JP2006152346A - Surface treatment apparatus, surface treatment method, and electro-optical apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface treatment apparatus and a surface treatment method capable of performing a plurality of surface treatments of a work with the minimum common power even when performing the surface treatment by using a plurality of gases. <P>SOLUTION: In the surface treatment apparatus for treating a work 70 by activating reaction gas introduced under the atmospheric pressure or the pressure in a vicinity of the atmospheric pressure between a first electrode 20 and a second electrode arranged facing each other through the plasma discharge, dielectric bodies 41, 42 having a plurality of flow passages to flow reaction gas are provided between the first electrode 20 and the second electrode, the different reaction gases are introduced in a plurality of flow passages 91, 92, a plasma discharge generation unit is formed by supplying the power to the first electrode 20 or the second electrode , and the flow passage length of the flow passages 91, 92 of the dielectric bodies 41, 42 extending between the first electrode 20 and the second electrode is different from each other corresponding to the type of the reaction gas. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

    The present invention relates to a surface treatment apparatus and a surface treatment method for treating the surface of an object to be treated (also referred to as a workpiece) by performing plasma discharge under atmospheric pressure or a pressure near atmospheric pressure.

  There has been proposed an apparatus for performing a surface treatment on an object to be processed using plasma discharge under atmospheric pressure or a pressure near atmospheric pressure. The advantage of surface treatment by plasma discharge under atmospheric pressure or near atmospheric pressure is that it does not require equipment for formation and control in a low-pressure atmosphere compared to plasma discharge under vacuum. It is easy to realize and reduce the manufacturing cost.

Such a surface treatment apparatus using plasma generates a plasma discharge generation part (also referred to as a discharge region) generated under a pressure near atmospheric pressure between a pair of electrodes. A gas is introduced from one electrode through the vent hole. This gas enters the plasma discharge generating part through the porous body after passing through the vent hole. Further, two or more dielectrics and reaction gas flow paths are provided between the pair of electrodes. By doing in this way, two or more types of surface treatments can be performed simultaneously on the object to be processed (see, for example, Patent Document 1).
JP-A-6-2149 (first page, FIG. 1)

However, such a conventional plasma surface treatment apparatus has the following problems.
A conventional plasma surface treatment apparatus used under atmospheric pressure forms one discharge generating portion between a pair of electrodes. And this one discharge generation part activates the reactive gas (also called process gas) required for one kind of process, and performs a desired surface treatment with respect to a to-be-processed object.
With such a structure, when it is necessary to process using another type of reaction gas, the surface treatment operation is performed by switching the gas type from one type of reaction gas already used to another type of reaction gas. There is a need to do.

When a plurality of types of surface treatments are continuously performed on the object to be processed by switching the gas types in this way, it takes time to switch the gas types as described above, and the surface treatment work time is considerable. It takes a long time.
Moreover, since the conventional plasma processing apparatus has only one discharge generation part, it cannot expose to the discharge generation part in multiple times with respect to the surface of one to-be-processed object.

  Further, there is a method in which two or more dielectrics and reaction gas flow paths are provided between a pair of electrodes, and two or more kinds of treatments are performed with the pair of electrodes. With such a structure, it is necessary to apply electric power in accordance with the gas type that is most difficult to activate. Thus, when power is applied in accordance with the gas type that is most difficult to activate, wasteful power is required to activate the gas that is easily activated.

  Accordingly, the present invention solves the above problems, and even when performing surface treatment using a plurality of types of gases, a surface treatment apparatus and a surface capable of performing a plurality of surface treatments on an object to be processed with a minimum common power It aims to provide a processing method.

  In order to solve the above-mentioned problems, the present invention activates a reactive gas introduced between the first electrode and the second electrode arranged opposite to each other under atmospheric pressure or a pressure near atmospheric pressure by plasma discharge. Thus, in the surface treatment apparatus for treating an object to be processed, a dielectric having a plurality of flow paths for flowing the reaction gas is provided between the first electrode and the second electrode. Different types of the reaction gas are introduced into the plurality of flow paths, and a plasma discharge generation unit is formed by supplying power to the first electrode or the second electrode, corresponding to the type of the reaction gas. The channel lengths of the channels of the dielectric extending between the first electrode and the second electrode are different.

  According to this configuration, since the length of the flow path extending between the first electrode and the second electrode is different, a discharge generating portion having a different length is formed for each flow path. It is assumed that the discharge generation part is generated in a region of the flow path that overlaps the first electrode and the second electrode. Along with this, the staying time of the reaction gas introduced into each flow path is also different, and if the flow path has a long flow path, the flow extending between the first electrode and the second electrode. The path length becomes longer and the distance of the discharge generating part becomes longer. Further, since the dielectric is provided between the first electrode and the second electrode, the same output power is supplied to each of the plurality of flow paths provided in the dielectric. Therefore, for example, when a reaction gas that is easily activated and a reaction gas that is difficult to activate are used, if a reaction gas that is difficult to activate is introduced into a channel having a long channel length, the reaction gas that is difficult to activate is generated for a long time. Stay in the department and be activated. Thereby, the reactive gas which is hard to activate is activated with the same output power as the reactive gas which is easy to activate. Therefore, when a plurality of reaction gases having different activations are used, the surface treatment of the object to be processed is performed by reliably activating a plurality of different reaction gases in accordance with the output power (minimum power) of the reaction gas that is easily activated. It can be carried out.

In the surface treatment apparatus of the present invention, the first flow path of the flow paths provided in the dielectric is provided to extend between the first electrode and the second electrode in a substantially straight line. The second flow path has a curved portion at least partially and is provided to extend between the first electrode and the second electrode, and the flow path length may be longer than the first flow path. preferable.
According to this configuration, since the second flow path has a curved portion at least in part, the flow direction of the introduced reaction gas changes in the curved portion and convects in the vicinity of the curved portion. As a result, the flow rate of the introduced reaction gas is reduced, and the reaction gas can stay in the discharge generating portion for a long time. Therefore, for example, when a reactive gas that is difficult to activate is introduced into the second flow path, the reactive gas can be activated with the same output power as the first flow path.

Moreover, the surface treatment apparatus of the present invention includes the flow paths provided in the plurality of dielectrics.
The areas of the portions of the first electrode and the second electrode corresponding to each of the flow paths are made different for each of the flow paths, and the flow path, the first electrode, and the second electrode It is also preferable to make the overlapping regions different.
According to this structure, the length of the discharge generation part which generate | occur | produces in the overlapping area | region with a flow path and the said 1st electrode and the said 2nd electrode can be varied for every flow path. Thereby, the reactive gas which is hard to activate can be made to stay in the discharge generation part for a long time and can be activated by introduce | transducing into the long flow path of a discharge generation part. Therefore, when a reactive gas that is easily activated and a reactive gas that is difficult to activate are used, if the reactive gas that is difficult to activate is introduced into the long flow path of the discharge generating portion, it is activated with the same output power as the reactive gas that is easily activated. The

Further, the surface treatment apparatus of the present invention includes a gas supply unit for supplying the reaction gas, a treatment holding means on which the treatment target is mounted, and the table while the treatment target faces each dielectric. It is also preferable that the plurality of flow paths are provided along the moving direction of the object to be processed.
According to this configuration, since the plurality of flow paths are provided along the moving direction of the object to be processed, different processes can be performed on the object to be processed simultaneously or successively. As a result, the number of devices to be used can be reduced and the process can be simplified, and the overall cost can be reduced.

  In the surface treatment method of the present invention, a reaction gas introduced under atmospheric pressure or a pressure in the vicinity of atmospheric pressure is plasma-discharged between a first electrode and a second electrode that are arranged to face each other. A surface treatment method for treating the surface of each of the plurality of flow paths having different flow path lengths corresponding to the type of the reaction gas extending between the first electrode and the second electrode, The reaction gases of different types are introduced, the reaction gases that have passed through the flow paths having different flow path lengths are activated, and the activated reaction gases are injected onto the surface of the object to be moved relative to each other. A plurality of types of treatments are performed on the surface of the treatment body.

  According to this method, since the lengths of the flow paths extending between the first electrode and the second electrode are different, the time of staying in the discharge generation portion of the reactive gas introduced into each flow path is also different. Therefore, for example, when a reaction gas that is easily activated and a reaction gas that is difficult to activate are used, if a reaction gas that is difficult to activate is introduced into a channel having a long channel length, the reaction gas that is difficult to activate is generated for a long time. Stay in the department and activate. Thereby, the reactive gas which is hard to activate is activated with the same output power as the reactive gas which is easy to activate. Therefore, when a plurality of reaction gases having different activations are used, the surface treatment of the object to be processed is performed by reliably activating a plurality of different reaction gases in accordance with the minimum power that is the output power of the reaction gas that is easily activated. It can be carried out.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings.
[First Embodiment]
1 and 2 show a first preferred embodiment of the surface treatment apparatus of the present invention.
FIG. 1 is a plan view showing a schematic configuration of the surface treatment apparatus, and FIG. 2 is a cross-sectional view taken along line AA of the surface treatment apparatus of FIG.

The surface treatment apparatus 10 in FIGS. 1 and 2 is also called an atmospheric pressure plasma surface treatment apparatus.
The surface treatment apparatus 10 uses a plurality of discharge generators having different lengths due to plasma discharge under atmospheric pressure or a pressure near atmospheric pressure to continuously or simultaneously perform surface treatment on the surface of the object to be treated 70 with a minimum amount. It is a device that can be operated with electric energy. The surface treatment apparatus 10 is an apparatus that continuously performs surface treatment of the object 70 with a plurality of types of reaction gases with a minimum amount of electric power.

Here, the surface treatment used in the embodiment of the present invention includes surface modification such as ashing, etching, hydrophilic treatment and water repellent treatment, cleaning, film formation, and the like. The ashing process is a process for removing organic substances on the surface of the object 70 such as a glass substrate. The etching process is a process for removing a film formation on the surface of the object 70 such as a glass substrate. A hydrophilic process is a process which forms a hydrophilic film | membrane on the surface of the to-be-processed object 70, such as a glass substrate, for example. The water repellent treatment is a treatment for forming a water repellent film on the surface of the object 70 such as a glass substrate.
The type of plasma generated in the surface treatment apparatus 10 is glow discharge plasma generated under atmospheric pressure or a pressure near atmospheric pressure. This glow discharge plasma is generated with the occurrence of glow discharge in the plasma generating gas.

1 and 2 includes an application-side electrode unit 20 (first electrode), a ground-side electrode unit 30 (second electrode), a plurality of first gas supply units 21, and a second gas supply unit 22. , A high-frequency AC power source (also referred to as RF power source) 23, a transfer table 31, a moving operation unit 25, dielectrics 41 and 42 having different lengths, and a control unit 100.
The application-side electrode unit 20 and the ground-side electrode unit 30 form a so-called parallel plate type plasma discharge device. The application-side electrode unit 20 and the ground-side electrode unit 30 are arranged to face each other in parallel with a gap. In addition, the length in the short direction of the facing surface 20a of the application side electrode portion 20 and the ground side electrode portion 30 is formed corresponding to the flow path length of the first gas flow path 91 described later.
As described above, the surface treatment apparatus 10 has a pair of the application-side electrode unit 20 and the ground-side electrode unit 30 and constitutes a so-called one direct discharge type discharge means.

The application-side electrode unit 20 illustrated in FIG. 1 is electrically connected to the power source 23. The application-side electrode unit 20 is supplied with high-frequency AC power from a power source 23. The application-side electrode portion 20 is formed of a highly conductive material that can serve as an electrode, for example, aluminum, copper, stainless steel (SUS), titanium, tungsten, or the like.
The ground side electrode part 30 shown in FIG. 1 is arranged in parallel with a gap facing the application side electrode part 20 as described above, and the application side electrode part 20 and the ground side electrode part 30 are the same as FIG. They are provided in parallel along the Z direction shown in FIG. The ground side electrode unit 30 is grounded. The material of the ground side electrode part 30 can be the same as that of the application side electrode part 20.

A first gas supply unit 21 and a second gas supply unit 22 are disposed above the surface treatment apparatus 10. In the present embodiment, the first gas supply unit 21 and the second gas supply unit 22 contain mixed gases having different activation times. Specifically, the first gas supply unit 21 contains a mixed gas for performing a hydrophilic treatment on the surface 71 of the workpiece 70. He can be used as the carrier gas, and O ₂ can be used as the reactive gas. On the other hand, the second gas supply unit 22 contains a mixed gas for performing, for example, a water repellent process on the surface 71 of the object 70. He is used as the carrier gas, and CF ₄ is used as the reaction gas. Each of the first gas supply unit 21 and the second gas supply unit 22 is electrically connected to the control unit 100, and a predetermined command is output from the control unit 100 to supply a mixed gas to the gas flow path. The timing, the supply amount of the mixed gas, and the like are controlled.

Next, a plurality of dielectrics 41 and 42 and gas flow paths 91 and 92 formed in each dielectric will be described in detail with reference to FIGS.
Each of the dielectrics 41 and 42 is sandwiched between the application-side electrode unit 20 and the ground-side electrode unit 30, and is disposed along the short direction of the facing surface 20a of the application-side electrode unit 20 shown in FIG. Yes. The dielectrics 41 and 42 are made of, for example, ceramics such as alumina or silicon nitride, or glass such as quartz. The dielectrics 41 and 42 define the generation area of the discharge generation portion so that unnecessary discharge does not occur in other portions.

  The dielectrics 41 and 42 are provided with through holes having an opening shape concentric with the dielectric cross-sectional shape along the longitudinal direction of the dielectrics 41 and 42. In the present embodiment, the through hole provided in the dielectric 41 is the first gas flow path 91, and the through hole provided in the dielectric 42 is the second gas flow path 92. Further, the distance between the outer wall surface and the inner wall surface of the dielectrics 41 and 42 is substantially equal, and the plate thickness of the dielectrics 41 and 42 is formed uniformly. Thereby, electric power can be uniformly supplied to the mixed gas passing through the first gas flow path 91 and the second gas flow path 92. Further, since the first gas flow path 91 and the second gas flow path 92 are provided penetrating in the longitudinal direction of the dielectrics 41 and 42, the first gas flow path 91 and the second gas flow path 92 are provided. The channel length is equal to the length of each of the dielectrics 41 and 42 in the longitudinal direction. In the present embodiment, the second gas channel 92 is formed so that the channel length is longer than that of the first gas channel 91.

  The first gas channel 91 formed in the dielectric 41 is formed in a straight line along the short side direction of the facing surface 20 a of the application side electrode unit 20. A gas supply port 81 is provided in the opening above the first gas flow path 91. The gas supply port 81 is connected to the first gas supply unit 21, and the mixed gas is supplied from the first gas supply unit 21 to the gas supply port 81. In addition, a gas outlet 121 is provided in the opening below the first gas flow path 91. The gas blowing port 121 is provided in a direction facing the object to be processed 70 so that the activated mixed gas can reach the object to be processed 70 from the gas blowing port 121.

Unlike the first gas channel 91, the second gas channel 92 formed in the dielectric 42 has a bent portion in the channel. Specifically, a part of the second gas flow path 92 is provided to extend between the application side electrode part 20 and the ground side electrode part 30 along the longitudinal direction of the facing surface 20a of the application side electrode part 20. ing. And the gas flow path which has the bending part perpendicular | vertical to the upper direction continuously from the end of this 2nd gas flow path 92 is provided. A gas supply port 82 is provided at the opening at the tip of the gas flow path and is connected to the second gas supply unit 22. Further, a gas flow path having a downwardly perpendicular bent portion is provided continuously from the other end of the second gas flow path 92. A gas outlet 122 is provided at the opening at the tip of the gas flow path. The gas blowing port 122 is provided in a direction facing the object 70 to be processed, so that the activated mixed gas can reach the object 70 from the gas blowing port 122. At this time, the first gas flow path 91 formed in the dielectric 41 and the second gas flow path 92 formed in the dielectric 42 are disposed along the moving direction of the target object to be described later. . As described above, the second gas flow path 92 in the present embodiment is formed in a crank shape, and is between the application-side electrode portion 20 and the ground-side electrode portion 30 rather than the first gas flow passage 91 formed in a linear shape. The extending channel length is formed to be long.
In the present embodiment, the second gas flow path 92 is formed in a crank shape, but the present invention is not limited to this, and the second gas flow path 92 has a curved portion in at least a part thereof. What is necessary is just to form. As a result, the reaction gas introduced into the second gas flow path 92 convects at the curved portion and can stay in the discharge generating portion for a long time.

When power is supplied to the application-side electrode unit 20 by driving the power source 23 in the first gas flow path 91 of the dielectric 41 and the second gas flow path 92 of the dielectric 42, discharge occurs. Portions 101 and 102 are formed, respectively. That is, the discharge generators 101 and 102 include a pair of electrode parts each including the application-side electrode part 20 and the ground-side electrode part 30, and the first gas flow path 91 and the second gas path disposed between the pair of electrode parts. It occurs in a region in the flow path that overlaps with the gas flow path 92. In the present embodiment, this overlapping area is referred to as an overlapping area.
In the present embodiment, as described above, the channel length of the second gas channel 92 extends between the application side electrode unit 20 and the ground side electrode unit 30 longer than the channel length of the first gas channel 91. Is formed. Thereby, the overlapping region of the second gas flow channel 92 and the application side electrode unit 20 and the ground side electrode unit 30 is longer than the overlapping region of the first gas flow channel 91. Accordingly, the discharge generator 102 formed in the second gas flow channel 92 is longer than the discharge generator 101 formed in the first gas flow channel 91.
These discharge generators 101 and 102 activate the reaction gas of the mixed gas supplied to the first gas flow path 91 and the second gas flow path 92, respectively, to the surface 71 of the moving object 70 to be moved. To reach.

Next, the transfer table 31 shown in FIG. 2 is movable in the T direction along the guide rail 80 by the operation of the movement operation unit 25. This may be movable in the X, Y, and θ directions. On the mounting surface 31a of the transfer table 31, the object 70 is detachably placed.
The operation of the movement operation unit 25 is controlled by the control unit 100. The gas supply operation of the gas supply units 21 and 22 is controlled by the control unit 100. The operation of the power supply is controlled by the control unit 100.
The to-be-processed object 70 is a flat member, and various things can be employ | adopted according to the process objective. Examples thereof include electronic components such as packaged ICs, glass substrates used for liquid crystal display devices (LCD), plastic substrates, and the like.

Next, the operation of the surface treatment apparatus of this embodiment will be described in detail with reference to FIGS.
First, the control unit 100 outputs a drive signal to the movement operation unit 25. Thereby, the transfer table 31 moves in the T1 direction, and the object 70 is disposed at a position below the outlet 121 of the first gas flow path 91. Subsequently, the control unit 100 outputs a drive signal to the first gas supply unit 21. Thereby, the first gas supply unit 21 supplies the mixed gas to the first gas flow path 91. The application-side electrode unit 20 is supplied with high-frequency AC power from a power source 23. The supplied mixed gas passes through the discharge generating part 101 of the first gas flow path 91, whereby atmospheric pressure plasma is generated and excited reactive species of the reaction gas are generated. Then, the excited active species is injected from the outlet of the first gas channel 91 to the object 70 to be disposed below. Thereby, the surface of the to-be-processed object 70 is hydrophilically processed, for example.

  Next, when the hydrophilic process is completed, the control unit 100 supplies a drive signal to the movement operation unit 25. As a result, the transfer table 31 moves in the T1 direction, and the workpiece 70 is disposed at a position below the outlet 122 of the second gas flow path 92. Subsequently, the control unit 100 supplies a drive signal to the second gas supply unit 22. Thereby, the second gas supply unit 22 supplies the mixed gas to the second gas flow path 92. The supplied mixed gas passes through the discharge generation part 102 of the first gas flow path 91 to generate atmospheric pressure plasma, and excited reactive species of the reaction gas are generated. Then, this excited active species is injected from the outlet 122 of the second gas flow path 92 to the object 70 to be disposed below. Thereby, the surface of the object 70 is subjected to, for example, a liquid repellent treatment.

  In the above embodiment, the liquid repellent treatment is performed after the hydrophilic treatment. However, the hydrophilic treatment and the liquid repellent treatment can be performed simultaneously. That is, it is possible to perform hydrophilic treatment on a part of the object 70 and simultaneously perform liquid repellent treatment on other areas. It is also possible to simultaneously perform hydrophilic treatment and liquid repellent treatment on the same region of the object to be treated 70. In this case, for example, by arranging the outlets 121 and 122 with an inclination, the above-described processing can be performed on the same region of the object 70 to be processed.

Employing the structure of the surface treatment apparatus of the present invention has the following advantages.
The surface treatment apparatus 10 of the present invention does not need to be provided with a plurality of types of apparatuses in order to perform a plurality of types of treatments. If one surface treatment apparatus 10 is arranged, a plurality of types of treatments (for example, lyophilic treatment, repellent properties) Liquid treatment). Since only one surface treatment apparatus 10 is provided, it is possible to reduce the area where the apparatus is arranged and the cost of the apparatus. In addition, since it is not necessary to arrange a plurality of devices side by side, a transport unit for transporting the object to be processed between the plurality of devices is completely unnecessary. In addition, energy can be reduced by processing with minimum electric power according to the most easily activated reactive gases.
In addition, a plurality of types of process treatments such as ashing, etching, surface modification such as hydrophilic treatment and water repellency treatment, cleaning, film formation, etc., are almost simultaneously performed on the surface 71 of one object 70. Or since it can carry out continuously, the influence of the time-dependent change in several different processing time can be reduced.

  Further, according to the present embodiment, the channel length of the second gas channel 92 extending between the application side electrode unit 20 and the ground side electrode unit 30 is greater than the channel length of the first gas channel 91. Is also formed long. Therefore, the discharge generator 102 formed in the second gas channel 92 is longer than the length of the discharge generator 101 formed in the first gas channel 91. As a result, even a gas that is difficult to activate introduced into the second gas flow channel 92 is activated by staying in the discharge generation unit 102 in the flow channel for a long time. That is, the reactive gas that is difficult to activate is activated with the same output power as the reactive gas that is introduced into the first gas passage 91 and is easily activated. Therefore, even when a plurality of reaction gases having different activations are used, the surface of the object 70 to be processed can be surely activated by matching the minimum power that is the output power of the reaction gas that is easily activated. Processing can be performed.

[Second Embodiment]
Next, the present embodiment will be described with reference to the drawings.
In the above embodiment, the shape of the electrode portion is matched to the channel length of the first gas channel. Therefore, when the second gas flow path is formed longer than the first gas flow path, the first gas flow path is accommodated in the electrode portion by providing a bent portion in the second gas flow path. It was. In the present embodiment, the second gas channel is provided in a straight line and is longer than the first gas channel. Therefore, it differs in that the shape of the electrode portion corresponding to the second gas flow path is made different according to the length of the second gas flow path. In the following description, only differences from the first embodiment will be described. Since the dielectric 41 and the first gas flow path formed in the dielectric 41 have the same configuration as in the first embodiment, description thereof is omitted.

FIG. 3 is a cross-sectional view taken along line AA of the surface treatment apparatus shown in FIG. 1 in the present embodiment.
The dielectric 42 is sandwiched between the application-side electrode unit 20 and the ground-side electrode unit 30 and arranged in a straight line. The dielectric 42 is formed so as to be longer than the longitudinal dimension of the dielectric 41.
A second gas flow path 92 is formed in the dielectric 42. The second gas flow path 92 is formed by a through hole having an opening shape concentric with the cross-sectional shape of the dielectric 42 along the longitudinal direction of the dielectric 42. The distance between the outer wall surface and the inner wall surface of the dielectric 42 is substantially equal, and the plate thickness of the dielectric 42 is formed uniformly. Thereby, electric power can be supplied uniformly to the mixed gas passing through the second gas flow path 92. Further, since the second gas channel 92 is provided penetrating the longitudinal direction of the dielectric 42, the channel length of the second gas channel 92 is equal to the length of the dielectric 42 in the longitudinal direction. . In the present embodiment, the second gas channel 92 is formed so that the channel length is longer than that of the first gas channel 91.

  In addition, a gas supply port 82 is formed in the opening above the second gas flow path 92 formed in the dielectric 42 and is connected to the second gas supply unit 22. On the other hand, a gas outlet 122 is formed in the opening below the second gas flow path 92. The gas blowing port 122 is provided in a direction facing the object 70 to be processed, so that the activated mixed gas can reach the object 70 from the gas blowing port 122. Further, the positions of the gas outlet 122 of the first gas passage 91 and the gas outlet 122 of the second gas passage 92 are provided along the moving direction of the workpiece 70.

  In the present embodiment, the application-side electrode unit 20 and the ground-side electrode unit 30 are provided corresponding to the respective channel lengths of the first gas channel 91 and the second gas channel 92. Specifically, as shown in FIG. 3, the application side electrode part 20 corresponding to the second gas flow path 92 is formed to extend from the application side electrode part 20 corresponding to the first gas flow path 91, The opposing surface 20a of the application side electrode part 20 is formed in a substantially L shape. That is, the area of the application side electrode part 20 provided in the region corresponding to the second gas flow path 92 is formed larger than the area of the application side electrode part 20 provided in the area corresponding to the first gas flow path 91. Yes. The ground side electrode part 30 is the same as the application side electrode part 20.

  Therefore, according to the present embodiment, the flow length of the second gas flow path 92 is made longer than the flow length of the first gas flow path 91, so that the second gas flow path 92 and the corresponding application are applied. The overlapping region between the side electrode portion 20 and the ground side electrode portion 30 becomes large. As a result, the discharge generator 102 formed in the second gas flow path 92 is formed longer than the discharge generator 101 formed in the first gas flow path 91. Therefore, the mixed gas that passes through the second gas flow path 92 stays in the time discharge generator 102 for a longer distance than the first gas flow path 91. Therefore, for example, if a mixed gas that is difficult to activate is introduced into the second gas flow path 92, it can be activated with the same output power as the mixed gas that is easily activated.

(Method for manufacturing electro-optical device)
Next, a method for manufacturing an organic EL device which is an example of an electro-optical device will be described with reference to the drawings. In the manufacturing method of the organic EL device described below, the surface of the object to be processed is subjected to liquid repellent treatment and lyophilic treatment using the surface treatment device 10 described above. In the present embodiment, the organic EL device 1 employs a top emission structure, but it is also possible to employ a bottom emission structure. In addition, although the organic EL device of this embodiment is an active matrix type, a process for forming a circuit portion including a TFT and the like is formed by a known technique, and thus description thereof is omitted.

FIG. 4 is a cross-sectional view showing the manufacturing process of the organic EL device.
First, as shown in FIG. 4A, a transparent conductive film is formed so as to cover the entire surface of the circuit unit 11 formed on the substrate 18. Then, the pixel electrode 24 is formed by patterning the transparent conductive film into a predetermined shape. At this time, the pixel electrode 24 is electrically connected to the drain electrode 244 through the contact hole 24 a of the second interlayer insulating layer 284. A dummy pattern 26 is formed in the dummy area. The dummy pattern 26 is not electrically connected to a metal wiring such as a TFT formed in the lower layer.

  Next, as shown in FIG. 4B, the lyophilic control layer 28 that is an insulating layer is formed on the pixel electrode 24, the dummy pattern 26, and the second interlayer insulating layer 284. Then, an opening 28 a is formed in part of the lyophilic control layer 28 on the pixel electrode 24. Holes can be transferred from the pixel electrode 24 by the opening 28 a formed in the lyophilic control layer 28. On the other hand, in the dummy pattern 26 in which the opening 28a is not provided, the insulating layer (lyophilic control layer) 28 serves as a hole movement shielding layer and no hole movement occurs. Subsequently, BM (black matrix) is formed in the recesses on the lyophilic control layer 28 between the pixel electrodes 24. Specifically, it is formed by sputtering using a metal chromium material (not shown).

  Next, as shown in FIG. 4C, an organic partition layer 221 (bank) is formed on the lyophilic control layer 28 so as to partition each pixel electrode 24. Specifically, first, an organic layer is formed by applying a resist such as an acrylic resin or a polyimide resin dissolved in a solvent by various coating methods such as a spin coating method and a dip coating method. Next, an opening 221a is formed in the organic layer corresponding to each pixel electrode 24 in the organic layer by photolithography and etching. In this way, the organic partition layer 221 is formed so as to partition each pixel electrode 24. At this time, the side wall surface of the organic partition wall layer 221 is formed in a tapered shape, and the angle θ of the side wall surface with respect to the surface of the substrate 18 is preferably 110 degrees or more and 170 degrees or less.

Next, a region showing lyophilicity and a region showing liquid repellency are formed on the surface of the organic partition layer 221 by using the surface treatment apparatus 10 in the present embodiment. Specifically, first, the substrate 18 is heated to a predetermined temperature, for example, about 70 to 80 ° C. Next, plasma treatment using oxygen as a reactive gas (O ₂ plasma treatment) is performed in the air atmosphere using the surface treatment apparatus 10, and the partition wall surface of the organic partition layer 221, the pixel electrode 24, and the lyophilic control layer 28 are formed. Make the top surface lyophilic. Subsequently, plasma treatment using CF ₄ as a reactive gas (CF ₄ plasma treatment) is performed in an air atmosphere to make the upper surface of the organic partition layer 221 liquid repellent.

In this CF ₄ plasma treatment, the electrode surface 24c of the pixel electrode 24 and the lyophilic control layer 28 are also somewhat affected, but the structure of the ITO that is the material of the pixel electrode 24 and the lyophilic control layer 28. Since materials such as SiO ₂ and TiO ₂ have poor affinity for fluorine, the hydroxyl group imparted in the ink-philic process is not substituted with the fluorine group, and the lyophilic property is maintained.

  Next, the hole transport layer material is applied to the opening 221 a partitioned by the organic partition layer 221 by an inkjet method or the like. At this time, the applied hole transport layer material wets and spreads in the region partitioned by the organic partition wall layer 221 that has been subjected to the lyophilic treatment, and fills the opening 221a. On the other hand, the hole transport layer material does not repel and adhere to the upper surface of the organic barrier layer 221 that has been subjected to the liquid repellent treatment, and flows into the openings 221 a defined by the organic barrier layer 221. Thereafter, drying treatment and heat treatment are performed to form the hole transport layer 72 in the region partitioned on the organic partition wall layer 221 (on the electrode 24). In addition, after this hole transport layer formation process, in order to prevent the oxidation of the hole transport layer 72 and the light emitting layer 60, it is preferable to carry out in inert gas atmospheres, such as nitrogen atmosphere and argon atmosphere.

  Next, the light emitting layer forming material is applied onto the hole transport layer 72 by an inkjet method or the like. Then, the light emitting layer 60 is formed in the opening part 221a divided by the organic partition layer 221 by performing a drying process and heat processing. In addition, for example, a blue (B) light emitting layer forming material is selectively applied to a blue display region by an ink jet method, dried, and then similarly displayed for green (G) and red (R). Selectively apply to area and dry. Moreover, it is also preferable to form an electron injection layer on such a light emitting layer 60 as mentioned above as needed.

Next, as shown in FIG. 4D, an ITO film is formed so as to cover the upper surfaces of the light emitting layer 60 and the organic partition layer 221 by a physical vapor deposition method such as an ion plating method. Form.
The organic EL device is formed using the surface treatment apparatus 10 of the present embodiment through the processes described above.

(Electronics)
Next, an example of an electronic apparatus including an organic EL device formed using the surface treatment apparatus of the present embodiment described above will be described with reference to FIG.
FIG. 5 is a perspective view showing an example of a mobile phone. In FIG. 5, reference numeral 600 denotes a mobile phone body, and reference numeral 601 denotes an image display unit including the organic EL device of the above embodiment. According to this electronic device, the manufacturing cost can be reduced.
In addition, although the electronic apparatus of this embodiment shall be provided with the organic EL apparatus, it can also be set as the electronic apparatus provided with other electro-optical devices, such as a liquid crystal display device and a plasma display device.

  Note that the above-described organic EL device can be applied to various electronic devices other than the mobile phone. For example, LCD projectors, multimedia-compatible personal computers (PCs) and engineering workstations (EWS), pagers, word processors, televisions, viewfinder type or monitor direct view type video tape recorders, electronic notebooks, electronic desk calculators, car navigation systems The present invention can be applied to electronic devices such as a device, a POS terminal, and a device provided with a touch panel.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.
For example, in the above-described embodiment, a plurality of dielectrics are provided, and a gas flow path is formed in each dielectric. On the other hand, it is also preferable to provide a single dielectric and to form a plurality of gas flow paths in this dielectric. In the above embodiment, gas flow paths are formed in each of the two dielectrics, and one is used for liquid repellent treatment and the other is used for lyophilic treatment. However, the present invention is not limited to this. It is also possible to form a flow path in each of two or more dielectrics and perform two or more same or different treatments.

  Moreover, in the said embodiment, the length of the discharge generation | occurrence | production part was varied by changing the flow path length of a flow path, and the reactive gas from which activation differs was activated with the same electric power. On the other hand, for example, even when the lengths of the flow path lengths of the flow paths are substantially equal, by changing the region (superimposed region) sandwiched between the application side electrode portion and the ground side electrode portion, It is also possible to activate the reaction gases having different activations with the same electric power by changing the length of the discharge generation part of the flow path.

The top view which shows 1st Embodiment of the surface treatment apparatus of this invention. The side view which has the cross section in the AA in the surface treatment apparatus of FIG. 1 which concerns on 1st Embodiment. The side view which has the cross section in the AA in the surface treatment apparatus of FIG. 1 which concerns on 2nd Embodiment. It is a figure which shows the manufacturing method of the organic electroluminescent apparatus of an example of an electro-optical apparatus in order of a process. It is a figure which shows the mobile telephone of an example of an electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Surface treatment apparatus, 20 ... Application side electrode part (1st electrode), 21, 22 ... Gas supply part, 23 ... Power supply, 25 ... Movement operation part, 30 ... Ground side electrode part (2nd electrode), 31 ... Transport table, 41, 42 ... Dielectric, 70 ... Object to be processed, 71 ... Surface of object to be processed, 91, 92 ... Gas flow path, 101, 102 ... Discharge generator, T1, X, Y, [theta] ... Object to be processed Body movement direction

Claims (5)

A surface treatment apparatus for treating an object to be treated by activating a reactive gas introduced between the first electrode and the second electrode arranged opposite each other under atmospheric pressure or a pressure close to atmospheric pressure by plasma discharge. Because
Between the first electrode and the second electrode, a dielectric having a plurality of flow paths for flowing the reaction gas is provided,
While the different types of the reaction gases are introduced into the plurality of flow paths, a plasma discharge generation unit is formed by supplying power to the first electrode or the second electrode,
The surface treatment apparatus according to claim 1, wherein the flow path length of the flow path of the dielectric extending between the first electrode and the second electrode is changed in accordance with the type of the reaction gas. Of the plurality of flow paths provided in the dielectric,
A first flow path is provided extending substantially linearly between the first electrode and the second electrode;
The second flow path has a curved portion at least partially and is provided to extend between the first electrode and the second electrode, and has a flow path length longer than that of the first flow path. The surface treatment apparatus according to claim 1. Of the plurality of flow paths provided in the dielectric,
The areas of the portions of the first electrode and the second electrode corresponding to each of the flow paths are made different for each of the flow paths, and the flow path, the first electrode, and the second electrode are changed. The surface treatment apparatus according to claim 1, wherein the overlapping region is different. A gas supply unit configured to supply the reaction gas; a processing target holding unit on which the target object is mounted; and a moving operation unit configured to move the table while the target object faces each dielectric. A surface treatment apparatus,
The surface treatment apparatus according to claim 1, wherein the plurality of flow paths are provided along a moving direction of the object to be processed. A surface treatment method for treating the surface of an object to be treated by plasma discharge of a reaction gas introduced between the first electrode and the second electrode arranged opposite each other under atmospheric pressure or pressure near atmospheric pressure. There,
The reaction gas of a different type is introduced into each of a plurality of channels having different channel lengths corresponding to the type of the reaction gas extending between the first electrode and the second electrode. Activating the reaction gas that has passed through the flow paths having different lengths, injecting the activated reaction gas to the surface of the object to be relatively moved, and performing a plurality of types of treatment on the surface of the object to be treated A surface treatment method characterized by the above.

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