JP2006074066A - Substrate treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which can accurately set a discharge amount of a treatment liquid and easily change the discharge operation of the treatment liquid from a nozzle. <P>SOLUTION: A control part 13 has recipe data and a sub-library. Into the sub-library, a driving pattern, an acceleration and deceleration time of a pump driving motor 7, and a discharge speed and a discharge amount of a resist liquid from a resist nozzle 4 are inputted. Into the recipe data, control information such as the discharge time of the resist nozzle 4 and the like is inputted from an input part 12 and stored. Furthermore, each control information of the recipe data and the sub-library can be changed from the input part 12. If an operator inputs from an input unit 12 at least four pieces of control information among five pieces of the control information of the discharge amount, the discharge speed and the discharge time of the resist liquid 9, the acceleration time and the deceleration time, the control part 13 computes the rest of the control information on the basis of four input pieces of control information. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus including a nozzle that discharges a processing liquid.

  A substrate processing apparatus is used to perform predetermined processing on a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and a substrate for an optical disk. In such a substrate processing apparatus, the substrate is surface-treated by supplying a processing solution such as a resist solution, a developing solution or a cleaning solution to the surface of the substrate while rotating the substrate in a horizontal posture.

  FIG. 7 is a schematic diagram showing a configuration of a rotary coating apparatus as an example of a substrate processing apparatus. In FIG. 7, the rotary coating apparatus includes a substrate holding unit 2 that holds a substrate W and a spin motor 1 that rotationally drives the substrate holding unit 2. Further, the rotary coating apparatus is provided with a resist solution supply system 30 for supplying a resist solution to the surface of the substrate W. The resist solution supply system 30 includes a resist container 25 that stores the resist solution 26, a resist supply pipe 5 that guides the resist solution 26 in the resist container 25, and a resist nozzle 4 that discharges the resist solution. In the middle of the resist supply pipe 5, a bellows 20 for sending the resist solution 26 in the resist container 25 to the nozzle 4 and a cylinder 21 for extending and contracting the bellows 20 are disposed. Two introduction conduits 28 and 29 for introducing compressed air are connected to the cylinder 21. Open / close valves 22 and 23 are attached to the introduction pipes 28 and 29, respectively. The switching valve 24 connected to the introduction pipes 28 and 29 supplies the compressed air 27 by switching to one introduction pipe 28 and the other introduction pipe 29.

  When supplying the resist solution to the substrate W, compressed air 27 is supplied to the cylinder 21 through the introduction conduit 28 by the switching valve 24. Then, the bellows 20 is extended and the resist solution 26 is sucked into the bellows 20 from the resist container 25. Thereafter, the switching valve 24 is switched to supply the compressed air 27 from the introduction pipe line 29 to the cylinder 21. As a result, the bellows 20 is compressed, and the resist solution 26 in the bellows 20 is discharged from the resist nozzle 4 onto the surface of the substrate W through the resist supply pipe 5. The resist solution discharged onto the surface of the substrate W receives a centrifugal force due to the rotation of the substrate W, and is uniformly spread over the entire surface of the substrate W.

  The film thickness of the resist thin film applied and formed on the surface of the substrate W needs to be accurately controlled in order to form a fine pattern of the resist thin film on the substrate W. The film thickness of the resist thin film depends on the discharge amount of the resist solution supplied to the substrate W. For this reason, the discharge amount of the resist solution from the resist nozzle 4 needs to be accurately controlled.

  In the coating apparatus shown in FIG. 7, the discharge amount of the resist solution is controlled as follows. First, before discharging onto the substrate W, various times are set for the time for supplying the compressed air 27 to the cylinder 21 to drive the cylinder 21, that is, the time for discharging the resist solution from the resist nozzle 4, and the amount of the resist solution discharged at that time. Is measured in a measuring container, and the relationship between the discharge time and the discharge amount of the resist solution is obtained in advance. Based on the measurement result, the resist solution discharge time, that is, the driving time of the cylinder 21 is set so that the resist solution discharge amount becomes a desired value.

  When the resist solution is actually discharged, the cylinder 21 is driven based on the drive time set by the above processing, and the resist solution is discharged from the resist nozzle 4 onto the surface of the substrate W. Then, when the set drive time has elapsed, the on-off valves 22 and 23 of the introduction pipe lines 28 and 29 are closed, and the drive of the cylinder 21 is stopped. Thereby, the discharge of the resist solution from the resist nozzle 4 is stopped.

  In the conventional rotary coating apparatus, the resist solution discharge amount is controlled by the opening / closing operation of the opening / closing valves 22 and 23 of the introduction pipe lines 28 and 29 to the cylinder 21. The opening / closing operation of the opening / closing valves 22, 23 is performed using compressed air 27. For this reason, the opening / closing operations of the on-off valves 22 and 23 are not always constant, and it is therefore difficult to accurately control the discharge amount of the resist solution.

  Each of the on-off valves 22 and 23 has a unique flow rate characteristic. For this reason, even if it is a rotary coating device using the same kind of on-off valves 22 and 23, the relationship between the discharge time and discharge amount of a resist solution differs for each rotary coating device. Therefore, it is necessary to set the discharge time by obtaining the relationship between the discharge time and the discharge amount of the resist solution for each rotary coating apparatus.

  On the other hand, when changing the discharge amount of the resist solution in the conventional rotary coating apparatus, not only the discharge time of the resist solution but also the discharge speed of the resist solution from the resist nozzle 4 can be changed. is there. In this case, the supply amount of the compressed air 27 is adjusted by manually changing a flow rate control device (not shown) provided in the supply line of the compressed air 27 supplied to the cylinder 21. However, every time it is necessary to change the discharge speed of the resist solution, it is necessary to manually readjust the flow rate control device for the compressed air 27, and it is difficult to change the discharge speed of the resist solution.

  An object of the present invention is to provide a substrate processing apparatus capable of accurately setting the discharge amount of the processing liquid from the nozzle and easily changing the discharge operation of the processing liquid from the nozzle.

(1) 1st invention The substrate processing apparatus which concerns on 1st invention is a substrate processing apparatus which supplies the process liquid guide | induced from a process liquid supply source to a board | substrate, and performs a predetermined | prescribed process, Comprising: The board | substrate holding a board | substrate A holding means, a nozzle for discharging the processing liquid to the substrate held by the substrate holding means, a pump for sending the processing liquid from the processing liquid supply source to the nozzle, a motor for driving the pump, and an operation for discharging the processing liquid from the nozzle Input means for inputting control information for controlling the control, and control means for controlling the operation of the motor based on the control information input by the input means. The input means includes a discharge amount and discharge time of the processing liquid from the nozzle. , At least four control information among the five control information of the discharge speed, the acceleration time and the deceleration time of the motor can be input, and the control means, when four control information of the five control information is input, 5 The remaining control information of the control information is obtained, and the operation of the motor is controlled based on the five control information.

  In the substrate processing apparatus according to the first aspect of the present invention, the pump that sends the processing liquid to the nozzle is driven by a motor. The rotation operation of the motor can be accurately controlled by the control means. For this reason, the discharge amount of the processing liquid discharged from the nozzle can be set to a desired value by accurately controlling the discharge amount of the processing liquid from the pump driven by the motor. Furthermore, control information for controlling the discharge operation of the processing liquid of the nozzle can be input from the input means, and the operation of the motor is controlled based on the input control information. For this reason, it becomes possible to easily change the discharge operation of the processing liquid of the nozzle by inputting the control information from the input means.

  In particular, when four pieces of control information among five pieces of control information necessary for motor operation control are input, the control unit can obtain the remaining control information and control the operation of the motor. Thereby, the input operation of the operator's control information can be simplified.

(2) Second invention A substrate processing apparatus according to a second invention is the same as the substrate processing apparatus according to the first invention, wherein the control means controls the discharge time of the processing liquid from the nozzle, the discharge speed, and the acceleration of the motor. The operation of the motor is controlled based on time and deceleration time control information.

  In the substrate processing apparatus according to the second aspect of the invention, the control means can control the operation of the motor based on the control information of the discharge time, discharge speed, motor acceleration time and deceleration time of the processing liquid from the nozzle. Thereby, the discharge operation of the processing liquid from the nozzle can be accurately controlled.

(3) Third Invention A substrate processing apparatus according to a third invention is the substrate processing apparatus according to the first or second invention, wherein the control means is a motor based on control information on the discharge speed of the processing liquid. It controls the rotation speed.

  In the substrate processing apparatus according to the third aspect of the present invention, the control means can control the rotation speed of the motor based on the discharge speed control information. Thereby, the processing liquid can be discharged from the nozzle to the substrate at a desired discharge speed.

(4) Fourth invention A substrate processing apparatus according to a fourth invention is the substrate processing apparatus according to any one of the first to third inventions, wherein the control means includes at least an acceleration time and a deceleration time of the motor. The acceleration or deceleration operation of the motor is controlled based on one control information.

  In the substrate processing apparatus according to the fourth aspect of the invention, the control means can control the acceleration or deceleration operation of the motor based on control information on at least one of the acceleration time and the deceleration time. As a result, the initial and final discharge states of the processing liquid from the nozzle can be controlled to a desired state.

(5) Fifth Invention A substrate processing apparatus according to a fifth invention is the configuration of the substrate processing apparatus according to any one of the first to fourth inventions, wherein the control means uses control information for a discharge time of the processing liquid. Based on this, the time for the motor to drive the pump is controlled.

  In the substrate processing apparatus according to the fifth aspect of the invention, the control means can control the time for which the motor drives the pump based on the discharge time control information. Thereby, the discharge time of the processing liquid can be controlled by adjusting the discharge time of the processing liquid from the nozzle to a desired value.

(6) Sixth Invention A substrate processing apparatus according to a sixth invention is the configuration of the substrate processing apparatus according to any one of the first to fifth inventions, wherein the control means uses the control information for the discharge amount of the processing liquid. Based on this, the rotation operation of the motor is controlled.

  In the substrate processing apparatus according to the sixth aspect of the invention, the control means can control the rotation operation of the motor based on the control information on the discharge amount of the processing liquid. Thereby, the discharge amount of the processing liquid from the nozzle can be controlled to a desired value.

(7) Seventh Invention A substrate processing apparatus according to a seventh invention is the configuration of the substrate processing apparatus according to any one of the first to sixth inventions, wherein the input means provides control information according to the characteristics of the pump. Correction information for correction is further input, and the control means corrects the control information input by the input means based on the correction information, and controls the operation of the motor based on the corrected control information.

  In the substrate processing apparatus according to the seventh aspect of the invention, it is possible to input control information for controlling the discharge operation of the processing liquid of the nozzle and correction information for correcting the control information according to the characteristics of the pump by the input means. it can. The correction information includes information for correcting the general-purpose control information in accordance with the pump-specific characteristics of each substrate processing apparatus with respect to the control information generated for the general-purpose substrate processing apparatus. Therefore, the control liquid is controlled to a desired state accurately by correcting the control information based on the correction information input by the control means to control the discharge operation of the processing liquid of the nozzle.

(8) Eighth Invention A substrate processing apparatus according to an eighth invention is the configuration of the substrate processing apparatus according to any one of the first to seventh inventions, wherein the control means includes a plurality of processes for a predetermined process. Stores processing procedure information that defines the processing procedure in the process and motor control information that defines the rotational operation of the motor, controls a plurality of processing steps based on the processing procedure information, and controls the motor based on the motor control information. The operation is controlled, and the motor control information includes all or part of the five pieces of control information.

  In the substrate processing apparatus according to the eighth aspect of the invention, the control means controls a plurality of processing steps based on the stored processing procedure information and controls the operation of the motor based on the stored motor control information.

(9) Ninth Invention A substrate processing apparatus according to a ninth invention is the configuration of the substrate processing apparatus according to any one of the first to eighth inventions, wherein the input means changes the rotation speed of the motor as control information. The control means controls the rotational operation of the motor based on the rotational speed change pattern input from the input means.

  In the substrate processing apparatus according to the ninth aspect of the present invention, the rotational speed change pattern of the motor can be input from the input means, and the rotational operation of the motor can be controlled according to the input rotational speed change pattern. Thereby, a process liquid can be discharged from a nozzle in a desired state.

(10) Tenth Invention A substrate processing apparatus according to a tenth invention is the configuration of the substrate processing apparatus according to the ninth invention, wherein the rotational speed change pattern is a trapezoidal pattern.

  In the substrate processing apparatus according to the tenth invention, it is possible to input a trapezoidal rotation speed change pattern, and the control means has a trapezoidal rotation speed change pattern, the discharge amount of the processing liquid from the nozzle, and the discharge time. The operation of the motor can be controlled based on the control information of the discharge speed, the acceleration time and the deceleration time of the motor. Thereby, the discharge operation of the processing liquid from the nozzle can be accurately controlled.

(11) Eleventh invention A substrate processing apparatus according to an eleventh aspect of the invention is the substrate processing apparatus according to the ninth aspect of the invention, wherein the rotational speed change pattern has an S-shaped rotational speed when the motor is accelerated and decelerated. It is an S-shaped pattern that changes to.

  In the substrate processing apparatus according to the eleventh aspect of the invention, an S-shaped pattern whose rotational speed changes in an S-shape when the motor is accelerated and decelerated can be input, and the control means discharges the processing liquid from the nozzle. The rotational operation of the motor in accordance with the S-shaped rotational speed change pattern can be controlled based on the control information on the amount, the discharge time, the discharge speed, the acceleration time and the deceleration time of the motor. Thereby, the discharge operation of the processing liquid of the nozzle can be accurately controlled.

  FIG. 1 is a schematic configuration diagram of a rotary coating apparatus as an example of a substrate processing apparatus according to an embodiment of the present invention. In FIG. 1, the rotary coating apparatus includes a spin motor 1 and a substrate holding unit 2 that is attached to the tip of the rotation shaft of the spin motor 1 and is driven to rotate while holding the substrate W in a horizontal posture. The rotary coating apparatus also has a resist solution supply system 30 that supplies a resist solution to the substrate W. The resist solution supply system 30 includes a resist container 8 that stores the resist solution 9, a resist nozzle 4 that discharges the resist solution 9, a resist supply pipe 5 that connects the resist nozzle 4 and the resist container 8, and a resist supply pipe. A discharge pump 6 and a pump drive motor 7 provided in the passage 5 are provided.

  The resist nozzle 4 is formed to be movable between a position above the substrate W and a standby position outside the substrate W.

  The pump drive motor 7 is a pulse motor. In the pulse motor, the rotational speed can be accurately controlled by the drive pulse. The pump drive motor 7 composed of this pulse motor is rotationally driven by a drive pulse output from the motor controller 10 under the control of the main controller 11.

  The discharge pump 6 receives a rotational force from the pump drive motor 7 and sends the resist solution 9 from the resist container 8 to the resist nozzle 4 through the resist supply pipe 5 to be discharged from the resist nozzle 4.

  The main controller 11 includes an input unit 12, a control unit 13, and a display unit 14. The input unit 12 inputs control information for the discharge operation of the resist solution 9 from the resist nozzle 4 and control information for the rotation operation of the pump drive motor 7.

  The control unit 13 has a sub-library that stores recipe data that stores control information that defines the processing procedure in the rotary coating apparatus, and control information that defines the operation of the pump drive motor 7. Each control information input from the input unit 12 is stored at a predetermined position in the recipe data and the sub library. The control unit 13 refers to the recipe data and the sub-library to control the operation of each unit of the rotary coating apparatus and outputs a control signal to the motor controller 10 to control the rotation operation of the pump drive motor 7.

  The display unit 14 displays control information input from the input unit 12, control information obtained by the control unit 13, and the like.

  FIG. 2 is an explanatory diagram of recipe data, and FIG. 3 is an explanatory diagram of a sub-library. Furthermore, FIG. 4 is a figure which shows the rotational speed change of the pump drive motor in the process of a rotary coating device.

  As shown in FIGS. 2 to 4, in the rotary coating apparatus, a resist solution discharge process, a spin coating process, a substrate rinsing process, a drying process, and a standby process are performed. The recipe data 15 in FIG. 2 includes processing steps 15a corresponding to the respective processing steps of the rotary coating apparatus, substrate rotation speed 15b in each processing step, processing time 15c in each processing step, and resist nozzle movement timing information (not shown). Etc.) is stored.

  3 includes a resist solution discharge speed Vd from the resist nozzle 4, an acceleration time Ta and a deceleration time Tr of the pump drive motor 7, a resist solution discharge amount Q, and a drive pattern of the pump drive motor 7. P and a correction value C of the discharge amount of the resist solution are stored.

  In the above embodiment, the substrate holding unit 2 corresponds to the substrate holding means of the present invention, the resist nozzle 4 corresponds to the nozzle, the discharge pump 6 corresponds to the pump, the pump drive motor 7 corresponds to the motor, The input unit 14 of the controller 11 corresponds to an input unit, and the control unit 12 corresponds to a control unit. Furthermore, the recipe data 15 corresponds to processing procedure information, and the sub-library 16 corresponds to motor control information.

  The processing operation of the rotary coating apparatus having the above configuration will be described below. Usually, the recipe data 15 and the sub-library 16 of the rotary coating apparatus are created in advance and stored in the control unit 13 of the main controller 11. Then, the rotary coating apparatus performs each processing step with reference to the stored recipe data 15 and sub-library 16.

  In addition, when changing the processing operation based on the control information stored in the recipe data 15 and the sub-library 16 to perform a new processing operation, the control information to be changed is input from the input unit 12 of the main controller 11. . Here, the case where the discharge operation of the resist nozzle 4 is changed will be described.

  In this case, the operator uses the input unit 12 to discharge the resist solution Vd from the resist nozzle 4, the acceleration time Ta and the deceleration time Tr of the pump drive motor 7, the resist solution discharge amount Q, and the drive pattern P of the pump drive motor 7. Then, the correction value C of the resist solution discharge amount and the resist solution discharge time Td are input. Of the input control information, the resist solution discharge time Td is stored as the time T3 in the processing time 15c of the processing step S3 of the recipe data 15 in FIG. 2, and the remaining control information is stored in the sub-library 16 in FIG. Stored in place. Thereby, a process will be in a start state.

  In the rotary coating apparatus of this embodiment, it is not necessary to input all the seven control information from the input unit 12. For example, when the rotational speed of the pump drive motor 7 is controlled by a trapezoidal drive pattern as shown in FIG. 5, the discharge amount Q, discharge speed Vd, discharge time Td, acceleration time Ta, and deceleration time of the resist solution 9 Of the five Tr control information, at least four pieces of control information may be input. In this case, the control unit 13 calculates the remaining control information based on the four pieces of input control information.

  For example, when the discharge speed Vd, discharge time Td, acceleration time Ta and deceleration time Tr of the pump drive motor 7 are input from the input unit 12, the control unit 13 calculates the discharge amount Q of the resist solution, and the sub-library. 16 and displayed on the display unit 14. Thereby, the operator can confirm the discharge amount Q of the resist solution.

  When the rotational speed of the pump drive motor 7 is controlled by an S-shaped drive pattern as shown in FIG. 6, in addition to at least four pieces of control information similar to the trapezoidal drive pattern, the pump drive motor The control information of the S-shaped rotational speed at the time of acceleration and deceleration of 7 may be input.

  Further, when the correction value C of the discharge amount of the resist solution from the discharge pump 6 is input from the input unit 12, the control unit 13 corrects the rotational operation of the pump drive motor 7 based on the correction value C. Usually, the sub-library 16 is commonly used for a rotary coating apparatus in which the discharge pump 6 and the pump drive motor 7 having the same specifications are used. However, even if the discharge pump 6 has the same specification, a difference peculiar to the apparatus occurs in the discharge capacity of each pump. For example, in the discharge pump 6 having a specification of discharging 1 ml (milliliter) of resist liquid when 2000 drive pulses are given to the pump drive motor 7, 2000 drive pulses are actually given to the pump drive motor 7 and the discharge pump 6 is discharged. When the amount of discharge is measured, it may be different from 1 ml.

  Therefore, when the actually measured discharge amount per predetermined number of drive pulses is input from the input unit 12 as the correction value C, the control unit 13 calculates the discharge amount of the resist solution per drive pulse. Then, the actual discharge amount from the resist nozzle 4 is calculated and displayed on the display unit 14. As a result, the operator can confirm the actual discharge amount of the resist solution from the resist nozzle 4.

  When the actual discharge amount from the resist nozzle 4 is controlled to be the input discharge amount Q, the input value of the resist solution discharge time Td based on the discharge amount calculated from the correction value C or The input value of the discharge speed Vd is corrected. Thereby, the discharge amount from the resist nozzle 4 can be set to the input desired discharge amount Q.

  When the input of the control information is completed, the control unit 13 receives the input information of the processing start from the worker, and the control unit 13 moves the registration nozzle 4 above the substrate W based on the control information of the processing step S1 of the recipe data 15. Move.

  Next, a resist discharge process is performed based on the control information shown in process steps S2 and S3. At this time, the control unit 13 discharges the resist solution from the resist nozzle 4 to the substrate W based on the control information input from the input unit 12 and stored in the sub-library 16. For example, when the trapezoidal drive pattern P is input from the input unit 12, the control unit 13 rotationally drives the pump drive motor 7 as shown in FIG. 5 according to each control information. That is, the pump drive motor 7 is accelerated for Ta time from the resist solution discharge time t1 and then rotated at a constant rotational speed Rm for (Td− (Ta + Tr)) time. Further, the pump drive motor 7 is decelerated during the Tr time and stopped at time t2. As a result, the resist liquid 9 is discharged from the resist nozzle 4 onto the substrate W by a predetermined discharge amount Q at a predetermined discharge speed Vd.

  Thereafter, based on the control information shown in the processing steps S3 to S5, the spin motor 1 is rotationally driven at the rotational speeds R1, R4, and R5, and the resist solution 9 discharged onto the surface of the substrate W is spread over the entire surface.

  Further, based on the control information shown in the processing steps S <b> 6 to S <b> 8, the rinsing process on the back surface of the substrate W and the edge cleaning process on the peripheral edge of the substrate W are performed.

  Furthermore, after the rinse-off of the rinse liquid from the substrate W is performed based on the control information shown in the processing steps S9 to S10, the standby state is set.

  As described above, in the rotary coating apparatus according to the present embodiment, control information for the discharge operation of the resist nozzle 4 and the rotation operation of the pump drive motor 7 can be input from the input unit 12 of the main controller 11. For this reason, the discharge amount of the resist solution can be changed to an optimum amount according to the type of the resist solution, the diameter of the substrate W, and the like.

  Further, by driving the discharge pump 6 using the pump drive motor 7 formed of a pulse motor capable of accurate rotation control, the discharge amount of the resist solution from the resist nozzle 4 can be accurately controlled. In addition, by correcting the discharge operation from the resist nozzle 4 based on the correction value C obtained from the actual discharge amount of the discharge pump 6, the discharge characteristics of the discharge pumps 6 even when the common sub-library 16 is used. The amount of resist solution discharged can be accurately controlled to a desired amount by performing correction according to the above.

  In the above embodiment, the drive pattern of the pump drive motor 7 can be given not only a trapezoidal shape and an S-shaped pattern but also other drive patterns.

  In the above embodiment, the example in which the processing time stored in the T3 time column of the processing time 15c of the recipe data 15 is used as the discharging time Td of the resist solution 9 is shown. 16 may be configured to be stored.

  If the ejection time Td is input to the recipe data 15 as in the above embodiment, the ejection time in the recipe data 15 is changed when the resist ejection amount from the nozzle 4 is changed. The resist discharge amount from the nozzle 4 can be easily changed without changing the data in the sub-library 16.

  Further, in the above embodiment, the resist supply system 30 of the resist nozzle 4 of the rotary coating apparatus has been described as an example. However, the present invention can also be applied to the rinse liquid supply system of the edge cleaning nozzle, and further cleaning is performed. The present invention can also be applied to a substrate processing apparatus having another processing liquid supply system such as an apparatus or a developing apparatus.

It is a schematic diagram which shows the structure of the rotary coating device as an Example of the substrate processing apparatus of this invention. It is explanatory drawing of the recipe data of the rotary coating device of FIG. It is explanatory drawing of the sub library of the rotary coating apparatus of FIG. It is a figure which shows the rotation speed change of the spin motor of the rotary coating device of FIG. It is explanatory drawing of the rotational speed control of the pump drive motor of FIG. It is a figure which shows the other example of rotational speed control of the pump drive motor of FIG. It is a schematic diagram which shows the structure of the conventional rotary coating device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Spin motor 2 Substrate holding | maintenance part 4 Resist nozzle 5 Resist supply line 6 Discharge pump 7 Pump drive motor 8 Resist container 9 Resist liquid 10 Motor controller 11 Main controller 12 Control part 13 Display part 14 Input part 15 Recipe data 16 Sublibrary

Claims (11)

A substrate processing apparatus for performing a predetermined process by supplying a processing liquid guided from a processing liquid supply source to a substrate,
Substrate holding means for holding the substrate;
A nozzle for discharging a processing liquid onto the substrate held by the substrate holding means;
A pump for feeding the processing liquid from the processing liquid supply source to the nozzle;
A motor for driving the pump;
Input means for inputting control information for controlling the discharge operation of the processing liquid from the nozzle;
Control means for controlling the operation of the motor based on the control information input by the input means,
The input means is capable of inputting at least four pieces of control information among five pieces of control information of a processing liquid discharge amount, discharge time, discharge speed, acceleration time and deceleration time of the motor from the nozzle,
The control means obtains the remaining control information of the five control information when four control information of the five control information is input, and operates the motor based on the five control information. The substrate processing apparatus characterized by controlling. 2. The substrate according to claim 1, wherein the control unit controls the operation of the motor based on control information of a discharge time and discharge speed of the processing liquid from the nozzle, an acceleration time and a deceleration time of the motor. Processing equipment. The substrate processing apparatus according to claim 1, wherein the control unit controls a rotation speed of the motor based on control information on a discharge speed of the processing liquid. The substrate processing according to claim 1, wherein the control unit controls an acceleration or deceleration operation of the motor based on control information of at least one of an acceleration time and a deceleration time of the motor. apparatus. The substrate processing apparatus according to claim 1, wherein the control unit controls a time for which the motor drives the pump based on control information on a discharge time of the processing liquid. The substrate processing apparatus according to claim 1, wherein the control unit controls a rotation operation of the motor based on control information on a discharge amount of the processing liquid. The input means further inputs correction information for correcting the control information according to the characteristics of the pump,
The said control means correct | amends the said control information input by the said input means based on the said correction information, and controls operation | movement of the said motor based on the control information after correction | amendment. The substrate processing apparatus according to any one of the above. The control means stores processing procedure information that defines processing procedures in a plurality of processing steps for the predetermined processing, and motor control information that defines a rotational operation of the motor, and based on the processing procedure information While controlling the plurality of processing steps, controlling the operation of the motor based on the motor control information,
The substrate processing apparatus according to claim 1, wherein the motor control information includes all or part of the five pieces of control information. The input means inputs a rotation speed change pattern indicating a change in the rotation speed of the motor as the control information,
The substrate processing apparatus according to claim 1, wherein the control unit controls a rotation operation of the motor based on the rotation speed change pattern input from the input unit. The substrate processing apparatus according to claim 9, wherein the rotation speed change pattern is a trapezoidal pattern. The substrate processing apparatus according to claim 9, wherein the rotation speed change pattern is an S-shaped pattern in which the rotation speed changes to an S shape when the motor is accelerated and decelerated.

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