JP2006165000A - Dicing film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a single-layer or a three-layer dicing film having more excellent expandability and property for accommodating/collecting the used sheet to a rack. <P>SOLUTION: The dicing film is provided with following three means: a first means <non-oriented film A composed of a blended resin A of, 90 to 97 mass% of a particulate thermoplastic acrylic resin (PAA resin particle) in which a soft acrylate resin forms a core layer and a semi-hard or hard methacrylate resin forms a shell layer, and 10 to 3 mass% of a hydrogenated resin (hydrogenated SD soft resin) of a copolymer soft resin composed of styrene and an aliphatic diene>; a second means <non-oriented film B formed of a blended resin B including a terpene resin of 5 to 23 parts by mass in the blended resin of 100 parts by mass of the PAA resin particle of 80 to 90 mass% and the hydrogenated SD soft resin of 20 to 10 mass%>; and a third means <three-layer film formed of the non-oriented film B as the intermediate layer and the non-oriented film A as the front and rear surface layers>. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an improved dicing film for dicing a semiconductor wafer or the like into chips.

A semiconductor wafer made in advance with a large area is diced (cut) into chips, and it is necessary to fix the wafer during dicing. A dicing sheet is used for fixing and dicing.
The sheet is basically composed of an adhesive layer for fixing the wafer and a resin layer (dicing substrate film) that receives the cutting of the dicing cutter. As the dicing substrate film, a polyolefin film or a polyvinyl chloride film is generally used, but the polyvinyl chloride film is in decline due to environmental problems.

There are mainly the following two problems in dicing a semiconductor wafer (hereinafter simply referred to as a wafer).
One of them is chips (dicing waste) and cracks (dicing cracks) of the dicing film that are generated during dicing. Patent technology that attempts to solve this problem is also disclosed. For example, a film made of a polyolefin resin such as polyethylene, a copolymer of ethylene and a vinyl monomer, polypropylene, polymethylpentene, etc., irradiated with an electron beam or γ ray of 1 to 80 Mrad is used as a dicing substrate film, and ethylene is a main component. A copolymer with methyl methacrylate is used as a dicing substrate film (see, for example, Patent Documents 1 and 2).

And the second is expandability after dicing. That is, the wafer cut in the shape of a chip on the adhesive layer is picked up and sent to the next process. In order to easily perform this pickup, it is necessary to leave a certain gap. This constant gap is to expand as uniformly as possible in the vertical and horizontal directions at the same time. In addition to this expandability, patent technology relating to slipperiness is also disclosed.
For example, a polyolefin film having a constant surface roughness and a constant in-plane retardation before and after stretching is specified as a dicing substrate film, and the film is mainly composed of crystalline polyethylene on both sides and ethylene in the middle. This is achieved by laminating with a layer of amorphous polyolefin containing 40% by weight or more of any monomer component of propylene, or butene-1 (see, for example, Patent Document 3).
Further, a terpolymer resin having elasticity obtained by copolymerizing ethylene as a main component (60% by weight or more) and methacrylic acid and a (meth) acrylic acid alkyl ester (C3 to C8 alkyl group) is used as a dicing substrate film. As a dicing tape consisting of two layers by providing an adhesive layer on the dicing tape or a dicing substrate film, and further layering polyethylene or a copolymer of ethylene and vinyl acetate on the dicing substrate film. (For example, see Patent Document 4).
Also, a multilayer structure polymer particle having a soft (elastic) acrylic resin inside and a hard acrylic resin as an outermost layer, or 0 to 50% by mass of a thermoplastic resin, for example, highly polar ethylene resin, styrene Resin (for example, polystyrene (general or high impact), styrene-maleic anhydride copolymer, ABS, AAS, ACS, MBS, etc.), acrylic resin, polyester resin, nylon resin, vinyl chloride resin, PVA A film made of a blend of a resin or the like is used as a base, and an adhesive layer is provided on one side for dicing (see, for example, Patent Document 5).

Japanese Patent Laid-Open No. 5-21234 JP-A-5-156214 JP 2001-232683 A Japanese Patent Laid-Open No. 7-230972 JP 2004-79916 A

By the way, with the recent further downsizing of wafers (for example, 10 × 10 mm is reduced to 1 × 1 mm), the current dicing sheet can not cope with it, and a new problem has also occurred. This is the following two points.
First of all, because of the smaller size cut, it is necessary to expand more uniformly and smoothly in the vertical and horizontal directions (without tearing or breaking), but this is difficult to cope with.
Another is the collection of used dicing sheets. In general, a wafer is first fixed to an adhesive surface of a tape-like dicing sheet, which is stored in a rack and sent to a dicing process. And here, it is first cut into a predetermined size by a dicer (dicing). The sheet is then expanded to create a certain gap for easy pickup. Then, picking up by the picker completes the main process. What remains here is the used dicing sheet, which needs to be recovered efficiently. One of the efficient collections is storage and collection in the rack.

The efficient recovery to the rack is to store the used sheet after being heated and shrunk to a predetermined temperature. However, in the generally known dicing sheet, the heat shrinkage at that temperature is small. Storing in the rack was difficult. This difficulty becomes more difficult as the wafer cut size becomes smaller. In other words, the smaller the cut size, the larger the expansion of the sheet. Therefore, if the heat shrinkage in the recovery is not further contracted, the sheet cannot be stored in the rack.
Therefore, as a means for solving this problem, the used sheet is heated at a certain temperature, and is contracted to at least a size that can be easily stored in a rack, and is collected and stored.
As described above, the generally known sheet has a limit even if it can be heated and shrunk to a certain extent, and is hardly recovered by this method. In fact, it is even more difficult to cut the wafer in a smaller size, and it is impossible to recover the wafer.

According to the present invention, it is possible to expand more widely and uniformly required in accordance with the smaller size cut (hereinafter referred to as expandability), and to a rack of a used dicing sheet. The main problem is to find a film for dicing that can be recovered more quickly and easily (obtained with the expression of a property of greater shrinkage recovery at a lower temperature) (hereinafter referred to as rack recoverability). As found.
The rack is a name called in the industry, and is also called a sipper or a case. In the present invention, it will be called a rack.

First, the present invention is characterized in that the following blend resin A is a single-layer film for dicing comprising an unstretched film A.
<Blend resin A>
90 to 97% by mass of a granular thermoplastic acrylic resin formed of a soft acrylate resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene A blend resin of 10 to 3% by mass of a hydrogenated resin of a copolymerized soft resin comprising

The present invention is also characterized in that the following blend resin B is a single-layer film for dicing comprising the unstretched film B.
<Blend resin B>
80 to 90% by mass of a granular thermoplastic acrylic resin formed of a soft acrylic ester resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene A blend resin comprising 5 to 23 parts by mass of a terpene resin with respect to 100 parts by mass of a blend resin of 20 to 10% by mass of a hydrogenated resin of a copolymerized soft resin comprising

The present invention is also characterized in that it is a three-layer film for dicing comprising an unstretched film C made of the following blend resin C as an intermediate layer (M) and an unstretched film D made of blend resin D as a front and back layer (L). And
<Blend resin C>
80 to 90% by mass of a granular thermoplastic acrylic resin formed of a soft acrylic ester resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene Blend resin containing 5 to 23 parts by mass of terpene resin with respect to 100 parts by mass of blend resin of 20 to 10% by mass of hydrogenated resin of copolymerized soft resin consisting of
90 to 97% by mass of a granular thermoplastic acrylic resin formed of a soft acrylate resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene A blend resin of 10 to 3% by mass of a hydrogenated resin of a copolymerized soft resin comprising

  The present invention is also characterized in that the single-layer or three-layer dicing film has a longitudinal and lateral restoration ratio of 95% or more when contracted by heating at 60 ° C. for 10 seconds. .

  A dicing film having superior extensibility can be obtained, and a semiconductor wafer or the like can be diced into small pieces and picked up easily and reliably.

  In addition, the used dicing film can be stored and collected in the rack more quickly and easily.

  In addition, the cutting depth in dicing can be set deeper (it becomes easier to cut), and the slipperiness with respect to the receiving member (pressing member) used during dicing is good.

First, the granular thermoplastic acrylic resin (hereinafter referred to as PAA resin particles) that serves as a base for forming an unstretched film, regardless of whether it is a single-layer film or a three-layer film, will be described.
The PAA resin particles include a soft acrylic ester resin (hereinafter referred to as E-PAA resin) as a core layer, and a semi-rigid or hard methacrylate ester resin (hereinafter referred to as H-PAA resin) as a shell layer. That is, it has a granular shape in which the E-PAA resin is wrapped with the H-PAA resin.
Here, the meanings of the soft, semi-rigid and hard are roughly as follows.
Generally, it is the same as the region of resin hardness, that is, the region divided into soft-semi-hard-hard, and in terms of hardness, soft is Shore A hardness (for example, 20 to 80 degrees) and semi-hard-hard is Shore D hardness ( For example, 30 degrees or more). And if this is classified by the bending elastic modulus, it is classified as soft below 70 MPa, semi-rigid below 70-700 MPa, and hard above 700 MPa.
The meaning of granularity is generally a concept of fineness, ranging from a round shape to an elliptical shape and an amorphous shape. This granule is basically composed of two layers as described above, but single layer particles of only E-PAA resin and / or H-PAA resin may be mixed therewith. However, the mixing ratio in this case must be less than 50% by weight.
The soft hardness is represented by Shore A.

The E-PAA resin layer of the core mainly exhibits the expandability and heat shrinkability in the unstretched film, and the semi-rigid or hard H-PAA resin layer of the shell blends the styrene and aliphatic diene to be blended. It acts so as to assist in the development of compatibility (blend properties) with a copolymerized soft resin comprising:
In addition, the handling difficulty of the E-PAA resin itself is encased in an easy-to-handle H-PAA resin, and since it is granular, the handling becomes even easier.

  Note that the effect of the PAA resin particles depends to some extent on the type of E-PAA resin and H-PAA resin (difference in hardness due to structural components, bonding state, etc.) and the composition ratio of the core layer to the shell layer. fluctuate. Therefore, the best conditions are required to be thoroughly examined and confirmed for these factors in advance, but this condition range is described below for reference.

First, E-PAA resin basically uses a C4 or higher acrylic acid alkyl ester as a base monomer, and a small amount of an acrylic vinyl monomer having two or more vinyl groups (for example, allyl methacrylate). It is obtained by polymerizing in the form of an emulsion under the addition. The use of the C4 or higher acrylic acid alkyl ester softens. For example, when a small amount of the allyl methacrylate is added to this, it has elasticity by taking a crosslinked structure. At this time, other acrylic ester monomers such as acrylic acid, methyl ester or ethyl ester of methacrylic acid may be copolymerized in the presence of a minor amount. This copolymerization is preferred because the Shore A hardness of the resin can be changed as appropriate, leading to improved moldability.
In addition, the reaction ratio in this polymerization can be illustrated as follows.
The addition amount of the acrylic vinyl monomer having two or more vinyl groups with respect to the alkyl acrylate ester is 0.01 to 5% by mass with respect to the alkyl acrylate ester.

  In addition, the amount of the other alkyl acrylate ester in the case of copolymerization is 90% by mass or less with respect to 100% by mass of the alkyl acrylate ester. In this case, the addition amount of the acrylic vinyl monomer having two or more vinyl groups is 0.01 to 5% by mass with respect to the total amount of the acrylic acid alkyl ester and the other acrylic acid alkyl ester.

On the other hand, although it is H-PAA resin, first hard is generally obtained by polymerization of methacrylic acid methyl ester, ethyl ester or propyl ester. That is, the resin is basically harder than the alkyl ester having a shorter chain of C3 or less.
Semi-rigid is a binary copolymer (generally random structure) by copolymerizing other monomers of methyl or ethyl with the above-mentioned monomer that makes the above-mentioned hard, and further adding a C4 or higher (meth) acrylic acid alkyl ester. It is also possible to control the molecular weight. This molecular weight control is possible by adding a molecular weight modifier (general radical scavenger), for example, a trace amount of alkyl mercaptan.
In addition, the reaction ratio in this polymerization can be illustrated as follows.
The amount of methyl ester, ethyl ester or propyl ester of methacrylic acid is more than 50% by mass, and other C4 or higher (meth) acrylic acid alkyl ester when copolymerized is 50% by mass or less, preferably 20%. Keep it to less than mass%. Moreover, when adding a molecular weight modifier to a reaction system, it is set as about 0.5-1.5 mass% with respect to the methyl ester, ethyl ester, or propyl ester of this methacrylic acid.

Further, the composition ratio of the core layer and the shell layer by the both resins can be exemplified by the range of 30 to 90% by mass of the E-PAA resin of the core layer and 70 to 10% by mass of the H-PAA resin of the shell layer. It is preferable to increase the former so that the resulting PAA resin particles themselves are in a soft, preferably semi-rigid or hard region having elasticity.
The H-PAA resin layer is preferably made of semi-hard PAA resin rather than hard.

Various means for producing PAA resin particles are conceivable. Generally, however, the E-PAA resin monomer is first polymerized in the form of an emulsion. Since the resin is obtained in the form of an emulsion, the monomer of the H-PAA resin is subsequently added to the system and polymerized in the same manner. A granular PAA resin is obtained by separating and precipitating. The H-PAA resin used as the shell layer may be polymerized under the addition of a molecular weight modifier, for example, so that it is too high in molecular weight and does not become harder than necessary.
Here, in the case of copolymerization, the monomer having a large reaction ratio may be polymerized by itself in excess and mixed in the form of a single polymer.
The PAA resin particles are basically composed of two layers, but if repeated polymerization is performed, there are four or six layers. At this time, the monomer component can be changed.
The detailed manufacturing method is described in, for example, Japanese Patent Application Laid-Open No. 11-292940 or Japanese Unexamined Patent Application Publication No. 2004-79916, and further detailed description is omitted.

  As described above, the film made of PAA resin particles exhibits a working effect. However, as a problem as a film for dicing by itself, it is particularly abrupt and when it is intended to expand more widely and uniformly. , Tearing and tearing. A means that can solve this problem at once is a blend of a copolymerized soft resin hydrogenated resin (hereinafter referred to as a hydrogenated SD soft resin) made of styrene and an aliphatic diene. The hydrogenated SD soft resin will be described below.

First, the hydrogenated SD soft resin is basically a segment obtained by hydrogenating (adding hydrogen atoms) a polymer segment portion formed by styrene forming a hard portion and a polymer segment portion formed by an aliphatic diene forming a soft portion. It consists of an ethylene butylene polymer segment part.
And because it is soft, the segment amount based on the aliphatic diene component basically has a composition ratio equal to or higher than the segment amount based on styrene, but if too much, It is not good because it is difficult to develop a better restoring property related to the rack recovery and the compatibility (uniform blendability) with the PAA resin particles is also deteriorated. On the other hand, if the amount of segments based on styrene is too large, it is not good because it makes it difficult to develop better extensibility. If the composition range effective for coexistence of these both effects is illustrated, the polymerization segment by styrene will be 5-50 mass%, and the hydrogenated segment based on aliphatic diene will be 95-50 mass%. And when this is shown in a hardness (Shore A) range, it is about 40 to 98 degrees.
This softness basically depends on the polymerization ratio and molecular weight of the diene with respect to styrene, but there are other types of bonding, that is, a polymer segment formed by the styrene component in the resin and water generated by the diene component. The difference also depends on whether the bond with the addition polymerization segment is random or alternating, and whether both ends are polymerization segments made of styrene components. In the present invention, basically, any soft resin having excellent film moldability may be used regardless of the bonding type. However, a soft resin having rubber elastic properties is not preferable. This is also because it becomes difficult to maintain the expanded state with no external force.
In addition, although it cannot use even non-hydrogenated SD soft resin, it is not preferable. This is because it is not good in terms of heat resistance and weather resistance.

If the styrene is less than 50% by mass, a nuclear alkylated styrene may be mixed. One aliphatic diene is a chain dimer having double bonds at both ends, but C4 to C6, more preferably a C4 aliphatic diene, that is, 1,3-butadiene, 1,3-isoprene. It is.
Note that, in place of the styrene component, for example, not only a soft polyolefin (for example, propylene elastomer resin) using a propylene component, but also general polystyrene, impact-resistant polystyrene, and the like cannot achieve the effects of the present invention.

As described above, the film of the present invention can be effectively achieved only by blending PAA resin particles and hydrogenated SD soft resin. Further, in the blend, the PAA resin particles are mainly used as a main component. It is more effective to use a blend resin with less SD soft resin. The blend ratio is 90 to 97% by mass, preferably 92 to 95% by mass, and 10 to 3% by mass, preferably 8 to 5% by mass, of the hydrogenated SD soft resin.
Here, when the PAA resin particles are less than 90% by mass, that is, the hydrogenated SD soft resin is more than 10% by mass, it is difficult to form a film having the heat shrinkage recovery rate. On the other hand, if it exceeds 97 mass%, that is, if the hydrogenated SD soft resin is less than 3 mass%, the film tends to tear or break in the expansion.

  The blend resin A of the above PAA resin particles and hydrogenated SD soft resin becomes a non-stretched single layer film, has the improved resilience and expandability, and is effectively used for dicing. However, in the case of the single-layer film, depending on the use conditions (that is, the user's requirements), the performance may not be sufficient particularly in scalability. Accordingly, there is a need for such a film that can easily be diced into a semiconductor wafer or the like with a superior extensibility that can be used under any use condition, and can collect the rack after use. That is, the film having both excellent expandability and rack recoverability is also required. The means for solving this is as follows.

That is, the next blend resin B is the single layer film formed of the unstretched film B.
This is based on 80 to 90% by mass of the PAA resin particles, preferably 83 to 88% by mass and 20 to 10% by mass of the hydrogenated SD soft resin, preferably 17 to 12% by mass, of 100 parts by mass of the blend resin. There exists in using the blend resin B in which 5-23 mass parts of terpene resin is contained, Preferably 8-20 mass parts is contained.
As described above, the superior extensibility is basically preferably 10% by mass or less of the hydrogenated SD soft resin. However, when the terpene resin is used in combination, it has been found that there is no substantial decrease in rack recoverability even in a range as large as 10% by mass or more, and the expansibility is further improved. The invention has been reached.

The terpene resin is generally a terpene resin blended with various resins as a tackifier to form an adhesive resin. The range of PAA resin particles is 80 to 90% by mass and hydrogenated SD soft resin is 20 to 10% by mass. Among the blended resins, there is no substantial decrease in rack recoverability, and it has a heterogeneous effect of further improving expandability.
As is generally known, this terpene resin is a terpene monomer, that is, a terpene resin having α-pinene, β-pinene or dipentene as a skeleton, a styrene-modified terpene resin having this as a skeleton, or a phenol having this as a skeleton. This is a modified terpene resin. There are also saturated terpene resins obtained by hydrogenating these terpene resins.
These terpene resins also have a molecular weight of about 500 to 1400, a softening point of about 80 to 150 ° C, and a glass transition point of about 40 to 90 ° C.
In the present invention, basically, any of these resins may be used (although there is some difference in function and effect), but for the rack recoverability, the PAA resin particles and the hydrogenated SD soft resin Those that can be blended with higher compatibility with these blend resins are the phenol-modified copolymerized terpene resins and those having a glass transition point of about 55-90 ° C.

  The terpene resin is blended for further improvement of the expandability and the rack recoverability. However, the blend amount is such that the blend resin characteristics of the PAA resin particles and the hydrogenated SD soft resin are lost. It is also important not to be. Without losing the blend resin properties, the blend range in which both of these properties are most effectively obtained is 5 to 23 parts by mass of terpene resin, preferably 7 to 20 parts by mass with respect to 100 parts by mass of the blend resin. Furthermore, it is 10-17 mass parts. That is, when it exceeds 23 parts by mass, the adverse effect on the extensibility is particularly great, and the slipperiness necessary for dicing is also deteriorated. If it is less than 5 mass parts, the further improvement of both these characteristics is hardly seen.

As described above, the unstretched single-layer film obtained by blending a predetermined terpene resin with a blend resin with PAA resin particles containing more hydrogenated SD soft resin has a higher level of expandability. This is a film for dicing that has characteristics compatible with rack recoverability. This single-layer film is a three-layer film in which both sides, that is, the front and back layers (L), are laminated as an intermediate layer (M). Can also be used.
That is, the three-layer film is a film obtained by laminating the next non-stretched film by the blend resin C as an intermediate layer (M) and the non-stretched film by the blend resin D as a front and back layer (L).
<Blend resin C>
Blend resin containing 5 to 23 parts by mass of terpene resin with respect to 100 parts by mass of blend resin of 80 to 90% by mass of PAA resin particles and 20 to 10% by mass of hydrogenated SD soft resin <Blend resin D>
Blend resin of blend resin of 90-97 mass% of PAA resin particles and 10-3 mass% of hydrogenated SD soft resin In other words, this three-layer film is composed of PAA resin particles blended with the terpene resin and hydrogenated SD soft resin. An unstretched film made of a three-component blend resin and an intermediate layer (M), and a non-stretched film made of a two-component blend resin of unterminated PAA resin particles and hydrogenated SD as front and back layers (L) It is.

The effect of being the three-layer film is as follows.
The excellent rack recoverability of the monolayer film containing the terpene resin is further improved. In addition, the slight slippage of the film seen on the side where the blend amount of the terpene resin is large is also covered with the front and back layers (L) containing no terpene resin. There is no slipperiness. Furthermore, the intermediate layer (L) tends to be slightly hardened due to the inclusion of the terpene resin, but this tendency is alleviated by the front and back layers, and the overall film stiffness is adjusted to an appropriate one.

The single-layer or three-layer film is an unstretched film that is not stretched both vertically and horizontally. This is a necessary condition for use for dicing. In other words, the expansion can be performed uniformly and smoothly in either direction, and it must not be stretched to heat it, shrink and quickly collect it into the rack.
Here, “non-stretching” means that stretching should not adversely affect the expansion and rack recovery.

The thickness structure of the single layer or three layer film is exemplified as follows.
The single layer has a thickness of about 60 to 100 μm, the three layers have a total thickness of about 60 to 100 μm, the intermediate layer (M) has a thickness of about 50 to 80 μm, and the front and back layers (L) have the same thickness in the range of about 5 to 10 μm.

Each of the single-layer or three-layer films has excellent expandability and rack recoverability. For example, the single layer or three-layer film has a single parameter that can be restored more quickly and more greatly at a lower temperature. As shown, when the film that had been stretched by 40% in the longitudinal direction and the lateral direction in advance is shrunk by heating at 60 ° C. for 10 seconds, the restoration rate in the longitudinal direction and the lateral direction is again 95% of the original elongation of 40%. % Can be restored.
As a condition, first, the 40% elongation is because even if a very small semiconductor wafer is cut, if it can be expanded and expanded by 40% in length and breadth, there is no problem with the pickup, and it is 95% by heating at 60 ° C. for 10 seconds. If it can be contracted as described above, it can be quickly and smoothly collected in the existing rack.

Next, the means for producing the single layer or three layer film will be described.
First, there is a method using a T die or a round die as a preferable manufacturing means, but since a method using a T die is preferable, film forming by this method will be described below.
In the case of the single layer film, it is as follows.
First, blend resin A or blend resin B obtained by dry blending or melt-kneading PAA resin particles and hydrogenated SD soft resin or PAA resin particles, hydrogenated SD soft resin and terpene resin within the blend range is about barrel temperature. Supply to a single-screw extruder controlled to 170-210 ° C., extrude from a T-die controlled to around 200 ° C., and perform a cooling roll adjusted to 25-40 ° C. without performing longitudinal and transverse stretching operations. Pass through to cool and solidify.

On the other hand, the case of a three-layer film is as follows.
First, the blend resin B is used as a blend resin C, which is supplied to one single-screw extruder, and the blend resin A is used as a blend resin D, which is supplied to two single-screw extruders. The three single-screw extruders are connected to a single three-layer T die, and are co-extruded so that the resin C is in the middle and the resin D is on both sides. Here, since three layers are laminated at a time and discharged, they are cooled and solidified by passing through a cooling roll adjusted to 25 to 40 ° C. without any longitudinal or transverse stretching operation. Here, the barrel temperature of each extruder and the temperature of the three-layer T die are performed in each temperature range in the case of the single layer.
During the blending, addition of, for example, an antioxidant, a colorant, and an antistatic agent (for example, a polymer resin having a polyoxyalkylene chain in the molecule) is permissible as long as the properties of the film are not impaired. Akiru.

The single-layer film or the three-layer film is a film serving as a substrate for dicing. In actual use, an adhesive layer is provided on one side and a release paper is stretched thereon to form a necessary form (for example, It is cut into a tape shape and used.
Hereinafter, examples will be described in detail together with comparative examples.
In addition, the determination of expandability and rack recoverability in each of the following examples was performed by the following measurements.

Expandability First, the film obtained in each example is cut to an inner diameter of about 500 mm, and this is stretched and fixed on a ring-shaped frame having an inner diameter of 200 mm. Then, a cut of 5 × 5 mm square and a depth of 30 μm (by a disco 27HEDG blade used as a dicer) is engraved on the entire surface of the stretched film having an inner diameter of 150 mm (the entire ring-shaped frame is Horizontally fixed). Next, a disk having an outer diameter of 150 mm is arranged so as to be located at the lower center of the ring-shaped frame, and the disk is sequentially moved in five stages of 30 mm, 35 mm, 40 mm, 45 mm, and 50 mm at a speed of 200 cm / min. Push up. Check for film tears at each push-up stage. Less than 40 mm is rejected and x, and therefore 40 mm or more is determined to be acceptable.

● Rack recoverability The following measurements are made in the vertical and horizontal directions of the film obtained.
Two samples, 10 mm in width and cut in the vertical direction, and 10 mm in width and cut in the horizontal direction are used as samples. For each of these, set to a tensile tester “AGS100A” manufactured by Shimadzu Corporation with a distance between chucks of 40 mm (same meaning as the distance between the marked lines of the sample is 40 mm), and first stretched by 40% at a tensile speed of 200 mm / min. To do. When the extension is held for 1 minute, the extended state is released. Then, hot air of 60 ° C. is blown on each released sample for 10 seconds. When the temperature is returned to room temperature, the length is measured, and the restoration rate (%) in the vertical and horizontal directions for 40% elongation is obtained. If the restoration rate is 95% or more in the vertical and horizontal directions, it is possible to quickly and easily store and collect the dicing sheet in the rack even for small wafers of 1 x 1 mm cut size. If it is less than 95%, this cannot be done and x is assumed.

(Example 1) (In the case of a monolayer film not containing terpene resin)
As PAA resin particles, manufactured by Kuraray Co., Ltd., Parapet, variety SA-D (Vicat softening point 70 ° C., Shore A hardness 93, MFR 22 g / 10 min (230 ° C., 98.07 N)) 93% by mass, hydrogenated SD soft Resin made by JSR Corporation, trade name Dynalon variety 4630P (styrene content less than 10% by weight, Shore A hardness 78, Tg-45 ° C., MFR 5.6 g / 10 min (230 ° C., 21.2N) 7% by weight as resin. The blended resin A is supplied to a single-screw extruder controlled at a barrel temperature of 170 to 205 ° C., extruded from a T die at 200 ° C., and taken off while being cooled in a cooling roll (30 ° C.) in an unstretched state. Thus, an unstretched single layer film A was obtained.
The thickness of the obtained film was 80 μm. The film expandability and rack recoverability were measured, and the results are summarized in Table 1.

(Example 2) (In the case of a monolayer film containing a terpene resin)
As PAA resin grains, Kuraray Co., Ltd., trade name Parapet, variety SA-D (Vicat softening point 70 ° C., Shore A hardness 93, MFR 22 g / 10 min (230 ° C., 98.07 N)) 85% by weight, hydrogenated As SD soft resin, manufactured by JSR Corporation, trade name Dynalon variety 4630P (styrene content less than 10% by mass, Shore A hardness 78, Tg-45 ° C., MFR 5.6 g / 10 min (230 ° C., 21.2 N) and 15% by mass After dry blending 15 parts by mass of phenol-modified terpene resin (manufactured by Yashara Chemical Co., Ltd., YS Polystar T115, average molecular weight 600, Tg 57 ° C.) Using the obtained chip as a resin B, this was film-formed under the same conditions as in Example 1 to obtain an unstretched single-layer film B.
The thickness of the obtained film was 80 μm. The film expandability and rack recoverability were measured, and the results are summarized in Table 1.

(Example 3) (In the case of a three-layer film)
Resin B, which is the same as in Example 2, is used as Resin C, and this is used as one single-screw extruder (barrel temperature is the same as that in Example 2). Each of which was co-extruded from a three-layer T-die at 200 ° C. and cooled by a cooling roll (30 ° C.) in an unstretched state. Then, the film was taken out to obtain an unstretched three-layer film.
The thickness of the obtained three-layer film was 80 μm in total thickness, and the middle layer M64 μm and the front and back layers L were 8 μm each. The film expandability and rack recoverability were measured, and the results are summarized in Table 1.

(Comparative Example 1) (vs. Example 1)
In Example 1, an unstretched single layer film having a thickness of 80 μm was obtained by film-forming under the same conditions except that only PAA resin particles were used. The expandability and rack recoverability of the film were measured and the results are summarized in Table 1.

(Comparative Example 2) (vs. Example 1)
Using a resin obtained by dry blending 85% by mass of the same PAA resin particles as in Example 1 and 15% by mass of the same hydrogenated SD soft resin, the film was molded under the same conditions, and an unstretched single layer for comparison having a thickness of 80 μm. I got a film. The expandability and rack recoverability of the film were measured and the results are summarized in Table 1.

(Comparative Example 3) (vs. Example 2)
In Example 2, a film was molded under the same conditions except that 15 parts by mass of phenol-modified terpene resin was used with respect to 100 parts by mass of PAA resin particles to obtain an unstretched single layer film having a thickness of 80 μm. The thickness of the obtained film was 80 μm. The film expandability and rack recoverability were measured, and the results are summarized in Table 1.

(Reference Example 1)
Chips obtained by dry blending 15 parts by mass of the same phenol-modified terpene resin as in Example 2 with respect to 100 parts by mass of the same dry blend resin A as used in Example 1, and then melt-kneading the chip. The film was molded under the same conditions as in No. 2 to obtain an unstretched single layer film.
The thickness of the obtained film was 80 μm. The film expandability and rack recoverability were measured, and the results are summarized in Table 1.

(Reference Example 2)
A chip obtained by dry blending 27 parts by mass of the same phenol-modified terpene resin as in Example 2 with 100 parts by mass of the same dry blend resin A used in Example 2 and then melt-kneading the chip The film was molded under the same conditions as in No. 2 to obtain an unstretched single layer film.
The thickness of the obtained film was 80 μm. The film expandability and rack recoverability were measured, and the results are summarized in Table 1.

(Table 1)

Claims (4)

A single-layer film for dicing, wherein the following blend resin A is made of an unstretched film A.
<Blend resin A>
90 to 97% by mass of a granular thermoplastic acrylic resin formed of a soft acrylate resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene A blended resin of 10 to 3% by mass of a hydrogenated resin of a copolymerized soft resin. A single-layer film for dicing, wherein the following blend resin B is made of an unstretched film B.
<Blend resin B>
80 to 90% by mass of a granular thermoplastic acrylic resin formed of a soft acrylic ester resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene A blend resin comprising 5 to 23 parts by mass of a terpene resin with respect to 100 parts by mass of a blend resin of 20 to 10% by mass of a hydrogenated resin of a copolymerized soft resin. A three-layer film for dicing, characterized in that an unstretched film C made of the following blend resin C is used as an intermediate layer (M), and an unstretched film D made from the blend resin D is used as a front and back layer (L).
<Blend resin C>
80 to 90% by mass of a granular thermoplastic acrylic resin formed of a soft acrylic ester resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene A blend resin comprising 5 to 23 parts by mass of a terpene resin with respect to 100 parts by mass of a blend resin of 20 to 10% by mass of a hydrogenated resin of a copolymerized soft resin.
<Blend resin D>
90 to 97% by weight of a granular thermoplastic acrylic resin formed of a soft acrylic ester resin as a core layer and a semi-rigid or hard methacrylic ester resin as a shell layer, styrene and an aliphatic diene A blended resin of 10 to 3% by mass of a hydrogenated resin of a copolymerized soft resin. The elongation in the longitudinal direction and the transverse direction is 40%, and the restoration rate in the longitudinal direction and the transverse direction is 95% or more when heated and contracted at 60 ° C for 10 seconds. A film for dicing consisting of a single layer or three layers as described in 1.