JP2006153642A - Concentration measuring instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a concentration measuring instrument having high measurement accuracy, capable of shortening an operation time. <P>SOLUTION: A chip carrier 700 for storing a glass chip 600 as an optical waveguide substrate is placed on the upper surface 501 of an optical block 500, and the optical block 500 is equipped with a light source module 530 and a detector 531. The first positioning part 420, the second positioning part 440 and a pressing part 460 for positioning and holding the glass chip operated by a turning handle 407 are provided on the device case 400 side. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a concentration measuring apparatus, and more particularly to a concentration measuring apparatus that measures the concentration of a specific component in a liquid sample to be measured using light.

  Conventionally, methods for measuring the concentration of various hormones such as insulin, proteins, and organic substances such as blood sugar include measuring the voltage generated by the electrode reaction, and changing the color using a dye that reacts with the substance and is adsorbed. There is an optical density measurement method (for example, see Patent Document 1) in which measurement is performed by changing the amount of light such as laser light. This optical density measurement method has an advantage of high measurement resolution.

  Hereinafter, this optical density measurement method will be briefly described. First, a liquid object to be measured is placed on a glass chip, and for example, a dye is reacted with the object to be measured so that incident light is absorbed according to the concentration of the object to be measured. Then, the glass chip is placed on the concentration measuring device while confirming the positioning state, and the glass chip is screwed using a tool. Thereafter, a laser beam is guided into the glass chip, and the laser beam that has passed through the region where the object to be measured is placed is taken out of the glass chip to detect the amount of light. The concentration of the object to be measured is calculated from the detected value of the light quantity.

In such an optical concentration measurement method, the light source and the detector are arranged at predetermined positions with respect to the glass chip so that the light emitted from the light source is optimally incident on the region where the object to be measured is arranged. It was necessary to arrange the glass chip, the light source, and the detector with high accuracy.
Japanese Patent Application Laid-Open No. 2004-184381 (first page, FIG. 1)

  However, in the above-described concentration measuring apparatus, since the glass chip positioning and screw fixing are performed manually, the positioning state differs depending on the operator, which hinders measurement and uses the screw to position the glass chip. There was a problem that it took time.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a concentration measuring apparatus that has high measurement accuracy and can shorten the working time.

  The first feature of the present invention is that concentration measurement is performed by irradiating the object to be measured disposed on the optical waveguide substrate with light passing through the optical waveguide substrate and receiving the return light from the optical waveguide substrate. An apparatus main body having a substrate mounting portion on which an optical waveguide substrate is mounted, a positioning guide that allows the optical waveguide substrate mounted on the substrate mounting portion to move only in a specific direction, and a substrate mounting A first positioning portion for positioning the optical waveguide substrate by contacting one end surface in the specific direction of the optical waveguide substrate placed on the mounting portion; and a second positioning for pressing the other end surface of the optical waveguide substrate in the specific direction And an interlocking mechanism that interlocks the first positioning portion, the second positioning portion, and the pressing portion.

  The second feature of the present invention is that measurement is performed by irradiating the object to be measured arranged on the optical waveguide substrate with light passing through the optical waveguide substrate and receiving the return light from the optical waveguide substrate. An apparatus main body having a substrate mounting portion for mounting an optical waveguide substrate, a positioning guide that allows the optical waveguide substrate mounted on the substrate mounting portion to move only in a specific direction, and a substrate A first positioning unit that positions the optical waveguide substrate by contacting one end surface in the specific direction of the optical waveguide substrate placed on the mounting unit, and a second that presses the other end surface of the optical waveguide substrate in the specific direction A positioning unit, a pressing unit that presses the optical waveguide substrate toward the substrate mounting unit, a first positioning unit, a second positioning unit, an interlocking mechanism that interlocks the pressing unit, a rotary handle that operates the interlocking mechanism, and an optical Waveguide substrate A substrate carrier mounted on the apparatus main body so as not to interfere with the substrate mounting section, the first positioning section, and the second positioning section in the stored state, and separated from the optical waveguide substrate on the apparatus main body. It is a summary.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the density | concentration measuring apparatus which has a high measurement precision and can shorten work time.

  Hereinafter, the details of the concentration measuring apparatus according to the embodiment of the present invention will be described with reference to FIGS.

[Schematic configuration of concentration measuring device]
As shown in FIG. 1, the concentration measuring apparatus 100 according to the present embodiment includes an apparatus main body 200 and a lid body 300 as an open / close lid that opens and closes the upper surface of the apparatus main body 200. The apparatus main body 200 includes an apparatus case 400 and an optical block 500 provided in the apparatus case 400. The device case 400 is a substantially rectangular parallelepiped housing, and a predetermined region of the optical block 500 is exposed through an opening 404 (see FIGS. 5 and 6) formed in the upper wall 401. As shown in FIG. 1, a first cover 402 and a second cover 403 are attached to the upper wall 401 of the apparatus case 400 so as to sandwich a predetermined region of the exposed optical block 500.

  As shown in FIG. 2, a chip carrier 700 as a substrate carrier is placed on the upper surface 501 of the optical block 500. The chip carrier 700 is configured to house a glass chip 600 as an optical waveguide substrate. The optical block 500 includes a plurality of light source modules 530 provided on one side surface and the same number of detectors 531 as the light source modules 530 provided on the other side surface.

  On the apparatus case 400 side, as shown in FIGS. 4, 7 and 8, etc., there are a first positioning part 420, a second positioning part 440 and a pressing part 460 for positioning and holding the glass chip 600 on the optical block 500. Is provided.

[Configuration of optical block]
As shown in FIGS. 2 and 3, the optical block 500 has a substantially trapezoidal structure. The optical block 500 is formed by cutting a metal block. The specific outer shape of the optical block 500 is located at a rectangular upper surface 501, a rectangular lower surface 502 parallel to the upper surface 501, and both longitudinal ends indicated by arrows y in FIGS. 2 and 3. And a pair of trapezoidal side surfaces 503 parallel to each other, and a pair of tapered surfaces 504 and 505 located on both sides in the width direction indicated by an arrow x in the drawing. Note that the direction formed by the arrow x and the direction formed by the arrow y are orthogonal to each other in the same plane.

  As shown in FIG. 2, a rectangular substrate mounting surface 506 is formed on the upper surface 501 around the entire length of the optical block 500 in the arrow y direction at the center in the arrow x direction in the drawing. It is formed slightly higher than. A plurality (eight in this embodiment) of substrate placement portions (surface regions on which the glass chip 600 is placed on the substrate placement surface 506) 507 are parallel to each other on the substrate placement surface 506 along the arrow y direction. Are arranged adjacent to each other. In the concentration measuring apparatus 100 according to the present embodiment, a plurality of glass chips 600 can be simultaneously placed on the substrate placement unit 507, and measurement using the plurality of glass chips 600 can be performed at a time.

  On the substrate placement surface 506, the glass chips 600 housed in the chip carrier 700 are placed on the corresponding substrate placement portions 507. The glass chip 600 is placed on the substrate platform 507 so that the longitudinal direction thereof coincides with the arrow x direction.

  9 is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 9, the optical block 500 is penetrated so as to connect a region on one side (the light source module 530 side) in each substrate mounting portion 507 and a predetermined position of one tapered surface 504. A light exit passage 508 is formed. On the tapered surface 504 side of the optical block 500, one opening 508A of the light emission path 508 to which the light source module 530 is attached is formed. In the vicinity of the opening 508A, the light source module 530 is disposed, so that the diameter is larger than that of the light emission path 508. Further, the other opening end of the light emission path 508 for allowing light to enter the glass chip 600 placed on the substrate platform 507 is located in the area on the light source module 530 side of each substrate platform 507. An emission opening 508B is formed.

  Further, as shown in FIG. 9, a light incident path 509 is formed between the surface of the substrate platform 507 located on the detector 531 side and the other tapered surface 505. The detector 531 described above is arranged and fixed on the tapered surface 505 of the light incident path 509 on the opening 509A side, and the light receiving surface of the detector 531 faces the opening 509A. The other opening end of the light incident path 509 is an incident opening 509 </ b> B opened in the substrate platform 507.

  Further, as shown in FIG. 9, non-detection that penetrates to the lower surface 502 at a position between the exit opening 508 </ b> B and the entrance opening 509 </ b> B and adjacent to the exit opening 508 </ b> B in the substrate platform 507. A light removal passage 510 is formed. The non-detection light removal passage 510 is configured so that a reflection component that does not travel into the glass chip 600 out of the light that exits from the emission opening 508B and enters the glass chip 600 is incident. The opening end of the non-detection light removal passage 510 in the substrate platform 507 is a non-detection light incident opening 510A. Further, the other opening 510B of the non-detection light removal passage 510 is formed on the lower surface 502. In the present embodiment, the non-detection light removal passage 510 is bent at an intermediate portion, and is formed so as to have a positional relationship in which the opening 510A cannot be seen from the opening end 510B.

  The inner wall surfaces of the light exit passage 508, the light entrance passage 509, and the non-detection light removal passage 510 described above are subjected to processing such as black coating so as to have light absorption.

  Note that the optical axis of the light emitted from the light source module 530 fixed to one tapered surface 504 of the optical block 500 passes through the light emission path 508 and enters the lower surface of the glass chip 600 at a predetermined incident angle. Is set to In the present embodiment, by fixing the light source module 530 to the optical block 500, an accuracy within ± 0.2 degrees of the predetermined incident angle to the glass chip 600 can be achieved.

  As shown in FIG. 9, on the substrate mounting portion 507, a transparent protective glass (indicated by a one-dot chain line in the figure) 511 covering the emission opening 508B, the non-detection light incidence opening 510A, and the incidence opening 509B is provided. Is arranged.

  Each substrate placement portion 507 on the substrate placement surface 506 is provided with four substrate placement projections 512 for placing the glass chip 600 at a predetermined height. These substrate mounting protrusions 512 are arranged so as to surround the regions where the emission openings 508B, the non-detection light incident openings 510A, and the incident openings 509B are formed in the respective substrate placement portions 507. That is, these substrate mounting protrusions 512 are arranged at positions that do not interfere with the optical waveguide in the glass chip 600. These substrate mounting protrusions 512 are obtained by fixing metal pins to the substrate mounting portion 507 of the optical block 500. The upper end surfaces of the substrate mounting protrusions 512 are ground so that the variation in height is within ± 50 μm by grinding, cutting, polishing, deburring, and the like.

  Further, as shown in FIG. 2, only the specific direction (arrow x direction) is sandwiched between the glass chips 600 from both sides in the width direction on both sides of the substrate placement portion 507 on the substrate placement surface 506 in the arrow y direction. Two pairs of positioning projections 513 are provided so as to allow the movement in the direction of arrow y and restrict the movement in the direction of the arrow y. In the present embodiment, only two positioning projections 513 are arranged between the substrate mounting portions 507 adjacent to each other, and are shared by each other.

  Further, as shown in FIG. 2, carrier positioning pins 514 for positioning the chip carrier 700 are respectively provided on both sides of the plurality of substrate platforms 507 on the substrate platform surface 506 in the arrow y direction. Yes.

  Further, as shown in FIGS. 2, 3, and 9, liquid reservoir grooves 515 are respectively formed on both sides of the substrate mounting surface 506 on the upper surface 501 of the optical block 500 in the arrow x direction. A so-called submerged sheet 516 having a function of causing discoloration including moisture is disposed at the bottom of the liquid storage groove 515. With this submerged sheet 516, it is possible to easily recognize the liquid leakage of the liquid sample of the glass chip 600.

[Schematic configuration of light source module]
As shown in FIG. 9, the light source module 530 includes a semiconductor laser 531, a collimating lens 532, a sleeve 533 for fixing the semiconductor laser 531, a sleeve holder 534, a lens holder 535, and the like.

  The light source module 530 is set so that the optical axis of the emitted light from the semiconductor laser 531 passes through the substantially center of the light emitting path 508. The sleeve 533 for fixing the semiconductor laser 531 is provided so as to be movable and adjustable in a direction perpendicular to the optical axis with respect to the sleeve holder 534. The collimating lens 532 and the semiconductor laser 531 are provided so as to be relatively movable in the optical axis direction.

  With the above-described configuration, the light source module 530 can finely adjust the optical axis of the light emitted from the semiconductor laser 531 and finely adjust the spread angle of the laser light traveling in the light emission path 508. . In the present embodiment, the spreading angle of light incident on the glass chip 600 can be set to 0.5 degrees or less by the light condensing action of the collimating lens 532.

〔Detector〕
In the detector 531, a photodiode that performs photoelectric conversion based on incident light is used as a light receiving element. The detector 531 is fixed so that the light receiving surface faces the opening end 509 </ b> A of the tapered surface 505 of the light incident path 509 in the optical block 500.

[Device Case]
As shown in FIG. 5, the apparatus case 400 has a rectangular opening 404 on the upper wall 401 that exposes the substrate mounting surface 506 described above. As described above, the optical block 500 is built in the apparatus case 400, and the substrate placement surface 506 formed with the plurality of substrate placement portions 507 on the upper surface of the optical block 500 is exposed through the opening 404. It has become. A chip carrier 700 is arranged on the substrate mounting surface 506.

  A lid 300 that opens and closes the upper portion of the apparatus case 400 is rotatably supported on one side edge of the upper surface of the apparatus case 400. As shown in FIG. 1, a pin 301 that pushes an open / close confirmation switch 412 disposed on the apparatus case 400 side protrudes from the rotation base of the lid 300. When the lid 300 is closed, the light source module 530 and the detector 531 on the optical block 500 side can be driven. The inner surface of the lid 300 is painted black to give light absorption.

  A drive switch 405 and various indicators 406 for driving the light source module 530 and the detector 531 are provided on the side of the upper surface 401 of the upper case 401 of the apparatus case 400. As described above, the drive switch 405 can be turned on only when the open / close confirmation switch 412 is pressed by the pin 301, that is, when the lid 300 is closed. The indicator 406 lights up and displays a detection result such as the open / closed state of the lid 300 and the presence / absence of the chip carrier 700. Whether or not the chip carrier 700 is placed is determined by a detection means (not shown).

  Further, as shown in FIG. 1, a rotation handle 407 is provided on one side of a region where the optical block 500 is exposed on the surface of the upper wall 401 of the apparatus case 400. The rotation handle 407 includes a columnar rotation base 408 and a handle portion 409 integrally provided so as to be perpendicular to the axial direction of the rotation base 408. A rotating shaft portion 410 (see FIG. 10) that penetrates the upper wall 401 and protrudes into the device case 400 is integrally provided at the lower portion of the rotating base portion 408. FIG. 10 shows a state in which the rotary shaft portion 410 that protrudes through the upper wall portion of the device case 400 is seen from the inside of the device case 400.

  Further, as shown in FIG. 5, on the surface of the upper wall 401 of the device case 400, guide rails 411 as guide portions are provided along the arrow x direction on both sides of the opening 404 in the arrow y direction. ing. The pair of guide rails 411 has a function of guiding a first positioning portion 420, a second positioning portion 440, and a pressing portion 460, which will be described later, so as to reciprocate in the arrow x direction.

[Glass chip]
As shown in FIG. 12, the glass chip 600 is a rectangular glass substrate and is made of a light-transmitting material such as borosilicate glass. At the center of the upper surface of the glass chip 600, a sample placement portion 601 for accommodating an object to be measured is formed. The sample placement portion 601 is surrounded by a jetty 602 made of, for example, ABS resin, and a liquid containing, for example, a protein as the object to be measured is accommodated in an inner recess surrounded by the jetty 602. ing.

In addition, on the upper surface of the glass chip 600, on both sides of the sample placement portion 601 (both sides in the longitudinal direction of the glass chip 600), an incident side grating 603 and an emission side grating 604 are formed. The incident side grating 603 and the emission side grating 604 are formed by, for example, patterning a titanium dioxide (TiO ₂ ) film in a stripe shape.

  As shown in FIG. 12, in the glass chip 600 having such a configuration, when the light L emitted from the light source module 530 is incident at a predetermined incident angle θ, the primary light L1 incident in the glass chip 600 is incident. The optical waveguide is formed by repeating reflection such that the light is diffracted by the side grating 603 and totally reflected on the lower surface side of the glass chip 600, and the reflected light is totally reflected on the upper surface of the glass chip 600. The light that has passed through the sample placement portion 601 is diffracted by the emission side grating 604 and emitted from the lower surface side of the glass chip 600 to enter the light incident path 509 (see FIG. 9).

  First, the 0th-order light L0 reflected from the lower surface of the glass chip 600 enters the non-detection light removal path 510 (see FIG. 9) of the optical block 500 and is eliminated.

[Chip carrier]
As shown in FIG. 2, the chip carrier 700 is a rectangular frame on which a plurality (eight in this embodiment) of glass chips 600 are placed. 2 shows a state in which one glass chip 600 is placed on the chip carrier 700, but usually eight glass chips 600 are placed and used.

  The chip carrier 700 includes a pair of horizontal frames 701 that are parallel to each other and a pair of vertical frames 702 that are parallel to each other and connect the ends of the horizontal frames 701 to each other. Positioning ribs 703 for positioning the glass chips 600 are formed at equal intervals on the inner edges of the horizontal frames 701 facing each other, with the glass chips 600 disposed therebetween. A notch 704 is formed between the positioning ribs 703 adjacent to each other, and the four corners of the glass chip 600 are placed on the chip mounting portions 705 on both sides of the notch 704. The glass chip 600 placed on the chip carrier 700 is positioned with respect to the chip carrier 700 by the positioning rib 703 and the chip placement portion 705.

  A pair of horizontal frames 701 of the chip carrier 700 is formed with a groove 708 positioned at the center in the width direction of each glass chip 600 placed. The groove 708 is formed so that the horizontal frame 701 does not interfere with operations of a first positioning portion 420 and a second positioning portion 440 described later.

  A positioning hole 706 is formed in the middle portion of each vertical frame 702 to fit the carrier positioning pin 514 protruding from the substrate mounting surface 506 of the optical block 500. FIG. 3 shows a state in which the chip carrier 700 is placed on the optical block 500 and the carrier positioning pins 514 are fitted in the positioning holes 706. Each vertical frame 702 of the chip carrier 700 is provided with an operation rod 707 for carrying out a transfer operation.

  When the chip carrier 700 is properly placed on the optical block 500, the substrate placement protrusions 512 projecting from the substrate placement portion 507 of the optical block 500 are formed in the inner frame space of the chip carrier 700. The substrate mounting protrusion 512 is set so as to lift the glass chip 600 from the chip carrier 700. For this reason, the thickness of the chip carrier 700 is set so as to fall between the plane formed by the optical block 500 in the substrate platform 507 and the protruding end of the protrusion.

[First positioning part]
Next, the structure of the 1st positioning part 420 is demonstrated using FIGS. 4-6 and FIG.

  As shown in FIG. 5, the first positioning portion 420 is bridged so as to form a right angle with a pair of guide rails 411 disposed so as to sandwich the opening 404 of the apparatus case 400, and the arrow x of the opening 404 It has the 1st positioning block 421 which can be slid with respect to the guide rail 411, or can drive | work, located in the one side of a direction.

  A plurality of (eight in the present embodiment) first contact pins 422 project from the end surface of the first positioning block 421 on the opening 404 side. In addition, one end is connected to both ends of the first positioning block 421 in the arrow y direction, and the other end is connected to and fixed to a bolt 429 protruding from the surface of the upper wall 401 of the device case 400. 423 is bridged. The coil spring 423 is set so as to constantly urge the first positioning block 421 in the direction away from the opening 404 (the direction indicated by the thick arrow x1 in FIG. 11).

  Further, as shown in FIGS. 4 to 6 and FIG. 11, the U-shaped stroke regulating member 424 is provided on the side surface of the first positioning block 421 opposite to the opening 404 in the vicinity of both ends in the arrow y direction. It is fixed.

  These stroke regulating members 424 are configured such that the stroke in the arrow x direction is regulated by a stopper member 425 protruding from the upper wall 401. The stopper member 425 is provided so as to be located inside the U-shaped shape of the stroke restricting member 424.

  Further, a driving force transmission rod 426 is fixedly provided at the center of the first positioning block 421 in the width direction (arrow y direction) on the end surface of the first positioning block 421 located on the opposite side of the opening 404. A compression coil spring 427 is passed through the drive force transmission rod 426 so that the drive force transmission rod 426 can slide in the axial direction on the first drive transmission plate 428 via the compression coil spring 427. It is inserted. As shown in FIGS. 4 to 6 and FIG. 11, the first drive transmission plate 428 is connected to a later-described interlocking mechanism 800 (see FIG. 10) in the apparatus case 400 through a plate opening 430 formed in the upper wall 401. )) And is driven to reciprocate in the direction of the arrow x in accordance with the operation of the interlocking mechanism 800.

  The first positioning block 421 is a metal block having a length extending over a pair of guide rails 411, and guide grooves (not shown) for guiding the guide rails 411 are formed on the lower surfaces of both end portions in the arrow y direction. .

  As shown in FIG. 5, the first contact pin 422 includes a thin tip pin 422A and a base pin 422B that fits the tip pin 422A coaxially. The base pin 422B is implanted in the first positioning block 421. The tip pin 422A is always urged with a predetermined force by a spring (not shown) in a direction protruding from the base pin 422B. Further, the distal end of the distal end pin 422A is positioned and set so as to be able to contact substantially the center of the opposing end surface of the glass chip 600 placed on the substrate placement projection 512 of the substrate placement portion 507.

  The first positioning unit 420 having such a configuration performs an advance / retreat operation in the direction of the arrow x with a predetermined stroke according to the positional relationship between the stroke restricting member 424 and the stopper member 425 in accordance with the reciprocating operation of the first drive transmission plate 428. It is like that. At this time, when the first positioning block 421 moves most toward the opening 404 side where the substrate mounting portion 507 is exposed, the tip pin 422A of the first contact pin 422 hits the end surface of the glass chip 600 and Positioning is performed. The highest pressure at which the tip pin 422A contacts the end surface of the glass chip 600 is set to be a predetermined pressure (for example, 100 gf) or less.

  In the initial state in which the glass chip 600 is placed on the substrate platform 507, the tip of the tip pin 422A is set so as not to come into contact with one end face of the glass chip 600 facing the tip pin 422A. Further, an adjustment screw portion 424A that can finely adjust the stroke by changing the contact position with the stopper member 425 is provided at a portion of the stroke regulating member 424 opposite to the opening 404.

[Second positioning part]
Next, the structure of the 2nd positioning part 440 and the press part 460 is demonstrated using FIGS. 5-8 and FIG.

  First, the second positioning portion 440 is spanned across the pair of guide rails 411 described above, and can be slid or run along the guide rails 411 at a right angle with the guide rails 411. A block 441 is provided.

  The second positioning block 441 is located on the other side of the opening 404 formed in the upper wall 401 of the apparatus case 400 (the side opposite to the first positioning portion 420). Slide shoes 442 that slide or run on the guide rails 411 are provided at lower portions of both ends of the second positioning block 441, respectively.

  In addition, a plurality (eight in this embodiment) of second contact pins 443 are provided on the opening 404 side of the portion (intermediate portion excluding both ends) sandwiched between the pair of guide rails 411 in the second positioning block 441. Is protruding. The second contact pin 443 is positioned so as to be able to abut on the center of the opposite end surfaces of the glass chip 600 placed on the substrate platform 507. The second contact pin 443 includes a thin tip pin 443A and a base pin 443B that fits the tip pin 443A coaxially. The base pin 443B is implanted in the second positioning block 441. The tip pin 443A is always urged with a predetermined force by a spring (not shown) in a direction protruding from the base pin 443B.

  Further, bearing plates 444 are provided upright in the vicinity of both ends and in the middle of the upper surface of the second positioning block 441, respectively. A support shaft 445 penetrates and is supported by these bearing plates 444. An intermediate portion of a plurality (eight in this embodiment) of pressing arms 461 constituting the pressing portion 460 is rotatably supported on the support shaft 445.

  By the way, on the opposite side of the opening 404 in the second positioning block 441, there is provided a pressing block 462 that is parallel to the second positioning block 441 and spans across the pair of guide rails 411. Yes. Slide shoes 463 that slide or run on the guide rail 411 are provided at the lower ends of both ends of the pressing block 462 (see FIG. 8), and are movable along the guide rail 411.

  As shown in FIG. 11, opposed plates 464 and 446 are erected in the vicinity of both end portions on the upper surfaces of the pressing block 462 and the second positioning block 441, and a coil spring 467 is interposed between the opposed plates 464 and 446. In this state, bolts 466 are inserted through the counter plate 446, the coil spring 467, and the counter plate 464 sequentially. A positioning nut 468 is screwed to the bolt 466 outside the counter plate 464 from which the tip side portion of the bolt 466 protrudes. In this state, an interval between the second positioning block 441 and the pressing block 462 is set.

  Pins 469 protrude from both end portions of the upper surface of the pressing block 462. A pin 471 having a coil spring 470 having one end fixed to the pin 469 and a second end fixed to the upper wall 401 of the device case 400 is projected. The coil spring 470 is set to urge the pressing block 462 in a direction away from the opening 404 side.

  Further, as shown in FIGS. 4 to 6 and FIG. 11, the opening 404 side of the second positioning block 441 is located on both sides (both sides in the arrow y direction) of the opening 404 in the upper wall 401 of the apparatus case 400. A positioning block 472 for restricting the movement to is projected. In contrast, positioning contact portions 447 that contact the positioning block 472 are provided at both ends of the second positioning block 441. The positioning block 472 defines a position where the second positioning block 441 is closest to the opening 404 side. For this reason, the load that abuts the end surface of the glass chip 600 with the tip pin 443A of the second contact pin 443 of the second positioning portion 440 is defined by the positions of the positioning block 441 and the positioning contact portion 447. In the present embodiment, the load applied to the end surface of the glass chip 600 by the tip pin 422A is set to be 100 gf or less.

  In addition, a second drive transmission plate 474 (see FIGS. 5, 6, and 10) that protrudes into the apparatus case 400 through the plate opening 473 formed in the upper wall 401 is provided at the center lower portion of the pressing block 462. .) Is provided. The second drive transmission plate 474 is connected to an interlocking mechanism 800 described later.

  Further, as shown in FIGS. 7, 8, and 11, a rising wall portion 475 is erected on the edge of the upper surface of the pressing block 462 opposite to the opening 404, and the upper portion of the rising wall portion 475 is overlaid. A cam wall portion 476 that extends from the edge portion toward the opening 404 and faces the pressing block 462 is formed. A tapered cam surface 476 </ b> A is formed on the lower surface of the cam wall portion 476 so as to be inclined upward as it is away from the opening 404 of the upper wall 401. By this cam surface 476A, a pressing arm 461 of a pressing portion 460 described later is operated.

(Pressing part)
Next, the structure of the press part 460 is demonstrated using FIGS. 5-8 and FIG.

  As described above, the pressing portion 460 includes a plurality of (this embodiment) in which the intermediate portion is rotatably supported by the support shaft 445 fitted and inserted into the three bearing plates 444 provided on the upper surface of the second positioning block 441. Eight pressing arms 461 are configured to press the upper surface of the glass chip 600 placed on the substrate platform 507 under the action of the cam wall 476 described above.

  At the end of the pressing arm 461 on the opening 404 side, a chip pressing portion 461A that protrudes downward is provided. A wheel 461B that rolls in contact with the lower surface of the cam wall 476 is rotatably provided at the other end of the pressing arm 461. Further, as shown in FIGS. 7 and 8, the wheel 461B is always attached upward from the second positioning block 441 side between the support shaft 445 and the end portion where the wheel 461B is provided in the pressing arm 461. An energizing compression spring 448 is interposed.

  The pressing portion 460 advances and retreats in the direction of the arrow x together with the second positioning portion 440 according to the operation of the rotary handle 407, and after pressing the glass chip 600 with the tip pin 443A of the second positioning portion 440, Alternatively, as the wheel 461B moves up the cam surface 476A on the upper surface of the glass chip 600 at the same time as being pressed, the chip pressing portion 461A descends and holds the glass chip 600 with a predetermined pressure (a load of 100 gf or less). Is set. In order to set the pressure at which the chip pressing portion 461A presses the glass chip 600, the setting of the urging force of the compression spring 448 shown in FIGS. 7 and 8 may be adjusted.

  In particular, the position where the chip pressing portion 461A contacts the glass chip 600 is protruded from the substrate mounting portion 507 when the glass chip 600 is positioned at an appropriate position by the tip pin 443A of the second positioning portion 440. It is set at a position outside the path of the light emitted from the light source module 530 inside the rectangular area formed by connecting the four substrate mounting protrusions 512.

[Interlocking mechanism]
Next, the interlocking mechanism 800 will be described with reference to FIG. FIG. 10 shows a state in which the upper wall 401 of the device case 400 is viewed from the lower surface side, and shows a state in which the optical block 500 is omitted.

  The interlocking mechanism 800 in the present embodiment is provided on the lower surface side of the upper wall 401 of the device case 400. The interlocking mechanism 800 is coaxially extended from the lower part of the rotation base 408 of the rotary handle 407 and is interlocked with a rotary shaft 410 that penetrates the upper wall 401 and protrudes into the device case 400. .

  As shown in FIG. 10, a rotating arm 801 as an arm portion fixed at an intermediate portion is provided at the lower end of the rotating shaft portion 410 so as to be orthogonal to the rotating shaft portion 410. A fixing pin 802 is fixed to the lower surface of the upper wall 401 on the side of the rotation shaft portion 410 in the direction of the arrow x. One end of a coil spring 803 is fixed to the fixing pin 802. A fixing pin 804 that fixes the other end of the coil spring 803 is provided at one end of the rotating arm 801. It should be noted that the coil spring 803 is positioned substantially on the extension of the rotating shaft 410 and is set to be in the most extended state in a state where the fixing pins 802 and 804 are most separated from each other. For example, in this state, when the rotary handle 407 is slightly rotated in either one of the rotation directions, the coil spring 803 contracts so that the rotating arm 801 is forcibly rotated by the coil spring 803.

  As shown in FIG. 10, a stopper member 805 is provided on the side of the other end 801 </ b> A of the rotating arm 801 in the state where the coil spring 803 is most stretched. When the first positioning unit 420, the second positioning unit 440, and the pressing unit 460 described above are on standby in a state where they are separated from the opening 404, the other end 801A of the rotating arm 801 comes into contact with the stopper member 805. ing.

  A pin 806 protrudes upward between the fixed pin 804 at one end and the rotating shaft 410 in the rotating arm 801. A reciprocating rod 807 that is movable in the direction of arrow y is connected to the rotating arm 801 via a pin 806. The reciprocating rod 807 slides on a guide rail 811 provided on the lower surface of the upper wall 401 so as to extend along the arrow y direction.

  A long hole 808 into which the pin 806 is fitted is formed on the peripheral surface of one end of the reciprocating rod 807. The long hole 808 is formed so that the pin 806 can be moved in the arrow x direction. For this reason, the reciprocating rod 807 can reciprocate in the direction of the arrow y as the pivot arm 801 swings.

  Drive transmission plates 809 and 810 are formed integrally with the other end of the reciprocating rod 807 so as to extend toward both sides in the direction of the arrow x. These drive transmission plates 809 and 810 transmit the driving force to the first transmission arm portion 812 and the second transmission arm portion 813.

  As shown in FIG. 10, the first transmission arm portion 812 has one end engaged with the drive transmission plate 810 and an L-shaped swing arm 814 bent substantially at a right angle at the middle portion, A transmission arm 815 that is rotatably connected to the other end of the arm 814, is formed on the upper wall 401, and is integrally provided with the first drive transmission plate 428 on the free end side. Yes.

  The bent portion of the swing arm 814 is pivotally supported by the support shaft 816 with respect to the lower surface of the upper wall 401. The first drive transmission plate 428 is provided so as to form a right angle upward with respect to the free end of the transmission arm 815, and is directed upward from the upper wall 401 via the plate opening 430 described above. Protruding. The upper end portion of the first drive transmission plate 428 is connected to the first positioning block 421 via the drive force transmission rod 426 described above.

  The second transmission arm portion 813 has one end engaged with the drive transmission plate 809 and an L-shaped swing arm 816 bent substantially at a right angle at the intermediate portion, and the other end of the swing arm 816. And a transmission arm 817 integrally connected to the second drive transmission plate 474 on the free end side.

  The bent portion of the swing arm 816 is pivotally supported by the support shaft 818 with respect to the lower surface of the upper wall 401. The second drive transmission plate 474 is provided so as to form a right angle upward with respect to the free end of the transmission arm 817, and is directed upward from the upper wall 401 via the plate opening 473 described above. Protruding. The upper end portion of the second drive transmission plate 474 is integrally provided at the lower center portion of the above-described pressing block 462.

[Operation and Action of Concentration Measurement Device of this Embodiment]
First, the operation and action when measuring the concentration of an object to be measured using the concentration measuring apparatus 100 according to the present embodiment will be described.

(Chip carrier placement)
An object to be measured such as a protein solution is dropped and placed on the sample placement portion 601 on the upper surface of the glass chip 600. In addition, depending on the object to be measured, a reaction treatment or addition of a dye is appropriately performed.

  Next, as shown in FIG. 2, the glass chip 600 is placed on the chip carrier 700. In FIG. 2, one glass chip 600 is shown, but a plurality (eight in this embodiment) of glass chips 600 are placed on the chip carrier 700.

  Thereafter, the operator carries the chip carrier 700 on which the glass chip 600 is placed with the operation rod 707 to the substrate placement surface 506 of the optical block 500 exposed at the opening 404 of the apparatus case 400. At this time, as shown in FIG. 3, carrier positioning pins 514 on the optical block 500 side are fitted into positioning holes 706 (see FIG. 2) formed in the chip carrier 700 to position the chip carrier 700. At this time, the glass chip 600 is placed on the four substrate placement protrusions 512 projecting from the respective substrate placement portions 507, and is in a floating state from the chip carrier 700. Here, the movement of the glass chip 600 in the arrow y direction is restricted by the positioning protrusions 513 provided on both sides of the substrate mounting portion 507, and the movement in the arrow x direction is possible.

  FIG. 3 shows a state where one glass chip 600 is placed, but usually a plurality of glass chips 600 are placed simultaneously as described above. At this time, as shown in FIGS. 5 and 7, the tip of the tip pin 422 </ b> A of the first contact pin 422 of the first positioning portion 420 is in a standby state where it does not contact one end surface of the glass chip 600. Further, the tip of the tip pin 443A of the second contact pin 443 of the second positioning portion 440 and the tip pressing portion 461A of the pressing portion 460 are in a standby state where they do not contact the other end surface and surface of the glass chip 600.

(Operations and actions associated with the operation of the rotating handle)
Next, the handle portion 409 of the rotary handle 407 at the position shown in FIG. 5 is held and rotated to the position shown in FIG. 6 in the direction indicated by the arrow a in the figure. When the rotary handle 407 is in the position shown in FIG. 5, as shown in FIG. 10, the rotating arm 801 located below the upper wall 401 is in the position indicated by the two-dot chain line, and the other end of the rotating arm 801 801A is in pressure contact with the stopper member 805 by the pulling force of the coil spring 803. Then, by rotating the rotary handle 407 as described above, the coil spring 803 is stretched against the pulling force, and when the central axis of the coil spring 803 passes the rotating shaft portion 410, it is rotated again by the pulling force of the coil spring 803. The arm 801 is urged to rotate toward the position indicated by the solid line in FIG. As the turning arm 801 rotates, the reciprocating rod 807 moves from the position indicated by the two-dot chain line in FIG. 10 to the position indicated by the solid line. Accordingly, the swinging arms 814 and 816 engaged with the drive transmission plates 809 and 810 of the reciprocating rod 807 are rotated from the position indicated by the two-dot chain line in FIG. 10 to the position indicated by the solid line. The transmission arms 815 and 817 move toward each other as the swinging arms 814 and 816 rotate.

(Operation and action of the first positioning portion, the second positioning portion, and the pressing portion)
As described above, when the transmission arms 815 and 817 come close to each other by the rotation of the swinging arms 814 and 816, the first drive transmission plate 428 provided integrally with the distal end of the transmission arm 815 and the distal end of the transmission arm 817. The second drive transmission plate 474 provided integrally is close to each other. As shown in FIG. 5, the upper end portion of the first drive transmission plate 428 is connected to one end side of the drive force transmission rod 426 via the compression coil spring 427. The other end side of the driving force transmission rod 426 is connected to the central portion of the first positioning block 421. The upper end portion of the second drive transmission plate 474 is connected to the central portion of the pressing block 462. For this reason, when the rotary handle 407 is rotated as described above, the first positioning block 421 and the pressing block 462 are moved closer to each other.

  When the first positioning block 421 and the pressing block 462 are moved closer to each other, the second positioning block 441 connected to the pressing block 462 via the coil spring 467 and slidably provided on the guide rail 411 is also moved together with the pressing block 462. Move to the first positioning block 441 side.

  With the movement of the first positioning block 441 as described above, the tip of the tip pin 422A of the first contact pin 422 contacts one end surface of the glass chip 600, as shown in FIGS. The tip of the tip pin 443A of the second contact pin 443 in the second positioning portion 440 contacts the other end surface of the glass chip 600.

  At this time, as shown in FIG. 6, the first positioning block 421 is positioned by contacting the stroke regulating member 424 and the stopper member 425. When the other end surface of the glass chip 600 is pressed toward the first positioning portion 420 in the arrow x direction with the tip of the tip pin 443A of the second contact pin 443, the tip pin 422A of the first contact pin 422 is pushed. Movement in the direction of the arrow x is prevented while being pushed into the base pin 422B by a predetermined distance. Note that the stroke of the first contact pin 422 that protrudes and retracts from the base pin 422B of the tip pin 422A is such that the glass chip 600 is positioned when the tip pin 422A is most retracted. The relationship with the member 425 is also set in consideration.

  On the other hand, in the second positioning portion 440, the tip of the tip pin 443A of the second contact pin 443 is moved along the other end face of the glass chip 600 in accordance with the movement of the second positioning block 441. The glass chip 600 is moved toward the first positioning portion 420 by pressing toward the side. The second positioning block 441 moves to the first positioning portion 420 side in the arrow x direction together with the pressing block 462 side via the coil spring 467. Thereafter, the second positioning block 441 contacts the positioning block 472 and is prevented from moving toward the first positioning unit 420 in the arrow x direction. At this time, the tip pin 443A of the second contact pin 443 is retracted partway with respect to the base pin 443B. That is, with the glass chip 600 positioned, the tip pin 443A of the second contact pin 443 is set to an intermediate position of a stroke that can be projected and retracted with respect to the base pin 443B. The reason for this is to prevent the glass chip 600 from being strongly pressed and damaged by the tip pin 443A of the second contact pin 443.

  Next, when the pressing block 462 is further pressed toward the first positioning portion 420 in a state where the second positioning block 441 is in contact with the positioning block 472, the coil spring 467 is compressed and the pressing block 462 becomes the second positioning block. It moves to a position where it abuts against 441. With the change in the relative position between the pressing block 462 and the second positioning block 441, the pressing unit 460 performs the operation described below.

  First, as the pressing block 462 approaches the second positioning block 441, the wheel 461B provided at the end of the pressing arm 461 rolls along the cam wall portion 476 on the pressing block 462 side, and the cam surface 476A is moved along the wheel 461B. Is set to hold the glass chip 600 at a predetermined pressure (weight of 100 gf or less).

  In particular, the position where the chip pressing portion 461A contacts the glass chip 600 is protruded from the substrate mounting portion 507 when the glass chip 600 is positioned at an appropriate position by the tip pin 443A of the second positioning portion 440. It is set at a position outside the path of the light emitted from the light source module 530 inside the rectangular area formed by connecting the four substrate mounting protrusions 512.

  As shown in FIG. 10, the coil spring 803 having one end fixed to the end of the rotating arm 801 and the other end fixed to the lower surface of the upper wall 401 of the device case 400 with a fixing pin 802 includes the rotating arm. Due to the swing of 801, the rotating shaft portion 410 of the rotating arm 801 is passed. Since the coil spring 803 is compressed when it passes through the rotating shaft portion 410, the coil spring 803 performs an operation (quick motion operation) forcibly rotating the rotating arm 801. Further, as shown in FIG. 5 and FIG. 6, the first positioning block 421 and the pressing block 462 are biased in the direction away from each other by the coil springs 423 and 470, and thus the first positioning portion 420 and the second positioning portion 440. In order to release the pressing portion 460, the rotating handle 407 is rotated in the direction opposite to the direction indicated by the thick arrow a in FIG. 5 until the coil spring 803 connected to the rotating arm 801 passes the rotating shaft portion 410. Then, the release can be performed by the quick motion operation described above.

(Measurement start operation and action)
Next, as shown in FIG. 1, the drive switch 405 such as the light source module 530 can be turned on by closing the lid 300 of the device case 400 and pressing the open / close confirmation switch 412 with the pin 301. When the drive switch 405 is turned on, light is emitted from the light source module 530, and incident light that has passed through the glass chip 600 can be detected by the detector 531. As described above, the concentration of the object to be measured placed in the sample placement unit 601 can be specified by detecting the amount of incident light by the detector 531.

(Effect of this embodiment)
In the concentration measuring apparatus 100 according to the present embodiment, the measurement accuracy is high and the working time can be shortened.

  In the concentration measurement apparatus 100 according to the present embodiment, since the light source module 530 and the detector 531 are fixed to the optical block 500 made of a metal block, the optical axis of the light emitted from the light source module 530 is set. While improving accuracy, it can control that an optical axis shifts after setting. For this reason, in the present embodiment, it is possible to apply a predetermined incident angle θ at which light emitted from the light exit passage 508 is incident on the lower surface of the glass chip 600 to the glass chip 600 with high accuracy.

  By forming the light exit path 508 and the light incident path 509 in the optical block 500, it is possible to prevent light from being irradiated in the wrong direction.

  Furthermore, by forming the non-detection light removal passage 510 in the optical block 500, the Fresnel reflection component reflected by the lower surface of the glass chip 600 can be effectively removed. That is, Fresnel reflection components that are not used for detecting the concentration of the object to be measured can be excluded from the non-detection light removal path 510. For this reason, the detection accuracy of the concentration measuring apparatus 100 can be improved.

  In the concentration measurement apparatus 100 according to the present embodiment, the chip carrier 700 is placed on the substrate placement surface 506 in the optical block 500 so that the glass chip 600 is movable only in the uniaxial direction (arrow x direction). The arrangement and positioning of the glass chip 600 are facilitated. Furthermore, since the pressure which presses the glass chip 600 with the 1st positioning part 420, the 2nd positioning part 440, and the press part 460 can be easily set by selecting the urging | biasing force of each spring member, it is glass at the time of a measurement. The chip 600 can be prevented from being deformed, and the measurement accuracy can be further increased.

  In the concentration measuring apparatus 100 according to the present embodiment, the exit opening 508B of the light exit passage 508, the entrance opening 509B of the light entrance passage 509, and the non-detection light removal passage 510 that are opened on the substrate platform 507 are provided. Since the non-detection light incident opening 510A is covered with a single protective glass 511, even if a liquid measurement object spills from the glass chip 600, the liquid reaches the light source module 530, the detector 531 and the like. It is possible to prevent electrical and optical adverse effects such as failure and accuracy degradation.

  In addition, since the liquid storage groove 515 is formed on the substrate mounting surface 506 on the outside of the substrate mounting portion 507, it is possible to prevent the apparatus from being soiled with a liquid measurement object. In addition, since a submerged sheet 516 that causes discoloration due to contact with the liquid is disposed at the bottom of the liquid reservoir groove 515, it can be easily recognized that an object to be measured is leaking.

  In the concentration measuring apparatus 100 according to the present embodiment, since a plurality of glass chips 600 can be juxtaposed, work efficiency can be improved. And since the glass chip 600 will be in the state which floated from the chip carrier 700 when mounted in the board | substrate mounting part 507, there exists an advantage that the freedom degree of the shape of the chip carrier 700 becomes high.

[Other Embodiments]
It should not be understood that the descriptions and drawings which form part of the disclosure of the above-described embodiments limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, in the above-described embodiment, the member that presses the glass chip 600 in the first positioning portion 420 and the second positioning portion 440 is configured with a contact pin. It is possible to apply various members such as a plate material that comes into contact. Further, the interlocking mechanism that transmits the driving force to the first positioning block 421, the second positioning block 441, and the pressing block 462 is not limited to the above-described embodiment, and other link mechanisms and the like can be applied. .

  In the above-described embodiment, the wheel 461B rolls on the cam surface 476A, so that the pressing arm 461 of the pressing unit 460 is swung to press the chip pressing unit 461A against the surface of the glass chip 600. Of course, a mechanism in which the pressing arm 461 rotates depending on the relative distance between the pressing block 462 and the second positioning block 441, for example, a rack and pinion mechanism may be applied.

  In the above-described embodiment, the output opening 508B, the incident opening 509B, and the non-detection light incident opening 510A are closed with one protective glass 511, but protective glass is provided in each opening. Alternatively, these openings may be closed with two protective glasses. In this case, the planar shape is not limited as long as the opening can be closed. In addition, in the above-described embodiment, the surface of the protective glass 511 may be provided with an antireflection film.

  In the embodiment described above, the protective glass 510 is used, but a transparent material other than glass can also be used. In this case, what is necessary is just to be able to realize sufficient optical transparency with respect to the light (laser light) emitted from the light source module 530 and surface accuracy capable of obtaining flatness of about the wavelength.

  In the above-described embodiment, the liquid reservoir groove 515 is formed only on both sides of the substrate placement surface 506, but the liquid reservoir groove may of course be formed so as to surround the substrate placement surface 506.

  In the above-described embodiment, the four substrate mounting protrusions 512 are provided on the substrate mounting portion 507. However, at least three or more substrate mounting protrusions 512 are provided at positions that do not interfere with the light path. Any configuration may be used.

  In the above-described embodiment, the optical block 500 formed by metal shaving is used. However, if the light source module 530, the semiconductor laser 531 and the like can be mounted integrally, the processing method and materials are changed as appropriate. Is possible.

  In the above-described embodiment, the light source module 530 is not limited to this using the semiconductor laser 531 as the light source.

It is a perspective view which shows the outline of the density | concentration measuring apparatus which concerns on embodiment of this invention. It is a disassembled perspective view which shows the optical block and chip carrier of the density | concentration measuring apparatus which concerns on embodiment of this invention. It is a perspective view which shows the state which mounted the chip carrier in the optical block of the density | concentration measuring apparatus which concerns on embodiment of this invention. In the concentration measuring apparatus which concerns on embodiment of this invention, it is a perspective view which shows the state which removed the cover body, the 1st cover, and the 2nd cover. In the concentration measuring apparatus which concerns on embodiment of this invention, it is a principal part top view which shows the state which has not positioned the glass chip. In the concentration measuring apparatus which concerns on embodiment of this invention, it is a principal part top view which shows the state which has positioned the glass chip. It is a figure which shows the state which has not positioned the glass chip in the AA cross section of FIG. It is a figure which shows the state which has positioned the glass chip in the AA cross section of FIG. It is AA sectional drawing of FIG. It is a figure which shows the interlocking mechanism of the density | concentration measuring apparatus which concerns on this Embodiment. It is a principal part perspective view of the density | concentration measuring apparatus which concerns on this Embodiment. It is sectional explanatory drawing which shows the optical waveguide of a glass chip.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100 ... Concentration measuring apparatus, 200 ... Apparatus main body, 300 ... Cover body, 400 ... Apparatus case, 401 ... Upper wall, 404 ... Opening part, 407 ... Rotating handle, 410 ... Rotating shaft part, 420 ... 1st positioning part, 421 ... first positioning block, 428 ... first drive transmission plate, 440 ... second positioning section, 441 ... second positioning block, 445 ... support shaft, 460 ... pressing section, 461A ... chip pressing section, 474 ... second driving transmission Plate, 476 ... Cam wall, 500 ... Optical block, 506 ... Substrate placement surface, 507 ... Substrate placement part, 512 ... Substrate for projection, 513 ... Positioning projection, 514 ... Carrier positioning pin, 530 ... Light source module 531 ... Semiconductor laser, 531 ... Detector, 600 ... Glass chip (optical waveguide substrate), 700 ... Chip carrier (substrate carrier), 00 ... interlocking mechanism 801 ... rotating arm (arm portion), 807 ... reciprocating rod 812 ... first transfer arm, 813: second transfer arm.

Claims (10)

A concentration measuring device that performs measurement by irradiating light to pass through the optical waveguide substrate to the object to be measured disposed on the optical waveguide substrate and receiving return light from the optical waveguide substrate,
An apparatus main body having a substrate mounting portion on which the optical waveguide substrate is mounted;
A positioning guide that allows the optical waveguide substrate mounted on the substrate mounting portion to move only in a specific direction;
A first positioning unit for positioning the optical waveguide substrate in contact with one end surface in the specific direction of the optical waveguide substrate mounted on the substrate mounting unit;
A second positioning portion that presses the other end surface of the optical waveguide substrate in the specific direction;
A pressing portion that presses the optical waveguide substrate toward the substrate mounting portion;
An interlocking mechanism for interlocking the first positioning part, the second positioning part, and the pressing part;
A concentration measuring device comprising: The first positioning part is disposed on one side of the specific direction of the substrate mounting part, and is provided so as to be reciprocable with a certain stroke along the specific direction.
The second positioning part is disposed on the other side of the specific direction of the substrate mounting part, and is provided so as to be able to reciprocate along the specific direction.
The pressing portion is provided so as to move along the specific direction together with the second positioning portion, and the optical waveguide substrate is positioned by the first positioning portion and the second positioning portion. The concentration measuring apparatus according to claim 1, wherein the waveguide substrate is pressed and held. The interlocking mechanism is set to bring the first positioning portion and the second positioning portion close to and away from each other,
The concentration measuring apparatus according to claim 2, wherein the first positioning unit positions the optical waveguide substrate when moving to the other side in the specific direction. The tip portion of the first positioning portion that contacts one end surface of the optical waveguide substrate is biased by a spring toward the other side in the specific direction,
4. The tip portion of the second positioning portion that contacts the other end surface of the optical waveguide substrate is biased by a spring toward one side in the specific direction. The density | concentration measuring apparatus as described in any one of these. The apparatus main body is provided with a guide part for guiding the first positioning part and the second positioning part along the specific direction, and the first positioning part and the second positioning part are separated from each other. Spring-loaded in the direction,
A rotary shaft of the rotary handle is rotatably supported by the apparatus main body, and an arm portion perpendicular to the rotary shaft is fixed, and is provided between one end of the arm portion and the rotary shaft. Having a reciprocating rod that is pivotably connected and reciprocates along the axial direction;
One end portion of each of the pair of swing arms pivotally supported by the apparatus main body so that each intermediate portion thereof is pivotally moved together with the reciprocating rod, and the other end of each of the pair of swing arms The spring is attached to bias the first positioning portion and the second positioning portion when the other ends of the pair of swinging arms are close to each other. 5. The concentration measuring apparatus according to claim 1, wherein the first positioning portion and the second positioning portion are brought close to each other against a force. 6.   The front end portions of the first positioning portion and the second positioning portion that are in contact with the end surfaces of the optical waveguide substrate are provided so as to be able to project and retract along the specific direction, and are urged in a protruding direction, so that the first positioning portion is provided. 6. The concentration measuring apparatus according to claim 1, wherein a distal end portion of the portion is set so as to position the optical waveguide substrate at a most retracted position.   The concentration measuring apparatus according to claim 1, wherein a plurality of the substrate mounting portions are provided side by side along a direction orthogonal to the specific direction. The apparatus main body is provided with the substrate mounting portion on a surface thereof, a light emitting path communicating with an emission opening formed in the substrate mounting portion, and light communicating with an incident opening formed in the substrate mounting portion. An optical block in which an incident path is formed, and a device case containing the optical block so that the substrate mounting portion is exposed,
8. The concentration measuring apparatus according to claim 1, wherein a surface of the apparatus case on which the substrate placement unit is exposed can be opened and closed with an opening / closing lid.   The rotating handle is provided at a lateral position of the substrate platform exposed from the device case, and the rotating shaft of the rotating handle passes through the device case and penetrates toward the inside of the device case. The concentration measuring apparatus according to claim 8, wherein the interlocking mechanism is provided inside an apparatus case. A concentration measuring device that performs measurement by irradiating light to pass through the optical waveguide substrate to the object to be measured disposed on the optical waveguide substrate and receiving return light from the optical waveguide substrate,
An apparatus main body having a substrate mounting portion for mounting the optical waveguide substrate;
A positioning guide that allows the optical waveguide substrate mounted on the substrate mounting portion to move only in a specific direction;
A first positioning unit for positioning the optical waveguide substrate in contact with one end surface in the specific direction of the optical waveguide substrate mounted on the substrate mounting unit;
A second positioning portion that presses the other end surface of the optical waveguide substrate in the specific direction;
A pressing portion that presses the optical waveguide substrate toward the substrate mounting portion;
An interlocking mechanism for interlocking the first positioning part, the second positioning part, and the pressing part;
A rotating handle for operating the interlocking mechanism;
The optical waveguide substrate is placed on the apparatus main body so as not to interfere with the substrate mounting section, the first positioning section, and the second positioning section in a state in which the optical waveguide substrate is housed, and the optical waveguide is mounted on the apparatus main body. A substrate carrier separated from the substrate;
A concentration measuring apparatus comprising:

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