JP2006120971A - Heat dissipation cabinet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve heat dissipation effect of a heat generator without enlarging the size of a heat dissipation cabinet. <P>SOLUTION: The housing has a thermal diffusion body 23 installed in contact with a lower surface of the heat generator 21, and a housing 25 for housing the thermal diffusion body 23 and the heat generator 21 in contact with the outer side surface, that is, the lower surface and the side edge face of the thermal diffusion body 23. A refrigerant path 27 wherein refrigerant such as cooling water flows is formed in the bottom 31 of the housing 25, and a heat pipe 29 is formed in the inside of a side 33 or the like of the thermal diffusion body 23 and the housing 25. Heat dissipation is carried out effectively while diffusing heat to both of an axial direction of a heat pipe 29 and an apposition direction of a plurality of the heat pipes 29, by making the refrigerant path 27 cross the heat pipe 29. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat radiating housing that stores a heat generating element such as a semiconductor device while radiating heat.

  In recent years, high-power electric motors have been installed in electric vehicles such as hybrid vehicles and fuel cell vehicles. An electric motor in an automobile operates in an alternating current and drives the motor via an inverter.

  This inverter uses a semiconductor device such as a power MOSFET, and since this semiconductor device operates at a high speed, the amount of heat generated must be large. And in order to prevent the malfunction of the semiconductor device which is a heat generating body, heat dissipation is very important.

  In order to efficiently dissipate heat generated by such a semiconductor device, a heat dissipating case having a structure capable of dissipating heat has been installed on the semiconductor device.

  FIG. 7 is a schematic bottom sectional view showing a conventional heat radiating case, and FIG. 8 is a schematic side sectional view showing the heat radiating case in which a heating element is housed. In the example shown in FIGS. 7 and 8, a heat diffusion material 3 such as a copper alloy having high thermal conductivity is placed in contact with a heating element 1 such as a power MOSFET, and a heat radiating housing 5 is in contact with the heat diffusion material 3. Installed. The heat radiating housing 5 also functions as a protective case for housing the heat generating element 1 and the heat diffusing material 3, and includes a bottom portion 7, a side portion 8, and a top portion 9. And especially in the bottom part 7 with a large contact area with the heat-diffusion material 3, the refrigerant | coolant path | route 11 through which refrigerant | coolants, such as cooling water, flows is formed inside.

  In such a configuration, when the heating element 1 generates heat, the heat is transmitted to the heat diffusing material 3, and the heat of the heat diffusing material 3 is transmitted to the heat radiating housing 5. At this time, the refrigerant flows through the refrigerant path 11 in the bottom portion 7 of the heat radiating casing 5, and the refrigerant introduced into the refrigerant path 11 from the refrigerant supply port 13 of the refrigerant path 11 becomes the bottom of the heat radiating casing 5. 7 is absorbed, and the refrigerant is discharged from the refrigerant outlet 15 of the refrigerant path 11, whereby the heat radiating housing 5 is cooled. Thus, by cooling the heat radiating housing 5 with the refrigerant, the heat generated in the heat generating body 1 is efficiently discharged to the outside by the refrigerant through the heat diffusing material 3 and the heat radiating housing 5, and the operation of the heat generating body 1 is performed. Defects can be prevented.

  By the way, when the heat generating body 1 is housed in the heat radiating housing 5 and heat is radiated through the heat radiating housing 5, the size of the heat radiating housing 5 is increased so that the contact area of the heat radiating housing 5 with the outside air is increased. Increasing the heat dissipation effect can be increased.

  However, unnecessarily increasing the size of the heat dissipating housing 5 impairs the space efficiency of the automobile. That is, increasing the size of the heat dissipating housing 5 to increase the heat dissipating effect and improving the space efficiency of the automobile are in a so-called trade-off relationship. It was difficult. Therefore, a technique capable of improving the heat dissipation effect by another method without increasing the size of the heat dissipation housing 5 has been desired.

  Accordingly, an object of the present invention is to provide a heat dissipating case that can improve the heat dissipating effect of the heat generating element in addition to increasing the size of the heat dissipating case.

  In order to solve the above-mentioned problems, the invention according to claim 1 includes a thermal diffuser that is placed in contact with the heating element, a storage body that contacts the thermal diffusion body, and stores the thermal diffusion element and the heating element. A heat pipe for diffusing the heat of the heating element at least inside the heat diffusion body, and a refrigerant for discharging the heat diffused by the heat pipe to the outside inside the storage body A path is formed.

  The invention according to claim 2 is the heat radiating housing according to claim 1, wherein the storage body includes a side portion that is installed in contact with a side end surface of the heat diffusing body, and the heat pipe includes the heat pipe, It is formed to extend to the side portion through the side end face of the thermal diffusion body.

  The invention according to claim 3 is the heat radiating casing according to claim 2, wherein the storage body further includes a bottom portion that is installed in contact with a lower surface of the heat diffusing body, and the refrigerant path includes the bottom portion. It is formed so as to straddle the heat pipe.

  The invention according to claim 4 is the heat radiating casing according to claim 2 or 3, wherein the storage body further includes an extended side portion located on an outer side surface of the side portion, and the refrigerant path. However, it is formed so as to cross the heat pipe in the extended side portion.

  In the first aspect of the invention, the effect of thermal diffusion can be increased by forming a heat pipe in the thermal diffusion body provided in the heating element. The heat diffused in the heat diffusion body in this way can be discharged to the outside by the refrigerant in the refrigerant path, and the heat dissipation effect can be improved without enlarging the size of the heat dissipation housing. . In particular, when a plurality of refrigerant paths are formed, heat is diffused by each heat pipe, and the heat distribution between the plurality of heat pipes can be released to the outside while being uniformed by the refrigerant in the refrigerant path. Can be improved easily.

  In the invention according to the second aspect, since the heat pipe is extended to the side portion of the housing body, heat can be easily dispersed throughout the heat radiating casing to improve the heat radiation effect.

  In the invention according to claim 3, since the refrigerant path is formed in the bottom portion that is disposed in contact with the lower surface of the heat diffusion body, if the heat diffusion body is formed in a plate shape, it contacts the heat diffusion body. The coolant path can be routed in the bottom having a large area, and the cooling effect by the coolant can be improved.

  In the invention according to claim 4, since the refrigerant path is formed in the outwardly extending side portion formed on the side surface while actively utilizing the heat diffusion function of the heat pipe and concentrating heat on the side surface side, If the heat sink is not provided, the size of the heat dissipation housing can be reduced by reducing the size in the height direction, and if the bottom is provided and the refrigerant path is formed in the bottom, the refrigerant path is extended to the side surface side. By spreading, it is possible to effectively dissipate the heat diffused by the heat pipe.

{First embodiment}
FIG. 1 is a cross-sectional schematic view showing a part of the heat radiating housing 20 according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional schematic side view showing the heat radiating housing 20 in which a heating element is housed. is there.

  As shown in FIGS. 1 and 2, the heat radiating housing 20 houses and protects a heating element 21 which is a semiconductor device such as a power MOSFET used in an inverter for an automobile, for example, and is generated by the heating element 21. The heat diffusion body 23 is disposed in contact with the lower surface of the heating element 21, and the outer surface of the heat diffusion body 23, that is, the lower surface and the side end surface is in contact with the heat diffusion body 23. A storage body 25 for storing the heat diffusing body 23 and the heat generating body 21, a refrigerant path 27 through which a coolant such as cooling water flows is formed at the bottom 31 of the storage body 25, and the heat diffusing body 23 and the storage body 25. A heat pipe 29 is formed inside the side portion 33.

  The thermal diffusion body 23 is a plate body made of a material having an insulating property such as alumite and having excellent thermal conductivity, and has a high thermal conductivity such as a heat transfer seal or silicon grease on the upper surface thereof. The heating element 21 is bonded using an adhesive or the like.

  The storage body 25 is formed in a substantially box shape including a bottom portion 31, a side portion 33, and a top portion 35 using an insulating material having high thermal conductivity such as anodized.

  The heat pipe 29 is a closed-loop electrothermal element capable of transporting a large amount of heat with a small temperature difference by utilizing the latent heat of evaporation and condensation of liquid by using an ultrafine wire wick. As shown in FIG. 1, the heat pipe 29 has an axis formed along one direction (for example, the longitudinal direction) parallel to the plate surface of the heat diffusing body 23, and an end portion of the heat pipe 29 is a side portion of the storage body 25. Are arranged so as to extend upward. A plurality of the heat pipes 29 are formed in parallel along a direction (for example, the width direction) orthogonal to one direction of the thermal diffusion body 23. As a result, the heat pipe 29 is formed so as to be arranged in all the portions of the constant unit area of the heat diffusion body 23 and the side portion 33 of the storage body 25, and particularly in the axial direction of the heat pipe 29. On the other hand, the heat of the heating element 21 can be efficiently dispersed.

  The refrigerant path 27 formed in the bottom 31 of the storage body 25 is formed in a meandering shape or a zigzag shape as shown in FIG. 1 in order to make the heat distribution of the bottom portion 31 as uniform as possible. Alternatively, it is formed so as to cross a plurality of heat pipes 29 when viewed in plan. In this manner, the refrigerant path 27 is formed so as to cross the plurality of heat pipes 29, whereby the temperature difference between the plurality of heat pipes 29 can be made as uniform as possible. And the refrigerant | coolant is introduce | transduced in the said refrigerant | coolant path | route 27 from the refrigerant | coolant supply port 32a of this refrigerant | coolant path | route 27, This refrigerant | coolant is discharged | emitted from the refrigerant | coolant discharge port 32b of the refrigerant | coolant path | route 27, Therefore To be cooled.

  According to the above configuration, when the heat generating body 21 generates heat, the heat is transmitted to the bottom 31 and the side 33 of the storage body 25 through the heat diffusing body 23 and released to the outside.

  At this time, the heat diffusion is efficiently performed in the axial direction of each heat pipe 29 by the plurality of heat pipes 29 installed from the heat diffusion body 23 to the side portion 33 of the storage body 25.

  Then, the heat diffused to the heat diffusion body 23 and the side portion 33 of the storage body 25 is transmitted to the bottom portion 31 that is in close contact with all the bottom surfaces thereof. And a refrigerant | coolant flows into the refrigerant path 27 formed inside this bottom part 31, and the heat | fever of the bottom part 31 is efficiently discharged | emitted outside. In particular, since the refrigerant path 27 is formed so as to be orthogonal to the axial direction of the heat pipe 29, the heat distribution between the plurality of heat pipes 29 can be made as uniform as possible. As described above, the heat diffusion is performed in the axial direction by the plurality of heat pipes 29, and the refrigerant is caused to flow in the refrigerant path 27 formed so as to be orthogonal to the heat pipes 29. Since heat radiation can be performed while performing, extremely efficient heat radiation is performed.

  Therefore, it is possible to efficiently dissipate heat by the synergistic action of the plurality of heat pipes 29 and the refrigerant path 27 without increasing the size of the heat dissipating casing as in the past.

{Second Embodiment}
FIG. 3 is a bottom schematic cross-sectional view showing the heat radiating housing 20 according to the second embodiment of the present invention, and FIG. 4 is a side cross-sectional schematic diagram showing the heat radiating housing 20 in which a heating element is housed. 3 and 4, elements having the same functions as those in the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals. 3 and 4, the refrigerant supply port 32a and the refrigerant discharge port 32b of the refrigerant path 27 are not shown.

  As in the first embodiment, the heat dissipating housing 20 of this embodiment is basically formed with a plurality of heat pipes 29 from the heat diffusion body 23 to the side portion 33 of the storage body 25 as shown in FIG. The refrigerant path 27 is formed in the storage body 25 so as to be orthogonal to the heat pipe 29 as much as possible. However, the refrigerant path 27 is extended to the outwardly extending side part 37 further outside the side part 33 of the storage body 25, and the refrigerant path 27 of the outwardly extending side part 37 connects the ends of the plurality of heat pipes 29 to each other. It is arranged to cross.

  With such a configuration, the temperature distribution of the plurality of heat pipes 29 arranged on the side portion 33 of the storage body 25 is made as uniform as possible, and the heat of the side portion 33 is more efficiently transmitted by the refrigerant in the refrigerant path 27. Can be released to the outside well. Therefore, although the size of the heat dissipation casing 20 is slightly larger than that of the first embodiment, the heat dissipation efficiency of the heat dissipation casing 20 can be further improved.

{Third embodiment}
FIG. 5 is a schematic bottom sectional view showing the heat radiating housing 20 according to the third embodiment of the present invention, and FIG. 6 is a schematic side sectional view showing the heat radiating housing 20 in which the heating element is housed. In FIGS. 5 and 6, elements having the same functions as those in the second embodiment shown in FIGS. 3 and 4 are denoted by the same reference numerals. 5 and 6, the refrigerant supply port 32a and the refrigerant discharge port 32b of the refrigerant path 27 are not shown.

  The heat dissipating case 20 of this embodiment omits the bottom 31 of the storage body 25 in the second embodiment, and includes only the refrigerant path 27 formed in the outwardly extending side portion 37, and the inside of the heat diffusing body 23 and the side portion 33. The heat diffused by the plurality of heat pipes 29 is released to the outside. The configuration of this embodiment is the same as that of the second embodiment in that the refrigerant path 27 of the extended side portion 37 is disposed so as to cross the ends of the plurality of heat pipes 29.

  In this case, the refrigerant path 27 of the extended side portion 37 mainly discharges only the heat of the side portion 33 to the outside by the refrigerant, but omits the bottom portion 31 and the refrigerant path 27 inside thereof from the configuration of the second embodiment. Even so, the heat pipe 29 itself has a structure capable of transporting a large amount of heat with a small temperature difference. It is possible to transport to the portion 37 and discharge heat to the outside by the refrigerant in the refrigerant path 27 of the extending side portion 37. Therefore, it is possible to provide the heat radiating housing 20 that is compact in the height direction and has high heat radiating efficiency.

  In addition, each said embodiment demonstrated an example of the thermal radiation housing | casing 20, Since the refrigerant path 27 in the storage body 25 is formed so that it may straddle the several heat pipe 29, or it may cross. If it exists, the shape of the refrigerant | coolant path | route 27 and the heat pipe 29 is not restricted to the shape shown in FIGS.

It is a bottom view section schematic diagram showing the heat dissipation case concerning a 1st embodiment of the present invention. It is a heat sink case concerning a 1st embodiment of the present invention, and is a side section section schematic diagram showing the state where a heating element was stored inside. It is a bottom view section schematic diagram showing the heat dissipation case concerning a 2nd embodiment of the present invention. It is a heat sink case concerning a 2nd embodiment of the present invention, and is a side view section schematic diagram showing the state where a heating element was stored inside. It is a bottom view section schematic diagram showing the heat dissipation case concerning a 3rd embodiment of the present invention. It is a heat sink case concerning a 3rd embodiment of the present invention, and is a side section section schematic diagram showing the state where a heating element was stored inside. It is a bottom view section schematic diagram showing the conventional heat dissipation case. It is a conventional heat dissipation housing | casing, and a side view cross-sectional schematic diagram which shows the state by which the heat generating body was accommodated in the inside.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 Radiation housing | casing 21 Heat generating body 23 Thermal diffusion body 25 Storage body 27 Refrigerant path 29 Heat pipe 31 Bottom part 32a Refrigerant supply port 32b Refrigerant discharge port 33 Side part 35 Top part 37 Extension side part

Claims (4)

A thermal diffuser that is placed in contact with the heating element;
A storage body that contacts the thermal diffusion body and stores the thermal diffusion body and the heating element;
A heat pipe for diffusing the heat of the heating element is formed at least inside the thermal diffusion body,
A heat radiating housing, wherein a refrigerant path for discharging the heat diffused by the heat pipe to the outside is formed inside the housing. The heat dissipating housing according to claim 1,
The storage body includes a side portion that is installed in contact with a side end surface of the heat diffusing body,
The heat radiating casing, wherein the heat pipe is formed to extend to the side portion through a side end face of the heat diffusing body. The heat dissipating case according to claim 2,
The storage body further includes a bottom portion that is installed in contact with the lower surface of the thermal diffusion body,
The heat dissipation casing, wherein the refrigerant path is formed so as to straddle the heat pipe in the bottom. The heat dissipating case according to claim 2 or claim 3,
The storage body further includes an extended side portion located on an outer side surface of the side portion,
The heat dissipation housing, wherein the refrigerant path is formed so as to cross the heat pipe in the outwardly extending side portion.

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