JP2006128719A5 - - Google Patents
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- Publication number
- JP2006128719A5 JP2006128719A5 JP2006013478A JP2006013478A JP2006128719A5 JP 2006128719 A5 JP2006128719 A5 JP 2006128719A5 JP 2006013478 A JP2006013478 A JP 2006013478A JP 2006013478 A JP2006013478 A JP 2006013478A JP 2006128719 A5 JP2006128719 A5 JP 2006128719A5
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- mold
- molded body
- pressing
- concave portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006013478A JP4026659B2 (ja) | 2002-09-05 | 2006-01-23 | 側面発光型発光装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002259482 | 2002-09-05 | ||
JP2003133874 | 2003-05-13 | ||
JP2006013478A JP4026659B2 (ja) | 2002-09-05 | 2006-01-23 | 側面発光型発光装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003303932A Division JP3991961B2 (ja) | 2002-09-05 | 2003-08-28 | 側面発光型発光装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006128719A JP2006128719A (ja) | 2006-05-18 |
JP2006128719A5 true JP2006128719A5 (ko) | 2006-10-05 |
JP4026659B2 JP4026659B2 (ja) | 2007-12-26 |
Family
ID=36722979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006013478A Expired - Lifetime JP4026659B2 (ja) | 2002-09-05 | 2006-01-23 | 側面発光型発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4026659B2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009059870A (ja) * | 2007-08-31 | 2009-03-19 | Sanyo Electric Co Ltd | 発光モジュールおよびその製造方法 |
JP4683053B2 (ja) | 2008-01-28 | 2011-05-11 | 日亜化学工業株式会社 | 射出成形用金型及びこれによって成形される半導体パッケージ並びに半導体パッケージの製造方法 |
EP2244310B1 (en) * | 2008-02-08 | 2016-06-29 | Nichia Corporation | Light emitting device |
KR101562773B1 (ko) * | 2008-09-17 | 2015-10-22 | 서울반도체 주식회사 | 사이드뷰 led 패키지 및 그것의 몸체를 성형하기 위한 금형 세트 및 방법 |
JP6229479B2 (ja) | 2013-12-18 | 2017-11-15 | 豊田合成株式会社 | 面状光源および発光素子の製造方法 |
-
2006
- 2006-01-23 JP JP2006013478A patent/JP4026659B2/ja not_active Expired - Lifetime
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