JP2006088607A - Ultrasonic processing method and ultrasonic processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide, in the processing of a synthetic resin material using an ultrasonic oscillation, an ultrasonic processing method capable of managing the processing conditions and an ultrasonic processing apparatus provided with a quality managing function. <P>SOLUTION: In an ultrasonic jointing apparatus (1) which controls an ultrasonic oscillator (2) through an oscillation time pertinent to the temperature of an electric horn (3) detected by a temperature sensor (9), there are memorized in a memory section in a plural number the combinations of an oscillation time of the case where the jointing between synthetic resin materials (10, 11) is performed normally and a reference waveform pattern formed together with a load current output from the ultrasonic oscillator (2) at that time. By a comparison judging apparatus (6) there is formed a first waveform pattern (18, 19) from the above relationship between a load current and an oscillation time obtained by an actual jointing work, and the reference waveform pattern corresponding to the oscillation time of the first waveform pattern (18, 19) is read out from the memory section, and by comparing it with the first waveform pattern the condition of the jointing, whether good or bad, is managed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an ultrasonic processing method and an ultrasonic processing apparatus for managing the processing state of a synthetic resin material processed by ultrasonic vibration.

  Conventionally, a joining device and a welding device using ultrasonic vibration include an ultrasonic oscillator that oscillates ultrasonic vibration, a horn attached to the ultrasonic oscillator, and an anvil that sandwiches a material to be joined to each other. There is known an apparatus that joins materials by heating and welding an object by sandwiching a material to be joined between the horn and the anvil and ultrasonically vibrating the horn.

  As an apparatus control method using this ultrasonic vibration, for example, an ultrasonic bonding method and apparatus (Patent Document 1) have already been proposed by the applicant of the present application, and the temperature of the detected horn is detected by detecting the temperature of the horn. Can determine which temperature range is included in a plurality of preset temperature ranges, and control the oscillation time of the ultrasonic oscillator based on the oscillation time set corresponding to each preset temperature range it can.

  In addition, for example, a welding state monitoring method in an ultrasonic welding apparatus (Patent Document 2) has been proposed, and the object to be welded is supported by observing a waveform pattern of a current flowing in an ultrasonic oscillator that applies vibration to an ultrasonic horn. It is possible to detect abnormalities in the welding state such as clogging of the surface and the tip surface of the ultrasonic horn, wear, misalignment of the work piece, and poor pressing force.

  The ultrasonic bonding method and ultrasonic bonding apparatus in Patent Document 1 have been found by the inventors' extensive research and research to find that there is a relationship in which appropriate ultrasonic bonding is performed in the region a indicated by the solid line in FIG. In a region indicated by a broken line outside this range, it was found that the adhesive strength is insufficient when the oscillation time is shorter than the region a or the temperature of the horn is low. Further, when the oscillation time is longer than that of the region a or the horn temperature is high, it is found that they are bonded in a brittle state, and the invention is configured based on this. .

  In the welding state monitoring method in Patent Document 2, the characteristics of the waveform pattern of the current flowing in the ultrasonic oscillator as shown in FIG. 7 are used to observe whether welding is normally performed. That is, when the welding state is normally performed, in the waveform pattern of the current flowing through the ultrasonic oscillator, in the period D for melting the solder, the load current is increased due to the familiarity of the joint from the melting of the solder. Decrease. For this reason, as a waveform shape, the shape which falls linearly is shown. Subsequently, in the period E until the molten state is maintained and the joining is completed, since the molten state is present, the load is constant and the current waveform pattern is horizontal.

  In particular, in the welding state monitoring method in Patent Document 2, paying attention to the waveform shape that falls linearly in period D, observation is made as to whether welding is normally performed. That is, when the pressing force of the horn gradually decreases from the normal pressing force, a phenomenon that the current falling period D gradually disappears is taken out and used as a determination condition when the pressing force is insufficient.

Also, if the support surface of the anvil and the pressure surface of the horn are worn, clogged, etc., or if the welded part is caught and the conductive film side is exposed on the top and bottom surfaces, When the insulating film side bonded to the back surface of the film is exposed on the top and bottom surfaces, a phenomenon in which the descent period D is not observed is taken out and used as a condition for judging poor welding.
JP 2001-179837 A JP-A-6-341966

  In the ultrasonic bonding method and the ultrasonic bonding apparatus shown in Patent Document 1, the temperature of the horn and the oscillation time of the ultrasonic oscillator can be controlled so as to have an optimum relationship. For this reason, accurate and stable bonding can be performed, but the final inspection of the bonding state between synthetic resin materials bonded by ultrasonic oscillation is currently performed by sampling inspection. It was.

  In the welding state monitoring method shown in Patent Document 2, the waveform pattern of the current flowing in the ultrasonic oscillator changes depending on the temperature of the horn, the oscillation time during which the horn is oscillated, the clearance between the horn and the anvil, and the like. . Moreover, the welding state monitoring method described in Patent Document 2 is a monitoring method that can be applied when welding an electrode to a conductive film in a state where the conductive film and the insulating film are stacked on each other. For this reason, as a waveform pattern shape of the current flowing through the ultrasonic oscillator, a special waveform pattern that can be formed when an electrode is welded to the conductive film in a state where the conductive curtain and the insulating film are stacked on each other is used.

  For this reason, in the melting apparatus and the bonding apparatus having a waveform pattern in which the falling period D does not occur, the falling period D to be observed does not occur in the first place, and even if it occurs, it occurs only for a very short time. The method could not be applied to these melting and bonding devices.

  The object of the present invention is to solve these problems and to perform synthesis using an ultrasonic machining apparatus capable of performing bonding, welding, welding, drilling, punching, cutting, etc. to a synthetic resin material. An object of the present invention is to provide an ultrasonic processing method and an ultrasonic processing apparatus capable of managing the processing state of a resin material.

The said subject is effectively achieved by employ | adopting the following structures of this invention.
That is, the basic configuration of the ultrasonic processing method of the present invention is that the synthetic resin material is sandwiched between the horn and the anvil of the ultrasonic oscillator, and the horn is ultrasonically vibrated to process the synthetic resin material. In the ultrasonic processing method for performing processing and managing the processing state of the synthetic resin material that has been subjected to the processing processing, the ultrasonic oscillator at the time of normal processing in the processing step for the synthetic resin material As a reference waveform pattern showing the relationship between vibration energy and the elapsed time from when the horn was oscillated, a reference waveform pattern is formed for each oscillation time with different time lengths, and these are stored in the storage unit, Before determining the relationship between the vibration energy of the ultrasonic oscillator and the elapsed time from when the horn was oscillated as a first waveform pattern, and before processing the synthetic resin material The oscillation time of the ultrasonic oscillator is detected as the first oscillation time, the oscillation time closest to the first oscillation time is selected from the storage unit, and the reference waveform pattern corresponding to the selected oscillation time is read from the storage unit The reference waveform pattern read out and the first waveform pattern are compared, and the defect state related to the processing state of the synthetic resin material according to the deviation state of the pattern shape between the reference waveform pattern and the first waveform pattern. Management is the most important feature.

  In the present invention, the load power of the ultrasonic oscillator is used as vibration energy for forming the waveform pattern, the time when the ultrasonic oscillator is oscillated or the first oscillation time is detected from the first waveform pattern, synthetic resin The relationship between the oscillation time of the ultrasonic oscillator with respect to the material and the detected horn temperature is stored in advance in the storage unit in association with the oscillation time for each predetermined temperature range, and stored in the storage unit from the detected horn temperature. The oscillation time is selected. Preferably, a load current value of the ultrasonic oscillator is used as the vibration energy, and the first oscillation time is detected from the first waveform pattern.

  On the other hand, an ultrasonic processing apparatus according to the present invention includes an anvil on which a synthetic resin material is placed, a horn, an ultrasonic oscillator that generates ultrasonic vibrations in the horn, and the horn can be moved toward and away from the anvil. A drive device for driving the motor, the comparison determination device for inputting the vibration energy output from the ultrasonic oscillator, and an output signal from the comparison determination device, and at least the drive device, the ultrasonic oscillator, and the comparison determination device And a storage unit connected to at least one of the control unit and the comparison / determination unit, wherein the storage unit is a normal machining process by the horn and the anvil. As a reference waveform pattern showing the relationship between the vibration energy of the ultrasonic oscillator and the elapsed time since the horn was oscillated, the time length is different. A function of storing a reference pattern in correspondence with each oscillation time to be performed, the control device selecting the oscillation time stored in the storage unit, the drive device based on the selected oscillation time, and A function of outputting a control signal to the ultrasonic oscillator, and the comparison and determination device receives the vibration energy input from the ultrasonic oscillator and an elapsed time from when the vibration energy is input. A function of calculating and forming a first waveform pattern indicating a relationship between energy and oscillation time, and the control device or the comparison / determination device calculates an oscillation time of the ultrasonic oscillator required for processing the synthetic resin material. It has a function of detecting as a first oscillation time, and the control device or the comparison determination device is closest to the first oscillation time from the storage unit based on the first oscillation time. And a function of reading out a reference waveform pattern corresponding to the selected oscillation time from the storage unit, and the comparison / determination device is configured such that the reference waveform pattern thus read out and the first waveform pattern calculated and formed The main feature is that it further has a function of making a comparison decision and outputting the comparison decision result.

  The ultrasonic processing apparatus of the present invention further includes a temperature sensor that detects the temperature of the horn, and the storage unit previously determines an oscillation time of the ultrasonic oscillator and a temperature detected by the temperature sensor in advance. The temperature signal detected by the temperature sensor is further provided with a function of storing the oscillation time corresponding to each temperature range as a correspondence relationship, and the function of selecting the oscillation time stored in the storage unit in the control device. The main feature is that the oscillation time is selected based on

  In the present invention, when the ultrasonic processing is performed on the synthetic resin material by controlling the oscillation time of the ultrasonic oscillator so that the optimal oscillation time is obtained, the synthetic resin material subjected to the ultrasonic processing is applied. On the other hand, the processing state can be managed. For this reason, the reference waveform pattern is stored in the storage unit for each oscillation time having a different time length.

  That is, the first waveform pattern is formed by the vibration energy of the ultrasonic oscillator and the elapsed time from when the horn is oscillated. Further, the time required for the processing performed on the synthetic resin material is detected as the first oscillation time. A reference waveform pattern having an oscillation time closest to the detected first oscillation time is selected from reference waveform patterns previously set and stored for each oscillation time required for processing for the synthetic resin. By comparing and judging the selected reference waveform pattern and the first waveform pattern, the quality of the processing state applied to the synthetic resin material is determined, and the processing state of the synthetic resin material is managed.

  As a result, how the vibration energy of the ultrasonic oscillator changes with time with the passage of time since the horn began to oscillate, and the waveform pattern is formed, the oscillation energy and the horn begin to oscillate. It can be calculated from the elapsed time from.

  In the present invention, the obtained waveform pattern is handled as the first waveform pattern. The first oscillation time of the ultrasonic oscillator required for processing the synthetic resin material can be obtained from the first waveform pattern or the oscillation time set by the detected horn temperature.

  Further, the oscillation time for setting the reference waveform pattern and the oscillation time when the ultrasonic processing is performed change depending on the temperature change of the horn. In addition to this, the oscillation time also changes depending on the difference in shape and thickness of the synthetic resin material to be processed, and the processing types such as joining, cutting, drilling, punching, etc. It also changes depending on.

  For this reason, it is necessary to obtain in advance a plurality of reference waveform patterns corresponding to the processing conditions based on various processing conditions for performing the ultrasonic processing. At this time, it is necessary to set the oscillation time required for processing by each reference waveform pattern for each reference waveform pattern.

  A reference pattern corresponding to the oscillation time closest to the detected first oscillation time can be selected from the reference waveform patterns for each oscillation time obtained in advance during normal machining.

  In addition, by comparing the first waveform pattern with the reference waveform pattern serving as a comparison reference with respect to the first waveform pattern, the quality control of the product is performed on the product that has been processed for the synthetic resin material. Can do.

  For this reason, quality control can be performed simultaneously for each synthetic resin product that has been processed, and if a processing abnormality is found, for example, the processing step is stopped. By generating an alarm, it is possible to keep the number of defective products generated to a small number. Also, the reference waveform pattern and the first waveform pattern in which an abnormality is found can be displayed on the same screen or as separate screens. This makes it easier for the repairing operator to find the cause of the abnormality from the difference in waveform pattern, and shortens the time required for repair.

  The waveform pattern can be obtained from, for example, the load power of the ultrasonic oscillator and the elapsed time since the horn started to oscillate. As the vibration energy of the ultrasonic oscillator, the load current of the ultrasonic oscillator, the load voltage of the ultrasonic oscillator, the physical quantity that can be detected as the vibration energy of other ultrasonic oscillators, for example, It is also possible to use the vibration of the synthetic resin material at the time of sonic processing, the sound generated at the time of ultrasonic processing, or the like.

  As a reference waveform pattern, multiple waveform patterns obtained when processing is completed in a normal state are prepared in advance, and the combination of oscillation time and waveform pattern is stored using the oscillation time in the waveform pattern as a selection condition. It can be stored in the part. The reference waveform pattern and the first waveform pattern can be formed, for example, by measuring the time from when the ultrasonic oscillator starts oscillation using the load current of the ultrasonic oscillator and the clock signal.

  The comparison between the reference waveform pattern and the first waveform pattern is performed by superimposing the vertical axes and the horizontal axes of the respective start points at the same position, and setting the time axis as the horizontal axis or the output axis of the load current as the vertical axis. In this case, sampling is performed at predetermined intervals, and by comparing the sampled values, it is determined whether the deviation amount between the sampled values is within a desired range. A deviation state from one waveform pattern can be detected.

  As the first oscillation time required for processing the synthetic resin material, the first oscillation time can be obtained from the first oscillation pattern, or the oscillation time set by the horn temperature detected at the start of the processing process. You can also. When the oscillation time is set based on the detected horn temperature, the horn can be oscillated in an oscillation time suitable for the detected horn temperature.

  If the temperature of the horn changes during processing on the synthetic resin material and the oscillation time of the ultrasonic oscillator is changed and controlled with the temperature change of the horn, the waveform pattern that is finally formed, that is, By detecting the first oscillation time required for the processing for the synthetic resin material by the first waveform pattern according to claim 1, the time required for the processing can be obtained more accurately.

  Moreover, as an ultrasonic processing apparatus of this invention, it can be set as the structure provided with the comparison determination apparatus in the normal ultrasonic processing apparatus provided with the memory | storage part and the control apparatus. As the ultrasonic processing apparatus of the present invention, a joining apparatus, a welding apparatus, a welding apparatus, a punching apparatus, a punching apparatus, a cutting apparatus or the like using ultrasonic vibration can be used.

  In the storage unit, a reference waveform pattern indicating a relationship between vibration energy and oscillation time of the ultrasonic oscillator in a normal operation process by the horn and the anvil is used as a reference for each oscillation time with different time lengths. It is possible to provide a function for storing patterns in association with each other.

  The control device has a function of selecting the oscillation time stored in the storage unit and a function of outputting a control signal to the drive device and the ultrasonic oscillator based on the selected oscillation time. be able to.

  The comparison / determination unit may have a function of calculating and forming a first waveform pattern indicating a relationship between the vibration energy input from the ultrasonic oscillator and an elapsed time since the horn is oscillated. The comparison determination unit may have a function of detecting a first oscillation time in the first waveform pattern from the first waveform pattern and outputting the detected first oscillation time to the control device. it can.

  As the detection of the first oscillation time, the control device may have a function of setting the oscillation time set by the horn temperature detected at the start of the processing to be the first oscillation time. The control device further includes a function of selecting an oscillation time closest to the first oscillation time from the storage unit based on the first oscillation time, and reading a reference waveform pattern corresponding to the selected oscillation time; A function of outputting the read reference waveform pattern to the comparison determination unit can be provided. In addition, the comparison determination unit can be provided with a function of reading the reference waveform pattern from the storage unit.

  The comparison / determination unit can further have a function of comparing and determining the reference waveform pattern and the first waveform pattern and outputting the determination result. Further, if necessary, the comparison / determination unit may have a function of causing the display unit or the like to output the first waveform pattern calculated by the comparison / determination unit and the reference waveform pattern input from the control unit.

The control device has a function of issuing an alarm based on the determination result output from the comparison determination unit as necessary, and a function of outputting a drive stop signal to the drive device and the ultrasonic oscillator. It can also be left.
Thereby, the ultrasonic processing apparatus which can perform the ultrasonic processing method of this invention can be obtained.

  The control device and the comparison determination device can be configured as one control device. In addition, the clock can be incorporated in at least one of the control device and the comparison / determination device. As a configuration of the control device that can detect the temperature from the temperature sensor and output a control signal to the drive device and the ultrasonic oscillation device, an appropriate configuration is adopted without departing from the technical idea of the present invention. be able to.

  The ultrasonic processing apparatus according to the present invention is provided with a temperature sensor for detecting the temperature of the horn, and the storage unit is configured to previously set an oscillation time of the ultrasonic oscillator and a temperature detected by the temperature sensor for each predetermined temperature range. Can be provided with a function of storing the correspondence relationship corresponding to the oscillation time.

  At this time, the control device needs to have a function of selecting the oscillation time stored in the storage unit based on the temperature signal input from the temperature sensor.

  As the temperature sensor, a non-contact type temperature sensor can be used for the horn, a temperature sensor of a type that can be adhered to the surface of the horn, or a temperature sensor that can be embedded in the horn can be used. . Desirably, since the horn is configured to vibrate ultrasonically, it is desirable to use a non-contact type temperature sensor. As the non-contact type temperature sensor, a temperature sensor that detects infrared rays is more preferable, and a sensor such as a thermopile or a semiconductor can also be used.

  Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings. In the following description, an ultrasonic bonding apparatus will be described as an example of the ultrasonic processing apparatus. However, as the configuration of the ultrasonic processing apparatus and the ultrasonic processing method of the present invention, the shape and arrangement described below will be described. However, the present invention is not limited thereto, and any shape and arrangement configuration that can solve the problems of the present invention can be adopted. For this reason, this invention is not limited to the Example demonstrated below, A various change is possible.

  FIG. 1 is a schematic view of an ultrasonic bonding apparatus according to an embodiment of the present invention. The ultrasonic bonding apparatus includes an ultrasonic oscillator 2 that oscillates ultrasonic vibrations, and a horn 3 that is attached to the ultrasonic oscillator 2 and vibrates ultrasonically. The ultrasonic oscillator 2 and the horn 3 are provided so as to be able to contact and separate from the anvil 8 by a driving device 4 such as a motor or a cylinder. Further, a drive device may be connected to the anvil 8 so that the anvil 8 can be brought into and out of contact with the horn 3. The ultrasonic oscillator 2 and the driving device 4 are driven and controlled by a control signal from the control device 5, respectively. The temperature of the horn 3 is detected by a temperature sensor 9 arranged in a non-contact state, and the detected temperature is input to the control device 5.

  The comparison determination device 6 inputs a load current value of the ultrasonic oscillator 2 and is connected to a storage unit (not shown). The comparison / determination device 6 may be configured to be able to receive and receive signals with the control device 5 as necessary. Further, the comparison / determination device 6 creates a waveform pattern (see FIG. 3) indicating the relationship between the load current and the elapsed time after the horn 3 oscillates, and displays the created waveform pattern on the display unit 7. To do.

  Superposed synthetic resin materials 10 and 11 can be placed on the anvil 8. After the synthetic resin materials 10 and 11 placed thereon are sandwiched between the horn 3 and the ultrasonic oscillator 2 is oscillated, ultrasonic vibration is generated in the horn 3. Thereby, the synthetic resin materials can be joined by melting between the synthetic resin materials.

  In FIG. 1, a relatively thin sheet-like resin material is exemplified as the synthetic resin materials 10 and 11 to be placed on the anvil 8 and will be described below. However, the synthetic resin materials 10 and 11 are sheet-like materials. It is not limited to those. The synthetic resin materials 10 and 11 can be joined to each other even if they have shapes having thickness and dimensions.

  When the synthetic resin materials 10 and 11 are bonded using the ultrasonic bonding apparatus 1 having the above configuration, the temperature of the horn 3 is low at the beginning of use, but the temperature of the horn 3 increases due to continuous use. It will be.

  Now, when ultrasonic bonding is performed between the sheet-like synthetic resin materials 10 and 11, when looking at the case where the amplitude and frequency of the ultrasonic vibration generated from the ultrasonic oscillator 2 are constant, the temperature of the horn 3 at this time is If it is low and the oscillation time of the horn 3 is short, the adhesive strength when twisting or the like is applied to the joint portion of the sheet-like synthetic resin material becomes weak. Further, when the temperature and the frequency of the horn 3 are high and the oscillation time of the horn 3 is long when the amplitude and frequency are constant, the sheet-like resin material is likely to be embrittled.

  Summarizing this relationship, it is possible to obtain the relationship of FIG. 2 in which the vertical axis indicates the oscillation time of the horn 3 and the horizontal axis indicates the temperature of the horn 3. It can be performed. In a region indicated by a broken line outside this range, that is, when the oscillation time is shorter than the region a or the temperature of the horn 3 is low, the adhesive strength is insufficient. Further, when the oscillation time of the horn 3 is longer than that of the region a or the temperature of the horn 3 is high, the sheet-like synthetic resin material is bonded in an embrittled state.

  For this reason, the oscillation time of the ultrasonic oscillator 2 in a state where the horn 3 is in contact with the synthetic resin material 10 is controlled according to the temperature of the horn 3 detected by the temperature sensor 9, and the detected temperature of the horn 3 is Controlling the oscillation time of the horn 3 so as to fall within the region a shown in FIG. 2 is desirable in order to prevent the occurrence of defective products in the joining.

  As shown in FIG. 2, the appropriate relationship between the temperature of the horn 3 and the oscillation time of the horn 3 is that the oscillation time corresponds to each predetermined temperature range, as shown in FIG. Can be set. This relationship can be expressed by the following equation.

  Y = B−AX, where Y is the oscillation time, X is the temperature of the horn 3, A is a positive number, the slope of the region a, and the coefficient of the above equation that controls the oscillation time, B is the temperature of the horn 3 This is the oscillation time when 0 degree is set.

  The timing at which the temperature of the horn 3 is detected by the temperature sensor 9 is preferably detected immediately before the horn 3 presses the synthetic resin materials 10 and 11 to perform bonding. Based on the temperature of the horn 3 detected by the control device 5, an oscillation time is set from the relationship shown in FIG. 2, and a control signal is output from the control device 5 to the drive device 4 and the ultrasonic oscillator 2 based on the set oscillation time. Can be controlled. Thereby, more accurate temperature setting becomes possible and joining can also be performed reliably.

  When the temperature of the horn 3 is constantly detected by the temperature sensor 9 and the detected temperature is out of the temperature range a set up to now, a new oscillation time can be reset corresponding to the newly detected temperature. . At this time, it becomes possible to control the drive device 4 and the ultrasonic oscillator 2 based on the newly set oscillation time. In this case, the remaining oscillation time needs to be a time obtained by subtracting the oscillation time that has passed so far from the newly set oscillation time.

  The temperature sensor 9 that detects the temperature of the horn 3 is more preferably a non-contact type temperature sensor that detects infrared rays, and a sensor such as a thermopile or a semiconductor can also be used.

  According to the ultrasonic bonding apparatus according to this embodiment, the temperature of the horn 3 is detected in a non-contact manner, and the relationship between the temperature of the horn 3 and the oscillation time at the time of bonding is controlled as an oscillation time that allows good bonding. ing. For this reason, even if the temperature of the horn 3 rises with use, the synthetic resin materials 10 and 11 can always be joined under appropriate joining conditions.

  Moreover, since the oscillation time is controlled and the bonding state is controlled to be constant, there is no sudden addition of energy to the synthetic resin material compared to the case of controlling the amplitude of ultrasonic vibration, Local breakage is unlikely to occur, and simple and accurate control is possible.

  In the present invention, in the ultrasonic bonding apparatus that is controlled so as to have an oscillation time according to the temperature of the horn 3 described above, the bonding state between the synthetic resin materials that have been bonded is detected on-time. It is characterized by managing good / bad bonding state based on the detection result. Hereinafter, a configuration of an ultrasonic bonding apparatus and an ultrasonic processing method that can manage the quality of the bonding state will be described.

  As shown in FIG. 3, when the joint between the synthetic resin materials 10 and 11 is normally performed in the normal processing state, the reference is made corresponding to several oscillation times required when the joint is performed normally. Waveform patterns 15 to 17 can be obtained respectively. FIG. 3 exemplarily shows the reference waveform patterns 15 to 17 corresponding to three oscillation times. However, the reference waveform pattern is not limited to three, and the reference corresponding to the required number of oscillation times. The waveform pattern can be obtained in advance by experiments or the like.

  The reference waveform pattern corresponding to the oscillation time can be stored in a readable storage unit, and can be read by access from the control device 5 or the comparison determination device 6.

  In the following description, as reading of data from the storage unit (not shown), the oscillation time based on the detection result of the temperature sensor 9 is read by access from the control device 5, and by access from the comparison determination unit 6. The case of reading the reference waveform pattern will be described. However, as the reading of data from the storage unit, the reference waveform pattern can also be read by access from the control device 5. The reference waveform pattern read out by the control device 5 can be output as the first waveform pattern.

  The load current of the ultrasonic oscillator 2 when the synthetic resin materials 10 and 11 are joined by the ultrasonic oscillation of the horn 3 and the elapsed time after starting the oscillation of the horn 3 are input to the comparison determination device 6. Then, the first waveform pattern 18 or the first waveform pattern 19 as shown in FIG. In FIG. 4, two first waveform patterns 18 and 19 are illustrated together with the reference waveform pattern 15 for convenience, but the number of the first waveform patterns obtained in one bonding is one. In the following description, for the sake of convenience, the description is continued assuming that the first waveform pattern indicated by the reference numeral 18 is formed as the first waveform pattern.

  The elapsed time from the start of the oscillation of the horn 3 is to start counting from the time when the oscillation start signal is output from the control device 5 to the ultrasonic oscillator 2 or to output the load current from the ultrasonic oscillator 2. It can be obtained by starting timing from the time when the signal is input. The time can be obtained by an appropriate method using an output signal from a clock (not shown) or the like.

  When the first waveform pattern 18 is formed in the comparison determination device 6, the first waveform pattern 18 is displayed on the display unit 7, and the first oscillation time required for joining is detected from the first waveform pattern 18. The first oscillation time can be obtained by obtaining the time from when the load current value becomes the initial current value to the next initial current value.

  Based on the first oscillation time, the comparison / determination device 6 selects the oscillation time closest to the first oscillation time from the combination of the oscillation time and the reference waveform pattern stored in advance in a storage unit (not shown). A combination with the reference waveform pattern is selected, and the selected reference waveform pattern 15 is read. By inputting the first oscillation time detected by the comparison determination device 6 to the control device 5, the control device 5 can also read the reference waveform pattern 15 from the storage unit, and the read reference waveform pattern 15 can be read from the control device 5. It can also be output to the comparison judgment device 6.

  In the comparison / determination device 6 to which the reference waveform pattern 15 is input, the reference waveform pattern 15 can be displayed on the display unit 7. As a display method, the first waveform pattern 18 and the reference waveform pattern 15 may be displayed on the display unit 7 in an overlaid state, or the first waveform pattern 18 and the reference waveform pattern 15 may be individually displayed on the display unit 7. It can also be displayed. Further, by combining these display forms, a desired display screen can be obtained by a switching operation such as a changeover switch in the display unit 7.

  The comparison / determination unit 6 can obtain the deviation between the reference pattern 15 and the first waveform pattern 18 by sampling and comparing the two patterns at predetermined intervals in the time axis direction. Various existing methods can be used as a method for obtaining the deviation.

  As a method for obtaining the deviation, an upper limit waveform pattern and a lower limit waveform pattern that are an allowable range of deviation with respect to the reference waveform pattern are set in advance, and the detected waveform pattern (for example, the first waveform pattern) is There is a method for determining whether or not the waveform pattern exists between the upper limit waveform pattern and the lower limit waveform pattern.

  According to this method, the allowable range of deviation in a specific part of the reference waveform pattern can be set large or small. In particular, it is possible to include the detected waveform pattern within an allowable range in a portion where the deviation often changes greatly although it does not lead to the occurrence of defective products.

  As another method for obtaining the deviation, for example, an upper limit and a lower limit width are set around the reference waveform pattern to obtain an allowable range, and the detected waveform pattern (for example, the first waveform pattern) is the upper limit. There is a method for determining whether or not it is within an allowable range between the upper limit and the lower limit. With this method, an allowable range having a certain width can be set with respect to the reference waveform pattern.

  When the deviation between the reference waveform pattern 15 and the first waveform pattern 18 is out of a predetermined range, the abnormal signal is controlled by assuming that the synthetic resin materials 10 and 11 that have just been joined are in a poorly joined state. Output to the device 5. The control device that has input the abnormal signal issues an alarm by an appropriate means and outputs an oscillation stop signal to the ultrasonic oscillator 2 and returns to the driving device 4 after returning the ultrasonic oscillator 2 to the initial position. The stop signal to be output is output. The alarm transmission control and the ultrasonic machining apparatus stop control are not necessarily required, and can be configured as necessary.

  The first waveform pattern 18 having a larger output form than the reference waveform pattern 15 shown in FIG. 4 indicates that at least one of the synthetic resin materials 10 and 11 is in an embrittled state. The first waveform pattern 19 having an output form smaller than that of the pattern 15 indicates that insufficient bonding has occurred. In the normal joining operation, since the oscillation time of the horn 3 is controlled based on the temperature of the horn 3 as described above, a defective product is rarely generated, but a defective bonding state has occurred for some reason. Even in this case, the present invention can detect the occurrence of defective products and can prevent the generation of a large number of defective products.

  Moreover, by displaying the basic waveform pattern 15 and the first waveform pattern 18 or the first waveform pattern 19 at the same time on the display unit 7, an operator who performs repair sees the waveform pattern displayed on the display unit 7. This makes it easy to identify the cause of the defective product.

  Even if a defect in the joining state is found by the present invention, at most, the defective product discovered by the quality control of the present invention and the next product that is subsequently joined are rejected as defective products. This prevents the risk of producing a large number of defective products.

  Examples of joints to which the present invention can be applied include joining of the fastener tape 21 and the reinforcing tape 27 in the slide fastener 20 shown in FIG. 5, and a box bar formed of a synthetic resin material and fixed to the lower end of the fastener element row. And fixing of the box body 26 and the like. In addition, as shown in FIG. 6, a joint portion 35 in which a part of the reversing portion 31 of the fastener element 30 is joined with the fastener tape 21 can also be cited as a joint portion between synthetic resin materials.

  Moreover, the joining example illustrated here is an illustration and does not indicate that the present invention is applied only in relation to the slide fastener. The present invention is applied as an ultrasonic processing method to an ultrasonic processing apparatus that performs bonding, welding, welding, drilling, punching, cutting, etc. to a synthetic resin material in addition to bonding between synthetic resin materials by ultrasonic vibration. Is something that can be done. Furthermore, a quality control function can be provided to the ultrasonic processing apparatus that performs these processes.

  The technical idea of the present invention can be applied to a device or the like to which the technical idea of the present invention can be applied.

1 is a schematic view of an ultrasonic bonding apparatus according to an embodiment of the present invention. (Example) FIG. 6 is a schematic graph showing the relationship between oscillation time and temperature. (Example) It is the graph which modeled the relationship between the output of an ultrasonic oscillator, and oscillation time. (Example) It is the graph which modeled the relationship between a reference | standard waveform pattern and a 1st waveform pattern. (Example) It is a product drawing which shows the member joined by the ultrasonic bonding apparatus. (Example) It is the elements on larger scale which show the member joined by the ultrasonic bonding apparatus. (Example) It is the graph which modeled the current waveform pattern which shows the normal state of welding operation. (Conventional example)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ultrasonic bonding apparatus 2 Ultrasonic oscillator 3 Horn 4 Drive apparatus 5 Control apparatus 6 Comparison determination apparatus 7 Display part 8 Anvil 9 Temperature sensor 10, 11 Synthetic resin materials 15-17 Basic waveform pattern 18, 19 First waveform pattern 20 Slide Fastener 21 Fastener tape 22 Fastener element 23 Slider 24 Handle 25 Upper stop 26 Box 27 Reinforcement tape 30 Fastener element 31 Reverse part 32 Leg part 33 Sewing thread 34 Core string 35 Joint part

Claims (6)

The synthetic resin material (10, 11) is sandwiched between the horn (3) and the anvil (8) of the ultrasonic oscillator (2), and the horn (3) is ultrasonically vibrated against the synthetic resin material. In the ultrasonic processing method for performing processing and managing the processing state of the synthetic resin material that has been subjected to the processing,
The relationship between the vibration energy of the ultrasonic oscillator (2) and the time elapsed since the horn (3) was oscillated during normal processing in the processing step for the synthetic resin material (10, 11). As a reference waveform pattern (15 to 17) to be shown, a reference waveform pattern (15 to 17) is formed for each oscillation time with different time lengths, and these are stored in the storage unit.
The relationship between the vibration energy of the ultrasonic oscillator (2) and the elapsed time since the horn (3) was oscillated is obtained as the first waveform pattern (18, 19), and the processing for the synthetic resin material is performed. The required oscillation time of the ultrasonic oscillator (2) is detected as the first oscillation time,
An oscillation time closest to the first oscillation time is selected from the storage unit, and a reference waveform pattern (15 to 17) corresponding to the selected oscillation time is read from the storage unit,
The read reference waveform pattern (15-17) and the first waveform pattern (18, 19) are compared, and the pattern shape of the reference waveform pattern (15-17) and the first waveform pattern (18, 19) is compared. An ultrasonic processing method comprising: managing a defect state related to a processing state of the synthetic resin material according to a deviation state of the synthetic resin material.   2. The ultrasonic processing method according to claim 1, wherein a load current value of the ultrasonic oscillator (2) is used as the vibration energy.   3. The ultrasonic processing method according to claim 1, wherein the first oscillation time is detected from the first waveform pattern (18, 19). The relationship between the oscillation time of the ultrasonic oscillator (2) in the processing step for the synthetic resin material (10, 11) and the detected temperature of the horn (3) is determined in advance for each predetermined temperature range. And store it in the storage unit.
From the temperature of the horn (3) detected in the processing step, select the oscillation time stored in the storage unit,
The ultrasonic processing method according to any one of claims 1 to 3, wherein the ultrasonic oscillator (2) is oscillated based on the selected oscillation time. Anvil (8) to place synthetic resin material,
An ultrasonic oscillator (2) comprising a horn (3) and generating ultrasonic vibration in the horn (3);
A driving device (4) for driving the horn (3) so as to be able to contact with and separate from the anvil (8);
The comparison determination device (6) for inputting vibration energy output from the ultrasonic oscillator (2),
A control device (5) for inputting an output signal from the comparison determination device (6) and outputting a control signal to at least the drive device (4), the ultrasonic oscillator (2) and the comparison determination device (6); ,
A storage unit connected to at least one of the control device (5) and the comparison determination device (6);
With
The storage unit, during normal processing by the horn (3) and anvil (8), the vibration energy of the ultrasonic oscillator (2) and the elapsed time since the horn (3) was oscillated. As a reference waveform pattern (15-17) indicating the relationship, it has a function of storing the reference pattern (15-17) corresponding to each oscillation time with different time lengths,
The control device (5) has a function of selecting the oscillation time stored in the storage unit, and sends a control signal to the drive device (4) and the ultrasonic oscillator (2) based on the selected oscillation time. Has a function to output,
The comparison / determination device (6) shows a relationship between the vibration energy and the oscillation time based on the vibration energy input from the ultrasonic oscillator (2) and the elapsed time from the input of the vibration energy. It has a function to calculate and form one waveform pattern (18, 19)
The control device (5) or the comparison / determination device (6) has a function of detecting an oscillation time of the ultrasonic oscillator (2) required for processing the synthetic resin material as a first oscillation time,
The control device (5) or the comparison / determination device (6) selects an oscillation time closest to the first oscillation time from the storage unit based on the first oscillation time, and a reference corresponding to the selected oscillation time. It has a function of reading the waveform pattern (15 to 17) from the storage unit,
The comparison / determination device (6) has a function of comparing and determining the read reference waveform pattern (15 to 17) and the calculated and formed first waveform pattern (18, 19) and outputting the comparison determination result. Furthermore, the ultrasonic processing apparatus characterized by having. Further comprising a temperature sensor (9) for detecting the temperature of the horn (3),
The storage unit stores the oscillation time of the ultrasonic oscillator (2) and the temperature detected by the temperature sensor (9) as a correspondence relationship in which the oscillation time corresponds in advance for each predetermined temperature range. In addition,
The function of selecting the oscillation time stored in the storage unit in the control device (5) is a function of selecting the oscillation time based on a temperature signal detected by the temperature sensor (9). The ultrasonic processing apparatus according to claim 5.

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