JP2006107236A - Component life monitoring system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system that can reduce the cost of a monitored apparatus and can ensure life management of components. <P>SOLUTION: An operational information acquisition means 12 of the monitored apparatus 1 acquires operational information about each component to write it to an operational information IC tag 19, and an environmental information acquisition means 14 acquires environmental information to write it to the operational information IC tag 19. A cumulative operational load recording means 22 of a monitoring apparatus 2 reads the operational information IC tag 19 and a component IC tag 30, and calculates a cumulative operational load of the component to write it to the component IC tag 30. A component replacement warning means 26 reads the component IC tag 30 to compare the cumulative operational load with a life operational load and, if determining that the life is expiring, outputs a warning display, and an environmental condition warning means 27 reads the operational information IC tag 19 and component IC tag 30 and, if determining that the environmental information does not meet life guarantee conditions, outputs a warning display. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a management technology for life parts such as consumable / wear parts and deteriorated parts, and more particularly, to a part life monitoring system for monitoring a part life via an IC tag.

Conventional general component life management is a centralized management that prepares a component management database and issues an alarm when the stored component lifetime expires. Since there is no management information at hand, there is a problem that it is not immediately possible to determine whether the cause of the failure is due to the life of the component or a sudden failure.
In addition, when managing the life of parts installed in computer systems nationwide, the number of parts to be managed is enormous and the life of parts varies from one part to another, so equipment expansion / removal and parts replacement As a result, it is difficult to manage the lifespan of the parts, and it is difficult to prevent failures due to the lifespan.
Therefore, instead of intensively managing with the parts management database, each functional part constituting a single device has a control unit and a nonvolatile memory, records the operation history information of the part, and extracts this record. A technique for prompting replacement of parts has been proposed (see Patent Document 1).
JP 2001-101492 A

However, in the device described in Patent Document 1, the operation history information cannot be taken out unless power is supplied to the functional component in order to read the record in the nonvolatile memory. In addition, there is a problem that even when power is supplied, the operation history information recorded from the failed part cannot be extracted in many cases.
In addition, there is a problem that the cost of parts becomes high to make a part in which a control unit and a nonvolatile memory are integrated for each functional part.
The present invention was made to solve the above problems, and even when the operation of the monitoring target device is stopped, the cumulative operation amount of each component of the monitoring target device can be taken out to the outside. It is another object of the present invention to provide a component life monitoring system capable of reliably managing the life of a component that is not much different from the component cost when a monitoring function is not provided. To do.

In order to solve the above-mentioned problem, in the present invention, the operation information of a component subject to lifetime management is written in the operation information IC tag, and the cumulative operation amount of the component calculated using the operation information in the operation information IC tag Life management is performed by comparing the management information in the component IC tag attached to the component and the component IC tag. In addition, environmental information of the monitoring target device is acquired and written to the operation information IC tag, and it is determined whether there is an adverse effect on the component life due to the environment. For example, the life guarantee conditions of each part are compared with the acquired operating environment of each part, and a notification is made when the operating environment does not satisfy the life guarantee conditions.
That is, in the present invention, the above-mentioned problem is solved as follows.
(1) A component life monitoring system comprising a monitoring target device composed of a plurality of components and a monitoring device for monitoring the component life of the device is provided, and each of the monitoring target devices mounted on the monitoring target device is provided. A component IC tag provided corresponding to the component and storing management information of each component, an operation information IC tag provided corresponding to the monitoring target device and storing operation information, and operation information of the monitoring target device Operation information / environment information acquisition means for acquiring information related to the operation environment of each component mounted on the monitoring target device or the monitoring target device and writing it to the operation information IC tag, and an abnormality detection unit for the component When an abnormality is detected, an abnormality detection reporting means for reporting to the monitoring device that the abnormality has been detected is provided.
On the other hand, the monitoring device reads the operation information IC tag and the component IC tag, calculates the accumulated operation amount of the component, and writes the accumulated operation amount to the component IC tag, and the monitoring device When an abnormality is notified from the abnormality detection reporting means, there is provided a life failure monitoring means for reading the component IC tag of the abnormality detecting component and determining whether the abnormality is due to a component life or a sudden failure and reporting it.
(2) The monitoring device is provided with component replacement warning means for reading the component IC tag and issuing a preventive replacement warning.
(3) The monitoring device is provided with an environmental condition warning means for reading the operation information IC tag and the component IC tag to report whether the device environment has an adverse effect on the component life.

In the present invention, the following effects can be obtained.
(1) Since the IC tag associated with each part of the monitoring target device stores information on the cumulative operation amount and the life operation amount of each part up to the present, an abnormality provided corresponding to each part When a failure of a component is detected by the detection unit, it is possible to determine whether the failure is due to a lifetime or a sudden failure by reading the information stored in the IC tag.
(2) The part replacement date can be predicted from the comparison between the cumulative operation amount and the life operation amount of the component IC tag, and the user can be notified of the component replacement time.
(3) Since the accumulated operation amount is stored in the component IC tag, and the operation information such as the accumulated operation amount of each component is read from the component IC tag, the operation information is stored even when the monitored device is turned off or malfunctioned. Can be acquired.
(4) Since the monitoring device and the monitoring target device are separated, the monitoring target device is provided with operation information acquisition means, and the information acquired by the operation information acquisition means is read and processed by the monitoring device via the IC tag. In addition, it is not necessary to have an operation information acquisition unit and a monitoring unit integrally for each part, and the cost can be reduced.

FIG. 1 is a diagram showing a configuration example of a component life monitoring system according to the present invention. The component lifetime monitoring system shown in FIG. 1 includes a monitoring target device 1 and a monitoring device 2 that monitors the component lifetimes of a plurality of components (component 15 to component 17) mounted on the monitoring target device 1. The monitoring target device 1 is, for example, office equipment such as a personal computer, a printer, a FAX, and a copying machine, various home appliances, an ATM, a vending machine, and various devices having a processor.
The monitoring target device 1 includes a clock 11 that acquires time information, an operation information acquisition unit 12 that acquires operation information of each component, an environmental sensor 13 that detects the operating environment of the monitoring target device 1, and the environmental sensor 13. Environmental information acquisition means 14 for acquiring the environmental information of the monitoring target apparatus 1, parts 15 to 17, an abnormality detection reporting means 18 for notifying the monitoring apparatus 2 that a part abnormality has been detected, and operation of the parts An operation information IC tag 19 to which information, environment information, and abnormality detection information are written, and an IC tag reading / writing means 20 for writing operation information, environment information, and abnormality detection information to the operation information IC tag 19 are provided.
The operation information acquisition unit 12 and the environment information acquisition unit 14 write the acquired information to the operation information IC tag 19 through the IC tag reading / writing unit 20.
Each of the components 15 to 17 is provided with a component IC tag 30 for storing management information of each component. In addition, each component 15 to 17 detects an abnormality of each component and corresponds to each component to detect abnormality detection. An abnormality detection unit 40 for notifying is provided. When the abnormality of the component is detected, the abnormality detection unit 40 adds the ID of the component in which the abnormality is detected and notifies the abnormality detection reporting unit 18 of the component abnormality.
The monitoring target device 1 can include a different operation information IC tag 19 for each component, and can also include a single operation information IC tag for writing operation information of a plurality of components.

The monitoring device 2 reads the operation information IC tag 19 of the monitoring target device 1 and reads the IC tag reading / writing means 21 for reading / writing the component IC tag 30, and calculates the cumulative operation amount of each component. The component of the component in which the abnormality is detected in response to the abnormality detection notification from the cumulative operation amount recording unit 22 that records in the corresponding component IC tag 30 through the read / write unit 21 and the abnormality detection notification unit 18 of the monitoring target device 1 Life failure monitoring means 23 that reads the IC tag 30 and monitors whether the abnormality is due to the life of the part, communication means 24, display means 25, and part replacement that issues a warning of preventive replacement by reading the part IC tag 30 Warning means 26, and environmental condition warning means 27 for reading the operation information IC tag 19 and the component IC tag 30 to report the presence or absence of adverse effects on the component life due to the device environment; Provided.
The communication means 24 and the display means 25 communicate the results of monitoring by the life failure monitoring means 23, the preventive replacement warning by the parts replacement warning means 26, and the presence / absence of adverse effects on the part life by the environmental condition warning means 27 to an external device. Display on the display.

In the present invention, the components are, for example, an HDD, an MO drive, a CD / DVD drive, a fan, a motherboard, a memory, etc. in the case of a personal computer. For example, HDD, MO drive, CD / DVD drive, etc. can detect the start or end of operation from the lighting state of the lamp that displays the operation status, and the motherboard, memory, etc. start or operate from power ON / OFF The end can be detected.
In the present invention, as described later, for example, two operation information IC tags 19 are prepared, and the operation information of each component is written to one operation information IC tag 19 together with the component ID. When the tag is full, the operation information may be written to the other operation information IC tag 19.
In the configuration example shown in FIG. 1, the operation information IC tag 19 and the component IC tag 30 are provided in the monitoring target device 1. However, in the present invention, the operation information IC tag 19 and the component IC tag 30 are monitored. The structure provided outside the apparatus 1 can also be taken.
In the configuration example shown in FIG. 1, the monitoring target device 1 and the monitoring device 2 have a one-to-one correspondence. However, in the present invention, one monitoring device 2 corresponds to a plurality of monitoring target devices 1. A system configuration can also be adopted.

FIG. 2 is a diagram illustrating an arrangement example of the environmental sensor.
In the example shown in FIG. 2, as the environmental sensor 13 in the casing of the monitoring target apparatus 1, for example, an air volume sensor 13a and a humidity sensor 13b are provided on the output side of the cooling fan 35, and the CD / DVD drive 31, HDD 32, substrate, etc. A power source sensor 13c is connected to the power source 33, and a temperature sensor 13d is provided in the vicinity of the substrate 34 and the like.
The air volume of the cooling fan 35 (or the cooling fan operating state) detected by the air volume sensor 13a, the humidity detected by the humidity sensor 13b, the voltage value supplied to each component detected by the power sensor 13c (or the power on) / Off), the temperature in the vicinity of the substrate 34 detected by the temperature sensor 13d, and the like are sent to the environmental information acquisition means 14.
An environmental sensor such as the temperature sensor 13d may be provided for each component, and if each sensor is provided for each component, it is possible to monitor the environmental conditions of each component. Below, as shown in FIG. 2, the case where the environmental information in a housing | casing is detected is demonstrated.
Also, by sending the power on / off information supplied to each component detected by the power sensor 13c to the operation information acquisition means 12, it is possible to determine whether or not the component is operating according to the power supply state. Operation start or operation end can be acquired.

FIG. 3 is a diagram showing an example of the data structure of the component IC tag.
As shown in the figure, the component IC tag 30 has a tag ID that uniquely identifies the component IC tag 30, a component ID that uniquely identifies each component stored in the monitoring target device 1, and the component reaches the end of its life. It has a data structure such as a life operation amount that is a total operation amount, a life guarantee condition that is operation environment condition information of a part that guarantees the life operation amount, and a cumulative operation amount up to now.
Of the information in the component IC tag 30, the accumulated operation amount is written by the accumulated operation amount recording means 22 of the monitoring device 2. Examples of the life guarantee conditions include conditions relating to temperature, humidity, supply voltage, air volume, and the like.

FIG. 4 is a diagram showing an example of the data configuration of the operation information IC tag.
As shown in the figure, the operation information IC tag 19 includes a tag ID for uniquely identifying the operation information IC tag 19, a component ID for uniquely identifying each component, an operation information storage area for storing operation information, and environmental information. Are stored in an environment information storage area and an abnormality detection flag indicating whether or not an abnormality has been detected. The operation information IC tag 19 stores information on each component in association with the component ID.
Examples of the operation information stored in the operation information storage area include information such as power-on / off times and component operation start / end times. Examples of the environment information stored in the environment information storage area include information such as temperature, humidity, supply voltage, and air volume in the monitoring target device 1. The abnormality detection flag is a flag that is set by the abnormality detection reporting unit 18 when a component abnormality is detected by the abnormality detection unit 40 provided corresponding to each component in the monitoring target device 1.

FIG. 5 is a flowchart showing an operation process of the component life monitoring system according to the first embodiment of the present invention.
First, operation processing on the monitoring target apparatus 1 side illustrated in FIG. When the power is turned on (step S1), the operation information acquisition unit 12 acquires the operation information of each component and writes it to the operation information IC tag 19 together with the ID of each component (step S2). Further, the environment information acquisition means 14 acquires the environment information and writes it to the operation information IC tag 19 (step S3).
When a component abnormality is detected, the abnormality detection reporting means 18 sets an abnormality detection flag in the operation information IC tag 19 (step S4). And a process is complete | finished with the cutting | disconnection of a power supply (step S5).
Next, warning display processing by the monitoring device 2 shown in FIG. The accumulated operation amount recording means 22 of the monitoring device 2 reads the operation information IC tag 19 and the component IC tag 30 and calculates the accumulated operation amount of each component based on the operation information in the operation information IC tag 19. Write to the IC tag 30 (step S11). For example, if an operation start time and an operation end time are stored as operation information in the operation information IC tag 19, the latest operation time is added to the accumulated operation amount stored in the component IC tag 30. The accumulated operating amount is calculated, and the calculated accumulated operating amount is written to the component IC tag 30.
Then, the component replacement warning means 26 reads the component IC tag 30 (step S12) and determines whether it is in the lifetime range (step S13). For example, if it is determined that the current cumulative operating amount exceeds the lifetime operating amount recorded in the component IC tag 30 and is in the lifetime region, a warning is displayed (step S14).

Also, for example, when it is determined that the current cumulative operating amount is equal to or less than the lifetime operating amount and not within the lifetime range, the environmental condition warning unit 27 reads the operating information IC tag 19 and the component IC tag 30 (step S15) and operates. It is determined whether the environmental information in the information IC tag 19 satisfies the life guarantee condition in the component IC tag 30 (step S16).
If the environmental information satisfies the life guarantee condition, the process is terminated. If the environmental information does not satisfy the life guarantee condition, a warning is displayed (step S17).
For example, when the life guarantee condition is a temperature condition of 25 ° C. and the environmental information is 40 ° C., the environmental information does not satisfy the life guarantee condition, and the current device environment may adversely affect the component life. Will display a warning.
Here, when the environmental information of the monitoring target device acquired by the environmental sensor 13 is saved in the monitoring device 2 as the environmental history information together with the time information, when a component failure occurs, the failure cause is determined from the environmental history information. It is also possible to analyze whether or not is based on the operating environment.

Next, the life failure monitoring process by the monitoring device 2 shown in FIG.
When the life failure monitoring means 23 reads the operation information IC tag 19 and confirms that the abnormality detection flag is set (step S21), the life failure monitoring means 23 reads the component IC tag 30 and accumulates the life operation amount in the component IC tag 30 and the cumulative amount. Based on the operation amount, it is determined whether it is a life failure (step S22).
For example, when it is determined that the accumulated operation amount exceeds the life operation amount and it is a life failure, a life failure display is performed (step S23). If it is determined that there is an abnormality due to an abnormal failure, a sudden failure display is issued (step S24).

6 and 7 are flowcharts showing an example of the operation information acquisition processing operation in the operation information acquisition means of the monitoring target apparatus 1.
FIG. 6 shows an operation processing flow for acquiring the power-on time and the power-off time as operation information. In FIG. 6, the operation information acquisition unit 12 determines whether a power ON signal has been detected (step S31). When a power ON signal is detected, power on time information is collected (step S32), and the power on time is written in the operation information storage area of the operation information IC tag 19 (step S33).
When the power ON signal is not detected in step S31, the operation information acquisition unit 12 determines whether the power OFF signal is detected (step S34). If the power OFF signal is not detected, the process returns to step S31. If the power OFF signal is detected, the power-off time information is collected (step S35), and the power-off time is written in the operation information IC tag 19 (step S35). S36), the process is terminated.

FIG. 7 shows an operation processing flow for acquiring an operation start time and an operation end time as operation information. The operation information acquisition unit 12 confirms whether a flag indicating that the part is in operation (hereinafter referred to as an operation flag) is ON (step S41). If the operation flag is not ON, the part starts operating. It is determined whether or not an operation display lamp signal indicating that the operation has been performed (a lamp indicating an operation state provided in the HDD, CD / DVD drive, etc.) is turned on (step S42).
If the operation display lamp signal is not turned on, the process returns to step S41. If the operation display lamp signal is turned on, the part is identified (step S43), and the time when the operation display lamp signal is turned on is identified. The operation information IC tag 19 is written as the operation start time of (i)) (step S44). Then, the operation flag is turned on (step S45), and the process returns to step S41.

If the operation flag is ON in step S41, it is determined whether the operation display lamp signal is OFF (step S46). If the operation display lamp signal is not OFF, the process returns to step S41. When the operation display lamp signal is turned off, the part is identified (step S47), and the time when the operation display lamp signal is turned off is written to the operation information IC tag 19 as the operation end time of the identified part (step S47). S48). Then, the operation flag is turned off (step S49), and the process is terminated.
In the above flowchart, the operation state is detected by the lamp indicating the operation state provided in the HDD, the CD / DVD drive, etc., but the operation state of the component is detected by detecting a drive signal for the component. You may make it discriminate | determine by other means, such as discriminating.

In the first embodiment of the present invention described above, component life is monitored via IC tags (operation information IC tag 19 and component IC tag 30). Therefore, after the monitored device is turned off, or even when the monitored device fails and stops its operation, the information written in the IC tag is read to stop the operation of the monitored device. It is possible to know the cumulative operation amount of each component at, and to determine the life of the component.
Furthermore, by storing the abnormality detection information, environmental history information, etc. of the monitored device in the monitoring device, it is possible to analyze the cause of failure of the monitored device even after the monitored device stops operating. Is possible.
In addition, since information exchange between the monitoring target device and the monitoring device is performed via the IC tag, a communication path for connecting the monitoring target device and the monitoring device is unnecessary, and the monitoring device is relatively simple. Can be installed.
In addition, a monitoring device is provided separately from the monitoring target device. The monitoring device calculates the cumulative operating amount, determines the life failure, determines the part replacement time, and determines the environmental conditions. It is only necessary to acquire information / environment information and detect an abnormality, and the configuration of the monitoring target apparatus can be simplified. In particular, if a single monitoring device is configured to monitor a plurality of monitoring target devices, the overall cost can be reduced as compared with the case where each monitoring target device is individually provided with a monitoring function.

In the first embodiment, the operation information and environment information of each component is written in the operation information IC tag, and the monitoring device reads out the information written in the operation information IC tag. And the reading of the IC tag information on the monitoring device are performed asynchronously. For example, if the reading time interval on the monitoring device side is longer than the writing time interval on the IC tag on the monitoring target device side, The information written in the IC tag is rewritten before being read by the monitoring device, and there is a possibility that the information is lost.
Next, a second embodiment of the present invention that solves the above problem will be described.
In the second embodiment of the present invention, two operation information IC tags 19 and a synchronization tag 50 for identifying which operation information IC tag 19 is full are prepared in the monitoring target apparatus 1. .
As shown in FIG. 8, the synchronization tag 50 has a data structure called a tag ID and a synchronization flag indicating which operation information IC tag 19 is full. For example, when the first operation information IC tag is full, the synchronization flag in the synchronization tag 50 is set to 1. When the second operation information IC tag is full, the synchronization flag in the synchronization tag 50 is set to 0. Is done.

In the second embodiment, the monitoring target device 1 writes the operation information of each component together with the component ID to one operation information IC tag 19, and when this operation information IC tag 19 becomes full, The operation information is written to the operation information IC tag 19.
On the other hand, when the monitoring device 2 periodically reads the synchronization tag 50 and detects that one of the operation information IC tags 19 is full, the operation information in the operation information IC tag 19 that is full is displayed. To lead.
In the present invention, the monitoring device 2 may be configured to include a storage unit that temporarily stores the operation information in the read one operation information IC tag 19.

FIG. 9 is a flowchart showing an operation process of the component life monitoring system according to the second embodiment of the present invention.
First, operation processing on the monitoring target apparatus 1 side illustrated in FIG. 9A will be described. The monitoring target device 1 collects operation information (step S51), collects environment information (step S52), and then reads the synchronization tag 50 (step S53).
It is determined whether or not 1 is set in the synchronization flag in the synchronization tag 50 (step S54). If the synchronization flag is set to 0 instead of 1, the collected information is used as the first operation information IC tag 19-1. (Step S55).
Next, it is determined whether or not the first operation information IC tag 19-1 is full (step S56). If the first operation information IC tag 19-1 is not full, the process is terminated, and the first operation information IC tag is completed. If the tag 19-1 is full, the synchronization flag 50 is set to 1 (step S57), and the second operation information IC tag 19-2 is cleared.
In step S54, if 1 is set in the synchronization flag in the synchronization tag 50, the collected information is written to the second operation information IC tag 19-2 (step S59). Next, it is determined whether or not the second operation information IC tag 19-2 is full (step S60). If the second operation information IC tag 19-2 is not full, the processing is terminated, and the second operation information IC tag is finished. If the tag 19-2 is full, the synchronization flag of the synchronization tag 50 is set to 0 (step S61), and the first operation information IC tag 19-1 is cleared.

Next, operation processing on the monitoring device 2 side illustrated in FIG. 9B will be described. The monitoring device 2 periodically reads the synchronization tag 50 (step S71) and monitors whether the synchronization flag in the synchronization tag 50 has changed (step S72).
If the synchronization flag has not changed, the process is terminated. If the synchronization flag has changed from 0 to 1, the first operation information IC tag 19-1 is read and stored in the storage unit in the monitoring device 2. (Step S73).
When the synchronization flag changes from 1 to 0 in step S72, the second operation information IC tag 19-2 is read and stored in the storage unit in the monitoring device 2 (step S74).
Then, the accumulated operation amount recording means 22 reads the component IC tag 30 of each part by reading the storage unit, calculates the accumulated operation amount of each component, and writes the calculated accumulated operation amount to the component IC tag 30 ( Step S75) and the process ends.
According to the second embodiment of the present invention, the monitoring device 2 detects which operation information IC tag 19 is full, and reads the operation information IC tags 19 that are full together. Therefore, it is possible to avoid a situation in which the other operation information IC tag 19 in which information is being written is read, and an accurate accumulated operation amount at the present time can be calculated.
Further, even when a plurality of components fail one after another in the monitoring target device 1, the abnormality detection information, operation information, and the like can be reliably read by the monitoring device 2.

It is a figure which shows the structural example of the component life monitoring system of this invention. It is a figure which shows the example of arrangement | positioning of an environmental sensor. It is a figure which shows an example of a data structure of a component IC tag. It is a figure which shows an example of a data structure of an operation information IC tag. It is a flowchart which shows the operation | movement process of the component lifetime monitoring system which concerns on the 1st Embodiment of this invention. It is a flowchart (1) which shows an example of operation information acquisition processing operation. It is a flowchart (2) which shows an example of operation information acquisition processing operation. It is a figure which shows the data structure of a synchronous tag. It is a flowchart which shows the operation processing of the component lifetime monitoring system which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Monitoring object apparatus 2 Monitoring apparatus 11 Clock 12 Operation | movement information acquisition means 13 Environmental sensor 14 Environmental information acquisition means 15, 16, 17 Parts 18 Abnormality detection notification means 19 Operation | movement information IC tag 20, 21 IC tag read / write means 22 Cumulative operation Quantity recording means 23 Life failure monitoring means 24 Communication means 25 Display means 26 Parts replacement warning means 27 Environmental condition warning means 30 IC tag 40 Abnormality detection unit 50 Synchronization tag

Claims (3)

A component life monitoring system comprising a monitoring target device composed of a plurality of components and a monitoring device for monitoring the component life of the device,
The above monitored devices include
A component IC tag provided corresponding to each component mounted on the monitoring target device and storing management information of each component;
An operation information IC tag provided corresponding to the monitoring target device and storing operation information;
Operation / environment information acquisition means for acquiring operation information of the monitoring target device and information regarding the operating environment of each component mounted on the monitoring target device or the monitoring target device and writing the information to the operation information IC tag;
When the abnormality detection unit of the component detects an abnormality, an abnormality detection reporting means for reporting the abnormality to the monitoring device;
On the other hand, the monitoring device
A cumulative operation amount recording means for reading the operation information IC tag and the component IC tag, calculating a cumulative operation amount of the component, and writing to the component IC tag;
When an abnormality is notified from the abnormality detection reporting means of the monitoring target device, a life failure monitoring is performed in which the component IC tag of the abnormality detection component is read to determine whether the abnormality is due to a component life or a sudden failure. And a component life monitoring system. 2. The component life monitoring system according to claim 1, wherein the monitoring device includes component replacement warning means for reading the component IC tag and issuing a warning for preventive replacement. 3. The component life according to claim 2, wherein the monitoring device comprises an environmental condition warning means for reading the operation information IC tag and the component IC tag to report whether or not the device environment has an adverse effect on the component life. Monitoring system.

Images