JP2006137786A5 - - Google Patents

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Publication number
JP2006137786A5
JP2006137786A5 JP2004326088A JP2004326088A JP2006137786A5 JP 2006137786 A5 JP2006137786 A5 JP 2006137786A5 JP 2004326088 A JP2004326088 A JP 2004326088A JP 2004326088 A JP2004326088 A JP 2004326088A JP 2006137786 A5 JP2006137786 A5 JP 2006137786A5
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Japan
Prior art keywords
copolymers
liquid crystal
raw material
mentioned
structural units
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JP2004326088A
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Japanese (ja)
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JP2006137786A (en
JP4381961B2 (en
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Priority to JP2004326088A priority Critical patent/JP4381961B2/en
Priority claimed from JP2004326088A external-priority patent/JP4381961B2/en
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Publication of JP2006137786A5 publication Critical patent/JP2006137786A5/ja
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Description

これらの原料化合物から得られる熱可塑性液晶ポリマーの代表例として表５に示す構造単位を有する共重合体（ａ）〜（ｅ）を挙げることができる。

Figure 2006137786
As representative examples of the thermoplastic liquid crystal polymer obtained from these raw material compounds, copolymers (a) to (e) having the structural units shown in Table 5 can be mentioned.
Figure 2006137786

JP2004326088A 2004-11-10 2004-11-10 Circuit board manufacturing method using thermoplastic liquid crystal polymer film Active JP4381961B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004326088A JP4381961B2 (en) 2004-11-10 2004-11-10 Circuit board manufacturing method using thermoplastic liquid crystal polymer film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004326088A JP4381961B2 (en) 2004-11-10 2004-11-10 Circuit board manufacturing method using thermoplastic liquid crystal polymer film

Publications (3)

Publication Number Publication Date
JP2006137786A JP2006137786A (en) 2006-06-01
JP2006137786A5 true JP2006137786A5 (en) 2007-10-04
JP4381961B2 JP4381961B2 (en) 2009-12-09

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ID=36618803

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JP2004326088A Active JP4381961B2 (en) 2004-11-10 2004-11-10 Circuit board manufacturing method using thermoplastic liquid crystal polymer film

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JP (1) JP4381961B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7024142B2 (en) 2019-04-23 2022-02-22 株式会社クラレ Thermoplastic liquid crystal polymer films, laminates, and molded bodies, and methods for manufacturing them.
JP7024143B2 (en) 2019-04-23 2022-02-22 株式会社クラレ Thermoplastic liquid crystal polymer films, laminates, and molded bodies, and methods for manufacturing them.
JP7024141B2 (en) 2019-04-23 2022-02-22 株式会社クラレ Thermoplastic liquid crystal polymer films, laminates, and molded bodies, and methods for manufacturing them.

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008150525A (en) * 2006-12-19 2008-07-03 Polymatech Co Ltd Heat conductive polymer molding and method for producing the same
KR20090108834A (en) * 2008-04-14 2009-10-19 삼성전기주식회사 Method of manufacturing insulating sheet and laminated plate clad with metal foil and printed circuit board and printed circuit board thereof using the same
JP5308295B2 (en) * 2009-09-28 2013-10-09 株式会社クラレ Thermoplastic liquid crystal polymer film for transmission line and transmission line
KR102161929B1 (en) * 2011-10-31 2020-10-05 주식회사 쿠라레 Thermoplastic liquid crystal polymer film, and laminate and circuit board using same
JPWO2013146174A1 (en) * 2012-03-29 2015-12-10 株式会社クラレ Thermoplastic liquid crystal polymer film and method for producing the same
JP5876818B2 (en) * 2012-03-30 2016-03-02 モレックス エルエルシー Connector with sheet
JP2015034282A (en) * 2013-08-08 2015-02-19 サムソン エレクトロ−メカニックス カンパニーリミテッド． Composite material for circuit board production, and circuit board ingredient material produced using the same
CN107501573B (en) * 2017-08-02 2021-01-22 中山大学 Amorphous polymer with low dielectric constant and preparation method and application thereof
JP7116546B2 (en) * 2017-12-27 2022-08-10 Ｅｎｅｏｓ株式会社 metal foil clad laminate
CN112292421B (en) * 2018-06-26 2023-11-17 引能仕株式会社 Resin molded article and electric/electronic component comprising wholly aromatic liquid crystalline polyester resin capable of reducing dielectric loss tangent by heat treatment
CN112969585A (en) * 2018-11-08 2021-06-15 株式会社可乐丽 Thermoplastic liquid crystal polymer film and circuit substrate using the same
CN113248915A (en) * 2021-05-26 2021-08-13 宁夏清研高分子新材料有限公司 Low-dielectric-constant liquid crystal composite material and preparation method thereof
CN113480868B (en) * 2021-06-29 2022-10-04 宁波长阳科技股份有限公司 Liquid crystal polymer film and preparation method thereof
TW202344396A (en) * 2022-02-28 2023-11-16 日商富士軟片股份有限公司 Laminate, wiring board, and method for manufacturing wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7024142B2 (en) 2019-04-23 2022-02-22 株式会社クラレ Thermoplastic liquid crystal polymer films, laminates, and molded bodies, and methods for manufacturing them.
JP7024143B2 (en) 2019-04-23 2022-02-22 株式会社クラレ Thermoplastic liquid crystal polymer films, laminates, and molded bodies, and methods for manufacturing them.
JP7024141B2 (en) 2019-04-23 2022-02-22 株式会社クラレ Thermoplastic liquid crystal polymer films, laminates, and molded bodies, and methods for manufacturing them.

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