JP2006147253A - Method of manufacturing press-worked component and connector terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide methods of manufacturing a press-worked component and a connector terminal in which cost of plating treatment is suppressed in comparison with the case that post-plating treatment is applied. <P>SOLUTION: An upper terminal 22 includes a fitting part 24 and a board mounting part 26. When manufacturing the upper terminal 22, pre-plating treatment is applied in advance to front and back surfaces of a metal plate of which entire surface is not plated. Subsequently, a work is stamped out from the metal plate by press-working. The fitting part 24 is formed by partially applying bending work to the work around a predetermined bending position as a center and a board mounting part 26 is formed. Thus, the plated layer on the back surface of the work is exposed over three surfaces which are a front surface 72B, a right side surface 72D and a back surface 72F of the fitting part 24, and further on a back surface 74G, a left side surface 74A and a right side surface 74D of the board mounting part 26. Therefore, the post-plating treatment for a part used for electrical connection is not necessary. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a press-processed product manufactured by punching from a plate material, and a method for manufacturing a connector terminal manufactured by punching from a plate material and connected to a substrate by soldering.

  For example, a surface mount connector (so-called SMT connector), for example, is mounted on a substrate of an electronic device or an electronic circuit by soldering.

  This type of connector includes, for example, a connector housing formed in a substantially rectangular box shape, and a plurality of connector terminals (terminals) that are inserted into mounting holes provided on the side of the connector housing. Each of the plurality of connector terminals is plated, and is bent downward (board side) and has a tip fixed to the upper surface of the board by soldering (see, for example, Patent Document 1). ).

  By the way, the plurality of connector terminals as described above are manufactured by punching from a plate material. When manufacturing the plurality of connector terminals, first, a plate material (strip material) in a non-plated state is punched out by press working to form a work connected in a comb shape (chain shape). The workpiece after the press working (after punching the plate material) is still in an unplated state on the entire periphery (both the plate material surface portion and the punched cut surface portion). Thereafter, the entire periphery (both the plate material surface portion and the punched cut surface portion) is plated by a so-called post-plating process. Each workpiece processed as described above is bent according to a connector to be surface-mounted and used as a connector terminal.

  Thus, according to the conventional manufacturing method, it is possible to reliably perform plating over the entire periphery of each connector terminal.

  However, in the conventional manufacturing method as described above, a plating layer is formed on the entire periphery of the workpiece by a so-called post-plating process on a workpiece having a complicated shape connected to a comb shape after pressing (after punching a plate material). The film thickness varies depending on the post-plating part, and it is difficult to make the film thickness of the plating layer uniform as a whole. If the thickness of the plating layer is not uniform, for example, the insertion / extraction force between the connector terminal and the female terminal corresponding to the connector terminal is increased, which is not preferable from the viewpoint of the fitting operation between the connector and the female connector corresponding to the connector. .

In addition, such a post-plating process has a problem that the processing cost is very high compared to the pre-plating process. In this case, it is conceivable to produce a connector terminal by punching a workpiece from a pre-plated plate material, but the cut surface is naturally unplated and a plating layer is required for this part. (For example, when the cut surface portion is a part to be soldered), the post-plating process cannot be omitted. For this reason, the problem of the processing cost which arises by performing post-plating processing is not fundamentally solved, but the countermeasure for suppressing the cost of plating processing was desired.
JP 2001-110491 A

  In view of the above problems, an object of the present invention is to obtain a method of manufacturing a press-processed product and a method of manufacturing a connector terminal that can reduce the cost of the plating process as compared with the case of performing the post-plating process.

  The manufacturing method of the press-worked product according to the invention of claim 1 pre-plats both front and back surfaces of the plate material, and punches the workpiece from the plate material by performing press work on the plate material after the pre-plating treatment, Next, bending is performed around a predetermined bending position so that any one plate surface of the workpiece is in close contact with each other, and the plating layer on the other plate surface of the workpiece is bent. It is characterized by forming a surface layer at the processing site.

  In the method for manufacturing a press-processed product according to the first aspect of the present invention, the pre-plating process is performed in advance on both the front and back surfaces of the plate material in the entire non-plating process state.

  Next, the plate material subjected to the pre-plating process is subjected to press work, and a workpiece is punched from the plate material.

  Next, the workpiece is bent around a predetermined bending position, and any one plate surface of the workpiece is in close contact with each other.

  As a result, the plating layer on the other plate surface of the workpiece is used as the surface layer in the bending portion. For this reason, a post-plating process can be made unnecessary.

  Therefore, the manufacturing method of the press-processed product according to claim 1 can reduce the cost of the plating process as compared with the case of performing the post-plating process because the plating process is only the pre-plating process.

  According to a second aspect of the present invention, there is provided a method for manufacturing a connector terminal, wherein the connector terminal is manufactured by being punched from a plate material, attached to a connector housing, and provided with a fitting portion that fits with a connection terminal of a mating connector. In the method, pre-plating is performed in advance on both the front and back surfaces of the plate material, and the workpiece to be a pre-process product of the connector terminal is punched from the plate material by pressing the plate material after the pre-plating treatment, Bending is partially performed around a predetermined bending position so that any one plate surface of the workpiece is in close contact with each other, and the plated layer on the other plate surface is a surface layer at the bending portion. Thus, the fitting portion is formed.

  In the connector terminal manufacturing method according to the second aspect of the present invention, the pre-plating process is performed in advance on both the front and back surfaces of the plate material in the entire non-plating process state.

  Next, the plate material that has been subjected to the pre-plating process is subjected to press work, and a workpiece that is a pre-process product of the connector terminal is punched out from the plate material.

  Next, the workpiece is partially bent around a predetermined bending position of the workpiece, and any one plate surface of the workpiece is in close contact with each other. As a result, the plated layer on the other plate surface of the workpiece is used as the surface layer in the bending portion, and the connector terminal fitting portion is formed. For this reason, the post-plating process can be made unnecessary in the connector terminal fitting portion.

  Therefore, in the connector terminal manufacturing method according to the second aspect, since only the pre-plating process is required for the plating process, the cost of the plating process can be reduced as compared with the case of performing the post-plating process.

  Moreover, in the manufacturing method of this connector terminal, since the plating layer of a connector terminal is formed by a pre-plating process, the film thickness of a plating layer can be made uniform.

  According to a third aspect of the present invention, there is provided a method for manufacturing a connector terminal, comprising: a connector terminal having a board mounting portion that is manufactured by being punched from a plate and attached to a connector housing mounted on the board; In the manufacturing method, pre-plating is performed in advance on both the front and back surfaces of the plate material, and the plate material after the pre-plating treatment is subjected to press processing to punch a workpiece that is a pre-process product of the connector terminal, and then , A part of the workpiece plate is bent about a predetermined bending position so that the plate surfaces are in close contact with each other, and the plating layer on the other plate surface is bent The substrate attachment portion is formed by using the surface layer in FIG.

  In the connector terminal manufacturing method according to the third aspect of the invention, the pre-plating process is performed in advance on both the front and back surfaces of the plate material in the entire non-plating process state.

  Next, the plate material that has been subjected to the pre-plating process is subjected to press work, and a workpiece that is a pre-process product of the connector terminal is punched out from the plate material.

  Next, the workpiece is partially bent around a predetermined bending position of the workpiece, and any one plate surface of the workpiece is in close contact with each other. As a result, the plated layer on the other plate surface of the workpiece is used as a surface layer in the bending portion, and the board attachment portion of the connector terminal is formed. For this reason, the post-plating process can be dispensed with at the board mounting portion of the connector terminal.

  Therefore, in the connector terminal manufacturing method according to the third aspect, since only the pre-plating process is required for the plating process, the cost of the plating process can be suppressed as compared with the case of performing the post-plating process.

  Moreover, in the manufacturing method of this connector terminal, since the plating layer of a connector terminal is formed by a pre-plating process, the film thickness of a plating layer can be made uniform.

  According to a fourth aspect of the present invention, there is provided a connector terminal manufacturing method according to the third aspect, wherein the plating layer of the board mounting portion is formed on at least the back surface facing the board.

  In the connector terminal manufacturing method according to the fourth aspect of the present invention, since the plating layer of the board mounting portion of the connector terminal is formed on at least the back surface facing the board, the board mounting portion is fixed to the board by soldering. In some cases, the solder fillet is formed in an appropriate shape between the board mounting portion and the board. Therefore, it is possible to secure a sufficient soldering strength to fix the board mounting portion, more specifically, the connector terminal to the board, which is preferable.

  As described above, the method for manufacturing a press-processed product and the method for manufacturing a connector terminal according to the present invention can reduce the cost of the plating process as compared with the case where the post-plating process is performed.

  A press-processed product and an upper terminal 22 and a lower terminal 28 as connector terminals applied to a surface mount connector (hereinafter also referred to as an SMT connector) 10 according to an embodiment of the present invention will be described with reference to FIGS. To do. For convenience of explanation, the direction indicated by the arrow A in FIGS. 1 to 3 and 9 is forward, the direction indicated by the arrow B orthogonal to the arrow A is rightward, and is orthogonal to both the arrows A and B. The direction indicated by the arrow C is referred to as the upward direction.

  In FIG. 3B, an outline of the SMT connector 10 and a board (for example, a printed board on which lands are printed by screen printing or the like) 12 on which the SMT connector 10 is mounted is shown in a side sectional view. Yes.

  The SMT connector 10 includes a connector main body 14 as a connector housing. The connector main body 14 is formed, for example, in a substantially rectangular box shape, and has a back wall 16 that is erected with respect to the substrate 12 while being mounted on the substrate 12. The back wall 16 is formed with a plurality of upper terminal attachment holes 18 arranged in parallel along the left-right direction and a plurality of lower terminal attachment holes 20 arranged in parallel along the left-right direction. (See FIG. 3A). As shown in FIGS. 3 (A) and 3 (B), the upper terminal mounting hole 18 is formed immediately above the lower terminal mounting hole 20 (except for the central portion in the left-right direction of the back wall 16). The upper terminal mounting hole 18 and the lower terminal mounting hole 20 are formed in a horizontally long rectangular shape that is symmetrical to each other in the vertical direction and the horizontal direction, and has a lateral dimension somewhat larger than the vertical dimension in the rear view. (See FIG. 3A).

  Further, the SMT connector 10 includes a plurality of upper terminals 22 arranged in parallel along the left-right direction and a plurality of lower terminals 28 arranged in parallel along the left-right direction. As shown in FIGS. 3 (A) and 3 (B), the upper terminal 22 is disposed immediately above the lower terminal 28 (excluding the central portion in the left-right direction of the back wall 16).

  The upper terminal 22 includes a fitting portion 24 that is engaged with an upper terminal mounting hole 18 provided in the back wall 16 of the connector body 14 (see FIGS. 1 and 3).

  The fitting part 24 has a lower layer part 48. The lower layer portion 48 is formed in a thin plate-like body having a substantially rectangular shape when viewed from above, which is elongated in the front-rear direction. The lower layer portion 48 is stacked with the upper layer portion 50 in close contact therewith. The upper layer portion 50 is formed in a substantially rectangular thin plate-like body in a top view that is elongated in the front-rear direction corresponding to the lower layer portion 48. The right end portion of the upper layer portion 50 is continuous with the right end portion of the lower layer portion 48 through the intermediate portion 46. The intermediate portion 46 is formed in a thin plate-like body having a substantially rectangular shape in a side view corresponding to the lower layer portion 48 and the upper layer portion 50 and extending in the front-rear direction.

  In the fitting portion 24, plating layers are formed by a pre-plating process (tin plating process) on the back surface 72F of the lower layer portion 48, the right side surface 72D of the intermediate portion 46, and the surface 72B of the upper layer portion 50. On the other hand, the left side surface 72E of the lower layer portion 48 and the left side surface 72C of the upper layer portion 50 (that is, the left side surface of the fitting portion 24) are exposed to the outside (the plated layer is a surface layer). ) Is not formed with a plating layer. A plating layer is formed on the back surface 72A of the upper layer portion 50 and the front surface 72G of the lower layer portion 48. Such a fitting portion 24 is formed in a horizontally long shape having a size in the horizontal direction somewhat larger than the size in the vertical direction in rear view (see FIGS. 1 and 3A).

  A leg portion 27 is integrally provided on the rear side of the fitting portion 24 (see FIGS. 1 and 3). The leg portion 27 is formed continuously with the lower layer portion 48 of the fitting portion 24 by shifting the center position in the left and right direction from the center position in the left and right direction of the lower layer portion 48 of the fitting portion 24 to the left side (that is, The leg 27 is offset to the left with respect to the fitting part 24). Furthermore, the leg portion 27 is bent downward (on the substrate 12 side) in the middle.

  A substrate attachment portion 26 is provided continuously along the upper surface of the substrate 12 at the tip end portion (the end portion opposite to the fitting portion 24) of the leg portion 27. The board attaching part 26 has an intermediate part 52. The intermediate portion 52 is formed in a substantially rectangular thin plate-like body in a bottom view that is elongated in the front-rear direction corresponding to the substrate 12. A left side portion 54 is erected integrally with a left end portion of the intermediate portion 52. The left side portion 54 is formed into a substantially rectangular thin plate-like body in a side view that is elongated in the front-rear direction corresponding to the intermediate portion 52. On the other hand, a right side portion 56 stands integrally with a right end portion of the intermediate portion 52. The right side portion 56 is formed in a substantially rectangular thin plate-like body in a side view that is elongated in the front-rear direction corresponding to the intermediate portion 52.

  In the board mounting portion 26, a plating layer is formed by a pre-plating process on the back surface 74G of the intermediate portion 52, the left side surface 74A of the left side portion 54, and the right side surface 74D of the right side portion 56. On the other hand, the plating layer is formed on the surface 74E of the left side portion 54 and the surface 74F of the right side portion 56 (that is, the surface of the substrate mounting portion 26). It has not been. A plating layer is formed on the right side surface 74B of the left side portion 54 and the left side surface 74C of the right side portion 56.

  In such a board mounting portion 26, the right side surface 74B of the left side portion 54 and the left side surface 74C of the right side portion 56 are in close contact with each other, and in the rear view, the vertical dimension is somewhat larger than the horizontal dimension. Is formed. The board mounting portion 26 as described above is fixed to the board 12 by soldering (mounted on the board 12) (see FIGS. 3 and 9). In FIG. 3B, the solder fillet is not shown. ).

  On the other hand, the lower terminal 28 includes a fitting portion 30 that is engaged with a lower terminal mounting hole 20 provided in the back wall 16 of the connector body 14 (see FIGS. 2 and 3).

  The fitting part 30 has a lower layer part 62. The lower layer part 62 is formed in a thin plate-like body having a substantially rectangular shape when viewed from above, which is elongated in the front-rear direction. On the lower layer 62, the upper layer 64 is stacked in close contact. The upper layer portion 64 is formed in a substantially rectangular thin plate-like body in a top view that is elongated in the front-rear direction corresponding to the lower layer portion 62. The left end portion of the upper layer portion 64 is continuous with the left end portion of the lower layer portion 62 through the intermediate portion 60. The intermediate portion 60 is formed in a substantially rectangular thin plate-like body in a side view that is elongated in the front-rear direction corresponding to the lower layer portion 62 and the upper layer portion 64.

  In the fitting portion 30, a plating layer is formed by a pre-plating process on the back surface 76 </ b> F of the lower layer portion 62, the left side surface 76 </ b> D of the intermediate portion 60, and the front surface 76 </ b> B of the upper layer portion 64. On the other hand, the right side surface 76E of the lower layer portion 62 and the right side surface 76C of the upper layer portion 64 (that is, the right side surface of the fitting portion 30) are exposed. Is not formed. A plating layer is formed on the back surface 76A of the upper layer portion 64 and the surface 76G of the lower layer portion 62. Such a fitting part 30 is formed in a horizontally long shape having a lateral dimension somewhat larger than the vertical dimension in rear view (see FIGS. 2 and 3A).

  A leg 33 is integrally provided on the rear side of the fitting portion 30 (see FIGS. 2 and 3). The leg portion 33 is formed continuously with the lower layer portion 62 of the fitting portion 30 by shifting the center position in the left and right direction from the center position in the left and right direction of the lower layer portion 62 of the fitting portion 30 to the right side (that is, The leg portion 33 is offset to the right side with respect to the fitting portion 30). Further, the leg portion 33 is bent downward (on the substrate 12 side) in the middle.

  A substrate attachment portion 32 is provided continuously along the upper surface of the substrate 12 at the tip end portion (the end portion opposite to the fitting portion 30) of the leg portion 33. The board attaching part 32 has an intermediate part 66. The intermediate portion 66 is formed in a substantially rectangular thin plate-like body in a bottom view that is elongated in the front-rear direction corresponding to the substrate 12. A left side portion 68 is erected integrally with the left end portion of the intermediate portion 66. The left side portion 68 is formed in a thin plate-like body having a substantially rectangular shape in a side view that is elongated in the front-rear direction corresponding to the intermediate portion 66. On the other hand, a right side portion 70 is erected integrally with a right end portion of the intermediate portion 66. The right side portion 70 is formed in a substantially rectangular thin plate-like body in a side view that is elongated in the front-rear direction corresponding to the intermediate portion 66.

  In the board mounting portion 32, a plating layer is formed by a pre-plating process on the back surface 78G of the intermediate portion 66, the left side surface 78D of the left side portion 68, and the right side surface 78A of the right side portion 70. On the other hand, the plating layer is formed on the surface 78F of the left side portion 68 and the surface 78E of the right side portion 70 (that is, the surface of the substrate mounting portion 32). It has not been. A plating layer is formed on the right side surface 78C of the left side portion 68 and the left side surface 78B of the right side portion 70.

  In such a board mounting portion 32, the right side surface 78C of the left side portion 68 and the left side surface 78B of the right side portion 70 are in close contact with each other, and in the rear view, the vertical dimension is slightly larger than the horizontal dimension. Is formed. The board mounting portion 32 of the leg 33 as described above is fixed (mounted on the board 12) to the board 12 by soldering (see FIG. 3B). In FIG. (The fillet is not shown).

  In such a state that the board mounting part 26 and the board mounting part 32 are mounted on the board 12, the board mounting parts 26 and the board mounting parts 32 are alternately arranged in a straight line in the left-right direction ( (See FIG. 3A).

  As described above, the upper terminal 22 and the lower terminal 28 pass through the back wall 16 and protrude to the rear of the connector body 14 and are mounted on the substrate 12. Thus, the SMT connector 10 is a male connector and is connected to a female connector that is an external terminal. In this connected state, the upper terminal 22 and the lower terminal 28, which are male terminals, are fitted to a female terminal (mating terminal) fitting portion in which the fitting portion 24 and the fitting portion 30 are provided on the external terminals, respectively. And is connected in a conductive state.

  Next, the operation of the embodiment of the present invention will be described.

  Hereinafter, for convenience of explanation, the upper terminal 22 will be taken as an example and the manufacturing procedure will be described.

  First, a pre-plating process (tin-plating process) is performed in advance on both the metal plate front surface portion 58A and the metal plate back surface portion 58B of the metal plate 58 (see FIG. 4) in the entire non-plated state. In the metal plate 58 after the pre-plating process, both the metal plate front surface portion 58A and the metal plate back surface portion 58B are plated, but the peripheral portion 50C is unplated.

  Next, a rectangular thin plate-like fitting portion 24 </ b> A in a top view corresponding to the fitting portion 24 of the upper terminal 22 and a length corresponding to the board mounting portion 26 of the upper terminal 22 were formed. A thin plate-like body 22A as a work (a pre-process product of the upper terminal 22) composed of a substantially straight thin plate-like substrate mounting portion 26A in a top view is formed by being punched from the metal plate 58 by press working ( (See FIG. 5). The thin plate-like body 22A after the press working has both the metal surface portion 40A punched out from the metal plate surface portion 58A and the metal back surface portion 40B punched out from the metal plate back surface portion 58B. The cut surface portion 40C is in a non-plated state.

  In this case, the thin plate-like substrate mounting portion 26A of the thin plate-like body 22A has a thin plate shape with the center position in the width direction (direction corresponding to the left-right direction of the upper terminal 22) orthogonal to the longitudinal direction and the plate thickness direction. It is displaced from the center position in the width direction of the fitting portion 24A and is formed to extend linearly along the longitudinal direction of the thin plate-like fitting portion 24A.

  Next, as shown in FIG. 6, the thin plate-like fitting portion 24A of the thin plate-like body 22A is bent, and is connected to the left side (thin plate-like substrate mounting portion 26A) with respect to the widthwise central portion. The central portion and the right portion in the width direction with respect to the side portion are raised at a substantially angle of 90 degrees, so that the thin plate-like fitting portion 24A becomes the thin plate-like fitting portion 24B (hereinafter, the thin plate-like fitting portion). This raised portion of 24B is referred to as a rising portion 70. (See the two-dot chain line portion in FIG. 6). In this state, both the surface rising portion 70A raised from the metal surface portion 40A and the back surface rising portion 70B raised from the metal back surface portion 40B are both in a plated state, and the rising surface portion 40C from the punched cut surface portion 40C is raised. The cut surface portion 70 </ b> C that is the upper end surface of the raised portion 70 is in a non-plated state.

  Next, the thin plate-like fitting portion 24B is subjected to bending processing (partial bending of the thin plate-like body 22A), and the central portion (the base end portion of the rising portion 70) is set as the bending center position. The right portion (the tip portion and the intermediate portion of the rising portion 70) is further bent at an approximate angle of 90 degrees with respect to the central portion, and the metal surface portions 40A are in close contact with each other.

  In this way, the portion of the thin plate-like fitting portion 24B that is the central portion in the width direction of the thin plate-like fitting portion 24A is the intermediate portion 46, and among the thin plate-like fitting portions 24B, the thin plate The portion on the left side of the center portion in the width direction of the fitting portion 24A (the portion connected to the thin plate-like substrate mounting portion 26A) is the lower layer portion 48, and the thin plate-like fitting portion 42 has the above thin plate. The portion on the right side of the center portion in the width direction of the fitting portion 24A (the portion bent so as to be stacked on the lower layer portion 48) is the upper layer portion 50, and the thin plate fitting portion 24B is the fitting portion as a whole. 24.

  In the fitting portion 24, the back surface 72A of the upper layer portion 50 that is a bent portion of the front surface rising portion 70A and the upper layer portion 50 that is a bent portion of the back surface rising portion 70B. Both of the surface 72B and the surface 72B are plated. Further, the left side surface 72C of the upper layer portion 50 with the cut surface portion 70C facing left in the width direction and the left side surface 72E of the lower layer portion 48 (that is, the aforementioned punched cut surface portion 40C) are in a non-plated state. Furthermore, the right side surface 72D of the intermediate portion 46 is in a plated state.

  Next, as shown in FIG. 7, the thin plate-like substrate mounting portion 26A (more specifically, the tip portion on the opposite side of the fitting portion 24 of the thin plate-like substrate attaching portion 26A) is subjected to crushing processing, The plate thickness dimension is compressed to, for example, about 30% of the plate thickness dimension of the thin plate-like substrate mounting portion 26A before the crushing process, and the width direction dimension of the thin plate-like substrate mounting portion 26A is widened to attach the thin plate-like substrate mounting. Part 26B. After the crushing process, the thin plate-like substrate mounting portion 26B includes a metal surface portion 45A formed by being crushed in the metal surface portion 40A and a metal back surface portion 45B formed by being crushed in the metal back surface portion 40B. Both are plated, but the punched cut surface portion 45C formed by crushing the punched cut surface portion 40C is in a non-plated state.

  Next, the thin plate-like substrate mounting portion 26B is subjected to bending processing (the thin plate-like body 22B obtained by bending the thin plate-like body 22A is partially bent), and the central portion in the width direction is bent. A center position, and both sides (the left and right sides in the width direction of the thin plate-like substrate mounting portion 26B) are raised at an approximate angle of 90 degrees with respect to the center portion in the width direction. The portions 45A are in close contact with each other.

  In this way, the central portion 52 in the width direction of the thin plate-like substrate attachment portion 26B is the intermediate portion 52, and the left portion of the thin plate-like substrate attachment portion 26B is the left portion 54 with respect to the central portion in the width direction. A portion on the right side of the central portion in the width direction of the plate-like substrate attachment portion 26B is a right portion 56, and the thin plate-like substrate attachment portion 26B is a substrate attachment portion 26 of the upper terminal 22 as a whole.

  The substrate mounting portion 26 after bending is bent on the right side 74B of the left side portion 54, which is a portion subjected to bending processing on the left side in the width direction of the metal surface portion 45A, and on the right side in the width direction of the metal surface portion 45A. The left side surface 74C of the right side portion 56 that is the processed portion, the left side surface 74A of the left side portion 54 that is the portion that is bent on the left side in the width direction of the metal back surface portion 45B, and the metal back surface portion 45B Of these, the right side surface 74D of the right side portion 56, which is a portion that has been bent on the right side in the width direction, is in a plated state, but the surface 74E of the left side portion 54, which is a portion that has been subjected to bending processing on the punched cut surface portion 45C. And the surface 74F of the right side part 56 is a non-plating state. Further, the back surface 74G of the intermediate portion 52 is in a plated state.

  Next, the fitting portion 24 is inserted into the upper terminal mounting hole 18 provided in the back wall 16 of the connector body 14, and the thin plate-like leg portion that has not been crushed in the thin-plate-like substrate mounting portion 26A described above. The base end side (fitting portion 24 side) of 27 is bent downward (substrate 12 side), and the substrate attachment portion 26 side is bent along the upper surface of the substrate 12. As a result, the thin plate-like leg portion 27A becomes the leg portion 27 as a whole (see FIG. 8 above).

  The upper terminal 22 is manufactured as described above.

  Here, in the upper terminal 22, the front surface 72 </ b> B, the back surface 72 </ b> F, and the right side surface 72 </ b> D of the fitting portion 24 are coated by a pre-plating process previously applied to the metal plate 58. The left side surface 74A and the right side surface 74D are coated by a pre-plating process applied in advance to the metal plate 58.

  As described above, in the upper terminal 22, the plating layer (the metal plate surface portion 58A and the metal plate back surface portion 58B of the metal plate 58 is applied in advance to the portion used for electrical connection (the portion where the plating layer is required). Since the plating layer formed by the pre-plating process is located, it is not necessary to perform the post-plating process on the fitting part 24 and the board mounting part 26. Compared with the conventional manufacturing method of the upper terminal where both the surface portion of the plate 58 and the punched cut surface portion are coated, the cost of the plating process can be suppressed.

  Further, in such a manufacturing method of the upper terminal 22, since the film thickness of the plating layer of the upper terminal 22 becomes uniform by the pre-plating process, the substrate mounting portion 26 (placed on the land 13 on the substrate 12) by soldering, for example. The shape of the solder fillet 72 formed on the substrate mounting portion 26) is formed in an appropriate shape as shown in FIGS. 9 (A) and 9 (B). Therefore, it is possible to ensure a sufficient soldering strength for fixing the board mounting portion 26, more specifically, the upper terminal 22 to the board 12.

  The manufacturing procedure of the upper terminal 22 has been described above. Regarding the manufacturing procedure of the lower terminal 28, when forming the fitting portion 30, the bending direction of the thin plate-like fitting portion 24A is the same as that when the upper terminal 22 is manufactured. Are the same except for changing in the opposite direction and changing the portion of the thin plate-like substrate mounting portion 24A to be crushed to the fitting portion 30 side, and the description thereof is omitted. .

  In the present embodiment, the bending process of the board mounting portion 26A is a subsequent process of the bending process of the thin plate-like fitting portions 24A and 24B, but the present invention is not limited to this. The bending step of the thin plate-like substrate attachment portion 26A may be a pre-process of the bending step of the thin plate-like fitting portions 24A and 24B.

It is a perspective view which shows the outline of the connector terminal which concerns on embodiment of this invention. It is a perspective view which shows the outline of the other connector terminal which concerns on embodiment of this invention. (A) is a rear view of the surface mount connector, and (B) is a side sectional view showing a state in which the surface mount connector is mounted on the substrate. It is a perspective view of the board | plate material to which the pre-plating process was performed previously. It is a perspective view which shows the outline of the workpiece | work punched out from the board | plate material by press work. It is a perspective view which shows the state which performed the bending process to the part corresponding to the fitting part of a connector terminal among workpiece | work. It is a perspective view which shows the state which gave the crushing process to the part corresponding to the board | substrate attachment part of a connector terminal among works. It is a figure which shows the state which gave the bending process to the part corresponding to the board | substrate attachment part of a connector terminal among workpiece | work. (A) is a side view which shows the outline of the solder fillet formed in the board | substrate attachment part of a connector terminal, (B) is sectional drawing along the 9B-9B line of (A).

Explanation of symbols

10 Connector 12 Board 14 Connector body (Connector housing)
22 Upper terminal (connector terminal)
24 Fitting part 26 Board mounting part 28 Lower terminal (connector terminal)
30 Fitting part 32 Board mounting part 58 Metal plate (plate material)
22A Thin plate (work)
22B Thin plate (work)

Claims (4)

Pre-plating is applied to both front and back sides of the plate material,
The workpiece is punched out from the plate material by applying press processing to the plate material after the pre-plating treatment,
Next, bending is performed around a predetermined bending position so that any one plate surface of the workpiece is in close contact with each other, and the plating layer on the other plate surface of the workpiece is bent. Made with the surface layer at the processing site,
A method for producing a press-processed product. In a manufacturing method of a connector terminal provided with a fitting portion that is manufactured by being punched from a plate material, attached to a connector housing, and fitted with a connection terminal of a mating connector,
Pre-plating the front and back sides of the plate material in advance,
By punching the plate material after the pre-plating treatment, the workpiece which is the previous process product of the connector terminal is punched from the plate material,
Next, a part of the plate is bent about a predetermined bending position so that any one of the plate surfaces is in close contact with each other, and the plating layer on the other plate is bent. The fitting part was formed by making it a surface layer in a part,
A manufacturing method of a connector terminal. In a manufacturing method of a connector terminal provided with a board mounting portion that is manufactured by being punched from a plate material, attached to a connector housing mounted on a board, and connected to the board,
Pre-plating the front and back sides of the plate material in advance,
By punching the plate material after the pre-plating treatment, the workpiece which is the previous process product of the connector terminal is punched from the plate material,
Next, a part of the plate is bent about a predetermined bending position so that any one plate surface of the workpiece is in close contact with each other, and the plating layer on the other plate surface is bent. The substrate mounting part was formed by making it a surface layer in a part,
A manufacturing method of a connector terminal. The plating layer of the substrate mounting portion was formed on at least the back surface facing the substrate.
The method of manufacturing a connector terminal according to claim 3.

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