JP2006102640A - Method and apparatus for forming film, and film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming a film which can prevent the occurrence of a particle without reducing productivity in film formation on the surface of a substrate, an apparatus for forming the film, and the film formed by such a film formation method. <P>SOLUTION: The apparatus for forming the film 1 comprises a wafer support part 2 for rotationally supporting a wafer W which is coated with a liquid film formation material, a film formation material supply part 4 for supplying the film formation material to the wafer W by a coating method to form the film, and a liquid-repellent film formation part 5 for supplying a liquid-repellent material to the edge part of one face and another face of the wafer W to form a liquid-repellent film wherein prior to the supply of the liquid formation material to one face of the wafer W from the film formation material supply part 4, the liquid-repellent material is supplied to the edge part of one face and another face of the wafer W from the liquid-repellent film formation part 5 to form the liquid-repellent film, thereby preventing the film formation material from entering another face side of the wafer W. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a film forming method, a film forming apparatus, and a film.

Conventionally, as a method of forming a film on one surface of a substrate such as a semiconductor wafer, a liquid film forming material is dropped on the center of the substrate rotating at high speed, and the dropped film forming material is applied to the substrate by centrifugal force. A spin coating method is known in which a film is formed by applying to a film (see, for example, Patent Document 1).
Of the film forming material applied (supplied) to one surface of the substrate by this spin coating method, the excessively supplied material is scattered (dropped) from the edge of the substrate by centrifugal force and detached from the substrate. . At this time, a part of the film forming material penetrates and adheres to the other surface along the end surface of the substrate.

Thus, the film forming material adhering to the other surface not only deteriorates the appearance quality of the substrate but also causes generation of particles.
Therefore, in such a spin coating method, generally, after a film is formed on one surface of the substrate, a process such as removal of the film forming material attached by a rinse agent or the like is performed.
However, by performing such a treatment, the rinse agent scatters to a region other than the target region, and the waste solution treatment of the rinse agent is required, and the thick film portion by the rinse agent However, it takes time to remove the film, resulting in a decrease in productivity.

JP 2001-300408 A

  An object of the present invention is to provide a film forming method and a film forming apparatus capable of preventing the generation of particles in a film formation on a substrate surface without reducing productivity, and a film formed by such a film forming method. .

Such an object is achieved by the present invention described below.
The film forming method of the present invention is a film forming method for forming a film on one surface of a substrate by supplying a liquid film forming material by a coating method,
Prior to supplying the film-forming material to one side of the substrate,
By forming a liquid repellent film by supplying a liquid repellent material to the edge of one surface and the edge of the other surface of the substrate, the film forming material enters the other surface side of the substrate. It is characterized by preventing.
Thereby, it is possible to reliably prevent the generation of particles without reducing the productivity.

In the film forming method of the present invention, it is preferable that the liquid repellent film is also formed on an end surface of the substrate when the liquid repellent film is formed.
Thereby, it can prevent more reliably that a particle | grain generate | occur | produces, without reducing productivity.
In the film forming method of the present invention, the liquid repellent film is preferably formed by supplying a liquid repellent material to the substrate and then drying it.
Thereby, a liquid repellent film can be formed rapidly.

In the film forming method of the present invention, when the average thickness of the liquid repellent film is A [mm] and the average thickness of the film to be formed is B [mm], A / B is 1 × 10 ^−4. It is preferable to satisfy the relationship of ˜5 × 10 ⁻¹ .
Even in such a relatively thin liquid repellent film, it is possible to sufficiently suppress or prevent the liquid repellent material scattered from one surface from entering the other surface.

In the film forming method of the present invention, the liquid lyophobic material is preferably a liquid containing a fluorinated coupling agent.
As a result, a liquid repellent film exhibiting excellent liquid repellency can be formed relatively easily.
In the film forming method of the present invention, the liquid repellent film is preferably formed by supplying a gaseous liquid repellent material to the substrate.
Thereby, a liquid repellent film can be formed rapidly.

In the film forming method of the present invention, it is preferable that the gaseous liquid repellent material is a fluorine compound made into plasma.
As a result, a liquid repellent film exhibiting excellent liquid repellency can be rapidly formed.
In the film forming method of the present invention, the liquid repellent film rotates the substrate and supplies the liquid repellent material at the predetermined location when the edge of the substrate passes through the predetermined location. Preferably it is formed.
As a result, the liquid repellent film can be formed on the edges of both surfaces of the substrate without moving the position at which the liquid repellent is discharged toward the substrate, so that the liquid repellent film can be efficiently formed. .

In the film forming method of the present invention, the liquid repellent film is configured to supply the liquid repellent material at the predetermined location when the edge of the substrate passes through the predetermined location while transporting the substrate. Preferably it is formed.
As a result, the liquid repellent film can be formed on the edges of both surfaces of the substrate without moving the position at which the liquid repellent is discharged toward the substrate, so that the liquid repellent film can be efficiently formed. .

In the film forming method of the present invention, it is preferable to remove at least a part of the liquid repellent film after forming the film.
Thereby, generation | occurrence | production of a particle can be prevented more reliably.
The film of the present invention is formed by the film forming method of the present invention.
Thereby, a highly reliable film in which generation of particles is prevented can be obtained.

In the film of the present invention, the film has a relationship in which D / C is 0.3 to 2.0 when the thickness of the central part is C [mm] and the thickness of the edge is D [mm]. It is preferable to satisfy.
Thereby, generation | occurrence | production of a crack is blocked | prevented and generation | occurrence | production of a particle is prevented reliably.
The film forming apparatus of the present invention is a film forming apparatus used in the film forming method of the present invention,
A film forming material supply unit for forming the film by supplying the film forming material to the substrate by a coating method;
A liquid repellent film forming part for supplying the liquid repellent material to the substrate to form the liquid repellent film;
It has a moving means for moving the substrate relative to the film forming material supply section and the liquid repellent film forming section.
Thereby, it is possible to reliably prevent the generation of particles without reducing the productivity.

Hereinafter, a film forming method, a film, and a film forming apparatus of the present invention will be described in detail based on the preferred embodiments shown in the drawings.
<First Embodiment>
First, a first embodiment of a film forming method and a film forming apparatus of the present invention will be described.
Hereinafter, a wafer will be described as an example of a substrate on which a film is formed.

1 is a plan view showing a first embodiment of a film forming apparatus of the present invention, FIG. 2 is a longitudinal sectional view taken along line AA in FIG. 1, and FIG. 3 is an outline of a liquid repellent film forming head in FIG. FIG. 3A is a side view of the liquid repellent film forming head, and FIG. 3B is a longitudinal sectional view taken along line BB in FIG. 3A. In the following description, the upper side in FIG.
As shown in FIGS. 1 and 2, the film forming apparatus 1 includes a wafer support portion 2 that rotationally supports a wafer W to which a liquid film forming material is applied, and an excess film forming material that scatters (drops) from the wafer W. A film forming material supply unit 4 for supplying a film forming material to the wafer W by a coating method to form a film, and an edge on one surface and an edge on the other surface of the wafer W. A liquid repellent film forming section 5 for supplying a liquid repellent material to form a liquid repellent film. Hereinafter, each of these components will be described sequentially.

  The wafer support unit 2 is in contact with the central portion of the back surface of the wafer W and has a disk-like mounting plate 6 for horizontally mounting the wafer W, and a rotation transmission extending downward from the center of the mounting plate 6. A shaft 7 and a motor 8 connected to the lower end of the rotation transmission shaft 7 and rotating the rotation transmission shaft 7 around the central axis are provided. By rotating the motor 8, the wafer W is rotated in a horizontal plane. That is, in the present embodiment, the wafer support part 2 constitutes a moving means for moving the wafer W relative to the film forming material supply part 4 and the liquid repellent film forming part 5.

  The collection unit 3 is disposed below the mounting plate 6 and has a bowl-shaped surplus film-forming material catch container 9 that opens upward from the diameter of the wafer W toward the upper side, and a lower surface of the surplus film-forming material catch container 9. The connected shaft 11 and the surplus film forming material catch container 9 are supported via the shaft 11, and the two air cylinders 10 capable of raising and lowering the surplus film forming material catch container 9 together with the shaft 11 are provided.

When the film forming material is applied to the wafer W by the film forming material supply unit 4 described later, the collecting unit 3 pushes up the excess film forming material catching container 9 upward. Thereby, the surplus film forming material scattered from the edge of the wafer W by the centrifugal force of the rotating wafer W can be reliably recovered.
The surplus film forming material collected by the surplus film forming material catch container 9 can be supplied to the film forming material supply unit 4 by a suction nozzle (not shown) or the like and reused as the film forming material.

  The film forming material supply unit 4 includes a film forming material discharge nozzle 12 that discharges (supplies) the film forming material toward the center of one surface (one surface) of the wafer W, and the wafer support unit 2. A rotation transmission shaft 13 disposed outside and extending along the vertical direction; a motor 14 connected to the lower end of the rotation transmission shaft 13 and rotating the rotation transmission shaft 13 around the central axis; and a horizontal direction And an arm 15 connected to the upper end of the rotation transmission shaft 13 and the film forming material discharge nozzle 12.

The film forming material supply unit 4 discharges (supplies) the film forming material onto one surface of the rotating wafer W, and the discharged film forming material using centrifugal force is placed on the surface of this surface of the wafer W. By covering, the film forming material is applied to the surface of the wafer W.
Then, the applied film forming material is subjected to a predetermined process such as a baking process (heating process) as necessary, and the film forming material is cured (dried), whereby one surface of the wafer W is formed. A film is formed. Note that, by appropriately selecting a film forming material, for example, a film (functional film) having a desired function such as a conductor film, an insulating film, a semiconductor film, or a resist film can be formed.
When the film forming material is not applied (supplied) to the wafer W, the film forming material discharge nozzle 12 is retracted from the upper surface region of the wafer W by rotating the motor 14 clockwise by a predetermined angle in FIG. be able to.

  The liquid repellent film forming portion 5 has a liquid repellent film on the edge of one surface of the wafer W and the edge of the other surface (hereinafter collectively referred to as “the edge of both surfaces”). A liquid repellent film forming head 16, a rotation transmission shaft 33 that is disposed symmetrically with respect to the center of the wafer support W 2, the film forming material supply unit 4, and the wafer W, and extends in the vertical direction; The motor 21 connected to the lower end of the rotation transmission shaft 33 and rotating the rotation transmission shaft 33 around the central axis, and the upper end of the rotation transmission shaft 33 and the liquid repellent film forming head 16 extending along the horizontal direction And an arm 34 to be connected.

In FIG. 3, a liquid repellent film forming head 16 is a rectangular parallelepiped liquid repellent material discharge device, and has a groove-shaped opening 17 dug in the horizontal direction from one side surface. Therefore, the liquid repellent film forming head 16 has a U-shape when viewed from the side.
The distance between the opposing surfaces 18a and 18b in the opening 17, that is, the groove width in the vertical direction is set to be larger than the thickness of the wafer W, and the spray nozzle 19 and the heater 20 are arranged on each of the opposing surfaces 18a and 18b. It is arranged with.
Each spray nozzle 19 ejects a liquid repellent material upward or downward. Thereby, the liquid repellent material can be supplied to the edges of both surfaces of the wafer W. And this liquid repellent material can be dried with the heater 20, and a liquid repellent film can be formed in these edge parts.

  The liquid repellent material is not particularly limited. For example, tridecafluoro-1,1,2,2 tetrahydrooctyltriethoxysilane, tridecafluoro-1,1,2,2 tetrahydrooctyltrimethoxysilane, Fluorine coupling agents such as decafluoro-1,1,2,2 tetrahydrooctyltrichlorosilane, octadecyltrimethoxysilane, vinyltrimethoxysilane, polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether Fluorine organic materials such as copolymer (PFA), ethylene-tetrafluoroethylene copolymer (ETFE), perfluoroethylene-propene copolymer (FEP) and ethylene-chlorotrifluoroethylene copolymer (ECTFE) , Examples include liquids containing fluorine-based inorganic materials such as potassium titanium titanate, potassium silicofluoride, potassium fluorozirconate, and silicofluoric acid. Among these, liquids containing fluorine-based coupling agents are used. Is preferred. As a result, a liquid repellent film exhibiting excellent liquid repellency can be formed relatively easily.

  When such a fluorinated coupling agent, fluorinated organic material and fluorinated inorganic material are dissolved in a solvent or dispersed in a dispersion medium, examples of the solvent or dispersion medium used include nitric acid, sulfuric acid, ammonia, hydrogen peroxide. Inorganic solvents such as water, carbon disulfide, carbon tetrachloride, ethylene carbonate, ketone solvents such as methyl ethyl ketone (MEK), acetone, diethyl ketone, methyl isobutyl ketone (MIBK), methyl isopropyl ketone (MIPK), cyclohexanone, Alcohol solvents such as methanol, ethanol, isopropanol, ethylene glycol, diethylene glycol (DEG), glycerin, diethyl ether, diisopropyl ether, 1,2-dimethoxyethane (DME), 1,4-dioxane, tetrahydrofuran (TH ), Tetrahydropyran (THP), anisole, ether solvents such as diethylene glycol dimethyl ether (diglyme), diethylene glycol ethyl ether (carbitol), cellosolv solvents such as methyl cellosolve, ethyl cellosolve, phenyl cellosolve, hexane, pentane, heptane, cyclohexane Aliphatic hydrocarbon solvents such as toluene, xylene, benzene, etc., aromatic heterocyclic compounds such as pyridine, pyrazine, furan, pyrrole, thiophene, methylpyrrolidone, N, N-dimethyl Amide solvents such as formamide (DMF) and N, N-dimethylacetamide (DMA), halogen compound solvents such as dichloromethane, chloroform and 1,2-dichloroethane, ethyl acetate, methyl acetate, formic acid Ester solvents such as chill, sulfur compound solvents such as dimethyl sulfoxide (DMSO) and sulfolane, nitrile solvents such as acetonitrile, propionitrile and acrylonitrile, organic acid solvents such as formic acid, acetic acid, trichloroacetic acid and trifluoroacetic acid Or a mixed solvent containing these.

Although it does not specifically limit as the heater 20, For example, a heating wire, an infrared heater, etc. are mentioned. The liquid repellent material attached to the wafer W by the spray nozzle 19 is dried using such a heater 20, thereby forming a liquid repellent film on the edges of both surfaces of the wafer W.
Here, as described above, the opening 17 is set such that the groove width in the vertical direction is larger than the thickness of the wafer W. Thereby, the liquid repellent film forming head 16 can accommodate the wafer W, more specifically, the edge of the wafer W in the opening 17.
When the liquid repellent film forming head 16 accommodates the edges of both surfaces of the wafer W in the opening 17, the facing surfaces 18a and 18b face the one surface and the other surface of the wafer W, respectively. .

Each of the facing surfaces 18a and 18b has a spray nozzle 19 and a heater 20, respectively. The spray nozzle 19 and the heater 20 are arranged along the edge of the wafer W on each surface. Therefore, the liquid repellent film forming head 16 can continuously form the liquid repellent film on the edges of both surfaces of the wafer W by rotating the wafer W by the moving means described above.
The liquid repellent film forming unit 5 rotates the motor 14 by a predetermined angle clockwise in FIG. 1 when the liquid repellent film is not formed on the edges of both surfaces of the wafer W. The forming head 16 can be detached from the edge of the wafer W.

The film forming method of the present invention supplies a liquid repellent material to the edge of one surface of the wafer W and the edge of the other surface before supplying the film forming material to one surface of the wafer W. By forming the liquid repellent film, the film forming material is prevented from entering the other surface side of the wafer W.
Below, the film-forming method which the film-forming apparatus 1 of this embodiment performs is demonstrated sequentially.
[1] First, after placing the wafer W on the mounting plate 6, the motor 8 of the wafer support unit 2 is driven to rotate the wafer W in a horizontal plane.
[2] Next, when the rotation of the wafer W is stabilized, the motor 21 of the film forming material supply unit 4 is rotated counterclockwise by a desired angle in FIG. Accordingly, the liquid repellent film forming head 16 is moved to the edge of the wafer W, and the edge of the wafer W is accommodated in the opening 17 of the liquid repellent film forming head 16.
[3] Next, in a state where the wafer W is rotated, the liquid repellent film forming head 16 is moved from each spray nozzle 19 toward the edge of both surfaces of the wafer W at one position without moving. After supplying the liquid repellent material, the liquid repellent material attached to the wafer W is dried by the heater 20. Thereby, a liquid repellent film is continuously formed on the edges of both surfaces of the wafer W.

In the present embodiment, since the liquid repellent material is dried by the heater 20, the liquid repellent film can be formed quickly.
Here, the average thickness of the liquid-repellent film varies slightly depending on the viscosity of the liquid film-forming material supplied in step [6] described later, but the average thickness of the liquid-repellent film is A [mm]. When the average thickness of the power film is B [mm], it is preferable that A / B satisfies the relationship of 1 × 10 ^{−4 to} 5 × 10 ⁻¹ , and 5 × 10 ⁻⁴ to 1 × 10 ^−1. It is more preferable to satisfy the following relationship. Even in such a relatively thin liquid repellent film, it is possible to sufficiently suppress or prevent the liquid repellent material scattered from one surface from entering the other surface.
As will be described later, when removing the liquid repellent film after forming the film, the liquid repellent film can be easily and surely removed by forming the liquid repellent film having a relatively thin film thickness. can do.

[4] Next, the motor 21 is rotated clockwise by a desired angle to detach the liquid repellent film forming head 16 from the edge of the wafer W.
[5] Next, the motor 14 of the liquid repellent film forming unit 5 is rotated counterclockwise in FIG. 1 by a predetermined angle. Thus, the film forming material discharge nozzle 12 is made to face the center of the wafer W.
[6] Next, a liquid film forming material is discharged (supplied) from the film forming material discharge nozzle 12 facing the center of the wafer W toward the center of one surface of the rotating wafer W. As a result, the supplied film forming material covers the surface of one surface of the wafer W by centrifugal force. Then, a film is formed on one surface of the wafer W by curing the film forming material.

In curing the film forming material, a predetermined process such as a baking process (heating process) may be performed as necessary.
When the film forming material covers the surface of the wafer W by centrifugal force, a liquid repellent film is formed on the edges of both surfaces of the wafer W. Thereby, it is possible to suitably suppress or prevent the surplus film forming material scattered from the edge of one surface from entering due to the centrifugal force and inadvertently adhering to the other surface.

Further, since the supplied film forming material is unevenly distributed at the edge of the wafer W due to centrifugal force, a thick film portion tends to be generated at the edge of the formed film. Such a thick film portion causes cracks and also causes particles.
However, in the film forming method of the present invention, since the liquid repellent film is formed on the edge of one surface, it is possible to suitably suppress or prevent the occurrence of a thick film portion at the edge of the film. it can. As a result, the occurrence of cracks can be reliably prevented.
In the film thus formed, when the thickness of the central portion is C [mm] and the thickness of the edge portion is D [mm], the relationship that D / C is 0.3 to 2.0. It is preferable to satisfy, and it is more preferable to satisfy the relationship of 0.5 to 1.5. In a film satisfying such a relationship, the generation of cracks is prevented, so that the generation of particles is reliably prevented.

[7] Thereafter, the motor 14 is rotated clockwise by a predetermined angle to retract the film forming material discharge nozzle 12 from the upper surface region of the wafer W.
Note that one or both of the liquid repellent films formed on the edges of both surfaces of the wafer W may be removed after the film is formed. Thereby, the generation of particles due to the liquid repellent film being formed on the wafer W can be reliably prevented.

The method for removing the liquid repellent film is not particularly limited. For example, ultraviolet light, Ne-He laser, Ar laser, CO ₂ laser, ruby laser, semiconductor laser, YAG laser, glass laser, YVO ₄ laser, and excimer laser are used. And a method of irradiating various lasers. In addition to these, for example, a base layer having a weak adhesion to the wafer W is formed between the wafer W and the liquid repellent film, and this base layer is peeled off after the film is formed. Also good.

According to the first embodiment of the film forming method and the film forming apparatus of the present invention as described above, since the liquid repellent film is formed on the edges of both surfaces of the wafer W, one surface (the film is formed). It is possible to suitably suppress or prevent the liquid-repellent material scattered from the surface) from entering and adhering to the other surface.
In addition, the occurrence of a thick film portion at the edge of the formed film can be suitably suppressed or prevented. Therefore, it is possible to reliably prevent the generation of particles without reducing the productivity of the wafer W.

Further, since it is not necessary to use a rinse agent, the productivity of the wafer W can be improved, and the rinse agent can be reliably prevented from being scattered and attacked by the film.
Further, in the present embodiment, since the heater 20 is provided for drying the liquid repellent material ejected (supplied) from the spray nozzle 19 and attached to the edge of the wafer W, the liquid repellent film can be formed quickly. . Thereby, the productivity of the film can be further improved.
Furthermore, since the liquid repellent film can be continuously formed on the edges of both surfaces of the wafer W at one place without moving the liquid repellent film forming head 16, the liquid repellent film can be formed efficiently. .

Second Embodiment
Next, a second embodiment of the film forming apparatus of the present invention will be described.
FIG. 4 is a diagram showing a schematic configuration of the liquid repellent film forming head in the second embodiment of the film forming apparatus of the present invention, and FIG. 4 (A) is a side view of the liquid repellent film forming head. FIG. 4B is a longitudinal sectional view taken along line CC in FIG.

Hereinafter, the film forming apparatus according to the second embodiment will be described with a focus on differences from the first embodiment, and description of similar matters will be omitted.
The film forming apparatus of the second embodiment is the same as the first embodiment except for the liquid repellent film forming head.
In FIG. 4, the liquid repellent film forming head 22 is a rectangular parallelepiped liquid repellent material discharge device having a groove-shaped opening 25, and the liquid repellent film forming head 22 has a U-shape when viewed from the side. The groove width in the vertical direction of the portion 25 is set to be larger than the thickness of the wafer W, as in the liquid repellent film forming head 16 described above.

The liquid repellent film forming head 22 has, for example, a plasma spray nozzle 23 as a nozzle for ejecting (supplying) a gaseous liquid repellent material on each of the opposing surfaces 24a and 24b.
Examples of the plasma injection nozzle 23 include various plasma devices. For example, a remote plasma device can be used.
According to the remote plasma apparatus, a gaseous liquid repellent material can be generated relatively easily by a high-frequency electric field.

The gaseous liquid repellent material is not particularly limited, for example, tetrafluoromethane _(CF 4), tetrafluoroethylene _{(C 2 F} 4), propylene hexafluoride _{(C 2 F} 4), eight fluoride those plasma a fluorine compound such as butylene (C 4 _{F 8)} and the like. By forming a liquid repellent film using these materials, a liquid repellent film exhibiting excellent liquid repellency can be rapidly formed.

Here, active fluorine gas (fluorine plasma) is generated by converting the fluorine compound into plasma using a remote plasma apparatus. Then, this active fluorine gas is irradiated onto the surface of the edge of both surfaces of the wafer W, and adsorbs, bonds, etc. to the surface of the wafer W, for example. As a result, a liquid repellent film is formed on the edges of both surfaces of the wafer W.
Here, when the edge of the rotating wafer W is accommodated in the opening 25 of the liquid repellent film forming head 22, the facing surfaces 24 a and 24 b face the one surface and the other surface of the wafer W, respectively.

  Each of the facing surfaces 24a and 24b has a plasma spray nozzle 23. The liquid repellent film forming head 22 is arranged along the edge of the wafer W on each surface. Therefore, the liquid repellent film forming head 22 can continuously form the liquid repellent film on the edges of both surfaces of the wafer W by rotating the wafer W by the moving means described above.

According to the second embodiment of the film forming apparatus of the present invention, since the liquid repellent film is formed on the edges of both surfaces of the wafer W, the same effect as the film forming apparatus 1 of the first embodiment is obtained. be able to.
Further, in this film forming apparatus, since the plasma injection nozzle 23 ejects the active fluorine gas to form the liquid repellent, the liquid repellent film can be rapidly formed without performing a treatment such as drying.

<Third Embodiment>
Next, a film forming method and a film forming apparatus according to a third embodiment of the present invention will be described.
In the following description, an FPD (Flat Panel Display) substrate will be described as an example of a substrate on which a film is formed.
FIG. 5 is a side view showing a third embodiment of the film forming apparatus of the present invention, and FIG. 6 is a plan view of the film forming apparatus of FIG. Hereinafter, for convenience of explanation, the upper side in FIG. 5 is referred to as “upper”, the lower side is referred to as “lower”, the left side is referred to as “front”, the right side is referred to as “rear”, the upper side in FIG. It is called “Left”.

  As shown in FIGS. 5 and 6, the film forming apparatus 26 includes a substrate transport unit 28 that transports an FPD substrate 32 to which a liquid film forming material is applied, and a film forming material on one surface of the FPD substrate 32. Film forming material supply slit (film forming material supply part) 29 and a liquid repellent film forming part 30 for forming a liquid repellent film on the edge of the FPD substrate 32. Hereinafter, each of these components will be described sequentially.

The substrate transport unit 28 includes a front transport unit 28a disposed in front and a rear transport unit 28b disposed rearward at a predetermined interval from the front transport unit 28a. Each of the front conveyance unit 28a and the rear conveyance unit 28b includes a plurality of rotating rollers 31 arranged in parallel to each other in a horizontal plane. These rotating rollers 31 place an FPD substrate 32 thereon. The substrate transport unit 28 transports the placed FPD substrate 32 in the direction of the arrow (forward) in FIG. 5 by rotating each rotation roller 31 counterclockwise in FIG. In other words, in the present embodiment, the substrate transport unit 28 has moving means for moving the FPD substrate 32 relative to the film forming material supply slit (film forming material supply unit) 29 and the liquid repellent film forming unit 30. It is composed.
Each rotating roller 31 is controlled to be freely rotated and stopped by a control unit (not shown).

  The film forming material supply slit 29 is disposed to face the front conveyance unit 28a. The distance in the vertical direction between each rotating roller 31 and the film forming material supply slit 29 in the front transport unit 28a is set to be approximately the same as the thickness of the FPD substrate 32. Therefore, when the FPD substrate 32 is transported forward by the substrate transport portion 28, the film forming material supply slit 29 faces one surface of the FPD substrate 32.

When the FPD substrate 32 is transported forward by the substrate transport unit 28 and the film forming material supply slit 29 faces one surface of the FPD substrate 32, the FPD substrate 32 is removed from the film forming material supply slit 29. A film forming material is supplied toward one surface.
Here, the length of the film forming material supply slit 29 in the left-right direction is set to be substantially the same as the width of the FPD substrate 32. Therefore, the film forming material is supplied (applied) over substantially the entire one surface of the FPD substrate 32.

  Then, the applied film forming material is subjected to a predetermined process such as a baking process (heating process) as necessary, and the film forming material is cured (dried), whereby one of the FPD substrates 32 is provided. A film is formed on the surface. Note that, by appropriately selecting a film forming material, for example, a film (functional film) having a desired function such as a conductor film, an insulating film, a semiconductor film, or a resist film can be formed.

The liquid repellent film forming unit 30 is disposed between the front transport unit 28a and the rear transport unit 28b in the front-rear direction.
The liquid repellent film forming unit 30 includes an upper film forming unit 35 disposed above the transport surface of the FPD substrate 32 and a lower film forming unit 36 facing the upper film forming unit 35.
The upper film forming part 35 and the lower film forming part 36 are arranged apart from each other. The separation distance is set to several times the thickness of the FPD substrate 32. Therefore, when the FPD substrate 32 is transferred forward by the substrate transfer unit 28, the upper film forming unit 35 faces one surface of the FPD substrate 32, and the lower film forming unit 36 is set to the FPD substrate 32. Opposite to the other surface.

The upper film forming portion 35 includes a front and rear end film forming head 37 and two side end film forming heads 38a and 38b.
The front and rear end film forming head 37 is a rectangular parallelepiped liquid repellent material discharge device, and is set so that the length in the left-right direction is substantially equal to the width of the FPD substrate 32. The position in the left-right direction and the position in the left-right direction of the FPD substrate 32 are arranged to coincide with each other.
Further, the front and rear end film forming head 37 has a plurality of plasma spray nozzles 39 arranged linearly in the left-right direction on the surface facing the FPD substrate 32.

The side end film forming heads 38a and 38b are cuboid liquid repellent material discharge devices. And it arrange | positions so that each of the edge part (henceforth a "side edge part" only) regarding the left-right direction of the board | substrate 32 for FPD may be opposed.
The side end film forming heads 38 a and 38 b also have one plasma injection nozzle 39 on the surface facing the FPD substrate 32.

Each plasma spray nozzle 39 has the same configuration as the plasma spray nozzle 23 in the second embodiment, and ejects the same active fluorine gas as described above.
The ejected active fluorine gas is adsorbed and bonded to the FPD substrate 32 to form a liquid repellent film.
Further, the lower film forming part 36 has the same configuration as the upper film forming part 35.

  When the FPD substrate 32 is transferred forward by the substrate transfer unit 28, the upper film forming unit 35 faces one surface of the FPD substrate 32, and the lower film forming unit 36 is connected to the other side of the FPD substrate 32. It will face the surface. At this time, the side end film forming heads 38 a and 38 b eject active fluorine gas from the plasma spray nozzle 39 toward both surfaces of the side edge portion of the FPD substrate 32. As a result, a liquid repellent film is continuously formed on both sides of the side edge from the front end to the rear end of the FPD substrate 32.

  Further, in this case, the front and rear end film forming head 37 is opposed to an edge portion (hereinafter referred to as “front end edge portion”) and a rear end edge (hereinafter referred to as “rear end edge portion”) of the FPD substrate 32. At the timing, the active fluorine gas is ejected from the plasma spray nozzle 39 toward both surfaces of the FPD substrate 32. Thus, a liquid repellent film is formed on both the front edge portion and the rear edge portion.

Below, the film-forming method which the film-forming apparatus 26 of this embodiment performs is demonstrated sequentially.
[1] First, after the FPD substrate 32 is placed on the rear conveyance unit 28b, the rotation roller 31 is rotated to convey the FPD substrate 32 forward.
[2] Next, when the front and rear end film forming head 37 faces the front end edge of the FPD substrate 32, the plasma spray nozzles 39 of the front and rear end film forming head 37 are directed to both surfaces of the front end edge. Activated fluorine gas. As a result, a liquid repellent film is formed on the front edge portions of both surfaces of the FPD substrate 32.
[3] After that, when the side end film forming heads 38a and 38b are opposed to the side edge of the FPD substrate 32, the side end film forming heads 38a and 38b are not opposed to the side edge. The active fluorine gas is ejected from the respective plasma spray nozzles 39 in the direction of the side edges. As a result, a liquid repellent film is formed on the side edges of both surfaces of the FPD substrate 32.
[4] Next, when the front and rear end film forming head 37 faces the rear end edge of the FPD substrate 32, both surfaces of the rear end edge from each plasma spray nozzle 39 of the front and rear end film forming head 37 are provided. Activated fluorine gas is ejected toward As a result, a liquid repellent film is formed on the rear edge portions of both surfaces of the FPD substrate 32.
In this way, a liquid repellent film is continuously formed on the edges of both surfaces of the FPD substrate 32.

[5] Then, from when the film forming material supply slit 29 is opposed to one surface of the FPD substrate 32 until the film forming material supply slit 29 is not opposed to this one surface, the film forming material supply slit 29 is connected to the FPD substrate 32. The film forming material is supplied toward one surface of the film. As a result, the film forming material is supplied over substantially the entire one surface of the FPD substrate 32. Then, by curing this film forming material, a film is formed over substantially the entire one surface of the FPD substrate 32.

In curing the film forming material, a predetermined process such as a baking process (heating process) may be performed as necessary.
When this film-forming material is supplied over almost the entire surface of one side of the FPD substrate 32, a liquid repellent film is formed on the edges of both surfaces of the FPD substrate 32. Thereby, it can suppress or prevent suitably that the film formation material dripped from the edge part of one surface permeates into the other surface, and adheres unintentionally.
According to the film forming apparatus according to the third embodiment of the present invention as described above, since the liquid repellent film is formed on the edges of both surfaces of the FPD substrate 32, the above-described first embodiment is achieved. The same effect as the membrane device 1 can be obtained.

Further, while the FPD substrate 32 is transported forward, the side end film forming heads 38a and 38b are activated fluorine atoms by a plasma spray nozzle 39 from a predetermined position toward the side edge of the FPD substrate 32. Spout gas. Accordingly, the FPD substrate 32 is continuously moved from the front end to the rear end of the FPD substrate 32 on both sides of the side edge of the FPD substrate 32 without moving the position where the active fluorine gas is ejected toward the FPD substrate 32. Thus, a liquid repellent film can be formed. As a result, the liquid repellent film can be efficiently formed.
In the present embodiment, the case where a plasma spray nozzle is provided as the nozzle provided in the liquid repellent film forming unit 30 has been described. However, the present invention is not limited to such a configuration, and the same nozzle as described in the first embodiment is used. May be provided.

<Fourth embodiment>
Next, a fourth embodiment of the film forming apparatus of the present invention will be described.

FIG. 7 is a diagram showing a schematic configuration of the liquid repellent film forming head in the fourth embodiment of the film forming apparatus of the present invention, and FIG. 7A is a side view of the liquid repellent film forming head. FIG. 7B is a longitudinal sectional view taken along line DD in FIG.
Hereinafter, the film forming apparatus according to the fourth embodiment will be described with a focus on differences from the first embodiment, and description of similar matters will be omitted.

The film forming apparatus of the fourth embodiment is the same as the first embodiment except that the number of spray nozzles and heaters provided in the liquid repellent film forming head and the installation location are different.
In the liquid repellent film forming head 16 ′ of the present embodiment, the spray nozzle 19 and the heater 20 are arranged side by side on the opposing surfaces 18 a and 18 b, respectively, and the spray nozzle 19 and the heater 20 are also formed on the opening surface 18 c. Arranged side by side. Thereby, the liquid repellent film can be continuously formed on the edge portions of both surfaces of the wafer W and also on the end surfaces thereof.

As a result, according to the fourth embodiment of the film forming apparatus of the present invention, it is possible to suitably prevent the film forming material from adhering to the edge portions of both surfaces of the wafer W, and to form the film on the end surface. It is also possible to suitably prevent the forming material from adhering. Thereby, the generation of particles can be prevented more reliably without reducing the productivity of the wafer W.
In the present embodiment, the formation of the liquid repellent film on the end surface of the wafer W is described in addition to the configuration of the first embodiment. However, the present invention is not limited to this, and the configuration of the second embodiment or the third embodiment. In addition, the configuration described in this embodiment may be used in combination.

As described above, the film forming method, the film forming apparatus, and the film have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each unit is an arbitrary configuration having the same function. Can be substituted. Moreover, other arbitrary structures and processes may be added to the present invention.
In the above-described embodiment, when the liquid repellent film is formed, the liquid repellent film formation head does not move, but the liquid repellent film formation head moves the edge of the substrate, so that the liquid repellent film becomes the edge. It may be formed.

In the above-described embodiment, as an example of the substrate on which the film is formed, the substrate having a substantially constant thickness has been described. However, the substrate may have a configuration in which the thickness gradually decreases at the end. Good.
In the embodiment described above, the film forming method of the present invention is applied to spin coating (first embodiment, second embodiment, fourth embodiment) and slit coating (third embodiment), but the present invention is applied. The film forming method to be applied is not limited to these, and can be applied to a film forming method including a step of applying a liquid material, specifically, a device manufacturing method. For example, it can be applied to gap coating, spray coating, inkjet, etc. May be.
The device manufacturing method to which the film forming method of the present invention can be applied is not limited to the above-described semiconductor wafer and FPD substrate, for example, an LCD (Liquid Crystal Display) substrate, an EL (Electric Luminescence) element, and a PDP (Plasma Display Panel). ) Substrate and the like can also be manufactured.

It is a top view which shows 1st Embodiment of the film-forming apparatus of this invention. It is sectional drawing in line AA of FIG. FIG. 3 is a diagram showing a schematic configuration of the liquid repellent film forming head in FIG. 1, FIG. 3A is a side view of the liquid repellent film forming head, and FIG. 3B is a line B in FIG. It is a longitudinal cross-sectional view in -B. FIG. 4 is a diagram showing a schematic configuration of a liquid repellent film forming head in a second embodiment of the film forming apparatus of the present invention, FIG. 4A is a side view of the liquid repellent film forming head, and FIG. FIG. 5 is a longitudinal sectional view taken along line CC in FIG. It is a side view which shows 3rd Embodiment of the film-forming apparatus of this invention. It is a top view of the film-forming apparatus of FIG. FIG. 7A is a diagram showing a schematic configuration of a liquid repellent film forming head in a fourth embodiment of the film forming apparatus of the present invention, FIG. 7A is a side view of the liquid repellent film forming head, and FIG. FIG. 8 is a longitudinal sectional view taken along line DD in FIG.

Explanation of symbols

W ... wafer, 1,26 ... deposition apparatus, 2 ... wafer support unit, 3 ... recovery unit, 4 ... film forming material supply unit, 5,30 ... liquid repellent film formation unit, 6 ... Placement plate, 7, 13, 33 ... Rotation transmission shaft, 8, 14, 21 ... Motor, 9 ... Catch container for surplus film forming material, 10 ... Air cylinder, 11 ... Shaft, 12 ... Film formation Material discharge nozzle, 15, 34 ... Arm, 16, 16 ', 22 ... Liquid repellent film forming head, 17, 25 ... Opening, 18a, 18b, 24a, 24b ... Opposing surface, 18c ... Opening surface , 19 ... Spray nozzle, 20 ... Heater, 23, 39 ... Plasma spray nozzle, 28 ... Substrate transport section, 29 ... Film forming material supply slit, 31 ... Rotating roller, 32 ... Substrate for FPD, 35... Upper film forming part, 36... Lower film forming part, 37. Forming head, 38a, 38b...

Claims (13)

A film forming method for forming a film on one surface of a substrate by supplying a liquid film forming material by a coating method,
Prior to supplying the film-forming material to one side of the substrate,
By forming a liquid repellent film by supplying a liquid repellent material to the edge of one surface and the edge of the other surface of the substrate, the film forming material enters the other surface side of the substrate. A film forming method characterized by preventing the above.   The film forming method according to claim 1, wherein when forming the liquid repellent film, the liquid repellent film is also formed on an end surface of the substrate.   The film forming method according to claim 1, wherein the liquid repellent film is formed by supplying a liquid repellent material to the substrate and then drying the liquid repellent film. When the average thickness of the liquid repellent film is A [mm] and the average thickness of the film to be formed is B [mm], A / B is 1 × 10 ^{−4 to} 5 × 10 ^−1. The film forming method according to claim 3, wherein:   5. The film forming method according to claim 3, wherein the liquid repellent material is a liquid containing a fluorine-based coupling agent.   The film forming method according to claim 1, wherein the liquid repellent film is formed by supplying a gaseous liquid repellent material to the substrate.   The film forming method according to claim 6, wherein the gaseous liquid repellent material is obtained by converting a fluorine compound into plasma.   8. The liquid repellent film is formed by supplying the liquid repellent material at the predetermined location when the edge of the substrate passes through the predetermined location while rotating the substrate. The film forming method according to any one of the above.   The liquid repellent film is formed by supplying the liquid repellent material at the predetermined location when the edge of the substrate passes through the predetermined location while transporting the substrate. The film forming method according to any one of the above.   The film forming method according to claim 1, wherein at least part of the liquid repellent film is removed after the film is formed.   A film formed by the film forming method according to claim 1.   12. The film according to claim 11, wherein the film satisfies a relationship of D / C of 0.3 to 2.0 when the thickness of the central portion is C [mm] and the thickness of the edge portion is D [mm]. The membrane described. A film forming apparatus for use in the film forming method according to claim 1,
A film forming material supply unit for forming the film by supplying the film forming material to the substrate by a coating method;
A liquid repellent film forming part for supplying the liquid repellent material to the substrate to form the liquid repellent film;
A film forming apparatus comprising: a moving unit that moves the substrate relative to the film forming material supply unit and the liquid repellent film forming unit.

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