JP2006181743A - Ceramic structure and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic structure constituted by integrally laminating a plurality of ceramic green sheets to bake them, in detail a ceramic structure not requiring special surface treatment or the like after baking and having protruded parts on its surface formed from a sintered surface enhanced in orthogonal angle, smoothness and dimensional precision, and its manufacturing method. <P>SOLUTION: The ceramic structure is manufactured by placing the regions becoming the protruded parts of the ceramic green sheet on a resin sheet, laminating a plurality of the ceramic green sheets and pyrolyzing the resin sheet when the laminate of the ceramic green sheets are baked to remove it. The protruded parts are characterized in that the angle formed by the surface of the ceramic structure and the protruded parts is within 90±3°, the smoothness of the side surfaces and upper surfaces of the protruded parts is 30 μm or below and the radius of curvature of the corner part between mutual surfaces is 50 μm or below, in a state the inner surfaces of the protruded parts are sintered to become sintered surfaces as they are. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a ceramic structure in which a plurality of ceramic green sheets are laminated and fired, and more specifically, the surface convexity formed from a sintered surface having high squareness, flatness and dimensional accuracy after firing. The present invention relates to a ceramic structure having a partial structure and a method for manufacturing the same.

  Conventionally, the use of a ceramic structure having a convex portion on the surface includes, for example, a back plate of a display or the like, and recently, a complex structure composed of a three-dimensional structure having floating island-like convex portions on the surface of a plurality of surfaces. There is also an increasing demand for a ceramic structure having a different shape. For example, in the field of electronic component packages that mount semiconductor elements, sensors, and various electronic components, etc., the three-dimensional structure of packages is progressing in order to achieve both multi-functionality, high functionality, and small size and low profile. .

  For example, in the case of an electronic component package, such a ceramic structure has a structure in which a metallized wiring layer is disposed on the surface or inside of an insulator in which a plurality of insulating layers are stacked. As the insulating layer, those made of ceramics such as alumina ceramics are frequently used, and more recently, an insulating layer in which an insulating layer made of a glass ceramic structure capable of co-firing with copper metallization is laminated has been put into practical use. ing.

  In the production of such a ceramic structure, a slurry is prepared by adding a suitable resin binder to a ceramic raw material powder prepared at a predetermined ratio and dispersing it in an organic solvent, and a conventionally known doctor blade method or lip coater. A ceramic green sheet having a predetermined thickness (hereinafter also referred to as a green sheet) is formed by a casting method such as a method.

  Next, as a metallized wiring layer, a metal paste obtained by adding and mixing a resin binder, a solvent, and a plasticizer to an appropriate metal powder is printed and applied to the above green sheet in a predetermined pattern by a well-known screen printing method. At the same time, a through hole (through hole) is formed by a micro drill or a laser, and a metal paste is filled in the through hole to form a through conductor (via conductor, via hole).

  Then, in order to form a convex part on the surface, a through hole is formed by punching a predetermined part of the green sheet. After that, by laminating a plurality of green sheets with through holes formed together with other green sheets using an appropriate adhesion liquid, and firing the obtained green sheet laminate including the convex portions under predetermined conditions, A ceramic structure having protrusions on the surface is obtained.

  In recent years, in order to achieve both multi-function / high functionality and small size / low profile in such ceramic structures, the ceramic structures have been three-dimensionally structured. It is indispensable to prevent the sheet from being deformed. Furthermore, it is desired to cope with a ceramic structure having a complicated shape such as a three-dimensional structure having a plurality of convex portions with high dimensional accuracy formed from a sintered surface having high flatness after firing.

  However, when a ceramic structure having a convex portion is pressed and laminated with a green sheet with a through hole and a green sheet without a through hole, a pressure difference is generated between the through hole portion and the other portion. As a result, the bottom of the through hole of the green sheet laminate that does not receive pressure may bulge.

  In addition, when the pressurization pressure is lowered to solve the above problem, the pressure necessary for the close contact of the peripheral portion of the through hole is reduced, so that delamination occurs between the green sheets. It was difficult to obtain a ceramic structure with no reliability.

  Furthermore, when the width of the convex portion is thin and weak, there is a problem of deformation at the time of pressurization such as lamination, or a case where a plurality of convex portions are formed at a narrow interval by punching in the same green sheet, etc. , During so-called raw processing such as when cutting (snap processing) to cut into individual pieces of a ceramic structure by cutting between a plurality of convex portions formed on the same green sheet with a metal blade or the like It becomes easy for the malfunction which deform | transforms.

Therefore, as a method to solve these problems, a method of flattening by cutting etc. the part where deformation or swelling occurred after firing, or laminating while pressing a mold etc. on the part other than the convex part to suppress deformation However, the manufacturing method is generally performed. On the other hand, there is disclosed a method of removing unsintered powder and the like after performing pressure-uniform lamination while filling non-sintered powder and the like in portions other than the convex portions (for example, Patent Documents 2 and 3). According to this method, since pressure equalization lamination is possible, it becomes possible to obtain a ceramic molded body excellent in flatness and dimensional accuracy. Furthermore, a method is disclosed in which portions other than the convex portions are covered with a thin elastic sheet, and pressure equalization lamination is performed by an isostatic press (for example, Patent Document 4).
Japanese Patent Laid-Open No. 2003-332741 JP 2001-358247 A JP-A-8-245268 JP 2003-289119 A

  However, a method for performing surface treatment such as cutting is expensive. In addition, the method using a mold is expensive, and there is a problem that the green sheet is damaged when a positional shift occurs when pressing the mold. In the case of Patent Documents 2 and 3, a process for removing the unsintered powder after firing is necessary. If the removal of the unsintered powder or the like is insufficient, various problems such as defective insulation are caused. There was a fear. Furthermore, in the case of patent document 4, when the convex part was thin and weak, there existed a possibility that it might deform | transform by applying an excessive pressure.

  Therefore, the present invention has been devised in view of the above problems, and the object thereof is to form a sintered surface having high squareness, flatness and dimensional accuracy without requiring special surface treatment after firing. It is an object of the present invention to provide a ceramic structure having a convex portion on the surface and a manufacturing method thereof.

  The ceramic structure of the present invention has a sintered surface in which convex portions are formed on the surface, side surfaces of the convex portions are substantially perpendicular to the surface, and the surface of the convex portion is sintered. The angle formed by the side surface of the convex portion and the surface of the ceramic structure in the state consisting of is 90 ° ± 3 °.

  The ceramic structure of the present invention is characterized in that the flatness of the side surface of the convex portion is 30 μm or less.

  In the ceramic structure of the present invention, the flatness of the upper surface of the convex portion is 30 μm or less.

  The ceramic structure of the present invention is characterized in that the radius of curvature of the corner between the side surface of the convex portion and the surface of the ceramic structure is 50 μm or less.

  The ceramic structure of the present invention is characterized in that a radius of curvature of a corner portion between the surfaces of the convex portion is 50 μm or less.

  The method for producing a ceramic structure of the present invention includes a step of forming a through hole using a punching die in a resin sheet, a step of placing a ceramic green sheet on the resin sheet in which the through hole is formed, A step of fitting a part of the ceramic green sheet into the through hole of the resin sheet by pressing from the ceramic green sheet side using a punching die to produce a resin sheet-ceramic green sheet composite; and the resin It comprises a step of producing a laminate including at least one sheet-ceramic green sheet composite, a binder removal step of thermally decomposing and removing the resin sheet, and a step of firing the laminate. .

  In the ceramic structure of the present invention, the convex portion is formed on the surface, the side surface of the convex portion is substantially perpendicular to the surface, and the surface of the convex portion is composed of a sintered surface that is sintered. The angle between the side surface of the convex portion and the surface of the ceramic structure is 90 ° ± 3 °, the flatness of the side surface of the convex portion is 30 μm or less, the flatness of the upper surface of the convex portion is 30 μm or less, the side surface of the convex portion and the ceramic Since the radius of curvature of the corner between the surface of the structure is 50 μm or less and the radius of curvature of each corner between the surfaces of the convex portion is 50 μm or less, special flattening treatment such as cutting and surface treatment Thus, a ceramic structure with high dimensional accuracy can be obtained. For this reason, when an electronic component or the like is mounted on the upper surface or the side surface of the convex portion on the surface, problems such as bonding failure can be prevented.

  Further, the method for manufacturing a ceramic structure of the present invention includes a step of forming a through hole using a punching die in a resin sheet, a step of placing a ceramic green sheet on the resin sheet having the through hole formed therein, A step of fitting a part of the ceramic green sheet into the through hole of the resin sheet by pressing from the ceramic green sheet side using a mold, and a resin sheet-ceramic green sheet composite A laminate including at least one layer, a debinding step of thermally decomposing and removing the resin sheet, and a step of firing the laminate, so that pressure equalization lamination is possible, and the convex portion is formed. It is possible to form a ceramic structure without deformation and without delamination. In addition, since a thermally decomposable resin sheet is used, the laminate may be baked all at once without removing the resin sheet filled in the portions other than the convex portions, and the number of processes can be reduced.

  In the method for producing a ceramic structure of the present invention, a through hole is first formed in a resin sheet using a punching die, and then a ceramic green sheet is placed on the resin sheet on which the through hole is formed and punched out. By pressing from the ceramic green sheet side using a mold, a part of the ceramic green sheet is fitted into the through hole of the resin sheet to produce a resin sheet-ceramic green sheet composite, thus forming a convex part of the ceramic structure Since the shearing history by the punching die that is added to the ceramic green sheet is only once, deformation of the convex portion of the ceramic structure can be further suppressed, and the convex shape having a particularly excellent squareness can be obtained. It is an effective means for realizing. Therefore, even when the convex portion is thin and weak, it is possible to obtain a ceramic structure having a convex portion on the surface formed from a sintered surface having high squareness, flatness, and dimensional accuracy.

  The ceramic structure of the present invention and the manufacturing method thereof will be described in detail below.

  First, a green sheet for producing a ceramic structure is produced as follows. Green powder powder, such as ceramic powder and glass powder, if desired, ceramic powder that serves as a sintering aid is added and mixed into the mixture, resin binder, plasticizer and other additives, organic solvent, etc. To prepare a slurry. Thereafter, a green sheet having a predetermined thickness is formed using the slurry by a forming method such as a doctor blade method, a rolling method, or a pressing method.

  Next, when forming an electrical wiring or the like, by punching the green sheet, a through hole serving as a via hole connecting the upper and lower wiring conductor layers is formed, and a conductive paste is filled in the through hole. .

  The ceramic powder includes metal or non-metal oxide or non-oxide powder. These powders may be used in a single composition or in the form of a compound alone or in combination. Specifically, Li, K, Mg, B, Al, Si, Cu, Ca, Br, Ba, Zn, Cd, Ga, In, lanthanoid, actinoid, Ti, Zr, Hf, Bi, V, Nb, Ta , W, Mn, Fe, Co, Ni, and other oxides, carbides, nitrides, borides, sulfides, and the like.

More specifically, a composite oxide of SiO ₂ , Al ₂ O ₃ , ZrO ₂ , TiO ₂ and an alkaline earth metal oxide, ZnO, MgO, MgAl ₂ O ₄ , ZnAl ₂ O ₄ , MgSiO ₃ , Mg _{2 SiO 4, Zn 2 SiO 4} , Zn 2 TiO 4, SrTiO 3, CaTiO 3, MgTiO 3, BaTiO 3, CaMgSi 2 O 6, SrAl 2 Si 2 O 8, BaAl 2 Si 2 O 8, CaAl 2 Si 2 O ₈ , Mg ₂ Al ₄ Si ₅ O ₁₈ , Zn ₂ Al ₄ Si ₅ O ₁₈ , AlN, Si ₃ N ₄ , SiC, and a composite oxide containing at least one selected from Al ₂ O ₃ and SiO ₂ (For example, spinel, mullite, cordierite) and the like, and can be selected in accordance with the application.

Examples of the glass powder include SiO ₂ —B ₂ O ₃ , SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ , SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO (however, M Is Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ₁ O—M ₂ O system (where M ₁ and M ₂ are the same or different, and Ca, Sr , Mg, Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ₁ O—M ₂ O (where M ₁ and M ₂ are the same as above), SiO ₂ —B ₂ O ₃ —M ₃ O system (where M ₃ is Li, Na or K), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ₃ O system (where M ₃ is the same as above), A glass containing at least one selected from the group consisting of Pb glass, Bi glass, alkali metal oxide, alkaline earth metal oxide, and rare earth oxide is preferable. These glasses become amorphous glass when fired, and when fired, lithium silicate, quartz, cristobalite, cordierite, mullite, anorthite, serdian, spinel, garnite, willemite, dolomite, petalite and their Crystallized glass that precipitates at least one type of substituted derivative crystal is used.

  The mixing ratio of the ceramic powder and the glass powder is a ratio used for a normal glass ceramic structure material, and is preferably 60:40 to 1:99 by weight.

Examples of the auxiliary component include B ₂ O ₃ , ZnO, MnO ₂ , alkali metal oxides, alkaline earth metal oxides, rare earth metal oxides, and the like, which can be selected according to use.

  In addition, as a material when the ceramic structure of the present invention is used as a piezoelectric element, crystals of perovskite type structures such as barium titanate and lead zirconate-lead titanate solid solutions are specifically mentioned. Include zirconate titanates such as lead zirconate titanate (PZT) and lead lanthanum zirconate titanate (PLZT), or lead titanate.

  On the other hand, as the resin binder of the green sheet, for example, acrylic (acrylic acid, methacrylic acid or a homopolymer or copolymer thereof, specifically an acrylic ester copolymer, a methacrylic ester copolymer) , Acrylic acid ester-methacrylic acid ester copolymer, etc.), homopolymers or copolymers of polyvinyl acetal, cellulose, polyvinyl alcohol, polyvinyl acetate, polyvinyl chloride, polypropylene carbonate, etc. It is preferable to contain at least one selected from these.

  Specific examples of acrylics include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, Examples include isobutyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isononyl acrylate, isononyl methacrylate, isodecyl acrylate, and isodecyl methacrylate. Acrylic esters and alkyl methacrylates A copolymer containing a carboxylic acid group, an alkylene oxide group, a hydroxyl group, a glycidyl group, an amino group or an amide group as a copolymerization component is preferably used as the copolymer having a steal main chain. it can.

  Examples of those having a carboxylic acid group include acrylic acid, methacrylic acid, maleic acid, itaconic acid, and fumaric acid. Examples of those having alkylene oxide include methylene oxide, ethylene oxide, and propylene oxide. As those having a hydroxyl group, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, diethylene glycol monoacrylate, diethylene glycol monomethacrylate, glycerol monoacrylate, glycerol monomethacrylate, trimethylolpropane There are triacrylate, trimethylolpropane trimethacrylate, etc., and those having a glycidyl group include glycidyl Examples of those having an amino group or an amide group include dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, diethylaminoethyl acrylate, diethylaminoethyl methacrylate, N-tert-butylaminoethyl acrylate, N-tert- Examples include butylaminoethyl methacrylate, acrylamide, cyclohexyl acrylamide, cyclohexyl methacrylamide, N-methylol acrylamide, and diacetone acrylamide.

  Other copolymerizable acrylonitrile, styrene, ethylene, vinyl acetate, n-vinylpyridone and the like may be copolymerized with these copolymers having acrylic acid ester or methacrylic acid alkyl ester as the main chain.

  Specific examples of the polyvinyl acetal type include polyvinyl butyral, polyvinyl ethylal, polyvinyl propylal, polyvinyl octylal, polyvinyl phenylal, and derivatives thereof.

  Specific examples of the cellulose type include methylcellulose, ethylcellulose, carboxymethylcellulose, hydroxypropylcellulose, hydroxypropylmethylcellulose, nitrocellulose, and cellulose acetate.

  Next, as a conductor paste for forming a conductor portion such as a metallized wiring or a via conductor, for example, one or two metal powders such as Au, Cu, Ag, Pd, W, Mo, Ni, Al, and Pt are used. The above is mentioned, and in the case of two or more kinds, any form such as mixing and alloying may be used. What mixed these resin powders with the resin binder, the solvent, the plasticizer, the dispersing agent, etc. can use it conveniently.

  Examples of the resin binder for the conductive paste include acrylic, polyvinyl acetal, and cellulose homopolymers or copolymers, and contains at least one selected from these.

  Specific examples of acrylics include homopolymers or copolymers of acrylic acid, methacrylic acid or their esters, specifically acrylic ester copolymers, methacrylic ester copolymers, acrylic ester-methacrylic acid An ester copolymer may be used, and a hydroxyl group, a carboxylic acid group, an alkylene oxide group, a glycidyl group, an amino group, an amide group, or the like may be appropriately introduced into these copolymers. By introducing these, the effect of improving the dispersibility with ceramics and the effect of improving the viscosity and thixotropy can be expected. In addition, styrene, α-methylstyrene, acrylonitrile, ethylene, vinyl acetate, polyvinyl alcohol can be copolymerized with acrylic resin as long as the performance such as thermal decomposability and solubility in various solvents is not impaired. , N-vinylpyrrolidone or the like may be introduced as appropriate. Among these acrylic resins, one or two or more kinds can be appropriately selected and used as necessary.

  As the solvent for the conductive paste, terpineol, dihydroterpineol, ethyl carbitol, butyl carbitol, carbitol acetate, butyl carbitol acetate, diisopropyl ketone, methyl cellosolve acetate, cellosolve acetate, butyl cellosolve, butyl cellosolve acetate, High in cyclohexanone, cyclohexanol, isophorone, cypropylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, butyl carbitol methyl-3-hydroxyhexanoate, trimethylpentanediol monoisobutyrate, pine oil, mineral spirits, etc. A boiling point solvent can be preferably used.

  The resin binder is preferably mixed at a ratio of 0.5 to 15.0 parts by weight with respect to 100 parts by weight of the metal powder, and the organic solvent is mixed at a ratio of 5 to 100 parts by weight with respect to 100 parts by weight of the solid component and the resin binder. In addition, you may add some inorganic components, such as glass powder and oxide powder, in this conductor paste. This conductor paste is printed on the green sheet in a predetermined pattern using a known printing method such as a screen printing method or a gravure printing method.

  A green sheet laminate is produced by applying or transferring an appropriate adhesive composed of a resin binder, solvent, and plasticizer to the green sheet thus obtained and then pressing and laminating with other green sheets to laminate them. To do. A ceramic structure is obtained by firing the obtained green sheet laminate under predetermined conditions.

  Next, the manufacturing method of the ceramic structure of this invention is demonstrated using FIG.1 and FIG.2.

  In the present invention, a green sheet is fitted into the through hole 3 of the resin sheet 2 that is thermally decomposed in the firing process before pressure lamination. Thereby, since the bottom part of the part in which the side wall of a convex part and the convex part are not formed is pressurized through the resin sheet 2 in the step which pressurizes and laminates, a swelling and a deformation | transformation do not generate | occur | produce. Further, a high lamination pressure can be applied so that delamination does not occur in the green sheet laminate. In addition, regarding the magnitude | size of the convex part applicable to this invention, if it is a magnitude | size which can be inserted in the resin sheet 2, it can apply from a fine thing to a comparatively big thing.

  Next, a method for fitting a green sheet into the through hole 3 of the resin sheet 2 will be described. The through-hole 3 is formed by a punching apparatus mainly composed of an upper mold 4 that is a driving part of the punching mold and a lower mold 6 that is a fixing part of the punching mold. As shown in FIG. 1 (a), the resin sheet 2 is placed on a lower mold 6 provided with an opening 5, and the upper mold 4 is placed from above the resin sheet 2 as shown in FIG. 1 (b). A punching process is performed by driving downward, and as shown in FIG.1 (c), the through-hole 3 is formed and the resin sheet 2 in which the through-hole 3 was formed is obtained. Note that the punching device may be one in which the upper mold 4 is fixed and the lower mold 6 can be driven.

  Next, as shown in FIG. 1D, using the same punching device, the green sheet 1 is overlaid on the resin sheet 2 in which the through holes 3 are formed, and as shown in FIG. By driving 4, punching of the green sheet 1 and fitting of the punched green sheet 1 into the through hole 3 are performed simultaneously. Subsequently, the excess portion of the green sheet 1 is removed to obtain a resin sheet-green sheet composite A in which the green sheet is fitted into the through hole 3 as shown in FIG.

  Then, the manufacturing method of the ceramic structure which has the convex part 7 on the surface is demonstrated with the process drawing of FIG. A wiring sheet 8 comprising a resin sheet-green sheet composite A1 in which the uppermost resin sheet 2a is fitted, a resin sheet-green sheet composite A2 in which the lowermost resin sheet 2b is fitted, and a metallized layer. And green sheet B1, B2, B3 in which the via conductor 9 was formed is laminated | stacked collectively, and the green sheet laminated body C is obtained. Next, after the state (c) in which the uppermost resin sheet 2a fitted in the green sheet laminate C is removed in the first debinding step, the resin sheet 2b is further removed in the second debinding step. . Finally, the green sheet laminate is subjected to a third binder removal step and then fired to obtain a ceramic structure D.

  By such a manufacturing method of the present invention, not only the upper surface of the convex part but also the side wall of the convex part or the bottom part of the part where the convex part is not formed is pressed and no swelling or deformation occurs. Therefore, it is possible to pressurize at a high lamination pressure, and the ceramic structure D can be manufactured under a condition in which delamination does not occur.

  In the method for producing a ceramic structure of the present invention, a through hole is first formed in a resin sheet using a punching die, and then a ceramic green sheet is placed on the resin sheet on which the through hole is formed and punched out. By pressing from the ceramic green sheet side using a mold, a part of the ceramic green sheet is fitted into the through hole of the resin sheet to produce a resin sheet-ceramic green sheet composite, thus forming a convex part of the ceramic structure Since the shearing history by the punching die that is added to the ceramic green sheet is only once, deformation of the convex portion of the ceramic structure can be further suppressed, and the convex shape having a particularly excellent squareness can be obtained. It is an effective means for realizing. Therefore, even when the convex portion is thin and weak, it is possible to obtain a ceramic structure having a convex portion on the surface formed from a sintered surface having high squareness, flatness, and dimensional accuracy.

  In addition, in the method for producing a ceramic structure of the present invention, a method of punching and fitting a resin sheet-ceramic green sheet composite may be used in combination. That is, instead of the resin sheet 2 of FIG. 1B, first, the green sheet 1 is penetrated with a punching die to form portions other than the convex portions of the ceramic structure, and then the obtained green sheet 1 You may use together the resin sheet-ceramic green sheet composite_body | complex in which the resin sheet 2 thermally decomposed in a baking process was inserted in the through-hole. In this case, the shear history by the punching die applied to the green sheet 1 for forming the convex portion of the ceramic structure is formed by punching the green sheet 1 to form a through hole and a resin sheet in the formed through hole. Since it takes a total of two steps for fitting the green sheet 1, the wall portion of the through hole of the green sheet 1 serving as the corner of the convex portion of the ceramic structure may be deformed. Therefore, in order to realize a good squareness, the gap (clearance) between the upper mold 4 that is the driving part of the punching mold in FIG. 1 and the lower mold 6 that is the fixing part of the punching mold is finely adjusted. It is preferable.

  Next, the manufacturing method of the resin sheet 2 (2a, 2b) used when manufacturing the ceramic structure of this invention is described. The resin sheet 2 (2a, 2b) preferably includes resin beads, a resin binder, and at least one of a plasticizer and a lubricant. As the characteristics required for the resin sheet 2 (2a, 2b), punching processability (shearing processability) and thermal decomposability in the firing process are important. In order to obtain good punching processability, a powdered resin Addition of beads is effective. In the shearing process such as punching or cutting of the resin sheet, the shearing process is easy to occur in the shearing direction through the resin layer existing between the resin beads. In addition, since the propagation of cracks generated in directions other than the shear direction is suppressed by the presence of resin beads, the resin sheet having substantially the same shape as the through-hole can be obtained by suppressing crack propagation in directions other than the shear direction and shearing into a desired shape. Therefore, when the green sheets are pressed and laminated, the deformation of the green sheets can be prevented. Furthermore, it becomes possible to further improve workability by including at least one of a plasticizer and a lubricant. By including a plasticizer, softness and flexibility can be imparted to the resin sheet. In addition, the inclusion of a lubricant improves slippage between resins or resin beads during the shearing process of the resin sheet, so that the shear processability is improved and the elongation of the resin sheet can be suppressed. High processing becomes possible.

  The resin beads are not particularly limited as long as they exhibit good thermal decomposition behavior upon firing, but acrylic, α-methylstyrene, and the like are preferable. The average particle size of the resin beads is preferably 1 to 20 μm. When the average particle diameter is less than 1 μm, the aggregation of resin beads becomes a problem, and when the average particle diameter exceeds 20 μm, protrusions are likely to occur on the surface of the resin sheet 2 (2a, 2b). In addition, you may use the thing of a hollow structure as a resin bead. In this case, there is an advantage that the sheet attack to the green sheet is reduced because the resin content of the resin beads is small at the time of degreasing.

  Further, the resin beads preferably have a crosslinking reaction from the viewpoint of solvent resistance. However, when the crosslinking reaction proceeds excessively, the thermal decomposability tends to deteriorate.

  Resin beads and resin binders such as aromatic hydrocarbons such as toluene, benzene and xylene, esters such as ethyl acetate, butyl acetate and isobutyl acetate, ketones such as methyl isobutyl ketone, methyl ethyl ketone and acetone, hexane and heptane, etc. One or more selected from aliphatic hydrocarbons, ethers such as diethyl ether, dipropyl ether, and tetrahydrofuran, alcohols such as methanol, ethanol, isopropyl alcohol, and butanol, and cell solves such as ethyl cellosolve Disperse in organic solvent.

  The resin binder used for the resin sheet 2 (2a, 2b) is not particularly limited as long as it has excellent thermal decomposability, and is preferably acrylic or α-methylstyrene. As acrylic resins, homopolymers or copolymers of acrylic acid, methacrylic acid or their esters, specifically acrylic ester copolymers, methacrylic ester copolymers, acrylic ester-methacrylic ester copolymers Examples include coalescence. As such, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate , T-butyl acrylate, t-butyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, and the like. Among these acrylic resins, one or two or more kinds can be appropriately selected and used as necessary. Among these, an isobutyl methacrylate-based (IBMA) or methyl methacrylate-based (MMA) resin binder alone or a copolymer is particularly preferable. Further, styrene, α-methylstyrene, acrylonitrile, ethylene, etc., which can be copolymerized with an acrylic resin, may be appropriately introduced as long as the thermal decomposability is not impaired. It contains at least one selected from these.

  Furthermore, the plasticizer added to give flexibility and flexibility to the resin sheet 2 (2a, 2b) may be any plasticizer that does not impair the thermal decomposability of the resin sheet. For example, dimethyl phthalate, dibutyl phthalate Phthalic acid esters such as, di-2-ethylhexyl phthalate, diheptyl phthalate, di-n-octyl phthalate, diisononyl phthalate, diisodecyl phthalate, butylbenzyl phthalate, ethyl phthalyl ethyl glycolate, butyl phthalyl butyl glycolate There are aliphatic ester systems such as di-2-ethylhexyl adipate and dibutyl diglycol adipate, which contain at least one selected from these. Of these, plasticizers such as phthalic acid esters such as dibutyl phthalate (DBP) and di-2-ethylhexyl phthalate (DOP) are preferable.

  Furthermore, as a lubricant added to improve the shear processability of the resin sheet 2 (2a, 2b), any lubricant that does not impair the thermal decomposability of the resin sheet 2 (2a, 2b) may be used, for example, diethylene glycol, Triethylene glycol, polyethylene glycol, diethylene glycol methyl ether, triethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol-n-butyl ether, triethylene glycol-n-butyl ether, ethylene glycol phenyl ether, ethylene glycol-n-acetate, diethylene glycol monohexyl Ethylene glycols such as ether and diethylene glycol monovinyl ether, dipropylene glycol, tripropylene glycol, polypropylene Glycol, dipropylene glycol methyl ether, tripropylene glycol methyl ether, dipropylene glycol monoethyl ether, dipropylene glycol-n-butyl ether, tripropylene glycol-n-butyl ether, propylene glycol phenyl ether, ethylene glycol benzyl ether, ethylene glycol Examples include propylene glycol type such as isoamyl ether, and glycerin type such as glycerin, diglycerin, polyglycerin, and the like, and contains at least one selected from these. Of these, polyethylene glycol (PEG) and glycerin are preferable.

  These plasticizers and lubricants are preferably limited to the minimum necessary amount. For example, when a product in which a conductor portion such as a fine wiring conductor is formed at a site where the resin sheet comes into contact, a large amount of plasticizer or lubricant remains in the composition of the molten resin sheet 2 (2a, 2b). When it does, it becomes easy to melt | dissolve the resin binder in the conductor part which contacts it, and there exists a possibility that defects, such as deform | transforming a conductor part and making it disconnect, may arise because the intensity | strength of a conductor part falls.

  A slurry prepared by adding 40 to 80 parts by weight of a resin binder to 100 parts by weight of the resin beads in the organic solvent and dispersing it, and then adding 5 to 40 parts by weight of a plasticizer and a lubricant in a total amount. The resin sheet 2 (2a, 2b) is obtained by applying onto a carrier sheet that has been treated with a release agent by a coating method such as a conventionally known roll coater, gravure coater, blade coater, and drying.

  The thermal decomposability of the resin sheet 2 (2a, 2b) is preferably superior to the resin binder contained in the green sheet on which it is placed and the resin binder contained in the conductor portion in contact with the resin sheet.

  Specifically, the thermal decomposability of the resin sheet 2 (2a, 2b) is preferably superior to the resin binder contained in the green sheet that comes into contact with the resin sheet 2 (2a, 2b). That is, as the resin binder in the green sheet is thermally decomposed (degreased) and the amount of the remaining resin binder in the green sheet is decreased, the strength of the green sheet is decreased, and the resin sheet 2 is delayed with respect to the brittle green sheet. When (2a, 2b) is thermally decomposed, the melt of the high-viscosity resin sheet 2 (2a, 2b), which has become liquid by heating, is moved up, down, left and right accompanying boiling on the surface of the green sheet that has become brittle after degreasing. Since it thermally decomposes accompanied by vibration motion, the phenomenon that the surface of the green sheet in contact with the thermally decomposed part is partially removed is eliminated.

  On the other hand, when a conductor part such as a wiring conductor is formed at a site where the resin sheet contacts, the thermal decomposability of the resin sheet 2 (2a, 2b) is superior to the resin binder contained in the conductor part in contact therewith. It is preferable. More specifically, the resin contained in the green sheet on which the resin sheet 2 (2a, 2b) is placed is set to a 20% weight reduction temperature of the resin binder contained in the conductor portion in contact with the resin sheet 2 (2a, 2b). What is necessary is just to set so that it may become 20% weight reduction temperature or more of a binder. Thereby, after most of the resin sheets 2 (2a, 2b) are thermally decomposed during firing, the thermal decomposition of the resin binder for the conductor paste contained in the conductor portion is started. At the stage where the composition of (2a, 2b) remains, since the resin binder in the conductor part in contact therewith has not started thermal decomposition, the strength of the conductor part is sufficiently maintained. Therefore, a highly reliable ceramic structure free from defects such as the composition of the molten resin sheet 2 (2a, 2b) dissolving the resin binder in the conductor portion to deform or disconnect the conductor portion. Can be produced.

  Next, the thermal decomposability of the resin sheet 2 (2a, 2b) will be described in detail. It is preferable that the thermal decomposition of the resin sheet 2 (2a, 2b) starts from the uppermost layer portion 2a toward the lower layer portion and finally completes at the lowermost layer portion 2b. That is, it is preferable that the uppermost layer portion 2a of the resin sheet 2 is superior to the lowermost layer portion 2b in terms of thermal decomposability.

  The effect by giving a difference in the thermal decomposability of the uppermost layer portion 2a and the lowermost layer portion 2b of the resin sheet 2 will be described.

  As shown in the process diagram (c) of FIG. 2, in the step of removing the uppermost layer resin sheet 2a fitted in the green sheet laminate C in the first debinding step, the lowermost layer resin sheet 2b. Since the green sheet and the conductor adjacent to each other are protected by the resin sheet 2b, the resin sheet 2a can be thermally decomposed without being damaged by the melt generated in the thermal decomposition process of the resin sheet 2a. By removing the lowermost layer resin sheet 2b in the subsequent second debinding step, the green sheet and the conductor portion adjacent to the resin sheet 2b can be minimized in damage due to the melt of the resin sheet 2. . These effects are particularly prominent when the amount of the resin sheet 2 fitted into the portion of the green sheet where the convex portions 7 are not formed is large.

  Thus, as a means for giving a difference in the thermal decomposability of the resin sheet 2, there is a case where the combination type of the resin beads and the resin binder constituting the uppermost layer portion 2a and the lowermost layer portion 2b is changed. That is, the material of the uppermost layer resin sheet 2a is selected to be more thermally decomposable than the lowermost layer resin sheet 2b. Further, as described above, in addition to the method of individually producing and combining the resin sheets 2a and 2b so as to have a difference in thermal decomposability, a method such as tape molding or coating on the upper part of the lowermost resin sheet 2b By forming the uppermost layer resin sheet 2a, the resin sheet 2 in which the thermal decomposability is changed in an inclined manner inside the resin sheet 2 may be used.

  In addition, about the thickness of resin sheet 2a, 2b, it is preferable that the resin sheet 2a is thicker than the resin sheet 2b. That is, the lowermost resin sheet 2b is a green sheet and a conductor present immediately below the lowermost resin sheet 2b when the uppermost resin sheet 2a is thermally decomposed in the first debinding process. In order to protect the portion, it is preferable that the sheet state is maintained to some extent, but more preferably, in the first debinding step, the resin sheet is formed on the resin sheet 2b having the minimum thickness that can maintain the sheet state to the minimum. It is to thermally decompose and remove most of the resin sheet 2 containing 2a. Thereby, at the time of a 2nd binder removal process, the various troubles to the green sheet and conductor part which are immediately under it can be prevented by suppressing the amount of melts of resin sheet 2b.

The thickness t ₂ of the resin sheet 2 combined resin sheet 2a, 2b may be pressure equalizing stacking by setting to the same extent as the thickness t ₁ of the green sheet for forming the convex portions 7 of the surface, preferably . Actually, the optimum ratio of the thickness balance between the resin sheet thickness t ₂ and the green sheet thickness t ₁ is slightly different depending on the lamination conditions such as the lamination pressure and the lamination temperature, but t ₂ is 0.3t _{1 to} 1.1t ₁ . it is preferable, from the viewpoint of equalizing pressure lamination, more preferably _{t 2} is 0.9t ₁ ~1.0t _1.

  Further, the resin sheet 2 is placed on the bottom of the portion of the green sheet where the convex portion 7 is not formed, but it is preferably placed or placed so that the lower surface of the resin sheet 2 is in contact with at least the entire bottom surface. In this case, lamination pressure can be applied to the entire bottom surface, and deformation of the bottom surface can be prevented. In addition, the resin sheet 2 is placed or placed so that the lower surface and the side surface of the resin sheet 2 are in contact with at least the entire bottom surface and the entire lower side of the inner surface of the portion where the convex portion 7 is not formed. Good. In this case, even if the convex portion 7 is weak, deformation and destruction of the convex portion 7 due to the stacking pressure can be prevented. Furthermore, the resin sheet 2 is preferably placed or installed so that the lower surface and the side surface of the resin sheet 2 are in contact with the entire bottom surface and the entire inner surface of the portion where the convex portions 7 are not formed. In this case, deformation of the entire surface of the convex portion 7 can be prevented.

  On the other hand, in the embodiment of FIG. 2, the case where the resin sheet 2 is composed of the uppermost layer resin sheet 2a and the lowermost layer resin sheet 2b has been described, but the uppermost layer resin sheet 2a and the lowermost layer portion Another resin sheet may be provided between the resin sheet 2b. In that case, it is preferable that the other resin sheets have the same thermal decomposability as one of the resin sheets 2a and 2b or have an intermediate thermal decomposability between the resin sheets 2a and 2b.

From the above, in the present invention, the thermal decomposability of each material forming the green sheet laminate is determined by thermogravimetric differential thermal analysis (TG / DTA) up to 600 ° C. at a temperature rising rate of 10 ° C./min in an N ₂ atmosphere. If it performed in a differential high-temperature thermal balance (Rigaku Co., Ltd. "TG8120"), a 80% weight loss temperature of the uppermost portion of the resin sheet 2 T _a ° C., 80% weight loss temperature of the lowermost layer portion the T _b ° C., 20% weight reduction temperature of the resin binder in the green sheet in which the resin sheet 2 is placed upon the T _c ° C., preferably satisfy the relation of T a _{<T b} ≦ T _c . Further, it is preferable that the resin sheet 2 (2a, 2b) is thermally decomposed by 99% by weight or more at 600 ° C. or less.

On the other hand, when a conductor part such as a wiring conductor is formed at a site where the resin sheet 2 comes into contact, it is preferable that the 20% weight reduction temperature of the resin binder contained in the conductor part is set to T _c ° C or higher.

The temperature profile of binder removal process during firing of the ceramic structure of the present invention, T _a ° C. near a predetermined time most of the resin sheet 2a is thermally decomposed temperature, for example, maintained from 1 to 6 hours sufficiently The first debinding step for thermally decomposing and removing the resin sheet 2a, and then the second debinding for sufficiently decomposing and removing the resin sheet 2b by maintaining _Tb ° C. for a predetermined time, for example, 1 to 6 hours. It is preferable to divide the process into a third debinding process that is performed while maintaining a temperature exceeding T _c ° C for a predetermined time, for example, 1 to 6 hours. Such holding time varies within the above range depending on the amount and material of the resin binder.

Thereby, after most of the resin sheets 2 (2a, 2b) are thermally decomposed, the resin binder of the green sheet and the conductor portion can start to decompose, and the resin sheet 2 (2a, 2b) is melted. At the stage where the product remains, the resin binder in the green sheet and the conductor portion has not started thermal decomposition, so that sufficient strength can be maintained. Therefore, it is possible to prevent the melt of the resin sheet 2 (2a, 2b) from eroding and destroying the green sheet and the conductor portion that are in contact therewith. Moreover, the temperature exceeding T _c ° C. to maintain the predetermined time can be green sheet and the conductor portion of the resin binder also sufficiently thermally decomposed.

  The thus obtained convex portion 7 of the ceramic structure according to the present invention has a sintered surface on which the side surface is substantially perpendicular to the surface of the ceramic structure and the surface of the convex portion remains sintered. The angle between the side surface of the convex portion and the surface of the ceramic structure is 90 ° ± 3 °, the flatness of the side surface of the convex portion is 30 μm or less, and the flatness of the upper surface of the convex portion is 30 μm or less, the radius of curvature of the corner between the side surface of the projection and the surface of the ceramic structure is 50 μm or less, and the radius of curvature of the corner between the surfaces of the projection is 50 μm or less. . The flatness referred to here is based on what is defined in Japanese Industrial Standards (for example, Reference 1: “JIS Industrial Terminology Dictionary (4th edition)”, p1747, 1995, Reference 2. : "JIS B6191 (Machine tools-Static accuracy test method and general rules for machine accuracy test method)", p20-26, 1999).

  Thus, since the convex part in the ceramic structure of this invention consists of a sintered surface which has a high squareness, flatness, and dimensional accuracy, it is not necessary to perform special planarization processes, such as cutting and surface treatment. Therefore, when mounting electronic parts on the top and side surfaces of the convex part on the surface, it is possible to prevent defects such as bonding defects, and to make multifunctional / high function and compact / low profile compatible. A three-dimensional structure of the structure can be realized.

  In addition, since the convex part in the ceramic structure of this invention consists of a sintered surface which has a high squareness, flatness, and dimensional accuracy, it is not necessary to perform special planarization processes, such as cutting and surface treatment. However, the surface of the convex portion may be lightly polished or cut. In that case, higher squareness, flatness and dimensional accuracy can be obtained.

  Examples of the ceramic structure of the present invention and the manufacturing method thereof will be described below.

(Examples 1-4)
Ceramic structure having convex portions 7 on the surface [1. Preparation of green sheet]
11 parts by weight of a binder of a copolymer composition of methyl acrylate and methyl methacrylate per 100 parts by weight of a glass ceramic raw material powder composed of SiO ₂ , Al ₂ O ₃ , CaO, ZnO, B ₂ O ₃ , phthalate as a plasticizer 5 parts by weight of dibutyl acid was added, and toluene was mixed as an organic solvent for 36 hours by a ball mill to prepare a slurry. The obtained slurry was molded by a doctor blade method and dried to produce green sheets having thicknesses of 0.2 mm, 0.3 mm, and 0.8 mm. Next, a through hole (through hole) having a diameter of 200 μm was formed in the green sheet by punching.

  Subsequently, the through-hole filling conductor paste described below was filled into the through-hole formed in the green sheet by a screen printing method. Next, a wiring pattern having a film thickness of 15 μm is printed and applied by screen printing using the following conductive paste for wiring, followed by drying at 80 ° C. for 1 hour using a hot air drying furnace to form a metallized wiring. did.

[2. Preparation of conductor paste]
(2-1) Conductor paste for filling through holes (conductor paste for forming via conductors)
For 100 parts by weight of Cu powder, 2 parts by weight of a resin binder of a copolymer composition of methyl acrylate and methyl methacrylate (used in common with the green sheet) and 4 parts by weight of a mixed solvent of terpineol and butyl carbitol acetate 2 parts by weight of a phthalate ester plasticizer (a mixture of DOP: di-2-ethylhexyl phthalate and DBP: dibutyl phthalate) was added and mixed with stirring. Thereafter, a conductive paste was prepared by mixing with a three-roll mill until there were no aggregates such as Cu powder and resin binder.

(2-2) Conductive paste for wiring 3 parts by weight of a resin binder of a copolymer composition of methyl acrylate and methyl methacrylate (used in common with the green sheet), terpineol and butyl with respect to 100 parts by weight of Cu powder 10 parts by weight of a mixed solvent of carbitol acetate and 10 parts by weight of a phthalate ester plasticizer (mixture of DOP and DBP) were added, and these were stirred and mixed. Thereafter, a conductive paste was prepared by mixing with a three-roll mill until there were no aggregates such as Cu powder and resin binder.

[3. Preparation of resin sheet]
A composition obtained by adding 55 parts by weight of isobutyl methacrylate, 5 parts by weight of DOP, 5 parts by weight of polyethylene glycol, and 150 parts by weight of methyl isobutyl ketone as a resin binder to 100 parts by weight of resin beads of crosslinked isobutyl methacrylate was mixed to form a slurry. . The slurry was molded by the doctor blade method and dried to produce resin sheets 2a having thicknesses of 0.3 mm and 0.8 mm.

  Similarly, a composition in which 55 parts by weight of n-butyl methacrylate, 5 parts by weight of DOP, 5 parts by weight of polyethylene glycol, and 150 parts by weight of methyl isobutyl ketone are added as resin binder to 100 parts by weight of resin beads of crosslinked n-butyl methacrylate. Were mixed to form a slurry. The slurry was molded by the doctor blade method and dried to prepare a resin sheet 2b having a thickness of 0.2 mm.

[4. Production of ceramic structure having convex portion 7]
The green sheet laminate of FIG. 2 was formed using the resin sheets 2a and 2b. That is, a resin sheet-green sheet composite A1 (length 50 mm × width 50 mm × thickness 0.3 mm or 0.3 mm) having a form shown in Table 1 by inserting green sheets into the resin sheets 2a and 2b by the punching method of FIG. 8 mm, convex portion: depth 50 mm × width 5 mm or 10 mm × height 0.5 mm or 0.8 mm) and resin sheet-green sheet composite A2 (length 50 mm × width 50 mm × thickness 0.2 mm, convex portion: depth 50 mm X width 5 mm or 10 mm x height 0.2 mm).

Subsequently, resin sheet-green sheet composites A1 and A2 coated with an adhesive made of an acrylic resin, a solvent, and a phthalate ester plasticizer, and green sheets B1, B2, and B3 having a thickness of 0.2 mm are used. By laminating at a pressure of 9 MPa, five green sheets were integrated to produce a green sheet laminate having internal wiring. Table 1 shows the height T ₁ and the width W ₁ of the protrusions 7 of the green sheet laminate obtained.

Next, this green sheet laminate is placed on an Al ₂ O ₃ setter and is in the vicinity of 80% weight reduction temperature _Ta ° C. of the resin sheet 2a in a nitrogen, hydrogen, and steam mixed atmosphere firing furnace. After the resin sheet 2a is sufficiently removed by holding at 310 ° C. for 3 hours, the resin sheet 2b is sufficiently held at 330 ° C., which is around 80% weight reduction temperature T _b ° C. of the resin sheet 2b, for 3 hours. Was removed.

Thereafter, the resin binder contained in the green sheet is further maintained at 850 ° C., which is in the temperature range exceeding the 20% weight reduction temperature T _c ° C., for 3 hours to further remove the binder, and subsequently fired at 950 to 1000 ° C. Thus, ceramic structures having convex portions 7 of various sizes were produced.

(Comparative Examples 1-4)
Ceramic structures were produced in the same manner as in Examples 1 to 4 except that the resin sheets 2a and 2b were not used.

The evaluation results of the obtained ceramic structure are shown in Table 1. First, attach a protractor display scale to the measuring microscope ("MM-60" manufactured by Nikon Corp.) to measure the angle between the maximum warp part of the side surface of the convex part 7 (the tip part where the unevenness is maximum) and the surface of the ceramic structure. And measured the results. Further, the flatness of the surfaces (upper surface and side surface) constituting the convex portion 7 is evaluated using a high-speed three-dimensional shape measurement system ("EMS98AD-3D100XY" manufactured by Combs) based on those defined in Japanese Industrial Standards. did. In addition, the flatness of the side surface is shown by averaging the flatness of the four surfaces. On the other hand, the result of having measured the curvature radius of the corner | angular part between the surfaces which comprise the convex part 7 while observing with a measuring microscope ("MM-60" Nikon company make) was shown by the average value.

  From Table 1, in Examples 1-4, since pressure lamination was performed in a state in which the resin sheet 2 was fitted, deformation was suppressed, and the angle of 90 ° ± 3 ° or less was formed on all surfaces forming the convex portion 7. A ceramic structure having excellent squareness, flatness, and dimensional accuracy having a flatness of 30 μm or less and a radius of curvature of 50 μm or less could be obtained.

On the other hand, in Comparative Examples 1 to 4, since the resin sheet 2 was not filled, the convex portion 7 was crushed during pressure lamination, and the side surface swelled and deformed, so the flatness increased. Along with this, the curvature radius between the surfaces constituting the convex portion 7 also increased. The degree of deformation increases as the height T ₁ of the convex portion 7 increases and the width W ₁ of the upper surface of the convex portion 7 increases as the height T ₁ of the convex portion 7 increases. The higher the height T _{1, the} larger, and the narrower the width W ₁ of the upper surface of the convex portion 7, the larger it becomes.

(A)-(f) is each process drawing explaining the preparation methods of the resin sheet-green sheet composite body by which the green sheet was inserted by the resin sheet used as the ceramic structure of this invention. (A)-(d) is each process drawing explaining the manufacturing method of the ceramic structure which has a convex part on the surface of this invention.

Explanation of symbols

1: Ceramic green sheet 2, 2a, 2b: Resin sheet 3: Through hole 4: Upper mold 5: Opening 6: Lower mold 6
7: protrusion 8: wiring conductor layer 9 via conductors A, A1, A2: a resin sheet - green sheet composite B1, B2, B3: ceramic green sheet C: ceramic green sheet laminate T _1: height of the projection W ₁ : Width of the upper surface of the convex part D: Ceramic structure having a convex part on the surface

Claims (6)

A state in which a convex portion is formed on the surface and the side surface of the convex portion is substantially perpendicular to the surface, and the surface of the convex portion is formed of a sintered surface that remains sintered. The ceramic structure according to claim 1, wherein an angle formed between a side surface of the convex portion and a surface of the ceramic structure is 90 ° ± 3 °. 2. The ceramic structure according to claim 1, wherein the flatness of the side surface of the convex portion is 30 [mu] m or less. 3. The ceramic structure according to claim 1, wherein the flatness of the upper surface of the convex portion is 30 μm or less. The ceramic structure according to any one of claims 1 to 3, wherein a radius of curvature of a corner between a side surface of the convex portion and a surface of the ceramic structure is 50 µm or less. The ceramic structure according to any one of claims 1 to 4, wherein a radius of curvature of a corner between each surface of the convex portion is 50 µm or less. A method for manufacturing a ceramic structure according to any one of claims 1 to 5, wherein a through hole is formed in a resin sheet using a punching die, and the resin sheet on which the through hole is formed. A step of placing the ceramic green sheet on the resin sheet, and pressing the ceramic green sheet from the ceramic green sheet side using the punching die to fit a part of the ceramic green sheet into the through-hole of the resin sheet. A step of producing a green sheet composite, a step of producing a laminate comprising at least one layer of the resin sheet-ceramic green sheet composite, a binder removal step of thermally decomposing and removing the resin sheet, and the laminate And a step of firing. A method for producing a ceramic structure, comprising:

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