JP2006066594A - Heatsink device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To release heat generated by a semiconductor which is arranged on a closely packed substrate by a small device, at low cost and efficiently. <P>SOLUTION: The heatsink device is provided with the substrate 10 on which the semiconductor 1 is mounted and in which a heat radiation path (via holes 11 and 14 and an internal copper foil pattern 12) is formed for leading heat conducted from the backside of the semiconductor 1 to lead-out positions on the periphery of the semiconductor 1, a heat dissipation fin 25 which radiates heat conducted from the surface of the semiconductor 1, and a fin fixing metal fixture 20 which is formed of a thermally conductive material on which the heat dissipation fin 25 is mounted and which is provided with a lead part 21 connected with the lead out positions (foot print parts 13) of the heat dissipation path. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat radiating device that radiates heat generated by a semiconductor such as an LSI through a substrate, and more particularly to a heat radiating device and an electronic device that can efficiently radiate heat generated from the front and back of the semiconductor.

  2. Description of the Related Art Conventionally, semiconductors such as LSI mounted on a substrate have a high integration density, and there is an increasing demand for means that can efficiently dissipate heat generated by the semiconductor.

  FIG. 16 is a diagram showing a conventional heat dissipation structure. The heat generated by the semiconductor 100 such as LSI is radiated through the radiation fins 102 attached to the upper surface of the semiconductor 100 and the semiconductor 103 leads (ball bumps 101 in the BGA package). A technique for diffusing into the via 104 and the internal copper foil pattern 105 is generally used.

  Specifically, a heat sink for heat dissipation is built in the printed circuit board, the heat sink is formed in a hollow rectangular shape, and water or the like is poured into the hollow portion to cool it (for example, see Patent Document 1 below) or to a semiconductor. Radiating fins (see, for example, the following Patent Document 2) for improving the heat diffusivity of the IC chip by improving the adhesion of the semiconductor device and preventing the falling without applying stress to the upper surface of the semiconductor device and ensuring the heat radiating effect. Using a chip cover that is covered with an integrated chip cover and that forms a special concave step on the edge of the adapter board, a structure that improves packing strength, integrity, and protection (for example, see Patent Document 3 below). Etc.

JP 2002-270743 A Japanese Patent Application Laid-Open No. 6-196883 Japanese Patent Laid-Open No. 9-23076

  However, in the technique described in Patent Document 1, the heat generated in the LSI chip is transmitted to the heat radiating fins by the board, vias, and conductive metal, and the board thickness is increased, corresponding to the component mounting restrictions. (For example, it is necessary to reduce the height of the component) or the internal structure of the substrate becomes complicated, resulting in an increase in the number of steps for manufacturing the substrate and the manufacturing cost. In addition, when the number of LSI (BGA) pins exceeds 1000 pins, and high-speed and wiring entry / exit increases, installing a heat sink inside the board at a position directly under the LSI places restrictions on the lead-out wiring and vias, Design becomes difficult.

  In the technique described in Patent Document 2, it is necessary to manufacture the metal fin structure of the heat radiating fins very precisely, and it is a special (not general purpose) structure in accordance with the heat radiating body. In addition, since the fixing structure of the radiating fin is also sandwiched, the contact portion may be damaged when vibration or the like occurs.

  In addition, the technique described in Patent Document 3 has certain advantages in adhesion improvement, IC protection, and thermal conductivity, but the IC chip and the heat sink with a cover function are integrated and can be touched by human hands. There is a risk that the cover may come off easily or with the IC.

  In particular, in recent years, semiconductor packages such as LSIs have been diversified, and the number of pins derived from these packages has been increased, and the size has been reduced. Since the heat radiation fins and the like joined to the semiconductor thus miniaturized have a small contact area, efficient heat radiation cannot be performed even if the heat radiation fins that are larger than necessary are used. In addition, the number of high heat generating components mounted on one board is increasing, and the distance between the components is also narrowed. Under such circumstances, the heat dissipation effect cannot be improved by simply radiating heat using only the radiating fins. Note that, in a state where high-density mounting of semiconductors on such a substrate is performed, it is not preferable to use a large radiating fin itself because it limits the area of other mounted components. In addition, in order to improve the heat radiation effect, when the heat radiation fin is attached to the semiconductor by bonding or the like, problems such as an increase in the number of man-hours and the inability to be removed after bonding occur.

  An object of the present invention is to provide a heat dissipation device and an electronic apparatus that can efficiently dissipate heat generated from a heating element (for example, a semiconductor) disposed on a substrate.

  In order to solve the above-described problems and achieve the object, the heat dissipating device according to the present invention includes a heating element, and heat conducted from the back surface of the heating element to the outside of the mounting position of the heating element. A substrate on which a heat radiation path to be led out is formed, a heat radiation fin that radiates heat conducted from the surface of the heating element, a heat conductive material, the heat radiation fin is attached, and the heat radiation path And a fin fixing member having a connection portion connected to the outer side portion.

  According to this invention, the heat from the surface of the heating element can be dissipated from the radiation fin. Further, the heat from the back surface of the heat generating element can be conducted to the heat radiating fins via the fin fixing bracket connected to the heat radiating path led out from the inside of the substrate to the outer side of the mounting position of the heat generating element. As a result, heat generated from the front and back surfaces of the heating element can be dissipated through different heat dissipation paths, and the efficiency of heat dissipation of the heating element can be improved.

  According to the heat radiating device and the electronic apparatus according to the present invention, heat on the upper surface side of the heating element can be conducted to the heat radiating fin, and heat from the lower surface can also be conducted to the heat radiating fin. Can be increased. For example, when semiconductors are mounted at high density as the heating element, heat generated from each semiconductor can be efficiently dissipated.

  Exemplary embodiments of a heat dissipation device and an electronic device according to the present invention will be described below in detail with reference to the accompanying drawings.

(Embodiment)
FIG. 1 is a side view showing a configuration of a heat dissipation device according to an embodiment of the present invention. The illustrated semiconductor 1 is a BGA (Ball Grid Array) type high heat generation type LSI. In this semiconductor 1, ball bumps 2 are arranged on the lower surface as input / output pads.

  The substrate 10 is provided with heat dissipation vias 11 in the thickness direction of the substrate 10 corresponding to the positions of the ball bumps 2 of the semiconductor 1. An internal copper foil pattern 12 is formed in the substrate 10 in the length direction, and the internal copper foil pattern 12 is connected to the via 11. A plurality of vias 11 and internal copper foil patterns 12 are provided in layers inside the substrate 10.

  A plurality of footprints 13 are formed on the surface of the substrate 10 at positions where the semiconductor 1 is disposed. The footprint 13 is also formed on the outer side of the bonding position of the semiconductor 1. A via 14 for conducting heat is formed immediately below the footprint 13. An internal copper foil pattern 12 is connected to the via 14.

  A lead portion 21 of the fin fixing bracket 20 is joined to the footprint portion 13 on the outer side of the substrate 10 by surface mounting. The fin fixing metal 20 is formed by bending a metal material having good thermal conductivity so as to have a substantially trapezoidal shape when viewed from the side. A heat radiating fin 25 having a plurality of fins 25 a formed on the upper surface is attached to the upper surface of the fin fixing bracket 20. The heat radiating fins 25 are fixed to the upper surface of the fin fixing bracket (fin fixing member) 20 using screws 26.

  A heat conductive mat 30 is interposed between the upper surface of the semiconductor 1 and the lower surface of the radiation fin 25. The heat conductive mat 30 is made of a shrinkable material such as a thermal sheet that has good heat conductivity, insulation, and the like. A recess 25 b having a predetermined depth for positioning and holding the heat conductive mat 30 is formed on the lower surface of the heat radiating fin 25 in correspondence with the outer diameter of the heat conductive mat 30.

  With the above configuration, a first heat radiation path extending from the heat conductive mat 30 to the heat radiation fin 25 is formed on the upper surface (front surface) side of the semiconductor 1. Further, on the lower surface (rear surface) side of the semiconductor 1, heat conduction is performed through the ball bump 2 to the footprint portion 13 to the via 11 to the internal copper foil pattern 12 to the via 14 to the footprint portion 13 on the outer side of the semiconductor 1. Two heat dissipation paths are formed. On the second heat radiation path, each part of the via 11, the internal copper foil pattern 12, and the via 14 radiates the conducted heat inside the substrate 10. Further, the second heat radiation path thereafter extends from the footprint portion 13 to the lead portion 21 to the fin fixing bracket 20 to the heat radiation fin 25 on the outer side of the semiconductor 1. Thereby, the heat from the lower surface of the semiconductor 1 can also be radiated from the radiation fins 25. The footprint 13 on the outer side of the semiconductor 1 located at the end of the second heat dissipation path is not limited to the formation of the wiring pattern, and is thermally connected to the connection part (lead part 21) of the fin fixing bracket 20 (Other configuration examples will be described later).

  FIG. 2 is a plan view showing the fin fixing bracket. The fin fixing bracket 20 has an opening 20a through which the heat conduction mat 30 can pass through the inside thereof at a central portion that is larger than the outer diameter of the heat conduction mat 30. Thereby, the heat conductive mat 30 can be mounted from the upper part of the opening 20a of the fin fixing bracket 20. Screw holes 20b are formed at four locations around the opening 20a, and screws 26 for attaching the radiation fins 25 are fitted therein. The screw hole 20 b is a locking hole for attaching the heat radiation fin 25. In the example shown in FIG. 2, two lead portions 21 are provided at four corners, two in total. The number and width of the lead portions 21 are determined by conditions having a holding force and a peel strength that can withstand the weight of the heat dissipating fins 25 and the screws 26 that fasten the fins.

  FIGS. 3A to 3D are diagrams illustrating a manufacturing process of the heat dissipation device. The manufacturing process shown in these drawings is performed by fully automatic surface mounting using a manufacturing reflow line.

  First, as shown in FIG. 3A, the semiconductor 1 is mounted on the substrate 10. The semiconductor 1 is mounted on the substrate 10 with its upper surface being sucked by a suction nozzle of an automatic mounter (not shown).

  Next, as shown in FIG. 3-2, the fin fixing metal 20 is adsorbed by an automatic mounter and mounted on the semiconductor 1. At this time, the fin fixing bracket 20 can be sucked and held by an automatic mounter in a state where a mounting suction plate to be described later is attached. At this time, the lead portion 21 is mounted so as to be positioned in the footprint portion 13 portion of the outer side portion of the semiconductor 1.

  Next, as shown in FIG. 3C, hot air is blown from the upper surface of the semiconductor 1 and the fin fixing metal 20 and the lower surface of the substrate 10 by reflow solder mounting. Thereby, the ball bumps 2 of the semiconductor 1 are soldered to the substrate 10. Further, the lead portion 21 of the fin fixture 20 is soldered to the footprint portion 13 on the substrate 10.

  Next, as shown in FIG. 3-4, the heat conductive mat 30 is inserted through the opening 20 a (see FIG. 2) from the top of the fin fixing bracket 20, and the lower surface of the heat conductive mat 30 is the semiconductor 1. Install so that it touches the top surface. Thereafter, the heat radiating fins 25 are attached to the upper surface of the fin fixing bracket 20 and fixed with screws 26. At this time, the heat conductive mat 30 is provided in a contracted state so as to be in close contact with the upper surface of the semiconductor 1 and the lower surface of the heat radiation fin 25. Further, even if the screws 26 are fixed with screws, the heat conduction mat 30 has a certain degree of contraction, so that excessive force is not exerted on the ball bumps 2 of the BGA. Further, the provision of the heat conductive mat 30 can improve the adhesion between the radiation fins 25 and the semiconductor 1. When the heat conductive mat 30 having the function of a radio wave absorber is used, it is possible to absorb jamming radio waves radiated from the semiconductor 1 and reduce external radiation of the jamming radio waves.

  FIG. 4A is a plan view showing the mounting suction plate, and FIG. 4B is a side view showing the mounting suction plate. In these drawings, the mounting suction plate 40 is shown attached to the fin fixing bracket 20. As described above, the mounting suction plate 40 is used to suck the fin fixing bracket 20 when the fin fixing bracket 20 is mounted on the substrate 10 using an automatic mounter. The mounting suction plate 40 is made of a flexible resin material.

  The mounting suction plate 40 is formed in a flat plate shape so as to cover the opening 20a of the fin fixing bracket 20, and locking pieces 41 are bent downward at the four corner portions, respectively. The locking piece 41 has a claw 41a at the tip bent toward the outside. The locking piece 41 can be inserted into the screw hole 20b of the fin fixing bracket 20 and the inserted state can be maintained by the claw 41a at the tip. With the mounting suction plate 40 attached to the fin fixing bracket 20, the upper surface of the mounting suction plate 40 is located at the center of the fin fixing bracket 20. The suction nozzle of the automatic mounter can suck this center position (location a in the figure), and can stably mount the fin fixing bracket 20 at the position where the substrate 10 is disposed. The mounting suction plate 40 is removed after the fin fixing bracket 20 is mounted on the substrate 10. At the time of this removal, as shown in FIG. 4B, by lifting the mounting suction plate 40 while bending the removal side piece 42 downward, the claw 41a at the tip of the locking piece 41 with respect to the screw hole 20b is removed. The lock can be released and removed.

  Next, FIGS. 5A to 5D are diagrams illustrating another manufacturing process of the heat dissipation device. These figures show a semi-automatic manufacturing process. First, as shown in FIG. 5A, the semiconductor 1 is mounted on the substrate 10 by an automatic mounter. Next, as shown in FIG. 5B, reflow solder mounting is performed on the semiconductor 1. Thereafter, as shown in FIG. 5-3, the fin fixing bracket 20 is mounted. The fin fixing bracket 20 can be fixed to the substrate 10 by soldering using a soldering iron 28 as shown. Thereafter, the heat conductive mat 30 and the heat radiating fins 25 shown in FIG. 5-4 are attached.

  FIG. 6A is a plan view illustrating another example of the mounting suction plate, and FIG. 6B is a side view illustrating another example of the mounting suction plate. In these drawings, the mounting suction plate 40 is shown attached to the fin fixing bracket 20. The mounting suction plate 40 is formed in a flat plate shape so as to cover the opening 20a of the fin fixing bracket 20, and locking pieces 41 are bent downward on both sides. The mounting suction plate 40 is made of a flexible resin material. Further, the vertical dimension of the suction mounting suction plate 40 (the length of the locking piece 41) is substantially matched to the vertical distance between the top and bottom of the lead portion 21, and when the mounting suction plate 40 is attached to the fin fixing bracket 20. The shape is such that vertical displacement does not occur.

  The locking piece 41 has a claw 41a at the tip bent toward the outside. The locking piece 41 can be locked to the side 22 portion of the fin fixing bracket 20. With the mounting suction plate 40 attached to the fin fixing bracket 20, the upper surface of the mounting suction plate 40 is located at the center of the fin fixing bracket 20. The suction nozzle of the automatic mounter can suck this center position (location a in the figure), and can stably mount the fin fixing bracket 20 on the substrate 10. The mounting suction plate 40 is locked to the side 22 by lifting the mounting suction plate 40 upward while pulling the claw 41a at the tip after mounting the fin fixing bracket 20 on the substrate 10. The locking of the piece 41 can be released and removed.

  FIG. 7 is a side view showing another example of the fin fixing bracket. When the plate thickness of the fin fixing bracket 20 is thin, the groove depth of the screw hole 20b cannot be increased. In this case, as shown in the drawing, it is possible to use a screw hole 20b provided with a screw tap spacer 20c having a predetermined depth.

  FIG. 8A is a plan view illustrating another example of the fin fixing bracket, and FIG. 8B is a side view illustrating another example of the fin fixing bracket. The same components as those described above are denoted by the same reference numerals. In this configuration, side walls 20d are bent at four sides of the opening 20a. By providing this side wall 20d, the side part of the heat conductive mat 30 can be supported, and position shift of the heat conductive mat 30 can be prevented.

  FIG. 9A is a plan view illustrating another example of the fin fixing bracket, and FIG. 9B is a side view illustrating another example of the fin fixing bracket. In this configuration, the number of screw holes 20b (spacers 20c with screw taps) is two in the center, the plate width of the four sides around the opening 20a is thin, and the mounting area of the fin fixing bracket 20 on the substrate 10 is shown in FIG. It is made smaller and lighter than the fin fixing bracket 20 shown in FIG. This makes it possible to increase the mounting density by utilizing an unmounted area necessary for repair around the BGA.

  FIG. 10A is a plan view illustrating another example of the fin fixing bracket, and FIG. 10B is a side view illustrating another example of the fin fixing bracket. This configuration includes the side wall 20d shown in FIG.

  FIG. 11A is a side view illustrating another example of the fin fixing bracket. The fin fixing metal 20 is not provided with a lead part 21 but is formed with a tip part 21 a for insertion into the substrate 10. FIG. 11B is an enlarged view of the fin fixing bracket. As shown in this figure, the tip 21a of the fin fixing bracket 20 can be soldered and fixed after being inserted into the insertion hole 10a formed in the substrate 10.

  FIG. 12A is a side view illustrating another example of the fin fixing bracket. FIG. 12-2 is an enlarged view of the fin fixing bracket. As shown in these drawings, a nut 35b is previously fixed to the upper portion of the insertion port 21b of the lead portion 21 of the fin fixing bracket 20 by welding or the like. Then, the bolt 35 a is inserted into the bolt insertion port 10 b provided in the substrate 10. Then, the bolt 35a is fastened to the nut 35b. Thereby, the fin fixing bracket 20 can be attached to the substrate 10. According to this configuration, the fin fixing bracket 20 can be removed from the substrate 10 only by releasing the tightening of the bolt 35a and the nut 35b, and can be easily attached and detached multiple times.

  FIG. 13-1 is a plan view showing a heat radiating fin, FIG. 13-2 is a back view showing the heat radiating fin, and FIG. 13-3 is a side view showing the heat radiating fin. A plurality of vertically long fins 25 a are arranged on the upper surface of the heat radiating fins 25 so as to protrude. Further, a plurality of screw holes 25 c are formed penetratingly at positions corresponding to the screw holes 20 b of the fin fixing metal 20. A recess 25 b having a predetermined depth for positioning and holding the heat conductive mat 30 corresponding to the outer diameter of the heat conductive mat 30 is formed on the back surface of the radiation fin 25.

  14A is a perspective view illustrating an electronic device on which a substrate on which a semiconductor is mounted is mounted, and FIG. 14B is a side cross-sectional view illustrating the electronic device on which a substrate on which a semiconductor is mounted. A casing 50 of this electronic device is provided with a plurality of slots 50a (15 in the illustrated example) on the front surface, and the substrate 10 is mounted in each slot 50a. On the substrate 10, the rear connector 10 d is connected to a board 53 inside the housing 50, and power and signals for the substrate 10 are input and output.

  An opening 50b for taking in an air flow for cooling the semiconductor into the housing 50 is formed in the lower portion of the slot 50a, and a discharge port (see FIG. 14-2) 50c for discharging the air flow is formed in the upper portion of the housing 50. Is formed. A plurality of fans 51 are provided at the lower part of the housing 50. The fan 51 forms an air flow (C in the figure) for sending air taken in from the opening 50b from the lower part of the substrate 10 to the upper part. The air flow formed by the fan 51 passes through the semiconductor 1 mounted on the substrate 10 and the radiating fin 25 portion mounted on the semiconductor 1, and the heat dissipated from the radiating fin 25 is discharged from the discharge port 50c. .

  By the way, the arrangement | positioning position of the semiconductor 1 mounted on the board | substrate 10 may adjoin, or the some semiconductor 1 may be arrange | positioned along the flow of an air flow. In such a case, the semiconductor 1 located rearward when viewed from the air flow direction (C) cannot receive the heat radiated from the front semiconductor 1 to improve the heat dissipation effect.

  15A is a plan view illustrating another example of the fin fixing bracket, and FIG. 15B is a side view illustrating another example of the fin fixing bracket. As shown in the figure, the fin fixing bracket 20 is provided with a wind direction adjusting portion 23 on one of the four sides. The wind direction adjusting portion 23 protrudes in a triangular shape when seen in a plan view, and is formed by bending an inclined piece 23a having a predetermined height at the protruding portion.

  FIG. 15C is a diagram illustrating a change state of the wind direction by the fin fixing bracket illustrated in FIG. As shown in the figure, it is assumed that the semiconductors 1 are arranged close to each other along the air flow (C). In such an arrangement state, the fin fixing bracket 20 provided with the wind direction adjusting portion 23 is arranged on the semiconductor 1 side located in front of the air flow direction (C). At this time, the arrangement of the wind direction adjusting unit 23 is set so that the air flow direction (C) is deflected from the semiconductor 1 direction located behind. Thereby, since the air flow containing the heat dissipated from the semiconductor 1 in front of the air flow direction (C) does not pass through the semiconductor 1 located behind, the heat radiation of the semiconductor 1 located behind is performed. Will not be disturbed.

  In the above configuration, the wind direction adjusting portion 23 is provided in the fin fixing bracket 20, but the heat radiating fin 25 may be configured by providing the same configuration as the wind direction adjusting portion 23.

  According to the configuration of the embodiment described above, the fin fixing bracket 20 can be easily mounted on the surface by an automatic mounter by mounting the suction plate 40 for mounting. Then, the heat generated on the upper surface side of the semiconductor 1 can be radiated from the radiation fins 25 through the heat conduction mat 30. The heat generated on the lower surface side of the semiconductor 1 is conducted through the ball bumps 2 to the vias 11 to the internal copper foil pattern 12 to the vias 14 to the footprints 13. On this heat dissipation path, each part of the via 11, the internal copper foil pattern 12, and the via 14 radiates the conducted heat inside the substrate 10. Further, after this, a heat radiation path from the footprint 13 to the lead 21 to the fin fixing metal 20 to the heat radiation fin 25 is formed. As a result, heat from the lower surface of the semiconductor 1 can be radiated from the radiation fin 25 by conducting heat to the radiation fin 25 via the footprint 13. Thereby, the heat generated from the semiconductor 1 can be efficiently dissipated. Moreover, the radiation fin 25 is a structure which can be screwed to the fin fixing bracket 20 with the heat conductive mat 30 interposed therebetween, and can be easily attached and replaced.

  In addition, although the attachment of the radiation fin 25 with respect to the fin fixing metal 20 was performed using the screw 26, it is not limited to this, and may be performed using a pin or other fixture that allows the radiation fin 25 to be easily attached and detached. .

(Supplementary Note 1) A substrate on which a heating element is mounted, and a heat dissipation path for leading heat conducted from the back surface of the heating element to the outside of the mounting position of the heating element is formed inside,
A radiating fin for radiating heat conducted from the surface of the heating element;
A fin fixing member that is formed of a thermally conductive material, is attached with the radiating fin, and has a connection portion connected to the outer portion of the radiating path;
A heat dissipation device comprising:

(Appendix 2) The heat dissipation path formed in the substrate includes a via formed to extend in the thickness direction of the substrate;
The heat radiating device according to claim 1, comprising an internal copper foil pattern connected to the via and formed along the surface of the substrate.

(Additional remark 3) The said fin fixing member is provided with the opening part which has a diameter corresponding to the outer diameter of the said heat generating body,
The supplementary note 1 or 2, wherein a heat conductive mat that has thermal conductivity and can be contracted is interposed between the surface of the heating element and the radiation fin through the opening. Heat dissipation device.

(Additional remark 4) The said fin fixing member has a side wall for positioning the side part of the said heat conductive mat in the said opening part, The heat radiating device of Additional remark 3 characterized by the above-mentioned.

(Additional remark 5) The said fin fixing member has a locking hole for fixing the said thermal radiation fin, The heat radiating device as described in any one of additional marks 1-4 characterized by the above-mentioned.

(Additional remark 6) It is detachable with respect to the said fin fixing member, and when mounting the said fin fixing member on the said board | substrate, the opening part of the said fin fixing member is covered, and the adsorption | suction location for mounting is formed The heat radiating device according to any one of appendices 1 to 5, further comprising an adsorption plate.

(Additional remark 7) The said board | substrate is provided with the pattern formed in the derivation | leading-out position of the said thermal radiation path | route,
The heat radiating device according to any one of appendices 1 to 6, wherein the fin fixing member includes a lead portion joined to the pattern.

(Supplementary note 8) The heat dissipation device according to supplementary note 7, wherein the lead portion of the fin fixing member is soldered to the pattern.

(Additional remark 9) The heat dissipation apparatus as described in any one of additional remarks 1-6 provided with the front-end | tip part inserted in the said fin fixing member in the derivation | leading-out position of the said thermal radiation path | route, and joining.

(Additional remark 10) The said radiation fin has a recessed part of the diameter corresponding to the outer diameter of the said heat conductive mat in the location which the said heat conductive mat joins, The any one of Additional marks 1-9 characterized by the above-mentioned. Heat dissipation device.

(Additional remark 11) The said fin fixing member was equipped with the wind direction adjustment part which changes the flow of the air flow for cooling, The heat radiating device as described in any one of additional marks 1-10 characterized by the above-mentioned.

(Additional remark 12) The electronic device provided with the thermal radiation apparatus as described in any one of the said additional remarks 1-11.

  As described above, the heat dissipation device according to the present invention can efficiently dissipate heat generated by a heating element such as a semiconductor, and is particularly suitable for a board mounted with high density and an electronic apparatus including the board. ing.

It is a side view which shows the structure of the thermal radiation apparatus by embodiment of this invention. It is a top view which shows a fin fixing metal fitting. It is a figure explaining the manufacturing process of a thermal radiation apparatus (the 1). It is a figure explaining the manufacturing process of a thermal radiation apparatus (the 2). It is a figure explaining the manufacturing process of a thermal radiation apparatus (the 3). It is a figure explaining the manufacturing process of a thermal radiation apparatus (the 4). It is a top view which shows the suction plate for mounting. It is a side view which shows the suction plate for mounting. It is a figure explaining the other manufacturing process of a thermal radiation apparatus (the 1). It is a figure explaining the other manufacturing process of a thermal radiation apparatus (the 2). It is a figure explaining the other manufacturing process of a thermal radiation apparatus (the 3). It is a figure explaining the other manufacturing process of a thermal radiation apparatus (the 4). It is a top view which shows the other example of the adsorption | suction board for mounting. It is a side view which shows the other example of the adsorption | suction board for mounting. It is a side view which shows the other example of a fin fixing metal fitting. It is a top view which shows the other example of a fin fixing metal fitting. It is a side view which shows the other example of a fin fixing metal fitting. It is a top view which shows the other example of a fin fixing metal fitting. It is a side view which shows the other example of a fin fixing metal fitting. It is a top view which shows the other example of a fin fixing metal fitting. It is a side view which shows the other example of a fin fixing metal fitting. It is a side view which shows the other example of a fin fixing metal fitting. It is an enlarged view of a fin fixing metal fitting. It is a side view which shows the other example of a fin fixing metal fitting. It is an enlarged view of a fin fixing metal fitting. It is a top view which shows a radiation fin. It is a rear view which shows a thermal radiation fin. It is a side view which shows a radiation fin. It is a perspective view which shows the electronic device with which the board | substrate which mounts a semiconductor is mounted | worn. It is a sectional side view which shows the electronic device with which the board | substrate which mounts a semiconductor is mounted | worn. It is a top view which shows the other example of a fin fixing metal fitting. It is a side view which shows the other example of a fin fixing metal fitting. It is a figure which shows the change state of the wind direction by a fin fixing metal fitting. It is a figure which shows the conventional heat dissipation structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor 2 Ball bump 10 Board | substrates 11 and 14 Via 12 Internal copper foil pattern 13 Footprint part 20 Fin fixing bracket 20a Opening part 20b Screw hole 21 Lead part 23 Wind direction adjustment part 25 Radiation fin 25a Fin 26 Screw 30 Thermal conduction mat 40 Mounting Adsorption plate

Claims (5)

A substrate on which a heat generating body is mounted, and a heat dissipation path that leads heat conducted from the back surface of the heat generating body to the outside of the mounting position of the heat generating body is formed inside,
A radiating fin for radiating heat conducted from the surface of the heating element;
A fin fixing member that is formed of a thermally conductive material, is attached with the radiating fin, and has a connection portion connected to the outer portion of the radiating path;
A heat dissipation device comprising: The heat dissipation path formed in the substrate includes a via formed to extend in the thickness direction of the substrate;
The heat dissipation device according to claim 1, comprising an internal copper foil pattern connected to the via and formed along the surface of the substrate. The fin fixing member includes an opening having a diameter corresponding to the outer diameter of the heating element,
The heat conductive mat which has thermal conductivity and can be shrunk is interposed between the surface of the heating element and the heat radiating fin through the opening. The heat dissipation device described.   A mounting suction plate that is detachable from the fin fixing member and covers the opening of the fin fixing member and forms a mounting suction portion when the fin fixing member is mounted on the substrate. The heat radiating device according to any one of claims 1 to 3, wherein An electronic apparatus comprising the heat dissipation device according to any one of claims 1 to 4.

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