JP2006093237A - Semiconductor integrated circuit arranging device, method of manufacturing integrated circuit device, and semiconductor integrated circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To fix a semiconductor integrated circuit to a substrate by flexibly changing the arranged state of the circuit. <P>SOLUTION: After an IC chip 42 provided with optical elements 88 on its side face is positioned at a height at which the optical elements 88 can make optical communication with the optical elements of the other IC chip by holding the chip 42 by means of an arm 50, the chip 42 is fixed on a printed circuit board 30 with a bonding agent. Therefore, even if it is required to fix the IC chip 42 at a different height, the fixation can be dealt with flexibly. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor integrated circuit arrangement device, a method of manufacturing a semiconductor integrated circuit device, and a semiconductor integrated circuit device, and more particularly, a semiconductor integrated circuit arrangement device that arranges a semiconductor integrated circuit on a substrate, and a semiconductor integrated circuit arranged on a substrate. The present invention relates to a semiconductor integrated circuit device manufacturing method for manufacturing a semiconductor integrated circuit device, and a semiconductor integrated circuit device including a semiconductor integrated circuit and a substrate.

  Conventionally, an IC chip having an optical element (light emission or light reception) on a side surface is disposed on a printed circuit board having another optical element (light reception or light emission), and between the optical element of the IC chip and the optical element on the printed circuit board. A device for optical communication and the like has been proposed. In this case, the height position and angle of the IC chip on the printed circuit board are expected to be properly communicated between the optical element of the IC chip and the optical element on the printed circuit board. If it is not a planned height position or angle, optical communication cannot be performed.

In view of this, an optical module (Patent Document 1) has been proposed in which, when an optical element is arranged on a substrate, the height of the optical element is determined by the height of a bump for temporary connection. That is, the temporary connection bumps are sandwiched and fixed between the optical element and the substrate.
JP 2002-111113 A

  However, when it is desired to arrange the plurality of optical elements at different heights, provisional connection bumps corresponding to the respective heights are required, and the height of the optical elements cannot be adjusted flexibly.

  The present invention provides a semiconductor integrated circuit arrangement device capable of flexibly changing the arrangement state and fixing the semiconductor integrated circuit, a method for manufacturing the semiconductor integrated circuit device, and a semiconductor integrated circuit device related thereto. With the goal.

  In order to achieve the above object, a semiconductor integrated circuit placement device according to the first aspect of the present invention includes a holding means for holding a semiconductor integrated circuit and moving the holding means so that the semiconductor integrated circuit moves three-dimensionally. Moving means, control means for controlling the moving means so that the semiconductor integrated circuit is in a predetermined arrangement state with respect to the substrate, and maintaining the semiconductor integrated circuit in the predetermined arrangement state with respect to the substrate. And a fixing means for fixing the semiconductor integrated circuit to the substrate.

  According to a seventh aspect of the present invention, there is provided a method for manufacturing a semiconductor integrated circuit device, wherein the semiconductor integrated circuit is maintained in a predetermined arrangement state with respect to the substrate, and the semiconductor integrated circuit is maintained in the predetermined arrangement state with respect to the substrate. In this state, the semiconductor integrated circuit is fixed to the substrate.

  The holding means holds the semiconductor integrated circuit, and the moving means moves the holding means so that the semiconductor integrated circuit moves three-dimensionally.

  The control means controls the moving means so that the semiconductor integrated circuit is in a predetermined arrangement state with respect to the substrate. That is, the semiconductor integrated circuit can be maintained in a predetermined arrangement state with respect to the substrate.

  The fixing means fixes the semiconductor integrated circuit to the substrate in a state where the semiconductor integrated circuit is maintained in the predetermined arrangement state with respect to the substrate.

  Note that a groove may be formed at the end of the surface facing the substrate in the semiconductor integrated circuit. Thereby, the fixing means fixes the semiconductor integrated circuit to the substrate by supplying an adhesive, for example, in a space formed by the groove and the substrate in the semiconductor integrated circuit.

  Thus, in the present invention, the semiconductor integrated circuit is maintained in a predetermined arrangement state with respect to the substrate by controlling the moving means, and in this state, the semiconductor integrated circuit is fixed to the substrate. Since it is sufficient to control the moving means, the semiconductor integrated circuit can be fixed to the substrate by flexibly changing the arrangement state.

  Here, the predetermined arrangement state may be that the semiconductor integrated circuit and the substrate are parallel to each other and the height of the semiconductor integrated circuit is a predetermined height.

  In this case, using the height teaching means indicating a predetermined reference height, the control means detects the reference height by positioning the holding means on the height teaching means, and based on the detected reference height. Thus, the moving means is controlled so that the height of the semiconductor integrated circuit becomes a predetermined height.

  Further, the predetermined arrangement state may be such that an angle formed by the semiconductor integrated circuit and the substrate is a predetermined angle (greater than 0 degrees).

  In this way, the moving means is controlled so that the angle formed between the semiconductor integrated circuit and the substrate is a predetermined angle (greater than 0 degrees), and in this state, the semiconductor integrated circuit is fixed to the substrate. Even if it is desired to change the angle formed between the semiconductor integrated circuit and the substrate, it is only necessary to control the moving means, so that the angle formed between the semiconductor integrated circuit and the substrate can be flexibly changed into various arrangement states. It can be fixed to the substrate.

  In this case, one end side of the semiconductor integrated circuit is positioned on the substrate, and the other end side is placed, thereby supporting the semiconductor integrated circuit so that an angle formed between the semiconductor integrated circuit and the substrate becomes a predetermined angle. And supporting means arranged on the substrate, wherein the control means controls the moving means so that one end side of the semiconductor integrated circuit is located on the substrate and the other end side is placed on the supporting means. Also good. The angle formed between the semiconductor integrated circuit and the substrate is set to a predetermined angle by moving the support means while one end side of the semiconductor integrated circuit is positioned on the substrate and the other end side is placed on the support means. Fine adjustments may be made so that

  Further, as described above, when the predetermined arrangement state is that the angle formed between the semiconductor integrated circuit and the substrate is a predetermined angle (greater than 0 degrees), the portion of the semiconductor integrated circuit that is in contact with the substrate is defined as the semiconductor integrated circuit. The angle formed with the substrate may be smaller than a predetermined angle. For example, a portion in contact with the substrate of the semiconductor integrated circuit may have a tapered shape or an arc shape. As described above, when the portion of the semiconductor integrated circuit that is in contact with the substrate has a shape in which the angle formed between the semiconductor integrated circuit and the substrate is smaller than a predetermined angle, the adhesive is supplied to the semiconductor integrated circuit and the substrate. The area corresponding to the adhesive in the portion in contact with the substrate can be increased, and the adhesion effect can be enhanced.

  According to a thirteenth aspect of the present invention, a semiconductor integrated circuit in which an optical element for optical communication is arranged on one side and the one side of the semiconductor integrated circuit are arranged to face each other, and the optical element and the optical communication are arranged. A semiconductor integrated circuit device comprising: a substrate having an optical waveguide formed therein, wherein the optical element communicates optically through the waveguide, and the semiconductor integrated circuit and the substrate The semiconductor integrated circuit is disposed on the substrate such that an angle formed is a predetermined angle (greater than 0 degrees).

  The predetermined angle may be determined by a waveguide formed on the substrate.

  Therefore, the semiconductor integrated circuit is arranged on the substrate so that the optical element performs optical communication through the waveguide and the angle formed between the semiconductor integrated circuit and the substrate is a predetermined angle. It is possible to flexibly cope with the angle required by the waveguide.

  In this case, as described in claim 14, one end side of the semiconductor integrated circuit is positioned on the substrate and the other end side is placed, whereby an angle formed between the semiconductor integrated circuit and the substrate becomes a predetermined angle. And supporting means disposed on the substrate for supporting the semiconductor integrated circuit, wherein one end side of the semiconductor integrated circuit is positioned on the substrate and the other end side is placed on the supporting means. May be.

  The portion of the semiconductor integrated circuit that contacts the substrate may have a shape in which an angle formed by the semiconductor integrated circuit and the substrate is smaller than a predetermined angle. For example, as described above, the portion of the semiconductor integrated circuit that contacts the substrate may be tapered or arcuate. Thereby, as described above, the area corresponding to the adhesive in the portion in contact with the substrate of the semiconductor integrated circuit can be increased, and the adhesion effect can be enhanced.

  The invention according to claim 16 is a semiconductor integrated circuit device configured by arranging a semiconductor integrated circuit on a substrate, and is provided with an adhesive supplying agent at an end of a surface of the semiconductor circuit facing the substrate. A groove is formed.

  Thus, since the groove | channel for adhesive supply is formed in the edge of the surface facing the board | substrate in a semiconductor circuit, an adhesive agent is supplied to the space formed by this groove | channel and a board | substrate, and a semiconductor circuit and a board | substrate And fix.

  As described above, the present invention has an effect that the semiconductor integrated circuit can be fixed by flexibly changing the arrangement state.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a first embodiment of the invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the mounter as the semiconductor integrated circuit placement device according to the present embodiment includes a conveyor belt 32 that conveys a printed circuit board (PWPA) 30. Next to the conveyor belt 32, there is provided a chip tray 40 in which a plurality of IC chips 42 are arranged in a matrix with a reference height teaching rod 51 described later interposed therebetween. Each IC chip 42 has an optical element on its side surface. The arrangement position of the optical element is predetermined at a predetermined position.

  The mounter also includes two y-direction shafts 54 formed in a U-shape outside the arrangement area of both the chip tray 40 and the conveyor belt 32. An x-direction axis 52 is stretched over the two y-direction axes 54. The x-direction shaft 52 is mounted on the y-direction shaft 54 so as to be movable in the y-direction. On the X-direction shaft 52, an arm 50 configured to be movable in the z direction and finely movable in a three-dimensional manner is capable of moving a holding portion 56 that holds the IC chip 42 at the tip portion. Is attached. Note that the x, y, and z directions are orthogonal to each other.

  The mounter also includes a management device 64 including a display device 58, a keyboard 60, a mouse 62, and the like.

  As shown in FIG. 2, the mounter control system moves the arm 50 in the x direction along the x direction axis 52 and moves the x direction axis 52 in the y direction along the y direction axis 54. A y-direction movement motor 68 is provided, and a z-direction movement motor 70 is provided for moving the clamping portion 56 provided at the tip of the arm 50 in the z-direction. The control system includes a tip end moving motor 78 that is provided on the arm 50 and moves the sandwiching portion 56 in a three-dimensional manner, and a contact sensor 82 disposed at the tip of the sandwiching portion 56. Further, in this control system, an x-direction movement motor 66, a y-direction movement motor 68, and a z-direction movement motor 70 are connected via drivers 72, 74, and 76, respectively, and a tip end movement motor is connected via a driver 80. 78 includes a controller 84 to which a contact sensor 82 is connected.

  The controller 84 controls the x-direction movement motor 66, the y-direction movement motor 68, and the z-direction movement motor 70 via the drivers 72, 74, and 76 to move the arm 50 along the x-direction axis 52 in the x direction. Then, the x-direction axis 52 is moved in the y-direction along the y-direction axis 54, and the clamping portion 56 provided at the tip of the arm 50 is moved in the z-direction. In addition, the controller 84 controls the tip end moving motor 78 via the driver 80 and is provided on the arm 50 to move the holding portion 56 in a three-dimensional manner. Furthermore, the controller 84 can detect that the tip of the clamping unit 56 has touched something by inputting a signal from the contact sensor 82.

  The controller 84 is provided in the management device 64, and is connected to the display device 58, the mouse 62, and the keyboard 60 described above.

  Next, the operation of the present embodiment will be described.

  FIG. 3 shows a flowchart showing an arrangement processing program (executed by the management apparatus 64) for arranging the IC chip 42 on the printed circuit board 30 by the mounter.

  When a predetermined start button of the management device 64 is turned on, the arrangement processing program starts, and in step 102, the tip of the arm 50 is arranged at the upper end of the reference height teaching rod 51 as shown in FIG. The reference height teaching rod 51 is arranged with its upper end adjusted to a predetermined height. The management device 64 stores arrangement information (x, y, z coordinate information) of the reference height teaching bar 51. By the signal based on this arrangement information from the management device 64, the tip of the arm 50 is positioned above the reference height teaching bar 51, and thereafter, the tip of the arm 50 is gradually brought closer to the upper end of the reference height teaching bar 51 to make contact. When a signal indicating that the tip of the arm 50 is positioned at the tip of the reference height teaching bar 51 is input by the sensor 82, the driving of the arm 50 is stopped. As a result, the tip of the arm 50 is positioned at the upper end of the reference height teaching bar 51 and stops.

  In step 104, a reference height is set. That is, since the upper end of the reference height teaching bar 51 indicates the reference height as described above, in this step 104, the height detected when the tip of the arm 50 contacts the upper end of the reference height teaching bar 51 is determined. Set as reference height.

  In the next step 106, the tip of the arm located at the upper end of the reference height teaching bar 51 is moved and arranged on the printed circuit board 30 based on the arrangement information of the printed circuit board 30 stored in the management device 64. To do. In step 108, the height of the printed circuit board 30 is detected. In step 110, the difference between the reference height indicated by the reference height teaching bar 51 and the height of the printed circuit board 30 is calculated.

  In step 112, the upper surface height of the IC chip is calculated so that the light emitting position of the optical element arranged on the side surface of the IC chip 42 becomes a predetermined height from the upper surface of the substrate 30.

  In step 114, as shown in FIG. 5, the IC chip 42 is placed at a predetermined height from the planned placement position on the printed circuit board 30. The management device 64 stores arrangement information (x, y, z coordinate information) of planned arrangement positions. The tip of the arm 50 is positioned at a predetermined height from the planned placement position by a signal based on this placement information from the management device 64. In addition, an image pickup device for picking up an image of the printed circuit board 30 on the conveyor belt 32 is provided, and provided on the IC chip 42 and the printed circuit board 30 as shown in FIG. In consideration of the relative positional relationship between the marks 90A and 90B, the tip of the arm 50 may be positioned at a predetermined height from the planned placement position.

  In step 116, as shown in FIG. 6, it is lowered and stopped until the upper surface position of the IC chip 42 coincides with the upper surface height calculated in step 112. Thereby, the light emission position of the optical element 88 arranged on the side surface of the IC chip 40 coincides with the predetermined height from the reference surface. The predetermined height is a predetermined height h of the optical element 88 of the IC chip 42 for optical communication between the optical element 88 of the IC chip 42 and another optical element disposed on the printed circuit board 30. It is. The height h is a position higher by a predetermined distance from the reference height indicated by the upper end of the reference height teaching bar.

  Thereafter, the adhesive 94 is supplied from the adhesive supply nozzle 92 of the adhesive supply device as shown in FIG. 7 in a state where the upper surface position of the IC chip coincides with the calculated upper surface height position. As a result, the IC chip 42 and the printed board 30 are parallel to each other, and the optical element disposed on the side surface of the printed board 30 is fixed at a predetermined height by the adhesive. Therefore, the IC chip and the printed board can be bonded with high accuracy.

  Here, as the adhesive 94, as shown in FIG. 8, a material whose bonding effect is enhanced by UV (ultraviolet) light 96 may be used. Thereby, an IC chip and a printed circuit board are fixed more firmly.

  Thereafter, as shown in FIG. 9, the IC chip 42 and the printed board are fixed and filled with a sealant. As shown in FIG. 10, the IC chip 42 and the printed board 30 are parallel to each other, and the IC chip 42 and the printed board 30 are parallel. An optical element disposed on the side surface of the chip is fixed at a predetermined position.

  As described above, in this embodiment, the IC chip is held by the arm, the IC chip is positioned at a predetermined height, and the IC chip is fixed on the printed board in this state. Even if you want to fix it, you can deal flexibly.

  In the first embodiment described above, the shape of the surface facing the printed circuit board of the IC chip is flat, but the present invention is not limited to this, and the surface of the surface facing the printed circuit board of the IC chip is not limited to this. A groove may be formed at the end, and a predetermined space may be provided between the groove and the printed board. In this case, an adhesive is supplied and fixed in this space. This will be described in detail below.

  In FIG. 11, the wafer 10 is shown. The wafer 10 has a plurality of integrated circuits 11 arranged in a matrix on the first surface 10A. Further, a groove 14 is formed by the groove forming means 12 on the second surface 10B facing the first surface 10A of the wafer 10. In addition, as a formation method of a groove | channel, it is an etching etc., for example.

  The position of the groove 14 formed in the second surface 10B is a position P1 outside (periphery) of the region where the integrated circuit 11 is formed, that is, a position P1 between the two integrated circuits 11, or a plurality of integrated circuits. The position P2 is opposite to the position P1 on the outermost side of the integrated circuit located on the outermost side. The position P1 is a position outside at least two sides of the square integrated circuit 11, for example, two opposite sides. The shape of the groove is an elongated shape. In addition, a plurality of grooves may be formed at intervals along a region facing each side.

  As shown in FIG. 11B, the wafer 10 formed in this way is cut by the cutting means 16 for each integrated circuit 11 with reference to the position P1. When cut in this way, IC chips 42 each having a groove 14 are manufactured. That is, in each IC chip 42, as shown in FIG. 12, the integrated circuit 11 is formed on the first surface 42A, and the groove 14 is formed at the end of the second surface 42B opposite to the first surface 42A. Has been.

  Next, the IC chip 42 is mounted on the printed circuit board 30 as described above (see also FIG. 13). That is, the mounting is performed so that the second surface 42B of the IC chip 42 and the lead frame of the printed circuit board 30 are in contact with each other. Thereby, a predetermined space is formed between the printed circuit board 30 and the groove 14. In the present embodiment, an adhesive 94 is supplied from an adhesive supply device 92 to this space as shown in FIG. Accordingly, as shown in FIG. 13B, the adhesive 22 supplied to the space formed between the groove 14 and the printed board 30 is fixed.

  As described above, since the adhesive 94 is made of a material whose bonding effect is enhanced by the UV light 96, the adhesive supplied to the space between the groove 14 and the printed circuit board 30 as shown in FIG. By irradiating the agent 94 with UV light, the adhesive effect of the adhesive 94 is enhanced, and the IC chip 42 and the printed board 30 are more firmly fixed.

  Then, as shown in FIG. 15, the bonding pad of the IC chip and the lead electrode of the printed circuit board 30 are connected by the metal wire 26. Thereafter, the semiconductor integrated circuit device is sealed with resin or the like to form a package.

  Next, a second embodiment of the present invention will be described. Since this embodiment has the same configuration as that of the first embodiment described above, description thereof is omitted. In the IC chip 42 of the present embodiment, optical elements are arranged at predetermined positions on the bottom surface.

  Next, the operation of the present embodiment will be described. Since the operation of the present embodiment is the same as that of the second embodiment, only different portions will be described.

That is, as shown in FIG. 16, the IC chip 42 is sandwiched by the sandwiching portion 56 of the arm 50,
The IC chip 42 is moved to a predetermined height position on the printed circuit board 30 from the position where the IC chip 42 is to be mounted. Next, as shown in FIG. 17, the arm 50 controls the clamping portion 56, and the IC chip 42 is inclined so that one end 42 </ b> A side is down and the other end 42 </ b> B side is up, and the IC chip 42 and the printed board are formed. The angle is set to a predetermined angle θ ° C. In addition, since one end 42A of the IC chip 42 is positioned on the printed board and the other end 42B is placed on the printed board 30, the angle formed by the IC chip 42 and the printed board 30 becomes a predetermined angle θ. An instruction member 120 serving as the instruction means and a contact member 122 with which the one end side 42A side of the IC chip 42 is in contact are arranged. Then, as shown in FIG. 18, the arm 50 moves the IC chip 48 so that one end 42 </ b> A of the IC chip is in contact with the contact member 122 and the other end 42 </ b> B is placed on the indicating member 120.

  Next, as shown in FIG. 19, the adhesive 94 is supplied from the adhesive supply nozzle 92 to the one end side 42 </ b> A of the IC chip 42. Then, the adhesive effect is enhanced by irradiating the adhesive 94 with UV light, and the IC chip 42 and the printed board 30 are more firmly bonded.

  Next, a modification of the second embodiment will be described.

  In the second embodiment described above, as shown in FIG. 19, the IC chip and the printed board 30 are fixed while the IC chip is supported by the instruction member 120. In the first modified example, as shown in FIG. 20, the indicating member 120 is omitted.

  Here, as shown in the third embodiment and the first modification (also a second modification described later), the reason why the IC chip 42 is fixed at a predetermined angle with the printed circuit board 30. Will be explained. As shown in FIG. 21, a waveguide 124 is formed on the printed circuit board 30, and an optical element 88 is provided on the lower surface of the IC chip 42, and light 126 from the optical element 88 provided on the IC chip 42 is reflected by a reflection mirror. Optical communication is performed by guiding the light to the waveguide 124 via 128, or by supplying light via the waveguide and receiving light by the optical element 88 of the IC chip 30 by the reflection mirror 128. At this time, for example, when a reflection mirror whose surface is easily formed by Si anisotropic etching is used as the reflection mirror 128, the inclination angle of the surface of the reflection mirror 128 becomes an angle (for example, 54.7 °). Therefore, the IC chip 42 is required to have an angle with respect to the printed circuit board 30 (the predetermined angle θ), and the IC chip 42 is fixed to the printed circuit board 30 so as to form a predetermined angle in order to flexibly cope with this. Thereby, the freedom degree of the reflective mirror 128 increases.

  Next, a second modification will be described. In the second modification, as shown in FIG. 22, at least one end (the side in contact with the printed circuit board) of one end and the other end of the IC chip 42 is an angle formed by the IC chip 42 and the substrate 30 on the one end side. However, a shape smaller than the predetermined angle θ, for example, a tapered portion 130 is provided. As shown in FIGS. 23 and 24, the IC chip 42 provided with the tapered portion 130 on at least one end side as described above is arranged so that the one end side contacts the contact member 122. As shown, adhesive 94 is supplied. Thereby, the area where the one end side of the IC chip 42 is in contact with the adhesive increases, and the IC chip 42 and the printed board 30 can be bonded more firmly.

  In addition, as shown in FIG. 26, the adhesive effect of the adhesive 94 may be enhanced by irradiating the adhesive 94 with UV light, and the adhesive effect may be further enhanced.

  In each of the embodiments described above, the reference height teaching bar is provided outside the printed circuit board to teach the absolute reference height, but the present invention is not prevented by this, It may be arranged on a print board, and a relative height may be taught for each print board. In this case, the height of the reference height teaching rod may be changed for each print base to teach the height as necessary.

(A) is a top view of the mounter which concerns on 1st Embodiment, (B) is a side view of a mounter. It is a block diagram which shows the control system of a mounter. It is a flowchart which shows the arrangement | positioning process program performed by the mounter. It is a figure which shows a mode that a reference | standard height is detected by the arm of a mounter. It is a figure which shows a mode that an IC chip is moved on a printed circuit board by the arm of a mounter. It is a figure which shows a mode that an IC chip and a printed circuit board are parallel by the arm of a mounter, and an IC chip is maintained by predetermined height. It is a figure which shows a mode that an adhesive agent is supplied in a state in which an IC chip and a printed circuit board are parallel and the IC chip is maintained at a predetermined height. It is a figure which shows a mode that an adhesive effect is heightened by irradiating UV light to an adhesive agent. It is a figure which shows a mode that a sealing agent is filled in the state in which the IC chip and the printed circuit board were fixed. It is a figure which shows a mode that an IC chip and a printed circuit board are parallel, and an IC chip is maintained by predetermined | prescribed height. (A) is a figure which shows a mode that a groove | channel is formed in a wafer, (B) is a figure which shows a mode that a wafer is cut | disconnected and an IC chip is manufactured. It is sectional drawing of an IC chip. (A) is a figure which shows a mode that the adhesive agent is supplied to the space between the groove | channel of an IC chip and a printed circuit board, (B) was supplied to the space between a groove | channel and a printed circuit board. It is a figure which shows a mode that the IC chip and the printed circuit board are adhere | attached with the adhesive agent. It is a figure which shows a mode that an adhesive agent is irradiated with UV light and the adhesive effect is improved. It is a figure which shows a mode that the IC chip and the printed circuit board were connected by the line. It is a figure which shows a mode that the IC chip is moving with the arm which concerns on 2nd Embodiment. It is a figure which shows a mode that the one end side of an IC chip is mounted in a printed circuit board by an arm, and the other end side is mounted in a pointing member. It is a figure which shows a mode that an IC chip and a printed circuit board are maintained with the predetermined | prescribed angle by the instruction | indication member. It is a figure which shows a mode that an adhesive agent is supplied in the state which maintains the IC chip and the printed circuit board at the predetermined angle. It is a figure which shows a mode that UV light is irradiated to the adhesive agent which concerns on a 1st modification. The figure which shows a mode that the light from the optical element arrange | positioned at the bottom face of an IC chip advances the waveguide provided in the printed circuit board It is a figure which shows a mode that the IC chip in which the taper part which concerns on a 2nd modification was formed is moved on a printed circuit board. It is a figure which shows a mode that an IC chip and a printed circuit board incline so that a predetermined angle may be made. It is a figure which shows the state which made the end of IC chip contact the printed circuit board in the state in which the IC chip and the printed circuit board made a predetermined angle. It is a figure which shows a mode that an adhesive agent is supplied in the state by which the IC chip and the printed circuit board are maintained at the predetermined angle. It is a figure which shows a mode that UV light is irradiated to the adhesive agent in a 2nd modification.

Explanation of symbols

30 Substrate 32 Conveyor belt 40 Chip tray 42 IC chip 50 Arm 51 Reference height teaching bar 52 x-direction axis 54 y-direction axis 56 Nipping part 64 Management device 66 x-direction movement motor 68 y-direction movement motor 70 z-direction movement motor 72 to 76 Driver 78 Tip Moving Motor 82 Contact Sensor 84 Controller 86 Intermediate Member 88 Light Emitting Element 90A Mark 90B Mark 92 Adhesive Supply Nozzle 94 Adhesive 96 UV Light 120 Support Member 122 Contact Member 124 Waveguide 126 Light 128 Reflecting Mirror 130 Tapered Part

Claims (16)

Holding means for holding a semiconductor integrated circuit;
Moving means for moving the holding means so that the semiconductor integrated circuit moves three-dimensionally;
Control means for controlling the moving means so that the semiconductor integrated circuit is in a predetermined arrangement state with respect to the substrate;
Fixing means for fixing the semiconductor integrated circuit to the substrate in a state where the semiconductor integrated circuit is maintained in the predetermined arrangement state with respect to the substrate;
A semiconductor integrated circuit placement device.   2. The semiconductor integrated circuit arrangement device according to claim 1, wherein the predetermined arrangement state is such that the semiconductor integrated circuit and the substrate are parallel to each other, and the height of the semiconductor integrated circuit is a predetermined height. Using a height teaching means showing a predetermined reference height,
The control means includes
By positioning the holding means on the height teaching means, the reference height is detected, and based on the detected reference height, the height of the semiconductor integrated circuit becomes the predetermined height. Controlling the moving means;
3. The semiconductor integrated circuit arrangement device according to claim 2, wherein:   2. The semiconductor integrated circuit arrangement device according to claim 1, wherein the predetermined arrangement state is such that an angle formed by the semiconductor integrated circuit and the substrate is a predetermined angle. Supporting the semiconductor integrated circuit so that an angle formed between the semiconductor integrated circuit and the substrate is a predetermined angle by placing one end of the semiconductor integrated circuit on the substrate and placing the other end on the substrate; Comprising support means disposed on the substrate;
The control means controls the moving means so that one end side of the semiconductor integrated circuit is positioned on the substrate and the other end side is placed on the support means.
5. The semiconductor integrated circuit placement device according to claim 4, wherein   6. The semiconductor integrated circuit according to claim 4, wherein a portion of the semiconductor integrated circuit that is in contact with the substrate has a shape in which an angle formed by the semiconductor integrated circuit and the substrate is smaller than a predetermined angle. Circuit placement device. Maintaining the semiconductor integrated circuit in a predetermined arrangement with respect to the substrate;
Fixing the semiconductor integrated circuit to the substrate in a state where the semiconductor integrated circuit is maintained in the predetermined arrangement state with respect to the substrate;
A method of manufacturing a semiconductor integrated circuit device.   8. The method of manufacturing a semiconductor integrated circuit device according to claim 7, wherein the predetermined arrangement state is that the semiconductor integrated circuit and the substrate are parallel to each other, and the height of the semiconductor integrated circuit is a predetermined height. . Using a height teaching means indicating a predetermined reference height with respect to the substrate, the reference height is detected,
Based on the detected reference height, the height of the semiconductor integrated circuit is the predetermined height,
9. A method of manufacturing a semiconductor integrated circuit device according to claim 8, wherein:   8. The method of manufacturing a semiconductor integrated circuit device according to claim 7, wherein in the predetermined arrangement state, an angle formed by the semiconductor integrated circuit and the substrate is a predetermined angle.   The semiconductor integrated circuit is supported so that an angle formed between the semiconductor integrated circuit and the substrate is a predetermined angle by placing one end side of the semiconductor integrated circuit on the substrate and placing the other end side on the substrate. 11. The semiconductor integrated circuit according to claim 10, wherein a support means disposed on the substrate is used, one end side of the semiconductor integrated circuit is positioned on the substrate and the other end side is placed on the support means. Device manufacturing method.   12. The semiconductor integrated circuit according to claim 10, wherein an angle formed by the semiconductor integrated circuit and the substrate at a portion in contact with the substrate of the semiconductor integrated circuit is smaller than a predetermined angle. A method of manufacturing a circuit device. A semiconductor integrated circuit in which an optical element for optical communication is disposed on one surface;
A substrate on which the one surface side of the semiconductor integrated circuit is arranged to be opposed, and an optical waveguide for optical communication with the optical element is formed therein;
A semiconductor integrated circuit device comprising:
The semiconductor integrated circuit is disposed on the substrate such that the optical element performs optical communication via the waveguide and an angle formed between the semiconductor integrated circuit and the substrate is a predetermined angle;
A semiconductor integrated circuit device. One end side of the semiconductor integrated circuit is positioned on the substrate, and the other end side is placed, thereby supporting the semiconductor integrated circuit so that an angle formed between the semiconductor integrated circuit and the substrate becomes a predetermined angle. A support means disposed on the substrate,
One end side of the semiconductor integrated circuit is located on the substrate, and the other end side is placed on the support means.
The semiconductor integrated circuit device according to claim 13.   15. The semiconductor according to claim 13, wherein a portion of the semiconductor integrated circuit that is in contact with the substrate has a shape in which an angle formed by the semiconductor integrated circuit and the substrate is smaller than the predetermined angle. Integrated circuit placement device. A semiconductor integrated circuit device configured by arranging a semiconductor integrated circuit on a substrate,
A groove for supplying an adhesive is formed at an end of the surface of the semiconductor circuit facing the substrate.
A semiconductor integrated circuit device.

Images