JP2006066741A - Method for manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic components with high dimension precision for preventing a ceramic green sheet from being deformed, or from being damaged in a manufacturing process. <P>SOLUTION: This method for manufacturing electronic components comprises a process for manufacturing a ceramic green sheet 2, a process for manufacturing a ceramic sheet 3 by burning a ceramic green sheet which is thinner than the ceramic green sheet 2, a process for manufacturing a laminate ceramic sheet 4 by laminating and heating the ceramic green sheet 2 and the ceramic sheet 3, a process for forming a conductor layer 5 on the laminate ceramic sheet 4, a process for manufacturing a ceramic layered product 6 by laminating and heating a plurality of laminate ceramic sheets 4, and a process for burning the ceramic sheet layered product 6. The ceramic green sheet 2 contains melting components which are turned into a melting status in heating when the laminate ceramic sheet 4 is manufactured, and when the ceramic sheet layered product 6 is manufactured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic component such as a multilayer capacitor or a multilayer ceramic wiring board.

  In recent years, along with the downsizing of electronic devices, downsizing and high performance are desired in electronic parts such as multilayer ceramic wiring boards. For example, in a multilayer ceramic wiring board, a thinner insulating layer and a wiring conductor layer are formed in multiple layers for miniaturization and higher density of the wiring conductor, and the width and interval of the wiring conductor layer are required to be finer. Yes.

  Such electronic parts are made by adding an organic binder, plasticizer, solvent, etc. to ceramic powder to form a slurry, forming a ceramic green sheet (hereinafter also referred to as green sheet) with a doctor blade, etc., and then a conductor containing metal powder. A conductive layer is formed on the green sheet by printing a paste, etc., and then a green sheet on which a plurality of conductive layers are formed is stacked and pressed to obtain a stacked body. It is obtained by firing the body.

  In the demand for higher functionality for electronic components, higher dimensional accuracy is required simultaneously with the miniaturization of wiring. This is because if there is dimensional variation of the ceramic wiring board, when mounting chip parts such as IC chips and chip capacitors on the ceramic wiring board, the size of the mask that prints the solder paste on the connection conductor on the surface of the ceramic wiring board This is because there is a problem in that it is necessary to prepare a plurality of IC chips according to the above, or when an IC chip is mounted by an automatic machine based on the outer side of the ceramic wiring board, it cannot be mounted accurately on the connection conductor on the surface of the ceramic wiring board.

  In the process of manufacturing electronic components using these ceramic wiring boards, from the formation of a through hole in a green sheet to the process of printing a conductor paste and laminating a plurality of green sheets to obtain a green sheet laminate The green sheet deforms due to repeated expansion and contraction. For example, in the formation of the through hole, the green sheet is extended by punching.

  Also, in the step of sintering the green sheet laminate obtained by these steps, the density of the green sheet is partially different, and the shrinkage rate of the green sheet varies depending on the part in the ceramic wiring board, and is fired. This causes variations in the board accuracy of later electronic components.

  With respect to this problem, in Patent Documents 1 to 3, an inorganic material that does not sinter at the firing temperature of the glass ceramic component and an organic component such as an organic binder and a plasticizer are formed on both sides or one side of the laminate of the glass ceramic green sheet. A method of laminating and firing a constrained green sheet is proposed. According to this restraint firing method, in order to restrain the shrinkage at the time of firing the laminate, the shrinkage occurs only in the thickness direction of the laminate, and the shrinkage occurs in the longitudinal direction and the lateral direction (direction in the plane) of the laminate surface. It has been shown that the dimensional accuracy of the glass-ceramic substrate is improved by suppressing the dimensional variation of the glass-ceramic substrate caused by variations in firing shrinkage.

Furthermore, in Patent Document 4, by attaching a very thin sintered ceramic sheet that does not deform to a green sheet that is easily deformed, a process from through-hole formation to sintering is performed in a constrained state in the plane direction. It is shown that the dimensional accuracy of the ceramic substrate is improved by suppressing the dimensional variation in the direction.
JP-A-4-243978 Japanese Patent Laid-Open No. 5-28867 JP-A-5-102666 Japanese Patent Laid-Open No. 5-110258

  However, in the above-described prior art, in the constrained firing method, the green sheet undergoes deformation such as expansion and contraction before the green sheet is processed to obtain a laminate, and these deformations are caused by printing misalignment and interlayering during lamination. Since this causes a deviation, there is a problem that it is difficult to increase the density of the wiring in the multilayer ceramic substrate.

  Furthermore, when manufacturing an electronic component having a cavity, the method of attaching a restraint sheet to the upper and lower surfaces of the laminate for restraint firing has a problem that cracks are generated during firing because the bottom of the cavity is not restrained. It was. In this case, if the green sheet in which the through-hole serving as the cavity is formed and the green sheet not formed with the through-hole serving as the bottom of the cavity are stacked and pressure-bonded, the cavity bottom of the green sheet laminate is warped. There was a problem. If the cavity bottom warps, it becomes difficult to mount an electronic element such as a crystal resonator or an IC chip. Further, even if an electronic element can be mounted in the cavity, the mounted electronic element is tilted. Therefore, when an optical semiconductor element such as a CCD or C-MOS is mounted, there is a problem that the light receiving accuracy is deteriorated.

  Also, in the method of pasting and processing a deformable green sheet and an extremely thin sintered ceramic sheet that does not deform, for example, when applying a slurry of a green sheet on a ceramic sheet, the thickness of the ceramic sheet is thin. When the slurry of the green sheet applied on the ceramic sheet is thick, there is a problem that the ceramic sheet cracks or warps due to drying shrinkage of the slurry when the slurry of the green sheet is dried.

  In addition, when a green sheet and a ceramic sheet produced independently are bonded together, or when the bonded ceramic sheets are laminated with a green sheet, it is performed via an adhesive, but the green sheet swells due to the solvent of this adhesive. There was a problem that the green sheet was deformed or the ceramic sheet was cracked by the pressure applied when the ceramic sheet was laminated or laminated to the green sheet.

  The present invention has been completed in view of the above-described conventional problems, and its purpose is to provide an electronic component that has high dimensional accuracy and that does not deform the ceramic green sheet or damage the ceramic sheet in the manufacturing process. It is to provide a manufacturing method.

  The electronic component manufacturing method of the present invention includes a step of producing a ceramic green sheet, a step of producing a ceramic sheet by firing another ceramic green sheet thinner than the ceramic green sheet, the ceramic green sheet and the ceramic A step of producing an integrated multilayer ceramic sheet by laminating and heating the sheet, a step of forming a conductor layer on the multilayer ceramic sheet, and a plurality of the multilayer ceramic sheets on which the conductor layer is formed A step of producing a ceramic sheet laminated body by laminating and heating, and a step of firing the ceramic sheet laminated body, wherein the ceramic green sheet is used for producing the laminated ceramic sheet and the ceramic. During heating when producing a sheet laminate Characterized in that it contains a molten component which is a fusion state.

  The method for manufacturing an electronic component according to the present invention is preferably characterized in that the melting component has a melting point of 35 ° C. to 100 ° C.

  According to the method for manufacturing an electronic component of the present invention, since the ceramic green sheet of the multilayer ceramic sheet contains a melting component that melts when heated, the ceramic green sheet produced separately and other ceramic green sheets thinner than that are produced. The ceramic green sheet is softened when the integrated multilayer ceramic sheet is produced by laminating and heating the ceramic sheet prepared by firing the ceramic sheet, so the ceramic green sheet is positioned above or below the ceramic sheet. It will be deformed following the shape. As a result, the pressure when bonding the ceramic green sheet and the ceramic sheet is not high enough to deform the ceramic green sheet or crack the ceramic sheet. Without cracking, the ceramic green sheet and the ceramic sheet are in close contact with each other, and a laminated ceramic sheet that is reliably integrated can be produced.

  In addition, ceramic green sheets and ceramic sheets are produced separately, and laminated to produce a laminated ceramic sheet. Therefore, a ceramic that occurs when ceramic green sheet slurry is applied on the ceramic sheet. The ceramic sheet does not crack or warp due to the stress generated at the interface between the ceramic green sheet slurry and the ceramic sheet when the green sheet slurry shrinks by drying. be able to.

  Next, when a plurality of these integrated multilayer ceramic sheets on which conductor layers are formed are laminated and heated and pressed to produce a ceramic sheet laminate, the integrated multilayer ceramic sheet is flattened by the ceramic sheet. Since the ceramic green sheet of the multilayer ceramic sheet does not expand or contract due to pressure because it is constrained in the direction, the deformation of the ceramic sheet laminate before firing can be suppressed, and the electronic material obtained by firing the ceramic sheet laminate Variations in dimensional accuracy due to deformation during processing of parts can be reduced.

  Furthermore, since the ceramic green sheet of the multilayer ceramic sheet softens when heated, the ceramic green sheet must be deformed following the shape of the ceramic sheet positioned above and below and the pattern of the conductor layer formed thereon. It becomes. As a result, the multilayer ceramic sheets are brought into close contact with each other without generating voids around the conductor layer or between the conductor layers, and an electronic component obtained by firing a ceramic sheet laminate obtained by laminating a plurality of multilayer ceramic sheets No delamination occurs and a highly accurate ceramic sheet laminate can be produced more reliably.

  In addition, since the ceramic green sheet of the multilayer ceramic sheet contains a melting component that melts when heated, the ceramic green sheet softens and has adhesiveness only by heating. Therefore, it is possible to perform pressure bonding while maintaining high dimensional accuracy of the ceramic sheet laminate without changing the shape of the conductor layer formed on the multilayer ceramic sheet. Moreover, since the pressure of pressurization is smaller than the pressure which a ceramic sheet breaks, the problem that a ceramic sheet cracks does not generate | occur | produce. Furthermore, since the ceramic green sheet does not soften and does not have adhesiveness at room temperature without heating, there is an advantage that handling is easy in processing without heating.

  Further, in the ceramic sheet laminate in which the multilayer ceramic sheets are laminated, the ceramic green sheet is fixed in the plane direction by the ceramic sheet, and therefore shrinks in one direction only in the thickness direction during sintering. Thereby, since the difference in shrinkage ratio of each part of the ceramic sheet laminate and the variation in the shrinkage characteristic inherent in the ceramic green sheet do not appear in the plane direction, a highly accurate electronic component can be manufactured.

  Therefore, the pattern shape of the conductor layer formed on the multilayer ceramic sheet is not deformed, and the ceramic sheet laminate and the electronic component obtained by firing the laminate have high dimensional accuracy.

  In the present invention, when a melting component that melts during heating has a melting point of 35 ° C. to 100 ° C., the ceramic green sheet is not softened and deformed at room temperature, so that it is easy to handle up to the lamination process. During heating, organic components such as an organic binder (hereinafter also referred to as a binder) and a plasticizer in the ceramic green sheet are not decomposed, so that delamination does not occur due to the decomposition gas, which is preferable.

  In addition, when manufacturing electronic parts having cavities, it is not necessary to press the ceramic green sheet with a large applied pressure, so the warping of the bottom of the cavity due to the difference in the elongation of the green sheet due to the pressurization between the cavity periphery and the cavity bottom. It is possible to suppress the generation, and it is possible to obtain an electronic component that can accurately and reliably mount the electronic element on the bottom of the cavity.

  Further, since the bottom of the cavity is also restrained by the ceramic sheet of the multilayer ceramic sheet, it can be restrained without generating cracks due to distortion during firing, and the resulting electronic component has high dimensional accuracy.

  Thus, according to the production method of the present invention, delamination does not occur during the production of the ceramic sheet laminate, and the ceramic green sheet does not soften at room temperature without heating, so that handling during processing is easy. Further, since the ceramic sheet laminate is shrunk in one direction in the thickness direction when the ceramic sheet laminate is sintered, it is possible to form a highly accurate conductor pattern. Therefore, an electronic component manufactured by the manufacturing method of the present invention has high dimensional accuracy. It will have.

  The method for manufacturing an electronic component of the present invention will be described in detail below. 1A to 1D are cross-sectional views for each process showing an example of an embodiment of a method of manufacturing an electronic component according to the present invention, wherein 1 is a support, 2 is a ceramic green sheet (green sheet), 3 is a ceramic sheet, 4 is a laminated ceramic sheet, 5 is a conductor layer, and 6 is a ceramic sheet laminate.

  First, as shown to Fig.1 (a), the green sheet 2 and the ceramic sheet 3 are each produced. The green sheet 2 is a ceramic powder, an organic binder, a solvent (organic solvent, water, etc.) to the melted component, a predetermined amount of plasticizer and dispersant for adjusting the hardness and strength as required, to obtain a slurry, This can be obtained by molding on a support 1 such as PET film or paper by the doctor blade method, the lip coater method, the die coater method or the like. The thickness of the green sheet 2 is made so as to be thicker than the thickness of the conductor layer 5 in order to fill a step between the conductor layer 5 and the laminated ceramic sheet 4 integrated.

  The ceramic sheet 3 is produced so that the thickness of the ceramic sheet 3 becomes 5 to 50 μm by similarly forming and sintering the green sheet using a slurry that does not contain a melting component with respect to the slurry used for the green sheet 2. If the thickness is less than 5 μm, sufficient strength of the ceramic sheet 3 is not obtained, and the ceramic sheet 3 is cracked during handling. Further, when the thickness is greater than 50 μm, the ceramic sheet 3 is cracked when the through holes are formed in the multilayer ceramic sheet 4 by punching or laser processing for forming through conductors such as via-hole conductors and through-hole conductors. Sometimes.

Examples of the ceramic powder include glass ceramic powder (a mixture of glass powder and filler powder) in the case of a ceramic wiring board, and composite perovskite ceramic powder such as BaTiO ₃ system and PbTiO ₃ system in the case of a multilayer capacitor. And is appropriately selected according to the characteristics required for the electronic component.

Examples of the glass component of the glass ceramic powder include SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO system (however, , M represents Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same or different and Ca, Sr, Mg , Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same as above), SiO ₂ —B ₂ O ₃ —M ³ ₂ O system (where M ³ represents Li, Na or K, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ³ ₂ O system (where M ³ is the same as above) And Pb-based glass, Bi-based glass, and the like.

Further, as the filler powder of the glass ceramic powder, for example, a composite oxide of Al ₂ O ₃ , SiO ₂ , ZrO ₂ and an alkaline earth metal oxide, a composite oxide of TiO ₂ and an alkaline earth metal oxide, A ceramic powder such as a composite oxide (for example, spinel, mullite, cordierite) containing at least one selected from Al ₂ O ₃ and SiO ₂ can be used.

  The composition of the ceramic powder of the green sheet 2 and the ceramic sheet 3 is not necessarily the same, and the composition of the ceramic powder may be the same or different depending on the characteristics of the target electronic component. For example, by making the ceramic sheet laminate 6 so that the dielectric constant of the ceramic sheet 3 is increased and the conductor layer 5 is formed above and below, a capacitor can be built in the ceramic wiring board. Further, by increasing the strength of the ceramic sheet 4, it is possible to make it difficult to generate cracks that occur during processing such as lamination or to increase the strength of the ceramic wiring board. That is, since the ceramic sheet 2 has been fired in advance, the green sheet 2 and the ceramic sheet 3 are different in firing temperature and sintering shrinkage behavior, and have a layer with characteristics such as higher dielectric constant or higher strength that cannot be fired simultaneously. It becomes possible to make an inner layer. However, if the thermal expansion coefficients of the green sheet 2 and the ceramic sheet 3 are different, deformation and destruction due to thermal stress may occur. Therefore, the thermal expansion coefficient is preferably set to a close value.

  As the binder blended in the slurry for forming the green sheet 2 and the ceramic sheet 3, those conventionally used for ceramic green sheets can be used, for example, acrylic (acrylic acid, methacrylic acid or esters thereof). Homopolymers or copolymers, specifically acrylic ester copolymers, methacrylic ester copolymers, acrylic ester-methacrylic ester copolymers, etc.), polyvinyl butyral, polyvinyl alcohol , Acrylic-styrene-based, polypropylene carbonate-based, cellulose-based homopolymers or copolymers. In view of decomposition and volatility in the firing step, an acrylic binder is more preferable.

  The melting component contained in the green sheet 2 is in a molten state upon heating when the ceramic sheet laminate 6 is produced, and includes hydrocarbons, fatty acids, esters, fatty alcohols, polyhydric alcohols, and the like. Considering the solubility in a solvent when preparing the slurry, hydrocarbons, esters, fatty alcohols and polyhydric alcohols having a small molecular weight and polarity are preferred. Furthermore, in view of compatibility with the above-described acrylic binder, esters, fatty alcohols, and polyhydric alcohols are more preferable.

  Among the above-mentioned melting components, those having a melting point of 35 to 100 ° C. are preferable. This is because when a material having a melting point in this range is used, the green sheet 2 is not softened and deformed at room temperature, so that handling up to the laminating process is easy and heating in the process of manufacturing the ceramic sheet laminate 6 is performed. This is because organic components such as a binder and a plasticizer in the laminated ceramic sheet 4 that are sometimes integrated are not decomposed, and therefore delamination is not generated by the decomposition gas. Specific examples of the melting component having a melting point of 35 to 100 ° C. include hexadecanol, polyethylene glycol, polyglycerol, stearylamide, oleylamide, ethylene glycol monostearate, paraffin, stearic acid, and silicone.

  The content of the molten component contained in the green sheet 2 varies depending on the binder component to be used and its amount and the molten component to be used, but the green sheet 2 is softened in a state where the molten component is melted, and above and below ( What is necessary is just an amount which deforms following the shape of the ceramic sheet 3 of the laminated ceramic sheet 4 located in FIG. 1 (d) and the pattern of the conductor layer 5 formed thereon.

  Next, as shown in FIG. 1B, the green sheet 2 and the ceramic sheet 3 are laminated and heated, so that the molten component becomes a molten state and the green sheet 2 is softened and deformed, that is, the molten component. The laminated ceramic sheet 4 is produced by heating at a temperature of about the melting point. At this time, as shown in FIG. 1B, it is preferable in terms of ease of handling that the ceramic sheets 3 are laminated while the green sheet 2 is held on the support 1. Further, at this time, pressurization (0.1 to 1 MPa) is enough to hold the softened green sheet 2 in order to assist the deformation following the shape of the ceramic sheet 3 so that the multilayer ceramic sheet 4 is not displaced. ), The green sheet 2 is not deformed and the ceramic sheet 3 is not cracked, and the green sheet 2 and the ceramic sheet 3 are in close contact with each other, so that the laminated ceramic sheet 4 can be reliably integrated. .

In addition, the green sheet 2 and the ceramic sheet 3 are produced separately, and heated and bonded together to produce an integrated laminated ceramic sheet 4, which occurs when the green sheet 2 slurry is applied on the ceramic sheet 3. The ceramic sheet 3 is surely integrated without being cracked or warped by the stress generated at the interface between the slurry of the green sheet 2 and the ceramic sheet 3 when the slurry of the green sheet 2 is dried and contracted. The laminated ceramic sheet 4 can be produced.

  Next, as shown in FIG. 1C, the conductor layer 5 is formed on the ceramic sheet 3 of the multilayer ceramic sheet 4. As a method of forming the conductor layer 5 on the multilayer ceramic sheet 4, for example, a paste obtained by forming a powder of a conductor material (conductor paste) is printed by a screen printing method, a gravure printing method, a plating method, a vapor deposition method, or the like. A method of directly forming on a laminated ceramic sheet 4 to form a metal film having a predetermined pattern shape by a conductor, a thick conductor film formed in a predetermined pattern shape by printing, a metal foil processed to a predetermined pattern shape, a plating method or a vapor deposition method There is a method of transferring a metal film having a predetermined pattern shape formed on the laminated ceramic sheet 4. Examples of the conductive material include one or more of W, Mo, Mn, Au, Ag, Cu, Pd (palladium), Pt (platinum), etc., and in the case of two or more, mixing, alloy, coating Or any other form.

  In addition, before forming the conductor layer 5, if necessary, a through conductor such as a via-hole conductor or a through-hole conductor for connecting the conductor layers 5 between the upper and lower layers may be formed. These through conductors are formed by means such as embedding a paste of conductor material powder (conductor paste) by printing or press filling in through holes formed in the multilayer ceramic sheet 4 by punching or laser processing. .

  When an electronic component having a cavity is manufactured, a cavity-shaped through hole is formed in a part of the laminated green sheet 4 by punching with a mold or the like before the next step of producing the ceramic sheet laminate 6. The through hole may be formed before or after forming the conductor layer 5 depending on whether or not the conductor layer 5 is formed on the inner surface of the cavity.

  Next, as shown in FIG. 1 (d), the laminated ceramic sheets 4 that are aligned and stacked are at a temperature at which the molten component becomes molten and the green sheet 2 is softened and deformed, that is, the melting point of the molten component. The ceramic sheet laminated body 6 is produced by heating at the temperature. Further, when the ceramic sheet laminate 6 is produced, the plane direction of the multilayer ceramic sheet 4 is constrained by the ceramic sheet 3, and therefore the green sheet 2 of the multilayer ceramic sheet 4 is not expanded or contracted by pressurization. It is possible to suppress the deformation of the ceramic sheet laminate 6 before being bonded. As a result, variation in dimensional accuracy due to deformation during processing of the electronic component obtained by firing the ceramic sheet laminate 6 can be reduced. At this time, the laminated multilayer ceramic sheets 4 are not displaced from each other, and the softened green sheet 2 is assisted to deform following the pattern shape of the ceramic sheet 3 and the conductor layer 5 formed thereon. When pressurization (0.1 to 1 MPa) is performed so as to hold down, the problem of cracking the ceramic sheet 3 does not occur more accurately, and reliable lamination is possible.

  In the step of producing the ceramic sheet laminate 6, the green sheet 2 contains a melting component that melts when heated, and therefore when the laminated ceramic sheet 4 with the conductor layer 5 formed is laminated and heated, In order to soften, the green sheet 2 deforms following the shape of the ceramic sheet 3 of the laminated ceramic sheet 4 positioned above and below it and the conductor layer 5 formed thereon. As a result, the laminated ceramic sheets 4 are brought into close contact with each other without generating voids around the conductor layer 5 and between the conductor layers 5, and the electronic component obtained by firing the ceramic sheet laminate 6 has no delamination. Become.

  Further, the multilayer ceramic sheet 4 constituting the ceramic sheet laminate 6 is contracted in one direction only in the thickness direction during sintering because the green sheet 2 is fixed in the plane direction by the ceramic sheet 3. Thereby, since the difference in shrinkage ratio of each part of the ceramic sheet laminate 6 and the variation of the original shrinkage characteristic of the green sheet 2 do not appear in the plane direction, a highly accurate electronic component can be manufactured.

  For example, when the green sheet 2 that does not contain a melting component that melts when heated is used, the dimensional accuracy of the ceramic sheet laminate 6 and the electronic component is about ± 0.5%, but contains the melting component of the present invention. When the green sheet 2 is used, the dimensional accuracy of the ceramic sheet laminate 6 and the electronic component is about ± 0.2%, and it has been experimentally found that the dimensional accuracy is significantly improved.

  Further, when an electronic component having a cavity is manufactured, the multilayer ceramic sheet 4 is not deformed by the ceramic sheet 3 of the multilayer ceramic sheet 4, so that the cavity bottom is warped even when the cavity peripheral portion and the cavity bottom are pressed. It is possible to obtain an electronic component that does not occur and can accurately and reliably mount an electronic element on the bottom of the cavity. Moreover, since the cavity bottom is also restrained by the ceramic sheet 3 of the multilayer ceramic sheet 4, it can be restrained without generating cracks due to distortion during firing, and the resulting electronic component has high dimensional accuracy.

  Only the ceramic sheet 3 may be used as the ceramic sheet positioned at the bottom of FIG. In the case of an electronic component in which the conductor layer 5 is not exposed on the surface, such as a multilayer capacitor, the multilayer ceramic sheet 4 in which the conductor layer 5 is not formed on the multilayer ceramic sheet 4 positioned at the top of FIG. In the case of an electronic component in which the conductor layer 5 is exposed on both surfaces, such as a multilayer ceramic wiring board, the one in which the conductor layer 5 is formed on both surfaces of the lowermost ceramic sheet 3 may be used.

  Finally, the ceramic sheet laminate 6 is fired to produce the electronic component of the present invention. The firing step consists of removing organic components and sintering the ceramic powder. Removal of the organic component is performed by heating the ceramic sheet laminate 6 in a temperature range of 100 to 800 ° C. to decompose and volatilize the organic component. The sintering temperature varies depending on the ceramic composition, and is performed within a range of about 800 to 1600 ° C. The firing atmosphere varies depending on the ceramic powder and the conductor material, and is performed in the air, in a reducing atmosphere, in a non-oxidizing atmosphere or the like, and may contain water vapor or the like in order to effectively remove organic components.

  The electronic component after firing is exposed on the surface of the conductor layer 5 exposed on the surface thereof, for preventing corrosion of the conductor layer 5, or for connecting to an external circuit board such as solder or metal wire or an electronic component (solder or the like). In this case, Ni or Au is preferably plated.

  The electronic component manufactured by the method as described above has high delamination and high dimensional accuracy, and therefore has excellent electrical characteristics and high airtightness required as an electronic component.

  In addition, this invention is not limited to the said embodiment, It does not interfere at all within the range which does not deviate from the summary of this invention.

(A)-(d) is sectional drawing for every process which shows an example of embodiment of the manufacturing method of the electronic component of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support body 2 ... Ceramic green sheet 3 ... Ceramic sheet 4 ... Multilayer ceramic sheet 5 ... Conductive layer 6 ... Ceramic sheet laminated body

Claims (2)

A step of producing a ceramic green sheet, a step of producing a ceramic sheet by firing another ceramic green sheet thinner than the ceramic green sheet, and laminating and heating the ceramic green sheet and the ceramic sheet Laminating a ceramic sheet by manufacturing a unitary laminated ceramic sheet, forming a conductor layer on the multilayer ceramic sheet, and laminating and heating a plurality of the multilayer ceramic sheets on which the conductor layer is formed A step of producing a body and a step of firing the ceramic sheet laminate, and the ceramic green sheet is heated when producing the multilayer ceramic sheet and when producing the ceramic sheet laminate. Contains a melting component that becomes a molten state Method of manufacturing an electronic component, characterized in that there. The method for manufacturing an electronic component according to claim 1, wherein the melting component has a melting point of 35 to 100 ° C.

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