JP2006190858A - Substrate treatment apparatus and substrate treatment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate treatment apparatus and a substrate treatment method for treating a substrate capable of improving measurement precision by a simple structure and method. <P>SOLUTION: The substrate treatment apparatus is provided with a holding jig having a contact which can be brought into contact with a liquid drop adhered to the surface of the substrate from the upper side; a moving mechanism to move the holding jig relatively on the surface of the substrate; and a drop handling mechanism of a vertically long member equipped with a cylinder and a piston, wherein a nozzle having a space with a cross section extending from a lower opening to an upper opening and an outlet communicating with the upper opening are provided. The moving mechanism moves the holding jig wherein the contact part is brought into contact with the drop adhered to the surface of the substrate along the surface of the substrate, and then it moves the holding jig upward at a specified position, and the lower opening of the nozzle with a hollow space emptied is located adjacent to the surface at the specified position and the piston is directly activated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method in which droplets are attached to a substrate and moved to inspect the substrate. In particular, the present invention relates to a method for handling droplets adhering to a substrate, a substrate processing apparatus and a substrate processing method characterized by the mechanism.

Substrate processing apparatuses are used in semiconductor and liquid crystal manufacturing facilities and inspection facilities.
The substrate processing apparatus is an apparatus that performs preprocessing to inspect a substrate. For example, the substrate is a substrate such as a semiconductor wafer or a liquid crystal substrate. The semiconductor wafer is a wafer of silicon, gallium, silicon carbide or the like.
The substrate processing inspection apparatus is required to have a simple and reliable mechanism in order to prevent substrate contamination.
In addition, some substrate processing equipment accurately determines the amount of impurities of ultra-trace metal elements (eg, sodium, potassium, iron, etc.) in thin films such as oxide films and nitride films formed on the surface of semiconductor wafers. It is used for pre-processing to measure. In this substrate processing apparatus, it is important to accurately position the substrate in order to accurately measure the amount of impurities.

The purpose and method for accurately measuring impurities on the surface of a semiconductor wafer will be briefly described.
If impurities are contained in a thin film such as an oxide film or a nitride film formed on the surface of a semiconductor wafer, even if the amount of the impurities is very small, the electrical characteristics of the semiconductor element are greatly affected.
Accordingly, there is a demand for suppressing the contamination of impurities from the wafer surface as much as possible in a semiconductor device manufacturing facility.
For this purpose, the amount of impurities present on the surface of the semiconductor wafer is accurately measured.
Instead of secondary ion mass spectrometry, Auger spectroscopy, or neutron activation analysis, which has recently been used to measure the amount of impurities present on the wafer surface, it has a fluoride solution, and the amount of impurities Measure. For example, the fluoride solution is an aqueous HF (hydrogen fluoride) solution.
After processing the oxide film on the surface of the silicon wafer with an HF (hydrogen fluoride) aqueous solution, the HF (hydrogen fluoride) aqueous solution is collected and impurities in the HF (hydrogen fluoride) aqueous solution are removed. Analysis is done. When the amount of the collected HF (hydrogen fluoride) aqueous solution is small, the impurity concentration increases, and the measurement accuracy is improved.

Various thin film dissolution methods for dissolving an oxide film on a substrate with an aqueous HF (hydrogen fluoride) solution have been proposed. Typical examples include a vapor phase decomposition method (VPD) and a droplet decomposition method (DADD). .
In the vapor phase decomposition method (VPD), the substrate is exposed to vapor of an HF (hydrogen fluoride) aqueous solution to dissolve the oxide layer of the substrate.
In the droplet decomposition method (DADD), an HF (hydrogen fluoride) aqueous solution is dropped on the surface of a substrate, and the oxide film of the substrate is dissolved by the droplets.
Thereafter, a droplet of HF (hydrogen fluoride) aqueous solution or HF / H ₂ O ₂ mixed water is dropped on the surface of the substrate, and the droplet is moved while adhering to the surface of the substrate. Impurities in the oxide film are collected in the droplets. The amount of impurities on the substrate surface is inspected by measuring the amount of impurities in the droplet.

A holding jig is used to move the droplet on the surface of the substrate. The holding jig has a contact portion that comes into contact with droplets attached to the surface of the substrate from above. When the holding jig is moved along the surface of the substrate, the droplets are pulled by the surface tension generated at the contact portion of the holding jig and move on the surface of the substrate. When the holding jig is moved so as to make a stroke in a predetermined region assumed on the surface of the substrate, the solution in the predetermined region can be collected.
After collecting the solution, the holding jig is moved horizontally to collect the solution collected in the container placed beside the substrate.
By the way, since the solution is held by being pulled by the holding jig with a weak surface tension, when the holding jig is moved from the edge of the substrate to the position of the container, the solution is separated from the holding jig. May fall off.
Also, if the holding jig is lifted on the surface of the substrate, the dissolved solution will remain on the surface of the substrate. Therefore, even if the region to be processed on the substrate surface does not include the edge of the substrate, remove the holding jig from that region. It was necessary to move to the edge of the substrate, and the undissolved solution was also collected.

JP 02-272359 A JP 02-028533 JP 08-233709 A Japanese Patent Laid-Open No. 02-229428

  In view of the above-described problems, there has been a demand for a substrate processing apparatus and a substrate processing method that can accurately measure impurities locally on the surface of a substrate and can prevent the contamination of the substrate and improve the measurement accuracy.

  The present invention has been devised in view of the above-described problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of further improving measurement accuracy with a simple structure and method.

  In order to achieve the above object, a substrate processing apparatus for moving a droplet by attaching a droplet to the substrate in order to inspect the substrate according to the present invention has a contact portion that can contact the droplet attached to the surface of the substrate from above. Holding jig, moving mechanism capable of relatively moving the holding jig on the surface of the substrate, and a member elongated in the vertical direction from the lower opening located at the lower part to the upper opening located at the upper part A nozzle provided with a hollow space having a cross-section that expands toward the top, a cylinder having a discharge port communicating with the upper opening, and a sealed space filled with gas that communicates with the discharge port and is formed inside the cylinder. A droplet handling mechanism having a movable piston, and the moving mechanism moves the holding jig in contact with the droplet adhering to the surface of the substrate from the upper side along the surface of the substrate. Later, the moving mechanism After the holding jig is moved upward at a predetermined position, the lower opening of the nozzle that has emptied the hollow space is positioned in the vicinity of the surface of the predetermined position so that the sealed space has a predetermined volume. The piston was moved directly so as to expand only a certain first volume.

  According to the configuration of the present invention, the contact portion of the holding jig can come into contact with the droplets attached to the surface of the substrate from above, and the moving mechanism can relatively move the holding jig on the surface of the substrate. In the droplet handling mechanism, the nozzle is a member that is long in the vertical direction, and is provided with a hollow space having a cross section that extends from the lower opening located at the lower part toward the upper opening located at the upper part, and the cylinder is provided with the upper opening. A liquid droplet that is attached to the surface of the substrate and has a discharge port that communicates with the piston, and a piston that is connected to the discharge port and forms a sealed space filled with gas in the cylinder. The holding jig with the contact portion being in contact with the upper side is moved along the surface of the substrate, so that the droplet is pulled by the holding jig while being in contact with the surface of the substrate, and the surface of the substrate is moved. Will hold the holding jig in place The liquid droplets are moved away from the holding jig and left on the surface of the substrate, and the lower opening of the nozzle that has emptied the hollow space is positioned in the vicinity of the surface of the predetermined position to thereby close the sealed space. Since the piston is linearly moved so as to expand the first volume, which is a predetermined volume, the droplets are sucked into the hollow space of the nozzle, and the handling of the droplets becomes easy.

Furthermore, a substrate processing apparatus according to an embodiment of the present invention includes a container capable of storing droplets, and the lower opening of the nozzle in which the droplets have entered the hollow space is positioned above the mouth of the container. The piston is directly moved so that the sealed space is reduced by a second volume which is a predetermined volume.
According to the configuration of the above embodiment, the piston is arranged such that the lower opening of the nozzle in which droplets have entered the hollow space is positioned above the mouth of the container and the sealed space is reduced by a second volume which is a predetermined volume. Is directly moved, so that an amount of liquid droplets corresponding to the second volume can be placed in the container.

Furthermore, in the substrate processing apparatus according to the embodiment of the present invention, the first volume is larger than the volume of the droplet contacting the contact portion of the holding jig.
According to the configuration of the above embodiment, since the first volume is larger than the volume of the droplet contacting the contact portion of the holding jig, the droplet left on the substrate is sucked into the hollow space, and the atmosphere Even when the gas is sucked into the hollow space, it is separated from the liquid droplets while ascending the hollow space having a cross section that expands as the gas goes up.

  Further, in order to achieve the above object, the substrate processing apparatus for moving a droplet by attaching the droplet to the substrate for inspecting the substrate according to the present invention can contact the droplet attached to the surface of the substrate from above. A holding jig having a portion, a moving mechanism capable of relatively moving the holding jig on the surface of the substrate, and an upper member that is a member that is long in the vertical direction and that is located at the upper part from the lower opening located at the lower part. A nozzle having a hollow space having a cross section that extends toward the opening, a cylinder having a discharge port that communicates with the upper opening, and a sealed space filled with gas that communicates with the discharge port inside the cylinder. A holding mechanism in which the moving mechanism is in contact with the liquid droplets attached to the surface of the substrate from above. Along the surface of the board After the movement, the droplet is collected in the container, and then the lower opening of the nozzle containing the liquid in the hollow space is positioned above the mouth of the container containing the collected droplet. The piston is directly moved so that the sealed space is reduced by a third volume which is a predetermined volume.

According to the configuration of the present invention, the contact portion of the holding jig can come into contact with the droplets attached to the surface of the substrate from above, and the moving mechanism can relatively move the holding jig on the surface of the substrate. ,
In the droplet handling mechanism, the nozzle is a member that is long in the vertical direction, and is provided with a hollow space having a cross section that extends from the lower opening located at the lower portion toward the upper opening located at the upper portion. Having a discharge port that communicates, the piston communicates with the discharge port inside the cylinder to form a sealed space filled with gas, can move directly, the container can store liquid droplets, and the moving mechanism Since the holding jig whose contact portion is in contact with the droplet attached to the surface of the substrate from above is moved along the surface of the substrate, the droplet is pulled by the holding jig while being in contact with the surface of the substrate. After the liquid surface is moved, the droplet is collected in the container, and then the lower opening of the nozzle in which the liquid has entered the hollow space is positioned on the mouth of the container in which the collected liquid is contained. The sealed space has a predetermined volume 3 because linearly moving the piston so as to only reduce the volume, the liquid is replenished to the vessel can be increased by an amount corresponding to the liquid in the container to the third volume.

Furthermore, the substrate processing apparatus according to the embodiment of the present invention includes a weight measuring device capable of measuring the weight of the container containing the collected droplets, and the third volume is obtained by subtracting the weight from a constant value. Corresponds to the value.
According to the configuration of the above embodiment, the weight measuring device can measure the weight of the collected droplet, and the third volume corresponds to a value obtained by subtracting the weight from a constant value. The total amount of liquid can be made constant.

Furthermore, the substrate processing apparatus according to an embodiment of the present invention includes a weight scale that the weight measuring device supports the container from below, and a cover that covers the weight scale and the container from above. Installed in a clean space with downflow.
With the configuration of the present invention described above, the substrate processing apparatus is installed in a clean space with a downflow, and a weight scale supports the container from below to measure the weight, and a cover covers the weight scale and the container from above. Therefore, it is possible to reduce the influence of the downflow on the weight measuring device and increase the accuracy of measuring the weight of the container containing the liquid.

Furthermore, the substrate processing apparatus according to an embodiment of the present invention includes a nozzle cleaning mechanism that blows out the cleaning liquid, and the lower opening of the nozzle that has been emptied of the hollow space is immersed in the cleaning liquid that is blown out of the nozzle cleaning mechanism. The piston is reciprocated so that the sealed space is expanded by a fourth volume, which is a predetermined volume, and further reduced.
According to the configuration of the present invention, the piston is reciprocated so that the lower opening of the nozzle with the hollow space emptied is immersed in the cleaning liquid of the nozzle cleaning mechanism to expand and further reduce the sealed space by a fourth volume. Therefore, the hollow space of the nozzle can be cleaned with the cleaning liquid.

Furthermore, in the substrate processing apparatus according to the embodiment of the present invention, the droplet handling mechanism has a linear motion actuator that linearly moves the piston, and the linear motion actuator has a stroke corresponding to the predetermined volume. Just move straight.
With the configuration of the above embodiment, the linear motion actuator moves the piston linearly by a stroke corresponding to the predetermined volume, so that the volume of the sealed container can be changed with high accuracy and the amount of liquid entering and exiting the hollow space can be accurately measured. Adjust well.

  Further, in order to achieve the above object, a substrate processing method in which a droplet is attached to a substrate and moved in order to inspect the substrate according to the present invention can contact the droplet attached to the surface of the substrate from above. A holding jig having a section, a nozzle which is a member elongated in the vertical direction and has a hollow space having a cross section extending from a lower opening located at the lower portion toward an upper opening located at the upper portion, and the upper opening. A liquid droplet handling mechanism comprising: a cylinder having a discharge port that is communicated; and a piston that is directly movable by forming a sealed space filled with gas in the cylinder and communicating with the discharge port; A substrate processing step of moving the holding jig whose contact portion is in contact with liquid droplets adhering to the surface of the substrate from the upper side along the surface of the substrate, and moving the holding jig upward at a predetermined position. Empty the hollow space A liquid droplet suction step in which the piston is linearly moved so that the lower opening of the nozzle is positioned in the vicinity of the surface of the predetermined position of the substrate and the sealed space is expanded by a first volume which is a predetermined volume; The droplet suction step is performed after the substrate processing step.

  According to the configuration of the present invention, the contact portion of the holding jig can come into contact with the droplet attached to the surface of the substrate from above. In the droplet handling mechanism, the nozzle is a member that is long in the vertical direction and is positioned at the lower portion. A hollow space having a cross section that extends from the lower opening to the upper opening located at the upper portion, the cylinder has a discharge port that communicates with the upper opening, and the piston communicates with the discharge port inside the cylinder Since the holding jig, in which the contact portion is brought into contact with the droplet attached to the surface of the substrate from the upper side, is moved along the surface of the substrate. Is pulled by the holding jig while being in contact with the surface of the substrate and moves the surface of the substrate, and the holding jig is moved upward at a predetermined position, so that the liquid droplets are separated from the holding jig and left on the surface of the substrate. The hollow space is emptied Since the lower opening of the slip is positioned in the vicinity of the surface at the predetermined position of the substrate and the piston is moved directly so as to expand the sealed space by a first volume which is a predetermined volume, the liquid droplets of the nozzle When sucked into the hollow space, it becomes easy to handle the droplet.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the preparation step further prepares a container capable of storing droplets, and the lower opening of the nozzle in which the droplets have entered the hollow space is provided at the mouth of the container. And a droplet discharge step of moving the piston directly so as to reduce the sealed space by a second volume which is a predetermined volume.
According to the configuration of the above embodiment, the lower opening of the nozzle in which droplets enter the hollow space is positioned above the mouth of the container so that the sealed space is reduced by a second volume which is a predetermined volume. Since the piston is moved linearly, an amount of droplets corresponding to the second volume can be placed in the container.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the first volume is larger than the volume of the droplet contacting the contact portion of the holding jig.
According to the configuration of the above embodiment, since the first volume is larger than the volume of the droplet contacting the contact portion of the holding jig, the droplet left on the substrate is sucked into the hollow space of the nozzle, and the atmosphere When the gas is sucked in, it is separated from the droplets while ascending the hollow space having a cross section that expands as the gas goes up.

  Further, in order to achieve the above object, a substrate processing method in which a droplet is attached to a substrate and moved in order to inspect the substrate according to the present invention can contact the droplet attached to the surface of the substrate from above. A holding jig having a section, a nozzle which is a member elongated in the vertical direction and has a hollow space having a cross section extending from a lower opening located at the lower portion toward an upper opening located at the upper portion, and the upper opening. A droplet handling mechanism having a cylinder having a discharge port communicated with and a piston capable of linear movement by forming a sealed space filled with gas in the cylinder and communicating with the discharge port, and capable of storing droplets A preparation process for preparing a container, a substrate processing process for relatively moving the holding jig in contact with the droplets attached to the surface of the substrate from above along the surface of the substrate, and the droplets Droplet times to collect in the container And reducing the closed space by a third volume, which is a predetermined volume, by positioning the lower opening of the nozzle containing the liquid in the hollow space above the mouth of the container containing the collected liquid droplets And a solution replenishing step for directly moving the piston.

  According to the configuration of the present invention, the contact portion of the holding jig can come into contact with the droplet attached to the surface of the substrate from above. In the droplet handling mechanism, the nozzle is a member that is long in the vertical direction and is positioned at the lower portion. A hollow space having a cross section that extends from the lower opening to the upper opening located at the upper portion, the cylinder has a discharge port that communicates with the upper opening, and the piston communicates with the discharge port inside the cylinder The holding jig, which forms a sealed space filled with gas and can move linearly, can store liquid droplets, and contacts the liquid droplets adhering to the surface of the substrate from above is provided on the substrate. The liquid droplets are moved relative to each other along the surface of the substrate, so that the liquid droplets are pulled by the holding jig while being in contact with the surface of the substrate, move the surface of the substrate, collect the liquid droplets in the container, and liquid enters the hollow space. Rotate the lower opening of the nozzle. Since the piston is directly moved so as to reduce the sealed space by a third volume, which is a predetermined volume, located above the mouth of the container containing the formed droplet, the liquid is replenished in the container, The liquid in the container can be increased by an amount corresponding to the third volume.

Further, the substrate processing method according to an embodiment of the present invention comprises a weight measuring step for measuring the weight of the container containing the collected droplets, and the third volume subtracts the weight from a constant value. Corresponds to the value.
According to the configuration of the above embodiment, the weight of the container containing the collected droplets is measured, and the third volume corresponds to a value obtained by subtracting the weight from a certain value, so that the total amount of liquid that has entered the container Can be a constant value.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the container is covered with a cover from above in a clean space where the weight measurement step has a downflow.
With the configuration of the above embodiment, since the container is covered with a cover from above in a clean space with downflow, the influence of downflow on measurement is reduced and the measurement accuracy of the weight of the liquid contained in the container is increased. Can do.

Further, in the substrate processing method according to the embodiment of the present invention, the lower opening of the nozzle in which the hollow space is emptied is immersed in a cleaning liquid, and the sealed space is expanded by a fourth volume which is a predetermined volume, and further reduced. And a nozzle cleaning step of reciprocating the piston.
According to the configuration of the above-described embodiment, the piston is reciprocated so that the lower space of the nozzle with the hollow space emptied is immersed in a cleaning liquid to expand and further reduce the sealed space by a fourth volume which is a predetermined volume. Therefore, the hollow space of the nozzle can be cleaned with the cleaning liquid.

Further, in the substrate processing method according to the embodiment of the present invention, the preparation step prepares a linear motion actuator that linearly moves the piston, and the linear motion actuator directly moves the piston by a stroke corresponding to the predetermined volume. Move.
With the configuration of the above embodiment, the linear motion actuator moves the piston linearly by a stroke corresponding to the predetermined volume, so that the volume of the sealed container can be changed with high accuracy and the amount of liquid entering and exiting the hollow space can be accurately measured. Adjust well.

As described above, another substrate processing apparatus and substrate processing method according to the present invention have the following effects depending on the configuration.
It has a holding jig with a contact part that comes into contact with the droplets attached to the surface of the substrate from above, a nozzle with a hollow space with a cross section that extends from the lower opening toward the upper opening, and a sealed space that communicates with the upper opening. Prepare a cylinder / piston and move the holding jig, which contacts the droplet attached to the surface of the substrate, along the surface of the substrate. Since the holding jig is moved upward at a predetermined position, the droplet is left on the surface of the substrate at a predetermined position, and the lower opening is moved to the cylinder at the predetermined position. -Since the sealed space of the piston is expanded, the droplets are sucked into the hollow space of the nozzle, and it becomes easy to handle the droplets.
Further, since the lower opening of the nozzle in which droplets have entered the hollow space is positioned above the mouth of an empty container and the piston is directly moved so as to reduce the sealed space by a second volume, the second An amount of droplet corresponding to the volume can be placed in the container.
In addition, since the first volume is larger than the volume of the droplet held by the holding jig, the droplet left on the substrate is sucked into the hollow space, and the atmospheric gas is sucked into the hollow space, It separates from the droplets while ascending the hollow space with a cross section that expands as the gas goes up.
In addition, a holding jig having a contact portion that comes into contact with droplets attached to the surface of the substrate from above, a nozzle having a hollow space with a cross section extending from the lower opening to the upper opening, and a sealed space communicating with the upper opening are provided. Prepare a cylinder / piston with the holding jig, and move the holding jig with the contact part in contact with the droplet attached to the surface of the substrate along the surface of the substrate. The droplet is collected in the container, and then the lower opening of the nozzle in which the liquid has entered the hollow space is positioned above the mouth of the container to open the sealed space. Since the piston is linearly moved so as to be reduced by two volumes, the liquid is refilled in the container, and the liquid in the container can be increased by an amount corresponding to the second volume.
In addition, the weight of the container containing the collected droplets is measured, and the third volume corresponds to a value obtained by subtracting the weight from a constant value, so that the total amount of liquid in the container is set to a constant value. can do.
In addition, since the substrate processing apparatus is installed in a clean space with downflow, and the cover covers the measuring device and the container from above, the influence of downflow on measurement is reduced, and the weight of the liquid contained in the container is reduced. Measurement accuracy can be increased.
In addition, since the piston is reciprocated so that the lower opening of the nozzle with the hollow space emptied is immersed in a cleaning liquid to expand and further reduce the sealed space by a fourth volume, the hollow space of the nozzle is cleaned with the cleaning liquid. it can.
In addition, since the linear actuator moves the piston by a stroke corresponding to the predetermined volume, the volume of the sealed container can be changed with high accuracy, and the amount of liquid entering and exiting the hollow space can be adjusted with high accuracy.
Therefore, it is possible to provide a substrate processing apparatus and a substrate processing method that can improve measurement accuracy with a simple structure and method.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a conceptual diagram of a droplet handling device according to an embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line AA of the substrate processing apparatus according to the embodiment of the present invention. FIG. 4 is a cross-sectional view taken along the line BB of the substrate processing apparatus according to the embodiment of the present invention. FIG. 5 is a BB cross-sectional view of the substrate processing apparatus according to the embodiment of the present invention. FIG. 6 is a cross-sectional view taken along the line BB of the substrate processing apparatus according to the embodiment of the present invention. FIG. 7 is a cross-sectional view taken along the line C-C of the substrate processing apparatus according to the embodiment of the present invention. FIG. 8 is a DD cross-sectional view of the substrate processing apparatus according to the embodiment of the present invention.
The substrate processing apparatus 1 is an apparatus for attaching and moving droplets P to the substrate T in order to inspect the substrate T, and includes a holding jig 10, a container 20, a moving mechanism 30, a droplet handling mechanism 40, and a nozzle replacement mechanism. 50, a holding jig cleaning mechanism 60, a chemical tank 70, a nozzle cleaning tank 80, and a weight measuring device 100 of the tray unit 90.
For example, the substrate T is a multilayer film substrate.
For example, the first layer is a layer that forms the surface of the substrate T. The second layer is a layer overlapping the first layer. The third layer is a layer overlapping the second layer. The fourth layer is a layer overlapping the third layer.
For example, the first layer is one of SiO ₂ , natural SiO ₂ and Si ₃ N ₄ , and the second layer is a silicon film (poly-Si, a-Si, SOI-Si, SIMOX-Si, etc. is one), the third layer, a interlayer film (SiО _{2, Si} 3 _N one of such _4), the fourth layer is a substrate (Si single crystals, one of such as glass).

FIG. 1 shows the overall arrangement of the substrate processing apparatus.
The substrate processing apparatus is installed in a clean space with a down flow. For example, the substrate processing apparatus 1 is installed in a clean bench where downflow occurs.

The holding jig 10 is a jig having a contact portion that can come into contact with droplets attached to the surface of the substrate from above.
3 to 5 show the holding jig 10 attracted to the tip of a swing arm mechanism 32 described later.
The holding jig 10 includes a flange portion 11, a cylindrical portion 12, a through hole 13, and a contact portion 14.
The flange portion 11 is an upper structure of the holding jig 10. The upper surface of the flange portion 11 is an adsorption surface that is adsorbed to the holding jig adsorption mechanism 33 described later with a negative pressure.
The cylindrical portion 12 is a lower structure of the holding jig 10. The cylindrical portion 12 is a cylindrical member that extends vertically.
The flange portion 11 and the cylindrical portion 12 are cut out from an integral material.
The through hole 13 is a hole that penetrates the holding member 10 in the vertical direction.
The contact portion 14 is a portion that communicates with the through hole 13 and is provided at the lower portion of the cylindrical portion 12. The contact portion 14 is a portion that comes into contact with the droplet P attached to the surface of the substrate T.
For example, the contact portion 14 is an inner wall of a dent recessed upward.
When the contact portion 14 is brought into contact with the droplet P adhering to the surface of the substrate T and the holding jig 10 is moved horizontally along the surface of the substrate T, the surface tension generated on the contact surface 14 pulls the droplet T. . Accordingly, the droplet P moves along the surface of the substrate T while being in contact with the surface of the substrate as the holding jig 10 moves.

The container 20 is a container capable of storing droplets.
For example, the container 20 is a wide-mouthed container. The wide mouth of the container 20 is fitted to the boundary between the flange portion 11 and the cylindrical portion 12 of the holding jig 10. The container 20 is stored in a container storage hole 93 provided in a tray unit 90 described later.

The moving mechanism 30 is a mechanism that can relatively move the holding jig 10 on the surface of the substrate T.
For example, the moving mechanism 30 includes a substrate rotation mechanism 31, a swing arm mechanism 32, a holding jig suction mechanism 33, and a nozzle attachment port fixing mechanism 34.
The substrate rotating mechanism 31 is a mechanism that supports the substrate T from below and rotates it around the vertical axis. The substrate T is supported by the substrate rotating mechanism 31 with the surface facing up, and the center of the outer peripheral arc is the center of rotation. Rotate horizontally.
The swing arm mechanism 32 is a mechanism that rotates a rear end portion of a horizontally extending arm around a vertical axis to swing a front end portion. The holding jig suction mechanism 33 and the nozzle attachment port fixing mechanism 34 are fixed to the tip of the arm.
Further, the swing arm mechanism 32 can be moved up and down by a predetermined distance in the vertical direction.
The holding jig suction mechanism 33 is a device that sucks and fixes the holding jig 10 with a negative pressure, and is fixed to the tip of the swing arm mechanism 32. The suction port 35 of the holding jig suction mechanism 33 communicates with a vacuum pipe provided in the member of the swing arm mechanism 32. The upper surface of the flange portion 11 of the holding jig 10 is attracted to the suction port 35 of the holding jig suction mechanism 33.
The nozzle attachment port fixing mechanism 34 is a mechanism for fixing a nozzle attachment port 42 of a droplet handling mechanism 40 described later, and is fixed to the distal end portion of the swing arm mechanism 32.

The droplet handling mechanism 40 is a mechanism for handling the droplet P attached to the substrate, and includes a nozzle 41, a nozzle attachment port 42, a flexible hose 43, a cylinder 44, a piston 45, and a linear motion actuator 46.
The nozzle 41 is a member that is long in the vertical direction, and is provided with a hollow space S having a cross section that expands from a lower opening located at the lower portion toward an upper opening located at the upper portion.
For example, the nozzle 41 is made of resin.
For example, as the nozzle 41, a micropippet tip having the above shape can be used.
The nozzle attachment port 42 is a member having a fitting portion that fits in the upper opening of the nozzle 41 at the lower end portion and having a through hole extending vertically. The nozzle mounting port 42 is fixed to the nozzle mounting port fixing mechanism 34.
The flexible hose 43 is a hose made of a flexible material that communicates a through hole of the nozzle attachment port 42 and a discharge port 47 of a cylinder 44 described later. Accordingly, the discharge port 47 of the cylinder 44 communicates with the upper opening 49 of the nozzle 41.
The cylinder 44 is a cylindrical member having a discharge port.
The piston 45 is a member capable of linearly moving by forming a sealed space H filled with gas that communicates with the discharge port 47 inside the cylinder 44. When the piston 56 is linearly moved, the sealed space H is expanded or contracted by a predetermined volume.
A micro syringe can be used for the cylinder 56 and the piston 56.
When the piston 56 is pushed into the cylinder 56, the volume of the sealed space H is reduced corresponding to the stroke.
When the piston 56 is pulled out from the cylinder 56, the volume of the sealed space H is expanded corresponding to the stroke.
The linear actuator 46 is an actuator that linearly moves the piston 45.
For example, the linear motion actuator 46 is a linear motion mechanism that is driven by a step motor.

When the linear actuator 46 pushes the piston 45 by a predetermined stroke while the liquid is in the hollow space S of the nozzle 41, the sealed container is reduced by a volume corresponding to the predetermined stroke, and the liquid corresponding to the predetermined volume is obtained. Is discharged from the lower opening of the nozzle 41.
When the linear actuator 46 pulls out the piston 45 by a predetermined stroke while the lower opening of the nozzle 41 of the empty hollow space S is immersed in the liquid, the sealed container is expanded by a volume corresponding to the predetermined stroke, and the predetermined container is expanded. The volume of liquid is sucked from the lower opening of the nozzle 41. When the gas is sucked into the lower opening, the cross section of the hollow space S expands from the lower opening toward the upper opening. Therefore, the gas rises in the liquid filled with the hollow space S, and the gas and the liquid are liquid. Separate at the interface.

The nozzle replacement mechanism 50 is a mechanism for replacing the nozzle 41. A new nozzle 41 can be set in the nozzle replacement mechanism 50 in advance.
With the new nozzle 41 set in the nozzle replacement mechanism 50, the nozzle mounting port 42 of the droplet handling mechanism 40 from which the nozzle 41 has been removed by the moving mechanism 30 is moved to the upper part of the nozzle replacement mechanism 50.
The nozzle mounting port 42 is fitted into the upper opening of the new nozzle 41.

The holding jig cleaning mechanism 60 is a mechanism for automatically cleaning the holding member 10.
The holding jig cleaning mechanism 60 supports the coupling portion between the flange portion 11 and the cylindrical portion 12 of the holding jig 10, and the cleaning liquid ejected from the ejection port cleans the through hole 13 of the holding member 10.
A plurality of holding jig cleaning mechanisms 60 may be provided. In this way, the plurality of holding jigs 10 can be used alternately while being washed.
FIG. 3 shows two types of holding jig cleaning mechanisms 60. In this way, the two holding jigs 10 can be used alternately while being washed.
When the holding member 10 sucked by the holding member suction mechanism 33 is positioned on the holding member cleaning mechanism 60 and the negative pressure of the holding member suction mechanism 33 is eliminated, the holding member 10 is supported by the holding jig cleaning mechanism 60. The
The holding member 10 is cleaned with the cleaning liquid.
For example, the cleaning liquid is pure water, HF aqueous solution, or diluted solution.
The cleaning liquid is blown out from the central ejection port, cleans the holding member 10, and is discharged from the drainage port.

The chemical tank 70 is a tank that can store a solution. There is an opening in the upper part of the dissolution tank through which a nozzle can be inserted.
For example, the solution is an aqueous HF solution, a solution or a diluted solution.

The nozzle cleaning device 80 is a device that stores a cleaning liquid for cleaning the nozzle.
The nozzle cleaning device 80 has an ejection port for ejecting the cleaning liquid and an exhaust port for discharging the cleaning liquid.
For example, the cleaning liquid is pure water, HF aqueous solution, or diluted solution.
The cleaning liquid is blown out from the central nozzle and discharged from the drain.

The tray unit 90 is a unit that receives the container 20 and includes a tray rotating mechanism 91 and a tray 92.
The tray 92 is a disk-shaped member. A plurality of container storage holes 93 are provided at a predetermined pitch along the edge.
The saucer 92 rotates about a vertical axis that passes through the center of the disk.
The tray rotating mechanism 91 is a mechanism that supports and rotates the tray 92 from below.

The weight measuring device 100 is a device that can measure the weight of the container 20 containing the collected droplets P, and includes a weight scale 101 and a cover 102.
The weighing scale 101 is a weighing scale that supports the container from below.
The weigh scale 101 is provided at the lower part of the tray 92 and lifts the container 20 stored in one container storage hole 93 to measure the weight of the container.
The cover 102 is a member that covers the weight scale 101 and the container 10 from above. In this way, the cover 102 blocks the downflow that flows in the clean booth, so the measurement accuracy of the weigh scale 101 is not affected by the downflow.

Next, a substrate processing method according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 9 is a procedure diagram of the substrate processing apparatus according to the embodiment of the present invention.
FIG. 10 is an operation diagram of the droplet handling device according to the embodiment of the present invention.
The substrate processing method includes a substrate installation step S10, a solution suction step S20, a holding jig adsorption step S30, a solution dropping step S40, a substrate processing step S50, a holding jig raising step S60, a holding jig cleaning step S70, and a droplet collecting step. S80, weight measurement step S90, nozzle cleaning step S100, and solution replenishment step S110.
A case where the above-described substrate processing apparatus is used will be described as an example.

(Substrate installation step S10)
The substrate installation step S <b> 10 is a step of installing the substrate T on the moving mechanism 30.
The substrate T, the surface of which is dissolved by a solution by the vapor phase decomposition method (VPD) or the droplet decomposition method (DADD), is placed on the substrate rotation mechanism 31.
The center of the arcuate edge of the substrate is made to coincide with the rotation center of the substrate rotation mechanism 31.

(Solution suction step S20)
The solution suction step S20 is a step in which the piston is linearly moved so that the lower opening 48 of the nozzle 41 with the hollow space S emptied is immersed in the solution and the sealed space H is expanded by a predetermined volume.
The tip of the swing arm mechanism 32 is moved onto the chemical tank 70.
The lower opening 48 of the nozzle 41 is immersed in the chemical stored in the chemical tank 70.
The piston 45 is pulled out by the linear motion actuator 56 so that the sealed space H is expanded by a predetermined volume.
Here, the predetermined volume is a volume of a droplet to be dropped on the surface of the substrate.
The solution is filled in the hollow space S of the nozzle 41.

(Holding jig adsorption process S30)
The holding jig suction step S30 is a process for holding the holding jig 10 on the moving mechanism 30.
The tip of the swing arm mechanism 32 is moved onto the holding jig cleaning mechanism 60.
The cleaned holding jig 10 is sucked to the holding jig suction mechanism 33.

(Solution dropping step S40)
The solution dripping step S40 is a step of dripping the solution onto the surface of the substrate. The lower opening of the nozzle in which the solution enters the hollow space is positioned on the surface of the substrate to reduce the sealed space H by a predetermined volume. Move the piston directly.
The tip of the swing arm mechanism 32 is moved onto the substrate T.
The swing arm mechanism 32 is lowered to a predetermined dimension of the distance between the holding jig 10 and the surface of the substrate.
The piston 45 is pushed in such that the sealed space H is reduced by a predetermined volume by the linear actuator 56.
The chemical solution filled in the hollow space S of the nozzle 41 drops and adheres to the surface of the substrate.
The droplet contacts the contact portion of the holding jig 10.

(Substrate processing step S50)
The substrate processing step S50 is a step of moving the holding jig 10 whose contact portion is in contact with droplets attached to the surface of the substrate T from above along the surface of the substrate T.
The tip of the swing arm mechanism 32 is swung, and the substrate is rotated by the substrate rotating mechanism 31. When the rotation of the substrate T and the swing of the swing arm mechanism are synchronized, the droplet P that contacts the contact portion 14 of the holding jig 10 moves on the surface of the substrate T along a predetermined locus.
When the predetermined trajectory is a trajectory in which a predetermined stroke is written in the predetermined area, the droplet can be moved within the predetermined area on the surface of the substrate.
The solution adhering to the surface of the substrate can be taken into the droplet.

(Holding jig raising step S60)
The holding jig raising step is a step of moving the holding jig upward at a predetermined position.
The movement of the swing arm mechanism 32 and the substrate rotation mechanism 31 is stopped, and the holding jig 10 is stopped at a predetermined position on the surface of the substrate.
When the tip of the swing arm mechanism is raised, the holding jig is moved upward at a predetermined position.
The holding jig moves upward, the contact between the droplet and the contact portion disappears, and the droplet is left at a predetermined position on the surface of the substrate.

(Holding jig cleaning step S70)
The holding jig cleaning step S <b> 70 is a process for cleaning the holding jig 10.
The tip of the swing arm mechanism 32 is positioned on the holding jig cleaning mechanism 60.
The holding jig 10 is placed on the holding jig cleaning mechanism 60.
When the negative pressure of the holding jig suction mechanism 33 is removed, the holding jig 10 is separated from the holding jig suction mechanism 33.
The holding jig 10 is cleaned by the holding jig cleaning mechanism 60.

(Droplet recovery step S80)
The droplet recovery step S80 is a step of recovering the droplets in the container.
An example of the droplet collection step S80 will be described by separating it into a plurality of steps.
(Droplet suction step S81)
In the droplet suction step S81, the lower opening 48 of the nozzle 41 in which the hollow space S is emptied is positioned in the vicinity of the surface at a predetermined position of the substrate T, and the sealed space H is expanded by a first volume which is a predetermined volume. In this way, the piston is moved directly.
The lower opening 48 of the nozzle 41 is positioned in the vicinity of the surface at a predetermined position of the substrate.
The lower opening 48 of the nozzle 41 is lowered as much as possible so as not to contact the surface of the substrate T. The distance between the lower end of the nozzle and the surface of the substrate is, for example, 0.1 mm.
FIG. 6 shows how a droplet is sucked.
The piston is pulled out so that the sealed space H is expanded by a first volume which is a predetermined volume.
The droplet moves from the surface of the substrate to the hollow space.
FIG. 10 shows the state of the hollow space S of the nozzle 41.
The first volume is larger than the volume of the droplet that has contacted the contact portion of the holding jig 10.
In this way, the droplet enters the hollow space without remaining on the surface of the substrate.
When the gas in the atmosphere enters the hollow space, the gas becomes bubbles A, rises in the droplets filled in the hollow space, and is separated from the droplets.
Since the cross section of the hollow space expands from the lower opening toward the upper opening, there is no possibility that the bubble A becomes a plug and the droplet rises.

(Droplet discharge step S82)
In the droplet discharge step S82, the lower opening 48 of the nozzle 41 in which droplets have entered the hollow space S is positioned above the mouth of the container 20, and the sealed space H is reduced by a second volume which is a predetermined volume. This is a step of moving the piston 45 directly.
The tip of the swing arm mechanism 32 is positioned on the container storage hole 93 of the tray unit 90. The container 20 is stored in the container storage hole 93.
The piston is directly moved so that the sealed space is reduced by a second volume which is a predetermined volume.
The liquid droplets are discharged from the hollow space S of the nozzle 41 and enter the container 20.

(Weight measurement step S90)
The weight measurement step S90 is a step of measuring the weight of the container containing the collected droplets.
The container 20 may be covered with a cover from above in a clean space with downflow.
In this way, since the downflow does not directly hit the container, the measurement accuracy is improved.

(Nozzle cleaning process S100)
The nozzle cleaning step S100 is a step of cleaning the hollow space S of the nozzle 41, and the closed space H is expanded by a predetermined volume by immersing the lower opening 48 of the nozzle 41 in which the hollow space S is emptied in the cleaning liquid. The piston is reciprocated to further reduce.
The tip of the swing arm mechanism 32 is moved onto the nozzle cleaning mechanism 80.
The lower opening of the nozzle 41 is lowered to the nozzle cleaning mechanism 80 and attached to the cleaning liquid.
When the piston is reciprocated so as to expand the sealed space H by a predetermined volume and further reduce it, the cleaning liquid enters and exits the hollow space. Accordingly, the cleaning liquid cleans the hollow space.

(Solution replenishment process S110)
The solution replenishing step S110 is a step of replenishing the solution in the container from which the droplets have been collected. The lower opening of the nozzle filled with the liquid in the hollow space S is filled in the mouth of the container in which the collected droplets are contained. Positioned above, the piston is directly moved so as to reduce the sealed space H by a third volume which is a predetermined volume.
The lower opening 48 of the nozzle 41 is immersed in the solution in the chemical tank 70, and the piston is directly moved so as to expand the sealed space H by a predetermined volume. By doing so, the hollow space S is filled with the solution. Next, the lower opening 48 of the nozzle 41 is positioned above the mouth of the solution 20. When the piston is directly moved so as to reduce the closed space H by the third volume, the third volume of solution enters the container 20.
The third volume may correspond to a value obtained by subtracting the weight from a constant value.
In this way, the total amount of liquid filled in the container becomes constant, and the work in the solution inspection process in the subsequent process becomes easy.

  Thereafter, when the solution replenishment step S100 is repeated from the substrate installation step S10, the solution is filled in the container accommodated in the container accommodation hole 93 of the tray unit 90.

If the substrate processing apparatus and the substrate processing method according to the above-described embodiment are used, the following effects are exhibited.
A cylinder / piston 44 having a nozzle 41 provided with a hollow space S having a cross section extending from the lower opening 48 toward the upper opening 49 and a discharge port 47 communicating with the upper opening 49. , 45 is provided in the substrate processing apparatus, so that the solution can be easily handled.
Since the cross section of the hollow space S of the nozzle 41 expands from the lower opening 48 toward the upper opening 49, when an atmospheric gas enters from the lower opening 48, the gas becomes bubbles and the liquid accumulated in the hollow space S passes through the liquid. Ascend and separate from the liquid. Therefore, the phenomenon that the gas becomes a plug and the liquid rises on the nozzle does not occur.
For example, using the droplet handling mechanism 40, the solution P is dropped on the surface of the substrate T, the droplet P is collected on the surface of the substrate T, the collected droplet is put in the container 29, The solution can be replenished inside.
Further, since the nozzle 41 and the discharge ports of the cylinders / pistons 44 and 45 are communicated by the flexible hose 43, the nozzle 41 can be easily handled.
Further, since the nozzle 41 is fitted into the nozzle mounting opening 42, the nozzle 41 can be easily replaced.
In addition, since the droplet attached to the substrate is attached to the contact portion of the holding jig 10 and the holding jig 10 is relatively moved along the surface of the substrate, the droplet is attached to the surface of the substrate T. The surface of the substrate T can be moved.
Thereafter, the holding jig 10 is moved upward, so that droplets can be left on the surface of the substrate.
Further, since the droplets remaining on the surface of the substrate T are sucked using the droplet handling mechanism 40 and collected in the container 20, there is no possibility of dropping the droplets P.
In addition, the droplets attached to the holding jig 10 of the conventional method are moved to the edge of the surface of the substrate T, moved from the edge onto the container 20, and the droplet P is collected in the container 20. Compared to the method to do, it is not necessary to move the edge.
Further, when a droplet attached to the surface of the substrate T is sucked using the droplet handling mechanism 40, if the predetermined volume is larger than the volume of the droplet contacting the contact portion 14 of the holding jig 10, Most of the droplets adhering to the surface of the substrate can be sucked into the hollow space of the nozzle.
Further, since the droplet handling mechanism 40 is used to replenish the solution in the container 20 in which the droplets are collected, the amount of the solution in the container 20 can be set to a desired amount.
In addition, since the weight measuring device 100 capable of measuring the weight of the container 20 containing the collected droplets is provided, the total amount of the collected droplets can be known.
Further, when the solution is replenished to the container using the droplet handling mechanism 40, the volume of the sealed space H to be reduced corresponds to a value obtained by subtracting the weight from a certain value, so that the total amount of the solution entering the container 20 is constant. The value can be
Further, when the substrate processing apparatus is installed in a clean space with downflow, the cover 102 is provided on the container 20 on the weighing scale 101, so that the downflow is prevented from hitting the container 20, and the weight measuring device is provided. 100 measurement accuracy can be improved.
Further, since the nozzle cleaning mechanism 80 for blowing the cleaning liquid is provided and the lower opening 48 of the nozzle 41 is immersed in the cleaning liquid and the piston 45 is reciprocated, the hollow space S of the nozzle 41 can be cleaned with the cleaning liquid.
Further, since the piston 45 of the piston / cylinder is directly moved by the linear motion actuator 46, the volume of expansion or reduction of the sealed space can be accurately adjusted by controlling the linear motion distance of the linear motion actuator 46.

The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the scope of the invention.
Although an example in which one nozzle replacement mechanism, two holding jig cleaning mechanisms, one chemical tank, and one nozzle cleaning mechanism are arranged adjacent to each other has been described, the present invention is not limited to this.
The droplet recovery process has been described with an example in which the holding jig is raised and the droplets remaining on the surface of the substrate are sucked by the droplet handling mechanism. However, the present invention is not limited to this. For example, a holding jig is used. Alternatively, a method may be used in which the contacted droplet is moved to the edge of the substrate and directly collected in the container.
Although the example in which the longitudinal direction of the nozzle is vertical has been described, the present invention is not limited to this, and the longitudinal direction of the nozzle may be inclined with the lower opening facing downward and the upper opening facing upward.

It is a top view of the substrate processing apparatus concerning the embodiment of the present invention. It is a conceptual diagram of the droplet handling apparatus which concerns on embodiment of this invention. It is AA sectional drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is BB sectional drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is BB sectional drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is BB sectional drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is CC sectional drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is DD sectional drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is a procedure figure of the substrate processing apparatus concerning the embodiment of the present invention. It is an effect | action figure of the droplet handling apparatus which concerns on embodiment of this invention.

Explanation of symbols

A Bubble T Substrate S Hollow space H Sealed space P Droplet 10 Holding jig 11 Flange portion 12 Cylindrical portion 13 Through hole 14 Contact portion 20 Container 30 Moving mechanism 31 Substrate rotating mechanism 32 Swing arm mechanism 33 Holding jig suction mechanism 34 Nozzle mounting port fixing mechanism 40 Droplet handling mechanism 41 Nozzle 42 Nozzle mounting port 43 Flexible hose 44 Cylinder 45 Piston 46 Direct acting actuator 47 Discharge port 48 Lower opening 49 Upper opening 50 Nozzle replacement mechanism 60 Holding jig cleaning mechanism 70 Chemical solution tank 80 Nozzle cleaning mechanism 90 saucer unit 91 saucer rotation mechanism 92 saucer 93 container storage hole 100 weight measuring device 101 weigh scale 102 cover

Claims (16)

A substrate processing apparatus for attaching and moving droplets on a substrate to inspect the substrate,
A holding jig having a contact portion capable of coming into contact with droplets attached to the surface of the substrate from above;
A moving mechanism capable of relatively moving the holding jig on the surface of the substrate;
A cylinder that is a member that is long in the vertical direction and has a nozzle provided with a hollow space having a cross section that extends from a lower opening located at the lower part toward an upper opening located at the upper part, and a discharge port communicated with the upper opening. And a droplet handling mechanism having a piston that can communicate with the discharge port and form a sealed space filled with gas inside the cylinder, and
With
After the moving mechanism moves the holding jig whose contact portion is in contact with the droplet attached to the surface of the substrate along the surface of the substrate, the moving mechanism moves the holding jig at a predetermined position. After moving upward, the lower opening of the nozzle that has emptied the hollow space is positioned in the vicinity of the surface of the predetermined position so as to expand the sealed space by a first volume that is a predetermined volume. Move the piston directly,
A substrate processing apparatus. A container that can store droplets
Prepared,
The lower opening of the nozzle in which droplets have entered the hollow space is positioned above the mouth of the container, and the piston is directly moved so as to reduce the sealed space by a second volume that is a predetermined volume.
The substrate processing apparatus according to claim 1. The first volume is larger than the volume of a droplet in contact with the contact portion of the holding jig;
The substrate processing apparatus according to claim 1. A substrate processing apparatus for attaching and moving droplets on a substrate to inspect the substrate,
A holding jig having a contact portion capable of coming into contact with droplets attached to the surface of the substrate from above;
A moving mechanism capable of relatively moving the holding jig on the surface of the substrate;
A cylinder that is a member that is long in the vertical direction and has a nozzle provided with a hollow space having a cross section that extends from a lower opening located at the lower part toward an upper opening located at the upper part, and a discharge port communicated with the upper opening. And a droplet handling mechanism having a piston that can communicate with the discharge port and form a sealed space filled with gas inside the cylinder, and
A container capable of storing droplets;
With
After the movement mechanism moves the holding jig, which contacts the contact portion from above to the droplets attached to the surface of the substrate, along the surface of the substrate,
After the droplet is collected in the container, the lower opening of the nozzle in which the liquid has entered the hollow space is positioned above the mouth of the container in which the collected droplet has been placed, so that the sealed space has a predetermined volume. The piston is moved directly so that the third volume is reduced.
A substrate processing apparatus. A weight measuring device capable of measuring the weight of the container containing the collected droplets;
Prepared,
The third volume corresponds to a constant value minus the weight;
The substrate processing apparatus according to claim 4. The weight measuring device has a weighing scale that supports the container from below, and a cover that covers the weighing scale and the container from above;
The substrate processing equipment is installed in a clean space with downflow.
The substrate processing apparatus according to claim 5. The nozzle cleaning mechanism that blows out the cleaning liquid
Prepared,
The lower opening of the nozzle with the hollow space emptied is immersed in the cleaning liquid blown out by the nozzle cleaning mechanism, and the piston is reciprocated so as to expand and further reduce the sealed space by a fourth volume which is a predetermined volume. ,
The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is characterized in that The droplet handling mechanism has a linear actuator that linearly moves the piston,
The linear actuator linearly moves the piston by a stroke corresponding to the predetermined volume;
The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is characterized in that A substrate processing method for attaching and moving droplets on a substrate to inspect the substrate,
A holding jig having a contact portion capable of coming into contact with droplets attached to the surface of the substrate from above;
A cylinder that is a member that is long in the vertical direction and has a nozzle provided with a hollow space having a cross section that extends from a lower opening located at the lower part toward an upper opening located at the upper part, and a discharge port communicated with the upper opening. And a liquid droplet handling mechanism having a piston that can communicate with the discharge port and form a sealed space filled with gas inside the cylinder, and a preparatory step,
A substrate processing step of moving along the surface of the substrate the holding jig in which the contact portion is in contact with the droplet attached to the surface of the substrate from above;
After the holding jig is moved upward at a predetermined position, the lower opening of the nozzle that has emptied the hollow space is positioned in the vicinity of the surface of the predetermined position of the substrate so that the sealed space is predetermined. A liquid drop suction process in which the piston is linearly moved so as to expand only the first volume which is the volume;
With
Performing the droplet suction step after the substrate processing step;
And a substrate processing method. The preparation step further prepares a container capable of storing droplets,
A droplet that moves the piston directly so that the lower opening of the nozzle in which the droplet enters the hollow space is positioned above the mouth of the container and the sealed space is reduced by a second volume that is a predetermined volume. A discharge process;
Comprising
The substrate processing method according to claim 9. The first volume is larger than the volume of a droplet in contact with the contact portion of the holding jig;
The substrate processing method according to claim 9. A substrate processing method for attaching and moving droplets on a substrate to inspect the substrate,
A holding jig having a contact portion capable of coming into contact with droplets attached to the surface of the substrate from above;
A cylinder that is a member that is long in the vertical direction and has a nozzle provided with a hollow space having a cross section that extends from a lower opening located at the lower part toward an upper opening located at the upper part, and a discharge port communicated with the upper opening. And a droplet handling mechanism having a piston that can communicate with the discharge port and form a sealed space filled with gas inside the cylinder, and a container capable of storing the droplet, When,
A substrate processing step of relatively moving the holding jig in contact with the droplets attached to the surface of the substrate from above along the surface of the substrate;
A droplet collection step for collecting the droplets in the container;
The lower opening of the nozzle containing the liquid in the hollow space is positioned above the mouth of the container containing the collected liquid droplets, and the sealed space is reduced by a third volume which is a predetermined volume. A solution replenishment step for moving the piston directly;
A substrate processing method comprising: A weight measuring step for measuring the weight of the container containing the collected droplets;
With
The third volume corresponds to a constant value minus the weight;
The substrate processing method according to claim 12. The weight measurement step covers the container with a cover from above in a clean space with a downflow,
The substrate processing method according to claim 13. A nozzle cleaning step of reciprocating the piston so that the lower opening of the nozzle with the hollow space emptied is immersed in a cleaning liquid to expand and further reduce the sealed space by a fourth volume which is a predetermined volume;
Comprising
13. The substrate processing method according to claim 9, wherein the substrate processing method is one of the following. The preparation step prepares a linear actuator that linearly moves the piston, and the linear actuator moves the piston by a stroke corresponding to the predetermined volume;
13. The substrate processing method according to claim 9, wherein the substrate processing method is one of the following.

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