JP2006165430A - Inductor and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized, low-profile inductance which can be manufactured in an inexpensive facility having superior mass productivity, and to provide a method for manufacturing the inductance part. <P>SOLUTION: The inductor comprises a multilayered magnetic material layer 2, and the layer 2 has a coil 1, a first metal layer 4 formed on at least one surface of a substrate 3, a first metal magnetic material layer 5, a resistance layer 6, and a laminated second metal magnetic material layer 7. The inductor is made of Fe or an Fe alloy, containing the first and second metal magnetic material layers 5 and 7. The ratio of S, contained in the surface of the first metal magnetic material layer 5 at the interface between the first metal magnetic material layer 5, and the resistance layer 6, is set to be not larger than 0.11 mass%. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inductor component used in various electronic devices and a manufacturing method thereof.

  Conventionally, this type of inductance component has a planar component structure from the viewpoint of miniaturization and low profile, and there is an increasing demand for low profile.

  Furthermore, in order to cope with the shift of the switching frequency in the power supply circuit to the high frequency region, it is necessary to reduce the eddy current. As a countermeasure, a method of forming a laminated structure of a magnetic layer and an insulator layer is generally used. (For example, refer to Patent Document 1).

FIG. 7 shows a configuration of a conventional inductance component described in the above publication, and includes a magnetic layer 111 containing Fe, and an insulator layer 112 made of a nitride of a positive element having a specific resistance larger than that of the magnetic body. And a coil conductor portion 113 that applies a magnetic field to the magnetic layer 111.
JP-A-9-55316

  However, in the conventional configuration, in order to secure an inductance value necessary for the power supply circuit, it is necessary to increase the number of magnetic layers 111 or increase the thickness of the magnetic layers 111 per layer. In the conventional configuration method, since it is necessary to use a thin film process using a vacuum apparatus such as vapor deposition or sputtering, the capital investment is high and there is a problem in productivity.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide a small and low-profile inductance component that is inexpensive and excellent in mass productivity and a method for manufacturing the same.

  In order to solve the above-described conventional problems, the present invention includes a coil and a first metal layer, a first metal magnetic layer, a resistance layer, and a second metal magnetic layer laminated on at least one side of a substrate. An inductance component comprising a multi-layer magnetic layer, wherein the first and second metal magnetic layers are Fe containing Fe or Fe alloy and the first metal magnetic layer and the resistance layer at the first interface The inductance component is such that the content ratio of S on the surface of the metal magnetic layer is 0.11% by mass or less.

  The inductance component and the manufacturing method thereof according to the present invention can provide a small and low-profile inductance component that is inexpensive and has excellent mass productivity by using a plating process and the like, and a manufacturing method thereof.

(Embodiment 1)
Hereinafter, an inductance component and a manufacturing method thereof according to Embodiment 1 of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of an inductance component according to Embodiment 1 of the present invention, and FIG. 2 is an enlarged cross-sectional view of a multilayer magnetic layer 2 of the inductance component shown in FIG.

  In FIG. 1, a coil 1 is formed such that a coated conductive wire using a high conductivity material such as copper or silver is wound around the surface of a multilayer magnetic layer 2, and is wound four turns in FIG. There is no limit to the number of turns.

  Moreover, you may provide the insulating layer 8 so that the surface of the said multilayer magnetic body layer 2 may be coat | covered using an insulating resin material etc. as needed. This insulating layer 8 prevents short-circuiting when an inductance component is mounted on a mounting board. The insulating layer 8 is preferably made of an organic resin material such as an epoxy resin, a silicon resin, an acrylic resin, or a mixture thereof. Further, an inorganic filler may be mixed in order to improve heat resistance and mechanical strength.

  Next, the configuration of the multilayer magnetic layer 2 will be described with reference to FIG.

In FIG. 2, a first metal layer 4 having conductivity is formed on at least one surface of a sheet-like substrate 3, and Fe or Fe alloy containing S is formed on the first metal layer 4. And a resistance layer 6 such as copper oxide is further laminated on the first metal magnetic layer 5, and then Fe or Fe alloy containing S is formed on the resistance layer 6. The multi-layer magnetic body layer 2 made of a laminated body in which the second metal magnetic body layers 7 made of, for example, are laminated. In the multi-layer magnetic layer 2 having such a configuration, the resistance layer 6 is formed on the resistance layer 6 by forming a film whose surface can be a conductive metal surface by a reduction reaction or the like. In addition, the second magnetic metal layer 7 can be formed by a plating process. At this time, by using an electroplating process in particular, the second metal magnetic layer 7 having a desired thickness can be formed quickly with simple equipment. Then, by using copper oxide or the like for the resistance layer 6, a Cu film can be formed on the surface of the resistance layer 6 by simply reducing the surface. In particular, since Cu ₂ O of this copper oxide can be formed by a plating process, all processes are processed by the plating process by forming this Cu ₂ O on the resistance layer 6. Is possible.

  In addition, it is desirable from the viewpoint of magnetic characteristics that the first metal layer 4 and the resistance layer 6 are designed to be thin.

Further, the resistance layer 6 is provided so as to separate the first metal magnetic layer 5 and the second metal magnetic layer 7, and the specific resistance of the resistance layer 6 is set to the first and second metal magnetic layers. By making it larger than 5 and 7, the eddy current generated across the first metal magnetic layer 5 and the second metal magnetic layer 7 can be cut off. At that time, if the ratio of the specific resistance values to the first and second metal magnetic layers 5 and 7 is 10 ² or more, the effect is particularly remarkable.

  In this way, the first metal layer 4 is present under the first metal magnetic layer 5, and the resistance layer 6 containing copper oxide is present under the second metal magnetic layer 7. Therefore, it is possible to form the metal magnetic layers 5 and 7 by a plating process. In particular, from the viewpoint of magnetic properties, if an electroplating process can be used for forming the first metal magnetic layer 5 and the second metal magnetic layer 7 that require a considerable film thickness, it is possible to use inexpensive equipment. Thus, it is possible to exert an effect that the production process can be more excellent in mass productivity.

  Next, when forming the first and second metal magnetic layers 5 and 7 by an electroplating process, saccharin containing S is used as a stress relaxation agent. By adding a stress relaxation agent such as saccharin containing S, the first and second metal magnets are excellent in uniformity so that cracks do not occur even when the first and second metal magnetic layers 5 and 7 are thickened. Body layers 5 and 7 can be formed. Therefore, when the first and second metal magnetic layers 5 and 7 having a predetermined thickness or more are formed in the electroplating process, it is indispensable to use a stress relaxation agent such as saccharin containing S.

  However, the presence of S contained in the first metal magnetic layer 5 and the second metal magnetic layer 7 promotes the formation of metal oxides on the surfaces of the first and second metal magnetic layers 5 and 7. I found out that It was also found that S aggregation also occurred in the vicinity of the surface. It was found that the adhesion between the first metal magnetic layer 5 and the resistance layer 6 was deteriorated by the formation of the metal oxide and the aggregation of S on the surface.

  As a result of studying this problem, in order to obtain a multilayer magnetic body layer 2 having good stress adhesion while having a stress relaxation action, the first metal magnetic layer 5 and the resistance layer 6 have a first interface at the interface. It was found that by controlling the composition ratio of S on the surface of the metal magnetic layer 5 to 0.11% by mass or less, the multilayer magnetic layer 2 having good stress relaxation action and good adhesion can be realized.

  Further, when an Fe alloy is used for the first metal magnetic layer 5 and the second metal magnetic layer 7, it is desirable that the composition ratio of Fe is 30% by mass or more. This is an improvement in magnetic properties of having a high saturation magnetic flux density and a low coercive force when the Fe content in the first and second metal magnetic layers 5 and 7 is 30% by mass or more. Can be realized.

  Further, as the Fe alloy used for the first metal magnetic layer 5 and the second metal magnetic layer 7, a metal magnetic material having a composition containing any one of FeNi, FeNiCo, and FeCo has a high magnetic flux density and a low More preferable from the viewpoint of magnetic loss.

  Thus, providing the resistance layer 6 having a large specific resistance capable of reducing the surface, such as the copper oxide, and the first metal at the interface between the first metal magnetic layer 5 and the resistance layer 6. By forming the S content ratio on the surface of the magnetic layer 5 to be 0.11% by mass or less, the first and second having a predetermined thickness that can increase a predetermined inductance value by a plating process. Metal magnetic layers 5 and 7 can be formed, and it is possible to realize a multilayer magnetic body layer 2 having high productivity and high adhesion, and an inductance component capable of handling a large current can be realized. .

  Next, a method for forming the multilayer magnetic layer 2 will be described in detail.

  First, a sheet-like base material 3 is prepared. The substrate 3 may be made of any material such as an inorganic material, an organic material, and a metal material, but can be appropriately selected from the viewpoint of the shape, strength, cost, and reliability of the inductance component.

  Then, the first metal layer 4 is formed on at least one surface of the substrate 3 by electroplating or electroless plating process.

  In addition, if the base material 3 is a metal material at this time, since the base material 3 can serve as the 1st metal layer 4, a structure can be simplified.

  The first metal layer 4 is provided in order to facilitate the formation of the first metal magnetic layer 5 by an electroplating process, and is preferably a metal such as Cu having excellent conductivity, and more magnetic. It is more preferable to use Fe, Ni, and Co that are included from the viewpoint of magnetic characteristics. Accordingly, when a metal such as Cu that does not have magnetism is used, the first metal layer 4 is desirably thin.

  Next, the first metal magnetic layer 5 is formed on the first metal layer 4 by an electroplating process. As the material of the first metal magnetic layer 5, a metal magnetic material having a composition made of Fe or an Fe alloy is preferable from the viewpoint of magnetic flux density and magnetic loss. At this time, the plating bath used in the electroplating step contains Fe ions or other metal ions, and an organic substance containing S such as saccharin as a stress relaxation agent is added to the plating bath. By using such a plating bath, it becomes possible to easily contain S atoms in the first metal magnetic layer 5. For example, when saccharin is used as a stress relaxation agent, the effect can be seen by adding 0.1 to 5 g / L in the plating bath. In addition, since the quantity which exhibits a stress relaxation effect | action changes with plating conditions, ie, current density, it can be controlled by appropriately setting conditions.

  Next, the method of reducing the composition ratio of S in the vicinity of the surface of the first metal magnetic layer 5 to 0.11% by mass or less involves etching the surface of the first metal magnetic layer 5 or changing the plating conditions. The method of selecting is given.

  Thereafter, a resistance layer 6 containing copper oxide is formed on the first metal magnetic layer 5. Examples of the method for forming the resistance layer 6 include an electrodeposition method, a plating process, and a sputtering method. However, if the resistivity is larger than the specific resistance with the first and second metal magnetic layers 5 and 7, the manufacturing method is limited. There is no. In particular, when the resistance layer 6 contains at least copper oxide, the surface of the resistance layer 6 can be easily reduced, and the thickness of the second magnetic metal layer 7 formed on the resistance layer 6 can be reduced. It was found that even in the case of a thick film of 10 to 20 μm, it has good adhesion.

  Moreover, since the inductance value as an inductance component decreases as the ratio of the resistance layer 6 to the total thickness of the multilayer magnetic layer 2 increases, it is desirable to make the thickness of the resistance layer 6 thinner. For example, even when a current of 30 A is passed through a choke coil or the like, if the resistance layer 6 has a thickness of 1 μm, its function can be sufficiently exerted.

  The laminated body having such a structure is used as the multilayer magnetic body layer 2, and if necessary, the insulating layer 8 such as silicon resin or epoxy resin is coated on the surface of the multilayer magnetic body layer 2 for insulation treatment, and then coated. By forming the coil 1 using a copper wire or the like, an inductance component can be obtained.

  In addition, although the structure of the said multilayer magnetic body layer 2 has been demonstrated by the structure laminated | stacked on the single side | surface of the base material 3, it can also be set as the multilayer magnetic body layer 2 arrange | positioned on both surfaces of the base material 3, and electromagnetic performance , And can be appropriately selected from the viewpoints of shape and cost. For example, if the total thickness of the metal magnetic layers 5 and 7 is increased, an inductance component having a large inductance value can be obtained. When the total thickness of the multilayer magnetic layer 2 is constant, the first and second metal magnetisms can be obtained. If the number of body layers 5 and 7 is increased, an inductance component having excellent high frequency characteristics can be obtained.

  A multilayer magnetic body having a high saturation magnetic flux density and a high magnetic permeability capable of handling a large current by using Fe or an Fe alloy as a main component of the first metal magnetic layer 5 and the second metal magnetic layer 7 The layer 2 can be realized, and as the Fe alloy material used for this, it is preferable to use a magnetic alloy material such as Fe—Ni, Fe—Ni—Co, or Fe—Co.

  Further, the composition of the first and second metal magnetic layers 5 and 7 of the multilayer magnetic layer 2 is not necessarily the same, and the effect can be obtained by making the main component Fe or Fe alloy as described above. It is done.

  A conductor layer may be formed on the resistance layer 6 as a buffer layer.

  By using the inductance component having the configuration as described above, it is possible to form the multilayer magnetic body layer 2 using a plating process, without using expensive equipment such as vapor deposition or sputtering equipment, It is possible to provide a small and low-profile inductance component that is inexpensive and excellent in mass productivity, and a method for manufacturing the same.

  Moreover, according to the configuration of the present invention, the first and second metal magnetic layers 5 and 7 having a thickness of 10 to 20 μm can be easily formed, and an inductance component having a large inductance value can be realized.

  Furthermore, since the adhesion strength of the multilayer magnetic body layer 2 can be improved by enhancing the adhesion between the layers, an effect that an inductance component having high reliability can be realized can also be exhibited.

  Next, a method for manufacturing the inductance component will be described.

  The inductance component manufacturing method shown in FIGS. 1 and 2 can be manufactured through the following manufacturing process.

  First, for example, a polyimide film having a thickness of 20 μm is prepared as the base material 3, and Ni having a thickness of 0.5 μm is formed on one side of the base material 3 as the first metal layer 4 by electroless plating. Next, an Fe—Ni alloy having a thickness of 20 μm is formed as a first metal magnetic layer 5 on the first metal layer 4 by electroplating.

  Then, the content ratio of S on the surface of the first metal magnetic layer 5 is set to 0.11% by mass or less by etching.

Next, Cu ₂ O is formed on the first metal magnetic layer 5 as a resistance layer 6 having a thickness of 1 μm by electrolytic plating.

  Next, the multilayer magnetic body layer 2 can be produced by forming a 20 μm thick Fe—Ni alloy as the second metal magnetic body layer 7 by electroplating on the resistance layer 6.

  Thereafter, an epoxy resin or the like is coated on the surface of the multilayer magnetic layer 2 as an insulating layer 8 as necessary, and then a copper wire having a diameter of 200 μm is wound around a predetermined number of turns, thereby providing the inductance shown in FIG. Parts can be manufactured.

  As described above, according to the inductance component and the manufacturing method thereof of the present invention, it is possible to provide a small and low-profile inductance component that is inexpensive and excellent in mass productivity, and a manufacturing method thereof.

(Embodiment 2)
Hereinafter, an inductance component and a manufacturing method thereof according to Embodiment 2 of the present invention will be described with reference to the drawings.

  3 is a perspective view of an inductance component according to Embodiment 2 of the present invention, and FIG. 4 is a cross-sectional view taken along the line AA in FIG. FIG. 5 is an enlarged sectional view of the multilayer magnetic layer in FIG.

  In FIG. 3 and FIG. 4, the coil 11 is disposed so as to be built in the coil insulating portion 12, and this coil insulating portion 12 is for preventing the coil 11 from being short-circuited. The coil 11 is formed by, for example, patterning a high conductivity material such as copper or silver on the coil insulating portion 12 such as a resin film by a plating process and then laminating.

  The upper stage of the coil 11 is spirally wound from the terminal portion 10b on one side of the inductance component toward the core, and then moves to the lower stage of the coil 11 through the through-hole electrode 15 at the center. It is formed while being wound so as to spread in a spiral toward the terminal portion 10a provided in.

  The upper and lower coils 11 must be wound in the same direction. As a result, a current flows from the upper stage to the lower stage of the coil 11 via the through-hole electrode 15 without canceling out the magnetic flux between the upper stage and the lower stage of the coil 11, and a large inductance value can be realized.

  Needless to say, the coil 11 can be formed by embedding it in the coil insulating portion 12 after processing a copper wire or processing a thin metal plate. Moreover, although the thickness (cross-sectional area) of this coil 11 changes with electronic devices of the use used, in order to respond | correspond at least to a large current, the thickness of 10 micrometers or more is required.

  Further, the coil 11 may be one stage or three stages or more instead of the two stages as shown in FIG.

  Next, the multilayer magnetic layer 22 is arranged on the upper and lower surfaces of the coil 11 configured as described above. The multilayer magnetic layer 22 can be arranged on both sides to further increase the inductance value.

  Moreover, the insulating layer 8 should just coat | cover at least the surface layer of the multilayer magnetic body layer 22 from the role of ensuring insulation. This insulating layer 8 is for preventing a short circuit when an inductance component is mounted on a mounting board or the like. The insulating layer 8 is preferably an organic resin material such as an epoxy resin, a silicon resin, or an acrylic resin from the viewpoint of productivity.

  With the above configuration, eddy currents generated in the thickness direction of the multilayer magnetic layer 22 can be suppressed, so that the inductance value can be increased and heat generation from the inductance component can also be suppressed. it can.

  Furthermore, by forming the coil 11 in a flat plate shape, it is possible to realize an inductance component with a lower profile, and by providing the coil 11 with multiple stages, an inductance component with a sufficiently large inductance value can be obtained. Can be realized.

  In addition, the coil 11 can be formed by plating using copper, silver or the like, and since the coil 11 has a quadrangular cross section, a low profile coil 11 having a high space factor can be obtained.

  In particular, since a fine electrode pattern can be formed on a plane by such a patterning technique, a low-profile inductance component can be realized as compared with the configuration of the first embodiment.

  Next, the configuration of the multilayer magnetic layer 22 in the second embodiment of the present invention will be described with reference to FIG.

  In FIG. 5, the basic structure of the laminated body is almost the same as that of the multilayer magnetic layer 2 of the first embodiment, and the difference is that the resistance layer 6 and the second metal magnetic layer 7 are further laminated. It is to be formed. As described above, the multilayer magnetic body layer 22 in which the laminated body of the resistance layer 6 and the second metal magnetic body layer 7 is laminated in two or more layers can increase the inductance value and increase the multilayer magnetic body layer. If the total number of magnetic layers is increased when the total thickness of 22 is constant, an inductance component having excellent high frequency characteristics can be obtained.

  Furthermore, by making the S content ratio of the surface of the first metal magnetic layer 5 and the second metal magnetic layer 7 disposed on the lower surface of the resistance layer 6 0.11% by mass or less, adhesion is improved. An excellent multilayer magnetic layer 22 can be realized.

  Further, by making the specific resistance of the resistance layer 6 larger than the specific resistance of the first and second metal magnetic layers 5 and 7, the multilayer magnetic layer 22 having excellent magnetic properties can be realized.

  In the second embodiment, the main component of the first and second metal magnetic layers 5 and 7 is made of Fe or an Fe alloy so that the multilayer magnetic layer 22 having a high saturation magnetic flux density and a high magnetic permeability is obtained. Obtainable.

  Moreover, since the inductance value as an inductance component decreases as the proportion of the resistance layer 6 to the total thickness of the multilayer magnetic layer 22 increases, it is desirable to make the thickness of the resistance layer 6 thinner.

  About the inductance component of this Embodiment 2 comprised as mentioned above, the manufacturing method is provided below.

  Of the inductance components in the second embodiment, the coil 11 can be manufactured through the following manufacturing process. First, after a resist film is formed on a substrate such as a polyimide film so as to form a lower coil pattern of the coil 11, a metal having high conductivity such as copper or silver is formed on this substrate to a thickness of several tens of μm by a plating process. The step of forming the lower coil pattern of the coil 11 in this way, the next forming the lower coil pattern of the coil 11, a resist film is again provided, and the place where the through hole electrode 15 is formed is etched or the like. Drill holes. Thereafter, a resist film for forming the upper coil pattern of the coil 11 is formed, and a metal such as copper or silver is formed on the substrate on which the resist film is formed to have a thickness of several tens of μm by the plating process. 11 upper coil pattern is formed. Thereafter, the sheet-like coil 11 shown in FIG. 4 can be manufactured through a process of covering the upper coil pattern.

  Next, the multilayer magnetic body layer 22 is formed on the sheet-like coil 11 formed as described above. The basic manufacturing process of the multilayer magnetic body layer 22 is substantially the same as that of the first embodiment. A resistance layer 6 and a second metal magnetic layer 7 are further laminated on the multilayer magnetic layer 22 shown in FIG. 2 by the same process. With such a configuration, it is possible to realize an inductance component capable of controlling frequency characteristics in a high frequency range and suppressing eddy current loss to a minimum and a manufacturing method thereof. And the multilayer magnetic body which improved adhesiveness and was excellent in reliability by making S content ratio of the surface of the 2nd metal magnetic body layer 7 arrange | positioned in the lower surface of the resistance layer 6 into 0.11 mass% or less Layer 22 can be made. Moreover, it becomes possible to manufacture using the base material 3 of a big size by setting it as such a manufacturing method.

  In addition, the multilayer magnetic body layer 22 in which the laminated body is formed on both surfaces of the substrate 3 can be similarly produced.

  As described above, with the configuration of the inductance component as in the second embodiment, in addition to the operation described in the first embodiment, even when operating in a high frequency region, there is little loss due to eddy current, and a large inductance value. It is possible to provide an inductance component having the above and a manufacturing method thereof.

(Embodiment 3)
Hereinafter, an inductance component and a manufacturing method thereof according to Embodiment 3 of the present invention will be described with reference to the drawings.

  FIG. 6 is a cross-sectional view of an inductance component according to Embodiment 3 of the present invention.

  In FIG. 6, the configuration and forming method of the coil 11 are the same as those in the second embodiment, and the description thereof is omitted here. Here, the difference from FIG. 4 of the second embodiment is that the through hole portion 16 is provided in the core portion of the coil 11.

  Further, a multilayer magnetic layer 23 is provided on the inner wall of the through hole portion 16, and as a result, the multilayer magnetic layer 23 provided separately on the upper and lower surfaces of the coil 11 is provided with the multilayer magnetic layer provided on the inner wall of the through hole portion 16. They are connected via the body layer 23.

  With such a configuration, the magnetic gap is eliminated, the leakage magnetic flux is further reduced, and an inductance component having a larger inductance value can be obtained.

  In FIG. 6, the gap between the through-hole portions 16 can be filled with a magnetic material filled with the insulating layer 8, and further improvement in magnetic characteristics can be expected.

  Further, an insulating layer 8 is provided on the surface of the multilayer magnetic layer 23. This insulating layer 8 is provided to prevent a short circuit, and an insulating inorganic material, organic material, and a composite thereof are preferable.

  The multilayer magnetic layer 23 has the same configuration as that shown in FIG. 2 or FIG. 5 and can be formed by a plating process, so that it is possible to provide an inductance component with excellent productivity and a method for manufacturing the same.

  For example, it is difficult to form the multilayer magnetic layer 23 by sputtering, vapor deposition or the like on the through hole 16 having a diameter of 1 mm or less and a depth of 0.1 mm or more, but it is formed by a plating process. Thus, the multilayer magnetic body layer 23 can be easily formed on the inner wall of the through hole portion 16.

  A method for manufacturing the inductance component configured as described above will be described below. The basic method of manufacturing the inductance component according to the third embodiment is substantially the same as that of the second embodiment, and only the contents that are different will be described.

  First, after the sheet-like coil 11 according to the second embodiment is formed, the through hole portion 16 is provided in the core portion of the coil 11 by punching or laser processing, and then the upper and lower surfaces of the coil 11 are formed. When the multilayer magnetic layer 23 is provided, the multilayer magnetic layer 23 is also provided on the inner wall of the through hole portion 16. By forming the multilayer magnetic material layer 23 on the inner wall of the through hole portion 16, the multilayer magnetic material layer 23 integrated with the upper and lower surfaces of the coil 11 can be obtained.

  As described above, the inductance component and the manufacturing method thereof according to the third embodiment can realize a small and low-profile inductance component with better adhesion.

  As described above, the inductance component and the manufacturing method thereof according to the present invention are excellent in mass productivity, have little loss due to eddy currents even when operated in a high frequency region, and can obtain sufficient inductance even if the size and height are reduced. In particular, it is useful for applications of inductor components used in power supply circuits of various electronic devices.

The perspective view of the inductance component in Embodiment 1 of this invention Expanded cross-sectional view of the same magnetic layer The perspective view of the inductance component in Embodiment 2 of this invention Sectional drawing in the AA part of the same FIG. Expanded cross-sectional view of the same magnetic layer Sectional drawing of the inductance component in Embodiment 3 of this invention Exploded perspective view of a conventional inductance component

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11 Coil 2,22,23 Multilayer magnetic body layer 3 Base material 4 1st metal layer 5 1st metal magnetic body layer 6 Resistance layer 7 2nd metal magnetic body layer 8 Insulating layer 10a Terminal part 10b Terminal part 12 Coil insulation 15 Through-hole electrode 16 Through-hole

Claims (13)

An inductance component comprising a coil and a multi-layer magnetic material layer in which a first metal layer, a first metal magnetic material layer, a resistance layer, and a second metal magnetic material layer are laminated on at least one surface of a substrate, The first and second metal magnetic layers are made of Fe containing Fe or Fe alloy, and the S content ratio of the surface of the first metal magnetic layer at the interface between the first metal magnetic layer and the resistance layer is set to 0. Inductance parts with 11 mass% or less. The inductance component according to claim 1, wherein the resistance layer and the second metal magnetic layer are repeatedly laminated. The inductance component according to claim 2, wherein the content ratio of S on the surface of the second metal magnetic layer provided on the lower surface of the resistance layer is 0.11% by mass or less. The inductance component according to claim 1, wherein the resistivity of the resistance layer is greater than the resistivity of the first metal magnetic layer and the second metal magnetic layer. The inductance component according to claim 2, wherein the specific resistance of the resistance layer is larger than the specific resistance of the second metal magnetic layer. The inductance component according to claim 1, wherein the Fe alloy has a Fe content of 30 mass% or more. The inductance component according to claim 6, wherein the Fe alloy includes any one of Fe—Ni, Fe—Ni—Co, and Fe—Co. The inductance component according to claim 1, wherein the first metal layer includes at least one of Fe, Ni, and Co. The inductance component according to claim 1, wherein the outermost layer of the multilayer magnetic layer is covered with an insulating layer. The inductance component according to claim 1, wherein the base material and the first metal layer are made of the same metal. An inductance component comprising a coil, a through-hole portion formed in the core portion of the coil, and a multilayer magnetic body layer, the multilayer magnetic body layer being continuously connected to the inner wall of the through-hole portion and the upper and lower surfaces of the coil The inductance component according to claim 1 provided. A first step of forming a coil; a first metal layer and a first metal magnetic layer formed on at least one surface of the substrate; and a composition ratio of S on the surface of the first metal magnetic layer of 0. An inductance component comprising: a second step of controlling to 11% by mass or less; and a third step of forming a second metal magnetic layer after forming a resistance layer on the first metal magnetic layer. A method of manufacturing an inductance component, wherein the first and second metal magnetic layers are formed using Fe containing Fe or an Fe alloy. 12. The method of manufacturing an inductance component according to claim 11, wherein at least the first and second metal magnetic layers are formed by a plating process.

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