JP2006093362A - Lift head structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate a fault resulting from deep hole working to a housing. <P>SOLUTION: A lift head structure is constituted of a boss 22 fixed to the housing 12 in a ball spline 15 and a spline shaft 23 in which only movement in a vertical direction is permitted to the boss 22, and a pipe 34 which communicates with the hollow part 31 of the spline shaft 23 is connected to a negative pressure pump with a hose 35. A bearing 41 which supports a needle pin 44 is formed at the upper end of the spline shaft 23, and a communicating hole 43 which communicates to the bearing 41 is formed at the hollow part 31 of the spline shaft 23. An entrance 52 and a vacuum hole 53 which the needle pin 44 goes in and out are opened in a stage 51 of the upper surface of a head 14. Negative pressure supplied to the internal space 54 of the head 14 through the hollow part 31 and the communication hole 43 of the spline shaft 23 is supplied to the vacuum hole 53. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a push-up head structure that pushes up a chip attached to a wafer sheet in a die bonding apparatus.

  2. Description of the Related Art Conventionally, as shown in FIG. 2, a die bonding apparatus is provided with a push-up head 701, and is configured to push up a target chip 703 when picking up a chip 703 adhered to a wafer sheet 702. ing.

  A needle pin 712 that pushes up the tip 703 is accommodated in the head portion 711 of the push-up head 701, and the needle pin 712 is attached to a bearing 714 provided at the upper end portion of the operating shaft 713. The operation shaft 713 is supported by a housing 716 via a stroke bearing 715, and a fixed block 717 is fixed to the lower end portion of the operation shaft 715.

  As shown in FIG. 3, a driven bearing 721 is provided at the lower end of the fixed block 717, and the driven bearing 721 rolls on the peripheral surface of the cam 723 rotated by the drive motor 722. It is configured as follows. Accordingly, the operating shaft 713 and the needle pin 712 supported by the operating shaft 713 are configured to move up and down according to the rotation angle of the cam 723, and the chip adhered to the wafer sheet 702. It is configured so that it can be peeled off from the wafer sheet 702 by pushing up 703.

  A flat straight surface 731 is formed on the side of the fixed block 717, and a miniature bearing 732 is biased to the straight surface 731. As a result, the fixed block 731 is configured with a detent 733 that restricts rotation, prevents the needle pin 712 attached to the operating shaft 713 from rotating, and the needle pin caused by eccentricity at the time of attachment. 712 is configured to prevent positional deviation 712.

  As shown in FIG. 2, the housing 716 surrounding the operating shaft 713 has a deep hole 741 drilled in the vertical direction, and its lower end is closed. In addition, the upper end portion of the deep hole 741 communicates with an internal space 742 in which the operation shaft 713 is accommodated, and a midway portion of the deep hole 741 is connected via a pipe 743 provided on the side. It is connected to a negative pressure supply source not shown. Thus, the negative pressure supplied from the negative pressure supply source is supplied to the internal space 744 of the head portion 711 and the negative pressure is supplied to the vacuum hole 746 opened in the stage 745 on the upper surface of the head portion 711. Thus, the wafer sheet 702 around the target chip 703 is attracted to the stage 745 so that the upward movement of the wafer sheet 702 when the needle 712 is pushed up is suppressed.

  However, such a push-up head 701 has a structure in which a deep hole 741 for supplying negative pressure is drilled in the housing 715, so that the structure is complicated and requires a lot of time for assembly, adjustment, maintenance, etc. It was a hindrance to cost.

  The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a push-up head structure capable of eliminating the problems caused by the deep hole machining in the housing.

  In order to solve the above problems, in the push-up head structure of the present invention, when a needle pin provided in the head portion is moved up to push up a chip on a wafer sheet disposed on the stage on the top surface of the head portion. In a push-up head for supplying a negative pressure to a vacuum hole provided in the stage to suck the wafer sheet, a boss portion supported by the housing in the housing of the push-up head, and the boss portion Provided is a ball spline consisting of a hollow spline shaft that is only allowed to move up and down, a bearing that supports the needle pin at the upper end of the spline shaft, and a lower end of the spline shaft within the spline shaft. While connecting a negative pressure supply source for supplying a negative pressure to the hollow portion, the upper end of the spline shaft is connected to the housing. Interior space of the head part provided with the parts and the hollow portion communicates to the negative pressure supplied to the hollow portion through the inner space provided communicating holes for supplying to said vacuum hole.

  That is, the needle pin that pushes up the tip is supported by a bearing provided on the spline shaft of the ball spline, and the spline shaft is only allowed to move up and down with respect to the boss portion supported by the housing of the push-up head. ing. Therefore, inadvertent rotation of the needle pin supported by the bearing can be prevented without providing an anti-rotation mechanism for preventing rotation of the bearing.

  Further, the spline shaft of the ball spline is hollow, and the negative pressure supplied to the lower portion of the spline shaft is supplied to the internal space in the head portion through the communication hole in the upper portion of the spline shaft. can do. As a result, the negative pressure supplied to the hollow portion of the spline shaft is supplied to the vacuum hole through the internal space, and the wafer sheet on the stage is adsorbed by the negative pressure.

  As described above, in the push-up head structure according to the present invention, the needle pin support mechanism is configured by a ball spline, so that the needle pin is not prepared while allowing the bearing supporting the needle pin to move up and down. Rotation can be prevented. For this reason, the mechanism is simplified and the cost is low as compared with the conventional case in which a stroke bearing that supports the needle pin so as to be movable up and down and a detent that prevents the needle pin from rotating is provided. Can be achieved.

  Moreover, by making the spline shaft of the ball spline hollow, a negative pressure can be supplied from the lower part to the upper part partitioned by the ball spline.

  This eliminates the need for processing the housing of the deep hole for negative pressure supply, simplifies the configuration, assembly, adjustment, maintenance, etc., eliminates the problems caused by these, and reduces the cost. Can be planned.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a push-up head 1 provided with a push-up head structure according to the present embodiment. The push-up head 1 picks up a chip 3 attached to a wafer sheet 2 with a bonding head 4 and leads it. It is provided in a die bonding apparatus for bonding to a frame bonding point.

  This push-up device 1 includes a cylindrical housing 12 supported by a support portion 11 and a head portion 14 fitted and fixed to a small-diameter portion 13 above the housing 12. The upper part is formed in a closed cylindrical shape. A ball spline 15 is provided in the housing 12.

  The ball spline 15 is configured by a boss portion 22 constituting an outer peripheral portion fixed to the housing 12 with a fixing screw 21 in a state fitted in the housing 12, and a spline shaft 23 disposed in the boss portion 22. The spline shaft 23 is vertically moved with respect to the boss portion 22 by a vertical groove formed in the spline shaft 23 and the boss portion 22 and a ball provided between the grooves (not shown). It is configured that only the movement of is allowed.

  The spline shaft 23 is formed in a cylindrical shape, and a hollow portion 31 extending in the axial direction is provided inside. The lower end portion of the spline shaft 23 is fixed with a fixing screw 33 in a state in which the block 32 is fitted, and the block 32 is configured to be driven in the vertical direction by a driving mechanism (not shown). . A cylindrical pipe 34 communicating with the hollow portion 31 of the spline shaft 23 projects from the block 32 toward the side. The pipe 34 is connected to a negative pressure pump constituting a negative pressure supply source via a hose 35, and the negative pressure generated by the negative pressure pump is supplied to the hollow portion 31 of the spline shaft 23. It is configured as follows.

  A bearing 41 is fixed to the upper end portion of the spline shaft 23 with a fixing screw 42, and a communication hole 43 communicating with the hollow portion 31 of the spline shaft 23 is formed on a side surface of the bearing 41. . A chuck 45 for detachably fixing the needle pin 44 is provided at the upper end portion of the bearing 41, and the needle pin 44 is configured to be replaceable.

  The upper surface of the head portion 14 constitutes a stage 51 that is in contact with the lower surface of the wafer sheet 2, and an inlet / outlet port 52 through which the needle pin 44 enters and exits is provided in the center portion. A vacuum hole 53 is formed in the outer peripheral portion of the entrance / exit 52, and the vacuum hole 53 communicates with an internal space 54 surrounded by the head portion 14.

  As a result, the negative pressure supplied from the negative pressure pump passes through the hollow portion 31 and the communication hole 43 of the spline shaft 23 to the inside of the head portion 14 provided above the ball spline 15. After being supplied to the space 54, it is configured to be supplied to the upper surface of the stage 51 through the vacuum hole 53, and the needle pin 44 is moved up by the drive mechanism so that the chip on the wafer sheet 2 is moved. When pushing up 3, the wafer sheet 2 is attracted and fixed to the stage 51 by the negative pressure supplied to the vacuum hole 53, thereby preventing upward escape.

  In the present embodiment according to the above configuration, the needle pin 44 that pushes up the tip 3 is attached to a bearing 41 provided on the spline shaft 23 of the ball spline 15, and the spline shaft 23 corresponds to the push-up head 1. Only vertical movement with respect to the boss portion 22 supported by the housing 12 is allowed. Therefore, inadvertent rotation of the needle pin 44 attached to the bearing 41 can be prevented without separately providing a detent mechanism for preventing the rotation of the bearing 41.

  As a result, the mechanism can be simplified as compared with the conventional case in which a stroke bearing for supporting the needle pin 44 so as to be movable up and down and a rotation stopper for preventing the needle pin 44 from rotating are provided. Cost reduction can be achieved.

  The spline shaft 23 of the ball spline 15 is hollow, and the negative pressure supplied from the lower portion of the spline shaft 23 is applied to the spline shaft 23 through the communication hole 43 at the upper portion of the spline shaft 23. It can be supplied to an internal space 54 in the head portion 14 provided above the ball spline 15.

  This eliminates the need for processing the deep hole for supplying negative pressure into the housing 12 and simplifies the configuration, assembly, adjustment, maintenance, and the like. Therefore, the malfunction resulting from these can be eliminated and cost reduction can be achieved.

It is sectional drawing which shows one embodiment of this invention. It is sectional drawing which shows the conventional pushing-up head. FIG. 3 is a view as seen from an arrow A in FIG. 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Push-up head 2 Wafer sheet 3 Chip 12 Housing 14 Head part 15 Ball spline 22 Boss part 23 Spline shaft 31 Hollow part 41 Bearing 43 Communication hole 44 Needle pin 51 Stage 53 Vacuum hole 54 Internal space

Claims (1)

When the needle pin provided in the head portion is moved upward to push up the chip on the wafer sheet disposed on the stage on the top surface of the head portion, negative pressure is supplied to a vacuum hole provided in the stage to thereby supply the wafer In the push-up head that sucks the sheet,
A ball spline comprising a boss portion supported by the housing and a hollow spline shaft that is only allowed to move up and down with respect to the boss portion is provided in the housing of the push-up head, and is provided at the upper end of the spline shaft. While providing a bearing that supports the needle pin, and connecting a negative pressure supply source that supplies a negative pressure to the hollow portion in the spline shaft, at the lower end of the spline shaft,
The upper end portion of the spline shaft communicates with the inner space of the head portion provided in the upper portion of the housing and the hollow portion, and the negative pressure supplied to the hollow portion is communicated with the vacuum through the inner space. A push-up head structure characterized in that a communication hole for supplying the hole is provided.

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