JP2006177901A - Method of manufacturing physical quantity sensor, and lead frame - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily prevent electric connection failure of a lead to a physical quantity sensor chip, in a manufacturing method of a physical quantity sensor. <P>SOLUTION: The lead frame is formed of a metal thin plate having stage sections 7 and 9 for supporting physical quantity sensor chips on their surfaces, a frame section having the leads 17 and 19 arranged around the stage sections, and a connecting section 13 for connecting the stage sections 7 and 9 to the frame section. The base ends 17b of the leads 17 separated from the stage sections 7 and 9 are arranged on substantially the same plane, the stage sections 7 and 9 are arranged tiltingly with respect to the same plane, and surfaces 17c of the tips 17a of the plurality of leads 17 located on the stage section 7 and 9 side are arranged along the surfaces 7a and 9a of the stage sections 7 and 9. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

  The present invention relates to a method for manufacturing a physical quantity sensor for measuring the azimuth and direction of a physical quantity such as magnetism and gravity, and a lead frame used for manufacturing the physical quantity sensor.

2. Description of the Related Art Recently, mobile terminal devices such as mobile phones have appeared that have a GPS (Global Positioning System) function for displaying user position information. In addition to this GPS function, by providing a function for accurately detecting geomagnetism and a function for detecting acceleration, it is possible to detect the azimuth, direction, or movement direction in the three-dimensional space of the mobile terminal device carried by the user. it can.
In order to provide the mobile terminal device with the functions described above, it is necessary to incorporate a physical quantity sensor such as a magnetic sensor or an acceleration sensor in the mobile terminal device. Further, in order to be able to detect the orientation and acceleration in the three-dimensional space by such a physical quantity sensor, it is necessary to incline the installation surface of the physical quantity sensor chip.

Here, various types of physical quantity sensors described above are currently provided. For example, a magnetic sensor that detects magnetism and does not tilt the installation surface is known as one of them. This magnetic sensor is mounted on the surface of a substrate and is one magnetic sensor chip (physical quantity sensor chip) that is sensitive to magnetic components of external magnetic fields in two directions (X and Y directions) orthogonal to each other along the surface. And the other magnetic sensor chip that is placed on the surface of the substrate and is sensitive to the magnetic component of the external magnetic field in the direction perpendicular to the surface (Z direction).
This magnetic sensor measures the geomagnetic component as a vector in a three-dimensional space using the magnetic component detected by the pair of magnetic sensor chips.

  However, this magnetic sensor has the disadvantage that the thickness (height relative to the Z direction) increases because the other magnetic sensor chip is placed in a state of being perpendicular to the surface of the substrate. Therefore, in order to make the thickness as small as possible, a physical quantity sensor (see, for example, Patent Documents 1 to 3) in which the installation surface is inclined as described above is preferably used.

  Further, as this type of physical quantity sensor, there is an acceleration sensor as described in Patent Document 1. In this one-side beam structure acceleration sensor, the acceleration sensor chip (physical quantity sensor chip) is inclined in advance with respect to the mounting substrate, so that even if the sensor packaging is placed on the surface of the mounting substrate, it depends on the inclination direction. In addition, the sensitivity in the predetermined axis direction can be kept high, and the sensitivity in the other axis direction including the direction along the surface of the substrate can be reduced.

  As described above, the physical quantity sensor in which the physical quantity sensor chips are inclined with respect to each other can be reduced in thickness while minimizing the thickness, and has various advantages associated with the inclination. .

  This type of physical quantity sensor includes, for example, as shown in FIG. 17, physical quantity sensor chips 81 and 82, a plurality of leads 83 for electrically connecting the physical quantity sensor chips 81 and 82 to the outside, and these. It consists of the resin mold part 84 fixed integrally. The physical quantity sensor chips 81 and 82 are disposed to be inclined with respect to the lower surface (bottom surface) 84 a of the resin mold portion 84.

As a method of manufacturing the physical quantity sensor 80 described above, the physical quantity sensor chips 81 and 82 are bonded to the stage portions 85 and 86, and then the physical quantity sensor chips 81 and 82 and the leads 83 are wired by the wires 87. And after wiring 87, the stage parts 85 and 86 are inclined.
JP-A-9-292408 JP 2002-156204 A JP 2004-128473 A

However, when the physical quantity sensor described above is manufactured, the lengths of the wires 87 are substantially equal regardless of the distance from the lead 83 to the surfaces 81a and 82a of the physical quantity sensor chips 81 and 82. For this reason, when bonding is performed in accordance with a location where the distance between the lead 83 and the surfaces 81a and 82a of the physical quantity sensor chips 81 and 82 is short, a load is applied to the wire at a location where the distance is long when the stage portions 85 and 86 are inclined. As a result, the wire 87 may be disconnected from the surface 81a, 82a of the physical quantity sensor chip 81, 82 or the wire 87 may be disconnected.
On the other hand, when bonding is performed in accordance with a location where the distance between the lead 83 and the surfaces 81a and 82a of the physical quantity sensor chips 81 and 82 is long, the wire 87 may sag, the wires 87 may come into contact with each other, and a short circuit may occur. May be exposed on the surface of the resin mold portion 84.

  The present invention has been made to solve the above-described problems, and provides a method for manufacturing a physical quantity sensor that can easily prevent poor electrical connection between a lead and a physical quantity sensor chip, and a lead frame used in the method. With the goal.

In order to solve the above problems, the present invention proposes the following means.
The invention according to claim 1 includes a stage portion on which a physical quantity sensor chip is placed on a surface, a frame portion having leads arranged around the stage portion, and a connecting portion that connects the stage portion and the frame portion. The base end of the lead, which is made of a thin metal plate and is spaced apart from the stage portion, is disposed on substantially the same plane, and the stage portion is inclined with respect to the same plane, and the stage portion A lead frame is proposed in which the surfaces of the tips of the plurality of leads positioned on the side are arranged along the surface of the stage portion.

When manufacturing a physical quantity sensor using the lead frame according to the present invention, first, a physical quantity sensor chip is arranged on the surface of the stage portion. Next, wire bonding is performed to electrically connect the bonding pad disposed on the surface of the physical quantity sensor chip and the surface of the tip of each lead by a wire.
Thereafter, the lead frame and the physical quantity sensor chip are accommodated in a mold, and a molten resin is injected into a resin forming space formed by the mold to integrally fix the lead frame and the physical quantity sensor chip. Forming part.

Here, since the surface of the tip of each lead is arranged on the same plane as the surface of the stage part, it is arranged in parallel with the bonding pad of the physical quantity sensor chip installed on the surface of the stage part. become. Therefore, wire bonding for connecting the bonding pad and the tip of the lead can be easily performed.
Moreover, since it is not necessary to change the distance between the tip of the lead and the bonding pad after the wire bonding, it is possible to prevent stress from being applied to the physical quantity sensor chip and the wire.

  The invention which concerns on Claim 2 has a stage part which mounts a physical quantity sensor chip on the surface, a frame part provided with the lead distribute | arranged to the circumference | surroundings, and a connection part which connects the said stage part and the said frame part A preparation step of preparing a lead frame made of a thin metal plate, a stage tilting step of deforming the connecting portion to tilt the stage portions with respect to the frame portion, and the plurality of leads positioned on the stage portion side Lead processing step for arranging the tip of the physical quantity along the inclination direction of the stage portion, an adhesion step for bonding the physical quantity sensor chip to the stage portion, and electrically connecting the physical quantity sensor chip and the tip of the lead A physical quantity center, wherein the stage tilting step and the lead machining step are simultaneously performed by press working. We have proposed a method of manufacturing.

  According to the physical quantity sensor manufacturing method of the present invention, since the stage portion is tilted in advance or a plurality of leads are arranged in the tilt direction of the stage portion before the bonding step or the wiring step, the physical quantity sensor chip is mounted. In a state where the physical quantity sensor chip and each lead are electrically connected by a wire in a bonded state, the stage portion is not moved with respect to the frame portion. Therefore, when manufacturing a physical quantity sensor, it is possible to prevent stress from being applied to the physical quantity sensor chip and wiring wires.

Further, since the stage tilting step and the lead processing step are simultaneously performed by press processing, the tip of the lead can be easily and in a short time arranged at substantially the same height as the bonding pad of the physical quantity sensor chip.
Furthermore, since the tips of the leads are arranged along the inclination direction of the stage portion, the distance between each lead and the surface of the physical quantity sensor chip bonded to the stage portion can be minimized. Therefore, in the wiring process, the length of the wire that electrically connects the physical quantity sensor chip and each lead can be set short.

  According to a third aspect of the present invention, in the physical quantity sensor manufacturing method according to the second aspect of the present invention, in the state in which the stage portion and the tip end of the lead are held in an inclined state during the bonding step and the wiring step, The manufacturing method of the physical quantity sensor characterized by arrange | positioning a stage part, the said lead, and the said frame part to the jig | tool which collectively supports these from the back side is proposed.

  According to the method of manufacturing a physical quantity sensor according to the present invention, since the stage part, the lead, and the frame part are collectively supported by the jig, the stage part and the lead are deformed during the bonding process and the wiring process. Thus, the physical quantity sensor chip can be adhered and the physical quantity sensor chip and each lead can be electrically connected in a stable state.

  According to a fourth aspect of the present invention, in the physical quantity sensor manufacturing method according to the second aspect of the present invention, a plurality of the stage portions are formed in the preparation step, and the wire step is performed by wire bonding in the wiring step. The surface of the physical quantity sensor chip and the surface of the tip of each lead are connected by a wire, and in the wiring step, the direction of the capillary used for the wire bonding is relative to the surface of each stage part and the tip of the lead. A method of manufacturing a physical quantity sensor is proposed in which the lead frame is swung so as to be arranged substantially vertically.

  According to the physical quantity sensor manufacturing method of the present invention, in the wiring process, the lead frame is swung in accordance with the inclination angle of each stage part, and the direction of the capillary is set with respect to the surface of each stage part and the physical quantity sensor chip. Since they are arranged substantially vertically, it is possible to easily set an apparatus required for wire bonding, in particular, arrangement of capillaries.

  According to a fifth aspect of the present invention, in the physical quantity sensor manufacturing method according to the second aspect, at the time of the preparation step, a plurality of the stage portions are formed, and at least two of the stages before the bonding step. The physical quantity sensor chip disposed on each stage portion is bonded to the surface of a single sheet-like die bond tape disposed over the portion, and the two bonding steps are performed via the die bond tape during the bonding step. A method of manufacturing a physical quantity sensor is proposed in which a physical quantity sensor chip is arranged on the surface of each stage part.

  According to the method of manufacturing a physical quantity sensor according to the present invention, the physical quantity sensor can be easily obtained even by arranging the die-bonding tape over the surfaces of the plurality of stage portions in the bonding step, even if the inclination angles of the plurality of stage portions are different from each other. The chips can be arranged on each stage unit, and the relative positions of a plurality of physical quantity sensor chips arranged on each stage unit can be set with high accuracy.

  The invention according to claim 6 is formed of a metal thin plate having a frame portion from which a plurality of leads projecting physical quantity sensor chips to the inside of the frame portion protrudes, and the frame portion is arranged on a flat surface, A lead frame is proposed in which the surfaces of the tips of the plurality of leads on which the physical quantity sensor chips are arranged are arranged in the same plane inclined at a certain angle with respect to the flat surface.

When manufacturing a physical quantity sensor using this lead frame, a physical quantity sensor chip having a plurality of protruding electrodes for electrical connection from the surface of the plate-like physical quantity sensor chip to the tip of each lead is prepared. Then, the physical quantity sensor chip and each lead are electrically connected to each other only by bonding the plurality of protruding electrodes of the physical quantity sensor chip to the surface of each lead.
In the state where the physical quantity sensor chip is arranged as described above, the physical quantity sensor chip is inclined with respect to the frame body portion. For this reason, when manufacturing a physical quantity sensor, it can prevent that a stress is applied to the protruding electrode used as the connection part of a physical quantity sensor chip and the front-end | tip of a lead | read | reed.

  According to a seventh aspect of the present invention, there is provided a physical quantity sensor chip including a lead frame made of a thin metal plate having a frame portion in which a plurality of leads protrudes inward from the frame body portion, and a plurality of protruding electrodes protruding from the surface. A lead processing step in which tips of a plurality of leads on which the physical quantity sensor chip is arranged are arranged in a direction inclined with respect to the frame body portion, and the physical quantities at the tips of the leads. A method of manufacturing a physical quantity sensor is provided, which includes a bonding wiring process for bonding protruding electrodes of a sensor chip.

According to the physical quantity sensor manufacturing method of the present invention, the physical quantity sensor chip can be tilted with respect to the frame body portion only by arranging the protruding electrode of the physical quantity sensor chip at the tip of each lead, and the physical quantity sensor chip. And each lead can be electrically connected to each other.
In addition, since the plurality of leads are arranged in the inclination direction before the bonding wiring process, the tips of the plurality of leads are moved with respect to the frame body portion with the physical quantity sensor chip bonded to each lead. There is nothing. Therefore, when the physical quantity sensor is manufactured, it is possible to prevent stress from being applied to the protruding electrode that is a connecting portion between the physical quantity sensor chip and the tip of each lead.

  According to an eighth aspect of the present invention, in the physical quantity sensor manufacturing method according to the seventh aspect, in the state of maintaining the inclined state of the tip of the lead in the bonding wiring step, the lead and the frame portion are A method of manufacturing a physical quantity sensor has been proposed, which is arranged on a jig that collectively supports these backsides.

  According to the method of manufacturing a physical quantity sensor according to the present invention, since the lead and the frame portion are collectively supported by the jig, the lead can be prevented from being deformed during the bonding wiring process, and is in a stable state. Thus, the physical quantity sensor chip can be installed and electrically connected.

As described above, according to the first aspect of the present invention, when manufacturing a physical quantity sensor, no stress is applied to the physical quantity sensor chip or the wiring wire, so the physical quantity sensor chip and each lead are connected. It is possible to prevent disconnection of the wire to be disconnected and peeling of the wire from the physical quantity sensor chip or the lead, that is, it is possible to easily prevent poor electrical connection between the physical quantity sensor chip and the lead.
Also, since the physical quantity sensor chip bonding pads installed on the surface of the stage part are arranged in parallel to each other, there is no need to change the length of the wire required for wire bonding for each lead, and the tip of the bonding pad and the lead Wire bonding can be easily performed.

According to the second aspect of the present invention, when the physical quantity sensor is manufactured, no stress is applied to the physical quantity sensor chip or the wire for wiring, so that the wire that connects the physical quantity sensor chip and each lead is disconnected. In addition, it is possible to prevent the wire from peeling from the physical quantity sensor chip and the lead, that is, it is possible to easily prevent poor electrical connection between the physical quantity sensor chip and the lead.
In addition, since the stage tilting process and the lead processing process can be performed easily and in a short time, the manufacturing efficiency of the physical quantity sensor can be improved and the manufacturing cost can be reduced.
Furthermore, since the length of the wire that electrically connects the physical quantity sensor chip and each lead can be set short in the wiring process, the manufacturing cost of the physical quantity sensor can be further reduced.

  According to the invention of claim 3, since the physical quantity sensor chip can be adhered and the physical quantity sensor chip and each lead can be electrically connected in a stable state, the electrical connection failure between the physical quantity sensor chip and the lead can be prevented. It can be surely prevented. Moreover, the inclination angle of the physical quantity sensor chip can be maintained at a desired angle, and a highly accurate physical quantity sensor can be provided.

  According to the invention of claim 4, in the wiring process, the lead frame is swung in accordance with the inclination angle of each stage portion, and the direction of the capillary with respect to the surface of each stage portion and the physical quantity sensor chip is substantially reduced. Since it is arranged vertically, it is possible to easily set the apparatus required for the wiring process, particularly the arrangement of the capillaries.

  According to the fifth aspect of the present invention, since the relative positions of the plurality of physical quantity sensor chips arranged on each stage unit can be set with high accuracy, a physical quantity sensor with higher accuracy can be provided. Since a plurality of physical quantity sensor chips can be easily arranged on each stage part, the manufacturing efficiency of the physical quantity sensor can be improved.

Further, according to the inventions according to claim 6 and claim 7, when the physical quantity sensor is manufactured, no stress is applied to the protruding electrode of the physical quantity sensor chip, so that the protruding electrode is peeled off from the tip of the lead. That is, it is possible to easily prevent poor electrical connection between the physical quantity sensor chip and the lead.
Furthermore, since the physical quantity sensor chip and each lead can be electrically connected only by arranging the physical quantity sensor chip on the lead frame, the manufacturing efficiency of the physical quantity sensor can be improved.

  According to the eighth aspect of the present invention, since the physical quantity sensor chip can be installed and electrically connected in a stable state, an electrical connection failure between the physical quantity sensor chip and the lead can be reliably prevented. Moreover, the inclination angle of the physical quantity sensor chip can be maintained at a desired angle, and a highly accurate physical quantity sensor can be provided.

FIG. 1 to FIG. 10 show a first embodiment of the present invention. A magnetic sensor (physical quantity sensor) according to this embodiment has a direction of an external magnetic field by two magnetic sensor chips inclined with respect to each other. The size is measured, and is manufactured using a lead frame formed by pressing and etching a thin metal plate made of a thin plate-like copper material or the like.
As shown in FIG. 1, the lead frame 1 includes two stage portions 7 and 9 for mounting magnetic sensor chips (physical quantity sensor chips) 3 and 5 formed in a rectangular plate shape in plan view, 9, and a stage lead 7, 9 and a connection lead (connection part) 13 for connecting the frame part 11 to each other. The stage part 7, 9, the frame part 11, and the connection part are provided. 13 is integrally formed.

The frame portion 11 includes a rectangular frame portion 15 that is formed in a substantially rectangular frame shape so as to surround the stage portions 7 and 9, and a plurality of frames that protrude inward from the sides 15 a to 15 d of the rectangular frame portion 15. Lead 17 and 19.
A plurality of leads 17 and 19 are provided on each of the sides 15a to 15d of the rectangular frame portion 15, and are intended to be electrically connected to bonding pads (not shown) of the magnetic sensor chips 3 and 5. It is.
The leads 17 projecting from the sides 15b and 15d of the rectangular frame 15 arranged in parallel with the arrangement direction of the two stage units 7 and 9 project from the sides 15a and 15c of the rectangular frame 15 orthogonal to the arrangement direction. It is formed longer than the lead 19.

The two stage portions 7 and 9 are formed in a substantially rectangular shape in plan view so as to place the magnetic sensor chips 3 and 5 on the surfaces 7a and 9a, respectively, and extend along the sides 15b and 15d of the rectangular frame portion 15. Are arranged side by side.
Two stage connecting portions 21 for connecting the two stage portions 7 and 9 to each other are formed at one end portions 7b and 9b of the two stage portions 7 and 9 facing each other. The stage connecting portion 21 is for preventing unnecessary wobbling of the stage portions 7 and 9, and can be easily deformed.

The connecting lead 13 protrudes from the respective corners 15 e to 15 h of the rectangular frame portion 15 toward the other end portions 7 c and 9 c of the stage portions 7 and 9. It connects with the side edge part located in the both ends by the side of the edge parts 7c and 9c. Here, the side end portions of the stage portions 7 and 9 indicate end portions in the width direction of the stage portions 7 and 9 orthogonal to the arrangement direction of the two stage portions 7 and 9.
One end portion of the connecting lead 13 is formed with an easily deformable portion 23 positioned on the other end portion 7c, 9c side of each stage portion 7, 9. The easily deformable portion 23 is formed so as to be easily deformable in order to change the direction of the stage portions 7 and 9 around the reference axis L1 orthogonal to the thickness direction of the rectangular frame portion 15. Each reference axis L1 is orthogonal to the direction in which the two stage portions 7 and 9 are arranged.

  As shown in FIG. 2, a plurality of lead frames 1 are formed on a thin metal plate 25 such as a copper plate through press working, etching, or the like. In the present embodiment, a plurality of lead frames 1 are formed on one metal thin plate 25, but the number and positions of the lead frames 1 to be formed can be changed as appropriate. A through-hole 27 that penetrates in the thickness direction is formed around each lead frame 1 in the metal thin plate 25.

Next, a method for manufacturing a magnetic sensor using the lead frame 1 described above will be described.
First, the lead frame 1 described above is prepared (preparation step), and the lead frame 1 is subjected to press working so that the orientation of the stage portions 7 and 9 is centered on the reference axis L1, as shown in FIGS. A plurality of leads 17 positioned on the side of the stage portions 7 and 9 among the leads 17 arranged in the arrangement direction of the stage portions 7 and 9 are simultaneously tilted with respect to the rectangular frame portion 15 (stage tilting step). Are arranged along the inclination direction of the stage portions 7 and 9 (lead processing step). In FIG. 3, the lead 17 disposed on one side 15d of the rectangular frame portion 15 along the arrangement direction of the two stage portions 7 and 9 is not shown. The structure is the same as that of the lead 17 arranged on the other side 15b.
In the stage tilting process, the direction of the stage portions 7 and 9 changes around the reference axis L1 by deforming the easily deformable portion 23 of the connecting lead 13 and the stage connecting portion 21 by press working. Further, in the stage tilting step, the other end portions 7c, 9c of the stage portions 7, 9 are arranged at positions shifted in the thickness direction of the metal thin plate with respect to the rectangular frame portion 15.
In the lead processing step, the lead 17 can be arranged by bending the middle portion of each lead 17 by press processing.

In order to easily perform the bending process of the lead 17 by pressing, as shown in FIG. 5, the front and back surfaces located in the middle part of the lead 17, or the front surface of the easily deformable part 23 of the lead connecting part 13. It is preferable to form a concave groove 29 in advance on the back surface by photoetching. This photoetching process may be performed, for example, when the lead frame 1 is formed on a metal thin plate.
In this case, since the thickness dimension of the middle portion of the lead 17 serving as a bent portion is formed thinner than the other portion by the groove 29, the middle portion of the lead 17 can be easily bent. The height position of the tip end portion 17a of the lead 17 with respect to the portion 15 can be set with high accuracy.

As shown in FIGS. 3 and 4, in the lead frame 1 subjected to this press working, the distal end portion 17 a of each lead 17 is displaced in the thickness direction with respect to the rectangular frame portion 15 and the proximal end portion 17 b of the lead 17. At the same time, the surface 17c of the tip 17a of each lead 17 is arranged along the surfaces 7a and 9a of the stages 7 and 9, respectively. In the lead frame 1, the stage portions 7 and 9 are inclined at a predetermined angle with respect to the rectangular frame portion 15.
After the stage tilting process and the lead processing process are completed, the lead frame 1 is fixed to the support unit 31 as shown in FIG. The support unit 31 includes a first jig 33 that disposes a metal thin plate 25 on which a plurality of lead frames 1 are formed on a surface 33a, and a second jig that sandwiches the metal thin plate 25 together with the first jig 33. 35.

On the surface 33a of the first jig 33, a plurality of stage support portions 37 equal in number to the lead frames 1 formed on the metal thin plate 25 and a plurality of through holes 27 formed in the metal thin plate 25 are inserted. A protruding portion 39 is formed to protrude.
The stage support portion 37 is formed in a substantially wedge shape, and is configured so that the stage portions 7 and 9 are disposed on the inclined surfaces 37a and 37b, respectively. Although not shown, the front end portions 17a of the leads 17 positioned along the surfaces 7a and 9a of the stage portions 7 and 9 are also arranged on the surfaces 37a and 37b of the stage support portion 37. It has become.

In the state where the stage portions 7 and 9 and the leads 17 are arranged on the stage support portion 37, the position and the inclined state of the stage portions 7 and 9 and the leading end portion 17a of the leads 17 can be maintained by press working.
Further, in the state where the rectangular frame portion 15 is arranged on the surface 33 a of the first jig 33, the projecting portion 39 is inserted into the through hole 27 of the metal thin plate 25, and therefore the stage support portion 37 and the lead frame 1. Can be prevented from shifting with respect to the stage support portion 37. That is, the first jig 33 plays a role of collectively supporting the stage portions 7 and 9 and the frame portion 11.

  The second jig 35 is disposed on the surface 33a of the peripheral edge portion 33b of the first jig 33, and at the tip of the protruding portion 39 inserted into the through hole 27 formed in the peripheral edge portion 25a of the metal thin plate 25. The metal thin plate 25 is prevented from coming out of the projecting portion 39. These two jigs 33 and 35 can be fixed to each other by a fixture 38 such as a bolt or a support in a state where the metal thin plate 25 is sandwiched.

  7 to 9, the magnetic sensor chips 3 and 5 are bonded to the surfaces 7a and 9a of the respective stage portions 7 and 9 with a silver paste (bonding process), and the wires 40 are arranged by wire bonding. Then, the bonding pads 41 arranged on the surfaces 3a and 5a of the magnetic sensor chips 3 and 5 are electrically connected to the leads 17 and 19 (wiring process). In these bonding process and wiring process, the metal thin plate 25 fixed to the support unit 31 is tilted (swinged) so that the surface 7a of one stage 7 or the surface 9a of the other stage 9 is in a horizontal position. It is done in the arranged state.

  In the bonding step, a collet 43 that supplies a silver paste to the surfaces 7a and 9a of the stage portions 7 and 9 is used. The collet 43 is arranged so as to give a silver paste to the lower side in the vertical direction, that is, in the bonding process, the orientation of the collet 43 is substantially perpendicular to the surfaces 7a, 9a of the stage portions 7, 9. Will be placed. This bonding process is performed while adjusting the relative position between the magnetic sensor chips 3 and 5 and the stage unit based on the image data acquired by the alignment camera 45.

In the wiring process, a capillary 47 that supplies the wire 40 downward in the vertical direction is used. That is, in the wiring process, the direction of the capillary 47 is arranged substantially perpendicular to the surfaces 7a and 9a of the stage portions 7 and 9. When wire bonding is performed, the capillary 47 moves between the tips 17a and 19a of the leads 17 and 19 and the bonding pads 41 of the magnetic sensor chips 3 and 5, so that the magnetic sensor by the wire 40 is used. Electrical connections between the chips 3 and 5 and the leads 17 are made. These wires 40 have a substantially constant length regardless of the height position of the bonding pad 41.
The relative position adjustment between the capillary 47 and the tip 17a of the lead 17 and the bonding pad 41 is performed using the same camera as the alignment camera 45 used in the bonding process. The alignment camera 45 is installed in the same apparatus as the collet 43 or the capillary 47 for performing the bonding process and the wiring process.

The bonding process and the wiring process are performed for each of the stage portions 7 and 9 having the surfaces 7a and 9a parallel to each other. That is, as shown in FIG. 7, the bonding process and the wiring process are performed in a state where the surface 7a of one stage portion 7 is horizontally arranged, and then the metal thin plate 25 is tilted (swinged), As shown in FIG. 8, the bonding process and the wiring process are performed in a state where the surface 9a of the other stage portion 9 is horizontally arranged.
In the bonding process and the wiring process, heat and mechanical stress are generated along with the bonding of the magnetic sensor chips 3 and 5 and wire bonding. Therefore, the first jig 33 of the support unit 31 is It is preferable to form it from a metal that can withstand mechanical stress.

  After the completion of the bonding process and the wiring process, the metal thin plate 25 is removed from the support unit 31, and the metal thin plate 25 is sandwiched between the pair of molds E and F as shown in FIG. One mold E has a flat surface E1, and the rectangular frame portion 15 and the leads 19 are arranged on the flat surface E1. The other mold F is formed with a plurality of recesses F2 recessed from the surface F1, and in a state where the rectangular frame portion 15 of the metal thin plate 25 is sandwiched between the pair of molds E and F, the magnetic sensor chip 3 , 5 and the stage portions 7 and 9 and the leads 17 and 19 of each lead frame 1 are accommodated in the recess F2.

Thereafter, the molten resin is injected into a resin forming space defined by the recesses F2 and the flat surface E1 of the molds E and F to form a resin mold portion that fills the magnetic sensor chips 3 and 5 in the resin (molding process). ).
In this molding process, since the entire stage portions 7 and 9 are arranged so as to be shifted in the thickness direction of the thin metal plate 25 with respect to the rectangular frame portion 15, the molten resin is disposed on the back surface 7 d of the stage portions 7 and 9. As a result, the gap between the back surfaces 7d and 9d of the stage portions 7 and 9 and the flat surface E1 of the mold E can be easily filled with the molten resin.

By performing the molding process described above, as shown in FIGS. 11 and 12, the magnetic sensor chips 3 and 5 are fixed inside the resin mold portion 49 in a state of being inclined with respect to each other. The resin used here is preferably a material having high fluidity so that the inclination angle of the magnetic sensor chips 3 and 5 does not change due to the flow of the resin.
Finally, the rectangular frame portion 15 is cut off to cut the connecting lead 13 and the leads 17 and 19 individually, and the manufacture of the magnetic sensor 50 is completed.

  The resin mold part 49 of the magnetic sensor 50 manufactured as described above is formed in a substantially rectangular shape in plan view similar to the rectangular frame part 15 described above. Further, the back surface of the lead 19 and the back surface 17 d of the base end portion 17 b of the lead 17 are exposed on the lower surface 49 a side of the resin mold portion 49. Furthermore, the leading end portion 17 a of the lead 17 is electrically connected to the magnetic sensor chips 3 and 5 by a metal wire 40, and the connecting portion is buried in the resin mold portion 49.

  The magnetic sensor chips 3 and 5 are embedded in the resin mold portion 49 and are inclined with respect to the lower surface 49 a of the resin mold portion 49. Further, the one end portions 3b and 5b of the magnetic sensor chips 3 and 5 facing each other face the upper surface 49c side of the resin mold portion 49, and the surfaces 3a and 5a are inclined at an acute angle. Here, the acute angle indicates an angle θ formed by the front surface 7a of the stage portion 7 and the back surface 9d of the stage portion 9.

The magnetic sensor chip 3 is sensitive to magnetic components in two directions of an external magnetic field, and these two sensitive directions are directions orthogonal to each other along the surface 3a of the magnetic sensor chip 3 (A direction and B). Direction).
The magnetic sensor chip 5 is sensitive to magnetic components in two directions of an external magnetic field, and these two sensitive directions are directions orthogonal to each other along the surface 5a of the magnetic sensor chip 5 (C direction and D direction).
Here, the A and C directions are parallel to the reference axis L1 of the stage portions 7 and 9, and are opposite to each other. The B and D directions are directions orthogonal to the reference axis L1 and are opposite to each other.

Furthermore, a plane defined by the A and B directions along the surface 3a of the magnetic sensor chip 3 (AB plane) and a plane defined by the C and D directions along the surface 5a of the magnetic sensor chip 5 (C -D plane) intersect each other at an acute angle θ.
Note that the angle θ formed by the AB plane and the CD plane is greater than 0 ° and not greater than 90 °. Theoretically, if the angle is greater than 0 °, the orientation of the three-dimensional geomagnetism Can be measured. However, in order to detect the geomagnetic vector component in the direction perpendicular to the AB plane or the CD plane with a sensitivity of a minimum level or more and to calculate the geomagnetic vector so as to reduce the error, the angle θ is set to 20 ° or more. It is preferable to set the angle to 30 ° or more in order to further reduce the error.
For example, the magnetic sensor 50 is mounted on a substrate in a mobile terminal device (not shown). In this mobile terminal device, the direction of geomagnetism measured by the magnetic sensor 50 is shown on the display panel of the mobile terminal device.

According to the manufacturing method of the lead frame 1 and the magnetic sensor 50 described above, the stage portions 7 and 9 are inclined in advance or the plurality of leads 17 are inclined in the inclination direction of the stage portions 7 and 9 before the bonding process and the wiring process. Since the magnetic sensor chips 3 and 5 are bonded to each other and the magnetic sensor chips 3 and 5 and the leads 17 are electrically connected to each other by the wire 40, the stage portions 7 and 9 are connected to the frame portion 11. Is not moved against. Therefore, when the magnetic sensor 50 is manufactured, it is possible to prevent the physical quantity sensor chips 3 and 5 and the wire 40 from being stressed, and the wire 40 that connects the magnetic sensor chips 3 and 5 and the leads 17 and 19 is disconnected. In addition, it is possible to prevent the wire 40 from being peeled off from the magnetic sensor chips 3 and 5 and the leads 17, that is, it is possible to easily prevent poor electrical connection between the magnetic sensor chips 3 and 5 and the leads 17.
Further, since the bonding pads 41 of the magnetic sensor chips 3 and 5 installed on the surfaces 7a and 9a of the stage portions 7 and 9 are arranged in parallel to each other, the length of the wire 40 required for wire bonding is set to the lead 17. It is not necessary to change each time, and wire bonding for connecting the bonding pad 40 and the tip of the lead 17 can be easily performed.

Furthermore, by simultaneously performing the stage tilting step and the lead processing step by press processing, the tip 17a of the lead 17 can be arranged at substantially the same height as the bonding pads 41 of the magnetic sensor chips 3 and 5 in a short time. Therefore, the manufacturing efficiency of the magnetic sensor 50 can be improved and the manufacturing cost can be reduced.
In addition, since the tip portions 17a of the leads 17 are arranged along the inclination direction of the stage portions 7 and 9, the surfaces 3a and 3a of the magnetic sensor chips 3 and 5 adhered to the leads 17 and the stage portions 7 and 9, respectively. The distance to 5a can be minimized. Therefore, in the wiring process, the length of the wire 40 that electrically connects the magnetic sensor chips 3 and 5 and each lead 17 can be set short, and the manufacturing cost of the magnetic sensor 50 can be further reduced.

  Further, since the metal thin plate 25 is fixed to the support unit, in particular, the stage portions 7 and 9, the leading end portion of the lead 17 and the frame portion 11 are collectively supported by the first jig 33. It is possible to prevent the stage portions 7 and 9 and the leads 17 from being deformed during the process and the wiring process. The electrical connection can be made. Therefore, poor electrical connection between the magnetic sensor chips 3 and 5 and the leads 17 can be reliably prevented. Moreover, the inclination angle of the magnetic sensor chips 3 and 5 can be maintained at a desired angle, and a highly accurate magnetic sensor 50 can be provided.

  Further, in the connecting step and the wiring step, the metal thin plate 25 is inclined (swinged) in accordance with the inclination angle of the stage portions 7 and 9, and the surfaces 7 a of the stage portions 7 and 9 and the magnetic sensor chips 3 and 5. , 9a, 3a, and 5a, the orientation of the collet 43 and the capillary 47 is arranged substantially perpendicularly, so that it is easy to set and adjust the apparatus required for the connection process and the wiring process, especially the arrangement setting of the collet 43 and the capillary 47. Can be done. In addition, for example, in the connection process and the wiring process, there is an effect that the focus of the alignment camera 45 can be easily aligned with the entire surfaces 7a and 9a of the stage portions 7 and 9 and the entire surfaces 3a and 5a of the magnetic sensor chips 3 and 5. .

In the above embodiment, the bonding process and the wiring process are performed for each of the stage parts 7 and 9 having the surfaces 7a and 9a parallel to each other. However, the magnetic sensor chip 3 is provided on the two stage parts 7 and 9. , 5 may be performed, and then the wiring process of the stage portions 7 and 9 may be performed.
However, when the bonding process and the wiring process are performed by the same apparatus, it is preferable to perform the bonding process and the wiring process on the other stage part 9 after performing the bonding process and the wiring process on one stage part 7. In this case, it is possible to improve the manufacturing efficiency of the magnetic sensor 50 by reducing the number of times the metal thin plate 25 is inclined (swinged).

In the bonding process, the magnetic sensor chips 3 and 5 are bonded to the surfaces 7a and 9a of the stage portions 7 and 9 via the silver paste. However, the present invention is not limited to this. 9 may be adhered.
That is, in the bonding step, for example, as shown in FIGS. 13 and 14, the magnetic sensor chips 3 and 5 may be bonded to the stage portions 7 and 9 via the adhesive sheet-like die bond tape 51. I do not care. In particular, when a single die bond tape 51 is arranged over the two stage portions 7 and 9, the two magnetic sensor chips 3 and 5 may be bonded to the surface of the die bond tape 51.

A pair of notches 53 are formed in the middle of the position where the magnetic sensor chips 3 and 5 are arranged in the die bond tape 51 of this sheet, perpendicular to the arrangement direction of the magnetic sensor chips 3 and 5. The pair of cutouts 53 can be inserted through the stage connecting portions 21 when the die bond tape 51 is arranged over the two stage portions 7 and 9. That is, the notch 53 serves to position the die bond tape 51 with respect to the stage portions 7 and 9 when the die bond tape 51 is disposed on the two stage portions 7 and 9.
The two magnetic sensor chips 3 and 5 are preferably bonded to the die bond tape 51 in advance before the bonding step.

When this die bond tape 21 is used, even if the inclination angles of the two stage portions 7 and 9 are different from each other, the die bond tape 21 is spread over the surfaces 7a and 9a of the two stage portions 7 and 9 in the bonding process. The magnetic sensor chips 3 and 5 can be easily arranged on the stage portions 7 and 9 simply by arranging them, and the relative positions of the plurality of magnetic sensor chips 3 and 5 arranged on the stage portions 7 and 9 are determined. It can be set with high accuracy.
Therefore, the magnetic sensor 50 with higher accuracy can be provided. In addition, since the plurality of magnetic sensor chips 3 and 5 can be easily arranged on the stage portions 7 and 9, the manufacturing efficiency of the magnetic sensor 50 can be improved.
Further, in the case of this configuration, the die bonding tape 21 and the magnetic sensor chips 3 and 5 can be positioned with respect to the stage portions 7 and 9 by the notch 53 and the stage connecting portion 21, so that the first bonding step is performed for the bonding process. The thin metal plate 25 disposed on the jig 33 may not be inclined (swinged).

Furthermore, the stage tilting step and the lead processing step are performed after the lead frame 1 preparation step, but the present invention is not limited to this, and the lead frame 1 may be performed simultaneously with the lead frame 1 preparation step.
Further, the surface 17c of the tip 17a of the lead 17 bent in the lead processing step is arranged along the surfaces 7a, 9a of the inclined stage portions 7, 9, but the present invention is not limited to this. It may be arranged at a position higher than the surface 17c. However, the surface 17c of the tip 17a of each lead 17 is preferably inclined in a direction parallel to the surfaces 7a, 9a of the stage portions 7, 9.
In the case of this configuration, the distance between the surface 17c of the tip portion 17a of each lead 17 and the surface of the magnetic sensor chips 3 and 5 disposed on the stage portions 7 and 9 can be shortened. The length can be set even shorter.

Next, a second embodiment according to the present invention will be described with reference to FIGS. Here, only differences from the first embodiment will be described, and the same components as those of the lead frame 1 and the magnetic sensor 50 will be denoted by the same reference numerals, and description thereof will be omitted.
As shown in FIGS. 15 and 16, the magnetic sensor chips 55 and 56 used in this embodiment have a configuration in which protruding electrodes are formed on pads on the surface thereof, or so-called flip chip or chip size package ( It may be a surface mount type configuration such as a Chip Size Package). That is, solder balls (protruding electrodes) 59 in which solder is formed in a substantially spherical shape protrude from the back surfaces 55a and 56a of the magnetic sensor chips 55 and 56 located on the lead frame 57 side. Is for electrical connection with the leads 61 and 62 of the lead frame 57.

A plurality of lead frames 57 on which these two magnetic sensor chips 55 and 56 are mounted are formed on a thin metal plate, and include a rectangular frame portion (frame body portion) 63 formed in a substantially rectangular shape in plan view, and a rectangular shape. The frame portion 65 includes a plurality of leads 61 and 62 projecting inwardly from the sides 63 a to 63 d of the frame portion 63. The tip portions 61 a and 62 a of the leads 61 and 62 are arranged at positions that substantially coincide with the arrangement positions of the solder balls 59 of the magnetic sensor chips 55 and 56.
When manufacturing a magnetic sensor using the lead frame 57, the lead frame 57 and the magnetic sensor chips 55 and 56 described above are prepared (preparation step), and the lead frame 57 is subjected to press working to produce a plurality of leads. The surfaces of the tip portions 61a and 62a of 61 and 62 are inclined at a certain angle with respect to the surface (flat surface) of the rectangular frame portion 63 (lead processing step). In this state, the surface of the tip 61a of the lead 61 where the solder ball 59 of one magnetic sensor chip 55 is arranged, and the surface of the tip 62a of the lead 62 where the solder ball 59 of the other magnetic sensor chip 56 is arranged. Are inclined to each other.

In the lead processing step, in the same manner as in the first embodiment, the middle portion of each lead 61, 62 is bent so that it is inclined with respect to the surface of the rectangular frame portion 63 on the same plane. Can be arranged.
After the end of the lead processing step, the lead frame 57 is placed on the first jig 33 similar to that of the first embodiment. In this state, the rectangular frame portion 63 is disposed on the surface 33a of the first jig 33, and the tip portions 61a and 62a of the leads 61 and 62 are disposed on the inclined surfaces 37a and 37b of the stage support portion 37, respectively. Thus, the position and the inclined state of the tips 61a and 62a of the leads 61 and 62 are maintained.

In this state, the solder balls 59 of the magnetic sensor chips 55 and 56 are bonded to the tips 61a and 62a of the leads 61 and 62 (adhesion wiring process). In this bonding wiring process, first, one magnetic sensor chip 55 is disposed in a state where the surface of the lead 61 inclined in one direction with respect to the rectangular frame portion 63 is disposed at a horizontal position. Thereafter, the lead frame 57 is tilted (swinged) together with the first jig 33, and the other magnetic sensor is disposed in a state where the surface of the lead 62 tilted in the other direction with respect to the rectangular frame portion 63 is disposed at a horizontal position. A chip 56 is arranged.
Thereafter, a molding process similar to that of the first embodiment is performed to form a resin mold portion in which the magnetic sensor chips 55 and 56 are embedded in the resin. Finally, the rectangular frame portion 63 is cut off, and the leads 61 and 62 are individually cut to complete the manufacture of the magnetic sensor (not shown).

According to the lead frame 57 and the magnetic sensor manufacturing method described above, since the plurality of leads 61 and 62 are arranged in the inclined direction before the bonding wiring process, as in the first embodiment, the magnetic sensor chip. In a state where the solder balls 59 of 55 and 56 are bonded to the leads 61 and 62, the tip portions 61a and 62a of the plurality of leads 61 and 62 are not moved with respect to the rectangular frame portion 63. For this reason, it is possible to prevent stress from being applied to the solder ball 59 which is a connection portion between the magnetic sensor chips 55 and 56 and the tip portions 61a and 62a of the leads 61 and 62. The solder ball 59 is connected to the tips of the leads 61 and 62. Separation from the portions 61a and 62a can be prevented, that is, poor electrical connection between the magnetic sensor chips 55 and 56 and the leads 61 and 62 can be easily prevented.
Moreover, since the connection between the magnetic sensor chips 55 and 56 and the respective leads 61 and 62 can be completed only by arranging the magnetic sensor chips 55 and 56 on the lead frame 57, the bonding is performed as in the first embodiment. It is not necessary to perform the process separately, and the manufacturing efficiency of the magnetic sensor can be further improved.

Furthermore, since the tip portions 61a and 62a and the rectangular frame portion of the leads 61 and 62 are collectively supported by the first jig 33, the leads 61 and 62 are prevented from being deformed during the bonding wiring process. In addition, the magnetic sensor chips 55 and 56 can be bonded and the magnetic sensor chips 55 and 56 can be electrically connected to the leads 61 and 62 in a stable state. Therefore, poor electrical connection between the magnetic sensor chips 55, 563, 5 and the leads 61, 6217 can be reliably prevented. Moreover, the inclination angle of the magnetic sensor chips 55 and 56 can be maintained at a desired angle, and the magnetic sensor 50 with high accuracy can be provided.
Further, when the magnetic sensor chips 55 and 56 are configured in a chip size package, the magnetic sensor of the same level is downsized as compared with the magnetic sensor chips 55 and 56 used in the first embodiment. It has the advantage that it can be easily broken.

In the above embodiment, the magnetic sensor chips 55 and 56 are provided with the solder balls 59. However, the present invention is not limited to this, and at least the leads 61 and 62 from the back surfaces 55a and 56a of the magnetic sensor chips 55 and 56. It is only necessary that the protruding electrode for electrical connection is formed to protrude.
In the first and second embodiments described above, the frame portion 11 includes the rectangular frame portions 15 and 57 that are formed in a substantially rectangular frame shape in plan view. What is necessary is just to provide the frame part which makes the lead | read | reeds 17, 19, 55, 56 protrude toward an inward side. That is, this frame part may be formed in a circular shape in a plan view, for example, and may have a three-dimensional structure.

Further, the stage portions 7 and 9 are formed in a substantially rectangular shape in plan view, but the present invention is not limited to this, and at least the magnetic sensor chips 3 and 5 are formed so as to be capable of being bonded to the surfaces 7a and 9a. That's fine. That is, the stage portions 7 and 9 may be formed in, for example, a circle or an ellipse in a plan view, or may be provided with a hole penetrating in the thickness direction or formed in a mesh shape. .
Furthermore, although the magnetic sensor chips 3, 5, 55, 56, the leads 17, 19, 61, 62 and the stage portions 7, 9 are integrally fixed by the resin mold portion 49, the present invention is not limited to this. The magnetic sensor chips 3, 5, 55, 56, the leads 17, 19, 61, 62 and the stage portions 7, 9 may be housed in the internal space of the box as a package, and these may be fixed integrally. .

  In the embodiment of the present invention, the description is applied to a magnetic sensor that detects a magnetic direction in a three-dimensional space. However, the present invention is not limited to this, and a physical quantity sensor that measures at least the azimuth and orientation in a three-dimensional space. If it is. Here, the physical quantity sensor may be, for example, an acceleration sensor equipped with an acceleration sensor chip that detects the magnitude and direction of acceleration instead of the magnetic sensor chip.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

It is a top view which shows the lead frame used for the manufacturing method of the magnetic sensor which concerns on the 1st Embodiment of this invention. It is a top view which shows the metal thin plate which forms multiple lead frames of FIG. It is a perspective view which shows the state which performed the stage inclination process and the lead processing process to the lead frame of FIG. FIG. 5 is a schematic side view showing a state in which the lead frame of FIG. 4 is viewed from the side. FIGS. 2A and 2B are side sectional views of leads of the lead frame of FIG. 1, in which FIG. 1A shows a state before a lead processing step, and FIG. 1B shows a state after the lead processing step. FIG. 5 is a cross-sectional view showing a state in which a thin metal plate on which a plurality of lead frames of FIG. 4 are formed is fixed to a support unit. FIG. 5 is a cross-sectional view illustrating a state in which an adhesion process and a wiring process are performed on one stage portion of the lead frame in FIG. 4. FIG. 5 is a cross-sectional view illustrating a state where an adhesion process and a wiring process are performed on the other stage portion of the lead frame of FIG. 4. FIG. 5 is an enlarged perspective view showing a state where an adhesion process and a wiring process are performed on the stage portion of the lead frame of FIG. 4. It is an expansion perspective view which shows the formation method of a resin mold part. It is a top view which shows the magnetic sensor manufactured with the lead frame of FIG. It is sectional drawing which shows the magnetic sensor manufactured with the lead frame of FIG. In the manufacturing method of the lead frame concerning other embodiments of the present invention, it is a sectional view showing an adhesion process. It is a perspective view which shows the die-bonding tape used in the adhesion process of FIG. FIG. 6 is a plan view showing a state in which a magnetic sensor chip is arranged on a lead frame in a lead frame manufacturing method according to a second embodiment of the present invention. FIG. 6 is a cross-sectional view showing a state in which a magnetic sensor chip is arranged on a lead frame in a lead frame manufacturing method according to a second embodiment of the present invention. It is a side view which shows the state which carried out the wire bonding of the conventional magnetic sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,57 ... Lead frame, 3, 5, 55, 56 ... Magnetic sensor chip (physical quantity sensor chip), 7, 9 ... Stage part, 7a, 9a ... Surface, 11, 65 ... -Frame part, 13 ... Connection lead (connection part), 15 ... Rectangular frame part, 17, 19, 61, 62 ... Lead, 17a, 61a, 62a ... Tip part, 17b ... Base end portion, 17c ... surface, 25 ... metal thin plate, 33 ... first jig, 40 ... wire, 47 ... capillary, 50 ... magnetic sensor (physical quantity sensor) , 51 ... Die bond tape, 59 ... Solder balls (projecting electrodes), 63 ... Rectangular frame (frame body)

Claims (8)

It consists of a metal thin plate having a stage part for placing a physical quantity sensor chip on the surface, a frame part having leads arranged around it, and a connecting part for connecting the stage part and the frame part,
The base end of the lead positioned away from the stage portion is arranged on substantially the same plane,
The stage portion is arranged to be inclined with respect to the same plane,
A lead frame, wherein the surfaces of the tips of the leads positioned on the stage part side are arranged along the surface of the stage part. A lead frame made of a metal thin plate having a stage portion on which a physical quantity sensor chip is placed, a frame portion having leads arranged around it, and a connecting portion for connecting the stage portion and the frame portion. A preparation process to prepare;
A stage tilting step of deforming the connecting part and tilting each stage part with respect to the frame part;
A lead processing step in which tips of a plurality of leads positioned on the stage part side are arranged along an inclination direction of the stage part;
Bonding step of bonding the physical quantity sensor chip to the stage part;
A wiring step for electrically connecting the physical quantity sensor chip and the tip of the lead,
A method of manufacturing a physical quantity sensor, wherein the stage tilting step and the lead processing step are simultaneously performed by pressing.   In the bonding step and the wiring step, the stage portion, the lead, and the frame portion are collectively supported from the back side while maintaining the inclined state of the stage portion and the tip of the lead. The physical quantity sensor manufacturing method according to claim 2, wherein the physical quantity sensor is arranged in a jig. In the preparation step, a plurality of the stage portions are formed,
During the wiring process, the surface of the physical quantity sensor chip and the surface of the tip of each lead are connected by wire bonding by wire,
In the wiring step, the lead frame is swung so that the direction of the capillary used for the wire bonding is arranged substantially perpendicular to the surface of each stage portion and the tip of the lead. A method for manufacturing a physical quantity sensor according to claim 2. In the preparation step, a plurality of the stage portions are formed,
Prior to the bonding step, the physical quantity sensor chip disposed on each stage portion is bonded to the surface of one sheet-like die bond tape disposed over at least two of the stage portions,
3. The physical quantity sensor manufacturing method according to claim 2, wherein two physical quantity sensor chips are arranged on the surface of each stage portion through the die-bonding tape during the bonding step. It consists of a metal thin plate having a frame part from which a plurality of leads projecting physical quantity sensor chips from the frame part protrudes,
The frame part is arranged on a flat surface;
A lead frame, wherein surfaces of tips of the plurality of leads on which the physical quantity sensor chips are arranged are arranged on the same plane inclined at a constant angle with respect to the flat surface. A preparation step of preparing a lead frame made of a thin metal plate having a frame portion from which a plurality of leads protrude from the frame portion to the inside thereof, and a physical quantity sensor chip having a plurality of protruding electrodes protruding from the surface;
A lead processing step in which tips of the plurality of leads on which the physical quantity sensor chips are arranged are arranged in a direction inclined with respect to the frame body;
A method of manufacturing a physical quantity sensor, comprising: an adhesion wiring step for adhering a protruding electrode of the physical quantity sensor chip to a tip of each lead. In the bonding wiring step, the lead and the frame portion are arranged on a jig that collectively supports them from the back side while maintaining the inclined state of the tip of the lead. Item 8. A method for manufacturing a physical quantity sensor according to Item 7.

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