JP2006128404A - Stacked piezoelectric element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked piezoelectric element in which the occurrence of impediment in the displacement of a stacked body and the disconnection of an external electrode can be suppressed through a simple arrangement. <P>SOLUTION: In the stacked piezoelectric element 1, a second external electrode 25 extends while waving along the laying direction and connected with a first external electrode 23 electrically and physically at a plurality of joints P. Since the second external electrode 25 exhibits stretching properties in the laying direction, the occurrence of impediment in the displacement of the stacked body 2 in the laying direction and disconnection of the second external electrode 25 can be suppressed. Furthermore, the structure of the piezoelectric element 1 can be simplified because an extremely simple member, e.g. a planar member extending while waving along the laying direction, is employed in the second external electrode 25 of the stacked piezoelectric element 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multilayer piezoelectric element.

As a conventional multilayer piezoelectric element, a multilayer body in which a plurality of piezoelectric bodies and a plurality of internal electrodes are alternately stacked, and an external part provided on the side surface of the multilayer body and electrically connected to a predetermined internal electrode The thing provided with the electrode is known (for example, refer patent documents 1-3). In the multilayer piezoelectric element described in Patent Document 1, the external electrode is formed so as to extend in the stacking direction of the multilayer body. In the multilayer piezoelectric element described in Patent Document 2, the external electrode is a mesh member made of a conductive wire, and is fixed to the side surface of the multilayer body with a conductive adhesive. In the multilayer piezoelectric element described in Patent Document 3, the external electrode is a coiled elastic member.
JP 2000-340849 A Japanese Patent Laid-Open No. 2001-210884 JP 2002-171003 A

  However, the multilayer piezoelectric elements described in Patent Documents 1 to 3 have the following problems.

  In the multilayer piezoelectric element described in Patent Document 1, since the entire external electrode extends in the stacking direction of the multilayer body, displacement (stretching operation) of the multilayer body in the stacking direction is hindered. Further, when the multilayer piezoelectric element is used for a long period of time, the external electrode may be disconnected without being able to withstand the expansion and contraction operation of the multilayer body.

  In the multilayer piezoelectric elements described in Patent Documents 2 and 3, the external electrode is a mesh member or a coiled elastic member, and can follow the expansion and contraction operation of the multilayer body. The occurrence of disconnection is suppressed. However, since a specially shaped member such as a mesh member or a coiled elastic member is employed for the external electrode, the configuration of the piezoelectric element becomes complicated.

  Therefore, the present invention has been made in view of such circumstances, and provides a multilayer piezoelectric element that can suppress the displacement of the multilayer body and the occurrence of disconnection of the external electrode with a simple configuration. With the goal.

  In order to achieve the above object, a multilayer piezoelectric element according to the present invention includes a multilayer body in which a plurality of piezoelectric bodies and a plurality of internal electrodes are alternately stacked, a side surface of the multilayer body, and a predetermined internal structure. A first external electrode electrically connected to the electrode, and a plate-like second external electrode provided outside the first external electrode and extending in a wave shape along the stacking direction of the stacked body, The first external electrode and the second external electrode are electrically and physically connected at a plurality of connection portions.

  In this multilayer piezoelectric element, the second external electrode extends in a wave shape along the stacking direction of the multilayer body, and is electrically and physically connected to the first external electrode at a plurality of connection portions. Yes. Thereby, since the second external electrode has elasticity in the stacking direction, the displacement of the stacked body in the stacking direction is smaller than that in which the entire external electrode extends in the stacking direction of the stacked body. Inhibition can be suppressed, and even when the piezoelectric element is used for a long period of time, the disconnection of the second external electrode can be suppressed. Moreover, even if the first external electrode provided on the side surface of the laminate is disconnected, the second external electrode is electrically and physically connected to the first external electrode at a plurality of connection portions. Therefore, a conduction path to a predetermined internal electrode is secured, and the function as a piezoelectric element is not impaired. Further, in this multilayer piezoelectric element, a very simple member such as a flat plate extending in a wave shape along the stacking direction of the multilayer body is employed for the second external electrode. The configuration of the piezoelectric element can be simplified as compared with a member having a special shape such as a member or a coiled elastic member.

  Further, the connecting portion is preferably positioned linearly on the second external electrode. At this time, the connecting portion has a central portion (a substantially central portion between the adjacent top portions of the second external electrode). More preferably). When the connection portion is thus positioned, the stretchability of the second external electrode in the stacking direction is maximized. Furthermore, it becomes easy to connect the first external electrode and the second external electrode when the piezoelectric element is manufactured.

  Moreover, it is preferable that the connection part is located in a staggered pattern on the second external electrode, and at this time, the connection part is more preferably located at the top of the second external electrode. When the connection portions are positioned in this way, the connection portions are separated from each other, so that the distance along the stacking direction between the adjacent top portions in the second external electrode can be shortened while preventing a short circuit. it can.

  The second external electrode preferably extends in a rectangular wave shape along the stacking direction. Thereby, manufacture of the 2nd external electrode becomes easy. At this time, the connection portion is located in the first portion along the stacking direction in the second external electrode, or the second section along the direction intersecting the stacking direction in the second external electrode. May be located in a part.

  Moreover, it is preferable that the first external electrode and the second external electrode are electrically and physically connected to each other by solder at the connection portion. This facilitates the connection between the first external electrode and the second external electrode when the piezoelectric element is manufactured. At this time, it is preferable that a solder insulating layer is formed on at least one of the outer surface of the first external electrode and the inner surface of the second external electrode, except at least a portion where the connection portion is located. Thereby, the first external electrode and the second external electrode can be electrically and physically accurately connected at a predetermined position by a predetermined amount of solder.

  According to the multilayer piezoelectric element of the present invention, it is possible to suppress the displacement of the multilayer body and the occurrence of disconnection of the external electrode with a simple configuration.

  Hereinafter, preferred embodiments of a multilayer piezoelectric element according to the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.

[First Embodiment]
As shown in FIGS. 1 and 2, the multilayer piezoelectric element 1 according to the first embodiment includes a multilayer body 2 having a polygonal column shape (in this case, a quadrangular column shape). The stacked body 2 has a first side surface 2a and a second side surface 2b which are positioned so as to be parallel to and opposed to each other in the stacking direction of the stacked body 2 (hereinafter simply referred to as “stacking direction”). .

  The laminated body 2 is configured such that the piezoelectric bodies 3 and the piezoelectric bodies 5 are alternately laminated, and further sandwiched between the piezoelectric bodies 7 and 9 from above and below. Each of the piezoelectric bodies 3, 5, 7, and 9 is made of, for example, a piezoelectric ceramic material mainly composed of lead zirconate titanate, and is formed in a rectangular thin plate shape. Here, the thickness of each piezoelectric body 3 and 5 is 50 to 100 μm.

  The stacked body 2 has a first internal electrode 11 and a second internal electrode 13. The first internal electrode 11 is formed on the upper surface of the piezoelectric body 3, and the second internal electrode 13 is formed on the upper surfaces of the piezoelectric bodies 5 and 9. Each of the internal electrodes 11 and 13 is made of, for example, a conductive material mainly composed of silver and palladium, and is patterned by screen printing. Here, the thickness of each internal electrode 11 and 13 is 0.5-5 micrometers.

  In the laminated body 2, the first internal electrode 11 and the second internal electrode 13 are laminated with the piezoelectric bodies 3 and 5 interposed therebetween. Thereby, in the multilayer body 2, the plurality of piezoelectric bodies 3 and 5 and the plurality of internal electrodes 11 and 13 are alternately stacked.

  The first internal electrode 11 is formed so as to be exposed to the first side surface 2a from the inner side than the second side surface 2b. That is, the end of the first inner electrode 11 on the second side surface 2b side is located a predetermined distance away from the second side surface 2b. The first internal electrode 11 is not exposed on the second side surface 2b.

  The second internal electrode 13 is formed so as to be exposed to the second side surface 2b from the inner side than the first side surface 2a. That is, the end of the second internal electrode 13 on the first side surface 2a side is located a predetermined distance away from the first side surface 2a. The second internal electrode 13 is not exposed on the first side surface 2a. The second internal electrode 13 is positioned so that a part thereof overlaps a part of the first internal electrode 11 when viewed from the stacking direction.

  External electrodes 21 are provided on the side surfaces 2 a and 2 b of the multilayer body 2. The external electrode 21 includes a first external electrode 23 and a second external electrode 25. The first external electrode 23 is formed so as to cover a part of each of the side surfaces 2a and 2b. The first external electrode 23 is made of, for example, a conductive material containing silver as a main component, and is patterned by screen printing. Here, the thickness of the first external electrode 23 is 1 to 40 μm.

  The first external electrode 23 formed on the first side surface 2a is electrically connected to the first internal electrode 11 exposed on the first side surface 2a on the first side surface 2a. The first external electrode 23 formed on the second side surface 2b is electrically connected to the second internal electrode 13 exposed on the second side surface 2b on the second side surface 2b.

  The second external electrodes 25 are disposed outside the first external electrodes 23 and extend in a wave shape along the stacking direction. The second external electrode 25 is made of a conductive material such as copper or an alloy thereof, nickel or an alloy thereof, stainless steel, or beryllium copper, and is formed in a flat plate shape. Here, the thickness of the second external electrode 25 is about 50 to 150 μm.

  The second external electrode 25 has a first portion 25a and a second portion 25b. The first portions 25a extend along the stacking direction and are discontinuously arranged in the stacking direction. The second portion 25b extends along a direction crossing the stacking direction (here, a direction orthogonal to the stacking direction), and connects the first portions 25a. Thus, the second external electrode 25 as a whole extends in a rectangular wave shape (that is, a pulse wave shape) along the stacking direction.

  As shown in FIG. 3, the second external electrode 25 is electrically and physically (that is, mechanically) connected to the first external electrode 23 discontinuously at the connection portion P located in each first portion 25 a. It is connected to the. That is, the second external electrode 25 is electrically and physically connected to the first external electrode 23 discontinuously at a plurality of connection portions P located in a staggered manner. Here, the distance along the stacking direction between adjacent connection portions P on the second external electrode 25 is 400 to 1000 μm. When the second external electrode 25 extends in a rectangular wave shape along the stacking direction, the first portion 25a is the top.

  As shown in FIG. 4, the second external electrode 25 is electrically and physically connected to the first external electrode 23 by solder 27 at each connection portion P. Here, the diameter of the solder 27 is about 100 to 200 μm. The first external electrode 23 and the second external electrode 25 may be connected to each connection portion P by spot welding or using a conductive adhesive.

  In the multilayer piezoelectric element 1 configured as described above, between the first external electrode 23 formed on the first side surface 2a and the first external electrode 23 formed on the second side surface 2b. When a voltage is applied, a voltage is applied between the first internal electrode 11 and the second internal electrode 13. Thereby, in the piezoelectric bodies 3 and 5, an electric field is generated in a portion sandwiched between the first internal electrode 11 and the second internal electrode 13, and the portion is displaced as an active portion.

  Next, a method for manufacturing the multilayer piezoelectric element 1 according to the first embodiment will be described.

  First, a base paste is prepared by mixing a piezoelectric ceramic material mainly composed of lead zirconate titanate with an organic binder, an organic solvent, or the like, and each of the piezoelectric layers 3, 5, 7, 9 is prepared using the base paste. A green sheet is formed. In addition, an organic binder, an organic solvent, or the like is mixed with a metal material (for example, silver: palladium = 7: 3) made of silver and palladium in a predetermined ratio to produce a conductive paste for forming an electrode pattern.

  Subsequently, an electrode pattern corresponding to the first internal electrode 11 is formed on the green sheet. Further, an electrode pattern corresponding to the second internal electrode 13 is formed on another green sheet. Each electrode pattern is formed by screen printing the above-described conductive paste.

  Subsequently, a green sheet on which an electrode pattern corresponding to the first internal electrode 11 is formed and a green sheet on which an electrode pattern corresponding to the second internal electrode 13 is formed are alternately stacked. A green sheet in which no is formed is laminated on the outermost layer to produce a laminate green. Here, the number of stacked green sheets is about 350 layers.

  Subsequently, while the laminate green is heated at a predetermined temperature (eg, about 60 ° C.) and pressed in the stacking direction at a predetermined pressure (eg, about 100 MPa), the laminate green is cut into a predetermined size. To do. The laminate green is cut by, for example, a diamond blade. As a result, the first internal electrode 11 is exposed on the first side surface 2a, and the second internal electrode 13 is exposed on the second side surface 2b.

  Subsequently, the laminate green is degreased (that is, debindered) at a predetermined temperature (for example, about 400 ° C.), and then fired at a predetermined temperature (for example, about 1100 ° C.) for a predetermined time (for example, about 2 hours). Thus, the laminate 2 is obtained.

  Subsequently, a conductive paste mainly composed of silver is screen-printed on each of the side surfaces 2a and 2b of the laminate 2, and then baked at a predetermined temperature (for example, about 700 ° C.) to form the first external electrode 23. To do. Note that a sputtering method, an electroless plating method, or the like may be applied to the formation of the first external electrode 23.

  Subsequently, the prepared second external electrode 25 is connected to the first external electrode 23 at each connection point P by soldering. The second external electrode 25 is obtained, for example, by performing tin plating on a stainless steel plate and processing it into a rectangular wave shape.

  Finally, polarization treatment (for example, applying an electric field for 3 minutes so that intensity | strength becomes 2 kV / mm in the environment of temperature 120 degreeC) is performed, and the laminated piezoelectric element 1 is obtained.

  As described above, in the stacked piezoelectric element 1 according to the first embodiment, the second external electrode 25 extends in a wave shape along the stacking direction, and the first connection is performed at the plurality of connection portions P. The external electrode 23 is electrically and physically connected. As a result, the second external electrode 25 has elasticity in the stacking direction, so that the entire external electrode extends in the stacking direction of the stack as compared to the stacking direction of the stack 2. Inhibition of the displacement can be suppressed, and even when the piezoelectric element 1 is used for a long period of time, the disconnection of the second external electrode 25 can be suppressed.

  Moreover, even if the first external electrodes 23 formed on the side surfaces 2a and 2b of the multilayer body 2 are disconnected, the second external electrodes 25 are electrically connected to the first external electrodes 23 at the plurality of connection portions P. The connection to the first internal electrode 11 and the conduction path to the second internal electrode 13 are secured, and the function as the piezoelectric element 1 is impaired. Absent.

  Furthermore, in the multilayer piezoelectric element 1 according to the first embodiment, a very simple member such as a flat plate extending in a wave shape along the stacking direction is employed for the second external electrode 25. The configuration of the piezoelectric element 1 can be simplified as compared with a case where a specially shaped member such as a mesh member or a coiled elastic member is used for the external electrode.

  In addition, the connection portions P where the first external electrode 23 and the second external electrode 25 are electrically and physically connected are located in a staggered manner in each first portion 25 a of the second external electrode 25. Therefore, the connection portions P are separated from each other. Accordingly, the distance along the stacking direction between the adjacent first portions 25a in the second external electrode 25 can be shortened while preventing a short circuit.

  Further, since the second external electrode 25 is a member extending in a rectangular wave shape along the stacking direction, the second external electrode 25 can be easily manufactured.

  Further, since the first external electrode 23 and the second external electrode 25 are electrically and physically connected to each other by the solder 27 at the connection portion P, the first external electrode 23 at the time of manufacturing the piezoelectric element 1 is used. And the second external electrode 25 are easily connected.

  In the multilayer piezoelectric element 1 according to the first embodiment described above, the connection portions P are located in a staggered manner in each first portion 25a of the second external electrode 25, but are shown in FIG. As described above, the connecting portion P may be positioned linearly in the central portion between the first portions 25a adjacent to each other in the second external electrode 25 (that is, the central portion of each second portion 25b). . When the connection portion P is thus positioned, the stretchability of the second external electrode 25 in the stacking direction is exhibited to the maximum. Furthermore, the connection between the first external electrode 23 and the second external electrode 25 during manufacture of the piezoelectric element 1 is facilitated.

[Second Embodiment]
The multilayer piezoelectric element 1 according to the second embodiment has the above-described first embodiment in that a resist is formed on the outer surface of the first external electrode 23 and the inner surface of the second external electrode 25. This is different from the multilayer piezoelectric element 1 according to the above. Hereinafter, the multilayer piezoelectric element 1 according to the second embodiment will be described focusing on the differences.

  As shown in FIG. 6, a resist (solder insulating layer) 29 is provided on the outer surface 23 a of the first external electrode 23 except at least a portion where the connection portion P is located (that is, a portion where the solder 27 is disposed). Is formed in a film shape. Similarly, a resist 29 is formed in a film shape on the inner surface 25c of the second external electrode 25 except at least a portion where the connection portion P is located (that is, a portion where the solder 27 is disposed). The first external electrode 23 and the second external electrode 25 are electrically and physically connected by solder 27 at each connection portion P. The resist 29 is, for example, an epoxy or acrylic resist.

  Next, a method for manufacturing the multilayer piezoelectric element 1 according to the second embodiment will be described. However, since the manufacturing process until obtaining the multilayer body 2 is the same as that of the multilayer piezoelectric element 1 according to the first embodiment, the subsequent manufacturing process will be described.

  A conductive paste mainly composed of silver is screen-printed on each of the side surfaces 2 a and 2 b of the manufactured laminate 2 and then baked at a predetermined temperature (for example, about 700 ° C.) to form the first external electrode 23. To do. Then, a resist 29 is formed on the outer surface 23a of the first external electrode 23 except at least a portion where the connection portion P is located.

  On the other hand, a plate material made of copper or an alloy thereof, nickel or an alloy thereof, stainless steel, beryllium copper, or the like is subjected to tin plating and processed into a rectangular wave shape to obtain a second external electrode 25. Then, a resist 29 is formed on the inner surface 25c of the second external electrode 25 except at least a portion where the connection portion P is located.

  Subsequently, a solder paste is filled and screen-printed on a portion where the connection portion P is located on the outer surface 23a of the first external electrode 23 using a metal mask.

  Subsequently, the portion where the connecting portion P is located on the outer surface 23a of the first outer electrode 23 and the portion where the connecting portion P is located on the inner surface 25c of the second outer electrode 25 are all matched. The alignment of the first external electrode 23 and the second external electrode 25 is performed. Then, the solder is heated and melted from the outside of the second external electrode 25 by a hot plate or the like, and the first external electrode 23 and the second external electrode 25 are electrically and electrically connected to each other by the solder 27 at each connection portion P. Connect physically.

  Finally, polarization treatment (for example, applying an electric field for 3 minutes so that intensity | strength becomes 2 kV / mm in the environment of temperature 120 degreeC) is performed, and the laminated piezoelectric element 1 is obtained.

  As described above, in the multilayer piezoelectric element 1 according to the second embodiment, at least the connection portion P is provided on the outer surface 23a of the first outer electrode 23 and the inner surface 25c of the second outer electrode 25. A resist 29 is formed except for the located portion. Thereby, the first external electrode 23 and the second external electrode 25 can be electrically and physically accurately connected by a predetermined amount of solder 27 at a predetermined position. Further, a solder plating process having a predetermined thickness can be applied to the solder connection portion of the second external electrode 25 in advance, and the solder can be connected as it is.

  In the multilayer piezoelectric element 1 according to the second embodiment described above, the resist 29 is formed on both the outer surface 23 a of the first external electrode 23 and the inner surface 25 c of the second external electrode 25. The resist 29 may be formed on either the outer surface 23 a of the first external electrode 23 or the inner surface 25 c of the second external electrode 25. Also in this case, compared to the case where the resist 29 is not formed on both sides, the first external electrode 23 and the second external electrode 25 are electrically and physically connected by a predetermined amount of solder 27 at a predetermined position. Can be connected accurately.

  The present invention is not limited to the first and second embodiments described above.

  For example, the shape of the laminated body 2 is not limited to a polygonal column shape, and may be a cylindrical shape. And the side surface in which the external electrode 21 is provided in the laminated body 2 is not limited to two side surfaces positioned so as to face each other, but may be two adjacent side surfaces. In addition, when the laminated body 2 is cylindrical, the external electrode 21 is provided in the arbitrary area | region of a side surface, if it is a position which does not contact mutually.

  Further, the second external electrode 25 is not limited to a rectangular wave extending along the laminating direction, and may be a triangular wave extending along the laminating direction as shown in FIG. Alternatively, as shown in FIG. 8, it may extend sinusoidally along the stacking direction. In these cases, the extreme value portion 25d where the width of the second external electrode 25 is maximum in the direction orthogonal to the stacking direction is the top.

  Further, the first internal electrode 11 may be exposed on the second side surface 2b as long as it is electrically insulated from the external electrode 21 provided on the second side surface 2b. Similarly, the second internal electrode 13 may be exposed to the first side surface 2a as long as it is electrically insulated from the external electrode 21 provided on the first side surface 2a.

1 is a perspective view of a multilayer piezoelectric element according to a first embodiment. It is a schematic diagram for demonstrating the cross-sectional structure of the lamination type piezoelectric element shown by FIG. It is a front view of the external electrode of the multilayer piezoelectric element shown in FIG. FIG. 2 is an enlarged schematic diagram for explaining a cross-sectional configuration of the multilayer piezoelectric element shown in FIG. 1. It is a front view which shows one modification of the position of the connection part in an external electrode. It is an expansion schematic diagram for demonstrating the cross-sectional structure of the laminated piezoelectric element which concerns on 2nd Embodiment. It is a front view which shows one modification of an external electrode. It is a front view which shows one modification of an external electrode.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Multilayer piezoelectric element, 2 ... Laminated body, 2a ... 1st side surface, 2b ... 2nd side surface, 3,5 ... Piezoelectric body, 11 ... 1st internal electrode, 13 ... 2nd internal electrode, 23 1st external electrode, 23a ... outer surface, 25 ... 2nd external electrode, 25a ... 1st part (top), 25b ... 2nd part, 25c ... inner surface, 25d ... extreme value part (top) , 27... Solder, 29... Resist (solder insulating layer), P.

Claims (10)

A laminate in which a plurality of piezoelectric bodies and a plurality of internal electrodes are alternately laminated;
A first external electrode provided on a side surface of the laminate and electrically connected to the predetermined internal electrode;
A flat plate-like second external electrode provided outside the first external electrode and extending in a wave shape along the stacking direction of the laminate,
The multilayer piezoelectric element, wherein the first external electrode and the second external electrode are electrically and physically connected at a plurality of connection portions.   The multilayer piezoelectric element according to claim 1, wherein the connection portion is linearly positioned on the second external electrode.   The multilayer piezoelectric element according to claim 2, wherein the connection portion is located at a central portion between adjacent top portions in the second external electrode.   The multilayer piezoelectric element according to claim 1, wherein the connection portions are staggered on the second external electrode.   The multilayer piezoelectric element according to claim 4, wherein the connection portion is located on a top portion of the second external electrode.   The stacked piezoelectric element according to claim 1, wherein the second external electrode extends in a rectangular wave shape along the stacking direction.   The multilayer piezoelectric element according to claim 6, wherein the connection portion is located in a first portion along the stacking direction in the second external electrode.   The multilayer piezoelectric element according to claim 6, wherein the connection portion is located in a second portion along a direction intersecting the stacking direction in the second external electrode.   The laminate according to any one of claims 1 to 8, wherein the first external electrode and the second external electrode are electrically and physically connected to each other by solder at the connection portion. Type piezoelectric element.   The solder insulating layer is formed on at least one of the outer surface of the first external electrode and the inner surface of the second external electrode except for at least a portion where the connection portion is located. Item 10. A laminated piezoelectric element according to Item 9.

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