JP2006181307A - Electric heating cooker - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric heating cooker consuming a little power and capable of simply heating and cooking tasty foods without generating electromagnetic wave regarded as harmful for the body. <P>SOLUTION: This electric heating cooker is basically constituted to use radiation heat release energy of a semiconductor heating element attached to a cooking plate, as a heating means of a cooking plate 20 disposed in a cooker body; the heating upper limit temperature of the semiconductor heating element 24 is set to 220°C, or below the carbonization temperature of the foods; and an insulating plate radiating far-infrared rays of 4-15 μm is used as the cooking plate. This constitution can consume a little power, generate no electromagnetic wave, and simply heat and cook the tasty foods. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electric cooking device for food, and more particularly to an electric cooking device using a semiconductor heating element as a heating means.

  Conventionally, as an apparatus for cooking food by using electricity, various cookers such as an oven toaster, a hot plate, an IH cooker, and a microwave oven have been proposed and provided for the convenience of consumers.

  Among these electric heating cookers, the oven toaster uses a quartz glass tube heater (Miraclon heater) with a spiral nichrome wire inside a milky white quartz glass tube, and the hot plate is heat resistant. A sheathed heater integrally formed by housing a highly insulating powder such as magnesium oxide (MgO) and a nichrome wire as a heating element in a heat resistant alloy sheath is used as a heat source.

  On the other hand, an induction heating (IH) cooker generates eddy currents in a cooking vessel formed of, for example, iron, iron enamel, stainless steel, etc. by magnetic lines generated from a spiral coil, and the eddy current generates heat in the cooking vessel. The electromagnetic induction heating method is used to heat the food, and the microwave oven irradiates the moisture contained in the food (foodstuff) with microwaves of 2450 MHz to increase the molecular vibration of the water. The food is heated using the heat generated by the friction.

  However, the quartz glass tube heater (Miraclon heater) and the hot plate sheathed heater in the above-mentioned oven toaster not only cannot be heated with high heat power consumption, but also takes a long rise time for temperature rise. In addition, since the temperature cannot be controlled smoothly, the food to be heated cannot be cooked well, or it is burnt or dried.

In addition, in the IH cooker that employs the induction heating method, the household power source is converted to a high frequency in order to enhance the electromagnetic heating effect, so an electric rice cooker or an electric heating jar that uses electric power at a normal frequency is used. Compared with general household appliances, much larger amount of electromagnetic waves are generated.
Therefore, a demagnetizing coil is arranged at a predetermined location on the cooker body to prevent the heating magnetic flux generated by the electromagnetic induction coil from interfering with the demagnetizing magnetic flux generated by this demagnetizing coil to prevent a large amount of electromagnetic waves from leaking outside the main body. There have been problems in terms of economy because the device is complicated (see Patent Document 1), but the structure is complicated and there is no change in using a large amount of electric power.

  Furthermore, in microwave ovens that use microwaves, for example, the effects of electromagnetic waves in daily life conducted on about 700 healthy children, or indoor electromagnetic waves and power transmission lines conducted on about 350 children with leukemia under 15 years old. According to a nationwide immunological survey on distances, usage of electrical products, etc., the national incidence of childhood leukemia doubles when the average value of electromagnetic waves exceeds 0.4 microstella (4 milligauss). Leakage of harmful electromagnetic waves has always been regarded as a problem for reasons reported by the Environmental Research Institute and the National Cancer Center (see Non-Patent Document 1).

And in the microwave oven, the water molecules are heated by using the vibration (friction) of the water molecules, so foods that contain a certain amount of moisture can be cooked deliciously. Often occurred.
Furthermore, heating by friction of water molecules can reheat cold foods and cook boiled dishes, but it can burn well when cooking grilled foods such as grilling fish. Therefore, for example, the cooking utensil includes an oxide magnetic material and is configured to generate heat when it is irradiated with microwaves (see Patent Document 2), or an oven function is separately installed. Measures are taken.

    JP 2004-288550 A   Mainichi Newspapers, 2002.2.95 "Sunday Mainichi" (pages 35-38)     JP-A-53-92943

  Under such circumstances, there has been a demand for the appearance of an electric cooking device that consumes less power and does not leak electromagnetic waves that are harmful to the body, and that allows food to be cooked deliciously and easily.

  Therefore, the inventors have been concerned about cooking of food to obtain an electric heating cooker that consumes less power and does not leak electromagnetic waves that are harmful to the body, and that allows food to be cooked deliciously and simply. After extensive research, in order to cook foods deliciously, not only the quality of ingredients, but also seasonings such as salt, sugar and spices, as well as thick pots and far infrared rays with small temperature changes can be used. From the fact that professional cooks are using porcelain cooking utensils, we have found that maintaining temperature during cooking is an important factor.

  On the other hand, the inventor used an exothermic functional mixture obtained by mixing and heating a mixture of tin oxide and a solution obtained by dissolving a mixture of lead oxide and lead chloride with an organic solvent using a reducing agent, followed by cooling. For the development of a new semiconductor heat exchange element (hereinafter referred to as a semiconductor heating element for the sake of clarity) that has a very high heat exchange rate and a high degree of freedom in the range of use by being attached to the material and formed into a predetermined shape. Has succeeded.

  This semiconductor heating element has a conventional PTC material (a heat transfer material made of a positive temperature-sensitive semiconductor material) that has a high current load, a short service life, a sudden change in current during use, and a low Curie temperature. While various problems have been pointed out in terms of practical use, such as restrictions on the rise, the power consumption is not only small, but the service life is also long, the temperature can be raised in a short time, and the mixing ratio of tin and lead It has also been confirmed that the upper limit temperature of heat generation can be appropriately set by adjusting.

  In order to solve the above-mentioned problem, the invention according to claim 1 of the present application is characterized in that a semiconductor heating element attached to the cooking plate is used as a heating means of the cooking plate disposed in the cooking device body. is there.

In the invention according to claim 2, as a semiconductor heating element, tin oxide and a solution obtained by dissolving a mixture of lead oxide and lead chloride in an organic solvent are mixed and heated using a reducing agent, and then cooled. A semiconductor heating element in which the obtained exothermic functional mixture is adhered to a heat-resistant substrate and formed into a film is used.
In this case, as a means for adhering the exothermic functional mixture to the heat-resistant substrate, in addition to thermal spraying or vacuum deposition, for example, a method such as mixing and applying a synthetic resin binder to the exothermic functional mixture is also employed. can do.

  On the other hand, the invention according to claim 3 is characterized in that the heat generation upper limit temperature of the semiconductor heating element is set to 220 ° C., which is a temperature at which food does not carbonize.

  Furthermore, the invention according to claim 4 is characterized by using an insulating plate that emits far infrared rays of 4 μm to 15 μm by plasma-coating ceramic on an aluminum alloy plate set to a predetermined thickness as a cooking plate. is there.

  Furthermore, the invention according to claim 5 is a food product characterized in that the food to be heated is cooked in an atmosphere that is held at 180 ° C. to 220 ° C. by the semiconductor heating element and radiates far infrared rays of 4 μm to 15 μm. It is a cooking method.

According to the electric heating cooker according to the present invention;
(1) The power consumption can be reduced to half or less as compared with a conventional electric heating cooker using a quartz glass tube heater (Miraclon heater) or a sheathed heater as a heat source.
(2) Since a semiconductor heating element that generates heat due to collision of electrons is used, electromagnetic waves are not generated, and rapid temperature rise and stable heat generation can be obtained, so that necessary heat energy can be efficiently transmitted to food.
(3) Adjusting the mixing ratio of tin and lead in the semiconductor heating element, setting the upper limit temperature of the heating to a temperature at which food does not carbonize and cooking under far-infrared radiation, so it is delicious regardless of the type of food It can be cooked easily and can be burnt if desired.
(4) In the conventional pneumatic cooking device, when various heat generating means are incorporated in the main body of the apparatus, it is necessary to design an auxiliary mechanism and a storage space for ensuring safety such as temperature control, prevention of ignition, and insulation treatment. However, since the upper limit temperature of heat generation can be set in advance, temperature control and ignition prevention mechanism are not required, the structure is simplified, and the size and weight can be reduced.
And so on.

Next, as a best embodiment of the electric heating cooker according to the present invention, an industrial pottery is illustrated and described in detail below.
1 to 3, a commercial pottery device 10 according to the present invention includes a pottery body 12 formed into a thin box shape using, for example, an austenitic stainless steel plate. A lid 16 having a handle 14 is provided through a hinge 18 so as to be freely opened and closed.

  A shallow inner box 19 having an open top is disposed inside the pottery body 12, and an opening 20 a of a bread-shaped cooking plate 20 attached to the inner box 19 is provided in the lid 16. The inner lid 22 can be closed.

  Further, a semiconductor heating element 24 is attached to the lower side of the pan-shaped cooking plate 20, and a power cord 26 connected to a terminal of the semiconductor heating element 24 is a protector 28 having an overcurrent protection circuit, an abnormal heating prevention circuit, and the like. The semiconductor heating element 24 is connected to a commercial power source (not shown) through a temperature controller 30 that adjusts the heating temperature of the semiconductor heating element 24 in the range of 100 ° C to 220 ° C.

  The cooking plate 20 is formed by plasma coating the ceramic 34 to a thickness of about 60 μm on the outer surface of the aluminum alloy plate 32 having a thickness dimension set to about 2 mm, for example, surface hardness (Vickers hardness) of about 470 to 500 v. , Heat resistance of about 600 ° C., thermal conductivity of 0.53 when pure copper is 1.0, total emissivity when blackbody furnace is 1.0, 0.81, far infrared of 4 μm to 15 μm by heating It is configured as an insulating plate having physical properties such as having a radiation function (see FIG. 4).

Further, the semiconductor heating element 24 is prepared by mixing a main component made of tin oxide and a solution obtained by dissolving a mixture of lead oxide and lead chloride with an organic solvent such as ethyl alcohol using an appropriate reducing agent. For example, a heating function mixture 36 obtained by heating and cooling after mixing a binder made of a synthetic resin such as nylon resin or silicon resin with this heating mixture, for example, A sheet-like heating element is formed by applying and laminating a heat-resistant film 38 formed of a thermoplastic polyimide resin or the like.
In this case, the semiconductor heating element 24 is set to 220 ° C., which is a temperature at which food does not carbonize, by adjusting the mixing ratio of tin oxide and lead mixture to a predetermined ratio.

  In the present embodiment, the semiconductor heating element 24 configured as a sheet-like heating element is attached to the lower surface of the cooking plate 20 using a fluorine-based high temperature adhesive 40 as shown in FIG. Alternatively, as described above, the mixture 36 obtained by adding a reducing agent to the melt of tin oxide and lead mixture and heating the mixture is adhered to the lower surface of the cooking plate 20 by means of thermal spraying or the like, thereby generating a heating element. If it is constituted, it is possible to further simplify the structure and improve the durability while facilitating the production, which is preferable.

  Further, on the lower surface of the semiconductor heating element 24, for example, a heat insulating material 42 made of an inorganic composite material using glass fiber as a reinforcing agent and borate as a binder is attached, and the cooking plate 20 is attached. A heat insulating wool 44 having excellent heat resistance, such as glass wool or silica wool, is disposed in the gap with the box 19.

  In the business-use pottery device 10 according to the present embodiment configured as described above, when the power cord 26 is inserted into a commercial power source and energized, an electronic collision occurs in the heat generating functional mixture 36 that forms the semiconductor heating element 24. Heat generation as a surface starts immediately, and when the set upper limit temperature is reached, this temperature is self-maintained. The heat generated in the semiconductor heating element 24 is quickly transmitted to the cooking plate 20 and rises to a temperature at which cooking can be performed in a few minutes. In this case, it is preferable to initially set the temperature of the cooking plate 20 to around 180 ° C. by appropriately operating the dial 30a of the temperature controller 30.

When the temperature of the cooking plate 20 reaches a temperature at which cooking is possible, the lid 16 is opened and the food F is placed on the cooking plate 20, so that the far infrared rays of 4 μm to 15 μm radiated together with the heat of the cooking plate 20. Thus, the food F is heated and heated from the core of the material.
Note that, when food is placed on the cooking plate 20, the temperature of the cooking plate 20 is slightly lowered. However, the semiconductor heating element 24 quickly moves toward the set temperature due to the collision of electrons changed in accordance with this reduction. Since it raises, the temperature change of the cooking plate 20 at the time of cooking can be made as small as possible, Therefore Heat cooking like a professional can be performed simply.

In addition, the food F is not heated to an unnecessarily high temperature by the heat generation temperature holding function of the semiconductor heating element 24, so that it can be cooked with sufficient moisture without being carbonized or ignited. Even raw vegetables such as can be cooked deliciously without splashing moisture.
In addition, when the food item is to be burnt, the temperature of the cooking plate 20 may be increased to near the upper limit of heat generation by appropriately operating the dial 30a of the temperature controller 30.

  And when cooking food, even if the lid 16 is opened according to the type of food to be targeted, or the lid 20 is closed and the opening 20 a of the cooking plate 20 is closed by the inner lid 22. For example, the semiconductor heating element 24 may be arranged inside the inner lid 22 so that the food placed on the cooking plate 20 can be heated from either the upper or lower side or both sides. Needless to say.

  The semiconductor heating element used in the electric heating cooker according to the present invention can be widely applied as a new heat source that substitutes for gas or the like conventionally used as a heat source for various kitchen appliances.

It is a partially cutaway perspective view showing a commercial pottery as an embodiment of an electric heating cooker according to the present invention. It is a partial cross section explanatory drawing of the commercial pottery shown in FIG. It is plane explanatory drawing which abbreviate | omitted the cover body of the pottery for business shown in FIG. It is A section expanded sectional explanatory drawing which shows the relationship between the cooking plate in the commercial pottery shown in FIG. 2, a semiconductor heating element, and a heat insulating material.

Explanation of symbols

10 Commercial pottery,
DESCRIPTION OF SYMBOLS 12 Bakeware main body 14 Handle 16 Lid 18 Hinge 19 Inner box 20 Bread-type cooking plate 22 Inner lid 24 Semiconductor heat exchange (heat generation) element 26 Power cord 28 Protector 30 Temperature controller 32 Aluminum alloy plate 32
34 Ceramic 36 Exothermic functional mixture 38 Heat resistant film 40 High temperature adhesive 42 Heat insulation material 44 Heat insulation wool.

Claims (5)

  An electric heating cooker that heats and cooks food using electricity, and that uses a semiconductor heating element attached to a cooking plate provided in the cooker body as a heating means.   The semiconductor heating element consists of tin oxide and a solution obtained by dissolving a mixture of lead oxide and lead chloride in an organic solvent, using a reducing agent, and then heating and cooling, and the resulting exothermic functional mixture is converted into a heat-resistant substrate. The electric heating cooker according to claim 1, wherein the electric cooking device is formed in a predetermined shape by adhering to the surface.   The electric heating cooker according to claim 1 or 2, wherein the upper limit temperature of heat generation of the semiconductor heating element is set to 220 ° C.   The electric heating cooking according to any one of claims 1 to 3, wherein the cooking plate is an insulating plate provided with a function of emitting far infrared rays of 4 µm to 15 µm by plasma-coating ceramic on an aluminum alloy plate set to a predetermined thickness. vessel.   A method for cooking food, characterized in that the food to be heated is cooked in an atmosphere that is held at 180 ° C. to 220 ° C. by a semiconductor heating element and that emits far infrared rays of 4 μm to 15 μm.

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