JP2006150545A - Polishing device and polishing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device capable of polishing projections on a surface of a panel in a short time without dropping abrasive grains and a part of a polishing layer from a polishing tape onto the surface of the panel. <P>SOLUTION: One or two or more sensor probes 16, 17 mounted on a substrate 11 measure the height of projections on the surface of a panel. A polishing head 20 having a head member 22 to press a polishing tape 30 on the surface of the panel is mounted on the substrate 11 movably in the Z-direction. The sensor probes 16, 17 are located on the side of the width direction of the polishing tape 30 on the head member 22 when viewed from the head member 22. Preferably, the polishing device 10 has two sensor probes 16, 17, and these two sensor probes 16, 17 are located on both sides of the width direction of the polishing tape 30 on the head member when viewed from the head member 22 so as to hold each head member 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a polishing apparatus and method for polishing unnecessary protrusions on the surface of a panel that requires a high degree of flatness, such as a liquid crystal panel.

  Panels such as liquid crystal panels that require a high degree of flatness on the surface generally detect the position of the protrusion on the surface in an inspection section with multiple CCD cameras, and then measure the height of the protrusion Sent to the polishing section with sensor probe, where the sensor probe is moved to the position of the protrusion detected in the inspection section, the height of this protrusion is measured, and this protrusion exceeds the predetermined height Then, the polishing device provided in the polishing section is moved to the position of the protrusion to polish the protrusion.

  In order to shorten the polishing time after the protrusion measurement, a sensor probe is attached to the polishing apparatus, and the polishing apparatus and the sensor probe move integrally.

The polishing apparatus has a head member for pressing the polishing tape against the surface of the panel. Then, after the measurement by the sensor probe, the head member is moved directly above the protrusion, the head member is lowered, the polishing tape is pressed against the protrusion through the head member, and the protrusion is polished. After polishing the protrusion, the head member is raised, the sensor probe is moved to the position of the protrusion, the height of the protrusion is measured again, and the height of the protrusion is lower than a predetermined height. Then, the sensor probe is moved to the next protrusion, the protrusion is polished as described above, and its height is measured again (for example, see Patent Document 1).
JP 2003-266292 A

  In the field of technology for polishing protrusions on the surface of the panel, not only the protrusions on the surface of the panel are polished to flatten the surface of the panel, but also the surface of the panel has several protrusions to be polished. Since there are several tens, it is a technical problem to reduce the time required for polishing one protrusion.

  In the above-described conventional polishing apparatus, the sensor probe is positioned on the side in the running direction of the polishing tape on the head member as viewed from the head member, and the head member is used to reduce the time required for polishing one protrusion. The polishing tape traveling above is sharply bent into a V shape to bring the sensor probe closer to the head member, thereby shortening the distance between the head member and the sensor probe.

  However, when the polishing tape is bent sharply into a V shape in this way, the polishing tape is cut during polishing, or a part of the abrasive grains and the polishing layer is dropped from the polishing tape, and one of the dropped abrasive grains and the polishing layer is removed. There exists a problem that a part adheres to the surface of a panel. In addition, when the sensor probe is viewed from the head member and positioned on the side of the polishing tape on the head member in the traveling direction, polishing debris adheres to the sensor probe and the height of the protrusion cannot be measured accurately. is there.

  Accordingly, the present invention has been made in view of this problem. During polishing, the polishing tape is not cut, and a part of the abrasive grains and the polishing layer is not dropped from the polishing tape onto the surface of the panel, and the time is shorter. An object of the present invention is to provide a polishing apparatus and method that can measure and polish the protrusions on the surface of the panel with higher accuracy.

The polishing apparatus of the present invention is a substrate on which one or more sensor probes for measuring the height of protrusions on the surface of the panel are attached, and is attached to the substrate so as to be movable in a direction perpendicular to the surface of the panel. A polishing head for polishing projections on the surface of the panel, a vertical moving means for moving the polishing head in a direction perpendicular to the surface of the panel with respect to the substrate, and a substrate on which the sensor probe and the polishing head are attached to the surface of the panel It is composed of horizontal moving means for moving in parallel directions.

  The polishing head includes means for attaching the first reel around which the polishing tape is wound, a head member for pressing the polishing tape against the surface of the panel, and the polishing tape drawn out from the first reel and passed over the head member. Means for attaching a second reel for picking up, and for rotating the second reel to draw the abrasive tape from the first reel while passing it over the second reel and to pass over the head member It is comprised from the means. Here, the first reel and the second reel are accommodated in a cassette, and the first and second reels of the cassette are attached to the means for attaching the reels, thereby polishing the cassette. You may attach to a head.

  In order to achieve the above object, in the present invention, the sensor probe is located on the side in the width direction of the polishing tape on the head member as viewed from the head member. Preferably, two sensor probes are attached to the substrate, and the two sensor probes sandwich one head member on each side of the width direction of the polishing tape on the head member as viewed from the head member. Is located. Here, these two sensor probes may be fixed to the above substrate, but a second vertical movement for individually moving these two sensor probes with respect to the substrate in a direction perpendicular to the surface of the panel. Further comprised of means, it is desirable to move these two sensor probes individually in a direction perpendicular to the surface of the panel.

  Using the polishing apparatus of the present invention, the protrusions on the surface of the panel are polished.

  First, the substrate is moved in a direction parallel to the surface of the panel by the horizontal moving means, and the height of the protrusion is measured by the sensor probe.

  When the height of the protrusion exceeds a predetermined height, the substrate is moved in parallel with the surface of the panel in the width direction of the polishing tape on the head member of the polishing head, so that the head member is directly above the protrusion. To be located.

  The polishing head is lowered with respect to the substrate by the vertical moving means. Then, the polishing tape is run immediately before or immediately after the polishing tape on the head member contacts the protrusion. Thereby, the protrusion is polished.

  Next, the head member is raised by the vertical moving means. Then, the substrate is moved in parallel with the surface of the panel in the width direction of the polishing tape on the head member by the horizontal moving means, and the height of the protrusion is measured by the sensor probe.

  When the height of the protrusion exceeds the predetermined height, the above process is performed again. On the other hand, when the height of the protrusion is lower than the predetermined height, the substrate of the polishing apparatus is moved to polish another protrusion.

  In the present invention, as described above, the resistance applied to the polishing tape is detected when the polishing tape is running while being in contact with the protrusions. This is because if the abrasive tape is in contact with a hard projection such as metal, the abrasive tape will break during polishing of this projection, or some of the abrasive grains and polishing layer will fall off the surface of the panel. Because it will be. And in order to prevent such cutting | disconnection of a polishing tape or drop-off | omission of an abrasive grain, the resistance concerning this polishing tape is detected, In response to this resistance detection, a polishing head is raised or a polishing tape Is shifted (ie, accelerated or decelerated). Preferably, the polishing head is lowered by driving a servo motor of the vertical movement means. And the detection of the resistance applied to the polishing tape is performed by detecting a change in the current applied to the servo motor, and when the value of the current applied to the servo motor becomes higher than the value applied initially, The servomotor is operated to raise the polishing head or the rotation speed of the second reel is changed to change the traveling speed of the polishing tape, thereby reducing the resistance applied to the polishing tape. The value of the current applied to the motor is returned to the value initially applied.

  In the present invention, since the sensor probe is located on the side of the width direction of the polishing tape on the head member as viewed from the head member, the distance between the polishing tape on the head member and the sensor probe can be shortened. Polishing time can be shortened.

  In addition, the polishing tape can be pressed without sharply bending the polishing tape with the head member, and this can reduce the falling off of abrasive grains and a part of the polishing layer from the polishing tape during polishing.

Furthermore, since the polishing debris does not adhere to the sensor probe, the height of the protrusion can be accurately measured.

  Furthermore, the width of the polishing tape can be narrowed, whereby the manufacturing cost of the tape can be reduced.

  When the polishing tape travels while contacting a hard projection such as metal, the polishing head is raised or the traveling speed of the polishing tape is changed (ie, accelerated or decelerated), so the polishing tape may break during polishing of the projection. In addition, part of the abrasive grains and the polishing layer does not fall off the surface of the panel.

<Polishing Apparatus> As shown in FIGS. 1 to 4, the polishing apparatus 10 of the present invention has a height of a protrusion (indicated by reference numeral 31 in FIG. 5) on the surface of a panel (indicated by reference numeral P in FIG. 5). A substrate 11 to which sensor probes 16 and 17 for measurement are attached, a polishing head that is attached to the substrate 11 so as to be movable in a direction perpendicular to the surface of the panel (direction indicated by an arrow Z) and polishes the protrusions on the surface of the panel 20. Vertical movement means 18 for moving the polishing head 20 in the direction indicated by the arrow Z with respect to the substrate 11, and a direction parallel to the surface of the panel together with the polishing head 20 (directions indicated by the arrows X and Y) It is comprised from the horizontal moving means 19 for making it move to.

  As shown in FIG. 3B, a substantially U-shaped frame is used as the substrate 11, and long stays 12 and 13 are fixed to the lower left and right ends of the substrate 11 one by one, respectively. One sensor probe 16 and 17 is attached to the lower end of each. Here, in the illustrated example, these stays 12 and 13 are fixedly attached to the substrate 11, but each stay 12 and 13 can be moved individually in a vertical direction (direction indicated by an arrow Z). A second vertical moving means (for example, product number: KS101 series, Suruga Seiki Co., Ltd.) (not shown) is attached to the substrate 11, and the stays 12, 13 are attached to the substrate 11 via the second vertical moving means. It may be attached.

  As shown in the drawing, the upper end of the substrate 11 is connected to the horizontal moving means 19.

  The horizontal moving means 19 may be a known horizontal moving means. For example, as shown in FIG. 6B, a pair of guide rails 19b long in the direction of arrow X are placed on a pair of guide rails 19a long in the direction of arrow Y so as to be movable in the direction of arrow Y. On a long guide rail 19b, a base 19c on which the substrate 11 is fixed is movably mounted in the direction of arrow Y. Then, a guide block 19f having a long screw 19e inserted in the direction of arrow Y is fixed to the rail 19b, and a guide block 19i having a long screw 19h inserted in the direction of arrow X is fixed to the base 19c. These screws 19e and 19h are driven by servo motors 19d and 19g, respectively, whereby the base 19c fixing the substrate 11 moves in the directions indicated by arrows X and Y.

  The sensor probes 16 and 17 measure the height of the protrusions by climbing over the protrusions (indicated by reference numeral 31 in FIG. 5) on the surface of the panel (indicated by reference numeral P in FIG. 5). As the sensor probes 16 and 17, commercially available sensor probes (for example, product number: MLH-322, Mitutoyo Corporation) can be used.

  The polishing head 20 includes means for attaching the first reel 23 around which the polishing tape 30 is wound (axis indicated by reference numeral 27), a head member 22 for pressing the polishing tape 30 against the surface of the panel, and the first reel 23. Means (axis shown by reference numeral 28) for attaching the second reel 24 for winding the polishing tape 30 drawn and passed over the head member 22, and while winding the polishing tape 30 with the second reel 24 It is constituted by means (motor indicated by reference numeral 26) for rotating the second reel 24 so as to be pulled out from the first reel 23 and passed over the head member 22.

  The first reel 23 is detachably attached to a shaft 27 connected to a motor 25 attached to the left side surface of the attachment plate 21. An unused polishing tape 30 is wound around the first reel 23. The second reel 24 is detachably attached to a shaft 28 connected to a motor 26 attached to the left side surface of the attachment plate 21.

  When the motor 26 is driven, the second reel 24 rotates, and the polishing tape 30 is pulled out from the first reel 23 while the second reel 24 winds up the polishing tape 30. Here, the motor 25 connected to the shaft 27 to which the first reel 23 is attached applies a moderate tension force to the polishing tape 30 to drive the polishing tape 30 to prevent slack and deviation. To do.

  When all of the polishing tape 30 wound around the first reel 23 is wound around the second reel 24, the first reel 23 and the second reel 24 around which the used polishing tape 30 is wound Are removed from the shafts 27 and 28, respectively, and another first reel wound with unused polishing tape and an empty second reel are attached to the shafts 27 and 28, respectively. 23 and 24 can be exchanged.

  As a modification, a cassette (not shown) containing the above-described first reel 23 around which the unused polishing tape 30 is wound and the above-described second reel 24 for winding up the used polishing tape 30 is provided. May be used. When such a cassette is used, the cassette can be attached to the polishing head 20 with one touch only by inserting the first and second reels 23 and 24 into the shafts 27 and 28, respectively. Can be done with a single touch. (In other words, the cassette can be easily replaced with a single touch.)

As the polishing tape 30, a tape in which a polishing layer in which abrasive grains are fixed with a resin binder is formed on the surface of a plastic sheet is used. For such polishing tapes, a paint composed of a resin binder and abrasive grains is applied to the surface of a plastic sheet, and this is dried to form a polishing layer on the surface of the plastic sheet, which is then cut into a tape shape. Can be manufactured. As the plastic sheet, a sheet having a thickness in the range of 5 μm to 50 μm selected from materials such as polypropylene, polyethylene terephthalate, and polyester is used. As the abrasive grains, particles having an average particle diameter of 0.05 μm to 10 μm made of a material selected from cerium oxide, aluminum oxide, silicon oxide, iron oxide, zirconium, diamond, silicon carbide and the like are used. As the resin binder, a binder made of a material selected from known synthetic resins such as polyurethane and polyester is used. The thickness of the polishing layer is in the range of 1 μm to 20 μm.

  The polishing tape 30 wound around the first reel 23 is wound around the second reel 24 via the guide rollers 29a and 29b, the head member 22, and the guide rollers 29c and 29d.

  The head member 22 may be fixed to the lower end portion of the attachment plate 21 or may be attached to the lower end portion of the attachment plate 21 so as to be appropriately movable in the direction indicated by the arrow Z.

  In the illustrated example, the head member 22 has a lower end surface formed so as to draw a gentle curve having a downward convex shape when viewed from the left and right sides of the polishing apparatus 10 of the present invention (see FIGS. 2A and 3). The polishing tape 30 is pressed against the surface of the panel through the lower end surface.

  When the polishing tape 30 pressed against the surface of the panel travels in a V shape, the surface portion of the polishing layer of the polishing tape 30 tears at the V-shaped apex where the polishing tape 30 bends sharply. Since a part of the abrasive grains and the polishing layer falls off and adheres to the surface of the panel, in the present invention, the polishing tape 30 pressed against the surface of the panel is caused to run so as to draw a U shape. The polishing tape 30 is prevented from being cut during polishing, and the abrasive grains and a part of the polishing layer from the polishing tape 30 are prevented from dropping off.

  Such cutting of the polishing tape and removal of a part of the abrasive grains and the polishing layer replace the head member 22 having the lower end surface that draws a downwardly convex gentle curve as described above, and the polishing apparatus of the present invention. The head member 22b having a flat lower end surface as shown in FIG. 3B and the head member 22c having a downward spire-like lower end surface as shown in FIG. That is, when the head members 22b and 22c as shown in FIGS. 3B and 3C are used, the vertical direction between the lower end surfaces of the head members 22b and 22c and the guide rollers 29b and 29c (the direction indicated by the arrow Z). The polishing tape 30 can be run without being bent sharply by reducing the interval or increasing the interval in the direction indicated by the arrow Y between the lower end surfaces of the head members 22b and 22c and the guide rollers 29b and 29c. it can. The vertical spacing between the lower end surfaces of the head members 22, 22b and 22c and the guide rollers 29b and 29c can be appropriately moved in the direction indicated by the arrow Z at the lower end of the mounting plate 21 as described above. The head members 22, 22 b, and 22 c attached in this manner can be adjusted by moving them.

  As shown in FIGS. 1 to 4, the left side surface of the mounting plate 21 of the polishing head 20 is connected to the inside of the left side surface of the substrate 11 via the vertical moving means 18, whereby the polishing head 20 is connected to the substrate 11. Is attached to the substrate 11 so as to be movable in the direction indicated by the arrow Z.

  The vertical moving means 18 may be a known vertical moving means. For example, as shown in FIG. 6B, a long screw 18b may be inserted in the direction of arrow Z into a guide block 18c fixed to the mounting plate 21, and the screw 18b may be driven by a servo motor 18a fixed to the substrate 11. .

As shown in the drawing, sensor probes 16 and 17 are attached to stays 12 and 13 attached to the left and right lower ends of the substrate 11, respectively, and these sensor probes 16 and 17 are on the head member 22 when viewed from the head member 22. One head member 22 is positioned on both sides of the polishing tape 30 in the width direction, one by one. In the illustrated example, two sensor probes 16 and 17 are used. However, when one sensor probe (reference numeral 16 or 17) is viewed from the head member 22, the width direction of the polishing tape 30 on the head member 22 is illustrated. You may make it located in the side of this. Further, three or more sensor probes may be positioned on the side in the width direction of the polishing tape 30 on the head member 22 when viewed from the head member 22 (for example, in the case of three, one sensor probe is provided on one side). Two, one on the other side).

  By positioning the sensor probes 16 and 17 in this way, the size of the head member 22 and / or the positions of the guide rollers 29b and 29c are viewed from the left and right sides of the polishing apparatus 10 of the present invention to the front side and the back side. Can be expanded. That is, it is possible to secure a space in which the polishing tape 30 can run so as to draw a gentle U-shape.

  Further, by positioning the sensor probes 16 and 17 in this way, the width of the polishing tape 30 can be reduced, and the width of the polishing tape 30 is preferably 15 mm or less, more preferably 7 mm or less. In addition, since the polishing tape 30 having such a narrow width can be used, the distance between the head member 22 and the sensor probes 16 and 17 can be further shortened.

<Polishing Method> Reference is made to FIGS. 5A to 5F. In accordance with the present invention, the protrusion 31 at position 32 on the surface of the panel P is polished.

The horizontal moving means 19 moves the substrate 11 to the position 32 of the protrusion 31 detected in the inspection section (FIG. 5A). This movement may be performed while the sensor probes 16 and 17 are in contact with the surface of the panel P. However, when foreign matter is present on the surface of the panel P, the foreign matter adheres to the sensor probes 16 and 17. Therefore, the sensor probe 16 is moved to the panel P just before reaching the position 32 of the projection 31 by performing the above-mentioned second vertical movement means (not shown) while being positioned above the surface of the panel P. It is desirable to contact the surface of The sensor probe 16 is in contact with the surface of the panel P, and the height of the protrusion 31 is measured when the sensor probe 16 gets over the protrusion 31. Thus, while the height of the protrusion 31 is measured by one sensor probe 16, the other sensor probe 17 is positioned above the surface of the panel P by the second vertical moving means (not shown). It may be allowed. While the polishing apparatus 10 is moving, the distance between the head member 22 and the surface of the panel P is about 1 mm to 20 mm.

When the height of the protrusion 31 is not a predetermined height, the horizontal moving means 19 moves the substrate 11 to the position of another protrusion. This movement may be performed while the sensor probes 16 and 17 are in contact with the surface of the panel P. However, foreign substances on the surface of the panel P may adhere to the sensor probes 16 and 17, so It is desirable that the vertical movement means (not shown) be positioned above the surface of the panel P.

If the height of the protrusion 31 exceeds a predetermined height, the substrate 11 is moved in parallel with the surface of the panel in the width direction of the polishing tape 30 on the head member 22 of the polishing head 20 (that is, indicated by the arrow X1). The head member 22 is positioned directly above the protrusion 31. Here, when the head member 22 reaches just above the protrusion 31, the movement of the polishing head 20 may be temporarily stopped, and then the head member 22 may be lowered in the direction of the arrow Z1 (FIG. 5B). The head member 22 may be lowered in the direction of the arrow Z1 while moving in the direction of the arrow X1 toward the top of the protrusion 31.

The polishing tape 30 is run immediately before or after the polishing tape 30 contacts the protrusion 31, and the polishing tape 30 is pressed against the surface of the panel P via the head member 22. The feed amount of the polishing tape 30 may be only the amount that the reels 23 and 24 are rotated about 1 to 2 times. Thereby, the protrusion 31 is polished.

This polishing may be performed without moving the head member 22 in the direction indicated by the arrow X1 (FIG. 5C), or may be performed while moving the head member 22 in the direction indicated by the arrow X1. While the projection 31 is being polished, the sensor probes 16 and 17 may be in contact with the surface of the panel P. However, foreign matter (polishing scraps) on the surface of the panel P may adhere to the sensor probes 16 and 17. Therefore, it is desirable that the second vertical moving means (not shown) is positioned above the surface of the panel P.

  After polishing the protrusions 31, the head member 22 is raised in the direction indicated by the arrow Z2, and the substrate 11 is moved in parallel with the surface of the panel in the width direction of the polishing tape 30 on the head member 22 of the polishing head 20 (that is, The height of the projection 31 after polishing is measured again. At the time of this re-measurement, both sensor probes 16 and 17 may be in contact with the surface of the panel P, but foreign matter (polishing debris) on the surface of the panel P is applied to the sensor probe 17 that is not used for this measurement. Since it may adhere, it is desirable that only the sensor probe 17 is positioned above the surface of the panel P by the second vertical movement means (not shown). Here, the head member 22 may be moved (FIGS. 5D, 5E, and 5F) after the head member 22 is raised in the direction of the arrow Z2, or moved while the head member 22 is raised in the direction of the arrow Z2. You may let them. Further, the moving direction of the head member 22 may be the direction of the arrow X1 (FIG. 5E) or the direction indicated by the opposite arrow X2 (FIG. 5F). When one sensor probe 16 is used, the sensor probe 16 is moved in the direction indicated by the arrow X2, and the height of the projection 31 after polishing is measured again with the sensor probe 16.

  By this re-measurement, when the height of the protrusion 31 is lower than the predetermined height, the polishing head 20 is moved to the position of another protrusion. If the height of the protrusion 31 still exceeds the predetermined height, the above process is performed again to polish the protrusion 31. While the protrusion 31 is being polished, the sensor probes 16 and 17 may be in contact with the surface of the panel P in the same manner as described above, but foreign matter (polishing scraps) on the surface of the panel P is caused by the sensor probes 16 and 17. It is desirable that the second vertical moving means (not shown) is positioned above the surface of the panel P.

In the present invention, the resistance applied to the polishing tape 30 is detected when the polishing tape 30 is running while being in contact with the protrusions 31. The resistance applied to the polishing tape 30 is detected by detecting a change in the current applied to the servomotor 18a (FIG. 6A), and the value of the current applied to the servomotor 18a is greater than the initial value applied. Is also increased, the traveling speed of the polishing tape 30 is changed by operating the servo motor 18a to raise the polishing head 20 or changing the rotation of the second reel 24 (ie, accelerating or decelerating), The resistance applied to the polishing tape 30 is reduced, so that the value of the current applied to the servomotor 18a returns to the value initially applied. This is because if the protrusion 31 is made of a hard material such as a metal, the polishing tape 30 is cut during polishing of the protrusion, or a part of the abrasive grains or the polishing layer falls off the surface of the panel P. The resistance applied to the polishing tape 30 is detected in order to prevent such cutting of the polishing tape 30 and dropping off of abrasive grains.

FIG. 1 is a partially broken front view of a polishing apparatus of the present invention. FIG. 2 is a rear view of the polishing apparatus of FIG. 3A is a left side view of the polishing apparatus of FIG. 1, and FIG. 3B is a cross-sectional view taken along line 3-3 of FIG. 3A. 4A is a right side view of the polishing apparatus of FIG. 1, and FIG. 4B shows a modification of the head member. 5A-5F illustrate the polishing of the protrusions by polishing the surface of the panel according to the present invention. FIG. 6A shows an example of the vertical moving unit, and FIG. 6B shows an example of the horizontal moving unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Polishing apparatus 11 ... Board | substrate 12, 13 ... Stay 16, 17 ... Sensor probe 18 ... Vertical moving means 18a ... Servo motor 18b ... Screw 18c ... Guide block 19 ... Horizontal moving means 19a, 19b ... Rail 19c ... Base 19d ... Servo motor 19e ... Screw 19f ... Guide block 19g ... Servo motor 19h ... Screw 19i ... Guide block 20: Polishing head 21 ... Mounting plates 22, 22b, 22c ... Head member 23 ... First reel 24 ... Second reel 25, 26 ... Motor 27, 28 ... Shafts 29a, 29b, 29c, 29d ... Guide roller 30 ... Polishing tape 31 ... Protrusion 32 ... Protrusion position P ... Panel X, X1, X2, Y, Z, Z , Z2 ··· movement direction

Claims (7)

A polishing apparatus comprising:
A substrate with one or more sensor probes attached to measure the height of the protrusions on the surface of the panel;
A polishing head attached to the substrate so as to be movable in a direction perpendicular to the surface of the panel, and polishing a protrusion on the surface of the panel;
Vertical movement means for moving the polishing head in a direction perpendicular to the surface of the panel with respect to the substrate; and horizontal movement means for moving the substrate in a direction parallel to the surface of the panel;
Consisting of
The polishing head comprises:
Means for attaching a first reel wound with abrasive tape;
A head member for pressing the polishing tape against the surface of the panel;
Means for attaching a second reel for winding the polishing tape drawn from the first reel and passed on the head member, and the first reel while winding the polishing tape on the second reel. Means for rotating the second reel to be pulled out of the reel and passed over the head member;
Consisting of
The sensor probe is located on the side of the width direction of the polishing tape on the head member when viewed from the head member;
However, polishing equipment. Two sensor probes are attached to the substrate;
These two sensor probes are positioned so as to sandwich the head member one by one on both sides in the width direction of the polishing tape on the head member as viewed from the head member.
However, the polishing apparatus according to claim 1. Further comprising second vertical movement means for individually moving the two sensor probes with respect to the substrate in a direction perpendicular to the surface of the panel;
However, the polishing apparatus according to claim 2. The first reel and the second reel are housed in a cassette;
The first reel and the second reel of the cassette are attached to the means for attaching the first and second reels, whereby the cassette is attached to the polishing head;
However, the polishing apparatus according to claim 1. A method for polishing protrusions on a surface of a panel using the polishing apparatus according to claim 1,
Moving the substrate in a direction parallel to the surface of the panel and measuring the height of the protrusion with the sensor probe;
When the height of the protrusion exceeds a predetermined height, the substrate is moved parallel to the surface of the panel in the width direction of the polishing tape on the head member of the polishing head, and the head member is moved Positioning the process directly above the protrusion;
Lowering the polishing head, and running the polishing tape immediately before or immediately after the polishing tape on the head member contacts the protrusions;
A method consisting of: The step of raising the head member, and moving the substrate parallel to the surface of the panel in the width direction of the polishing tape on the head member of the polishing head, and measuring the height of the protrusion with the sensor probe The process of
The method of claim 5 further comprising: Detecting a resistance applied to the polishing tape that travels in contact with the protrusion, and increasing the polishing head or changing a traveling speed of the polishing tape in response to the detection of the resistance;
The method of claim 5 further comprising:

Images