JP2006073720A5 - - Google Patents
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- JP2006073720A5 JP2006073720A5 JP2004254220A JP2004254220A JP2006073720A5 JP 2006073720 A5 JP2006073720 A5 JP 2006073720A5 JP 2004254220 A JP2004254220 A JP 2004254220A JP 2004254220 A JP2004254220 A JP 2004254220A JP 2006073720 A5 JP2006073720 A5 JP 2006073720A5
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- JP
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- Prior art keywords
- wire bonding
- bonding method
- connection portion
- wire
- shape
- Prior art date
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Claims (9)
前記ワイヤのループ形状を複数の形状パラメータで定義し、前記形状パラメータと前記ワイヤに発生するひずみの関係を関数で与え、前記ワイヤひずみを低減するよう前記関数に従い前記形状パラメータを自動的に計算してループ形状を決定しワイヤボンディングを行うことを特徴とするワイヤボンディング方法。 In the wire bonding method of electrically connecting the first connection portion and the second connection portion with a wire,
The loop shape of the wire is defined by a plurality of shape parameters, the relationship between the shape parameter and the strain generated in the wire is given as a function, and the shape parameter is automatically calculated according to the function so as to reduce the wire strain. A wire bonding method characterized by determining a loop shape and performing wire bonding.
既知の形状パラメータが入力されると、未知の形状パラメータを前記関数に従い自動的に計算して求め、ループ形状を決定しワイヤボンディングを行うことを特徴とするワイヤボンディング方法。 The wire bonding method according to claim 1,
A wire bonding method characterized in that when a known shape parameter is inputted, an unknown shape parameter is automatically calculated according to the function, a loop shape is determined, and wire bonding is performed.
既知の形状パラメータと前記関数から求めた未知の形状パラメータを一旦記憶装置に記憶し、その記憶に従いワイヤボンディングを行うことを特徴とするワイヤボンディング方法。 The wire bonding method according to claim 2,
A wire bonding method characterized in that a known shape parameter and an unknown shape parameter obtained from the function are temporarily stored in a storage device, and wire bonding is performed according to the storage.
形状パラメータである前記第１の接続部と前記第２の接続部の位置情報をカメラで認識すると、未知の形状パラメータを前記関数に従い自動的に計算して求め、ループ形状を決定しワイヤボンディングを行うことを特徴とするワイヤボンディング方法。 The wire bonding method according to claim 1,
When the position information of the first connection portion and the second connection portion, which are shape parameters, is recognized by the camera, an unknown shape parameter is automatically calculated according to the function, a loop shape is determined, and wire bonding is performed. The wire bonding method characterized by performing.
前記カメラで認識した位置情報と前記関数から求めた未知の形状パラメータを一旦記憶装置に記憶し、その記憶に従いワイヤボンディングを行うことを特徴とするワイヤボンディング方法。 The wire bonding method according to claim 4, wherein
A wire bonding method characterized in that position information recognized by the camera and an unknown shape parameter obtained from the function are temporarily stored in a storage device, and wire bonding is performed according to the storage.
前記第１の接続部は、半導体チップに設けられており、
前記第２の接続部は、配線基板、若しくはリードフレームのリードに設けられていることを特徴とするワイヤボンディング方法。 The wire bonding method according to claim 1,
The first connection portion is provided on a semiconductor chip;
The wire bonding method, wherein the second connection portion is provided on a lead of a wiring board or a lead frame.
前記第１の接続部及び前記第２の接続部の位置情報を認識する工程と、Recognizing position information of the first connection part and the second connection part;
前記位置情報をもとにワイヤボンディングの形状を設定する工程と、Setting the shape of wire bonding based on the position information;
前記設定したワイヤボンディングの形状の寿命を予測する工程と、Predicting the life of the set wire bonding shape;
前記予測した寿命が所定の寿命を満足しているときに、前記第１の接続部と第２の接続部とのワイヤボンディングを行う工程とを、ワイヤボンディング装置が行うことを特徴とするワイヤボンディング方法。A wire bonding apparatus, wherein a wire bonding apparatus performs a step of wire bonding between the first connection portion and the second connection portion when the predicted life satisfies a predetermined life. Method.
前記位置情報の認識をカメラを用いて行うことを特徴とするワイヤボンディング方法。A wire bonding method characterized in that the position information is recognized using a camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004254220A JP2006073720A (en) | 2004-09-01 | 2004-09-01 | Wire bonding method and wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004254220A JP2006073720A (en) | 2004-09-01 | 2004-09-01 | Wire bonding method and wire bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006073720A JP2006073720A (en) | 2006-03-16 |
| JP2006073720A5 true JP2006073720A5 (en) | 2006-11-24 |
Family
ID=36154028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004254220A Pending JP2006073720A (en) | 2004-09-01 | 2004-09-01 | Wire bonding method and wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006073720A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4943918B2 (en) * | 2007-03-31 | 2012-05-30 | 財団法人福岡県産業・科学技術振興財団 | Real shape verification device |
| CN113218956A (en) * | 2021-05-13 | 2021-08-06 | 厦门多彩光电子科技有限公司 | Welding wire evaluation method for LED lamp bead |
| CN113962189B (en) * | 2021-11-25 | 2023-04-21 | 中国电子科技集团公司第二十九研究所 | Automatic wire bonding arc quantization control method |
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2004
- 2004-09-01 JP JP2004254220A patent/JP2006073720A/en active Pending
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