JP2006135122A - Method for manufacturing laminated electronic component, and coating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the occurrence of short-circuiting failure by preventing a sheet attack phenomenon from occurring when manufacturing a laminated electronic component and the transfer of a solvent between green sheets. <P>SOLUTION: There are provided: steps S2, S3 for forming the green sheet by applying mixed dielectric paste containing a first resin and a second one that can be polymerizable to the first one on a support and by polymerizing the first and second resins; and a step S4 for forming an electrode pattern layer on the surface of the green sheet. In this case, although the step for forming the electrode pattern layer becomes a so-called Wet-on-Dry system, the green sheet has already been cured by two-pack polymerization when the electrode pattern layer is formed, thus preventing the sheet attack phenomenon from occurring. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer electronic component such as a multilayer ceramic capacitor, and more particularly to a method for manufacturing a multilayer electronic component capable of obtaining a high yield. The present invention also relates to a coating apparatus, and more particularly to a coating apparatus suitable for forming a dielectric layer included in a multilayer electronic component.

  Conventionally, the following methods are known as methods for producing multilayer electronic components such as capacitors, piezoelectric elements, PTC thermistors, NTC thermistors, and varistors. That is, a green sheet is formed by first applying a ceramic coating containing ceramic powder, organic binder, plasticizer, solvent, etc. in a sheet form on a flexible support made of PET film or the like using a doctor blade method or the like. To do. Next, after the green sheet is dried to some extent, a paste containing an electrode material such as palladium, silver, or nickel is printed on the green sheet to form an electrode pattern layer.

  Then, the green sheet on which the electrode pattern layer is formed is peeled from the support, and a plurality of the green sheets are laminated, then pressed and cut to take out the ceramic green chip. After burning out the binder in the ceramic green chip thus obtained and firing at a temperature of 1000 ° C. to 1400 ° C., a terminal made of silver, silver-palladium, nickel, copper or the like is obtained on the obtained fired body. When the electrodes are formed, a ceramic multilayer electronic component is completed.

  However, since the process of forming the electrode pattern layer on the dried green sheet is a so-called wet-on-dry method, a phenomenon that the solvent contained in the electrode pattern layer erodes the green sheet occurs. Such a phenomenon is called a “sheet attack phenomenon”. When this phenomenon occurs, the thickness of the green sheet decreases at the portion where the electrode pattern layer is formed. At this time, if the thickness of the green sheet is sufficient, the sheet attack phenomenon will not be a big problem, but the thickness of the green sheet is set to be very thin, for example, 3 μm or less for the purpose of downsizing the multilayer electronic component. However, there is a problem that a short circuit defect easily occurs due to a sheet attack phenomenon.

In addition, when the thickness of the green sheet is reduced, the operation of peeling the green sheet from the support becomes difficult, and the lamination yield becomes very poor. In order to solve this problem, the step of forming the green sheet and the step of forming the electrode pattern layer on the green sheet are alternately performed a plurality of times and then peeled. According to this, since the total thickness of a laminated body increases, peeling from a support body becomes easy (refer patent document 1). However, in this case, the solvent may move between the green sheet located in the upper layer and the green sheet located in the lower layer. If the film thickness of the green sheet becomes non-uniform due to this, a pinhole is generated. There has been a problem that short circuit defects are likely to occur.
Japanese Patent No. 3190177

  As described above, in the conventional manufacturing method, when the thickness of the green sheet is small, particularly when the thickness is 3 μm or less, the laminated type produced by the sheet attack phenomenon due to the electrode pattern layer or the movement of the solvent between the green sheets. There has been a problem that short-circuit defects are likely to occur in electronic components.

  Therefore, the present invention effectively suppresses the occurrence of a short circuit defect by preventing the sheet attack phenomenon and the movement of the solvent between the green sheets, and thereby the multilayer electronic component capable of obtaining a high yield. An object is to provide a manufacturing method.

  Another object of the present invention is to provide a coating apparatus suitable for carrying out such a method for manufacturing a multilayer electronic component.

  In the method for manufacturing a multilayer electronic component according to the present invention, a mixed dielectric paste containing a first resin and a second resin polymerizable with the first resin is applied onto a support, The method includes a first step of forming a green sheet by polymerizing the second resin, and a second step of forming an electrode pattern layer on the surface of the green sheet.

  According to the present invention, the second step of forming the electrode pattern layer is a so-called wet-on-dry method, but at the time of forming the electrode pattern layer, the green sheet is already cured by two-liquid polymerization. Therefore, the sheet attack phenomenon does not occur. For this reason, the thickness of the dielectric layer after firing can be set to a very thin thickness of 1 μm or less.

  The first step is a first sub-step of preparing a mixed dielectric paste by mixing a first dielectric paste containing a first resin and a second dielectric paste containing a second resin; It is preferable to include a second sub-step of applying the mixed dielectric paste onto the support before the mixed dielectric paste is cured by polymerization of the first resin and the second resin. In this case, it is preferable that both the first and second dielectric pastes contain ceramic powder. According to this, since the green sheet becomes a ceramic green sheet, a multilayer ceramic electronic component such as a multilayer ceramic capacitor can be manufactured.

  The method for manufacturing a multilayer electronic component according to the present invention includes a third step in which the first step and the second step are alternately performed a plurality of times, and then the obtained multilayer body is peeled from the support, and the multilayer body. It is preferable that the method further includes a fourth step of superimposing a plurality of. According to this, even when the thickness of the green sheet or the electrode pattern layer is very thin, the total thickness of the laminated body increases, so that the peeling from the support can be easily performed. In this case, it is assumed that adjacent green sheets are in direct contact with each other. However, since these are cured by two-component polymerization, the solvent does not move between adjacent green sheets. For this reason, it is possible to reduce problems such as non-uniform thickness of the green sheet and occurrence of pinholes.

  In the present invention, it is preferable to set the thickness of the green sheet formed in the first step performed for the first time to be thinner than the thickness of the green sheet formed in the first step performed for the second time and thereafter. According to this, when a plurality of stacked bodies are overlapped, the distance between adjacent electrode pattern layers can be made substantially constant.

  Further, after the first step and the second step are alternately performed a plurality of times, and before the third step is performed, a cover sheet made of a dielectric paste is formed on the surface of the electrode pattern layer positioned at the uppermost layer. It is preferable. The dielectric paste that is the material of the cover sheet preferably contains a first resin, a second resin, or a thermoplastic resin. According to this, when a plurality of laminated bodies are overlapped, it becomes possible to maintain the adhesion between the laminated bodies. In this case, it is preferable to set the thickness of the cover sheet to be thinner than the thickness of the green sheet formed in the first step performed after the second time. In particular, the thickness of the green sheet formed in the first step performed after the second time is set to be approximately equal to the sum of the thickness of the green sheet formed in the first step performed in the first time and the thickness of the cover sheet. In this case, the distance between adjacent electrode pattern layers is substantially constant.

  In the present invention, it is preferable that the green chip is fired after the green chip is formed by cutting the plurality of laminated bodies that are overlapped. According to this, it becomes possible to produce a multilayer ceramic electronic component such as a multilayer ceramic capacitor.

  In the present invention, it is preferable to form a step absorption pattern layer made of a dielectric paste in a region where the electrode pattern layer is not formed on the surface of the green sheet formed in the first step. According to this, when the green sheet is formed on the electrode pattern layer, the level difference to be absorbed by the green sheet becomes very small, so that the chip shape after lamination can be improved.

  The coating apparatus according to the present invention includes a first storage part that stores a first dielectric paste containing a first resin, and a second dielectric paste that contains a second resin that can be polymerized with the first resin. A second storage section for storing the mixture, a mixing section for preparing the mixed dielectric paste by mixing the first dielectric paste and the second dielectric paste, and the mixed dielectric paste on the support And the mixing unit applies the mixed dielectric paste while continuously receiving the first and second dielectric pastes from the first and second storage units, respectively. It is comprised so that supply to the said application part is possible continuously.

  According to the present invention, since the mixed dielectric paste contains two resins that are polymerized in two liquids, it can be applied before curing due to the progress of the two liquid polymerization. It is possible to perform continuous application while preventing clogging and the like. In addition, after the application, the mixed dielectric paste is cured by the progress of the two-component polymerization, so that even if the electrode pattern layer is formed on the surface, the sheet attack phenomenon does not occur.

  The mixing unit may include a stirring unit that stirs the first dielectric paste supplied from the first storage unit and the second dielectric paste supplied from the second storage unit. preferable. According to this, the first dielectric paste and the second dielectric paste are sufficiently stirred, and a uniform mixed dielectric paste can be prepared.

  As described above, according to the method for manufacturing a multilayer electronic component according to the present invention, since the so-called sheet attack phenomenon does not occur when the electrode pattern layer is formed, the thickness of the green sheet is very thin, particularly 3 μm or less. Even if it is set, the occurrence of short circuit failure can be effectively suppressed. Further, even in the case where the adjacent green sheets are in direct contact, the movement of the solvent does not occur, so the film thickness of the green sheet becomes non-uniform due to the movement of the solvent, or pinholes are generated. It is possible to reduce defects.

  Thus, according to the present invention, it is possible to obtain a high yield in the manufacture of a small and high performance multilayer electronic component.

  Further, if the coating apparatus according to the present invention is used, the above-described method for manufacturing a multilayer electronic component can be easily performed.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic cross-sectional view showing the structure of an example (multilayer ceramic capacitor) of a multilayer electronic component manufactured by a method according to a preferred embodiment of the present invention.

  A multilayer ceramic capacitor 2 shown in FIG. 1 is formed on a capacitor body 4, a first terminal electrode 6 formed on one end 4 a of the capacitor body 4, and the other end 4 b of the capacitor body 4. The second terminal electrode 8 is provided. The capacitor body 4 includes dielectric layers 10 and internal electrode layers 12 that are alternately stacked, and a step absorption layer 24 provided in the same layer as the internal electrode layers 12. The first terminal electrode 6 and the second terminal electrode 8 are alternately connected.

  The material of the dielectric layer 10 and the step absorption layer 24 is not particularly limited, and for example, a ceramic dielectric material such as calcium titanate, strontium titanate and / or barium titanate can be used. The thickness of each dielectric layer 10 is generally set to several μm to several hundred μm. However, if the method according to the present embodiment is used, the thickness of each dielectric layer 10 is suppressed while suppressing the occurrence of short-circuit defects. The thickness can be reduced to 1 μm or less, which makes it possible to simultaneously realize a reduction in size and an increase in capacity.

  The material of the internal electrode layer 12 is not particularly limited, but copper, copper alloy, nickel, nickel alloy, silver, silver-palladium alloy, or the like can be used. The thicknesses of the internal electrode layer 12 and the step absorption layer 24 are also usually about 10 to 50 μm. However, in order to achieve miniaturization and large capacity, It is preferable to set the following.

  The material of the first terminal electrode 6 and the second terminal electrode 8 is not particularly limited, and usually copper, copper alloy, nickel, nickel alloy, or the like is used, but silver, an alloy of silver and palladium, or the like is also used. be able to.

  The shape and size of the multilayer ceramic capacitor 2 may be appropriately determined according to the purpose and application. When the multilayer ceramic capacitor 2 has a rectangular parallelepiped shape, the length is usually 0.6 to 5.6 mm, the width is 0.3 to 5.0 mm, and the height is about 0.1 to 1.9 mm, preferably The length is 0.6 to 3.2 mm, the width is 0.3 to 1.6 mm, and the height is 0.3 to 1.6 mm.

  FIG. 2 is a flowchart for explaining a method of manufacturing a multilayer electronic component according to a preferred embodiment of the present invention. Hereinafter, a method for manufacturing a multilayer electronic component according to a preferred embodiment of the present invention will be described with reference to the flowchart shown in FIG.

  First, a support (carrier sheet) is prepared (step S1). The support preferably has flexibility, and for example, a PET film can be used. Moreover, in order to improve the peelability of the green sheet formed on the support, it is particularly preferable to coat the surface of the support with a silicone resin or the like. It does not specifically limit about the thickness of a support body, What is necessary is just to set to 5-100 micrometers.

  Next, as shown in FIG. 3, the green sheet 10a is formed on the surface of the support 20 by using a nozzle coating method, a doctor blade method, or the like (step S2). The green sheet 10a is a layer that finally becomes the dielectric layer 10 shown in FIG. As a material of the green sheet 10a, from a combination of a first dielectric paste containing one resin (first resin) selected from a combination of resins capable of two-component polymerization and a resin capable of two-component polymerization. A “mixed dielectric paste” obtained by mixing a second dielectric paste containing the other selected resin (second resin) is used.

  As the first dielectric paste and the second dielectric paste, it is preferable to use an organic solvent-based dielectric paste obtained by kneading a dielectric material and an organic vehicle.

  Dielectric raw materials include various compounds that become complex oxides and oxides, such as ceramic materials such as carbonates, nitrates, hydroxides, and organometallic compounds (more specifically, calcium titanate, strontium titanate, titanium) Barium acid etc.) can be appropriately selected and used by mixing. The dielectric material is usually used as a powder (ceramic powder) having an average particle size of 0.3 μm or less, preferably 0.2 μm or less. In order to form a very thin green sheet, it is desirable to use ceramic powder finer than the thickness of the green sheet 10a.

  An organic vehicle is obtained by dissolving a binder resin in an organic solvent. As the binder resin used in the organic vehicle, as described above, one resin selected from a combination of resins capable of two-liquid polymerization is used for the first dielectric paste, and the second dielectric paste is used. The other resin selected from a combination of resins capable of two-component polymerization is used. As a combination of resins capable of two-component polymerization, a combination of polyvinyl butyral resin and isocyanate resin, a combination of polyvinyl butyral resin and polyurethane resin, a combination of polyvinyl butyral resin and phenolic resin, polyvinyl butyral resin and Examples include combinations of epoxy resins, combinations of polyvinyl butyral resins and melamine resins, combinations of polyvinyl butyral resins and dialdehyde resins, and the like.

  The organic solvent used in the organic vehicle is not particularly limited as long as it dissolves the binder resin described above. Terpineol, alcohol, butyl carbitol, acetone, methyl ethyl ketone (MEK), toluene, xylene, ethyl acetate, butyl stearate An organic solvent such as isobornyl acetate can be used. The content of each component in the dielectric paste is not particularly limited, and may be a normal content, for example, about 5 to 10% by mass for the binder resin and about 10 to 50% by mass for the organic solvent.

  The dielectric paste may contain additives selected from various dispersants, plasticizers, dielectrics, glass frit, insulators, charging aids, and the like as necessary. However, the total content of these is desirably 10% by mass or less. Examples of the plasticizer include phthalate esters such as dioctyl phthalate and benzylbutyl phthalate, adipic acid, phosphate esters, glycols, and the like.

  Such a mixed dielectric paste obtained by mixing the first dielectric paste and the second dielectric paste is formed as soon as possible immediately before application so as not to be cured by two-liquid polymerization at a stage before application. It is preferable to mix the dielectric paste and the second dielectric paste.

  FIG. 4 is a schematic configuration diagram of a coating apparatus suitable for coating the above-described mixed dielectric paste.

  The coating apparatus 50 shown in FIG. 4 includes a first storage unit 52 that stores the first dielectric paste 52a, a second storage unit 54 that stores the second dielectric paste 54a, and a first dielectric. A mixing unit 56 for preparing the mixed dielectric paste 56a by mixing the paste 52a and the second dielectric paste 54a, and a coating head (application unit) 58 for applying the mixed dielectric paste 56a on the support 20 are provided. I have. The mixing unit 56 is provided with a stirring means 60, whereby the first dielectric paste 52 a supplied from the first storage unit 52 and the second dielectric supplied from the second storage unit 54. The body paste 54a is sufficiently agitated so that a uniform mixed dielectric paste can be prepared.

  The first dielectric paste 52a and the second dielectric paste 54a are continuously supplied to the mixing unit 56 from the first storage unit 52 and the second storage unit 54, respectively. For this reason, in the mixing part 56, the 1st and 2nd resin in which 2 liquid polymerization is possible is mixed immediately, and 2 liquid polymerization starts. However, since the mixing unit 56 continuously supplies the mixed dielectric paste 56a to the coating head 58, the mixed dielectric paste 56a does not harden in the mixing unit 56 and the coating head 58, and can flow sufficiently. It is applied onto the support 20 while maintaining the properties.

  Therefore, when such a coating apparatus 50 is used, the mixed dielectric paste is not cured by the progress of two-liquid polymerization before coating, and it is possible to perform coating while maintaining fluidity.

  After the mixed dielectric paste is applied onto the support 20 in this way, after a while, the binder resin (first resin) contained in the first dielectric paste and the second dielectric paste are contained. The two-component polymerization of the binder resin (second resin) that has been progressed proceeds, and as a result, the green sheet 10a is cured (step S3). When the two-component polymerization proceeds, a two-component polymerization process by drying of the green sheet or heating may be performed as necessary.

  Although not particularly limited, the amount of the binder resin contained in the first dielectric paste 52a and the amount of the binder resin contained in the second dielectric paste 54a are almost all obtained by two-component polymerization. It is preferable to set the amount to be consumed. With this setting, almost no uncured binder resin remains after the two-component polymerization.

  After the green sheet 10a is cured, as shown in FIG. 5, an electrode pattern layer 12a having a predetermined pattern is formed on the surface of the green sheet 10a formed on the support 20 (step S4). The electrode pattern layer 12 a finally becomes the internal electrode layer 12. The thickness (thickness after drying) of the electrode pattern layer 12a is not particularly limited, but is preferably set to be approximately the same as or less than the thickness t0 of the green sheet 10a. For the formation of the electrode pattern layer 12a, for example, a thick film forming method such as a printing method using an electrode paste or a thin film method such as vapor deposition or sputtering can be used.

  When a screen printing method or a gravure printing method, which is a kind of thick film method, is used as a method for forming the electrode pattern layer 12a, a conductive material made of various conductive metals or alloys (for example, nickel, nickel alloy, Electrode pattern pastes obtained by kneading various oxides, organometallic compounds, resinates, or the like, which become the above-described conductor materials after firing, and an organic vehicle are used.

  The shape of the conductor material contained in the electrode pattern paste is not particularly limited, such as a spherical shape or a flake shape, and different shapes may be mixed. The average particle diameter of the conductor material may be 0.1 to 2 μm, preferably about 0.2 to 1 μm.

  The organic vehicle contained in the electrode pattern paste can be composed of a binder and a solvent. As the binder, for example, ethyl cellulose, acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, or a copolymer thereof can be used, among which butyral such as ethyl cellulose or polyvinyl butyral. It is preferable to select a system material. The content of the binder is preferably set to 4 to 10 parts by mass with respect to 100 parts by mass of the conductor material.

  As the solvent, known solvents such as terpineol, butyl carbitol, kerosene, acetone, isobornyl acetate can be used. As content of a solvent, Preferably it is about 20-55 mass% with respect to the whole paste for electrode patterns.

  Moreover, it is preferable to add a plasticizer or a pressure-sensitive adhesive to the electrode pattern paste for the purpose of improving the adhesion to the green sheet 10a. As the plasticizer, the same one as used for the dielectric paste can be used, and the addition amount of the plasticizer is preferably 10 to 300 parts by mass, more preferably 10 with respect to 100 parts by mass of the binder. -200 parts by mass. In addition, when there is too much addition amount of a plasticizer or an adhesive, there exists a tendency for the intensity | strength of the electrode pattern layer 12a to fall remarkably.

  Thus, since the solvent is contained in the electrode pattern paste which is a material of the electrode pattern layer 12a, the formation of the electrode pattern layer 12a is a so-called wet-on-dry method. However, when the electrode pattern layer 12a is formed, the sheet attack phenomenon does not occur because the green sheet 10a has already been cured by the two-component polymerization. Therefore, the thickness t0 of the green sheet 10a can be set to a very thin thickness of 3 μm or less (the film thickness after firing is 1 μm or less).

  After forming the electrode pattern layer 12a in this way and drying it, as shown in FIG. 6, the electrode pattern layer 12a is formed on the surface of the green sheet 10a in a region where the electrode pattern layer 12a is not formed. A step absorption pattern layer 24a having substantially the same thickness as that is formed (step S5). The step absorption pattern layer 24a is a pattern complementary to the electrode pattern layer 12a, and plays a role of flattening a region where the electrode pattern layer 12a is formed and a region where the electrode pattern layer 12a is not formed. Thereby, when the green sheet is formed on the electrode pattern layer 12a, the steps to be absorbed by the green sheet are very small, and thus the chip shape after lamination can be improved. The step absorption pattern layer 24 a finally becomes the step absorption layer 24. The step absorption pattern layer 24 a is a dielectric similar to the first dielectric paste 52 a that is one material of the mixed dielectric paste 56 and the second dielectric paste 54 a that is the other material of the mixed dielectric paste 56. It can be formed by a printing method using a paste (step absorption pattern paste). However, it is not necessary to use a two-component polymerization type resin as the binder resin contained in the dielectric paste, and a normal thermoplastic resin can be used. If a thermoplastic resin is used as the binder resin, the adhesion to the green sheet 10a can be improved.

  The step absorption pattern layer 24a is also dried after being formed. Although not particularly limited, the drying temperature of the electrode pattern layer 12a and the step absorption pattern layer 24a is preferably set to 70 to 120 ° C., and the drying time is preferably set to 5 to 15 minutes.

  Since the dielectric paste which is the material of the step absorption pattern layer 24a also contains a solvent, the formation of the step absorption pattern layer 24a is also a wet-on-dry method, but the green sheet 10a has already been cured by two-liquid polymerization. Therefore, the solvent contained in the dielectric paste does not attack the green sheet 10a.

  In the above example, the step absorption pattern layer 24a is formed after the electrode pattern layer 12a is formed (step S4 → step S5), but this order may be reversed (step S5 → step S5). S4).

  Then, after repeatedly executing Steps S2 to S5 as many times as necessary (Step S6: YES), a cover sheet 26 is formed (Step S7), and the completed laminate 30 is removed from the support 20 as shown in FIG. Peel off (step S8). Although it does not specifically limit about the frequency | count of repetition, What is necessary is just to set to the frequency | count which can obtain the thickness which is easy to peel from the support body 20 (in FIG. 7, the example which repeated step S2-step S5 3 times). Is shown).

  The cover sheet 26 is a layer constituting the uppermost layer of the laminated body 30, and the first dielectric paste 52 a that is one material of the mixed dielectric paste 56 and the second material that is the other material of the mixed dielectric paste 56. The dielectric paste 54a, or a dielectric paste obtained by replacing the binder resin contained in these dielectric pastes with a thermoplastic resin can be formed by a printing method. Since these dielectric pastes have good adhesiveness with the two-component cured green sheet 10a, it is possible to reliably bond adjacent stacked bodies 30 to each other in the stacking of the stacked bodies 30 described later. Become.

Although not particularly limited, regarding the relationship between the thickness t0 of the lowermost green sheet 10a, the thickness t1 of the other green sheets 10a, and the thickness t2 of the cover sheet 26,
t0 + t2 = t1
It is preferable to set so that
t0 = t2 = t1 / 2
It is more preferable to set so that. With this setting, the distance between the adjacent electrode pattern layers 12a can be made equal (= t1) in the subsequent stacking of the stacked bodies 30.

  Next, a necessary number of the laminates 30 peeled from the support 20 are overlaid (step S9), finally pressed, and then cut into a predetermined size to form a green chip (step S10). ). The pressure at the time of final pressurization is preferably 10 to 200 MPa, and the heating temperature is preferably 40 to 100 ° C.

Then, the obtained green chip is subjected to binder removal processing / firing processing, and heat treatment (annealing) is performed to reoxidize the dielectric layer (step S11). Thereby, the capacitor body 4 is obtained. Further, the obtained capacitor element body 4 is subjected to end face polishing by, for example, barrel polishing, sand plast, etc., and then the terminal electrode paste is baked to form the terminal electrodes 6 and 8 (step S12). The ceramic capacitor 2 is completed. The firing conditions for the terminal electrode paste are preferably, for example, about 10 minutes to 1 hour at 600 to 800 ° C. in a humidified mixed gas of N ₂ and H ₂ .

  The multilayer ceramic capacitor 2 manufactured in this way is mounted on a printed circuit board by soldering or the like and used for various electronic devices.

  As described above, in the present embodiment, as the material of the green sheet 10a, the first dielectric paste 52a including one resin (first resin) selected from a combination of resins capable of two-component polymerization; Using a mixed dielectric paste 56 obtained by mixing the second dielectric paste 54a containing the other resin (second resin) selected from the combination of resins capable of two-component polymerization, two components after application Since the green sheet 10a is cured by progressing the polymerization, the so-called sheet attack phenomenon does not occur even if the electrode pattern layer 12a is formed on the surface thereof. For this reason, according to the present embodiment, even when the thickness t0 of the green sheet 10a is very thin, particularly set to 3 μm or less, the occurrence of short-circuit defects can be effectively suppressed, and a high yield can be achieved. Can be obtained.

  The present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention.

  For example, the method of the present invention is not limited to a method for manufacturing a multilayer ceramic capacitor, but can also be applied as a method for manufacturing other multilayer electronic components.

  In the above-described embodiment, the step absorption pattern layer 24a is formed in the region where the electrode pattern layer 12a is not formed. However, in the present invention, it is not essential to form the step absorption pattern layer. However, if the step absorption pattern layer is formed, high flatness can be obtained even when the green sheet is very thin, for example, 3 μm or less. When the step absorption pattern layer 24a is not formed, the upper and lower green sheets 10a are in contact with each other in the region where the electrode pattern layer 12a is not formed. In the present invention, each time the green sheet 10a is formed, these are cured by two-liquid polymerization. Therefore, the solvent does not move between the green sheet located in the upper layer and the green sheet located in the lower layer. For this reason, it is possible to reduce problems such as non-uniform thickness of the green sheet 10a and occurrence of pinholes.

  Further, the coating apparatus for forming the green sheet 10a is not limited to the coating apparatus 50 shown in FIG. 4, and after mixing the first dielectric paste and the second dielectric paste, 2 As long as the device can be applied before the mixed dielectric paste is cured by the progress of the liquid polymerization, a coating device having another configuration may be used. Therefore, when the pot life is long, it is not always necessary to mix these immediately before application, and after preparing the mixed dielectric paste, it is applied after temporarily storing it. It doesn't matter. Further, the mixing unit 56 may use a part of the coating head 58, for example, a liquid reservoir existing in the coating head as the mixing unit.

  Furthermore, instead of mixing the two dielectric pastes (first and second dielectric pastes), a second resin capable of two-liquid polymerization is added to the first dielectric paste (or the second dielectric paste) A mixed dielectric paste may be prepared by adding a first resin capable of two-liquid polymerization to the dielectric paste).

  Hereinafter, although the Example of this invention is described, this invention is not limited to this Example at all.

[Preparation of Dielectric Paste A]
First, BaTiO ₃ (average particle size of 0.2 μm / BT02 powder manufactured by Sakai Chemical Industry Co., Ltd.) is used as the main component of the dielectric material, and Y ₂ O ₃ is added to 100 mol of the main component as a subcomponent of the dielectric material. 2 mol, 2 mol of MgO, 0.4 mol of MnO, 0.1 mol of V ₂ O ₅ and 3 mol of (Ba _0.6 Ca _0.4 ) SiO ₃ were prepared.

  100 parts by weight of this dielectric material, 1 part by weight of a dispersant (polymeric dispersant / San Nopco SN5468) and 100 parts by weight of ethanol are placed in a polyethylene container together with zirconia balls (2 mmφ) and mixed for 16 hours. A dielectric mixed solution was obtained.

  The obtained dielectric mixed solution was dried at a drying temperature of 120 ° C. for 12 hours to obtain a dielectric powder.

  100 parts by weight of the obtained dielectric powder, 50 parts by weight of solvent ethanol, 20 parts by weight of solvent xylene, and 1 part by weight of a block type dispersant (JP4 manufactured by Unikema Co., Ltd.) were mixed for 4 hours with a ball mill, Dispersed.

  A lacquer solution of a resin containing 10 parts by weight of polyvinyl butyral resin (manufactured by Sekisui Chemical Co., Ltd.) (preparing a lacquer solution of ethanol having a lacquer concentration of 15%) is added to the dispersion after the primary dispersion to a ball mill. For 16 hours, and then secondarily dispersed to obtain a dielectric paste A.

[Adjustment of Dielectric Paste B]
A lacquer solution of a resin containing 10 parts by weight of an isocyanate resin (Daiichi Kogyo Seiyaku Co., Ltd.) in a dispersion after primary dispersion obtained in the preparation of the dielectric paste A (lacquer solution with ethanol at a lacquer concentration of 15%) Was prepared and mixed for 16 hours in a ball mill, followed by secondary dispersion to obtain a dielectric paste B.

[Adjustment of Dielectric Paste C]
In the dispersion after the primary dispersion obtained in the preparation of the dielectric paste A, a resin lacquer solution containing 10 parts by weight of a thermoplastic acrylic resin (Fujikura Kasei Co., Ltd., MM747 resin) (ethanol having a lacquer concentration of 15%) A lacquer solution was added) and mixed for 16 hours in a ball mill, followed by secondary dispersion to obtain a dielectric paste C.

[Adjustment of dielectric paste D]
A lacquer solution of a resin containing 10 parts by weight of a phenol resin (Daiichi Kogyo Seiyaku Co., Ltd.) (toluene lacquer solution having a lacquer concentration of 15%) is prepared in the dispersion after the primary dispersion obtained in the preparation of the dielectric paste A ) Was added, mixed for 16 hours in a ball mill, and secondarily dispersed to obtain a dielectric paste D.

[Adjustment of dielectric paste E]
In the dispersion after primary dispersion obtained in the preparation of the dielectric paste A, a resin lacquer solution containing 10 parts by weight of an epoxy resin (Dainippon Ink Co., Ltd.) (creating an ethanol lacquer solution having a lacquer concentration of 15%) Was added and mixed for 16 hours in a ball mill, followed by secondary dispersion to obtain a dielectric paste E.

[Adjustment of dielectric paste F]
A lacquer solution of a resin containing 10 parts by weight of a melamine resin (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) (a toluene lacquer solution having a lacquer concentration of 15%) is prepared in the dispersion after primary dispersion obtained in the preparation of the dielectric paste A ) And mixed for 16 hours in a ball mill, followed by secondary dispersion to obtain a dielectric paste F.

[Adjustment of dielectric paste G]
In the dispersion after primary dispersion obtained in the preparation of the dielectric paste A, a lacquer solution of resin containing 10 parts by weight of dialdehyde resin (Daiichi Kogyo Seiyaku Co., Ltd.) (lacquer solution of ethylene glycol having a lacquer concentration of 15%) Was prepared, and mixed for 16 hours in a ball mill, followed by secondary dispersion to obtain a dielectric paste G.

[Preparation of electrode pattern paste]
First, as additive (subcomponent) raw materials, (Ba, Ca) SiO ₃ : 1.48 parts by weight, Y ₂ O ₃ : 1.01 parts by weight, MgCO ₃ : 0.72 parts by weight, MnO: 0.13 Part by weight and V ₂ O ₅ : 0.045 part by weight were prepared. Next, these additive (subcomponent) raw materials prepared were mixed to obtain an additive (subcomponent) raw material mixture.

  Next, additive raw material mixture: 100 parts by weight, acetone: 150 parts by weight, terpineol: 104.3 parts by weight, polyethylene glycol dispersant: 1.5 parts by weight are mixed to form a slurry, and the resulting slurry is pulverized. By using a machine (Ashizawa Finetech Co., Ltd., model LMZ0.6), an additive slurry was obtained.

Note that the additives in the slurry were pulverized by rotating the rotor at a peripheral speed of 14 m / min and circulating the slurry between the vessel and the slurry tank. The vessel is filled with ZrO ₂ beads having a diameter of 0.1 mm so as to be 80% of the vessel volume, and the pulverization is performed so that the residence time of all the slurry in the vessel is 5 minutes. I went there. The median diameter of the crushed additive was 0.1 μm.

  Next, the crushed additive slurry was removed by evaporating acetone from the slurry using an evaporator to prepare an additive slurry in which the additive raw material was dispersed in terpineol. The additive raw material concentration in the additive slurry after removing acetone was 49.3% by weight.

Next, nickel powder (particle size 0.2 μm / Kawatetsu Kogyo Co., Ltd.): 100 parts by weight, additive slurry: 1.77 parts by weight, BaTiO ₃ powder (particle size 0.05 μm / Sakai Chemical Industry Co., Ltd.): 19.14 parts by weight, organic vehicle: 56.25 parts by weight, polyethylene glycol dispersant: 1.19 parts by weight, dioctyl phthalate (plasticizer): 2.25 parts by weight, isobornyl acetate: 32.19 parts by weight And 56 parts by weight of acetone were mixed using a ball mill to form a paste. Next, the obtained paste was removed by evaporating acetone using a stirrer equipped with an evaporator and a heating mechanism to obtain an electrode pattern paste.

The mixing with the ball mill was carried out under the conditions of a peripheral speed of 45 m / min and 16 hours, with the ball mill filled with 30% by volume of ₂ mmφ ZrO ₂ media and 60% by volume of the mixture of the above raw materials. The organic vehicle is prepared by stirring and dissolving ethyl cellulose resin having a molecular weight of 130,000: 4 parts by weight and ethyl cellulose resin having a molecular weight of 230,000: 4 parts by weight in isobornyl acetate: 92 parts by weight at a temperature of 70 ° C. It was produced by. That is, the resin content (the amount of ethyl cellulose resin) in the organic vehicle was 8% by weight.

Then, the viscosity of the resulting electrode pattern paste, using conical viscometer (HAAKE Co.), 25 ° C., the viscosity _{V 8} at a shear rate of 8 sec ^-1, and a viscosity _{V 50} at 50 sec ^-1, respectively It was measured. As a result of the measurement, V ₈ = 15.5 cps, V ₅₀ = 8.5 cps, V ₈ / V ₅₀ = 1.72, and it was confirmed that the viscosity could be used favorably for the printing method.

[Preparation of step absorption pattern paste]
First, in the same manner as the electrode pattern paste, an additive slurry in which an additive raw material was dispersed in terpineol was prepared.

Next, additive slurry: 8.87 parts by weight, BaTiO ₃ powder (BT-02 / Sakai Chemical Industry Co., Ltd.): 95.70 parts by weight, organic vehicle: 104.36 parts by weight, polyethylene glycol-based dispersant: 1 0.0 parts by weight, dioctyl phthalate (plasticizer): 2.61 parts by weight, isobornyl acetate: 19.60 parts by weight, acetone 57.20 parts by weight, and imidazoline surfactant (charging aid): 4 parts by weight were mixed using a ball mill to form a paste. Next, the obtained paste was removed by evaporating acetone using a stirrer equipped with an evaporator and a heating mechanism to obtain a step-absorption pattern paste. As the organic vehicle, the same organic vehicle as the internal electrode paste was used. That is, an 8% by weight isobornyl acetate solution of ethyl cellulose resin was used.

Subsequently, the viscosity of the obtained step absorption pattern paste was measured in the same manner as the electrode pattern paste. As a result of the measurement, V ₈ = 19.9 cps, V ₅₀ = 10.6 cps, and V ₈ / V ₅₀ = 1.88, confirming that the viscosity can be used favorably in the printing method.

Example 1
First, the above “dielectric paste A” and “dielectric paste A” are formed on the surface of a PET film (support 20) that has been subjected to an easy peeling treatment with a silicone resin by a nozzle coating method using the coating apparatus shown in FIG. A mixed dielectric paste made of “dielectric paste B” was applied to form a green sheet 10a. The film thickness of the green sheet 10a was set to 0.5 μm.

  Next, the support 20 on which the green sheet 10a was formed was continuously fed into a drying furnace, and the green sheet 10a was dried. The temperature in the drying furnace was 80 ° C., and the drying time was 2 minutes.

  Next, the support 20 on which the green sheet 10a was formed was introduced into a heat treatment drying furnace, and a two-component polymerization process was performed in an environment of 100 ° C. for 15 minutes. As a result, two-part polymerization of the polyvinyl butyral resin contained in the dielectric paste A and the isocyanate resin contained in the dielectric paste B proceeded, and the green sheet 10a was cured.

  Next, the above “electrode pattern paste” was applied to the surface of the green sheet 10a by a screen printing method to form an electrode pattern layer 12a having a predetermined pattern. Then, the support was continuously fed into the drying furnace, and the electrode pattern layer 12a was dried at 90 ° C. for 10 minutes. The film thickness of the electrode pattern layer 12a was set so that the film thickness after drying would be 1 μm.

  Further, the above-mentioned “step absorption pattern paste” was applied by screen printing to a region of the surface of the green sheet 10a where the electrode pattern layer 12a was not formed, thereby forming the step absorption pattern layer 24a. And the support body was continuously sent in in the drying furnace, and the level | step difference absorption pattern layer 24a was dried at 90 degreeC for 10 minute (s). The film thickness of the step absorption pattern layer 24a was set so that the film thickness after drying would be 1 μm.

  Next, the green sheet 10a is formed again on the surfaces of the electrode pattern layer 12a and the step absorption pattern layer 24a in the same manner as described above except that the film thickness is 1.0 μm. Liquid polymerization treatment was performed. Thereby, the two-part polymerization of the polyvinyl butyral resin contained in the dielectric paste A and the isocyanate resin contained in the dielectric paste B proceeded, and the second green sheet 10a was cured.

  Next, the electrode pattern layer 12a and the step absorption pattern layer 24a were formed on the surface of the second green sheet 10a in the same manner as described above and dried.

  Then, the above “dielectric paste C” was applied to the surfaces of the second electrode pattern layer 12 a and the step absorption pattern layer 24 a by a nozzle coating method to form a cover sheet 26. The film thickness of the cover sheet 26 was set so that the film thickness after drying was 0.5 μm. Thereafter, the support 20 on which the cover sheet 26 was formed was continuously fed into the drying furnace, and the cover sheet 26 was dried. The temperature in the drying furnace was 80 ° C., and the drying time was 2 minutes.

  As described above, the first green sheet 10a, the first electrode pattern layer 12a and the step absorption pattern layer 24a, the second green sheet 10a, the second electrode pattern layer 12a and the step absorption pattern layer 24a, the cover A laminate 30 in which the sheets 26 are laminated in this order was completed.

  A plurality of such laminates 30 were produced and peeled off from the support 20, and then laminated by thermocompression bonding so that the total number of electrode pattern layers 12a was 100. Thus, a laminate matrix was obtained. Thermocompression bonding was performed under the conditions of a pressure of 100 MPa and a temperature of 70 ° C. Next, the obtained laminated base material was cut by a dicing machine to obtain a green chip. In this example, the presence or absence of sheet attack of the green chip before firing was observed by a method described later.

Next, the green chip thus obtained was subjected to a binder removal process, a baking process, and a heat treatment (annealing) to produce a chip-shaped sintered body. The conditions for the binder removal treatment were temperature rising rate: 50 ° C./hour, holding temperature: 240 ° C., holding time: 8 hours, and atmospheric gas: in air. The firing conditions were as follows: heating rate: 300 ° C./hour, holding temperature: 1200 ° C., holding time: 2 hours, cooling rate: 300 ° C./hour, atmospheric gas: N ₂ gas controlled to a dew point of 20 ° C. And a mixed gas of H ₂ (5%). The conditions for the heat treatment (annealing) were: holding time: 3 hours, cooling rate: 300 ° C./hour, gas for atmosphere: N ₂ gas controlled at a dew point of 20 ° C. The atmosphere gas was humidified using a wetter at a water temperature of 0 to 75 ° C.

  Next, after polishing the end face of the chip-shaped sintered body by sand blasting, the In—Ga alloy paste is applied to the end portion, and then fired to perform the first terminal electrode 6 and the second terminal electrode 8. And a sample of the multilayer ceramic capacitor having the structure shown in FIG. 1 was obtained. The obtained sample had a width of 0.8 mm and a length of 1.6 mm.

[Measurement of presence or absence of sheet attack]
About the green chip sample obtained by the method of Example 1, the degree of occurrence of sheet attack was measured. In the measurement, first, 50 green chip samples were embedded in a two-component curable epoxy resin so that the side surfaces of the green sheet 10a and the electrode pattern layer 12a were exposed, and then the two-component curable epoxy resin was cured. . Next, using a sandpaper, the green chip sample embedded in the two-component curable epoxy resin was polished to a depth of 1.6 mm to expose the laminated section of the green sheet 10a and the electrode pattern layer 12a. The sandpaper was polished by using # 400 sandpaper, # 800 sandpaper, # 1000 sandpaper, and # 2000 sandpaper in this order. Next, using a diamond paste, a mirror-polishing treatment was performed on the sandpaper-polished surface. Then, using an optical microscope, the polished surface subjected to the mirror polishing treatment was observed at an enlargement magnification of 400 times to examine the presence or absence of sheet attack. As a result of observation with an optical microscope, the ratio of the samples in which the sheet attack occurred with respect to all the measured samples was defined as a “sheet attack rate”. The results are shown in Table 1.

  Note that whether or not a sheet attack occurred was determined by whether or not there was a portion where the thickness of the green sheet was reduced to 50% or less as compared with other portions.

[Measurement of short defect rate]
The short-circuit defect rate was measured for the multilayer ceramic capacitor obtained by the method of Example 1 above. The short-circuit defect rate was measured by preparing samples of 50 multilayer ceramic capacitors and examining the number of short-circuit defects.

Specifically, a resistance value is measured using an insulation resistance meter (E2377A multimeter manufactured by HEWLETT PACKARD), and a sample with a resistance value of 100 kΩ or less is defined as a short defect sample, and a short defect sample for all measurement samples. This ratio was defined as the “short defect rate”. The results are shown in Table 1.

  As shown in Table 1, no sheet attack was observed in the green chip produced by the method of Example 1, and the short-circuit defect rate of the finally produced multilayer ceramic capacitor was very low (4%).

Example 2
A green chip sample and a laminate were obtained in the same manner as in Example 1 except that “dielectric paste D” was used instead of the dielectric paste B as one material of the mixed dielectric paste as the material of the green sheet 10a. A ceramic capacitor sample was prepared. Then, the above-described sheet attack rate and short defect rate were measured. The results are shown in Table 1.

  As shown in Table 1, no sheet attack was observed for the green chip produced by the method of Example 2, and the short-circuit defect rate of the finally produced multilayer ceramic capacitor was very low (5%).

Example 3
A green chip sample and a laminate as in Example 1 except that “dielectric paste E” was used instead of the dielectric paste B as one material of the mixed dielectric paste that is the material of the green sheet 10a. A ceramic capacitor sample was prepared. Then, the above-described sheet attack rate and short defect rate were measured. The results are shown in Table 1.

  As shown in Table 1, no sheet attack was observed for the green chip produced by the method of Example 3, and the short-circuit defect rate of the finally produced multilayer ceramic capacitor was very low (5%).

Example 4
A green chip sample and a laminate were obtained in the same manner as in Example 1 except that “dielectric paste F” was used instead of the dielectric paste B as one material of the mixed dielectric paste as the material of the green sheet 10a. A ceramic capacitor sample was prepared. Then, the above-described sheet attack rate and short defect rate were measured. The results are shown in Table 1.

  As shown in Table 1, no sheet attack was observed for the green chip produced by the method of Example 4, and the short-circuit defect rate of the finally produced multilayer ceramic capacitor was very low (6%).

Example 5
A green chip sample and a laminate were obtained in the same manner as in Example 1 except that “dielectric paste G” was used instead of the dielectric paste B as one material of the mixed dielectric paste as the material of the green sheet 10a. A ceramic capacitor sample was prepared. Then, the above-described sheet attack rate and short defect rate were measured. The results are shown in Table 1.

  As shown in Table 1, no sheet attack was observed for the green chip produced by the method of Example 5 and the short-circuit defect rate of the finally produced multilayer ceramic capacitor was very low (7%).

Example 6
A green chip sample and a multilayer ceramic capacitor sample were produced in the same manner as in Example 1 except that “dielectric paste A” was used instead of the dielectric paste C as the material of the cover sheet 26. Then, the above-described sheet attack rate and short defect rate were measured. The results are shown in Table 1.

  As shown in Table 1, no sheet attack was observed for the green chip produced by the method of Example 6, and the short-circuit defect rate of the finally produced multilayer ceramic capacitor was very low (4%).

Example 7
A green chip sample and a multilayer ceramic capacitor sample were prepared in the same manner as in Example 2 except that “dielectric paste B” was used instead of the dielectric paste C as the material of the cover sheet 26. Then, the above-described sheet attack rate and short defect rate were measured. The results are shown in Table 1.

  As shown in Table 1, no sheet attack was observed for the green chip produced by the method of Example 7, and the short-circuit defect rate of the finally produced multilayer ceramic capacitor was very low (5%).

Comparative example As in Example 1, except that only the "dielectric paste C" was used instead of the mixed dielectric paste composed of the dielectric paste A and the dielectric paste B as the material of the green sheet 10a. Thus, a green chip sample and a multilayer ceramic capacitor sample were prepared. Then, the above-described sheet attack rate and short defect rate were measured. The results are shown in Table 1.

  As shown in Table 1, the sheet attack rate of the green chip produced by the method of the comparative example was 100%. Further, the short-circuit defect rate of the finally produced multilayer ceramic capacitor was 100%.

[Evaluation]
As described above, it is confirmed that the mixed dielectric paste, which is the material of the green sheet 10a, includes a combination of resins capable of two-component polymerization, thereby preventing sheet attack and, as a result, reducing the short-circuit defect rate. It was done.

It is a schematic sectional drawing which shows the structure of the multilayer ceramic capacitor 2 produced by the method by preferable embodiment of this invention. 3 is a flowchart for explaining a method of manufacturing a multilayer electronic component according to a preferred embodiment of the present invention. It is a schematic sectional drawing which shows the state after performing step S2. It is a schematic block diagram of the coating device 50 by preferable embodiment of this invention. It is a schematic sectional drawing which shows the state after performing step S4. It is a schematic sectional drawing which shows the state after performing step S5. It is a schematic sectional drawing which shows the state after performing step S7.

Explanation of symbols

2 Multilayer Ceramic Capacitor 4 Capacitor Element 4a One End 4b of Capacitor Element The Other End 6 of Capacitor Element First Terminal Electrode 8 Second Terminal Electrode 10 Dielectric Layer 10a Green Sheet 12 Internal Electrode Layer 12a Electrode pattern layer 20 Support 24 Step absorption layer 24a Step absorption pattern layer 26 Cover sheet 30 Laminate 50 Dielectric coating device 52 First reservoir 52a First dielectric paste 54 Second reservoir 54a Second dielectric Body paste 56 mixing section 56a mixed dielectric paste 58 coating head 60 stirring means

Claims (14)

  A mixed dielectric paste containing a first resin and a second resin that can be polymerized with the first resin is applied on a support, and the first resin and the second resin are polymerized to form a green sheet. And a second step of forming an electrode pattern layer on the surface of the green sheet. A method of manufacturing a multilayer electronic component, comprising:   The first step is to prepare the mixed dielectric paste by mixing a first dielectric paste containing the first resin and a second dielectric paste containing the second resin. A sub-step; and a second sub-step of applying the mixed dielectric paste onto the support before the mixed dielectric paste is cured by polymerization of the first resin and the second resin. The method of manufacturing a multilayer electronic component according to claim 1, comprising:   3. The method for manufacturing a multilayer electronic component according to claim 2, wherein each of the first dielectric paste and the second dielectric paste contains ceramic powder. 4.   After performing the first step and the second step alternately a plurality of times, a third step of peeling the obtained laminate from the support, and a fourth step of superposing a plurality of the laminates, The method of manufacturing a multilayer electronic component according to any one of claims 1 to 3, further comprising:   After performing the first step and the second step alternately a plurality of times, and before performing the third step, a cover sheet made of a dielectric paste is formed on the surface of the electrode pattern layer located at the uppermost layer. The method of manufacturing a multilayer electronic component according to claim 4, wherein the method is formed.   6. The method of manufacturing a multilayer electronic component according to claim 5, wherein the dielectric paste that is a material of the cover sheet includes the first resin, the second resin, or a thermoplastic resin.   The thickness of the green sheet formed in the first step performed for the first time is set to be smaller than the thickness of the green sheet formed in the first step performed for the second time or later. The manufacturing method of the multilayer electronic component of Claim 5 or 6.   The thickness of the cover sheet is set to be thinner than the thickness of the green sheet formed in the first step performed after the second time. A method for manufacturing a multilayer electronic component.   The thickness of the green sheet formed in the first step performed after the second time is the sum of the thickness of the green sheet formed in the first step performed in the first time and the thickness of the cover sheet. The method of manufacturing a multilayer electronic component according to claim 8, wherein the setting is substantially equal.   10. The multilayer electronic component according to claim 4, wherein a green chip is formed by cutting the plurality of stacked laminates, and then the green chip is fired. 11. Method.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the green sheet layer has a thickness of 3 μm or less.   12. The step absorption pattern layer made of a dielectric paste is formed in a region where the electrode pattern layer is not formed on the surface of the green sheet formed in the first step. The manufacturing method of the multilayer electronic component of any one of Claims 1. A first reservoir for storing a first dielectric paste containing a first resin, and a second reservoir for storing a second dielectric paste containing a second resin polymerizable with the first resin. A mixing unit for preparing a mixed dielectric paste by mixing the first dielectric paste and the second dielectric paste, and an application unit for applying the mixed dielectric paste on a support. Prepared,
The mixing unit can continuously supply the mixed dielectric paste to the coating unit while continuously receiving the first and second dielectric pastes from the first and second storage units, respectively. It is comprised in the coating apparatus characterized by the above-mentioned.   The mixing unit includes a stirring unit that stirs the first dielectric paste supplied from the first storage unit and the second dielectric paste supplied from the second storage unit. The coating apparatus according to claim 13, wherein the coating apparatus is a coating apparatus.

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