JP2006142809A - In-mold molding apparatus, in-mold molding method, manufacturing method for in-mold molded article and dust collector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the generation of defective products and to transfer mold a highly fine pattern or design efficiently on the outer surface of a molded article by preventing the foil dust of in-mold foil from adhering to a mold. <P>SOLUTION: An in-mold foil supply mechanism 40 for supplying the in-mold foil H between a cavity side mold 32 and a core side mold 34, a core side block 33 for fixing the in-mold foil H by clamping the cavity side mold 32 and the core side mold 34 in a cavity formed at that time, an injection molding machine 35 for integrating the transfer foil F formed in the in-mold foil H and a resin by injecting a molten resin into the cavity, a charger body 51 disposed in the vicinity of the in-mold foil H and electrifying foil dust P by discharging ions, and a planar electrode 55 for adsorbing the foil dust P electrified by the ions, are provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an in-mold molding apparatus, an in-mold molding method, an in-mold molded product manufacturing method, and a molding method for molding a resin part used for a mobile phone, a mobile information terminal device, a notebook personal computer, a household appliance, an automobile part, and the like. The present invention relates to a dust collector for efficiently collecting dust.

  2. Description of the Related Art Conventionally, in-mold molded products are manufactured by performing resin injection molding and simultaneously transferring patterns, characters, and the like onto the surface of molded products using an in-mold foil (for example, Patent Document 1). And 2). In-mold molded products are widely used in mobile phones, notebook personal computers, mobile information terminal devices, home appliances, and automotive parts. The in-mold molded product has an advantage that a high-definition image and design can be transferred and molded on its external surface to form a top coating to form a strong transfer image.

  FIG. 15 is a diagram schematically showing an in-mold molding apparatus 10 for manufacturing such an in-mold molded product. The in-mold molding apparatus 10 includes a cavity-side block 11 fixed to the apparatus, a core-side block 12 that is disposed opposite to the cavity-side block 11 and reciprocates in the horizontal direction in the drawing, and a foil supply that supplies the in-mold foil H Part 13. The cavity side block 11 is provided with a cavity side mold 11a, and the core side block 12 is provided with a core side mold 11b.

  The foil supply unit 13 includes a foil feeder 13 a that supplies the in-mold foil H, and a foil winder 13 b that winds the base film B from which the pattern is peeled off from the in-mold foil H. The in-mold foil H is located near the cavity-side mold 11a, and the distance between the in-mold foil H and the cavity-side mold 11a when the mold is opened is about 2 to 3 mm.

  The in-mold foil H is composed of a base film B and an adhesive layer, a vapor deposition layer and the like laminated on the base film B via a release layer, and the pattern layer is formed in the adhesive layer.

In the in-mold molding apparatus 10 configured as described above, after the in-mold foil H is sandwiched between the cavity-side mold 11a and the core-side mold 11b and the mold is closed, the cavity-side mold 11a and the core-side mold 11b The resin is injected into the cavity formed in step 1 and separated between the bale film of the in-mold foil H and the release layer, and the release layer side is integrally formed with the molded product.
JP 7-329112 A JP 2000-108158 A

  The in-mold molding method described above has the following problems. That is, after molding, fine foil dust P having a size of several microns to several mm may be peeled off from the in-mold foil H. When the foil dust P adheres to the molded product or the cavity side mold 11a and the core side mold 11b, the foil dust P is transferred as a dent during the next molding. Further, when the dent is not noticed and the foil dust P is not wiped off, there is a possibility that defects are continuously produced.

  In particular, the display part of a sub liquid crystal panel of a mobile phone has a high defect rate due to dents because the parts are transparent, and depending on the parts, the yield may be about 50% to 60%, which increases the manufacturing cost. It was with me.

  On the other hand, there has been a demand for an apparatus having a simple configuration that collects fine dust having a size of several microns to several mm dropped on the floor surface.

  Therefore, the present invention prevents the generation of defective products by preventing the in-mold foil dust generated when performing in-mold molding from adhering to the mold, and the appearance of the molded product is highly precise. It is an object of the present invention to provide an in-mold molding apparatus, an in-mold molding method, and an in-mold molded product manufacturing method that can efficiently transfer and pattern a design and a design. Another object of the present invention is to provide a dust collector that can efficiently collect fine dust.

  In order to solve the above problems and achieve the object, the in-mold molding apparatus, the in-mold molding method, the in-mold molded product manufacturing method, and the dust collector of the present invention are configured as follows.

(1) A first mold and a second mold for injection molding, a film supply unit that supplies an in-mold foil between the first mold and the second mold, and the first mold By closing the second mold, a mold closing means for fixing the in-mold foil in the cavity formed at that time, and injecting the molten resin into the cavity, the in-mold A resin supply unit that integrates the transfer foil and resin formed on the foil, and is disposed in the vicinity of at least one of the first mold, the second mold, and the in-mold foil, and releases ions. A charging unit for charging particles and an electrode unit for adsorbing particles charged by the ions are provided.

(2) The in-mold molding apparatus described in (1) above, wherein the charging unit is a glow discharge unit connected to a high-voltage DC power supply unit.

(3) In the in-mold molding apparatus described in (1), the charging unit and the electrode unit are arranged to face each other with the in-mold foil interposed therebetween.

(4) The in-mold molding apparatus according to (3), wherein an insulator is disposed on the charging unit side of the electrode unit.

(5) A film supply step of supplying an in-mold foil between the first mold and the second mold for injection molding, and closing the first mold and the second mold, The mold closing process for fixing the in-mold foil in the cavity formed at that time, and the molten resin in the cavity are injected to integrate the transfer foil and the resin formed on the in-mold foil. And a charging adsorption step for charging the vicinity of the in-mold foil and adsorbing charged particles.

(6) A film supply step of supplying an in-mold foil between the first mold and the second mold for injection molding, and closing the first mold and the second mold, A mold closing process for fixing the in-mold foil in the cavity formed at that time, and an in-mold molded product was molded by injecting molten resin into the cavity, and the in-mold foil was formed The method includes a resin supply step for integrating the transfer foil with the in-mold molded product, and a charging adsorption step for charging the vicinity of the in-mold foil and adsorbing charged particles.

(7) A charging unit that discharges ions to charge particles and an electrode unit that adsorbs particles charged by the ions are provided.

  According to the present invention, it is possible to prevent the occurrence of defective products by preventing the in-mold foil dust generated when performing in-mold molding from adhering to the mold, and to improve the appearance of the molded product. It is possible to efficiently transfer and mold various designs and designs. Moreover, it becomes possible to collect fine dust efficiently.

  FIG. 1 is a front view showing an in-mold molding apparatus 20 according to the first embodiment of the present invention, FIG. 2 is a schematic view showing a main part of the in-mold molding apparatus 20, and FIG. FIG. 4 and FIG. 5 are sectional views of the in-mold foil taken along the line XX of FIG. 3 and viewed in the direction of the arrows, and FIG. 6 shows the operating principle of the in-mold molding apparatus 20. FIG. 7 to FIG. 9 are sectional views showing an injection molding process by the in-mold molding apparatus 20. In these drawings, H represents an in-mold foil, B represents a base film, F represents a transfer foil, and P represents foil dust.

  The in-mold molding apparatus 20 includes a gantry 21 placed on the floor, an injection molding mechanism 30 provided on the gantry 21, an in-mold foil supply mechanism 40 that supplies the in-mold foil H, an in-mold And a charging device 50 for charging the foil H.

  The injection molding mechanism 30 is disposed opposite to the cavity side block 31 fixed to the gantry 21, the cavity side mold (first mold) 32 provided in the cavity side block 31, and the cavity side block 31 in the drawing. A core-side block 33 that reciprocates in the left-right direction, a core-side mold (second mold) 34 that is provided in the core-side block 33 and is combined with the cavity-side mold 32, and the cavity-side mold 32 and the core side An injection molding machine (resin supply unit) 35 for injecting molten resin into a cavity formed between the mold 34 and a resin supply unit 36 for supplying resin to the injection molding machine 35 is provided. . The core side block 33 has a function of closing the cavity side mold 32 and the core side mold 34 by moving to the cavity side block 31 side.

  The periphery of the cavity side mold 32 and the core side mold 34 is shielded by a pair of upper shielding plates 37a and 37b and a pair of lower shielding plates 38a and 38b. The pair of upper shielding plates 37a and 37b and the pair of lower shielding plates 38a and 38b do not come into contact with the cavity side block 31 and the core side block 33 when the cavity side mold 32 and the core side mold 34 are opened and closed. Has been placed.

  The in-mold foil supply mechanism 40 includes a foil feeder 41 that supplies the in-mold foil H, and a foil winder 42 that winds the base film B from which the transfer foil F has been peeled from the in-mold foil H. The in-mold foil H is located near the cavity-side mold 32, and the distance between the in-mold foil H and the cavity-side mold 32 when the mold is opened is about 2 to 3 mm.

  The charger 50 includes a bottomed cylindrical charger main body 51, a tungsten wire 52 disposed inside the charger main body 51, a high-voltage DC power source 53 connected to one end of the tungsten wire 52, and a tungsten wire. 52, a ground wire 54 connected to the other end of the battery 52, a flat plate electrode 55 disposed opposite to the charger body 51 with the in-mold foil H interposed therebetween, a ground wire 56 connected to the flat plate electrode 55, and a flat plate electrode 55 And a thin plate-like insulator 57 disposed close to the charger main body 51 side. The insulator 57 is made of a resin material or paper.

  The in-mold foil H is formed to a thickness of about 40 μm to 50 μm. As shown in FIG. 3, the in-film foil H has a base film B made of PET resin and a transfer arranged at regular intervals in the winding direction of the base film B. Foil F is provided. The base film B is formed with a vertical detection mark Ba and a horizontal detection mark Bb for detecting the position of the in-mold foil H, and a pattern portion E to be described later is a predetermined position of the cavity side mold 32. It is comprised so that it can position to.

  As shown in FIG. 4, the transfer foil F is laminated from the base film B side with a release layer K for facilitating peeling after molding and an adhesive layer S bonded to the molded product. A pattern layer E is formed on the surface.

  As shown in FIG. 5, the release layer K, the vapor deposition primer layer J, and the adhesive layer S are laminated from the base film B side, and the pattern layer E is inside the vapor deposition primer layer J, and the vapor deposition layer T is inside the adhesive layer S. The formed transfer foil F can also be used.

  In the in-mold molding apparatus 20 configured as described above, an in-mold molded product R, for example, an exterior casing of a mobile phone is molded as follows.

  First, the in-mold foil H is fed from the foil feeder 41 between the cavity side mold 32 and the core side mold 34, and based on the vertical detection mark Ba and the horizontal detection mark Bb, as shown in FIG. The side mold 32 is positioned and fixed at a predetermined position.

  Next, as shown in FIG. 8, the cavity side mold 32 and the core side mold 34 are closed, and the molten resin Q is injected by an injection molding machine. Next, as shown in FIG. 9, the cavity-side mold 32 and the core-side mold 34 are opened and taken out of the molded product R to which the transfer foil F has been transferred and cooled and solidified. At this time, fine foil dust P having a size of several microns to several mm is peeled off from the transfer foil F and scattered around the cavity side mold 32 and the core side mold 34.

  On the other hand, as shown in FIGS. 2 and 6, in the charger 50, a high voltage of −11 kV is applied to the tungsten wire 52. In addition, although it is effective with charging of -11 kV or less and 11 kV or more (absolute value 11 kV or more), there may be an effect even when the absolute value is 11 kV or less. Negative ions M released around the tungsten wire 52 by the glow discharge V negatively charge the in-mold foil H and the surrounding area. At this time, the foil dust P scattered around is also negatively charged, and since the insulator 57 is formed on the surface 55a side of the flat plate electrode 55, the back surface 55b which is positive due to the potential difference of the flat plate electrode 55 is formed. It goes around and adsorbs dust. Since the insulator 57 is provided, it is possible to prevent the in-mold foil H from being charged and adsorbed to the surface 55a of the flat plate electrode 55 and stopping the winding of the base film B.

  According to the in-mold molding apparatus 20 according to the first embodiment, since the foil dust P is collected by the charger 50, the foil dust P adheres to the cavity side mold 32 and the core side mold 34. It is possible to minimize the occurrence of defective products. For this reason, it became possible to manufacture the in-mold molded product R with a high yield. Therefore, high-quality products can be obtained for mobile phones, mobile information terminal devices, and notebook personal computers, and manufacturing at low cost is possible.

  In the above-described embodiment, an example of in-mold molding of a resin casing of a mobile phone has been described. However, a notebook personal computer, a mobile phone, a mobile information terminal device product, a home appliance, an automobile part material, etc. Any part of the product is possible.

  FIG. 10 is a perspective view schematically showing an in-mold forming apparatus 60 according to the second embodiment of the present invention. 10, the same functional parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the in-mold molding apparatus 20 according to the first embodiment described above, the charger 50 is provided only on the foil winder 42 side when viewed from the cavity side mold 32 and the core side mold 34. In the in-mold molding apparatus 60 according to the embodiment, it is also provided on the foil feeder 41 side and also on the cavity side mold 32 and the core side mold 34. The charger main body 51 and the plate electrode 55 are installed at symmetrical positions.

  In the in-mold molding apparatus 60 configured as described above, the same effect as that of the above-described in-mold molding apparatus 20 can be obtained.

  FIG. 11 is a perspective view schematically showing an in-mold molding apparatus 70 according to the third embodiment of the present invention. 11, the same reference numerals are given to the same functional parts as those in FIGS. 2 and 10, and the detailed description thereof will be omitted.

  In the in-mold molding apparatus 20 according to the first embodiment and the in-mold molding apparatus 60 according to the second embodiment, the in-mold foil supply mechanism 40 is arranged only in the vertical direction. In the in-mold molding apparatus 70 according to the embodiment, one set of the in-mold foil supply mechanism 40 is arranged in the vertical direction and the horizontal direction. Therefore, the in-mold molding apparatus 70 can perform composite in-mold molding in which the in-mold foil H is arranged in a vertical type and a horizontal type.

  The charging machine 50 is provided on the side of the foil feeder 41 and the foil winder 42 with respect to positions corresponding to the cavity side mold 32 and the core side mold 34 in each in-mold foil supply mechanism 40, respectively. Four units are arranged. The charger main body 51 and the plate electrode 55 are installed at symmetrical positions.

  In the in-mold molding apparatus 70 configured as described above, the same effect as that of the above-described in-mold molding apparatus 20 can be obtained.

  FIG. 12 is a view schematically showing an in-mold forming apparatus 80 according to the fourth embodiment of the present invention. 12, the same functional parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The foil feeder 41 was surrounded by a dustproof cover 81. By exhausting the dust-proof cover 81, the foil dust P that has entered the dust-proof cover 81 can be eliminated.

  In the in-mold molding apparatus 80 configured as described above, the same effect as that of the above-described in-mold molding apparatus 20 can be obtained.

  FIG. 13 is a perspective view showing a dust collecting apparatus 200 according to the fifth embodiment of the present invention, and FIG. 14 is an explanatory view showing an operation principle of the dust collecting apparatus 200.

  The dust collector 200 includes an arm 201 and a shoulder band 202, and a discharge dust collector 210 is provided on the distal end side of the arm 201, and a power supply unit 220 is provided on the proximal end side.

  As shown in FIG. 14, the discharge dust collecting section 210 is provided with a charging guide 211 and a bottomed cylindrical charger main body 212 held by the charging guide 211. A charging electrode 213 is provided inside the charger main body 212. A metal electrode 215 held by an electrode guide 214 is provided at a position opposite to the charger main body 212.

  The power supply unit 220 is housed in the housing 221, an 11 kV high voltage power supply 222 having a negative electrode connected to the charging electrode 213, and a positive electrode connected to the metal electrode 215, and a 24 V DC power supply 223. And a grounded 100V plug 224 connected to the DC power source 223. The metal electrode 215 is grounded by a grounded 100V plug 224. In FIG. 14, 225 indicates a ground wire. In addition, although it is effective with charging of -11 kV or less and 11 kV or more (absolute value 11 kV or more), there may be an effect even when the absolute value is 11 kV or less.

  According to the dust collector 200 configured as described above, the negative ions M emitted from the charger main body 212 negatively charge the particles P on the object surface or in the air, and collect them on the metal electrode 215 due to a potential difference. Dusted. In addition, since the dust collector 200 is portable, it can be charged and collected on the metal electrode 214 while moving various kinds of dust at any place like a vacuum cleaner.

  As described above, according to the dust collecting apparatus 200 according to the fifth embodiment, various kinds of particles can be easily and reliably collected.

  In addition to the above-described embodiment, even if the molding method, the material of the charging device, the structure, the voltage value, the current value, the distance, the dimension, and the like are different, the same effect is included in the present invention. In this embodiment, negative charging is used, but the same applies to positive charging and AC charging. In addition, although it is effective with charging of -11 kV or less and 11 kV or more (absolute value 11 kV or more), there may be an effect even when the absolute value is 11 kV or less.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the components without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

The front view which shows the in-mold shaping | molding apparatus which concerns on the 1st Embodiment of this invention. The schematic diagram which shows the principal part of the same in-mold shaping | molding apparatus. The front view which shows the in-mold foil used for the same in-mold shaping | molding apparatus. Sectional drawing which shows the example which cut | disconnected the in-mold foil by the XX line of FIG. 3, and looked at the arrow direction. Sectional drawing which shows another example which cut | disconnected the in-mold foil by the XX line of FIG. 3, and looked at the arrow direction. Explanatory drawing which shows the operating principle of the in-mold molding apparatus. Sectional drawing which shows the injection molding process by the in-mold molding apparatus. Sectional drawing which shows the injection molding process by the in-mold molding apparatus. Sectional drawing which shows the injection molding process by the in-mold molding apparatus. The perspective view which shows the in-mold shaping | molding apparatus which concerns on the 2nd Embodiment of this invention. The perspective view which shows the in-mold shaping | molding apparatus which concerns on the 3rd Embodiment of this invention. The schematic diagram which shows the in-mold shaping | molding apparatus which concerns on the 4th Embodiment of this invention. The perspective view which shows the dust collector which concerns on the 5th Embodiment of this invention. Explanatory drawing which shows the operation principle of the dust collector. The schematic diagram which shows an example of a general in-mold shaping | molding apparatus.

Explanation of symbols

  20, 60, 70, 80 ... In-mold molding device, 30 ... Injection molding mechanism, 32 ... Cavity side mold (first mold), 34 ... Core side mold (second mold), 35 ... Injection molding machine (Resin supply part), 40 ... in-mold foil supply mechanism, 50 ... charger, 51 ... charger main body, 53 ... high voltage DC power supply, 55 ... flat plate electrode (electrode part), 57 ... insulator, 200 ... dust collector , 210... Discharge dust collecting section, 212... Charger body, 213... Charging electrode, 215 .. metal electrode, 222.

Claims (7)

A first mold and a second mold for injection molding;
A film supply section for supplying an in-mold foil between the first mold and the second mold;
Mold closing means for fixing the in-mold foil in a cavity formed by closing the first mold and the second mold;
A resin supply unit that unifies the transfer foil and resin formed on the in-mold foil by injecting molten resin into the cavity;
A charging unit that is disposed in the vicinity of at least one of the first mold, the second mold, and the in-mold foil, and discharges ions to charge particles;
An in-mold molding apparatus comprising: an electrode portion that adsorbs particles charged by the ions.   The in-mold molding apparatus according to claim 1, wherein the charging unit is a glow discharge unit connected to a high-voltage DC power source unit.   The in-mold molding apparatus according to claim 1, wherein the charging unit and the electrode unit are disposed to face each other with the in-mold foil interposed therebetween.   The in-mold molding apparatus according to claim 3, wherein an insulator is disposed on the charging unit side of the electrode unit. A film supply step of supplying an in-mold foil between the first mold and the second mold for injection molding;
A mold closing step of fixing the in-mold foil in a cavity formed by closing the first mold and the second mold,
A resin supplying step of integrating the transfer foil and the resin formed on the in-mold foil by injecting the molten resin into the cavity;
An in-mold molding method comprising: a charging adsorption step for charging the vicinity of the in-mold foil and adsorbing charged particles. A film supply step of supplying an in-mold foil between the first mold and the second mold for injection molding;
A mold closing step of fixing the in-mold foil in a cavity formed by closing the first mold and the second mold,
A resin supply step of forming an in-mold molded product by injecting molten resin into the cavity, and integrating the transfer foil formed on the in-mold foil with the in-mold molded product,
A method for producing an in-mold molded product, comprising: a step of charging the vicinity of the in-mold foil and a step of charging and sucking charged particles. A charging unit that discharges ions to charge particles;
A dust collector, comprising: an electrode portion that adsorbs particles charged by the ions.

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