JP2006134623A - Transparent base plate and manufacturing method of the same, electro-optical device and manufacturing method of the same, and image forming device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transparent base plate improving efficiency of taking out light emitted from a light-emitting element, and further, having improved positional accuracy of a formed microlens against the light-emitting element and a manufacturing method of the same, and to provide an electro-optical device and a manufacturing method of the same, and an image forming device. <P>SOLUTION: A concave part 40 having a second matching radius R2 is formed on a light taking out face 30b of a glass base plate 30, and a separation wall 41 is formed in the concave part 40 by resist or the like. After forming a circular hole 42 having a first matching radius R1 smaller than the second matching radius R2 on the separation wall 40, the separation wall 41 is formed by the resist having high freedom of formation by which, the microlens 43 is formed in the circular hole 42. The microlens 43 having first matching radius R1 can be formed in the circular hole 42 without depending on the size of the radius of the concave part 40 by forming the microlens 43 in the circular hole 42. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a transparent substrate, a transparent substrate manufacturing method, an electro-optical device, an electro-optical device manufacturing method, and an image forming apparatus.

  An image forming apparatus using an electrophotographic method uses an exposure head as an electro-optical device that exposes a photosensitive drum as an image carrier to form a latent image. In recent years, in order to reduce the thickness and weight of the exposure head, an apparatus using an organic electroluminescence element (organic EL element) as a light emitting element as a light emitting source of the exposure head has been proposed.

  Among these, for the convenience that such organic EL elements can widen the selection range of constituent materials, in this type of exposure head, an organic EL layer is formed on one side surface (light emitting element forming surface) of the transparent substrate. In the organic EL layer, a so-called bottom emission structure in which emitted light is extracted from the other side surface (light extraction surface) opposite to the light emitting element formation surface is adopted.

  In the bottom emission structure, various wirings for causing the organic EL layer to emit light are formed between the light extraction surface and the organic EL layer. For this reason, there has been a problem that the aperture ratio of the organic EL element is lowered and the light extraction efficiency of the exposure head is lowered.

Therefore, in an exposure head equipped with an organic EL element, in order to improve the light extraction efficiency, a so-called microlens that collects and focuses the light emitted from the organic EL layer is formed on the light extraction surface. Propositions have been made (for example, Patent Document 1). In Patent Document 1, a light absorbing resin is applied to the light extraction surface for patterning, and a hole having the light absorbing resin as an inner wall is provided at a position facing the organic EL element. Then, an ultraviolet curable resin is sprayed into the hole to form a microlens at a position facing the organic EL element.
Japanese Laid-Open Patent Publication No. 2003-291404

However, in Patent Document 1, since the organic EL element is formed on the light emitting element formation surface and the microlens is formed on the light extraction surface, the following problems occur.
That is, the microlens is always formed away from the organic EL element (organic EL layer) by a distance corresponding to the thickness of the transparent substrate. In other words, the opening angle of the microlens with respect to the organic EL element is always reduced by the thickness of the transparent substrate, and the light extraction efficiency of the microlens is lowered.

  For this reason, it is conceivable to reduce the thickness of the transparent substrate in order to ensure the light extraction efficiency. However, in this case, the mechanical strength of the transparent substrate is insufficient and the organic EL element is formed or the exposure head is used. There is a risk of causing damage or the like during assembly.

  The present invention has been made in order to solve the above-described problems, and the object thereof is to improve the extraction efficiency of light emitted from the light emitting element, and further improve the positional accuracy of the formed microlens with respect to the light emitting element. A transparent substrate, a transparent substrate manufacturing method, an electro-optical device, an electro-optical device manufacturing method, and an image forming apparatus are provided.

  The transparent substrate of the present invention is a transparent substrate in which light irradiated from a light source is incident from the light incident surface side and is emitted through a microlens provided on the light extraction surface side. A concave portion having a width larger than the diameter of the lens was formed, an annular positioning portion for positioning the microlens was provided in the concave portion, and the microlens was formed in the positioning portion.

  According to the transparent substrate of the present invention, since the microlens is provided in the recess having a width larger than the diameter of the microlens, the operation of forming the microlens is facilitated, and the load on the manufacturing process can be reduced. Furthermore, the microlens can be formed on the light incident surface side as much as the concave portion is formed, and the opening angle of the microlens with respect to the light incident surface can be increased. As a result, the utilization efficiency of the light incident from the light incident surface can be improved. Further, by increasing the thickness of the transparent substrate other than the recess by the amount of the recess, the deterioration of the mechanical strength of the transparent substrate can be compensated. Furthermore, since the microlens is accurately positioned with respect to the light source by the positioning unit, the utilization efficiency of the light incident from the light incident surface can be improved.

  In the transparent substrate, the positioning portion includes a circular hole having an inner diameter opposite to the diameter of the microlens at a position facing the light source, and the microlens is formed in the circular hole.

  According to this transparent substrate, since the circular hole of the positioning portion has an inner diameter opposite to the diameter of the microlens, the microlens is accurately formed regardless of the size of the recess formed in the light extraction surface. Therefore, since the microlens is positioned more accurately with respect to the light emitting element, the utilization efficiency of the light emitted from the light emitting element can be further improved.

  In the transparent substrate, the microlens is a convex lens.

  According to this transparent substrate, since the microlens is formed by a convex lens, it is possible to improve the efficiency of condensing the light incident from the light incident surface by the microlens.

  The method for producing a transparent substrate of the present invention is the method for producing a transparent substrate in which light emitted from a light source is incident from the light incident surface side and emitted through a microlens provided on the light extraction surface side. A concave portion having a width larger than the diameter of the microlens is formed on the surface, an annular positioning portion for positioning the microlens is formed in the concave portion, and droplets of the lens-forming resin from the liquid ejecting apparatus are annularly formed. After being ejected into the positioning part, the microlens is formed by solidifying the lens-forming resin in the positioning part.

  According to the method for manufacturing a transparent substrate of the present invention, since the microlens is formed in the recess having a width larger than the diameter of the microlens, the operation of forming the microlens is facilitated and the load on the manufacturing process is reduced. Can do. Furthermore, by positioning the microlens by the positioning portion, the microlens can be accurately formed in the recess without depending on the size of the recess. Therefore, since the microlens can be accurately positioned with respect to the light source, the formed transparent substrate can further improve the utilization efficiency of light incident from the light incident surface.

  In this method for manufacturing a transparent substrate, after the surface treatment for repelling the droplet of the lens forming resin on the surface of the positioning portion, the droplet is ejected from the liquid ejecting apparatus into the positioning portion.

According to this transparent substrate manufacturing method, for example, a liquid repellent material is applied to the surface of the positioning portion, or surface treatment such as CF ₄ plasma treatment is performed. As a result, the liquid droplets ejected into the positioning part are repelled by the surface of the positioning part, so that the liquid droplet forms its surface in a curved shape by its surface tension. Accordingly, the surface of the lens formed by solidifying the liquid droplets has a more curved surface, so that the light collecting property is improved. That is, the formed transparent substrate can further improve the utilization efficiency of light incident from the light incident surface.

  In this method for manufacturing a transparent substrate, the positioning portion is formed of a liquid repellent member that repels the droplets of the lens forming resin.

  According to this method for manufacturing a transparent substrate, the positioning portion is made of a liquid repellent member such as a fluorine-based resin, for example. As a result, the liquid droplets ejected into the positioning part are repelled by the surface of the positioning part, so that the liquid droplet forms its surface in a curved shape by its surface tension. Accordingly, the surface of the lens formed by solidifying the liquid droplets has a more curved surface, so that the light collecting property is improved. That is, the formed transparent substrate can further improve the utilization efficiency of light incident from the light incident surface.

  The electro-optical device of the present invention allows light emitted from a light emitting element formed on a light emitting element forming surface of a transparent substrate to pass through a microlens provided on a light extraction surface side opposite to the light emitting element forming surface. In the emitting electro-optical device, a concave portion having a width larger than the diameter of the microlens is formed on the light extraction surface side, and an annular positioning portion for positioning the microlens is provided in the concave portion. The microlens was formed.

  According to the electro-optical device of the present invention, since the microlens is provided in the recess having a width larger than the diameter of the microlens, the work of attaching the microlens is facilitated. Furthermore, the microlens can be formed on the light emitting element forming surface side by the amount of the concave portion, and the opening angle of the microlens with respect to the light emitting element forming surface can be increased. As a result, the utilization efficiency of light incident from the light emitting element formation surface can be improved. Further, by increasing the thickness of the transparent substrate other than the recess by the amount of the recess, the deterioration of the mechanical strength of the transparent substrate can be compensated. Furthermore, since the microlens provided in the concave portion is accurately positioned with respect to the light source by being positioned by the positioning portion, this electro-optical device further improves the utilization efficiency of the light incident from the light emitting element formation surface. Can be improved.

  In this electro-optical device, the positioning portion includes a circular hole having an inner diameter opposite to the diameter of the microlens at a position facing the light emitting element, and the microlens is formed in the circular hole.

  According to this electro-optical device, since the circular hole of the positioning portion has an inner diameter opposite to the diameter of the microlens, the microlens is accurately formed regardless of the size of the recess formed in the light extraction surface. Therefore, since the microlens is positioned more accurately with respect to the light emitting element, the utilization efficiency of light incident from the light emitting element surface can be further improved.

  In this electro-optical device, the light emitting element includes a transparent electrode formed on the light extraction surface side, a back electrode formed opposite to the transparent electrode, and a light emission formed between the transparent electrode and the back electrode. An electroluminescent device comprising a layer.

  According to this electro-optical device, the light use efficiency of the electro-optical device including the electroluminescence element can be improved.

  In this electro-optical device, the light emitting layer is formed of an organic material, and the electroluminescent element is an organic electroluminescent element.

  According to this electro-optical device, the light utilization efficiency of the electro-optical device including the organic electroluminescence element can be improved.

  In the electro-optical device, a plurality of the light emitting elements are formed in the concave portions arranged along one direction of the light emitting element forming surface.

  According to this electro-optical device, the microlens formed corresponding to each of the light emitting elements arranged along one direction can improve the utilization efficiency of the light emitted from the light emitting elements.

  In this electro-optical device, the microlens is a convex lens, and condenses the light emitted from the light emitting element and emits the light from the light extraction surface.

  According to this electro-optical device, since the microlens is formed by a convex lens, it can be condensed by the microlens formed on the transparent substrate without using a condensing mechanism. Therefore, the efficiency of collecting the light emitted from the light emitting element can be improved.

  The method of manufacturing an electro-optical device according to the present invention includes a microlens provided on the light extraction surface side opposite to the light emitting element forming surface for light emitted from the light emitting element formed on the light emitting element forming surface of the transparent substrate. In the method of manufacturing an electro-optical device that emits light, a concave portion having a width larger than the diameter of the microlens is formed on the light extraction surface, and an annular positioning portion that positions the microlens is formed in the concave portion. Then, after the droplet of the lens forming resin is ejected from the liquid ejecting apparatus into the annular positioning portion, the lens forming resin is solidified in the positioning portion to form the microlens.

  According to the method for manufacturing an electro-optical device of the present invention, since the microlens is formed in the recess having a width larger than the diameter of the microlens, the operation of forming the microlens is facilitated and the load of the manufacturing process is reduced. be able to. Further, by positioning with the positioning portion, the microlens can be accurately formed in the recess without depending on the size of the recess. Accordingly, since the microlens can be accurately positioned with respect to the light source, the electro-optical device can further improve the utilization efficiency of the light incident from the light incident surface.

  In the electro-optical device manufacturing method, a circular hole having an inner diameter opposite to the diameter of the microlens is formed in the positioning portion at a position facing the light emitting element, and the liquid ejecting apparatus is formed in the circular hole. The microlenses are formed by ejecting droplets from the microlenses.

  According to the method for manufacturing the electro-optical device, the microlens is formed by the liquid ejected to the circular hole of the liquid ejecting apparatus, and therefore, compared to the case where the microlens formed by the replica method or the like is attached in the recess, for example Manufacturing processes and the like can be reduced. In addition, the microlens corresponding to the size of the circular hole can be reliably formed in the recess. As a result, the utilization efficiency of light emitted from the light emitting element and the productivity of the electro-optical device can be improved.

  In this electro-optical device manufacturing method, the surface of the positioning portion is subjected to a surface treatment for repelling the droplet of the lens forming resin, and then the droplet is ejected from the liquid ejecting device into the positioning portion.

According to this electro-optical device manufacturing method, for example, a liquid repellent material is applied to the surface of the positioning portion, or surface treatment such as CF ₄ plasma treatment is performed. As a result, the liquid droplets ejected into the positioning part are repelled by the surface of the positioning part, so that the liquid droplet forms its surface in a curved shape by its surface tension. Accordingly, the surface of the lens formed by solidifying the liquid droplets has a more curved surface, so that the light collecting property is improved. That is, the electro-optical device of the present invention can further improve the utilization efficiency of the light emitted from the light emitting element.

  In this method of manufacturing an electro-optical device, the positioning portion is formed of a liquid repellent member that repels the droplets of the lens forming resin.

  According to the method for manufacturing the electro-optical device, the positioning unit is configured of a liquid repellent member such as a fluorine resin. As a result, the liquid droplets ejected into the positioning part are repelled by the surface of the positioning part, so that the liquid droplet forms its surface in a curved shape by its surface tension. Accordingly, the surface of the lens formed by solidifying the liquid droplets has a more curved surface, so that the light collecting property is improved. That is, the electro-optical device of the present invention can further improve the utilization efficiency of the light emitted from the light emitting element.

  The image forming apparatus of the present invention develops a visible image by exposing a peripheral surface of an image carrier charged by a charging means to form a latent image and supplying colored particles to the latent image. In the image forming apparatus including a developing unit and a transfer unit that transfers the visible image onto a transfer medium, the exposure unit includes the electro-optical device described above.

  According to the image forming apparatus of the present invention, the exposure means for exposing the charged image carrier includes the electro-optical device. Accordingly, it is possible to improve the light use efficiency in the exposure of the image forming apparatus.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a schematic side sectional view showing an electrophotographic printer as an image forming apparatus.
(Electrophotographic printer)
As shown in FIG. 1, an electrophotographic printer 10 (hereinafter simply referred to as a printer 10) includes a housing 11 formed in a box shape. In the housing 11, a driving roller 12, a driven roller 13, and a tension roller 14 are provided, and an intermediate transfer belt 15 as a transfer medium is stretched around each of the rollers 12-14. The intermediate transfer belt 15 is provided so as to be circulated in the direction of the arrow in FIG.

  Above the intermediate transfer belt 15, four photosensitive drums 16 as image carriers are provided so as to be rotatable in the extending direction of the intermediate transfer belt 15 (sub-scanning direction Y). On the outer peripheral surface of the photosensitive drum 16, a photosensitive layer 16a (see FIG. 4) having photoconductivity is formed. The photosensitive layer 16a is charged with a positive or negative charge in the dark, and when irradiated with light having a predetermined wavelength region, the charge at the irradiated portion is lost. In other words, the electrophotographic printer 10 is a tandem printer constituted by these four photosensitive drums 16.

  Around each photosensitive drum 16, a charging roller 17 as a charging unit, an organic electroluminescence array exposure head 20 (hereinafter simply referred to as an exposure head 20) as an electro-optical device constituting the exposure unit, and a developing unit. The toner cartridge 21, the primary transfer roller 22 constituting the transfer means, and the cleaning means 23 are disposed.

  The charging roller 17 is a semiconductive rubber roller that is in close contact with the photosensitive drum 16. When a DC voltage is applied to the charging roller 17 to rotate the photosensitive drum 16, the photosensitive layer 16a of the photosensitive drum 16 is charged to a predetermined charging potential over the entire circumferential surface.

  The exposure head 20 is a light source that emits light in a predetermined wavelength region, and is formed in a long plate shape as shown in FIG. The exposure head 20 is positioned at a position separated from the photosensitive layer 16a by a predetermined distance with its longitudinal direction parallel to the axial direction of the photosensitive drum 16 (direction orthogonal to the paper surface in FIG. 1: main scanning direction X). ing. When the exposure head 20 emits light based on the print data in the vertical direction Z (see FIG. 1) and the photosensitive drum 16 rotates in the rotation direction Ro, the photosensitive layer 16a is exposed to light in a predetermined wavelength region. . Then, the photosensitive layer 16a loses the electric charge of the exposed part (exposure spot) and forms an electrostatic image (electrostatic latent image) on the outer peripheral surface thereof. Incidentally, the wavelength region of light exposed by the exposure head 20 is a wavelength region that matches the spectral sensitivity of the photosensitive layer 16a. That is, the peak wavelength of the light emission energy of the light exposed by the exposure head 20 is substantially the same as the peak wavelength of the spectral sensitivity of the photosensitive layer 16a.

  The toner cartridge 21 is formed in a box shape and accommodates toner T as colored particles having a diameter of about 10 μm therein. Note that the four toner cartridges 21 in this embodiment contain toner T of corresponding four colors (black, cyan, magenta, and yellow). The toner cartridge 21 includes a developing roller 21a and a supply roller 21b in order from the photosensitive drum 16 side. The supply roller 21b is configured to convey the toner T to the developing roller 21a by rotating. The developing roller 21a charges the toner T conveyed by the supply roller 21b by friction with the supply roller 21b and the like, and uniformly attaches the charged toner T to the outer peripheral surface of the development roller 21a. .

  Then, the supply roller 21b and the developing roller 21a are rotated while a bias potential substantially equal to the charging potential is applied to the photosensitive drum 16. Then, the photosensitive drum 16 gives an electrostatic attraction force relative to the bias potential between the exposure spot and the developing roller 21a (toner T). The toner T that has received the electrostatic attracting force moves from the outer peripheral surface of the developing roller 21a to the exposure spot and is attracted thereto. As a result, a monochrome visible image (developed image) corresponding to the electrostatic latent image is formed (developed) on the outer peripheral surface of each photosensitive drum 16 (each photosensitive layer 16a).

  Primary transfer rollers 22 are provided on the inner surface 15 a of the intermediate transfer belt 15 at positions facing the respective photosensitive drums 16. The primary transfer roller 22 is a conductive roller, and rotates while its outer peripheral surface is in close contact with the inner surface 15 a of the intermediate transfer belt 15. When a DC voltage is applied to the primary transfer roller 22 to rotate the photosensitive drum 16 and the intermediate transfer belt 15, the toner T adsorbed on the photosensitive layer 16 a is electrostatically attracted to the primary transfer roller 22 side by the intermediate transfer belt 15. The outer surface 15b is sequentially moved to be adsorbed. That is, the primary transfer roller 22 primarily transfers the visible image formed on the photosensitive drum 16 to the outer surface 15 b of the intermediate transfer belt 15. The outer transfer surface 15b of the intermediate transfer belt 15 is subjected to primary transfer of a monochrome image four times by the photosensitive drums 16 and the primary transfer roller 22, and a full-color image (toner) is superimposed by superimposing these images. Image).

  The cleaning unit 23 includes a light source such as an LED (not shown) and a rubber blade, and discharges the charged photosensitive layer 16a by irradiating the photosensitive layer 16a after the primary transfer with light. Then, the cleaning unit 23 mechanically removes the toner T remaining on the removed photosensitive layer 16a with a rubber blade.

Below the intermediate transfer belt 15, a recording paper cassette 24 containing the recording paper P is disposed. Above the recording paper cassette 24, a paper feeding roller 25 for feeding the recording paper P to the intermediate transfer belt 15 side is disposed. A secondary transfer roller 26 that constitutes a transfer unit is disposed above the paper feed roller 25 and at a position facing the drive roller 12. The secondary transfer roller 26 is a conductive roller similar to each of the primary transfer rollers 22 and presses the back surface of the recording paper P so that the front surface of the recording paper P contacts the outer surface 15 b of the intermediate transfer belt 15. Yes. When a DC voltage is applied to the secondary transfer roller 26 and the intermediate transfer belt 15 is rotated, the toner T adsorbed on the outer surface 15b of the intermediate transfer belt 15 sequentially moves onto the surface of the recording paper P and is adsorbed. To do. That is, the secondary transfer roller 26 secondarily transfers the toner image formed on the outer surface 15 b of the intermediate transfer belt 15 onto the surface of the recording paper P.

  Above the secondary transfer roller 26, a heat roller 27a containing a heat source and a pressure roller 27b for pressing the heat roller 27a are disposed. When the recording paper P after the secondary transfer is conveyed between the heat roller 27a and the pressing roller 27b, the toner T transferred onto the recording paper P is softened by heating and penetrates into the recording paper P. And solidify. As a result, the toner image is fixed on the surface of the recording paper P. The recording paper P on which the toner image is fixed is discharged to the outside of the housing 11 by a paper discharge roller 28.

  Therefore, the printer 10 exposes the charged photosensitive layer 16a by the exposure head 20, and forms an electrostatic latent image on the photosensitive layer 16a. Next, the printer 10 develops the electrostatic latent image on the photosensitive layer 16a to form a monochromatic visible image on the photosensitive layer 16a. Subsequently, the printer 10 sequentially transfers the visible image of the photosensitive layer 16 a onto the intermediate transfer belt 15 in order to form a full-color toner image on the intermediate transfer belt 15. The printer 10 secondarily transfers the toner image on the intermediate transfer belt 15 onto the recording paper P, fixes the toner image by heat and pressure, and ends printing.

  Next, the exposure head 20 as an electro-optical device provided in the printer 10 will be described below. 2 and 3 are a plan view and a front sectional view showing the exposure head 20, respectively. FIG. 4 is a schematic cross-sectional view along the one-dot chain line AA shown in FIG.

  As shown in FIGS. 2 and 3, the exposure head 20 is provided with a glass substrate 30 as a transparent substrate. The glass substrate 30 is a long substrate, and has a width in the longitudinal direction (main scanning direction X) that is substantially the same as the width in the axial direction of the photosensitive drum 16. In this embodiment, with respect to the glass substrate 30, the upper surface (the surface opposite to the photosensitive drum 16 side) is the light emitting element forming surface 30a as the light incident surface, and the lower surface (the surface on the photosensitive drum 16 side) is the light extraction surface. 30b.

First, the light emitting element formation surface 30a side of the glass substrate 30 is demonstrated below.
As shown in FIGS. 2 and 3, a plurality of pixel formation regions 31 arranged in a two-dimensional pattern in a staggered pattern are formed on the light emitting element formation surface 30 a of the glass substrate 30. In each pixel formation region 31, a pixel 34 including a thin film transistor 32 (hereinafter simply referred to as TFT 32) and a light emitting element 33 as a light source is formed. The TFT 32 is turned on by a data signal generated based on the print data, and the light emitting element 33 emits light based on the on state.

  As shown in FIG. 4, the TFT 32 includes a channel film B in the lowermost layer. The channel film B is an island-shaped p-type polysilicon film formed on the light emitting element formation surface 30a, and activated n-type regions (source region and drain region) (not shown) on the left and right sides in FIG. It has. That is, the TFT 32 is a so-called polysilicon type TFT.

At the upper center position of the channel film B, a gate insulating film D0, a gate electrode Pg, and a gate wiring M1 are formed in order from the light emitting element formation surface 30a side. The gate insulating film D0 is a light-transmitting insulating film such as a silicon oxide film, and is deposited on substantially the entire surface of the light emitting element formation surface 30a. The gate electrode Pg is a low-resistance metal film such as tantalum, and is formed at a substantially central position of the channel film B. The gate wiring M1 is a transparent conductive film having optical transparency such as ITO, and electrically connects the gate electrode Pg and a data line driving circuit (not shown). When the data line driving circuit inputs a data signal to the gate electrode Pg through the gate wiring M1, the TFT 32 is turned on based on the data signal.

  A source contact Sc and a drain contact Dc extending upward in the vertical direction Z are formed on the channel film B above the source region and the drain region. Each contact Sc, Dc is formed of a metal film such as a metal silicide that lowers the contact resistance with the channel film B. The contacts Sc and Dc and the gate electrode Pg (gate wiring M1) are electrically insulated from each other by a first interlayer insulating film D1 made of a silicon oxide film or the like.

  On the upper side of each contact Sc and contact Dc, a power line M2s and an anode line M2d made of a low-resistance metal film such as aluminum are formed. The power line M2s electrically connects the source contact Sc and a driving power source (not shown). The anode line M2d electrically connects the drain contact Dc and the light emitting element 33. The power supply line M2s and the anode line M2d are electrically insulated from each other by a second interlayer insulating film D2 made of a silicon oxide film or the like. When the TFT 32 is turned on based on the data signal, a drive current corresponding to the data signal is supplied from the power supply line M2s (drive power supply) to the anode line M2d (light emitting element 33).

  As shown in FIG. 4, the light emitting element 33 is formed above the second interlayer insulating film D2. An anode Pc as a transparent electrode is formed in the lowermost layer of the light emitting element 33. The anode Pc is a transparent conductive film having optical transparency such as ITO, and one end thereof is connected to the anode line M2d. A third interlayer insulating film D3 is deposited on the outer periphery of the anode Pc so as to surround the anode Pc. The third interlayer insulating film D3 is formed of a resin film such as photosensitive polyimide or acrylic, and electrically insulates the anode Pc of each light emitting element 33. Further, the third interlayer insulating film D3 opens the upper side of the anode Pc in a substantially circular hole shape, and forms a partition D3a composed of an inner peripheral surface thereof. The inner diameter of the partition D3a on the anode Pc side is formed by a first alignment radius R1 described later.

  An organic electroluminescence layer (organic EL layer) Oe made of an organic material is formed above the anode Pc and inside the partition wall D3a. The organic EL layer Oe is an organic compound layer composed of two layers, a hole transport layer and a light emitting layer. On the upper side of the organic EL layer Oe, a cathode Pa as a back electrode made of a metal film having light reflectivity such as aluminum is formed. The cathode Pa is formed so as to cover the entire surface of the light emitting element formation surface 30a, and is shared by each pixel 34 to supply a common potential to each light emitting element 33.

  That is, the light emitting element 33 is an organic electroluminescence element (organic EL element) formed by the anode Pc, the organic EL layer Oe, and the cathode Pa, and the inner diameter of the light emitting surface (organic EL layer Oe) is the first matching. It is formed with a radius R1.

On the upper side of the cathode Pa, a sealing portion P1 formed of a coating material such as a resin and preventing oxidation of various metal films and the organic EL layer Oe is formed.
When a driving current corresponding to the data signal is supplied to the anode line M2d, the organic EL layer Oe emits light with a luminance corresponding to the driving current. At this time, light emitted from the organic EL layer Oe toward the cathode Pa (upper side in FIG. 4) is reflected by the cathode Pa. Therefore, most of the light emitted from the organic EL layer Oe passes through the anode Pc, the second interlayer insulating film D2, the first interlayer insulating film D1, the gate insulating film D0, and the glass substrate 30, and the light extraction surface 30b. Irradiated to the side (photosensitive drum 16 side).

Next, the light extraction surface 30b side of the glass substrate 30 will be described below.
As shown in FIG. 3, the light extraction surface 30 b of the glass substrate 30 is formed with a recess 40 at a position facing each light emitting element 33. The recess 40 is a circular hole opened from the light extraction surface 30b toward the upper side in the vertical direction Z (on the photosensitive drum 16 side), and is formed such that its central axis is located on the central axis of the organic EL layer Oe. ing. The recess 40 is formed with a second alignment radius R2 having a depth of a distance Hd (see FIG. 4) and an inner diameter larger than the first alignment radius R1 of the organic EL layer Oe.

  An annular partition wall 41 is formed on the bottom surface 40a of each recess 40 as a positioning portion. The partition wall 41 is formed with a circular hole 42 at the center thereof. The circular hole 42 is formed so that the central axis thereof is located on the central axis of the organic EL layer Oe, and the inner diameter thereof is formed with the same first matching radius R1 as the inner diameter of the organic EL layer Oe. A micro lens 43 is formed in each recess 40 and in each circular hole 42. The microlens 43 is a convex lens having a sufficient transmittance with respect to the emission wavelength of the organic EL layer Oe (see FIG. 4).

  As shown in FIG. 4, the microlens 43 is an axial target lens having an optical axis A along the vertical direction Z, and is formed at a position facing the organic EL layer Oe when viewed from the optical axis A direction. Has been. The opening diameter of the microlens 43 is formed to be the same as the inner diameter of the circular hole 42 (organic EL layer Oe) of the partition wall 41, that is, the first alignment radius R1. Accordingly, the recess 40 is formed larger than the diameter of the microlens 43, and the circular hole 42 of the partition wall 41 is formed to have the same size as the diameter of the microlens 43. Thus, the light emitted from the organic EL layer Oe can be condensed and emitted to the light extraction surface 30b side without deteriorating the imaging performance in the peripheral portion of the microlens 43. Furthermore, as shown in FIG. 4, the microlens 43 has a distance between the apex of the lower curved surface (exit surface 43a) and the photosensitive layer 16a of the photosensitive drum 16 as an image-side focal length Hf of the microlens 43. I have to. That is, the microlens 43 positions the intersection (image-side focal point F) between the light beam (parallel light bundle L1) emitted from the organic EL layer Oe along the optical axis A and the optical axis A on the photosensitive layer 16a. It has become. As a result, the light emitted from the microlens 43 forms an exposure spot of a desired size on the photosensitive layer 16a.

  The emission surface 43 a of the microlens 43 is formed in a curved shape from the bottom surface 40 a of the recess 40. That is, the microlens 43 is close to the organic EL layer Oe side by the distance Hd from the light extraction surface 30b.

  Therefore, as shown in FIG. 5, the angle extending from the organic EL layer Oe on the optical axis A to the diameter of the microlens 43, that is, the opening angle θ1 is set when the microlens 43 is formed on the light extraction surface 30b. Compared with the opening angle θ2 (two-dot chain line 43i shown in FIG. 5), it increases by the distance Hd. When light in a predetermined wavelength region is emitted from the organic EL layer Oe, the microlens 43 collects light having a light amount corresponding to the opening angle θ1, and emits the light onto the photosensitive layer 16a to output the same photosensitive layer. 16a is exposed. As a result, the microlens 43 increases the amount of light for exposing the photosensitive layer 16a by an amount corresponding to the increase in the opening angle θ1.

(Exposure head manufacturing method)
Next, a method for manufacturing the exposure head 20 will be described below. 6 and 7 are explanatory diagrams for explaining a method of forming the recess 40.
As shown in FIG. 6, first, a sandblast masking agent Mk is applied to the entire surface of the light extraction surface 30 b of the glass substrate 30. Next, a circular hole Mh having an inner diameter of the second alignment radius R2 with the optical axis A as the center is patterned in the mask agent Mk. Subsequently, sand Sb such as an inorganic oxide is blown toward the light extraction surface 30b by a known sand blasting device, and the light extraction surface 30b (glass substrate 30) in the circular hole Mh is set to a predetermined depth (distance Hd). Scrape until. Then, the mask agent Mk is removed from the light extraction surface 30b. As a result, as shown in FIG. 7, a circular hole (concave portion 40) having an inner diameter of the second alignment radius R2 and a depth of distance Hd is formed on the light extraction surface 30b.

When the recess 40 is formed, subsequently, the pixel 34 is formed on the light emitting element formation surface 30a. FIG. 8 is an explanatory diagram for explaining a method of forming the pixel 34.
First, an amorphous silicon film is deposited on the entire surface of the light emitting element formation surface 30a by a CVD method using disilane or the like as a source gas. Next, the amorphous silicon film is irradiated with ultraviolet light by an excimer laser or the like to form a crystallized polysilicon film on the entire surface of the light emitting element formation surface 30a. Subsequently, the polysilicon film is patterned by a photolithography method, an etching method, or the like to form a channel film B corresponding to each recess 40.

  When the channel film B is formed, a gate insulating film D0 is formed by depositing a silicon oxide film or the like on the channel film B and the entire upper surface of the light emitting element formation surface 30a by a CVD method using silane or the like as a source gas. When the gate insulating film D0 is formed, a low-resistance metal film such as tantalum is deposited on the entire upper surface of the gate insulating film D0 by sputtering or the like, and the low-resistance metal film is patterned to form an upper side of the gate insulating film D0. A gate electrode Pg is formed. When the gate electrode Pg is formed, an n-type region (source region and drain region) is formed in the channel film B by an ion doping method using the gate electrode Pg as a mask. Subsequently, a light-transmitting transparent conductive film such as ITO is deposited on the entire upper surface of the gate electrode Pg and the gate insulating film D0 by sputtering or the like, and the transparent conductive film is patterned to form an upper surface of the gate electrode Pg. A gate wiring M1 is formed.

  When the gate wiring M1 is formed, a silicon oxide film or the like is deposited on the entire upper surface of the gate wiring M1 and the gate insulating film D0 by a CVD method using TEOS (tetraethoxysilane) or the like as a raw material to form a first interlayer insulating film D1. . When the first interlayer insulating film D1 is formed, a pair of circular holes (contact holes) that open from the source region and the drain region to the upper side of the first interlayer insulating film D1 along the vertical direction Z by a photolithography method, an etching method, or the like. H1, H2). When the contact holes H1 and H2 are formed, a metal film is deposited on the entire upper surface of the first interlayer insulating film D1 while filling the contact holes H1 and H2 with metal silicide or the like by sputtering or the like. Then, the metal film other than those in the contact holes H1 and H2 is removed by an etching method or the like to form the source contact Sc and the drain contact Dc.

  When each contact Sc, Dc is formed, a metal film such as aluminum is deposited on the entire upper surface of the contact Sc, Dc and the first interlayer insulating film D1 by sputtering or the like, and the metal film is patterned to form each contact Sc, Dc. A power supply line M2s and an anode line M2d connected to are formed. Next, a silicon oxide film or the like is deposited on the entire upper surface of the power supply line M2s, the anode line M2d, and the first interlayer insulating film D1 by a CVD method using TEOS (tetraethoxysilane) or the like as a raw material to form a second interlayer insulating film. D2 is formed. Subsequently, a circular hole (via hole Hv) that opens from a part of the anode line M2d along the vertical direction Z to the upper side of the second interlayer insulating film D2 is formed by photolithography or etching. When the via hole Hv is formed, a light-transmitting transparent conductive film such as ITO is deposited on the entire upper surface of the second interlayer insulating film D2 while being buried in the via hole Hv by sputtering or the like. Then, this transparent conductive film is patterned to form the anode Pc connected to the anode line M2d through the via hole Hv around the position facing the recess 40.

When the anode Pc is formed, a mask such as a resist is formed on the anode Pc at a position opposite to the recess 40, and photosensitive polyimide, acrylic, etc. are formed on the entire upper surface of the anode Pc and the second interlayer insulating film D2. A resin film is deposited. Then, the resist or the like is removed to form a third interlayer insulating film D3 having a partition D3a having a first matching radius R1. Next, when the third interlayer insulating film D3 is formed, droplets of the constituent material of the hole transport layer are ejected onto the anode Pc surrounded by the partition wall D3a by an inkjet method or the like, and the constituent material is dried and solidified. As a result, a hole transport layer is formed. Further, a droplet of the constituent material of the light emitting layer is ejected onto the hole transport layer by an inkjet method or the like, and the light emitting layer is formed by drying and solidifying the constituent material. Thus, the organic EL layer Oe including the hole transport layer and the light emitting layer whose inner diameter is the first matching radius R1 is formed.

  When the organic EL layer Oe is formed, a metal film such as aluminum is deposited on the entire upper surface of the organic EL layer Oe and the third interlayer insulating film D3 by sputtering or the like to form the cathode Pa. When the cathode Pa is formed, a sealing material P1 is formed by depositing a coating material such as resin on the entire upper surface of the cathode Pa by a CVD method or the like. As a result, as shown in FIG. 8, the pixel 34 including the light emitting element 33 is formed on the light emitting element forming surface 30 a at a position facing the recess 40.

When the pixel 34 is formed, the microlens 43 is subsequently formed in the recess 40. 9 and 10 are explanatory diagrams for explaining a method of forming the microlens 43. FIG.
First, the partition wall 41 is formed. As shown in FIG. 9, a formation layer 50 is formed in the recess 40 over the entire bottom surface 40a with a resist or the like. Next, a mask 51 made of resin or metal is formed on the entire upper side of the formation layer 50 and the light emitting element formation surface 30a. An exposure circular hole 52 corresponding to each recess 40 is formed in the mask 51 so as to penetrate therethrough. The exposure circular hole 52 has an inner diameter formed at the first alignment radius R1, and its central axis coincides with the central axis of the organic EL layer Oe. Then, the formation layer 50 is exposed through the exposure circular hole 52 and etched to form the circular hole 42 having the first alignment radius R1 in the formation layer 50 at a position opposite to the organic EL layer Oe. As a result, the partition walls 41 having the circular holes 42 are formed in the respective recesses 40 by the respective formation layers 50. Then, the mask 51 is removed from the formation layer 50 when the partition wall 41 is formed.

  Next, the microlens 43 is formed in the circular hole 42 of the partition wall 41 formed in this way by a liquid ejecting apparatus. Hereinafter, the configuration of the liquid ejecting apparatus for forming the microlens 43 will be described.

  As shown in FIG. 10, when the microlens 43 is formed, the liquid ejecting head 55 constituting the liquid ejecting apparatus is disposed above the light extraction surface 30 b of the glass substrate 30. The liquid jet head 55 is provided with a nozzle plate 57 on the lower side (light extraction surface 30 b side) of the base 56. A plurality of nozzles N are formed along the vertical direction Z on the nozzle forming surface 57a of the nozzle plate 57 (the surface opposite to the light extraction surface 30b). Each nozzle N communicates with a plurality of supply chambers 58 formed in the base 56, and is supplied with ultraviolet curable resin Pu from a storage tank (not shown) via each supply chamber 58. A vibration plate 59 is disposed on the upper side of the base 56 so as to face each supply chamber 58. The vibration plate 59 is reciprocally oscillated along the vertical direction Z to enlarge or reduce the volume in the supply chamber 58. Piezoelectric elements 60 that vibrate the vibration plate 59 by extending and contracting along the vertical direction Z are disposed above the vibration plate 59 and at positions opposite to the supply chambers 58.

The piezoelectric element 60 expands and contracts according to a drive signal input from a drive circuit (not shown), and enlarges / reduces the volume of the supply chamber 58 via the vibration plate 59. Then, by reducing the volume of the supply chamber 58, the ultraviolet curable resin Pu corresponding to the reduced volume is ejected as droplets Ds from each nozzle N, and conversely, by expanding the volume of the supply chamber 58, The UV curable resin Pu corresponding to the expanded volume is supplied into the supply chamber 58 from the storage tank. That is, the liquid ejecting head 55 ejects a predetermined capacity of the ultraviolet curable resin Pu from each nozzle N in accordance with the drive signal. Then, with respect to the liquid jet head 55 configured as described above, the glass substrate 30 has the light extraction surface 30b parallel to the nozzle formation surface 57a and the circular hole 42 of the partition wall 41 in each recess 40 at the center. Each axis is positioned so as to coincide with the central axis of the nozzle N.

Next, a method for forming the microlens 43 by the liquid ejecting apparatus described above will be described.
First, a drive signal is input from a drive circuit (not shown) to form the microlens 43 in the liquid ejecting head 55. Then, as shown in FIG. 10, the droplet Ds is ejected from each nozzle N of the liquid ejecting head 55 into the circular hole 42 of the partition wall 41 of the corresponding recess 40. The ultraviolet curable resin Pu injected into the circular hole 42 aggregates into a convex shape having a curved surface due to its surface tension or the like.

  When a predetermined capacity of the ultraviolet curable resin Pu is injected into the circular hole 42, ultraviolet light is irradiated into the circular hole 42 to cure the ultraviolet curable resin Pu that aggregates in the circular hole 42. As a result, the microlens 43 including the convex emission surface 43a having the opening diameter as the first matching radius R1 is opposed to the light emitting element 33 (organic EL layer Oe) through the glass substrate 30 and is placed in the recess 40. It is formed.

Next, effects of the present embodiment configured as described above will be described below.
(1) According to the present embodiment, the concave portion 40 having the second alignment radius R2 is formed on the light extraction surface 30b of the glass substrate 30 so as to have a width larger than the first alignment radius R1 of the inner diameter of the organic EL layer Oe. A partition wall 41 was formed in the recess 40 by a resist or the like. Then, after forming a circular hole 42 having an inner diameter of the first alignment radius R1 smaller than the second alignment radius R2 in the partition wall 41, the microlens 43 was formed in the circular hole 42. As described above, the partition wall 41 is formed by a resist (formation layer 50) having a high degree of freedom in the recess 40, and the microlens 43 is formed in the circular hole 42, thereby depending on the size of the radius of the recess 40. Therefore, the microlens 43 having a desired opening diameter (first alignment radius R1) can be accurately formed. In other words, since the restriction on the size of the recess 40 formed in the glass substrate 30 can be reduced, the load of the manufacturing process can be reduced. As a result, the exposure head 20 with high reliability can be easily manufactured, and the reliability of the printer 10 provided with the exposure head 20 can be improved.

  (2) In the present embodiment, the circular hole 42 of the partition wall 41 is formed so that the central axis coincides with the light emitting element 33, and the microlens 43 is formed in the circular hole 42. Since the partition wall 41 is made of a member having a high degree of freedom in forming a resist (formation layer 50) or the like, the circular hole 42 can be easily processed. Accordingly, when the concave portion 40 having the inner diameter of the first alignment radius R1 is formed on the glass substrate 30 and the microlens 43 is directly formed therein, or when the microlens formed by the replica method or the like is mounted in the concave portion 40 Compared to the above, the microlens 43 can be formed easily and accurately. Accordingly, the positional accuracy of the microlens 43 with respect to the light emitting element 33 can be improved, and the exposure head 20 (printer 10) reduces the variation in the amount of light for exposing the photosensitive layer 16a and emits light from the light emitting element 33. The extraction efficiency of the emitted light can be improved.

  (3) According to this embodiment, the microlens 43 is formed in the circular hole 42 of the partition wall 41 in the recess 40 formed in the glass substrate 30. The opening angle θ1 of the microlens 43 is increased by the distance Hd compared to the opening angle θ2 when the microlens 43 is formed on the light extraction surface 30b.

Therefore, the exposure head 20 (printer 10) can increase the amount of light for exposing the photosensitive layer 16a by the distance Hd, and can improve the extraction efficiency of the light emitted from the light emitting element 33.

  In addition, since the recess 40 is formed without reducing the thickness of the glass substrate 30 and the microlens 43 is formed in the recess 40, the glass substrate 30 can be made thicker by that amount, and the mechanical strength of the glass substrate 30 is increased. Can keep.

In addition, you may change the said embodiment as follows.
In the above embodiment, the shape of the partition wall 41 is formed in an annular shape. However, the shape is not limited to this, and may be appropriately changed as long as the positional accuracy of the microlens 43 with respect to the light emitting element 33 can be secured.
In the above embodiment, the transparent substrate is embodied as the glass substrate 30. However, the present invention is not limited to this, and may be a plastic substrate such as polyimide, which is a transparent substrate that transmits light emitted from the organic EL layer Oe. I just need it.
In the above embodiment, the pixels 34 are formed on the glass substrate 30. However, the present invention is not limited thereto, and the transparent substrate may be attached to the glass substrate 30 after the pixels 34 are formed on a separately provided transparent substrate.
In the above embodiment, the shape of the recess 40 is embodied as a circular hole. However, the shape is not limited to this, and the shape may be appropriately changed as long as the partition wall 41 can be formed in the recess 40.
In the above embodiment, the microlens 43 is formed by the liquid ejecting apparatus. However, the present invention is not limited to this. For example, the microlens 43 formed by the replica method or the like is attached to the circular hole 42 of the partition wall 41 in the recess 40. It may be.
In the above embodiment, the recess 40 is formed by the sand blast method. The method for forming the recess 40 is not limited to this. For example, laser processing using an excimer laser, a femtosecond laser, or the like may be used. Especially, as long as the recess 40 can be formed at a position facing the light emitting element 33. It is not limited.
In the above embodiment, the sandblast mask agent Mk is removed after the recess 40 is formed. By changing this, the mask agent Mk may be left on the light extraction surface 30b without being removed.
In the above embodiment, the inner diameter of the partition wall 41 and the opening diameter of the microlens 43 are matched with the first matching radius R1. For example, the inner diameter and the aperture diameter may be different from each other, and the light emitted from the organic EL layer Oe is condensed without deteriorating the imaging performance in the peripheral portion of the microlens 43. Any light spot that forms an exposure spot of a desired size on the light extraction surface 30b side may be used.
In the above embodiment, the microlens 43 is formed in a curved surface shape by the surface tension of the ultraviolet curable resin Pu. For example, the partition wall 41 is formed of a liquid-repellent resist such as a fluorine resin as a liquid-repellent member, and the ultraviolet curable resin Pu injected into the circular hole 42 forms a curved surface. You may do it. Further, for example, a liquid repellent material is applied to the surface of the partition wall 41 or a surface treatment such as CF ₄ plasma treatment is performed so that the ultraviolet curable resin Pu injected into the circular hole 42 forms a curved surface shape. Also good.
In the above embodiment, the micro lens 43 is embodied as a convex lens. However, the present invention is not limited thereto, and may be embodied as a concave lens, for example.
In the above embodiment, the microlens 43 is formed by the ultraviolet curable resin Pu. However, the present invention is not limited to this, and the microlens 43 may be formed by a thermosetting resin or the like.
In the above embodiment, each pixel 34 has one TFT 32. However, the present invention is not limited to this. For example, two or more TFTs 32 may be provided, or the TFT 32 may not be provided on the glass substrate 30. May be.
In the above embodiment, the electro-optical device is embodied as the exposure head 20. However, the present invention is not limited thereto, and may be a backlight mounted on a liquid crystal panel, for example, or includes a planar electron-emitting device, It may be a field effect display (FED, SED, etc.) using light emission of a fluorescent material by electrons emitted from the element.

1 is a schematic sectional side view showing a configuration of an image forming apparatus embodying the present invention. FIG. 2 is a schematic plan view showing a configuration of an exposure head of the image forming apparatus. Similarly, a schematic front sectional view showing a configuration of an exposure head. Similarly, the expanded sectional view which shows the structure of an exposure head. Similarly, a cross-sectional view illustrating the operation of the microlens of the exposure head. Similarly, the explanatory view explaining the manufacturing process of the exposure head. Similarly, the explanatory view explaining the manufacturing process of the exposure head. Similarly, the explanatory view explaining the manufacturing process of the exposure head. Similarly, the explanatory view explaining the manufacturing process of the exposure head. Explanatory drawing explaining the formation method of the micro lens by a liquid ejecting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Printer as image forming apparatus, 15 ... Intermediate transfer belt as transfer medium, 16 ... Photosensitive drum as image carrier, 17 ... Charging roller as charging means, 20 ... Electro-optical device constituting exposure means Organic EL array exposure head, 21 ... toner cartridge as developing means, 22 ... one transfer roller constituting transfer means, 26 ... secondary transfer roller constituting transfer means, 30 ... glass substrate as transparent substrate, 30a ... light Light emitting element forming surface as an incident surface, 30b... Light extraction surface, 33. Light emitting element as a light source, 40... Recessed portion, 41 .. Partition as positioning portion, 42... Circular hole, 43. Ds ... droplet, Oe ... organic EL layer as light emitting layer and EL layer, Pa ... cathode as back electrode, Pc ... through The anode as an electrode, R1 ... first matching radius which constitutes the diameter of the microlenses, the second matching radius as R2 ... width, T ... toner as colored particles, the main scanning direction as X ... one direction.

Claims (17)

In a transparent substrate that irradiates light from a light source, enters from the light incident surface side, and exits through a microlens provided on the light extraction surface side,
On the light extraction surface side,
A transparent substrate, wherein a concave portion having a width larger than the diameter of the microlens is formed, an annular positioning portion for positioning the microlens is provided in the concave portion, and the microlens is formed in the positioning portion. . The transparent substrate according to claim 1,
The transparent substrate is characterized in that the positioning portion includes a circular hole having an inner diameter opposite to the diameter of the microlens at a position facing the light source, and the microlens is formed in the circular hole. In the transparent substrate according to claim 1 or 2,
The microlens is a convex lens, and is a transparent substrate. In the method of manufacturing a transparent substrate, the light emitted from the light source is incident from the light incident surface side and emitted through the microlens provided on the light extraction surface side.
Forming a recess having a width larger than the diameter of the microlens on the light extraction surface;
In the recess, an annular positioning portion for positioning the microlens is formed,
A method for producing a transparent substrate, comprising: ejecting a droplet of a lens forming resin from a liquid ejecting apparatus into the annular positioning portion; and then solidifying the lens forming resin in the positioning portion to form the microlens. . In the manufacturing method of the transparent substrate according to claim 4,
A method for producing a transparent substrate, comprising: subjecting the surface of the positioning portion to surface treatment for repelling the droplet of the lens-forming resin, and then ejecting the droplet from the liquid ejecting apparatus into the positioning portion. In the manufacturing method of the transparent substrate according to claim 4,
The method of manufacturing a transparent substrate, wherein the positioning portion is composed of a liquid repellent member that repels the droplets of the lens forming resin. In an electro-optical device that emits light emitted from a light emitting element formed on a light emitting element forming surface of a transparent substrate via a microlens provided on a light extraction surface opposite to the light emitting element forming surface,
On the light extraction surface side,
An electro-optic characterized in that a recess having a width larger than the diameter of the microlens is formed, an annular positioning portion for positioning the microlens is provided in the recess, and the microlens is formed in the positioning portion. apparatus. The electro-optical device according to claim 7,
The electro-optical device, wherein the positioning unit includes a circular hole having an inner diameter opposite to the diameter of the microlens at a position facing the light emitting element, and the microlens is formed in the circular hole. . The electro-optical device according to claim 7 or 8,
The light-emitting element includes an electrode including a transparent electrode formed on the light extraction surface side, a back electrode formed opposite to the transparent electrode, and a light-emitting layer formed between the transparent electrode and the back electrode. An electro-optical device which is a luminescence element. The electro-optical device according to claim 9,
The electro-optical device is characterized in that the light emitting layer is formed of an organic material, and the electroluminescence element is an organic electroluminescence element. The electro-optical device according to any one of claims 7 to 10,
An electro-optical device, wherein a plurality of the light-emitting elements are respectively formed in the recesses arranged along one direction of the light-emitting element forming surface. The electro-optical device according to any one of claims 7 to 11,
The micro lens is a convex lens, and condenses light emitted from the light emitting element and emits the light from the light extraction surface. In a method for manufacturing an electro-optical device that emits light emitted from a light emitting element formed on a light emitting element forming surface of a transparent substrate via a microlens provided on a light extraction surface side opposite to the light emitting element forming surface ,
Forming a recess having a width larger than the diameter of the microlens on the light extraction surface;
In the recess, an annular positioning portion for positioning the microlens is formed,
A lens forming resin droplet is ejected from the liquid ejecting apparatus into the annular positioning portion, and then the micro lens is formed by solidifying the lens forming resin in the positioning portion. Method. The method for manufacturing an electro-optical device according to claim 13,
In the positioning portion, a circular hole having an inner diameter opposite to the diameter of the microlens is formed at a position facing the light emitting element,
A method of manufacturing an electro-optical device, wherein the microlens is formed by ejecting a droplet from the liquid ejecting device into the circular hole. The method of manufacturing the electro-optical device according to claim 13 or 14,
A method of manufacturing an electro-optical device, wherein the surface of the positioning portion is subjected to a surface treatment for repelling the droplet of the lens forming resin, and then the droplet is ejected from the liquid ejecting device into the positioning portion. . The method of manufacturing the electro-optical device according to claim 13 or 14,
The method of manufacturing an electro-optical device, wherein the positioning portion is formed of a liquid repellent member that repels the droplets of the lens forming resin. An exposure unit that exposes an outer peripheral surface of the image carrier charged by the charging unit to form a latent image; a developing unit that supplies colored particles to the latent image to develop a developed image; and the developed image In an image forming apparatus provided with a transfer means for transferring to a transfer medium,
An image forming apparatus comprising the electro-optical device according to any one of claims 7 to 12.

Images