JP2006127483A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card capable of mounting many IC chips thereon, allowing a switching part to be easily rotated, and being manufacturable at a low cost. <P>SOLUTION: This IC card is provided with: a switching part having a switching part body 3a piercing a card substrate 1 and rotatably mounted thereon, and a plurality of contact pats 3b mounted so as to extend in a direction vertical with respect to the rotation axis of the switching part body; and a plurality of IC chips 2a-2d; and is so structured that a plurality of connection terminals of one of the plurality of IC chips 2a-2d are electrically connected to the plurality of contact parts 3b via wires. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card, and more particularly to an IC card on which a plurality of IC chips are mounted.

2. Description of the Related Art Conventionally, an IC card that realizes multiple functions by providing a plurality of IC chips on an IC card has been developed. In such an IC card, a switching unit in which a plurality of IC chips are provided on the IC card is provided, and by rotating the switching unit, the external connection terminal of a desired IC chip is positioned at a predetermined position. The function can be selected (see Patent Document 1).
JP 2003-331245 A

  However, in the conventional IC card on which a plurality of IC chips are mounted, there is a problem that the number of IC chips to be mounted is limited because each IC chip needs to be provided in the switching unit. In addition, since it is necessary to form an external connection terminal on each IC chip, there is a problem that the cost is increased.

  Furthermore, since the conventional IC card is configured to rotate the switching unit by hooking a finger, there is a problem that it is difficult to rotate the switching unit with a thin and small IC card.

  The present invention has been made in view of the above circumstances, and provides an IC card on which many IC chips can be mounted and the switching unit can be easily rotated and can be manufactured at low cost. Objective.

  Therefore, first, in order to achieve the above object, the first invention includes a card base, a switching unit main body penetrating and rotating with respect to the card base, and the switching unit main body. A switching unit having a plurality of contact portions attached so as to extend in a direction perpendicular to the rotation axis, and a plurality of IC chips, and a plurality of connections of one IC chip among the plurality of IC chips The terminal and the plurality of contact portions are IC cards that are selectively connected via wiring by rotating the switching portion.

  In addition, the second invention is a card base, a light emitting element provided inside the card base, and a light receiving element that is provided inside the card base and receives light from the light emitting element and performs photoelectric conversion. A switching unit main body penetrating the card base material and rotatably provided with respect to the card base material, and attached so as to extend in a direction perpendicular to the rotation axis of the switching unit main body, One of the plurality of IC chips in accordance with the voltage detected by the switching unit having a light blocking unit that blocks light emitted from the IC, the external connection terminal of the IC card, the plurality of IC chips, and the light receiving element A switch circuit that selects a chip and electrically connects the external connection terminal to a connection terminal of the selected IC chip, and the selection of the IC chip is performed by rotating the switching unit and the light shielding unit. In Ri IC card amount to block light from the light emitting element is characterized in that is carried out by being adjusted, it is.

  According to the present invention, it is possible to provide a multi-function IC card that can mount many IC chips, can easily rotate the switching portion, and can be manufactured at low cost.

  Hereinafter, an IC card according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a top view of a contact IC card according to an embodiment of the present invention. In the figure, detailed structures such as wiring are omitted. 2 is a cross-sectional view taken along the line AA ′ in FIG. 1, FIG. 3 is a cross-sectional view taken along the line BB ′ in FIG. 2, and FIG. 4 is a diagram for explaining the connection relationship between the IC chip and the switching unit. FIG. 6 is a diagram for explaining the switching portion, and FIG. 6 is a diagram for explaining the structure of the contact portion of the switching portion.

  IC cards 2a to 2d that provide various functions are embedded in the card substrate 1 formed of an insulating material. These IC chips 2a to 2d provide a multi-function IC card.

  In the present embodiment, four IC chips 2a to 2d will be described as an example, but the number of IC chips is not limited to this. For example, an IC chip in which four IC chips are combined into one may be used.

  The size of the card substrate 1 is 85.6 mm in the long side, 53.97 mm in the short side, and 0.78 mm in thickness according to the ISO / JIS standard. The arrangement positions of the external connection terminals 4 are a maximum of 10.25 mm from the left end of the card and a maximum of 19.23 mm from the upper end of the card surface.

  In addition, the card base 1 is provided with a switching unit 3 that penetrates from the front surface to the back surface and is rotatable with respect to the card base 1. The switching unit 3 includes a switching unit main body 3a and a contact unit 3b.

  As shown in FIG. 5, the switching unit main body 3a is formed of an insulating material and is formed in multiple layers along the rotation shaft 21, and a contact portion 3b is provided between the switching unit main bodies 3a. The switching unit main body 3a penetrates the card base 1 and is provided to be rotatable around the rotation shaft 21.

  The contact part 3b is attached to the switching part main body 3a so as to extend in a direction perpendicular to the rotation shaft 21 of the switching part main body 3a. The contact portion 3b is formed in multiple layers at a predetermined interval along the rotation shaft 21 of the switching portion main body 3a, and is provided between the switching portion main bodies 3a formed in multiple layers.

  As shown in FIGS. 5 and 6, the contact portion 3 b is formed of an insulating material, and a conductive layer 31 is formed on the front and back surfaces thereof. The conductive layer 31 connects the switching unit 3 to the wirings 11 a to 11 d from the IC chips 2 a to 2 d and the wiring 12 from the external connection terminal 4.

  The conductive layer 31 is formed with respect to the rotating shaft 21, and one conductive layer 31 is electrically connected to the wirings 11a to 11d from the IC chips 2a to 2d, and the other conductive layer 31 is external. Electrical connection is made with the wiring 12 from the connection terminal 4.

  Although the case where the conductive layer 31 is formed on the axis has been described in the present embodiment, the shape of the conductive layer may not be the axis target, and one conductive layer 31 may be the wiring 11a from the IC chips 2a to 2d. The other conductive layer 31 may be formed so as to be electrically connected to the wiring 12 from the external connection terminal 4.

  FIG. 4 is a diagram for explaining the connection between the IC chip and the switching unit.

  Although FIG. 4 shows the connection relationship between the wiring 11a from the IC chip 2a and the switching unit 3, the same wiring configuration is adopted for the other IC chips 2b to 2d. The wiring 11a from the IC chip 2a is electrically connected by contacting the conductive layer 31 formed on the front surface and the back surface of the contact portion 3b. In this way, the wiring from the IC chip is three-dimensionally arranged and electrically connected to the contact part 3b of the switching unit 3, thereby making it possible to widen the wiring space and, as a result, to make the IC chip space wide. be able to.

  FIG. 4 shows the case where the IC chip 2a has six terminals and six wirings, but when the number of terminals is ten, the remaining four wirings are electrically connected to other contact portions. It is possible to connect. By providing the contact portion 3b in multiple layers and the conductive layer 31 on the front and back surfaces thereof, it is possible to deal with an IC chip having a large number of terminals.

  As shown in FIG. 3, by rotating the switching unit 3, any one of the IC chips 2 a to 2 d can be electrically connected to the switching unit 3.

  7 and 8 are diagrams for explaining the wiring between the switching unit 3 and the external connection terminal 4 of the contact type IC card.

  The conductive portion of each contact portion of the switching unit 3 and the wiring 12 are electrically connected, and the wiring 12 is connected to each terminal of the external connection terminal 4. As a result, one of the IC chips 2 a to 2 d is electrically connected to the external connection terminal 4 via the switching unit 3.

  In this embodiment, the contact type IC card has been described as an example. However, it is needless to say that the present invention can also be applied to a non-contact type IC card and a contact type / and non-contact type common IC card. .

  9 and 10 are diagrams for explaining wiring between the switching unit and the antenna in the non-contact type IC card.

  The conductive portion of each contact portion of the switching unit 3 and the wiring 12 are electrically connected, and the wiring 12 is connected to each terminal of the antenna 41. As a result, one of the IC chips 2 a to 2 d is electrically connected to the antenna 41 via the switching unit 3.

  FIG. 11 is a diagram for explaining wiring between the switching unit, the antenna, and the external connection terminal in the contact / non-contact type IC card.

  The conductive portion of each contact portion of the switching unit 3 and the wiring 12 are electrically connected, and the wiring 12 is connected to each terminal of the external connection terminal 4 and each terminal of the antenna 41. As a result, one of the IC chips 2 a to 2 d is electrically connected to the external connection terminal 4 and the antenna 41 via the switching unit 3.

  Therefore, according to the IC card according to the embodiment of the present invention, since the IC chips 2a to 2d are provided on the card base 1 without being provided in the switching unit 3, many IC chips can be mounted, and as a result. A multi-function IC card can be realized.

  Further, by forming the conductive layer 31 on the front and back surfaces of the contact portion 3b of the switching portion 3 and forming the contact portions 3b in multiple layers, a large wiring space can be secured and a large number of IC chips are mounted. It becomes possible.

(Other embodiments)
FIG. 12 is a top view of an IC card according to another embodiment of the present invention. In addition, the same code | symbol is attached | subjected and demonstrated to the same part as FIG. In the figure, detailed structures such as wiring are omitted. 13 is a cross-sectional view taken along line AA ′ of FIG.

  In the present embodiment, a contact type IC card will be described. However, for a non-contact type IC card, it is assumed that an antenna is connected to the external connection terminal 4 as shown in FIG.

  IC cards 2a to 2d that provide various functions are embedded in the card substrate 1 formed of an insulating material. These IC chips 2a to 2d provide a multi-function IC card.

  In the present embodiment, four IC chips 2a to 2d will be described as an example, but the number of IC chips is not limited to this. For example, an IC chip in which four IC chips are combined into one may be used.

  The size of the card substrate 1 is 85.6 mm in the long side, 53.97 mm in the short side, and 0.78 mm in thickness according to the ISO / JIS standard. The arrangement positions of the external connection terminals 4 are a maximum of 10.25 mm from the left end of the card and a maximum of 19.23 mm from the upper end of the card surface.

  The card base 1 is provided with a switching unit 51 that penetrates from the front surface to the back surface and is rotatable with respect to the card base 1. The switching unit 51 includes a switching unit main body 51a and a light shielding unit 51b.

  A portion of the switching portion main body 51a that penetrates the card base 1 is cylindrical, and a disk portion having a diameter larger than that of the cylinder is formed at the upper and lower portions. The switching unit 51 is fixed to the card base 1 by the upper and lower disk portions of the switching unit main body 51a. Further, the user can rotate the switching unit 51 with respect to the card base 1 by pinching the front and back disk portions of the IC card of the switching unit main body 51a.

  A light shielding part 51b for shielding light from a light emitting element (EL element) is attached around the switching part main body 51a. The light-shielding part 51b is mounted concentrically around the switching part main body 51a, and is attached so as to extend in a direction perpendicular to the rotation axis.

  FIG. 14 is a diagram illustrating the switching unit main body and the light shielding unit. The light-shielding part 51b has a shape in which a part of the disk is cut out. When the cut-out part is located below the light-emitting element 61 provided inside the card base 1, the light-emitting element 61 The generated light is shielded. That is, by adjusting the rotation of the switching unit 51, it is possible to adjust the amount of light passing from the light emitting element 61.

  Note that the shape of the light shielding portion is not limited to that shown in FIG. 14, and may be a shape in which the amount of light generated from the light emitting element 61 can be adjusted by rotating the switching portion 51. That's fine.

  FIG. 15 is a diagram illustrating another shape of the light shielding portion. As shown in the figure, the light shielding portion 51 in this case is formed with a plurality of through holes 52 along the circumferential direction for allowing light generated from the light emitting elements to pass through in a disk shape. Thus, by providing a margin (play) compared to the configuration shown in FIG. 14 in relation to the rotation amount of the switching unit 51 and the light shielding amount, switching of the IC chip based on the detection voltage described later is performed. It can be done more accurately.

  The light emitting element 61 is planarly formed inside the card base 1 and is formed, for example, by evaporating the light emitting element on the card base 1. The light emitting element 61 is connected to the power line of the external connection terminal 4, and power is supplied from the power line. In the case of a non-contact type IC card, power is supplied by an induced current from an antenna connected to the power line of the external connection terminal.

  A hole is formed in the lower part of the light emitting element 61, and the light generated from the light emitting element 61 passes through the hole and corresponds to the light emitting element 61 on the bottom inside the card substrate 1. Light is received by the formed solar cell (light receiving element) 62. The solar cell 62 is planarly formed at the bottom inside the card base 1 and is formed, for example, by evaporating a light receiving element on the card base 1. 16 is a diagram showing the light emitting element viewed from the B-B ′ direction in FIG. 13, and FIG. 17 is a diagram showing the solar cell (light receiving element) viewed from the C-C ′ direction in FIG. 13.

  FIG. 18 is a diagram showing an electrical connection relationship of the IC card according to the embodiment of the present invention.

  The light emitting element 61 is connected to the power line of the external connection terminal 4, and the solar cell 62 that receives light generated from the light emitting element 61 is connected to the switch circuit 63.

  Further, wiring from the external connection terminal 4 to the IC chip is connected to the switch circuit 63, and the external connection terminal 4 is connected to the IC chip 2 a to 2 based on the voltage received and photoelectrically converted by the solar cell 62. It is connected to any one of 2d.

  Various configurations of such a switch circuit 63 can be considered by those skilled in the art. An example of the switch circuit 63 is shown in FIG.

  As shown in the figure, the voltage photoelectrically converted by the solar cell 62 is applied to the comparators 71a to 71d having different threshold values. Here, it is assumed that the threshold values increase in the order of the comparators 71a to 71d.

  The output of the comparator 71a is connected to the input of the AND circuit 72a. The output of the comparator 71b is connected to the input of the AND circuit 72a via the NOT circuit 73a and directly connected to the input of the AND circuit 72b.

  The output of the comparator 71c is connected to the input of the AND circuit 72b via the NOT circuit 73b and directly connected to the input of the AND circuit 72c. The output of the comparator 71d is connected to the input of the AND circuit 72c via the NOT circuit 73c and directly connected to the switch 74d.

  The outputs of the AND circuits 72a to 72c are connected to the switches 74a to 74c. The switches 74a to 74d connect the wiring from the external connection terminal 4 to the IC chips 2a to 2d based on control signals from the AND circuits 72a to 72c and the comparator 71d, respectively. With such a configuration, any one of the IC chips 2 a to 2 d can be selectively connected to the external connection terminal 4 based on the output voltage from the solar cell 62.

  FIG. 20 is a diagram showing the relationship between the output voltage of the solar cell and the selected IC chip.

  Here, it is assumed that the threshold values of the comparators 71a to 71d are v1 to v4, respectively. As shown in the figure, the IC chip is selected according to the output voltage v of the solar cell. In the present embodiment, the output voltage from the solar cell is adjusted by rotating the switching unit 51, thereby adjusting the amount of light generated from the light emitting element 61 by the light shielding unit 51 b, and the IC chips 2 a to 2. 2d selection can be made.

  In the figure, no IC chip is selected when the output voltage v of the solar cell is smaller than the threshold voltage v1 of the comparator 71a. When the output voltage v is larger than the threshold voltage v1 of the comparator 71b and smaller than the threshold voltage v2 of the comparator 71b, the IC chip 2a is selected and is larger than the threshold voltage v2 of the comparator 71b. When it is larger and smaller than the threshold voltage v3 of the comparator 71c, the IC chip 2b is selected, and is larger than the threshold voltage v3 of the comparator 71c and smaller than the threshold voltage v4 of the comparator 71d. In this case, the IC chip 2c is selected, and if it is larger than the threshold voltage v4 of the comparator 71d, the IC chip 2d is selected.

  Therefore, according to the embodiment of the present invention, in addition to the above-described effect that many IC chips can be mounted, switching of the IC chip is performed using the light emitting element and the light receiving element. In comparison with the method of switching, the life is not deteriorated by wear.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

It is a top view of the contact type IC card concerning an embodiment of the invention. It is A-A 'sectional drawing of FIG. FIG. 3 is a B-B ′ sectional view of FIG. 2. It is a figure for demonstrating the connection relation of the wiring of an IC chip and a switching part. It is a figure for demonstrating a switching part. It is a figure for demonstrating the structure of the contact part of a switching part. It is a figure for demonstrating the wiring between the switching part and external connection terminal in a contact-type IC card. It is a figure for demonstrating the wiring between the switching part and external connection terminal in a contact-type IC card. It is a figure for demonstrating the wiring between the switching part and antenna in a non-contact-type IC card. It is a figure for demonstrating the wiring between the switching part and antenna in a non-contact-type IC card. It is a figure for demonstrating the wiring between the switching part, an antenna, and an external connection terminal in a contact / non-contact shared type IC card. It is a top view of the IC card which concerns on other embodiment of this invention. It is A-A 'sectional drawing of FIG. It is a figure which shows the switch part main body and the light-shielding part. It is a figure which shows the other shape of a light-shielding part. It is a figure which shows the light emitting element seen from the B-B 'direction of FIG. It is a figure which shows the light receiving element seen from the C-C 'direction of FIG. It is a figure which shows the electrical connection relationship of the IC card which concerns on embodiment of this invention. It is a figure which shows an example of a switch circuit. It is a figure which shows the relationship between the output voltage of a solar cell, and the IC chip selected.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Card base material, 2a-2d ... IC chip, 3 ... Switching part, 3a ... Switching part main body, 3b ... Contact part, 4 ... External connection terminal, 11a-11d, 12 ... Wiring, 21 ... Rotating shaft, 31 ... Conductive layer, 41 ... antenna, 51 ... switching unit, 51a ... switching unit body, 51b ... light shielding unit, 61 ... light emitting element, 62 ... solar cell (light receiving element), 63 ... switch circuit

Claims (14)

A card substrate;
A switching unit having a switching unit main body penetrating the card substrate and rotatably provided, and a plurality of contact units attached to extend in a direction perpendicular to the rotation axis of the switching unit main body. When,
A plurality of IC chips,
A plurality of connection terminals of one IC chip of the plurality of IC chips and the plurality of contact portions are selectively connected via wiring by rotating the switching portion. IC card.   2. The IC card according to claim 1, wherein the card base is made of an insulating material.   2. The IC card according to claim 1, wherein the plurality of contact portions are formed in multiple layers with a predetermined interval with respect to the rotation axis direction.   2. The IC card according to claim 1, wherein a conductive layer is formed on a front surface and a back surface of the contact portion and is electrically connected to two wirings on the front surface and the back surface.   The IC card according to claim 4, wherein the conductive layers formed on the front surface and the back surface of the contact portion are electrically connected to external connection terminals of the IC card, respectively.   The IC card according to claim 4, wherein the conductive layers formed on the front surface and the back surface of the contact portion are electrically connected to an antenna of the IC card.   7. The IC card according to claim 5, wherein the conductive layers formed on the front surface and the back surface of the contact portion are formed symmetrically about the rotation axis of the switching portion main body. The switching unit body is
Having a plurality of multilayer insulation members;
The IC card according to claim 1, wherein the contact portion is provided between the insulating members. A card substrate;
A light emitting element provided inside the card substrate;
A light receiving element that is provided inside the card substrate and receives light from the light emitting element to perform photoelectric conversion;
A switching unit main body penetrating the card base material and rotatably provided with respect to the card base material, and attached so as to extend in a direction perpendicular to a rotation axis of the switching unit main body and emitting light from the light emitting element A switching unit having a light shielding unit for blocking the light,
IC card external connection terminal,
A plurality of IC chips;
A switch circuit that selects one of the plurality of IC chips according to the voltage detected by the light receiving element, and electrically connects the external connection terminal to the connection terminal of the selected IC chip. And
The IC card is selected by rotating the switching unit and adjusting the amount of light blocked from the light emitting element by the light blocking unit.   The IC card according to claim 9, wherein power of the light emitting element is supplied from the external connection terminal.   The IC card according to claim 9, wherein the power source of the light emitting element is supplied by an induced current from an antenna of the IC card connected to the external connection terminal.   The IC card according to claim 9, wherein the light receiving element is a solar battery.   The switching unit main body has a cylindrical shape, and the light shielding unit is attached to the periphery of the switching unit main body, and has a disk shape having a notch for allowing light from the light emitting element to pass therethrough. The IC card according to claim 9.   The switching unit main body has a cylindrical shape, and the light shielding unit is attached to the periphery of the switching unit main body, and has a disk shape having a plurality of passage holes for allowing light from the light emitting element to pass therethrough. The IC card according to claim 9.

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