JP2006090058A - Inorganic composite board - Google Patents
Inorganic composite board Download PDFInfo
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- JP2006090058A JP2006090058A JP2004278860A JP2004278860A JP2006090058A JP 2006090058 A JP2006090058 A JP 2006090058A JP 2004278860 A JP2004278860 A JP 2004278860A JP 2004278860 A JP2004278860 A JP 2004278860A JP 2006090058 A JP2006090058 A JP 2006090058A
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- board
- resin foam
- cement board
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- cement
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Abstract
Description
本発明は、建物外壁や屋根の下地に用いられる、特に屋根下地である耐火野地板に関する。 TECHNICAL FIELD The present invention relates to a fireproof ground plate used as an outer wall of a building or a base of a roof, particularly a roof base.
屋根下地である耐火野地板としては、硬質木毛セメント板や木毛パーライトセメント板等が使用されている。
また、近年、その木毛セメント板にロックウール板を貼着して吸音性を向上させたり、発泡ポリスチレン板を貼着して断熱性を向上させたりしている。
In recent years, a rock wool board is stuck to the wood wool cement board to improve sound absorption, and a foamed polystyrene board is stuck to improve heat insulation.
しかしながら、これら従来の複合板は、その材質の違いから寸法安定性が異なるために、反ったり、捻れたりすることも考えられ、その為に下地材として不具合を生じる可能性もある。
その為に3層構造にして表裏面には同じ材質のものを使用したりしているが、それではコストアップになり、また厚みが厚くなってしまい不具合を生じる可能性がある。
また、発泡ポリスチレン板やロックウール板は変形しやすく、強度的に問題を生じる可能性がある。
However, these conventional composite plates may be warped or twisted due to differences in dimensional stability due to the difference in material, which may cause problems as a base material.
For this reason, the same material is used for the front and back surfaces in a three-layer structure, but this increases the cost and increases the thickness, which may cause problems.
In addition, the foamed polystyrene plate and the rock wool plate are easily deformed and may cause a problem in strength.
本発明の無機質複合板は、木毛セメント板の替わりに基材として木片セメント板を使用しその一方の面にフェノール樹脂フォームを貼着した無機質複合板で、フェノール樹脂フォームの寸法は木片セメント板の寸法よりも小さく、木片セメント板の吸水伸び率とフェノール樹脂フォームの吸水伸び率との差は0.1%以下であることが望ましい。 The inorganic composite board of the present invention is an inorganic composite board in which a wood chip cement board is used as a base material instead of a wood wool cement board, and a phenol resin foam is stuck on one side thereof. It is desirable that the difference between the water absorption elongation rate of the wood chip cement board and the water absorption elongation rate of the phenol resin foam is 0.1% or less.
本発明は基材として木毛セメント板を使用せずに、木片セメント板を使用しているので、非常に頑丈で、耐火性も良く、しかも、雨水が入り込んでも溜まりにくい。
また、木片セメント板の一方の面に、発泡ポリスチレン板等ではなく、フェノール樹脂フォームを貼着しているので、すぐれた断熱性があるとともに、しっかりとした屋根下地板になる。
また、フェノール樹脂フォームの寸法が木片セメント板の寸法よりも小さいので、万一、フェノール樹脂フォームが寸法変化を起こしても、その変化を吸収することができ、複合板どうしの接合の際、接着剤がはみ出しても、はみ出しを吸収でき、きっちりと施工できる。
また、木片セメント板の吸水伸び率とフェノール樹脂フォームの吸水伸び率との差が、0.1%以下であるので、万一フェノール樹脂フォームが吸水して伸びても、複合板が歪んだり、不陸が出たりすることがない。
In the present invention, a wood piece cement board is used without using a wood wool cement board as a base material. Therefore, the wood board is very strong, has good fire resistance, and is difficult to accumulate even if rainwater enters.
In addition, a phenolic resin foam, not a foamed polystyrene board, is attached to one surface of the wood cement board, so that it has excellent heat insulation and a firm roof base board.
In addition, since the dimensions of the phenolic resin foam are smaller than the dimensions of the wood cement board, even if the phenolic resin foam undergoes a dimensional change, the change can be absorbed and bonded when the composite boards are joined together. Even if the agent protrudes, it can absorb the protrusion and can be installed exactly.
Moreover, since the difference between the water absorption elongation rate of the wood chip cement plate and the water absorption elongation rate of the phenol resin foam is 0.1% or less, even if the phenol resin foam absorbs water and extends, the composite plate is distorted, There will be no unevenness.
[フェノール樹脂フォーム]
本発明に使用するフェノール樹脂フォームとしては、従来から公知の如何なる種類のフェノール樹脂フォームも用いることができる。
フェノール樹脂フォームの密度は、25〜35g/m3、熱伝導率は0.02〜0.025W/m・K、圧縮強さ0.1〜0.2N/mm2である。
また、24時間吸水伸び率は、0.25〜0.35%である。
[Phenolic resin foam]
As the phenol resin foam used in the present invention, any conventionally known phenol resin foam can be used.
The density of the phenol resin foam is 25 to 35 g / m 3, the thermal conductivity is 0.02 to 0.025 W / m · K, and the compressive strength is 0.1 to 0.2 N / mm 2.
The 24-hour water absorption elongation is 0.25 to 0.35%.
[木片セメント板]
木片セメント板は、木片とセメントと主構成原料とし、その他セメント硬化促進剤等を混合した原料に少量の水和水を加えた、所謂半乾式状態で型板状に原料を散布し、圧締プレスを行い硬化養生したものである。
一方、木毛セメント板は繊維方向の長さが20cm以上の良質な木材を繊維方向にできるだけ切断しないように削りだし、その木毛の表面全体を糊状のセメントペーストで均一に被覆し、圧縮成型したものである。
木片セメント板は木毛セメント板と比較すると、熱抵抗値が悪い。
例えば、木毛セメント板25mmは0.24m2K/Wに対して、木片セメント板25mmは0.13m2K/Wである。
逆に、木片セメント板のたわみは、厚さ25mmで4mm以下であるが、木毛セメント板のたわみは厚さ25mmで8mm以下であり、また、木片セメント板の曲げ破壊荷重は厚さ25mmで2200N以上であるが、木毛セメント板の曲げ破壊荷重は厚さ25mmで785N以上であり、つまり木片セメント板のほうが木毛セメント板よりも固くしっかりとしていて、しかもたわまない頑丈な板である。
また、木毛セメント板が表面に大きな巣穴(木毛繊維と木毛繊維との間)が多くあるので吸音性が良く、熱抵抗値が木片セメント板よりも大きいので断熱性が良いのであるが、この表面の巣穴は屋根下地であるからまったく問題がないという訳ではなく、もし、屋根の施工に問題があって、雨水が入り込んでしまったときには、この巣穴に雨水が溜まり凍害を起こすことも考えられる。
木片セメント板の場合、表面に大きな巣穴はないので、この問題はない。
木片セメント板の24時間吸水伸び率は、0.15〜0.25%であるのに対し、木毛セメント板の24時間吸水伸び率は0.25〜0.35%である。
木片セメント板は、木毛セメント板よりも寸法変化が少ない。
[Wood piece cement board]
Wood chip cement board is made of wood chip, cement and main constituent materials, and a small amount of hydration water is added to the raw material mixed with cement hardening accelerator etc. It has been hardened and cured by pressing.
On the other hand, a wood wool cement board is made by cutting high quality wood with a length of 20 cm or more in the fiber direction so as not to cut as much as possible in the fiber direction, and the whole surface of the wood wool is uniformly coated with a paste cement paste and compressed. Molded.
The wood chip cement board has a lower thermal resistance value than the wood wool cement board.
For example, a wood wool cement board 25 mm is 0.24 m 2 K / W, and a wood chip cement board 25 mm is 0.13 m 2 K / W.
On the contrary, the deflection of the wood cement board is 4 mm or less at a thickness of 25 mm, but the deflection of the wood wool cement board is 8 mm or less at a thickness of 25 mm, and the bending fracture load of the wood cement board is 25 mm in thickness. Although it is 2200 N or more, the bending fracture load of the wood wool cement board is 785 N or more at a thickness of 25 mm. is there.
In addition, the wood wool cement board has many large nest holes (between wood fiber and wood fiber) on the surface, so sound absorption is good, and the thermal resistance value is larger than the wood chip cement board, so heat insulation is good. However, this burrow on the surface is not a problem at all because it is a roof base. It is also possible to wake up.
In the case of wood chip cement board, there is no large burrow on the surface, so this problem does not occur.
The wood cement plate has a 24-hour water absorption elongation ratio of 0.15 to 0.25%, while the wood wool cement board has a 24-hour water absorption elongation ratio of 0.25 to 0.35%.
The wood cement board has less dimensional change than the wood wool cement board.
[複合板の製造方法]
木片セメント板の一方の面にフェノール樹脂フォームを貼着させる。
接着剤はエポキシ樹脂、酢酸ビニル樹脂、ゴム系の樹脂等の一般の接着剤を使用することができる。
このとき、フェノール樹脂フォームは木片セメント板よりも若干小さなサイズにしておく。
具体的には、木片セメント板のサイズが、長さ1820mm×幅910mm×厚さ18mmであるとすると、フェノール樹脂フォームのサイズは、長さ1815mm×905mm×厚さ12mmで、長さ、幅がそれぞれ5mmづつ短い。
複合板は、密度が全く異なる、木片セメント板とフェノール樹脂フォームとで構成されるが、基材が曲げ破壊荷重が高く、たわみの少ない木片セメント板を使用しているので、複合板が反ったり、捻ったりすることがない。
木毛セメント板とフェノール樹脂フォームとの複合の場合は、木毛セメント板の24時間吸水伸び率が0.25〜0.35%、フェノール樹脂フォームの24時間吸水伸び率も0.25〜0.35%であり、吸水伸び率がほぼ同じであるので、複合板は均一の挙動を起こしやすい。
しかし、木片セメント板とフェノール樹脂フォームとの複合の場合は、木片セメント板の24時間吸水伸び率が0.15〜0.25%、フェノール樹脂フォームの24時間吸水は0.25〜0.35%である。
接着剤でしっかりと接着されているので、複合板はほとんど均一の挙動を起こすが、やや接着が甘かったりすると、フェノール樹脂フォームのほうが伸びやすい。
したがって、フェノール樹脂フォームを木片セメント板よりも若干小さなサイズにしておくことで、吸水伸びで複合板の接着面が歪んだり不陸がでたりすることがない。
理論値上は、吸水伸び率が約0.1%違うので、長さ1820mmならば1.8mm、幅910mmならば0.91mm小さければよいので、木片セメント板のサイズが長さ1820mm×幅910mm×厚さ18mmに対し、フェノール樹脂フォームは長さ1818.2mm×幅909.09mmでよい。
[Production method of composite plate]
A phenolic resin foam is adhered to one side of the wood chip cement board.
As the adhesive, a general adhesive such as an epoxy resin, a vinyl acetate resin, or a rubber-based resin can be used.
At this time, the phenol resin foam is set to a size slightly smaller than the wood chip cement board.
Specifically, assuming that the size of the wood chip cement board is length 1820 mm × width 910 mm × thickness 18 mm, the size of the phenol resin foam is length 1815 mm × 905 mm × thickness 12 mm, and the length and width are Each is 5mm shorter.
The composite board is composed of wood chip cement board and phenolic resin foam with completely different densities, but the base material uses a wood chip cement board with high bending fracture load and less deflection, so the composite board warps. , Do not twist.
In the case of a composite of wood wool cement board and phenol resin foam, the wood wool cement board has a 24-hour water absorption elongation of 0.25 to 0.35%, and the phenol resin foam has a water absorption elongation of 24 hours of 0.25 to 0. .35%, and the water absorption elongation is almost the same, so the composite plate tends to behave uniformly.
However, in the case of a composite of wood chip cement board and phenol resin foam, the 24 hour water absorption elongation of the wood chip cement board is 0.15 to 0.25%, and the 24 hour water absorption of the phenol resin foam is 0.25 to 0.35. %.
Because it is firmly bonded with an adhesive, the composite plate behaves almost uniformly, but if the adhesion is slightly sweet, the phenolic resin foam is easier to stretch.
Therefore, by setting the phenol resin foam to a size slightly smaller than the wood chip cement board, the bonded surface of the composite board is not distorted or uneven due to water absorption elongation.
Theoretically, the water absorption elongation is different by about 0.1%. Therefore, if the length is 1,820 mm, it may be 1.8 mm, and if the width is 910 mm, it may be 0.91 mm. Therefore, the size of the wood cement board is 1820 mm long × 910 mm wide. X Phenol resin foam may have a length of 188.2 mm x a width of 909.09 mm for a thickness of 18 mm.
1 無機質複合板
2 木片セメント板
3 フェノール樹脂フォーム
1 Inorganic composite board 2 Wood chip cement board 3 Phenolic resin foam
Claims (3)
Priority Applications (1)
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JP2004278860A JP4799840B2 (en) | 2004-09-27 | 2004-09-27 | Inorganic composite board |
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JP2004278860A JP4799840B2 (en) | 2004-09-27 | 2004-09-27 | Inorganic composite board |
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JP4799840B2 JP4799840B2 (en) | 2011-10-26 |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63106841U (en) * | 1986-12-29 | 1988-07-11 | ||
JPH0326842Y2 (en) * | 1984-10-18 | 1991-06-11 | ||
JPH0571211A (en) * | 1991-07-05 | 1993-03-23 | Bridgestone Corp | Panel for building |
JPH09177293A (en) * | 1995-12-25 | 1997-07-08 | Matsushita Electric Works Ltd | Tatami-bed of japanese style |
JPH10159314A (en) * | 1996-11-27 | 1998-06-16 | Mitsui Home Co Ltd | Floor construction of house or the like |
JPH10317532A (en) * | 1997-05-21 | 1998-12-02 | Ig Tech Res Inc | Heat insulation panel, and heat insulation substrate structure using thereof |
JPH11190083A (en) * | 1997-12-25 | 1999-07-13 | Achilles Corp | Heat-insulating bearing wall structure by heat-insulating board |
JP2001073536A (en) * | 1999-09-01 | 2001-03-21 | Sekisui Chem Co Ltd | Tatami mat |
JP2003206585A (en) * | 2002-01-15 | 2003-07-25 | Daiken Trade & Ind Co Ltd | Wall panel and fitting structure thereof |
-
2004
- 2004-09-27 JP JP2004278860A patent/JP4799840B2/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0326842Y2 (en) * | 1984-10-18 | 1991-06-11 | ||
JPS63106841U (en) * | 1986-12-29 | 1988-07-11 | ||
JPH0571211A (en) * | 1991-07-05 | 1993-03-23 | Bridgestone Corp | Panel for building |
JPH09177293A (en) * | 1995-12-25 | 1997-07-08 | Matsushita Electric Works Ltd | Tatami-bed of japanese style |
JPH10159314A (en) * | 1996-11-27 | 1998-06-16 | Mitsui Home Co Ltd | Floor construction of house or the like |
JPH10317532A (en) * | 1997-05-21 | 1998-12-02 | Ig Tech Res Inc | Heat insulation panel, and heat insulation substrate structure using thereof |
JPH11190083A (en) * | 1997-12-25 | 1999-07-13 | Achilles Corp | Heat-insulating bearing wall structure by heat-insulating board |
JP2001073536A (en) * | 1999-09-01 | 2001-03-21 | Sekisui Chem Co Ltd | Tatami mat |
JP2003206585A (en) * | 2002-01-15 | 2003-07-25 | Daiken Trade & Ind Co Ltd | Wall panel and fitting structure thereof |
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JP4799840B2 (en) | 2011-10-26 |
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