JP2006128318A - Device and method of substrate processing information generating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing information generating device and a substrate processing information generation method which attain the increase in efficiency of formation of substrate processing information. <P>SOLUTION: On the basis of perforation arrangement information, a perforation component is arranged corresponding to the processing information of perforations. Substrate processing information is generated by disassembling a perforation component into the constituent elements. Efficient generation of substrate processing information facilitated by automatic arrangement of perforation components. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing information generation apparatus and a substrate processing information generation method for generating substrate processing information for perforation processing on a wiring board.

A printed wiring board is used to place and connect electronic components and the like. Here, there are cases where a plurality of printed wiring boards are formed on a single board and cut at the boundary between the plurality of printed wiring boards (so-called multi-sided design). At this time, perforations are formed on the substrate to facilitate cutting. A plurality of printed wiring boards can be obtained by breaking the board at the perforation.
A technique for improving the efficiency of perforation design has been disclosed (see Patent Document 1).
JP-A-7-282098

Drilling or the like by a processing device is used for forming perforations on the substrate. For this processing, substrate processing information (so-called CAM data) for processing the substrate by controlling the processing apparatus is required. This substrate processing information can be generated by registering a perforation as a kind of component in a database and placing it on a substrate on a computer screen.
However, if the perforation is manually arranged on the substrate, there is a possibility that a component selection error, a displacement of the arrangement, or the like occurs, or it takes time to generate the substrate processing information.
In view of the above, an object of the present invention is to provide a substrate processing information generation apparatus and a substrate processing information generation method that improve the efficiency of generation of substrate processing information.

  A substrate processing information generating apparatus according to the present invention includes a substrate graphic information storage unit that stores substrate graphic information representing a graphic of a wiring substrate to be perforated, and a plurality of components, and on the wiring substrate A perforation arrangement information storage unit that stores perforation arrangement information representing the arrangement of perforations as parts, perforation processing information as the parts, and perforation graphic information corresponding to the machining information A perforation part information storage unit for storing eye part information, and the perforation figure on the board figure represented by the board figure information based on the board figure information, the perforation arrangement information, and the perforation part information A board processing information generating unit that includes information on a perforated graphic represented by information and generates board processing information for perforating the wiring board. To.

  The substrate processing information generation method according to the present invention includes a plurality of components and a board that represents a figure of the wiring board based on perforation arrangement information that represents the arrangement of perforations as components on the wiring board. By synthesizing graphic information and perforation machining information as the part and perforation part information including perforation graphic information corresponding to the machining information, on the board graphic represented by the board graphic information Arranging the perforation graphic represented by the perforation graphic information; and disassembling the perforation corresponding to the synthesized perforation part information into the plurality of constituent elements, so that the wiring board is perforated. Generating substrate processing information for processing.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate process information generation apparatus and the board | substrate process information generation method which aimed at efficiency of generation | occurrence | production of board | substrate process information can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a block diagram showing a substrate processing information generation apparatus 10 according to an embodiment of the present invention.
The substrate processing information generation apparatus 10 can be configured by a computer, and includes an input unit 11, a perforation arrangement processing unit 12, a perforation disassembly processing unit 13, a display unit 14, a file input / output unit 15, a board graphic storage unit 21, and a sewing machine. An eye arrangement storage unit 22, a perforation part storage unit 23, and a substrate processing storage unit 24 are provided.

  The input unit 11 is an input device such as a keyboard and a mouse for inputting information for controlling operations performed by the substrate processing information generation device 10. From the input unit 11, for example, a substrate graphic file stored in the substrate graphic storage unit 21 and a perforation arrangement file stored in the perforation arrangement storage unit 22 are specified, and substrate processing information based on these files is specified. Instruction information for instructing generation is input.

Based on this instruction information, the perforation arrangement processing in the perforation arrangement processing unit 12 and the perforation decomposition processing in the perforation decomposition processing unit 13 are performed, and board processing information for perforating the wiring board is generated. And stored in the substrate processing storage unit 24.
These perforation arrangement processing and perforation disassembly processing are performed based on predetermined commands. Processing contents in the substrate processing information generation apparatus 10 are converted into commands, and information necessary for each command is stored in a database as additional information so that the processing in the substrate processing information generation apparatus 10 can be performed more flexibly. Become.
Examples of this command include “MOVE”, “FLAT”, “SAVE”.

“MOVE” corresponds to perforation arrangement processing, and means that perforations as components are arranged (or moved) on the wiring board.
The “component” here is not necessarily an electronic component itself, but means a general component arranged on a wiring board. Perforations are also treated as “components” as components of the board. This part can be created by grouping (grouping) a plurality of components. The component of the perforation as a component is essentially processing information for processing the wiring board, and is arranged relative to the reference coordinates of each component.

“FLAT” corresponds to the perforation disassembling process and means that the perforation as a component arranged on the wiring board is disassembled into its components. As a result, the grouping of the perforated components as parts is canceled, and each of the perforated components is directly arranged on the wiring board.
As described above, when the perforations are grouped into an integral part, the constituent elements are disposed relative to the reference coordinates of each part. When the perforation grouping is canceled, the constituent elements are arranged with respect to the reference coordinates of the wiring board.
In other words, the “FLAT” command cancels the grouping of the perforated components that had one group as a part, and the representation of the arrangement of the component is the wiring board from the relative coordinates based on the reference coordinates of the part. In other words, it is converted into absolute coordinates.
“SAVE” causes the substrate processing storage unit 24 to store substrate processing information generated by a series of processes.

  The perforation arrangement processing unit 12 is based on the perforation arrangement information stored in the perforation arrangement storage unit 22 and the board graphic information stored in the board graphic storage unit 21 and the perforation stored in the perforation part storage unit 23. By combining the eye part information, the perforation graphic represented by the perforation graphic information is arranged on the board graphic represented by the board graphic information.

In this perforation arrangement processing, a “MOVE” command and perforation arrangement information (for example, X coordinate, Y coordinate, angle) are used. Specifically, a command or the like is used as in (1) below.
MOVE Part name, X coordinate, Y coordinate, angle (1)
In this part name, X coordinate, Y coordinate, and angle, for example, characters such as CELL (part name), 0.0 (X coordinate), 1.0 (Y coordinate), and 90 (angle), numbers, and the like are inserted. It can be represented by text as shown in (2) (command record).
MOVE CELL, 0.0, 1.0, 90 (2)
Prior to the execution of this command, the text file (2) can be converted into a program that can be directly executed by a computer. Using commands as an intermediate language can provide versatility.

The perforation disassembly processing unit 13 disassembles perforations corresponding to the perforation part information synthesized by the perforation arrangement processing unit 12 into its constituent elements, thereby obtaining substrate processing information for perforating the wiring board. Generate.
The “FLAT” command is used for this perforation disassembly process.
The display unit 14 is a display unit such as a CRT or a liquid crystal display device, and displays a wiring board graphic corresponding to the board graphic information, a perforated part graphic corresponding to the perforated part information, and the like.
The file input / output unit 15 is input / output means or communication means for inputting / outputting board graphic information, perforation arrangement information, perforation part information, board processing information, etc. as a file, such as a CD-ROM drive or a communication device. is there.

The board graphic storage unit 21 stores board graphic information (outline drawing data) representing a state in which components such as perforations are arranged on the wiring board. The board graphic information is so-called CAD data, and the shape of the wiring board and components can be represented on the display unit 14 by a line drawing or the like.
FIG. 2 is a diagram illustrating an example of the wiring board 31 and the perforation 32 represented on the display unit 14 by the board graphic information.
A perforation 32 is disposed on the wiring board 31. The perforation 32 is divided into router processing portions 321, 325 and drill processing portions 323 to 324, and is formed by cutting the wiring board 31 with a router and a drill, respectively.

The perforation arrangement storage unit 22 stores perforation arrangement information indicating arrangement information (for example, arranged parts, X coordinates, Y coordinates, and angles) of parts such as perforations on the wiring board.
FIG. 3 is a schematic diagram illustrating an example of perforation arrangement information.
A part name (part identification information), an X coordinate, a Y coordinate, and an angle are represented correspondingly. That is, the position (X coordinate, Y coordinate) and direction (angle) arranged for each component are represented. The perforation arrangement information can be output from other systems.

The perforation part storage unit 23 stores perforation part information representing information on the constituent elements of the perforation as a part. A plurality of perforated parts can be registered in advance in the perforated part storage unit 23, and can be appropriately called and arranged.
The perforation part information includes position information of each component with respect to a reference position of a perforation as a part and information for processing. This perforation part information is used to control a processing apparatus that processes the wiring board. The perforation part information is also used to display the perforation as a part on the display unit 14.

FIG. 4 is a diagram illustrating a perforation 41 displayed on the display unit 14 according to perforation part information.
This perforation 41 has router processing portions 411, 415, and drill processing portions 412 to 414 as constituent elements, and corresponds to the perforation 32 shown in FIG.
These components are represented by relative coordinates (X coordinate, Y coordinate) with respect to the reference coordinates of the perforation 41, and element information such as processing means and processing contents, and are displayed on the display unit 14 based on this element information. The That is, the element information has both the characteristics of processing information for controlling the processing apparatus and graphic information for display on the display unit 14. However, it is also possible to completely separate the information in the perforated part information into machining information and graphic information. In both cases where the machining information and graphic information are separated or merged (can be used in common for machining and graphic display), both the machining information and graphic information exist in the perforated part information.

The processing information corresponding to the router processing units 411 and 415 includes, as element information, that the processing means is a router, the diameter of the router, and the position information of the end point and start point of the router processing in each. Among these, a circular shape is drawn on the display unit 14 corresponding to the diameter of the router and the position of the end point (or start point). Since the router processing parts 411 and 415 displayed by the perforation part information correspond to the processing information of the router processing parts 321 and 325, there is an apparent difference.
Each piece of machining information corresponding to the drill machining units 412 to 414 includes, as element information, that the machining means is a drill, the diameter of the drill, and the position information of each drilling. Among these, a circular shape is drawn on the display unit 14 corresponding to the diameter and position of the drill.

The substrate processing storage unit 24 stores substrate processing information representing information for processing the wiring substrate.
The board processing information includes graphic information for displaying the shape of the wiring board in addition to the processing information for controlling the processing of the wiring board, which is generated from the board graphic information, perforation arrangement information, and perforation part information. Contains.
FIG. 5 is a schematic diagram illustrating an example of display contents displayed on the display unit 14 by the substrate processing information. The shape of the board represented by the board graphic information and the perforated part represented by the perforated part information are superimposed. Perforations are represented by both perforations 32 and 41. The arrangement of the perforations 41 on the substrate 31 is performed based on the perforation arrangement information. Note that the router machining portions 411 and 415 and the drill machining portions 412 to 414 which are constituent elements of the perforation 41 are released from grouping.
The substrate processing information includes both processing information for controlling the processing of the substrate and graphic information representing the shape of the substrate after processing, for both human confirmation of the shape of the substrate after processing and control of the processing apparatus. It is possible to use.

(Operation of the substrate processing information generating apparatus 10)
The operation of the substrate processing information generation apparatus 10 will be described.
FIG. 6 is a flowchart showing an example of an operation procedure of the substrate processing information generation apparatus 10.
(1) Instruction input for generating substrate processing information (step S11)
Information for instructing generation of substrate processing information is input from the input unit 11. The board graphic file stored in the board graphic storage unit 21 and the perforation arrangement file stored in the perforation arrangement storage unit 22 are specified by a file name and the like, and the substrate processing information is generated based on these files. Instruct.

(2) Confirmation of input (steps S12 and S13)
It is determined whether or not the board graphic file having the inputted name is stored in the board graphic storage unit 21 (step S12). If there is no board graphic file with the input name, an error is output and generation of board processing information is stopped (step S14).
If there is a board graphic file with the input name, it is determined whether the perforation layout file with the input name is stored in the perforation layout storage unit 22 (step S13). If there is no perforation layout file with the input name, an error is output and generation of the substrate processing information is stopped (step S14).

(3) Reading and checking perforation arrangement file (steps S15 and S16)
The perforation arrangement file is read line by line (step S15), and it is determined whether the perforation part file having the part name in the read perforation arrangement file is stored in the perforation part storage unit 23 (step S16). . If there is no perforated part file with the input name, an error is output and generation of the substrate processing information is stopped (step S14).

(4) Arrangement of perforated parts on the substrate (step S17)
A perforation component as processing information is arranged on the wiring board 31 (where a perforation 32 as shape information is arranged). This arrangement is performed by the perforation arrangement processing unit 12 based on the perforation arrangement information.

(5) Confirmation of end of perforation arrangement file (EOF) (step S18)
Check if the perforation file is at the end. If it is not the end, the process returns to step S15, and reading of the next line of the perforation arrangement file is repeated.

(6) Disassembly / writing of perforated parts (steps S19 and S20)
If it is determined in step S18 that the perforation arrangement file is over, the grouping of the perforation parts is canceled and the constituent elements are arranged on the wiring board (step S19). As a result, a substrate processing file is generated, and this substrate processing file is stored in the substrate processing storage unit 24 (step S20).

In the present embodiment, artificial mistakes such as selection perforations on the perforations, additional leakage, and misalignment can be avoided by automatically arranging the perforations on a substrate on which a plurality of wiring boards are multi-faced.
Also, by making each operation a dedicated command and registering it, more flexible processing becomes possible and versatility is improved. The determination and creation of this command can be performed either during the processing in FIG. 6 or prior to the processing. Recording a sequence of commands corresponding to a series of processes in a file facilitates automatic execution of the series of processes.

(Other embodiments)
Embodiments of the present invention are not limited to the above-described embodiments, and can be expanded and modified. The expanded and modified embodiments are also included in the technical scope of the present invention.
For example, the above embodiment is mainly directed to the arrangement of perforations, but is not limited to the perforations, and can be applied to the arrangement of other components (components of the board), so that the number of work steps can be reduced.

It is a block diagram showing the board | substrate process information generation apparatus which concerns on one Embodiment of this invention. It is a figure showing an example of the wiring board and perforation which are represented on a display part by board graphic information. It is a schematic diagram showing an example of perforation arrangement information. It is a figure showing the perforation displayed on a display part by perforation part information. It is a schematic diagram showing an example of the display content displayed on a display part by board | substrate process information. It is a flowchart showing an example of the operation | movement procedure of a board | substrate process information generation apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Board | substrate process information generation apparatus, 11 ... Input part, 12 ... Perforation arrangement | positioning process part, 13 ... Perforation disassembly process part, 14 ... Display part, 15 ... File input / output part, 21 ... Board figure memory | storage part, 22 ... Perforation arrangement storage unit, 23 ... perforation component storage unit, 24 ... substrate processing storage unit, 31 ... wiring board, 32, 41 ... perforation

Claims (5)

A board graphic information storage unit for storing board graphic information representing a figure of a wiring board to be perforated;
A perforation arrangement information storage unit for storing perforation arrangement information representing arrangement of perforations as a part on the wiring board having a plurality of components;
Perforation part information storage unit for storing perforation part information including perforation processing information as the part and perforation graphic information corresponding to the processing information;
Based on the board graphic information, the perforation arrangement information, and the perforation part information, information on the perforation graphic represented by the perforation graphic information is arranged on the board graphic represented by the board graphic information. And a substrate processing information generating unit that generates substrate processing information for perforating the wiring substrate;
A substrate processing information generating apparatus comprising: The substrate processing information generating unit
By synthesizing the board graphic information and the perforation part information based on the perforation arrangement information, the perforation graphic represented by the perforation graphic information is formed on the board graphic represented by the board graphic information. A perforation arrangement processing unit to be arranged;
The substrate processing information generating apparatus according to claim 1, further comprising: a perforation disassembly processing unit that disassembles the perforation corresponding to the synthesized perforation part information into the plurality of components. The perforation part information includes relative position information of the component with respect to a reference position of the perforation and information on processing means corresponding to the component.
The substrate processing information generating apparatus according to claim 1. The board processing information includes relative position information of the component with respect to a reference position of the wiring board and information of processing means corresponding to the component.
The substrate processing information generating apparatus according to claim 1. Based on perforation arrangement information indicating a perforation arrangement as a part on the wiring board having a plurality of components, the board graphic information representing the figure of the wiring board, and the perforation as the part The perforation represented by the perforated graphic information on the board graphic represented by the board graphic information by combining the machining information and perforated part information including perforated graphic information corresponding to the machining information Placing a figure,
Generating board processing information for perforating the wiring board by disassembling the perforation corresponding to the synthesized perforation part information into the plurality of components;
A substrate processing information generation method comprising:

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