JP2006198656A - Manifold for cooling metallic die, and forming die using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for a manifold which can secure the quality of formed products by eliminating the erroneous connection of piping and the leakage of cooling fluid in cooling the forming dies. <P>SOLUTION: In the manifold for cooling metallic dies, a plurality of supply passages for supplying cooling fluid to each of a plurality of cooling pipe units which are inserted into a plurality of cooling holes of the forming dies and form supply and return passages of the cooling fluid, a plurality of collecting passages for collecting the used cooling fluid from the cooling pipe units, a fluid supply passage for distributively supplying the cooling fluid to a plurality of the supply passages, and a fluid discharge passage for collecting the cooling fluid from a plurality of the collecting passages are formed in a rigid body as the respective flow passage spaces. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to cooling of a molding die that performs aluminum die casting and the like, and more particularly to a flow path configuration of a cooling fluid that flows through the molding die.

In general, when molding is performed at a high temperature such as aluminum die casting, it is necessary to control the temperature of each part of the molded product in the molding die in order to ensure the quality of the molded product. Management is performed by cooling the corresponding part of the mold. The cooling is performed by changing the position of the cooling portion of the molding die and the cooling temperature for each molding die.
FIG. 1 and FIG. 2 show a prior art example in the case of cooling a molding die using water as a cooling medium. FIG. 1 shows an external appearance of a pipe connection configuration, and FIG. 2 shows a cross-sectional configuration of a manifold portion in the configuration of FIG. In the configuration of FIGS. 1 and 2, the cooling water supplied from the cooling water supply port 8 is distributed to the plurality of water supply pipes 4 by the water supply side manifold 6, passes through the cooling pipe joints 3, and then the reciprocating cooling pipe joints 10. Is supplied to a reciprocating cooling pipe 20 'connected to'. In the reciprocating cooling pipe 20 ′, cooling water enters from the inner cylinder 11 ′, cools the nesting portion 1 of the molding die, and returns to the drain side manifold 7 via the outer cylinder 12 ′ and the drain pipe 5. Further, it is discharged to the outside from the cooling water discharge port 9 via the drain side manifold 7. The reciprocating cooling pipe joint 10 ′ fixes the inner cylinder 11 ′ and outer cylinder 12 ′ of the reciprocating cooling pipe 20 ′ in a predetermined positional relationship, and drills into the nesting part 1 and the main mold part 2 of the molding die. The reciprocating cooling pipe 20 'is fixed in the provided cooling hole 50'. 30a ′, 30b ′, 30c ′, 30d ′ are seal members such as O-rings, and 13 is a nut for fixing the water supply pipe 4 and the drain pipe 5 to the cooling pipe joint 3 side.

  Among the prior arts related to the present invention, those described in the literature include, for example, JP-A-9-327760 (Patent Document 1), JP-A-2000-94111 (Patent Document 2), and Journal. of the JIST vol. 45 No. 522 (2004-7) p. p. There exists what was described in 545-549 (nonpatent literature 1). Japanese Patent Laid-Open No. 9-327760 discloses a plurality of water supply pipes between a plurality of cooling pipes 1 inserted into cooling holes of the mold A and a water supply manifold 5 between the installation plate 2 and the pipe holding plate 4. A structure is described in which the plurality of cooling pipes 1 and the drainage manifold 6 are connected by a plurality of drainage integrated hoses 10 while being connected by a distribution hose 8, and Japanese Patent Application Laid-Open No. 2000-94111 discloses a mold. In order to improve maintainability and workability around the mold, an inlet port 22a directly connected to the cooling water supply pipe 11 and an outlet port 22b directly connected to the cooling water discharge pipe 12 are an upper mold (mold). 2 and the cooling passage 21 from the inlet port 22a to the outlet port 22b is also formed in the upper die 2, and cooling water is also provided in the lower die (die) 3. An inlet port 32a directly connected to the supply pipe 11 and an outlet port 32b directly connected to the cooling water discharge pipe 12 are formed in the lower manifold 32, and a cooling passage 31 from the inlet port 32a to the outlet port 32b. Is also formed in the lower mold 3, and Journal of the JIST vol. 45 No. 522 (2004-7) p. p. 545-549 describes a technique for producing a carbide die for precision products having an internal cooling path by powder compaction lamination.

JP-A-9-327760 Japanese Unexamined Patent Publication No. 2000-94111 Journal of the JIST vol. 45 No. 522 (2004-7) p. p. 545-549

  Among the above-described conventional techniques, in the technique shown in FIGS. 1 and 2, when the number of cooling portions of the molding die is increased, and connection of a large number of water supply pipes 4 and drainage pipes 5 is necessary, There is a risk of erroneous connection or damage to the water supply pipe 4 or the drainage pipe 5. Depending on the incorrect connection, the quality of the molded product cannot be ensured without performing predetermined cooling, and this damage is caused by leakage of cooling water. Leads to. In the technique described in Japanese Patent Application Laid-Open No. 9-327760, the installation plate 2, the pipe presser plate 4, the water supply manifold 5, the water supply distribution hose 8, the drainage manifold 6, the drainage accumulation hose 10, and the like are combined with each other. Due to the configuration that forms the cooling water supply / discharge section, there is a risk of erroneous connection or damage to the water supply / distribution hose 8 or the drainage accumulation hose 10, leakage of cooling water due to the damage, etc. during maintenance. In addition, it takes time to align the connecting portion between the cooling pipe 1 and the water supply / distribution hose 8 or the drainage accumulation hose 10. In the technique described in Japanese Patent Laid-Open No. 2000-94111, the inlet ports 22a and 32a that are directly connected to the cooling water supply pipe 11, the outlet ports 22b and 32b that are directly connected to the cooling water discharge pipe 12, and the cooling passage 21 are provided. , 31 are directly drilled in the molds 2 and 3, so that the cooling performance may be lowered. In addition, since the cooling water supply port and the discharge port are provided for each cooling passage, when the number of cooling passages is increased in order to improve the cooling performance, the number of supply ports and discharge ports also increases. It is expected that the cooling structure of the mold itself will become complicated, leading to an increase in the manufacturing cost of the mold. Also, Journal of the JIST vol. 45 No. 522 (2004-7) p. p. The technique described in 545-549 also forms a cooling path for allowing a cooling medium to flow directly into the mold. When this is used for precision molding, the technique described in the above Japanese Patent Laid-Open No. 2000-94111 is used. The same thing as the case is concerned.

The problem of the present invention is that, in view of the state of the prior art described above, in the molding die cooling technology, there is no erroneous connection or damage of the water supply pipe or drainage pipe, and the cooling part of the die itself has a simple structure. It is to be able to ensure a predetermined quality of the molded product under the above conditions.
An object of the present invention is to solve such problems and to provide a cooling technique for a mold that is easy to use.

In order to solve the above-described problems, in the present invention, as a mold cooling manifold that supplies a cooling fluid to a molding die, the cooling fluid is inserted into a plurality of cooling holes formed in the molding die. A plurality of introduction paths for supplying the cooling fluid to each of a plurality of cooling pipe units forming the reciprocating flow path, and a plurality of cooling fluids used for cooling the molding die from the reciprocating flow path. A plurality of lead-in paths and fluid inflow end portions of the plurality of lead-in paths coupled to a common fluid supply path and fluid outlet-side ends of the plurality of lead-out paths coupled to the plurality of lead-out paths. A fluid discharge path common to the paths is formed in the rigid body, and the cooling fluid supplied from the supply port is distributed from the fluid supply path to the plurality of introduction paths, and the distributed cooling fluid is Each of the above cooling pipe units The cooling fluid used for cooling is recovered from the reciprocating flow path through the plurality of outlet paths, and the recovered cooling fluid is discharged from the discharge port via the fluid discharge path. The configuration.
Specifically, the present invention is a mold cooling manifold having the above-described basic configuration, and a molding mold apparatus using the mold cooling manifold.

  According to the present invention, in the cooling technology of the molding die, it becomes easy to connect and remove the flow path between the cooling pipe unit inserted into the molding die and the supply port and the discharge port of the cooling fluid. It is possible to improve work efficiency during maintenance. In addition, the reliability of the apparatus can be improved, and the predetermined cooling of the molding die can be surely performed without erroneous connection or leakage of cooling fluid, so that the quality of the molded product is ensured.

Embodiments of the present invention will be described below with reference to the drawings.
3 and 4 are explanatory diagrams of the first embodiment of the present invention. FIG. 3 is an external view of a mold cooling manifold as a first embodiment of the present invention, and FIG. 4 is a cross-sectional view of the mold cooling manifold of FIG. In any of the figures, the mold cooling manifold shows a state when combined with a molding mold and a cooling pipe unit inserted into the molding mold.

  In FIG. 3, 1 is a nesting part of the molding die, 2 is a main part of the molding die, 15 is a metal rigid body, and the nesting part 1 and the main part 2 of the molding die. The mold cooling manifolds 20a and 20b for cooling the metal are inserted into the cooling holes formed in the main mold part 2 and the insert part 1, respectively, and have reciprocal flow paths for passing the cooling fluid. The reciprocating cooling pipes 10a and 10b serving as cooling pipe units to be formed respectively have an inner cylinder (reference numeral 11 in FIG. 4) and an outer cylinder (reference numeral 12 in FIG. 4) constituting the reciprocating cooling pipe 20 at predetermined positions. The reciprocating cooling for fixing the reciprocating cooling pipes 20a and 20b in the cooling holes (reference numeral 50 in FIG. 4) drilled in the insert part 1 and the main mold part 2 of the molding die. The pipe joints 18a and 18b are respectively rigid of the mold cooling manifold 15. The introduction passages 19a and 19b are formed in the reciprocating cooling pipes 20a and 20b and supply the cooling fluid to the forward passage portion of the longitudinal reciprocating passage formed in the rigid body of the mold cooling manifold 15. A lead-out path that is formed in a pair with each of the introduction paths 18a and 18b, and that recovers the cooling fluid used for cooling from the return path portion of the longitudinal reciprocating flow path formed by the reciprocating cooling pipes 20a and 20b. 22 is formed in the rigid body of the mold cooling manifold 15, and the fluid supply path is connected to the fluid inflow side ends of the introduction paths 18 a and 18 b, and 23 is formed in the rigid body of the mold cooling manifold 15. The fluid discharge path to which the fluid outflow side ends of the outlet paths 19a and 19b are coupled, 8 is a supply port for supplying the cooling fluid to the fluid supply path 22, and 9 is the cooling fluid for the fluid discharge path 23. To discharge from The outlet 21 is arranged on the surface of the mold cooling manifold 15 and is a plate-like member for fixing the reciprocating cooling pipe joints 10a and 10b. 35a and 35b are through-holes provided in the plate-like member 21, and 40a and 40b are These are bolts that pass through the through holes 35a and 35b and fix the end face portions of the reciprocating cooling pipe joints 10a and 10b to the plate-like member 21 side. For example, a molding material such as aluminum is melted in a mold space (not shown) formed by a pair of nesting portions arranged in the molding die, for example, a pair of main mold portions. Filled in. In the case of a molding die comprising a paired main mold part and a paired nest part, the cooling system comprising the mold cooling manifold 15, reciprocating cooling pipe joint, reciprocating cooling pipe, etc. is one main mold. You may provide only with respect to a part and a nesting part, and you may provide with respect to this one main type | mold part and nesting part, and the other main type | mold part and nesting part.

  The introduction passages 18a and 18b, the lead-out passages 19a and 19b, the fluid supply passage 22, the fluid discharge passage 23, the portion where the reciprocating cooling pipe joints 10a and 10b are inserted, and the portion where the reciprocating cooling tubes 20a and 20b are inserted are all. The space for forming the flow path and the space for inserting the member are directly formed in the rigid body of the manifold 15 for cooling the mold by a technique such as additive manufacturing including powder compaction. The fluid supply path 22 is formed as a flow path space common to the introduction paths 18a and 18b, and the fluid discharge path 23 is formed as a flow path space common to the lead-out paths 19a and 19b. In the first embodiment, on the rigid body of the mold cooling manifold 15, the portions where the introduction paths 18a and 18b and the lead-out paths 19a and 19b are formed are the first part, the fluid supply path 22 and the fluid discharge path 23. Let the part where is formed be the second part. The first part and the second part may be in one rigid body or may be in separate rigid bodies. Further, the portion where the reciprocating cooling pipe joints 10a and 10b are inserted and the portion where the reciprocating cooling tubes 20a and 20b are inserted are configured as through holes in the rigid body of the mold cooling manifold 15, and the bolt 40a and the plate-like member By removing 21, the reciprocating cooling pipe joint 10 a and the reciprocating cooling pipe 20 a, or the reciprocating cooling pipe joint 10 b and the reciprocating cooling pipe 20 b, even when the mold cooling manifold 15 remains attached to the molding die. Can be removed to the outside. In FIG. 3, two reciprocating cooling pipes 20a and 20b are inserted into the molding die, and two sets of introduction paths 18a and 18b and outlet paths 19a and 19b are inserted into the mold cooling manifold 15. Is formed, and two reciprocating cooling pipe joints 10a and 10b are arranged, but three or more reciprocating cooling pipes, three or more sets of introduction paths, outlet paths, and three or more reciprocating cooling pipe joints are provided. The same applies when provided. For example, in the case of aluminum die casting, for example, dozens of reciprocating cooling pipes, dozens or more of reciprocating cooling pipe joints, and dozens or more of introduction paths and outlet paths are provided.

  FIG. 4 shows a cross section of a portion corresponding to the reciprocating cooling pipe 20a in the configuration of FIG. 4, 11 is an inner cylinder constituting a reciprocating cooling pipe 20a as a cooling pipe unit, 12 is an outer cylinder similarly constituting the reciprocating cooling pipe 20a, and 50 is a nesting part 1 and a main mold of a molding die. Cooling holes 30a, 30b, 30c, and 30d, which are drilled in the portion 2 and into which the reciprocating cooling pipe 20a is inserted, respectively, are sealing members such as O-rings, and 41a is the reciprocating cooling pipe joint 10a. A bolt for fixing the cylinder 11. The inner cylinder 11 and the outer cylinder 12 are concentric with each other, the inner cylinder 11 forms the forward path portion of the reciprocating flow path of the reciprocating cooling pipe 20, and the outer cylinder 12 forms the return path portion of the reciprocating flow path.

3 and 4, for example, when cooling water having a predetermined temperature as a cooling fluid is supplied from the supply port 8 to the fluid supply path 22 in the rigid body of the mold cooling manifold 15, the cooling water is cooled. In the rigid body, the water is distributed from the fluid supply path 22 to the introduction paths 18a and 18b and flows in. The cooling water that has flowed into the introduction path 18a flows through the introduction path 18a, reaches the reciprocating cooling pipe joint 10a, and flows into the inner cylinder 11 of the reciprocating cooling pipe 20a through a predetermined gap of the reciprocating cooling pipe joint 10a. The cooling water that has flowed into the inner cylinder 11 absorbs heat from the main mold part 2 and the nest part 1 of the molding die while flowing through the inner cylinder 11, and cools the molding mold. To do. The cooling water whose temperature has risen flows into the cooling hole 50 from the tip of the inner cylinder 11, and then in the outer cylinder 12 of the reciprocating cooling pipe 20 a, that is, between the outer periphery of the inner cylinder 11 and the inner periphery of the outer cylinder 12. It flows into the space. The cooling water that has flowed into the outer cylinder 12 flows through the outer cylinder 12 to reach the reciprocating cooling pipe joint 10a, and is led out from the predetermined clearance of the reciprocating cooling pipe joint 10a into the rigid body of the mold cooling manifold 15. It flows into the channel 19a and is collected. The cooling water collected in the outlet passage 19a further flows into the fluid discharge passage 23. The same applies to the cooling water that is distributed from the fluid supply path 22 to the introduction path 18b and flows in the introduction path 18b, reaches the reciprocating cooling pipe joint 10b, and reciprocates from a predetermined gap in the reciprocating cooling pipe joint 10b. The molding die is cooled while flowing into the inner cylinder of the cooling pipe 20b and flowing through the inner cylinder. The cooling water whose temperature has risen flows into the cooling hole from the tip of the inner cylinder, then flows through the outer cylinder of the reciprocating cooling pipe 20b, reaches the reciprocating cooling pipe joint 10b, and from a predetermined gap of the reciprocating cooling pipe joint 10b, It flows into the outlet path 19b in the rigid body of the mold cooling manifold 15 and is collected. The cooling water recovered in the outlet path 19b further flows into the fluid discharge path 23. The cooling water flowing into the fluid discharge path 23 is discharged from the discharge port 9 to the outside. The same applies to a configuration in which three or more reciprocating cooling pipes, three or more sets of introduction paths, outlet paths, and three or more reciprocating cooling pipe joints are provided.
The molding die apparatus is configured to include the die cooling manifold 15 having the above-described configuration, a molding die, and a reciprocating cooling pipe as a cooling pipe unit.

  According to the first embodiment, connection and removal of the flow path between the reciprocating cooling pipe inserted into the molding die and the supply port 8 and the discharge port 9 for the cooling fluid are facilitated for maintenance. It is possible to improve the work efficiency in such as. Further, even when the mold cooling manifold 15 is still mounted on the molding mold, the reciprocating cooling pipe joint and the reciprocating cooling pipe can be removed to the outside, and the work efficiency can be further improved. is there. Further, since the cooling fluid flow path is configured directly in the rigid body of the mold cooling manifold 15 and is not exposed to the outside, there is no erroneous connection on the flow path piping. The leakage of the cooling fluid due to the damage of the mold can be avoided, and the reliability of the mold cooling manifold 15 can be improved. The molding die can also have a simple structure, and a molded product of a predetermined quality can be manufactured under the simple configuration.

FIG. 5 is a diagram showing a second embodiment of the present invention. In the second embodiment, in addition to the basic configuration of the first embodiment, a flow rate control means for controlling the flow rate of the cooling fluid at the inlet of the introduction path in the rigid body of the mold cooling manifold 15 is provided. It is.
In FIG. 5, 10 is a reciprocating cooling pipe joint, and 18 is a reciprocating cooling pipe (18) formed in the rigid body of the mold cooling manifold 15 and inserted into the insert part 1 and main part 2 of the molding die. An introduction path 19 for supplying a cooling fluid to the forward path portion of the reciprocating flow path (not shown) is formed in the rigid body of the mold cooling manifold 15 in a pair with the introduction path 18. A lead-out path 16 for collecting the cooling fluid from the return path portion of the reciprocating flow path to be formed, 16 is a flow rate adjusting valve as a flow rate control means for controlling the inflow amount of the cooling fluid at the inlet of the introduction path 18. Also in the second embodiment, a plurality of introduction paths 18 and lead-out paths 19 are provided in the rigid body of the mold cooling manifold 15, and among these, the plurality of introduction paths 18 are shared by the flow rate control valve 16. The amount of cooling fluid flowing in from one fluid supply path 22 is controlled and distributed. Also in the second embodiment, on the rigid body of the mold cooling manifold 15, a portion where the introduction path 18 and the lead-out path 19 are formed is a first portion, a fluid supply path 22 and a fluid discharge path 23 are formed. This portion is the second portion. The flow rate control valves 16 control the inflow amounts of the cooling fluid into the plurality of introduction paths 18 by turning on and off the inlets of the plurality of introduction paths 18 and changing the opening degree of the inlets independently of each other. To do. Other configurations are the same as those in the first embodiment. In FIG. 5, the flow rate adjustment valve 16 is configured to change the opening degree of the inlet of the introduction path 18 according to the moving displacement amount of the screw portion, but other configurations may be used.
The molding die apparatus is configured to include the die cooling manifold 15 having the above-described configuration, a molding die, and a reciprocating cooling pipe as a cooling pipe unit.

  Also in the second embodiment, as in the first embodiment, the flow path between the reciprocating cooling pipe inserted into the molding die and the supply port 8 and the discharge port 9 for the cooling fluid. Can be easily connected and detached, and work efficiency during maintenance can be improved. Further, since the flow path of the cooling fluid is configured directly in the rigid body of the mold cooling manifold 15 and is not exposed to the outside, there is no erroneous connection on the flow path piping, Leakage of the cooling fluid due to damage can be avoided, and the reliability of the mold cooling manifold 15 can be improved. The molding die can also have a simple structure, and a molded product of a predetermined quality can be manufactured under the simple configuration. Furthermore, in the second embodiment, the flow rate adjusting valve 16 can change the flow rate of the cooling fluid flowing into the molding die and the distribution of the flow rate. Capability can be changed, and precise temperature control of the mold for molding becomes possible. As a result, it is possible to improve the accuracy of the molded product.

  In the first and second embodiments, the mold cooling manifold 15 includes a first portion in which a plurality of introduction paths and outlet paths are formed, one common fluid supply path, and one common fluid discharge. Although the case where one (one system) cooling system is formed by the second part formed with the path is illustrated, the first part of the above configuration and the second part of the above configuration are also included. A plurality of cooling systems may be provided in the rigid body of the mold cooling manifold 15, and a plurality of (a plurality of systems) cooling systems may be formed by the first portion and the second portion. A plurality of reciprocating cooling pipes are also provided in a plurality of groups corresponding to the plurality of first parts and second parts. In such a configuration, cooling using a cooling fluid having a different temperature in each cooling system, cooling using different types of cooling fluids such as water and oil in each cooling system, and cooling using different pressures. Cooling using a working fluid is possible, and cooling with a more finely controlled temperature is possible for a molding die.

  In the first and second embodiments, the mold cooling manifold 15 includes a plurality of introduction paths and a plurality of lead-out paths corresponding to a plurality of reciprocating cooling pipes. Further, the die cooling manifold is configured to be connected to the fluid discharge path, and the flow path switching unit is connected to the introduction path corresponding to the forward path part of the reciprocating flow path of the other reciprocating cooling pipe. By switching the flow path switching unit, the cooling fluid from the return path part of the reciprocating flow path of a certain reciprocating cooling pipe does not go from the outlet path to the fluid discharge path. In addition, it may be configured to be supplied to the forward path side of another reciprocating cooling pipe. In the case of this configuration, the cooling fluid supplied from the fluid supply path to a certain introduction path flows into the forward path portion of a certain reciprocating cooling pipe, and the reciprocating cooling pipe is cooled while cooling the molding die. It flows into the corresponding lead-out path through the return path section and flows into the introduction path corresponding to the forward path section of the other reciprocating cooling pipe through the flow path switching section. The cooling fluid further flows from the introduction path into the forward path portion of the other reciprocating cooling pipe and flows into the corresponding outlet path through the return path portion of the other reciprocating cooling pipe while cooling the molding die. Then, it passes through the flow path switching section and flows into the introduction path corresponding to the forward path section of another reciprocating cooling pipe. After repeating this, the cooling fluid that has flowed into the corresponding lead-out path through the return path portion of the last reciprocating cooling pipe goes from the lead-out path to the fluid discharge path and is discharged to the outside through the discharge port. According to such a configuration, in addition to the operations and effects in the first embodiment, it is possible to supply cooling fluids having different temperatures to the plurality of reciprocating cooling pipes, and for each part of the molding die. In addition, the degree of cooling by the cooling fluid can be changed. That is, the reciprocating cooling pipe at the part of the molding die that requires a high degree of cooling is supplied with a cooling fluid that does not yet rise in temperature, and the reciprocating cooling pipe at the part that requires a lower degree of cooling is supplied with temperature. It is possible to supply the cooling fluid in which the rise has occurred and perform appropriate cooling at each part. Also in this case, a molding die apparatus is configured by including the mold cooling manifold having the above configuration, a molding die, and a reciprocating cooling pipe as a cooling pipe unit.

  In the first and second embodiments, the mold cooling manifold 15 has a plurality of introduction paths and a plurality of outlet paths corresponding to each of the plurality of reciprocating cooling pipes in the first portion. In addition, the mold cooling manifold has, in addition to the first portion, a plurality of reciprocating cooling pipes, one common introduction path and outlet path, and a connection path connecting the plurality of reciprocating cooling pipes in series. The cooling fluid that has flowed into one reciprocating cooling pipe from the one common introduction path passes through the reciprocating flow paths in the plurality of reciprocating cooling pipes connected by the connection path, and After the flow in the order of the part, the forward path part,..., The return path part, it may be collected in the common lead-out path and further flowed into the fluid discharge path of the second part. In this case, the connection path is also formed directly as a flow path space in the rigid body of the first portion of the mold cooling manifold, like the introduction path and the lead-out path. In the mold cooling manifold having such a configuration, in addition to the operation and effect of the first embodiment, a cooling fluid having different temperatures can be supplied to a plurality of reciprocating cooling pipes. The degree of cooling by the cooling fluid can be changed for each part of the mold. That is, the reciprocating cooling pipe at the part of the molding die that requires a high degree of cooling is supplied with a cooling fluid that does not yet rise in temperature, and the reciprocating cooling pipe at the part that requires a lower degree of cooling is supplied with temperature. It is possible to supply the cooling fluid in which the rise has occurred and perform appropriate cooling at each part. Further, since the number of the introduction passages and the outlet passages can be one per a plurality of reciprocating cooling pipes, the piping configuration in the manifold is simplified. The molding die apparatus is configured to include the mold cooling manifold, the molding mold, and the reciprocating cooling pipe as the cooling pipe unit.

  Further, as a mold cooling manifold, a first part in which the common introduction path, the common lead-out path and the connection path are formed, and a second part in which a fluid supply path and a fluid discharge path are formed A cooling system comprising a combination of the above and the cooling system may be provided in a rigid body with a plurality of systems. In this configuration, in addition to the actions and effects described above, a cooling fluid having a different temperature is used in each cooling system. Cooling, cooling using different types of cooling fluids, such as water and oil, and cooling using cooling fluids of different pressures are possible. Temperature control is possible. Also in this case, a molding die apparatus is configured by including the mold cooling manifold having the above configuration, a molding die, and a reciprocating cooling pipe as a cooling pipe unit.

  Further, in the mold cooling manifold, a plurality of the first portions in which the connection paths are formed in a rigid body are provided for each second portion, and one fluid supply of the second portion is provided. A plurality of the introduction paths are connected (coupled) to the path, and a plurality of the outlet paths are connected (coupled) to one fluid discharge path of the second portion, A plurality of reciprocating cooling pipes connected in series may be connected in parallel in a plurality of groups between one fluid supply path and the one fluid discharge path. In the mold cooling manifold having such a configuration, the cooling capacity can be improved under a simple configuration. Also with the mold cooling manifold having such a configuration, a molding mold apparatus is configured by combining a molding mold and a reciprocating cooling pipe as a cooling pipe unit.

Furthermore, the mold cooling manifold is distributed from the fluid supply path 22 to the introduction paths 18a and 18b to the first part or the second part of the mold cooling manifold 15 shown in FIGS. At least one of the flow rate of the cooling fluid flowing in the direction, the flow rate of the cooling fluid flowing from the reciprocating cooling pipes 20a and 20b to the lead-out path introduction passages 19a and 19b, and the flow rate of the cooling fluid flowing in the fluid discharge path 23 Either the flow rate detection means for detecting the temperature or the temperature detection means for detecting the temperature of the cooling fluid flowing distributed from the fluid supply path 22 to the introduction paths 18a and 18b or the temperature of the cooling fluid flowing through the outlet paths 19a and 19b. One or both of the detection means may be provided. By providing these flow rate detection means and temperature detection means, flow rate information and temperature information of the cooling fluid can be obtained from the mold cooling manifold, and cooling control of the molding die based on this information and monitoring of necessity of maintenance, etc. Is possible. The molding die apparatus is configured to include the mold cooling manifold, the molding mold, and the reciprocating cooling pipe as the cooling pipe unit.
The mold cooling manifold or molding mold apparatus of the present invention can mold metals and resins.

It is a figure which shows the external appearance of the piping connection structure as a prior art. It is a figure which shows the cross-sectional structure of the manifold part in the structure of FIG. 1 is an external view of a mold cooling manifold as a first embodiment of the present invention. FIG. 4 is a cross-sectional view of the mold cooling manifold of FIG. 3. It is a figure which shows the 2nd Example of this invention.

Explanation of symbols

1 ... nested part,
2 ... Main mold part,
8 ... Supply port,
9 ... Discharge port,
10, 10a, 10b ... reciprocating cooling pipe joint,
11 ... Inner cylinder,
12 ... outer cylinder,
15 ... Manifold manifold cooling,
16 ... Flow control valve,
18, 18a, 18b ... introduction path,
19, 19a, 19b ... lead-out path,
20a, 20b ... reciprocating cooling pipe,
21 ... a plate-shaped member,
22: Fluid supply path,
23: Fluid discharge path,
30a, 30b, 30c, 30d ... sealing member,
35a, 35b ... through holes,
40a, 40b, 41a ... bolts,
50: Cooling hole.

Claims (10)

A mold cooling manifold that cools a molding mold with a cooling fluid,
In the rigid body,
For each of a plurality of cooling pipe units that are inserted into a plurality of cooling holes formed in the molding die and form a plurality of reciprocating flow paths for the cooling fluid, the cooling is provided in the forward path portion of the reciprocating flow path. A first portion formed with a plurality of introduction paths for supplying a working fluid and a plurality of outlet paths for collecting the cooling fluid used for cooling from the return path portion of the reciprocating flow path;
Fluid inflow side ends of the plurality of introduction paths are combined and a fluid supply path common to the plurality of introduction paths, and fluid outflow side ends of the plurality of outlet paths are combined and fluid in common to the plurality of outlet paths A second portion formed with a discharge path;
The cooling fluid supplied from the supply port is distributed from the fluid supply path of the second part to the plurality of introduction paths of the first part, and the distributed cooling fluid is respectively corresponded And supplying the cooling fluid used for cooling from the return path of the reciprocating flow path of the cooling pipe unit to the plurality of the first portions. A mold cooling manifold, wherein the cooling fluid is recovered by a passage, and the recovered cooling fluid is discharged from a discharge port via the fluid discharge passage of the second portion.   In the first portion, a lead-out path corresponding to the first cooling pipe unit among the plurality of cooling pipe units is coupled to an introduction path corresponding to the second cooling pipe unit via a flow path switching unit. 2. The mold cooling manifold according to claim 1, wherein the cooling fluid from the first cooling pipe unit can be supplied to the second cooling pipe unit by switching the flow path.   The introduction path and the lead-out path are coupled to the reciprocating flow path of each cooling pipe unit via a joint, and the rigid body includes a through hole into which the cooling pipe unit and the joint are detachably inserted. The mold cooling manifold according to claim 1.   2. The gold according to claim 1, wherein the second part includes a flow rate control unit that controls a flow rate of the cooling fluid distributed from the fluid supply path to the introduction path of the first part. Manifold for mold cooling.   The first part or the second part is a flow rate of the cooling fluid that is distributed and flows from the fluid supply path to the introduction path, and the cooling fluid that is recovered and flows from the cooling pipe unit side to the outlet path. A flow rate detecting means for detecting at least one of a flow rate and a flow rate of the cooling fluid flowing in the fluid discharge path, or a temperature of the cooling fluid flowing from the fluid supply path to the introduction path or the lead-out path 2. The mold cooling manifold according to claim 1, wherein either of the temperature detection means for detecting the temperature of the cooling fluid flowing through the first or both of the detection means is provided. 3. A mold cooling manifold that cools a molding mold with a cooling fluid,
An introduction path for supplying the cooling fluid to a plurality of cooling pipe units inserted into a plurality of cooling holes formed in the molding die and forming a plurality of reciprocating flow paths of the cooling fluid; and the cooling A first path formed in a rigid body with a connection path for connecting the pipe units in series and a lead-out path for recovering the cooling fluid used for cooling the molding die from the cooling pipe unit;
A second portion in which a fluid supply path to which the fluid inflow side end of the introduction path is coupled and a fluid discharge path to which the fluid outflow side end of the outlet path is coupled are formed in a rigid body;
The cooling fluid supplied from the supply port is transferred from the fluid supply path of the second part to the plurality of cooling pipe units connected in series via the introduction path of the first part. The cooling fluid used for cooling is recovered from the plurality of cooling pipe units through the lead-out path of the first portion, and the recovered cooling fluid is discharged from the fluid of the second portion. A mold cooling manifold characterized by being configured to be discharged from a discharge port via a passage.   A plurality of the first part and the second part are provided in the rigid body, respectively, and a plurality of cooling systems by the first part and the second part are formed in the rigid body. 2. A mold cooling manifold according to 1.   A plurality of the first parts are provided for each second part, a plurality of the introduction paths are connected to one fluid supply path, and a plurality of the lead-out lines are connected to one fluid discharge path. The mold cooling manifold according to claim 6, wherein the paths are connected to each other.   The mold cooling manifold according to claim 6, wherein a plurality of cooling systems by a combination of the first part and the second part are formed in the rigid body. A mold cooling manifold according to any one of claims 1 to 9,
A plurality of cooling pipe units coupled to the mold cooling manifold to form a plurality of reciprocating flow paths for cooling fluid;
A plurality of cooling holes are drilled, the cooling pipe units are inserted into the cooling holes, and the molding material cooled and melted by the cooling fluid flowing through the plurality of reciprocating flow paths of the cooling pipe unit is formed. A mold for molding into a predetermined shape and size;
A mold apparatus for molding, comprising:

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