JP2006176886A - Copper alloy material for terminal or connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a copper alloy material for electronic and electrical apparatus parts jointly having excellent mechanical properties, conductivity, stress relaxation properties, bending workability and plating properties, particularly, a copper alloy material for electronic and electrical apparatus parts having excellent plating properties and suitable for a terminal and a connector. <P>SOLUTION: The copper alloy material for a terminal or a connector having excellent mechanical strength, conductivity, stress relaxation properties, bending workability and the preventability of deterioration in plating has a composition comprising, by mass, 1.0 to 3.0% Ni, 0.2 to 0.7% Si, 0.01 to 0.2% Mg, 0.05 to 1.5% Sn, 0.2 to 1.5% Zn and <0.005% (including zero) S, and the balance Cu with inevitable impurities. After final plastic working, the surface roughness Ra is >0 to <0.1 μm, or, the surface roughness Rmax is >0 to <2.0 μm, Sn or Sn alloy plating is applied thereto, the thickness of the Sn or Sn alloy plating is 0.1 to 10 μm, the stress relaxation ratio after being kept for 1,000 hr at 150°C is ≤20%, and at the time when 180° bending is performed at the inside bending radius of 0 mm, cracks are not generated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a copper alloy material for electronic and electrical equipment components, and more particularly to a copper alloy material for electronic and electrical equipment components suitable for terminals, connectors, switches, relays, and the like that can be used for miniaturization of electronic and electrical equipment components.

Conventionally, a copper alloy is used as a material for terminals and connectors, and a Cu—Zn alloy, a Cu—Fe alloy excellent in heat resistance, and a Cu—Sn alloy are often used. In particular, inexpensive Cu-Zn alloys are often used in applications such as automobiles, but recent automobile terminals and connectors tend to be miniaturized and may be exposed to harsh environments such as in engine rooms. Due to the large number of Cu-Zn alloys, not only Cu-Fe alloys and Cu-Sn alloys can be used.
Thus, with changes in the environment in use, the characteristics required for the materials for terminals and connectors have become more severe. Copper alloys used for such applications are diverse, including stress relaxation characteristics, mechanical strength, thermal conductivity, bending workability, heat resistance, Sn plating connection reliability, and migration resistance characteristics. In particular, mechanical strength, stress relaxation characteristics, thermal / electrical conductivity, and bending workability are important characteristics.
As a copper-based material that satisfies these strict requirements, a Cu—Ni—Si-based alloy has attracted attention. For example, Patent Document 1 is known. However, even such Cu-Ni-Si alloys are in a state where they cannot be used. Specifically, the size of parts is reduced. For example, in a typical box-type terminal, the tab width of the male terminal to be inserted is reduced from about 2 mm to about 1 mm, so the width of the spring part is about 1 mm, and sufficient connection strength is achieved. It has become difficult to get. In addition, in order to ensure the connection strength at the spring part in connection with the miniaturization, many devices have been devised in the structure of the terminal. As a result, the bending workability required for the material becomes more severe. In conventional Cu-Ni-Si alloys, cracks often occur in the bent part. The stress relaxation characteristics are also the same, and the conventional Cu-Ni-Si alloy cannot be used for a long time due to the increase in stress applied to the material and the high usage environment.

Under such circumstances, for example, the addition of Mg is effective for improving the stress relaxation characteristics. For example, Patent Document 2 shows the effectiveness of Mg. However, although the stress relaxation property is improved by the addition of Mg, the bending workability is deteriorated, and for example, cracks are generated in the 180 ° contact bending test. When used for automobile connectors, it is essential to improve bending workability.
Although studies have been made to improve bending workability, it has been difficult to improve bending workability while maintaining strength and springiness.
Furthermore, if thermal / electrical conductivity is poor, stress relaxation is promoted by its own heat generation, so it is necessary to consider the balance between conductivity and stress relaxation characteristics. Examples of the copper alloy satisfying these conditions include the copper alloy disclosed in Patent Document 3 by the present inventors. However, as described below, there is room for further improvement with respect to plating suitability during plating and prevention of plating deterioration after plating (generally referred to as plating characteristics).
When using a copper-based material for the automobile connector such as the box-type terminal described above, it is common to apply Cu plating to the material as a base and further to Sn plating on the surface layer in order to improve reliability. When the unevenness of the surface of the material is larger than the plating thickness, the plating is repelled without plating on the convex portion, and uniform plating cannot be performed. Moreover, the area of the material-plating interface increases, Cu and Sn are likely to diffuse each other, and plating is easily peeled off due to the formation of Cu-Sn compounds and voids (voids). For this reason, it is necessary to make the material surface as smooth as possible.
In general, terminals and connectors for electric and electronic devices such as portable terminals and personal computers are plated with Au on the base Ni plating, but the surface layer is Au plating and the base is Ni. Even in the case of plating, plating deterioration such as plating peeling as described above occurs due to unevenness of the material surface.
Therefore, a copper alloy that can satisfy the above-described plating characteristics in addition to the above-described characteristics has been demanded.
JP-A 61-127842 JP-A-5-59468 Japanese Patent Application Laid-Open No. 11-222641

In view of these requirements, the present invention has an object to provide a copper alloy material for electronic and electrical equipment parts having excellent mechanical properties, electrical conductivity, stress relaxation properties, bending workability, and plating deterioration prevention properties. And
The present invention provides a copper alloy material for electronic and electrical equipment parts after plating, which is particularly suitable for terminals and connectors, which are excellent in plating characteristics (prevention of plating deterioration).

The present invention solves the above problems by the following (1) to (7).
(1) Ni is 1.0 to 3.0 mass%, Si is 0.2 to 0.7 mass%, Mg is 0.01 to 0.2 mass%, Sn is 0.05 to 1.5 mass%, Zn is 0.2 to 1.5 mass%, and S is less than 0.005 mass% ( A copper alloy material containing Cu and unavoidable impurities and having a surface roughness Ra of more than 0 μm and less than 0.1 μm or a surface roughness Rmax after final plastic working More than 0 μm and less than 2.0 μm, Sn or Sn alloy plating is applied, the thickness of Sn or Sn alloy plating is 0.1 μm to 10 μm, the stress relaxation rate after 1000 hours at 150 ° C. is 20% or less, Terminals with excellent mechanical strength, electrical conductivity, stress relaxation characteristics, bending workability, and plating deterioration prevention, characterized by no cracks when bent 180 ° with an inner bend radius of 0 mm Or copper alloy material for connectors.
(2) Ni consists of 1.0-3.0 mass%, Si 0.2-0.7 mass%, Mg 0.01-0.2 mass%, Sn 0.05-1.5 mass%, Zn 0.2-1.5 mass%, Ag, Co and Cr A copper alloy containing at least one selected from the group in a total amount of 0.005 to 2.0 mass% (provided that Cr is 0.2 mass% or less), S less than 0.005 mass% (including zero), the balance being Cu and inevitable impurities The surface roughness Ra after the final plastic working is more than 0 μm and less than 0.1 μm, or the surface roughness Rmax is more than 0 μm and less than 2.0 μm, and Sn or Sn alloy plating is applied, Sn or Sn alloy plating thickness is 0.1μm to 10μm, stress relaxation rate is 20% or less after 1000 hours at 150 ° C, and no cracking occurs when bending at 180 ° with inner bending radius of 0mm A copper alloy material for terminals or connectors, which is excellent in mechanical strength, conductivity, stress relaxation characteristics, bending workability, and plating deterioration prevention characteristics.
(3) The terminal or connector copper alloy material according to (1) or (2), wherein the terminal or connector copper alloy material is subjected to reflow treatment.
(4) The terminal or connector copper alloy material is subjected to base Cu or Cu alloy plating, and further subjected to Sn or Sn alloy plating thereon (1) or (2) A copper alloy material for the terminal or connector described.
(5) The terminal or connector copper alloy material is subjected to base Cu or Cu alloy plating, further Sn or Sn alloy plating is performed thereon, and reflow treatment is performed. The copper alloy material for terminals or connectors as described in (1) or (2).
(6) Ni is 1.0 to 3.0 mass%, Si is 0.2 to 0.7 mass%, Mg is 0.01 to 0.2 mass%, Sn is 0.05 to 1.5 mass%, Zn is 0.2 to 1.5 mass%, and S is less than 0.005 mass% ( A copper alloy material containing Cu and unavoidable impurities and having a surface roughness Ra of more than 0 μm and less than 0.1 μm or a surface roughness Rmax after final plastic working More than 0 μm and less than 2.0 μm, a base Ni or Ni alloy plating is applied, and Au or Au alloy plating is further applied thereon, and the thickness of the Au or Au alloy plating is 0.01 μm to 2.0 μm, 150 The mechanical strength, conductivity, stress relaxation characteristics, characterized by the fact that the stress relaxation rate after 1000 hours at ℃ is 20% or less and cracks do not occur when bending at 180 ° with an inner bending radius of 0 mm, and Copper alloy material for terminals or connectors that excels in bending workability and prevents deterioration of plating.
(7) Ni is 1.0 to 3.0 mass%, Si is 0.2 to 0.7 mass%, Mg is 0.01 to 0.2 mass%, Sn is 0.05 to 1.5 mass%, Zn is 0.2 to 1.5 mass%, Ag, Co, and Cr. A copper alloy containing at least one selected from the group in a total amount of 0.005 to 2.0 mass% (provided that Cr is 0.2 mass% or less), S less than 0.005 mass% (including zero), the balance being Cu and inevitable impurities The material has a surface roughness Ra of more than 0 μm and less than 0.1 μm after final plastic working, or a surface roughness Rmax of more than 0 μm and less than 2.0 μm, and is coated with underlying Ni or Ni alloy. Furthermore, Au or Au alloy plating is applied thereon, the thickness of Au or Au alloy plating is 0.01 μm to 2.0 μm, the stress relaxation rate after 1000 hours at 150 ° C. is 20% or less, and the inner bending radius Mechanical strength, electrical conductivity, stress relaxation characteristics, bending workability, and plating deterioration characterized by no cracks when bending at 180 ° at 0 mm Excellent sealing properties, terminals or connectors for copper alloy material.
The present invention is an alloy suitable for a terminal and a connector material, but can be applied to any electronic and electrical equipment component material that requires mechanical properties, electrical conductivity, stress relaxation properties, bending workability, and plating properties.

The copper alloy material for electronic and electrical equipment parts of the present invention has mechanical properties (tensile strength, elongation), electrical conductivity, stress relaxation properties, bending workability, and plating deterioration prevention (plating peeling prevention, plating resistance). It has excellent corrosion resistance.
Therefore, the present invention can suitably meet the recent demand for downsizing and high performance of electronic and electrical equipment. In addition, since the plating characteristics are improved over the conventional one, it is suitable for terminals and connectors, but is also suitable as a conductive material for general electronic equipment such as switches and relay materials.

The copper alloy material for a terminal or connector of the present invention is a copper alloy having a suitable mechanical property and thermal / electrical conductivity, by depositing a compound of Ni and Si in a Cu matrix, and a specific amount of Sn, Mg, Zn. It is added to improve the stress relaxation characteristics and bending workability, and to improve the plating performance by Sn or the like by defining the surface roughness so that the surface becomes smooth. The present inventors have been able to realize practically excellent materials for electronic and electrical equipment parts by finely defining the content of the alloy material component and the surface roughness.
The components of the copper alloy material used for the terminal or connector copper alloy material of the present invention (hereinafter also referred to as a copper alloy material for electronic / electric equipment parts) and the surface roughness are limited. Explain why.

First, each component contained in the copper alloy material used for the copper alloy material for electronic and electrical equipment parts of this invention is demonstrated.
It is known that when Ni and Si are added to Cu, a Ni-Si compound is formed, and when this is precipitated in Cu, strength and conductivity are improved.
If the Ni content is less than 1.0 mass%, the target strength cannot be obtained because the amount of precipitation is small. Conversely, if the Ni content exceeds 3.0 mass%, precipitation does not contribute to strength increase during casting and hot working, and it is not possible to obtain the strength suitable for the added amount, but also hot workability and bending work. It will also adversely affect sex.
Since the Si content is thought to be mainly due to the Ni ₂ Si phase of the precipitated Ni and Si compound, the optimum Si addition amount is determined when the addition Ni amount is determined. When the Si content is less than 0.2 mass%, sufficient strength cannot be obtained as when the Ni content is low. Conversely, when the Si content exceeds 0.7 mass%, the same problem as when the Ni content is high occurs.
In the present invention, the Ni content is preferably 1.7 to 3.0 mass%, more preferably 2.0 to 2.8 mass%, and the Si content is preferably 0.4 to 0.7 mass%, more preferably 0.45 to 0.6 mass%. It is preferable to adjust to.

Mg, Sn, and Zn are important additive elements constituting the present invention. These elements are related to each other to achieve a good balance of properties.
Mg significantly improves stress relaxation properties as described above, but has an adverse effect on bending workability. From the viewpoint of stress relaxation characteristics, the higher the content, the better. Conversely, if it is less than 0.01 mass%, the effect of improving the stress relaxation property does not appear, and if it exceeds 0.2 mass%, bending workability is not satisfied.
Sn correlates with Mg and can further improve the stress relaxation characteristics. As seen in phosphor bronze, Sn has an effect of improving stress relaxation characteristics, but the effect is not as great as that of Mg. If Sn is less than 0.05 mass%, the improvement effect does not appear, and conversely if it exceeds 1.5 mass%, the conductivity is lowered.
Zn does not contribute to stress relaxation properties, but can improve bending workability. By adding Zn in an amount of 0.2 to 1.5 mass%, even if Mg is added up to a maximum of 0.2 mass%, it is possible to achieve a level of bending workability that is practically acceptable. Zn also improves the heat-resistant peelability and migration resistance properties of Sn plating and solder plating, and is preferably added in an amount of 0.2 mass% or more. On the contrary, it is not preferable to add more than 1.5 mass% in consideration of conductivity.
In the present invention, the Mg content is preferably 0.03 to 0.2 mass%, more preferably 0.05 to 0.15 mass%, and the Sn content is preferably 0.05 to 1.0 mass%, more preferably 0.1 to 0.5 mass%, Zn content The amount is preferably 0.2 to 1.0 mass%, more preferably 0.4 to 0.6 mass%.

  S is an element that deteriorates hot workability, and the hot workability is improved by regulating the content thereof to less than 0.005 mass%. In particular, the S content is preferably 0 to less than 0.002 mass%.

The invention described in the above item (2) is the above item (1), except that the copper alloy material described in the above item (1) further contains at least one selected from the group consisting of Ag, Co and Cr. It is the same as the copper alloy material for electronic electrical equipment components described. These alloy elements Ag, Co, and Cr can contribute to further strength improvement.
The total content of these alloy elements is 0.005 to 2.0 mass%, preferably 0.005 to 0.5 mass%. If it is less than 0.005 mass%, the effect cannot be obtained sufficiently, and if it exceeds 2.0 mass%, Ag invites high costs, and Co and Cr crystallize (precipitate) coarse compounds during casting and hot working. This is because the strength commensurate with the content cannot be obtained, and hot workability and bending workability are deteriorated.
Ag has an effect of improving heat resistance and an effect of preventing bending of crystal grains and improving bending workability. However, since it is expensive, the Ag content is preferably 0.3 mass% or less.
Co performs the same function as Ni and is more effective than Ni. In addition, since the Co-Si compound has high precipitation hardening ability, the stress relaxation property is also improved. Therefore, it is effective to substitute a part of Ni with Co for members where heat and electrical conductivity are important. However, since it is expensive, the Co content is preferably 2.0 mass% or less.
Cr precipitates finely in copper and contributes to strength improvement. Since Cr lowers the bending workability, its content is 0.2 mass% or less, preferably 0.1 mass% or less.

It should be noted that Fe, Zr, P, Mn, Ti, V, Pb, Bi, Al, and the like can be added at a content of 0.01 to 0.5 mass% as a total amount, for example, so as not to deteriorate the basic characteristics. For example, Mn has an effect of improving hot workability, and it is effective to add 0.01 to 0.5 mass% so as not to deteriorate the conductivity.
In the copper alloy material used in the present invention, the balance other than the above components is Cu and inevitable impurities.
The copper alloy material used in the present invention can be produced by a conventional method and is not particularly limited. However, the ingot is hot-rolled and then cold-worked, for example, cold-rolled, and then recrystallized. It can be manufactured by performing heat treatment for the purpose of forming a solution and immediately quenching. An aging treatment can also be performed as necessary.

Surface roughness is an index representing the surface state of a material.
Ra defined in the present invention is an arithmetic average roughness and is described in JIS B 0601. Rmax is the maximum height, and is the same as that described as Ry in JIS B 0601.
The copper alloy material for electronic / electrical equipment parts of the present invention is manufactured such that the surface after the final plastic working of the copper alloy material having the above composition has the surface roughness Ra or Rmax defined in the present invention. The adjustment of Ra or Rmax can be performed, for example, by rolling or polishing.
In actual operation, the surface roughness of the copper alloy material can be adjusted by rolling using a rolling roll whose surface roughness is adjusted.

The copper alloy material for electronic / electrical equipment parts of the present invention is plated. There is no restriction | limiting in particular in the method, and plating is performed by the method performed normally.
When Sn plating is applied to the copper alloy material for electronic and electrical equipment parts of the present invention, repelling (non-uniform plating) occurs particularly when Ra or Rmax is large. In addition, the interface area between the material and the Sn plating increases, and the diffusion of Cu atoms in the material and Sn atoms in the plating easily occurs. For this reason, Cu-Sn compounds and voids (voids) are likely to be generated, and plating is easily peeled off when held at a high temperature.
When Au plating is applied to the copper alloy material for electronic and electrical equipment parts of the present invention, if the value of Ra or Rmax is large, pinholes are generated and the corrosion resistance deteriorates. Therefore, by specifying Ra to be greater than 0 μm and less than 0.1 μm, or Rmax to be greater than 0 μm and less than 2.0 μm, the plating property is improved. Preferably, Ra is less than 0.09 μm, or Rmax is less than 0.8 μm.
When the surface of the copper alloy material for electronic / electric equipment parts of the present invention is plated with Sn or Sn alloy, discoloration in the atmosphere can be prevented, which is preferable. When Sn or Sn alloy plating is applied, the thickness is more than 0.1 μm and not more than 10 μm. If the plating thickness is less than 0.1 μm, the effect cannot be obtained. If the plating thickness exceeds 10 μm, this effect is saturated and the cost is increased. Plating of Cu or Cu alloy under Sn plating is more preferable because it can prevent plating repelling. The thickness of the Cu or Cu alloy plating is preferably 1.0 μm or less. As the Sn alloy, for example, a Sn—Pb alloy, a Sn—Sb—Cu alloy, and a Cu—Ag alloy, a Cu—Cd alloy, or the like can be used.
In addition, it is preferable to perform a reflow process, and no whisker is generated by this process, and a short circuit can be prevented. Here, the reflow process means a heat melting process, which means heating and melting a plated material, and then cooling to solidify the plating.
Further, it is preferable to apply Au or Au alloy plating to the surface of the copper alloy material for electronic / electrical equipment parts of the present invention, because the connection reliability of the connector or the like can be improved. When Au or Au alloy plating is applied, the thickness is more than 0.01 μm and less than 2.0 μm. Ni or Ni alloy plating may be applied under the Au plating to improve the insertion / extraction life characteristics. The thickness of the Ni or Ni alloy plating is preferably 2.0 μm or less. As the Au alloy, for example, an Au—Cu alloy, an Au—Cu—Ag alloy, and a Ni alloy such as a Ni—Cu alloy and a Ni—Fe alloy can be used.

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.
An alloy having the composition shown in Table 1 was melted in a high frequency melting furnace and cast to a size of 30 mm × 100 mm × 150 mm. Next, these ingots were heated to 900 ° C., held for 1 hour, then processed by hot rolling to 30 mm to 12 mm, and then quickly cooled. In order to remove the oxide film on the surface, both sides were cut down to a thickness of 9 mm and processed to a thickness of 0.27 mm by cold rolling. Thereafter, heat treatment was performed at 750 to 850 ° C. for 30 s and immediately quenched at a cooling rate of 15 ° C./s or more for the purpose of recrystallization and solution of the test material. Next, cold rolling was performed at a reduction rate of 5%, and an aging treatment was performed. The aging treatment conditions are 515 ° C. × 2 hours in an inert atmosphere. After aging, cold rolling, which is the final plastic working, was performed, and the final thickness was adjusted to 0.25 mm. After the final plastic working, annealing was performed at 350 ° C. for 2 hours in order to improve the spring property. The surface of the obtained copper alloy material was polished with water-resistant paper and finished to the surface roughness shown in Table 2. Here, the surface roughness Ra and Rmax were measured with respect to Ra and Rmax between 4 mm in length in the direction perpendicular to the rolling direction, and arbitrary portions were measured 5 times, and average values thereof were used. Various characteristics evaluation was performed about the sample of the copper alloy material for electronic electrical equipment components obtained in this way.

The tensile strength and elongation were measured according to JIS Z 2241, and the conductivity was measured according to JIS H 0505. The results are also shown in Table 2.
The bending workability was evaluated by 180 ° bending with an inner bending radius of 0 mm. The evaluation index was a two-step evaluation based on the presence or absence of cracks.
The evaluation of stress relaxation characteristics was performed in accordance with EMAS-3003, which is a standard of the Japan Electronic Materials Industry Association. Here, the cantilever block type described in paragraph [0038] of JP-A-11-222641 was employed, the load stress was set so that the maximum surface stress was 450 MPa, and the test was conducted in a 150 ° C. constant temperature bath. Table 2 shows the relaxation rate (SRR) after 1000 hours test. Note that SRR of 23% or more was not preferable.

In addition to the samples used in the above tests, a sample plated with Sn or Au was prepared and the plating characteristics were tested as follows.
For the Sn plating, the base Cu plating was applied to the sample with a thickness of 0.2 μm, and the Sn plating was applied with a thickness of 1.0 μm. In addition, Au plating was performed on the sample with a base Ni plating having a thickness of 1.0 μm and an Au plating having a thickness of 0.2 μm.
The plating repellency test was performed by visually observing the appearance of the Sn-plated sample thus obtained.
The plating peel test was performed on the Sn-plated sample by performing 180 ° bending after heating at 150 ° C. for 1000 hours under atmospheric pressure, and visually confirming whether the plating was peeled off (heat-resistant peelability). .
The corrosion resistance test was performed by performing a salt spray test for 96 hours in a 5% NaCl aqueous atmosphere at a temperature of 35 ° C. on the Au-plated sample, and visually judging whether or not a corrosion product was generated.

As is clear from Tables 1 and 2, each sample of the comparative example is inferior in at least one of the characteristics as compared with the sample of the present invention. Specifically, No. 151 of the comparative example did not have a predetermined strength because the contents of Ni and Si were small. Nos. 152 and 153 were inferior in stress relaxation characteristics due to low Mg content. No.154 has poor bending workability due to its high Mg content. No. 155 was inferior in stress relaxation characteristics due to low Sn content. No. 156 had a high Sn content, so the conductivity decreased. No. 157 had a low Zn content, so the adhesion of the tin plating layer was reduced, and No. 158 had a high Cr content, so the bending workability was low. No.159 was discontinued due to high S content and cracking during hot working. No. 160 had a low Zn conductivity because of its high Zn content. No. 161 had poor bending workability due to its high Ni content. No. 162 had a high Si content, resulting in decreased electrical conductivity and inferior bending workability. No.163 was discontinued due to cracking during hot working due to high Ni and Si contents. No. 164 and No. 165 had high Ra and Rmax values, so the Sn plating heat-resistant peelability was poor and Sn plating repelling occurred. Moreover, the corrosion resistance of Au plating was inferior.
In contrast, the inventive examples (samples No. 101 to No. 124) are superior to the comparative examples in all of tensile strength, elongation, conductivity, bending workability, stress relaxation characteristics and plating characteristics. You can see that

Claims (7)

  Ni: 1.0-3.0 mass%, Si: 0.2-0.7 mass%, Mg: 0.01-0.2 mass%, Sn: 0.05-1.5 mass%, Zn: 0.2-1.5 mass%, S: less than 0.005 mass% (including zero) 2) Copper alloy material containing Cu and inevitable impurities in the balance, and after the final plastic working, the surface roughness Ra exceeds 0 μm and is less than 0.1 μm, or the surface roughness Rmax exceeds 0 μm Less than 2.0 μm, Sn or Sn alloy plating is applied, Sn or Sn alloy plating thickness is 0.1 μm to 10 μm, stress relaxation rate is 20% or less after 1000 hours at 150 ° C., inner bending radius For terminals or connectors with excellent mechanical strength, electrical conductivity, stress relaxation characteristics, bending workability, and plating deterioration prevention, characterized by no cracks when bent at 180 ° at 0mm Copper alloy material.   Ni selected from the group consisting of 1.0 to 3.0 mass%, Si 0.2 to 0.7 mass%, Mg 0.01 to 0.2 mass%, Sn 0.05 to 1.5 mass%, Zn 0.2 to 1.5 mass%, Ag, Co and Cr This is a copper alloy material containing 0.005 to 2.0 mass% (provided that Cr is 0.2 mass% or less), S less than 0.005 mass% (including zero), with the balance being Cu and inevitable impurities. After the final plastic working, the surface roughness Ra is more than 0 μm and less than 0.1 μm, or the surface roughness Rmax is more than 0 μm and less than 2.0 μm, Sn or Sn alloy plating is applied, Sn or Sn The thickness of the alloy plating is 0.1 to 10 μm, the stress relaxation rate after 1000 hours at 150 ° C. is 20% or less, and no cracks occur when bending 180 ° with an inner bending radius of 0 mm. A copper alloy material for terminals or connectors that is excellent in mechanical strength, electrical conductivity, stress relaxation characteristics, bending workability, and plating deterioration prevention.   The terminal or connector copper alloy material according to claim 1 or 2, wherein the terminal or connector copper alloy material is subjected to reflow treatment.   3. The terminal or connector according to claim 1 or 2, wherein the copper alloy material for the terminal or connector is subjected to base Cu or Cu alloy plating, and further subjected to Sn or Sn alloy plating thereon. Copper alloy material.   2. The copper alloy material for terminals or connectors is subjected to base Cu or Cu alloy plating, further Sn or Sn alloy plating is applied thereon, and reflow treatment is performed. Or a copper alloy material for a terminal or connector according to 2;   Ni: 1.0-3.0 mass%, Si: 0.2-0.7 mass%, Mg: 0.01-0.2 mass%, Sn: 0.05-1.5 mass%, Zn: 0.2-1.5 mass%, S: less than 0.005 mass% (including zero) 2) Copper alloy material containing Cu and inevitable impurities in the balance, and after the final plastic working, the surface roughness Ra exceeds 0 μm and is less than 0.1 μm, or the surface roughness Rmax exceeds 0 μm Less than 2.0 μm, base Ni or Ni alloy plating is applied, Au or Au alloy plating is further applied thereon, and the thickness of Au or Au alloy plating is 0.01 μm to 2.0 μm, 150 ° C. for 1000 hours The mechanical strength, conductivity, stress relaxation characteristics, and bending workability are characterized by a stress relaxation rate of 20% or less and no cracking when bending 180 ° with an inner bending radius of 0 mm. In addition, copper alloy materials for terminals or connectors that are excellent in preventing deterioration of plating. Ni selected from the group consisting of 1.0 to 3.0 mass%, Si 0.2 to 0.7 mass%, Mg 0.01 to 0.2 mass%, Sn 0.05 to 1.5 mass%, Zn 0.2 to 1.5 mass%, Ag, Co and Cr This is a copper alloy material containing 0.005 to 2.0 mass% (provided that Cr is 0.2 mass% or less), S less than 0.005 mass% (including zero), with the balance being Cu and inevitable impurities. After the final plastic working, the surface roughness Ra is more than 0 μm and less than 0.1 μm, or the surface roughness Rmax is more than 0 μm and less than 2.0 μm, and the base Ni or Ni alloy plating is applied. Au or Au alloy plating is applied on top, the thickness of Au or Au alloy plating is 0.01 μm to 2.0 μm, the stress relaxation rate after 1000 hours at 150 ° C. is 20% or less, and 180 mm at an inner bending radius of 0 mm ° Mechanical strength, electrical conductivity, stress relaxation characteristics, bending workability, and plating deterioration prevention, characterized by no cracks when bending Excellent, terminal or connector copper alloy material.