帯電体の帯電量の測定方法については、図1および図2に示す。図1は、静電気測定機器の断面図であり、図2は、静電気測定機器の上面図である。この図に示すように、鋼板1の両面にゴムシート2を貼り、鋼板1の片面にゴムシート2面にベース用アルミテープ3を貼り、その上にアルミナ板5をベース用アルミテープ3で固定する。このベース用アルミテープ3の上に、片側被覆を剥がした電線4をベース用アルミテープ3で固定する。もう一方はショットブラスト装置本体外に出し、静電気量を測定する。なお、符号6はガラス板、7はショットノズルを示す。
The method for measuring the charge amount of the charged body is shown in FIG. 1 and FIG. FIG. 1 is a cross-sectional view of a static electricity measuring device, and FIG. 2 is a top view of the static electricity measuring device. As shown in this figure,
ショット条件としては、加工時におけるノズルはボロンφ5を用い、供給エア:0.23MPa、圧送エア:0.20MPa、加工時におけるノズル内の内圧:0.19MPa、ノズル距離:50mm、研磨材供給量:69rpm(MAX)で幅50μmの溝加工を行った。その時の評価項目としては、帯電量と割れ頻度を測定した。帯電量については、上述した図1および図2に示す静電気測定機器を用い、割れ頻度については、加工後の誘電体形状としての割れ欠けの有無を目視にて確認し、10個のブラスト処理に対して割れ、欠けの発生頻度を測定した。また、金属粉末硬度については、ビッカース硬度計にて負荷荷重50gにて行った。 As the shot conditions, the nozzle used at the time of processing is boron φ5, supply air: 0.23 MPa, pumping air: 0.20 MPa, internal pressure inside the nozzle at processing: 0.19 MPa, nozzle distance: 50 mm, abrasive supply amount : Groove machining with a width of 50 μm was performed at 69 rpm (MAX). As evaluation items at that time, the charge amount and the cracking frequency were measured. For the charge amount, use the static electricity measuring device shown in FIG. 1 and FIG. 2 described above, and for the cracking frequency, visually check the presence or absence of cracks as a dielectric shape after processing, and perform 10 blast treatments. On the other hand, the occurrence frequency of cracks and chips was measured. Moreover, about metal powder hardness, it carried out with 50 g of load loads with the Vickers hardness meter.
表1に示すように、No.1〜12は本発明例であり、No.13〜20は比較例である。比較例No.13は、金属粉末硬度は低いために、溝加工が不可であった。比較例No.14は、金属粉末硬度は高いために、割れ頻度が多い。比較例No.15は、セラミックス粉末混合量が少ないために、帯電量が高く、かつ割れ頻度が多い。比較例No.16は、No.15と同様にセラミックス粉末混合量が少ないために、帯電量が高く、かつ割れ頻度が多い。比較例No.17は、セラミックス粉末混合量が多いために、溝加工が不可であった。 As shown in Table 1, no. Nos. 1 to 12 are examples of the present invention. 13 to 20 are comparative examples. Comparative Example No. In No. 13, since the metal powder hardness was low, groove processing was impossible. Comparative Example No. No. 14 has a high cracking frequency due to its high metal powder hardness. Comparative Example No. No. 15 has a high charge amount and a high cracking frequency because the ceramic powder mixing amount is small. Comparative Example No. 16 is No.16. Since the ceramic powder mixing amount is small as in the case of 15, the charge amount is high and the cracking frequency is high. Comparative Example No. No. 17 could not be grooved because of the large amount of ceramic powder mixed.
比較例No.18は、No.17と同様にセラミックス粉末混合量が多いために、溝加工が不可であった。比較例No.19は、セラミックス粉末混合帯電量が高く、かつ最大粒径/加工幅が小さいために、帯電量がプラスとなり、かつ溝加工が不可であった。比較例No.20は、セラミックス粉末混合帯電量が高く、かつ最大粒径/加工幅が大きいために、帯電量がプラスとなり、かつ溝加工が不可であった。これに対し、本発明例であるNo.1〜12は、いずれも帯電量が低く、かつ割れ頻度の少ないことが分かる。 Comparative Example No. No. 18 As in the case of No. 17, the amount of ceramic powder mixed was so large that groove processing was impossible. Comparative Example No. In No. 19, since the ceramic powder mixed charge amount was high and the maximum particle size / working width was small, the charge amount was positive and groove processing was impossible. Comparative Example No. No. 20 had a high ceramic powder mixed charge amount and a large maximum particle size / working width, so the charge amount was positive and groove processing was impossible. On the other hand, No. which is an example of the present invention. It can be seen that Nos. 1 to 12 have a low charge amount and a low cracking frequency.
上述したように、本発明に係るプラズマディスプレイパネル等の研磨に用いるショットブラスト用金属粉末を用いることにより、従来技術に比べて帯電量が十分低く、極めて加工が良好に行うことが可能となる等の優れた効果を奏するものである。 As described above, by using the metal powder for shot blasting used for polishing of the plasma display panel or the like according to the present invention, the charge amount is sufficiently lower than that of the prior art, and the processing can be performed extremely well. This is an excellent effect.
1 鋼板
2 ゴムシート
3 ベース用アルミテープ
4 電線
5 アルミナ板
6 ガラス板
7 ショットノズル
特許出願人 山陽特殊製鋼株式会社
代理人 弁理士 椎 名 彊
1
Patent Applicant Sanyo Special Steel Co., Ltd.
Attorney: Attorney Shiina
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CN114011958A (en) * | 2021-11-18 | 2022-02-08 | 中国航空制造技术研究院 | Shot blasting forming method for prolonging fatigue life of ribbed integral wallboard |
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RU2655546C2 (en) * | 2016-07-29 | 2018-05-28 | Надежда Владимировна Перевалова | Powder for water jet cutting (options) |
RU2674047C1 (en) * | 2018-01-10 | 2018-12-04 | Надежда Владимировна Перевалова | Water-jet cutting powder (options) |
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JP2004148414A (en) * | 2002-10-28 | 2004-05-27 | Seiko Epson Corp | Abrasive and production method for abrasive and production device used for the same |
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JP2004148414A (en) * | 2002-10-28 | 2004-05-27 | Seiko Epson Corp | Abrasive and production method for abrasive and production device used for the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114011958A (en) * | 2021-11-18 | 2022-02-08 | 中国航空制造技术研究院 | Shot blasting forming method for prolonging fatigue life of ribbed integral wallboard |
CN114011958B (en) * | 2021-11-18 | 2023-08-04 | 中国航空制造技术研究院 | Shot blasting forming method for prolonging fatigue life of ribbed integral wallboard |
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