JP2006130785A - Resin molding system and resin molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin molding system which can simultaneously heat, pressurize, and mold at least two resin moldings between heating/molding plates without using a large-scale press and a resin molding method. <P>SOLUTION: The resin molding system 11 for molding at least two resin moldings S2 simultaneously between the at least three piled heating/molding plates 14 is provided with a resin molding press 12 for molding the resin moldings S2 simultaneously between the heating/molding plates 14, a molding plate opening/closing apparatus 13 for opening/closing the piled heating/molding plates 14 outside the press 12, and moving apparatus 15 for moving the piled heating/molding plates 14 between the press 12 and the molding plate opening/closing apparatus 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin molding system and a resin molding method for simultaneously molding a plurality of resin molded products between thermoformed plates of at least three thermoformed plates stacked.

  As a resin molding press that simultaneously molds a plurality of resin molded products between the thermoformed plates of at least three or more thermoformed plates stacked, one described in Patent Document 1 is known. Patent Document 1 relates to a hot press in which a laminated material is disposed between hot plates, and the laminated material is pressurized and heated between the hot plates by moving the movable platen to obtain an integrated laminated body. However, in the hot press of Patent Document 1, since the movable platen is raised from the state where each hot plate is opened and the material to be laminated is pressed between the hot plates only by the cylinder device for pressurization, The cylinder device had to be provided with a large one requiring a large amount of hydraulic oil. As a result, there is also a problem that it takes a long time until the movable plate is raised.

  As what solves the said problem, what was described in patent document 2 is known. The hot press disclosed in Patent Document 2 is provided with both a movable platen driving unit that moves the movable plate toward the fixed platen and a hot plate pressurizing unit that pressurizes the hot plate, and the hot plate pressurizing unit has a small stroke. A small one can be used. However, the hot press of Patent Document 2 has a problem in that the movable platen driving means and the hot plate pressurizing means are separately provided, leading to an increase in cost. Further, both Patent Document 1 and Patent Document 2 have a structure in which a hot plate is opened in a hot press and a material to be laminated is carried in and out, and a space for carrying in and out is required between the hot plates. Therefore, there has been a problem that the structure of the hot press itself is enlarged.

In addition to the above, the one described in Patent Document 3 is known as a method for forming an IC card or the like by conveying a hot press plate between hot plates of a hot press apparatus. However, in Patent Document 3, the hot press plate itself does not have a heating means, nor does it simultaneously mold a plurality of resin molded products between the thermoformed plates of the thermoformed plates stacked at least three or more. . Therefore, it was not possible to efficiently mold a large amount of resin molded products simultaneously between hot plates.
JP 2000-94189 A (Claim 1, FIG. 1) JP 2002-59300 A (Claim 4, FIG. 1) JP 2002-301600 A (Claim 3, FIG. 8)

  The present invention has been made in view of the above-described problems, and a resin molding system capable of simultaneously heat-press-molding a plurality of resin molded products between respective thermoformed plates without using a large press device. And a resin molding method.

  The resin molding system according to claim 1 of the present invention is a resin molding system that simultaneously molds a plurality of resin molded products between the thermoformed plates of at least three or more thermoformed plates stacked between the thermoformed plates. A resin molding press device that simultaneously molds a plurality of resin molded products, a molded plate opening / closing device that opens and closes a stacked thermoformed plate outside the resin molding press device, and a resin molding press device and a molding plate opening / closing device. And a moving device for moving the stacked thermoformed plates.

  The resin molding system according to a second aspect of the present invention is the resin molding system according to the first aspect, wherein the stroke of the pressurizing mechanism of the resin molding press device is the sum of the distances between the thermoformed plates when the mold is opened in the molded plate opening / closing device. It is characterized by being smaller than the value.

  A resin molding system according to a third aspect of the present invention is the resin molding system according to the first or second aspect, wherein the thermoformed plate is provided with a cooling mechanism.

  A resin molding system according to a fourth aspect of the present invention is the resin molding system according to any one of the first to third aspects, wherein the thermoformed plate has a molding surface including a surface other than a flat surface on each opposing surface. It is characterized by.

  The resin molding system according to claim 5 of the present invention is the resin molding system according to claim 4, wherein the thermoformed plate has guide holes formed in portions different from the molding surface, and the guide bar is inserted into the guide hole. Positioning in a direction orthogonal to the pressing direction is performed.

  The resin molding system according to claim 6 of the present invention is the resin molding system according to claim 4 or 5, wherein the thermoformed plate is formed by forming an air passage toward the molding surface and supplying air to the air passage. The molded product is released from the mold.

  A resin molding system according to a seventh aspect of the present invention is the resin molding system according to any one of the fourth to sixth aspects, wherein the thermoformed plate has a surplus molding portion formed in a peripheral portion of the molding surface. Features.

  The resin molding method according to claim 8 of the present invention is a resin molding method in which a plurality of resin molded products are simultaneously molded between thermoformed plates of at least three or more thermoformed plates. After the resin material is supplied between the thermoformed plates outside the press molding resin press, the thermoformed plates are closed and stacked, and the stacked thermoformed plates are carried into the resin molded press device, and a plurality of resin molded It is characterized by molding the product at the same time.

  The resin molding method according to claim 9 of the present invention is that, in claim 8, the resin material supplied between the thermoformed plates is a conductive material containing carbon, and molds a fuel cell separator. Features.

  A resin molding system and a resin molding method according to the present invention include a resin that pressurizes a resin molded product in a resin molding system that simultaneously molds a plurality of resin molded products between the thermoformed plates of at least three or more thermoformed plates. After the resin material is supplied between the thermoforming plates outside the molding press device, the thermoforming plates are closed and stacked, and the stacked thermoforming plates are carried into the resin molding press device and pressurized to form a resin molded product. Therefore, a plurality of resin molded products can be simultaneously heated and pressed between each hot plate without using a large press device, and space saving and cost reduction of the press device can be achieved. .

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a resin molding system according to the present invention, and shows a state in which a thermoformed plate is opened in a molded plate opening / closing device. FIG. 2 is a front view of the resin molding system of the present invention, and shows a state where a thermoformed plate is carried into the resin molding press apparatus. FIG. 3 is a side view of the resin molding system of the present invention, and shows a state in which thermoformed plates are stacked in the molded plate opening / closing device. FIG. 4 is a cross-sectional view taken along the line AA in FIG. 1 and is a view for explaining the upper surface of the thermoformed plate. FIG. 5 is an enlarged vertical cross-sectional view of the main part of the molding plate opening / closing device in the resin molding system of the present invention when the movable plate is raised. FIG. 6 is an enlarged cross-sectional view of a main part showing a state of a thermoformed plate before molding and a thermoformed plate after molding in the resin molding system of the present invention. In FIGS. 2 and 3, a part of the member is notched.

  An outline of the resin molding system of this embodiment will be described with reference to FIGS. The resin molding system 11 is capable of simultaneously molding a large number of fuel cell separators, and includes a resin molding press device 12 and a molded plate opening / closing device 13. In the resin molding system 11, the thermoforming plate 14 is not always disposed in the resin molding press device 12 itself, and the thermoforming plate 14 is overlapped with the resin molding press device 12 and the molding plate opening / closing device 13. It is moved by the moving device 15 between them. In the resin molding system, the entire system or only the resin molding press apparatus may be installed inside a vacuum chamber (not shown).

  The resin molding press device 12 includes an upper fixing plate 16 made of a single plate shared with the molding plate opening / closing device 13 and a lower fixing plate facing a pressing device upper plate portion 17 which is a pressing device portion of the upper fixing plate 16. 19 is disposed. The press device upper platen portion 17 and the lower fixed platen 19 of the resin molding press device 12 have a large plate thickness so that distortion does not occur even under pressure. Four tie bars 20 are provided in the vicinity of the four corners of the upper plate portion 17 of the press device and in the vicinity of the four corners of the lower fixed plate 19 so as to support the upper plate portion 17 of the press device. A pressurizing cylinder device 21 as a pressurizing mechanism is disposed on the upper part 17 of the press device. The pressurizing cylinder device 21 is for pressurizing the thermoformed plate 14 in an overlapped state, and the ram 22 of the pressurizing cylinder device 21 is directed downward from the lower surface of the upper plate portion 17 of the press device. It is arranged. The pressing surface 23 of the ram 22 is a horizontal surface with no thermoforming plate 14 or the like fixed thereto. The outer shape of the pressing surface 23 of the ram 22 is larger than the outer shape of the molded fuel cell separator. In addition, the pressurization mechanism of the resin molding press apparatus may be disposed below the lower fixed platen and attached with a ram upward. The pressure cylinder device of the pressure mechanism is not limited to one. Furthermore, the pressurizing mechanism is not limited to the one using the cylinder device, and may be one using another pressurizing mechanism such as a combination of an electric motor and a toggle mechanism.

  The lower fixed platen 19 of the resin molding press device 12 is provided at a predetermined height. A hydraulic system that supplies hydraulic oil to the pressurizing cylinder device 21 and the like below the lower fixed platen 19, and the resin molding system 11. The control panel is stored. As shown in FIG. 2, the distance between the upper platen portion 17 and the lower fixed platen 19 of the press device of the upper fixed platen 16 is such that the overall height of the thermoformed plate 14 in the stacked state and the pressurizing cylinder device 21. The height of the ram 22 is calculated by adding the projecting dimension from the upper fixed platen 16 when the ram 22 is contracted and the stroke L1 of the ram 22. Therefore, the distance between the base plate including the upper fixing plate and the pressing device of a normal hot press as shown in Patent Document 1 is smaller, and the stroke L1 of the ram 22 of the pressurizing cylinder device 21 is also extremely small. ing. The upper surface 24 of the lower fixed platen 19 is flattened and has a plurality of holes formed at predetermined intervals, and a ball roller that reduces friction when moving the thermoformed plate 14 stacked in the holes. 25 are arranged respectively. The ball roller 25 is kept in a state in which a ball urged by a spring, which is an elastic body, slightly protrudes from the upper surface 24 of the lower fixed platen 19 at a normal time. When the ball of the ball roller 25 receives an external force of a predetermined level or more, the spring contracts and is inserted into the hole from the upper surface 24 of the lower fixed platen 19. The lower fixed platen 19 is provided with a guide positioning member 26 for positioning and guiding when the stacked thermoformed plate 14 is moved.

  Next, the thermoformed plate 14 will be described. In the present invention, the heat-molded plate 14 is composed of at least three or more, and is moved by the moving device 15 between the resin-molding press device 12 and the molded plate opening / closing device 13 in a stacked state. . 2 to 6, the lowermost thermoformed plate 14 includes a lower plate 27, a heat insulating plate 28 disposed on the lower plate 27, and a cartridge disposed on the heat insulating plate 28. It consists of a molded plate 30 with a built-in heater 29. The lower surface of the lower plate 27 in the lowermost thermoformed plate 14 is a flat surface, and is in surface contact with the upper surface 24 of the lower fixed platen 19 of the resin molding press device 12 during pressure molding. Therefore, the lowermost thermoformed plate 14 has a molding surface 31 as shown in FIG. 4 only on its upper surface. As shown in FIG. 6, the molding surface 31 of the thermoformed plate 14 of the present embodiment has an uneven shape having a portion different from the plane, unlike the hot plate of the lamination molding press. Specifically, the molding surface 31 has a concave shape, and includes a molding part 32 in which irregularities corresponding to the grooves of the fuel cell separator are formed, and an excessive part molding part 33 formed around the molding part 32. The periphery of the molding surface 31 including the surplus part molding portion 33 is a contact surface 58 formed of a flat surface. An air passage 34 is formed from the outside of the forming plate 30 toward the surplus portion forming portion 33. The air passage 34 is connected to a compressed air supply device through a flexible air pipe (not shown). Further, as shown in FIG. 4, the lowermost thermoformed plate 14 has guide holes 35 penetratingly formed in the vertical direction in the vicinity of the four corners of the contact surface 58 portion different from the molding surface 31. An intermediate thermoforming plate 14 is stacked on the lowermost thermoforming plate 14.

  The intermediate heat-formed plate 14 has a thickness of 50 mm as an example, and the length of the side in the same direction as at least the direction in which the formed-plate support pins 44 and 44 are opposed to the lowermost heat-formed plate 14. Slightly larger. In this embodiment, nine intermediate thermoforming plates 14 are disposed, and the upper intermediate thermoforming plate 14 has a slightly longer side. The intermediate thermoforming plate 14 has a cartridge heater 29 built therein, and a molding surface 31 including a surface other than a horizontal surface is formed on both surfaces of the lower surface and the upper surface of the intermediate thermoforming plate 14. In addition, a contact surface 58 is provided around the molding surface 31. Further, the molding surface 31 of the intermediate thermoforming plate 14 also includes a molding part 32 and an excess part molding part 33. An air passage 34 is formed from the outside of the intermediate thermoforming plate 14 toward the surplus portion forming portion 33, and the air passage 34 is connected to a compressed air supply device. The intermediate thermoformed plate 14 also has guide holes 35 penetratingly formed in the contact surface 58 at the same position as the lowermost thermoformed plate 14 in the vertical direction. The air passage may be formed so as to be opened only on either the upper surface or the lower surface of the thermoformed plate.

  The uppermost thermoformed plate 14 has a slightly longer side length in the same direction as the direction in which the formed plate support pins 44, 44 face each other than the uppermost thermoformed plate 14. Therefore, the lengths of the sides of all the thermoformed plates 14 are increased in order in the order of the upper hot plate. The uppermost thermoformed plate 14 includes an upper plate 36, a heat insulating plate 37 provided on the lower surface of the upper plate 36, and a formed plate 38 provided on the lower surface of the heat insulating plate 37 and incorporating the cartridge heater 29. ing. The thermoformed plate 14 has a molding surface 31 formed of a molding portion 32 and a surplus portion molding portion 33 only on the lower surface, and has a contact surface 58 around the molding surface 31. An air passage 34 is also formed from the outside of the forming plate 38 toward the surplus portion forming portion 33, and the air passage 34 is connected to a compressed air supply device. Four guide rods 39 are suspended in parallel downwardly at portions near the four corners of the contact surface 58 other than the molding surface 31 on the lower surface of the upper plate 36.

  The guide bar 39 is provided at the same position as the guide hole 35 of the lowermost thermoformed plate 14 and the guide hole 35 of the intermediate thermoformed plate 14, and can be inserted into each guide hole 35. As shown in FIG. 5, the length of the guide bar 39 is a predetermined dimension from the lower surface of the lower plate 27 in the lowermost thermoformed plate 14 when the guide rod 39 is inserted into the stacked thermoformed plate 14. The length is such that only L3 is inserted up to the top. As a result, in the resin molding press 12, even if the thermoformed plate 14 stacked by the ram 22 is compressed and the dimension in the height direction is reduced, the guide bar 39 is not brought into contact with the lower fixed platen 19. .

  In addition, the thermoformed plate 14 is provided with a uniform thickness at the portion of the contact surface 58. Therefore, when the thermoformed plates 14 are stacked and pressed and the contact surfaces 58 are brought into contact with each other, the lower surface of the lower plate 27 in the lowermost thermoformed plate 14 and the upper plate 36 in the uppermost thermoformed plate 14 are contacted. The upper surface is formed to be parallel. The area of the contact surface 58 is preferably at least about 33% to 75% of the area of the thermoformed plate 14 from the viewpoint of the parallelism and the strength of the thermoformed plate 14. In addition, as for the shaping | molding surface of a thermoforming board, either one of the molding surfaces which oppose may consist of a convex part, and it may be fitted by the other recessed part. Further, the molding surface is not limited to molding a single fuel cell separator. In addition, the size of each thermoformed plate is the same for all the molded plate portions including the abutting surface, and the thermoformed plate 14 is supported by attaching support claws having different protruding amounts to the side portions of the molded plate portion. You may do it.

  Further, the wiring 40 to the cartridge heater 29 of these thermoformed plates 14 is connected from a terminal box 41 disposed on the upper fixed platen 16, and the thermoformed plate 14 moves to the resin molding press device 12 or is molded. Even if the plate opening / closing device 13 is opened at a predetermined interval, the length can be accommodated. Moreover, the said wiring 40 uses a string-winding thing, and when the thermoforming board 14 is closed, slack is removed so that it may not be pinched | interposed between the thermoforming boards 14. FIG. The heating means for the thermoformed plate may be a resistance heating element other than the cartridge heater, or may be one that circulates a heat medium such as oil through a conduit inside the thermoformed plate.

  Next, the molded plate opening / closing device 13 will be described. The molding plate opening / closing device 13 provided adjacent to one side of the resin molding press device 12 is provided with a base plate 42 facing the opening / closing device upper plate portion 18 which is a molding plate opening / closing device portion of the upper fixed platen 16. Has been. Four struts 43 are provided between the four positions of the switchgear upper panel 18 and the four positions of the base panel 42 so as to support the switchgear upper panel 18. Holes are formed in the column 43 at predetermined intervals in the vertical direction, and molding plate support pins 44 that normally support the thermoforming plates 14 one by one are disposed in the holes. Therefore, the molding plate support pins 44 arranged on the four columns 43 can be placed on the molding plate support pins 44 one by one in the internal space of the molding plate opening / closing device 13. ing. The forming plate support pin 44 can be fixed by adjusting a dimension by which the forming plate support pin 44 protrudes from the support 43 toward the inner space inside by a double nut. And the molding plate support pin 44 protrudes and is fixed to the inner side from the support 43 longer as the lower molding plate support pin 44 so that the heating molding plate 14 is usually placed one by one. Further, four guide bars 45 are erected on the upper surface of the base board 42 in parallel upward. The guide rod 45 is a rod that is inserted into the guide hole 35 of the thermoformed plate 14 and is installed at the same position as the guide hole 35. As shown in FIG. 5, the front end surface of the guide bar 45 is opposed to the front end surface of the guide bar 39 suspended from the uppermost thermoformed plate 14 with a slight gap L4. ing.

  Further, two forming plate opening / closing cylinder devices 46 are arranged with the rods 47 facing downward at diagonal positions at the upper portion of the upper platen portion 18 of the upper fixed platen 16. As shown in FIGS. 1 and 4, the rod 47 of the cylinder device 46 for opening and closing the formed plate is provided on both sides of a movable plate 48 that can be moved up and down between the upper plate 18 of the switch device and the base plate 42. The brackets 49 are fixed to the respective surfaces. When the rod 47 of the molding plate opening / closing cylinder device 46 is contracted, the movable platen 48 is raised to the same height as the lower fixed platen 19 of the resin molding press device 12, and the base plate 42 is extended by extending the rod 47. Is lowered to a height close to. The movable platen 48 is a platen on which the stacked thermoformed plates 14 are placed, and the upper surface 50 of the movable platen 48 is planarly processed at predetermined intervals like the upper surface 24 of the lower fixed plate 19. A plurality of holes are formed, and ball rollers 25 are respectively disposed in the holes. Further, guide holes 51 through which guide bars 45 erected on the base board 42 are inserted are formed in the vicinity of the four corners of the movable board 48. The guide holes and guide rods of the thermoformed plate are provided with guide projections corresponding to guide rods with a length less than half of the thickness of the thermoformed plate on either the upper or lower surface of each molded plate. A guide hole through which the guide protrusion is inserted may be provided at the same position on the other surface.

  A wall portion 52 having a predetermined height is erected on one side (right side in FIG. 2) of the movable platen 48, and the moving device 15 for the stacked thermoformed plate 14 is placed outside the wall portion 52. A moving cylinder device 53 is provided. Further, guide members 55 are provided on both side surfaces of the movable platen 48 to prevent lateral displacement when the stacked thermoformed plates 14 are moved. The rod 54 of the moving cylinder device 53 is inserted through a hole formed through the wall 52 of the movable platen 48, and the engagement block 56 fixed to the tip of the rod 54 is in the lowermost thermoforming plate 14. Locked to the locking portion 57 of the lower plate 27. Specifically, as shown in FIG. 4, an L-shaped locking portion 57 in plan view is formed on one side surface of the lower plate 27 so as to face each other, and the rod 54 is interposed between the locking portions 57. When the engagement block 56 is locked, the lower plate 27 can move in the vertical direction with respect to the rod 54, and the locked state is maintained even when the rod 54 is retracted in the horizontal direction. ing. In addition, about the moving apparatus which moves the thermoformed board of the piled-up state, it is not limited to the cylinder apparatus for movement, You may move a thermoformed board with an electric device. Also, the ball roller that is provided on the lower fixed plate of the resin molding press device or the movable plate of the molding plate opening / closing device and reduces friction during movement of the thermoforming plate can be of other structures such as those using wheels. Good. Further, the guide positioning member can be appropriately applied such as a groove formed in the lower fixed platen.

  Next, the operation of the resin molding system 11 according to the present embodiment will be described with reference to FIGS. 1, 2, 3, and 6. In the resin molding system 11, as shown in FIG. 1, each thermoformed plate 14 is lowered in the molded plate opening / closing device 13 and each thermoformed plate 14 is placed on each molded plate support pin 44. As an example, a fuel cell separator resin sheet S1 made of a conductive material containing carbon and a binder made of a thermosetting resin is supplied to the molding surface 31 of the thermoformed plate 14 by the carry-in device. As shown in FIG. 6A, the supplied resin sheet S <b> 1 is supplied with a smaller outer shape than the molding portion 32 on the molding surface 31. And the plate | board thickness dimension of resin sheet S1 is larger than the dimension which added the depth of the molding surface 31 in the upper and lower thermoforming boards 14. FIG. At this time, the cartridge heater 29 of the thermoformed plate 14 is energized, and the thermoformed plate 14 is in a heated state.

  When the resin sheet S1 is supplied to the molding surface 31 of the heat-molded plate 14, the molding plate opening / closing cylinder device 46 of the molding plate opening / closing device 13 is operated to raise the movable platen 48. As the movable platen 48 rises, each thermoformed plate 14 starts to rise from the lowermost thermoformed plate 14, and when the lowermost thermoformed plate 14 comes into contact with the upper thermoformed plate 14, the thermoformed plate 14 14 and the heat-molded plate 14 stacked together are raised. At this time, as shown in FIG. 6A, the contact surfaces 58 of the thermoformed plate 14 are not completely in contact with each other. At this time, the intermediate and lowermost heat forming plates 14 are extracted from the guide rods 45 erected on the base board 42 as the heat forming plates 14 are raised, and are provided on the uppermost heat forming plate 14 instead. Since it is inserted through the guide bar 39, the thermoformed plate 14 is not displaced in the direction perpendicular to the moving direction when the mold is closed. When the rod 47 of the molding plate opening / closing cylinder device 46 is completely contracted, the height between the upper surface 50 of the movable platen 48 and the upper surface 24 of the lower fixed platen 19 in the resin molding press device 12 as shown in FIG. Are the same. Then, all the thermoformed plates 14 including the uppermost thermoformed plate 14 are overlaid on the movable platen 48.

  The cartridge heater of the thermoformed plate is not always energized / heated, and energization of the cartridge heater of the thermoformed plate is started almost simultaneously with the mold closing so that the thermoformed plate is heated from both sides. . When the entire resin molding system is installed in a vacuum chamber (not shown), the door is closed after the carry-in device is retracted, and pressure reduction in the vacuum chamber is started.

  Next, as shown in FIG. 2, the moving cylinder device 53 is operated and the side surface of the lower plate 27 is pressed by the engagement block 56 of the rod 54, so that the thermoformed plate stacked on the movable plate 48. 14 is moved toward the lower fixed platen 19 of the resin molding press 12 on the other side. At this time, the stacked thermoformed plates 14 are moved on the upper surface 50 of the movable platen 48 and the upper surface 24 of the lower fixed platen 19 by reducing the friction by the rotation of the ball roller 25. At this time, the stacked thermoformed plates 14 are moved while being guided by the side surfaces by the guide member 55 and the guide positioning member 26, and an L-shaped stop portion provided at the end of the guide positioning member 26. Is positioned at a predetermined position of the lower fixed platen 19 of the resin molding press 12.

  When positioning of the stacked thermoformed plate 14 on the lower fixed platen 19 is completed, the pressurizing cylinder device 21 of the resin molding press device 12 is then operated, the ram 22 is lowered, and the pressing surface 23 of the ram 22 is moved. The upper surface 36 of the uppermost thermoformed plate 14 is in surface contact with the upper surface 36 and presses the overlapped thermoformed plate 14 and the resin sheet S1 therebetween. The space formed between the lower surface of the lower plate 27 and the upper surface 24 of the lower fixed platen 19 in the lowermost thermoformed plate 14 by the ball roller 25 is pressurized so that the balls are in the lower fixed platen 19. The lower surface of the lower plate 27 and the upper surface 24 of the lower fixed platen 19 are brought into contact with each other. At this time, the lower plate 27 is lowered with respect to the rod 54 of the moving cylinder device 53. However, as described above, the lower plate 27 is provided so as to be movable in the vertical direction with respect to the rod 54. The lower plate 27 is lowered.

  And in the resin molding press apparatus 12, the pressure heating molding of the resin sheet S1 is performed via the thermoforming board 14 heated by the pressurizing cylinder apparatus 21 for a predetermined time. As shown in FIG. 6B, the resin sheet S <b> 1 is melted by being heated and pressurized during the molding, and the resin sheet S <b> 1 is filled to every corner of the molding portion 32 to be thin. The excess molten resin that cannot be filled in the molding part 32 flows to the surplus part molding part 33 formed in the peripheral part of the molding surface 31. The contact surfaces 58 of the upper and lower thermoforming plates 14 and 14 are brought into contact with each other by pressurization by the pressurizing cylinder device 21, and the state is continued until the heating and pressurization is completed, whereby the fuel cell separator S2 is reached. Are shaped by the molding surface 31 and are formed to have a uniform thickness. When the predetermined molding time is completed, the ram 22 of the pressurizing cylinder device 21 is raised, and the superimposed thermoformed plate 14 is released from pressurization. Then, the moving cylinder device 53 is actuated again, and the locking portion 57 of the lower plate 27 is pulled by the engagement block 56 of the rod 54, so that the thermoformed plate 14 is moved from the resin molding press device 12 to one side of the molded plate. It is carried out to the switchgear 13. In this case, it goes without saying that the movable platen 48 is waiting at the same position as the lower fixed platen 19.

  When the stacked thermoformed plates 14 are completely carried out onto the movable plate 48 of the molded plate opening / closing device 13, the moving cylinder device 53 is stopped and the molded plate opening / closing cylinder device 46 is operated so that the movable plate 48 is moved. Lower. And it mounts on the shaping | molding board support pin 44 one by one in an order from the uppermost one among the thermoforming boards 14 of the uppermost stage and the intermediate | middle thermoforming board 14, and finally the lowermost stage heating. The molding plate 14 is placed on the lowermost molding plate support pin 44. At that time, the lowermost and middle thermoformed plates 14 have guide rods 45 provided on the base board 42 from a state in which the guide holes 35 are inserted into the guide rods 39 provided on the uppermost thermoformed plate 14. Since the guide holes 35 are sequentially inserted into the inserted state, the thermoformed plate 14 is not displaced in the direction perpendicular to the moving direction when the mold is opened. Then, the thermoformed plates 14 are placed one by one on each of the formed plate support pins 44, whereby a take-out space is formed between the thermoformed plates 14. 3 is larger than the stroke L1 of the ram 22 of the resin molding press apparatus 12 shown in FIG. In other words, the stroke L1 of the pressurizing mechanism is smaller than the total value of the distances between the hot-formed plates 14 when the mold is opened and closed in the molded plate opening / closing device 13. As a result, in the present invention, the height of the resin molding press device 12 can be reduced. Therefore, in the present invention, the resin molding press apparatus can be mounted in a factory with a low ceiling, or it is not necessary to provide a pit on the factory floor and embed the ram of the resin molding press apparatus.

  Moreover, in this embodiment, air is supplied from the compressed air supply device through the air passage 34 formed toward the surplus portion molding portion 33 of the molding surface 31 of the heat-molded plate 14. The fuel cell separator S2 is released. Therefore, the fuel cell separator S2 does not stick to the molding surface 31 of the thermoformed plate 14. When the release of the fuel cell separator S2 is completed, when the resin molding system is disposed in the vacuum chamber, the pressure in the vacuum chamber is returned to atmospheric pressure, the door is opened, and the fuel cell separator is removed by a carry-out device (not shown). Take out S2. After the fuel cell separator S2 is taken out, the portion molded by the surplus portion molding portion 33 is cut by a cutting device to form a complete fuel cell separator.

  In this embodiment, the example using the resin material of the separator for a fuel cell made of the binder made of thermosetting resin and the conductive material containing carbon is described. However, the binder made of thermoplastic resin and the conductive material containing carbon are used. A fuel cell separator resin material may be used. In that case, it is desirable to use a thermoformed plate provided with a cooling mechanism in which a conduit for circulating a medium such as water is provided, and lower the temperature of the thermoformed plate in the latter half of the pressurizing step. Further, as a resin material supplied between the thermoformed plates, a powder material may be used instead of the resin sheet. In the case of powder material, the resin material can be supplied to both the groove portion and the convex portion of the molding surface of the thermoformed plate at a substantially uniform density. It is attached.

  Further, the resin molding system of the present invention is not limited to the fuel cell separator, but is a flat resin molded product including optical products such as a light guide plate and a light diffusion plate, a printed wiring board, an IC card, etc. It may be a laminate. The heat-molded plate is changed according to the molded product, and when a light guide plate or the like is molded, a stamper which is a transfer plate is attached. When molding a laminate such as a printed wiring board, a thermoformed plate is used as a mirror-formed plate, and a plurality of layers are laminated with another stainless steel plate or the like sandwiched between the thermoformed plate and the thermoformed plate. In some cases, an object is formed. However, when molding any molded product, the parallelism and thickness accuracy of the molded product can be improved if the heat-formed plate has a contact surface.

  Next, maintenance of the resin molding system 11 will be described. In the resin molding system 11, during molding continuously, resin residue adheres to the thermoformed plate 14, or the cartridge heater 29 of the thermoformed plate 14 breaks down, resulting in molding failure. There is. In such a case, it is necessary to stop the machine and perform maintenance of the thermoformed plate 14. When performing the maintenance, it is easier to perform the work if the space between the thermoformed plate 14 scheduled for maintenance and the other thermoformed plate 14 is wide open.

  In such a case, in the molded plate opening / closing device 13, the molded plate support pin 44 on which the heat molded plate 14 to be maintained is placed, and the molded plate support pin 44 below the same protrude from the column 43. It is possible to place several thermoforming plates 14 to be maintained directly on the lower forming plate support pins 44 or the lower thermoforming plate 14 by adjusting the dimensions to be shorter. Alternatively, several of the molding plate support pins 44 above the molding plate support pins 44 on which the thermoforming plate 14 scheduled for maintenance is placed cannot be mounted on the thermoforming plate 14 scheduled for maintenance, and By adjusting the length of the heat-formed plate 14 so that it can be placed long enough to be placed, the heat-formed plate 14 that is one above the heat-formed plate 14 that is scheduled to be maintained is formed by the above-mentioned several formed plates. It may be placed on the support pin 44. In any of the above cases, a large working space can be obtained above the thermoformed plate 14 scheduled for maintenance or below the uppermost thermoformed plate 14 scheduled for maintenance. Maintenance work of the plate 14 is facilitated. After the operation, the thermoforming plate 14 is pulled up by the molding plate opening / closing cylinder device 46, and the molding plate supporting pin 44 is returned to the original protruding dimension while the molding operation is being performed by the resin molding press device 12. deep.

  In the resin molding system of the present invention, one molding plate opening / closing device may be provided on each side of the resin molding press. In that case, the molding plate on the other side is moved simultaneously with or immediately after the movement of the heat-molded plate and the resin molded product in a state of being overlapped from the resin molding press device to the molding plate opening / closing device on one side after molding. Another heat-molded plate and resin material in a stacked state are brought into the resin molding press device from the switchgear. As a result, the waiting time of the resin molding press apparatus is almost eliminated. Furthermore, the resin molding system of the present invention can carry in / out the thermoformed plate to / from the resin molding press device by carrying in / out the thermoformed plate on which the thermoformed plate is stacked twice or more, and simultaneously pressurizing it. Good. In addition, the resin molding system of the present invention further reduces the thickness of the thermoformed plate. For example, about 30 thermoformed plates are stacked and pressed by a resin molding press to simultaneously mold a larger number of resin molded products. it can.

  Further, the present invention is not enumerated one by one, but is not limited to that of the above-described embodiment, and it goes without saying that the present invention can be applied to those modified by a person skilled in the art based on the gist of the present invention. That is.

It is a perspective view of the resin molding system of this invention, Comprising: It is a figure which shows the state by which the thermoforming board was mold-opened in the shaping | molding board opening / closing apparatus. It is a front view of the resin molding system of this invention, Comprising: It is a figure which shows the state in which the thermoforming board was carried in in the resin molding press apparatus. It is a side view of the resin molding system of this invention, Comprising: It is a figure which shows the state with which the thermoforming board was piled up in the shaping | molding board opening / closing apparatus. It is sectional drawing along the AA line of FIG. 1 in the resin molding system of this invention, Comprising: It is a figure which shows the upper surface of a thermoforming board. It is a principal part expansion longitudinal cross-sectional view at the time of the movable board raise of the shaping | molding plate opening / closing apparatus in the resin molding system of this invention. It is a principal part expanded sectional view which shows the state of the thermoforming board before shaping | molding in the resin molding system of this invention, and the thermoforming board after shaping | molding.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Resin molding system 12 Resin molding press apparatus 13 Molding plate opening / closing apparatus 14 Heating molding board 15 Moving apparatus 16 Upper fixed board 17 Press apparatus upper board part 18 Opening / closing apparatus upper board part 19 Lower fixed board 20 Tyba 21 Cylinder apparatus 22 Pressurization 23 Pressing surface 24, 50 Upper surface 25 Ball roller 26 Guide positioning member 27 Lower plate 28, 37 Heat insulating plate 29 Cartridge heater 30, 38 Molding plate 31 Molding surface 32 Molding portion 33 Surplus portion molding portion 34 Air passage 35, 51 Guide hole 36 Upper plate 39, 45 Guide rod 40 Wiring 41 Terminal box 42 Base board 43 Post 44 Molded plate support pin 46 Molded plate opening / closing cylinder device 47, 54 Rod 48 Movable platen 49 Bracket 52 Wall portion 53 Moving cylinder device 55 Guide member 56 Engagement block 57 Locking part 58 Surface L1 stroke L2 movement amount L3, L4 spacing S1 resin sheet S2 fuel cell separator

Claims (9)

In a resin molding system for simultaneously molding a plurality of resin molded products between each thermoformed plate of at least three or more thermoformed plates,
A resin molding press device that simultaneously molds a plurality of resin molded products between the thermoforming plates, a molding plate opening and closing device that opens and closes the stacked thermoformed plates outside the resin molding press device, and the resin molding A resin molding system comprising: a moving device that moves the superposed hot-formed plate between a press device and the formed-plate opening / closing device.   2. The resin molding system according to claim 1, wherein a stroke of the pressurizing mechanism of the resin molding press device is smaller than a total value of the distances between the thermoformed plates when the mold is opened in the molding plate opening and closing device.   The resin molding system according to claim 1, wherein the thermoformed plate is provided with a cooling mechanism.   4. The resin molding system according to claim 1, wherein each of the thermoformed plates has a molding surface including a surface other than a horizontal surface on each opposing surface. 5.   The said thermoforming board is positioned in the direction orthogonal to a pressurization direction by forming a guide hole in parts other than the said molding surface, respectively, and inserting a guide rod in the said guide hole. Resin molding system.   6. The resin molding system according to claim 4, wherein the thermoformed plate has an air passage formed toward the molding surface, and the resin molded product is released by supplying air to the air passage. .   The resin molding system according to any one of claims 4 to 6, wherein an extra portion molding portion is formed on a peripheral portion of the molding surface of the thermoformed plate. In a resin molding method of simultaneously molding a plurality of resin molded products between each thermoformed plate of at least three or more thermoformed plates,
After supplying the resin material between the thermoformed plates outside the resin molding press device that pressurizes the resin molded product, the thermoformed plates are closed and stacked,
A resin molding method in which the heat-molded plates in a stacked state are carried into the resin molding press and pressed to simultaneously mold a plurality of resin molded products.   The resin molding method according to claim 8, wherein the resin material supplied between the thermoformed plates is a conductive material containing carbon and molds a fuel cell separator.

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