JP2006148178A - Manufacturing apparatus for laminated ceramic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a precision laminate, by reducing deformation of a ceramic green sheet, in the manufacturing of a laminated ceramic component, such as laminated ceramic capacitor, package and substrate. <P>SOLUTION: A manufacturing apparatus for the laminated ceramic component includes an upper punch part 3 mounted with a heating part 32 on a crimping surface and with a cooling part 33 in the inside, and a lower punching part 4 supporting the laminate 2. A laminate 1 is placed between the upper punch part 3 and the lower punch part 4, and comprises the ceramic green sheet, a conductor pattern and a carrier film. The ceramic green sheet and the conductor pattern in the laminate are subjected to thermocompression bonding transfer on the laminated body positioned on the lower punch part 4. The heating part 32 is formed by a plate-shaped resistive body, and a buffer heat-insulating part 34 is interposed between the heating part 32 and the cooling part 33. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer ceramic component such as a multilayer ceramic capacitor and a multilayer ceramic substrate, and a manufacturing apparatus used therefor.

  Conventionally, when manufacturing a multilayer ceramic component such as a multilayer ceramic capacitor, a slurry-like composition comprising various ceramic dielectric powders, a resin binder and a solvent shown in FIG. 6 is first formed into a thin film by a coating method or the like. Thus, the ceramic green sheet 100 is formed.

Next, a conductive material paste containing metal powder such as palladium, silver, nickel, etc. is printed and dried on the surface of the ceramic green sheet 100 by a screen printing machine to form a large number of conductor patterns 101.

The ceramic green sheets 100 are punched out and stacked to form a laminate.

Such punching of the ceramic green sheet 100 is disclosed in Patent Documents 1 and 2, for example. That is, FIG. 5 shows a conventional laminating apparatus.

As shown in the figure, the conventional laminating apparatus is provided with a punched male mold 100 that can move up and down and a punched female mold 120 in which a receiving hole 121 for receiving the ceramic green sheet 100 punched down is formed. The ceramic green sheet 100 is transferred between the punched male mold 110 and the punched female mold 120 and stopped when the punched area on the upper surface of the ceramic green sheet 100 reaches the punched male mold 110, and the punched male mold 110 is punched. By dropping toward the female mold 120, the punched male mold 110 comes into contact with the punched area on the ceramic green sheet 100, and the ceramic green sheet 100 is punched and falls into the receiving hole 121 of the punched female mold 120. The punched ceramic green sheets 100 are sequentially stacked inside the punched female mold 120 to form a stacked body 130.
Japanese Patent Application Laid-Open No. 61-219125 JP 54-54385 A

  However, in order to achieve miniaturization and high performance in a multilayer ceramic component such as a multilayer ceramic capacitor, thinning and multilayering of ceramic green sheets have been promoted in recent years. For example, in the case of a multilayer ceramic capacitor, it is possible to reduce the size and increase the capacity by thinning and multilayering the ceramic green sheet. In this way, as the ceramic green sheet becomes thinner and multilayered, the strength per ceramic green sheet becomes weaker. In the conventional manufacturing method, when the ceramic green sheets 100 are laminated, the ceramic green sheets are laminated. Since the ceramic green sheet 100 is bent by its own weight, the ceramic green sheet 100 is bent and deformed, and the interval between the conductor patterns 101 printed thereon deviates from a predetermined dimension.

Further, since the outer peripheral portion of the contact surface of the punched male mold 110 is extended and deformed and dropped when the ceramic green sheet 100 is punched, when the multilayer body 130 is formed, a conductor inside the resulting multilayer body 130 is obtained. The pattern 101 may shift to cause variation in capacitance, disconnection of internal circuits, and the like.

The present invention has been devised in view of the problems as described above, and the purpose thereof is to be able to stack the ceramic green sheets without sagging as the ceramic green sheets become thinner, and without deformation during the stacking, An object of the present invention is to provide an apparatus for manufacturing a multilayer ceramic component capable of highly accurate lamination.

An apparatus for manufacturing a multilayer ceramic component according to the present invention comprises an upper punch portion in which a heating portion is disposed on a pressure-bonding surface, and a cooling portion is disposed therein, and a lower punch portion that supports a laminated body. The ceramic green sheet of a laminate composed of a ceramic green sheet, a conductor pattern, and a carrier film, and a laminated ceramic that transfers the conductor pattern onto the laminated body placed on the lower punch portion by thermocompression bonding In the component manufacturing apparatus, the heating unit is made of a plate-shaped resistor, and a buffer heat insulating unit is interposed between the heating unit and the cooling unit.

In addition, the multilayer ceramic component manufacturing apparatus is characterized in that at least one of the upper punch portion and the lower punch portion is movable when the pressure is changed.

Further, the multilayer ceramic component manufacturing apparatus of the present invention is characterized in that at least one of the upper punch part and the lower punch part is movable by changing the pressure by at least one of a hydraulic servo system and an electric servo system. is there.

  According to the multilayer ceramic component manufacturing apparatus of the present invention, heat is applied to the cooling part of the upper punch during heating by providing a buffer heat insulating part between the crimping surface of the upper punch part and the heating part. Appropriate heat can be transmitted to the laminate / stacked body without escaping, and since heat is not applied during cooling, the heat of the laminate / stacked body can be transmitted to the cooling unit. In addition, since the buffer material is provided, the pressure-bonding surfaces of the laminate and the laminated body have a uniform pressure, and the pressure-bonding surfaces obtain a uniform pressure. In addition, by adopting a configuration including a plate-like resistor, the resistor is heated by energization, so that a uniform temperature can be obtained in the laminate and the laminated body, and the amount of generated heat can be controlled by the thickness and material of the resistor. It becomes possible, and the deformation of the laminate can be suppressed.

  In addition, according to the multilayer ceramic component manufacturing apparatus of the present invention, the pressurization force can be adjusted by adopting a configuration equipped with a hydraulic servo system and / or an electric servo system, so that the pressure applied when the laminate and the laminate are in contact with each other is adjusted. Pressure can be reduced. In addition, the applied pressure in the crimped state can be finely controlled, and the deformation of the laminate or the stacked body can be suppressed.

Embodiments of the present invention will be described below. FIG. 1 shows an apparatus for producing a multilayer ceramic component according to the present invention, and FIG. 2 explains the structure of a laminate 1 used in the present invention.

The multilayer ceramic component manufacturing apparatus of the present invention is mainly composed of an upper punch portion 3 and a lower punch portion 4 opposed to the upper punch portion 3, and conveys and passes the laminate 1 between the upper punch portion 3 and the lower punch portion 4. .

In the laminate 1, a ceramic green sheet 12 is formed on a carrier film 11, and a conductor pattern 13 is further printed on a predetermined position by screen printing or the like.

The carrier film 11 is a long film formed from a hard resin material such as a biaxially stretched polyethylene terephthalate film (polyester film) or a biaxially stretched polypropylene film.

On the other hand, the ceramic green sheet 12 is formed on the surface of the carrier film 11 by forming a slurry-like composition comprising various ceramic dielectric powders, a resin binder, and a solvent by a coating method or a printing method. The thickness of the ceramic green sheet 12 is, for example, about 1 μm to 20 μm.

Further, a conductive material containing metal powder such as palladium, silver, or nickel is printed on the upper surface of the ceramic green sheet 12 as the conductor pattern 13.

The upper punch unit 3 includes a heating unit 32, a buffer heat insulating unit 34, and a cooling unit 33 in this order from the surface.

The heating unit 32 is made of a flat plate-like resistor having a pressure-bonding surface 31 that comes into contact with the back surface of the carrier film 11 of the ceramic green sheet 12. The heating unit 32 generates heat due to a direct current supplied from the power supply device 6. Any material can be used for the heating unit 32 as long as it is a conductive material. Preferred are metals such as Fe, Ni, Cr, etc. excellent in smoothness, sintered bodies such as SiC, C, and alloy materials and composite materials thereof. Further, a stainless alloy is preferable from the viewpoint of wear. The heating unit 32 may be plated or coated with Teflon (registered trademark) (registered trademark) in order to improve smoothness.

The thickness of the heating unit 32 can be any thickness between 0.01 mm and 1 mm. Preferably, the thickness that is difficult to tear from the viewpoint of durability is 0.1 mm to 1 mm. Furthermore, the thickness with a small heat capacity is preferably 0.1 mm from the viewpoint of temperature control. The cooling unit 33 cools the cooling medium by passing the cooling medium from the inlet 35a to the outlet 35b in the upper punch 3. The flow path of the internal fluid can be arbitrarily formed. Preferably, a plurality of flow paths are used so that the temperature of the crimping surface 31 is uniform from the viewpoint of temperature distribution.

Any cooling medium can be used. A gas such as air or a liquid such as oil is preferable. Furthermore, it is preferably water with a large heat capacity and low cost from the viewpoint of cooling efficiency and economy.

Moreover, it is preferable that the cooling medium is managed at a specified temperature by a heat exchanger such as a chiller.

Further, the cooling medium may be either a circulation type or a non-circulation type, but a circulation type is preferable from the viewpoint of the environment.

The buffer heat insulation part 34 can be used between the cooling part 33 and the heating part 32, and can use any thing which serves as a buffer material and a heat insulation material. Preferably, it is an elastic heat resistance material excellent in smoothness, for example, a metal such as lead, a resin such as silicon, a sintered material such as carbon, and a composite material thereof. Furthermore, it is preferable to use silicon having a large electric resistance from the viewpoint of insulation from the heating unit 32. Moreover, you may use the buffer heat insulation part 34 combining a buffer material and a heat insulation material. Any buffer material can be used. Preferably, it is an elastic material excellent in smoothness, for example, a metal such as lead, a resin such as silicon, a sintered material such as carbon, and a composite material thereof. Any heat insulating material can be used.

Preferably, a heat insulating material having excellent smoothness, for example, a metal such as lead, a resin such as silicon, a sintered material such as ceramic or carbon, and a composite material thereof. Further, when the buffer material and the heat insulating material are used in combination, the combination order is the order of the cooling unit 33, the heat insulating material, the buffer material, and the heating unit 32 or the order of the cooling unit 33, the buffer material, the heat insulating material, and the heating unit 32. Either is acceptable. Preferably, from the viewpoint of pressure distribution, the order is the cooling unit 33, the heat insulating material, the buffer material, and the heating unit 32 in which the surface pressure of the laminate is uniform.

When a conductive material is used as a buffer heat insulating material, a buffer material, or a heat insulating material in contact with the heating unit 32, paper, a resin film, or the like can be used between the heating unit 32. Alternatively, a process of attaching an insulating material such as a Teflon (registered trademark) coating process to the conductive material can be performed.

The thickness of the buffer heat insulation part 32 can use arbitrary thickness between 0.01 mm-30 mm. Preferably, the thickness which is difficult to tear from the viewpoint of durability is between 1 mm and 30 mm. Furthermore, preferably, the thickness with a small heat capacity is 1 mm from the viewpoint of temperature control.

The lower punch portion 4 preferably has a flat surface in contact with the support base 21. The pressing unit 5 uses a hydraulic servo to push up and pressurize the lower punch unit 4. The pressurization drive may use a servo motor. Moreover, although embodiment of this invention showed the form which pushes up the lower punch part 4, the form which installs the press part 5 in the upper punch part 3 and lowers and pressurizes the upper punch part 3 may be sufficient.

The power supply device 19 supplies a direct current to the heating unit 32 to cause the heating unit 32 to generate heat. A power supply device can use arbitrary things between the outputs of 10V-1000A-50V-6000A. Furthermore, the direct current is to perform current control so that the amount of current can be controlled. Further, the heat generation amount can be controlled by the energization time. Furthermore, the temperature of the heating unit 32 can be measured to control the amount of direct current.

Next, the operation of the manufacturing apparatus of the present invention will be described. In order to form a laminated body, first, the above-described laminated body 1 is moved to a predetermined position of the upper punch portion 3. At that time, the region moves in the direction of the right arrow, but the region to be stacked is sucked and held by the carrier film holders 36a and 36b at both end portions of the upper punch portion 3 and directly below the upper punch portion.

Next, the lower punch portion 4 is pushed up and pressed by the pressing portion 5 so that the laminate 1 is pressure-bonded to the surface of the laminated body 2 composed of the support base 21 and the laminated intermediate body 22 held by the lower punch portion 4. . In this state, power is supplied from the power supply device 6 to the heating unit 32 of the upper punch unit 3 while controlling the amount of current, and the laminate 1 is heated by the generated Joule heat.

Further, while controlling the current amount in the heating unit 32 while being pressurized, the heat generation amount is decreased and the laminate 1 is cooled. Therefore, when the laminate 1 is cooled to a predetermined temperature by the following pressurization, heating, cooling, and peeling steps, and the lower punch 4 is lowered by the pressing portion 5, the carrier film 11 becomes the carrier film holders 36a and 36b. Therefore, the ceramic green sheet 12 is transferred to the surface of the stacked body 2. As described above, a series of lamination operations are repeated to produce a laminate.

The laminate 1 heated by Joule heat and the laminate 1 to be cooled are examples of the present invention, and the laminate 1 and the stacked body 2 may be heated and cooled.

Next, FIG. 3 shows the state of pressure and temperature at which the laminate 1 and the laminated body 2 are heated and cooled while being pressed and the carrier film 11 is peeled off, and the crimping and peeling process will be described in more detail.

T1 is the initial temperature, T2 is the pressure bonding temperature, P1 is the initial pressure, P2 is the pressure pressure, Ta to Tf are the main points of temperature, and Pa to Pd are the main points of pressure.

The pressurization pushes up the lower punch portion 4, starts increasing pressure from the point Pa, and reaches the pressure P2 from the pressure P1 at the point Pb. During this time, the temperature T1 is maintained, and the laminate 1 and the laminated body 2 are pressurized without being heated. Further, the pressure P2 is maintained from the point Pb to the point Pc, and the heating unit 32 is energized and heated from the point Tb of the temperature T1. At this time, the pressure bonding surfaces of the laminate 1 and the ceramic green sheet 12 are softened by heat. The energization amount is controlled at the point Tc at which the pressure-bonding surface of the laminate 1 and the ceramic green sheet 12 reaches the temperature T2, the temperature T2 is maintained up to the point Td, and then the energization amount is reduced or stopped until the point Te where the temperature T1 is reached. Cooling is performed by the cooling unit 33 of the upper punch unit 3. The ceramic green sheet 12 of the softened laminate 1 and the pressure-bonding surface of the laminated body 2 are cooled while being pressurized, and are solidified and pressure-bonded. This crimping force is greater than the crimping force between the carrier film 11 and the ceramic green sheet 12. Further, the lower punch portion 4 descends and the pressure P2 is reduced from the point Pc, becomes a pressure P1 at the point Pd, and pressurization is terminated. On the other hand, when the carrier film 11 is held by the carrier film holders 36a and 36b, the lower punch portion 4 is lowered and peeled off from the laminate 1 at the same time. Thereafter, the temperature T1 is maintained from the point Te to the point Tf, and preparation for repeated stacking operations is made.

As described above, since the ceramic green sheet 12 is supported by the carrier film 11, it can be laminated without bending, and the laminate 1 and the laminate 2 can be cooled while being pressurized, so the ceramic green sheet of the laminate 1 can be cooled. 12, the pressure-bonding force between the pressure-bonding surfaces of the laminated body 2 and the carrier film 11 is strong, the carrier film 11 can be surely peeled off, and a laminated body with little deformation during lamination can be formed.

The lamination example of a multilayer ceramic capacitor is shown.

A PET film was used as a carrier film, a ceramic green sheet having a thickness of 1 to 8 μm was formed on the film, and a material on which an electrode pattern was printed by screen printing or the like was used. A silicon plate having a thickness of 1 mm was used as the buffer heat insulating material, and a stainless steel plate having a thickness of 0.1 mm, a width of 150 mm, and a length of 250 mm was used as the resistor. After pressing, a 1500 A direct current was passed through the resistor for 0.2 to 0.9 seconds depending on the thickness of the material, thereby suppressing the displacement of the conductor pattern inside the laminate.

The measurement method shown in FIG. 4 is used to measure between a conductor pattern in which deformation has occurred, and compared with the design value, the deformation amount of the laminate laminated by the conventional method is 30 μm. The amount of deformation of the laminate laminated by the manufacturing method of the present invention was 15 μm.

According to the method for manufacturing a multilayer ceramic component using the manufacturing apparatus of the present invention, since the laminate composed of the ceramic green sheet supported by the carrier film and the conductor pattern is used, the ceramic green sheet is bent by its own weight. Therefore, stable lamination is possible.

According to such a method for manufacturing a multilayer ceramic component, since the laminate composed of the ceramic green sheet supported by the carrier film and the conductor pattern is used, the laminate can be crimped without bending. And, since it is placed on the surface of the laminate and heated and cooled while being pressure-bonded, the pressure of the pressure-bonding force at the boundary between the carrier film and the ceramic green sheet is weakened by heating the laminate, followed by cooling and curing. This makes it possible to increase the crimping force at the boundary between the laminate and the ceramic green sheet, so that the crimping force between the laminate and the ceramic green sheet is stronger than the crimping force between the carrier film and the ceramic green sheet. Thus, a pressure sufficient to peel the ceramic green sheet from the carrier film can be obtained on the pressure-bonding surface of the laminated body. As a result, it is possible to peel off the carrier film without peeling failure.

According to the manufacturing apparatus of the present invention, by adopting a configuration in which a buffer heat insulating part is provided between the pressure-bonding surface of the upper punch part and the heating part, appropriate heat is applied to the laminate / stacked body during heating. At the time of transmission and cooling, the heat of the laminate / stacked body can be transmitted to the cooling unit, and the effects of heating and cooling can be combined. In addition, since the buffer material is provided, the pressure-bonding surfaces of the laminate and the laminated body have a uniform pressure, and the pressure-bonding surfaces obtain a uniform pressure-bonding force.

Furthermore, according to the manufacturing apparatus of the present invention, since the pressing force can be adjusted by adopting a configuration having a hydraulic servo system or an electric servo system, the pressing force at the time of contact between the laminate and the stacked body can be reduced, so that It becomes possible to suppress the deformation of the object. In addition, the pressure applied in the crimped state can be finely controlled, and deformation of the laminate can be suppressed.

Furthermore, according to the manufacturing apparatus of the present invention, by providing a configuration including a plate-like resistor, the resistor is heated by energization, so that a uniform temperature can be obtained in the laminate and the laminate. It is possible to suppress local deformation due to the heat effect. Further, the amount of heat generated can be controlled by the thickness and material of the resistor, and can be easily applied to a laminate of various materials, and deformation of those laminates can be suppressed.

It is sectional drawing which shows the state which is implementing one Example of this invention. It is a figure which shows the laminated body of this invention. It is a pressure and temperature profile figure of the Example shown in FIG. It is a figure which shows the definition of a laminated body deformation amount. It is a figure explaining the manufacturing apparatus of the conventional multilayer ceramic component. It is a figure which shows the ceramic green sheet and conductor pattern of the conventional method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Laminate 2 ... Laminated body 3 ... Upper punch part 4 ... Lower punch part 5 ... Pressing part 6 ... Power supply Device 11 ... Tape 12 ... Carrier film 13 ... Ceramic green sheet 14 ... Conductor pattern 21 ... Support base 22 ... Laminated intermediate 31 ... Crimp Surface 32 ... Heating part 32a ... Resistor 33 ... Cooling part 34 ... Buffer heat insulating part 35a ... Inlet 35b ... Outlet

Claims (3)

A ceramic green sheet disposed between the upper punch part and the lower punch part, comprising a heating part on the pressure-bonding surface, an upper punch part in which a cooling part is disposed inside, and a lower punch part that supports the stacked body; The ceramic green sheet of a laminate composed of a conductor pattern and a carrier film, and an apparatus for producing a multilayer ceramic component that transfers the conductor pattern by thermocompression onto the laminate to be placed on the lower punch part,
The heating unit is made of a plate-shaped resistor, and a buffer heat insulating unit is interposed between the heating unit and the cooling unit. 2. The multilayer ceramic component manufacturing apparatus according to claim 1, wherein at least one of the upper punch portion and the lower punch portion is moved while being pressurized. 3. The multilayer ceramic component manufacturing apparatus according to claim 2, wherein at least one of the upper punch portion and the lower punch portion is moved by changing the pressure by at least one of a hydraulic servo system and an electric servo system.

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