JP2006064223A - Cold/hot heat radiating panel and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cold/hot heat radiating panel having high surface cold/hot heat radiating efficiency, effectively saving energy, and being inexpensively and quickly manufactured. <P>SOLUTION: This cold/hot heat radiating panel comprises a base material 11, a groove 12 formed on a surface of the base material 11, a cold/hot heat radiating tube 13 mounted in the groove 12 for circulating a heat medium, and a surface material 14 placed on the surface of the base material 11. A filling material 10 is filled in a void part at least at a surface material side, in the groove 12. The filling material is attached to a face at a base material side, of the surface material 14, and the surface material 14 is brought into contact with a surface of the base material 11 and pressed to fill the filling material 10 to the void part of at least the surface material side to manufacture the cold/hot heat radiating panel. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cooling heat panel installed on a floor, a wall, a ceiling, and the like for cooling or heating a room such as a house and a method for manufacturing the same. Specifically, when installed on the floor, etc., a cooling heat panel that can efficiently save energy by efficiently cooling to the indoor side and suppressing the cooling heat to the outside as much as possible, and a method for efficiently manufacturing this cooling heat panel About.

  Floor heating is widely used as a facility for heating the interior of a house because of its comfort and cost performance. Of these, hot water type floor heating, in which hot water heated by a heat source machine is circulated between a heat radiating panel such as a hot water mat installed under the floor, is often used. Recently, not only the incorporation into a new house, but also a heat radiation panel that can be easily heated by installing it on an existing floor when renovating an existing house has been proposed. In addition, a cooling system has been proposed in which such a panel is laid on a wall or ceiling, and cold water is allowed to flow instead of hot water.

  4 (a) and 4 (b) (FIG. 4 (a) is a cross-sectional view, and FIG. 4 (b) is an enlarged view of a groove portion in FIG. 4 (a)). Further, a groove 12 is formed on the surface of the base material 11 such as polystyrene foam or plywood, and a cooling heat pipe 13 through which hot water or cold water as a heat medium flows is provided in the groove 12. There is one in which the material 14 is attached with an adhesive material 15. As the cooling heat pipe 13, a resin pipe such as a crosslinked polyethylene pipe or a metal pipe such as a copper pipe is used. The surface material 14 on the surface of the substrate 11 serves to fix the cool heat heat tube 13 and to homogenize the cool heat from the cool heat heat tube 13 within the panel. An aluminum foil or the like is used as the surface material 14.

  Taking floor heating as an example, from the viewpoint of energy efficiency, it is desired that the cool heat panel is radiated only in the upper surface direction, which is the indoor side. However, in fact, since the cooling heat panel is a thin planar structure, heat is radiated not only to the upper surface of the panel but also to the lower surface, which is under the floor. Cause. That is, the heat-cooling heat tube 13 and the surface material 14 are only in linear contact with each other in the length direction at the top of the heat-cooling heat tube 13 and the heat conduction path from the heat-cooling heat tube 13 to the surface material 14 is narrow. In addition, the conventional cooling heat panel as shown in FIG. 4 cannot obtain a sufficient cooling heat efficiency toward the surface.

  From the viewpoint of energy saving, it is preferable to increase the heat dissipation efficiency to the upper surface as much as possible. Among the Better Living Foundation excellent housing part certification standards, even in “Warming / Cooling System / Floor Heating Unit BLS HS / B-6-8”, the amount of heat dissipated on the floor of the floor heating radiator is 60% of the basic standard As described above, the recommended selection criterion is defined as 80% or more, which is regarded as important.

  Conventionally, the following proposals have been made in order to improve the cooling heat efficiency to the surface side of the cooling heat panel.

  For example, in Japanese Patent Application Laid-Open No. 2-8458, as shown in FIG. 5, a foil having a high thermal conductivity such as aluminum is provided in a reverse Ω-shaped cross section in the gap between the cooling heat tube 13 and the groove 12 of the base material 11. It has been proposed to insert a heat transfer foil 17 processed into a shape. In this cool heat heat panel, the heat transfer foil 17 having a reverse Ω-shaped cross section prevents heat from being diffused to the lower side of the cool heat heat pipe 13 and increases the heat cool efficiency to the upper surface. However, this heat transfer foil 17 can be applied only to the straight tube portion of the cool heat heat tube 13, and it is difficult to install the heat transfer foil 17 on the bent tube portion. Moreover, since the process of processing the heat transfer foil into a complicated shape having an inverted Ω-shaped cross section and inserting the heat transfer foil into the groove 12 of the base material 11 is required, the number of assembling steps and labor are increased, and the heat transfer foil 17 is required. The cost also increases, and as a result, the cooling heat panel becomes expensive.

Japanese Patent Laid-Open No. 2003-287234 is based on a structure in which the outer periphery is covered with a heat transfer foil 18 made of a metal having a high thermal conductivity over the entire length of the cooling heat pipe 13, as shown in FIG. It has been proposed to install in the groove 12 of the material 11. This cool heat heat panel guides the heat dissipated below the cool heat heat pipe 13 to the surface material 14 side by the heat transfer foil 18 covering the outer periphery of the cool heat heat pipe 13, thereby improving the heat discharge heat efficiency to the upper surface. It is something to enhance. This technology is superior to that shown in FIG. 5 in that it can be applied regardless of the straight pipe portion or the curved pipe portion of the cooling heat panel, but, like the conventional cooling heat panel shown in FIG. The heat transfer path between the heat foil 18 and the surface material 14 is limited to the linear contact portion directly above the cooling heat pipe 13, and this portion becomes a bottleneck. The effect is limited. In addition, the process and labor for winding the heat transfer foil 18 around the cool heat heat pipe 13 are increased, and the cost is increased by the heat transfer foil 13. As a result, the cool heat heat panel becomes expensive.
Japanese Patent Laid-Open No. 2-8458 JP 2003-287234 A

  As described above, each of the conventional techniques has difficulty in cost, workability at the time of assembly, and production efficiency, and also has a limit in the effect of improving the cooling heat efficiency.

  The present invention solves the above-described conventional problems, and provides a cooling heat panel that has high cooling heat efficiency on the surface side and is effective for energy saving, and can be manufactured easily and quickly at low cost. The purpose is to do.

  The cooling heat panel of the present invention (Claim 1) includes a substrate, a groove provided on the surface of the substrate, a cooling heat pipe for circulating a heat medium disposed in the groove, and the surface of the substrate. In the cooling heat panel comprising the surface material disposed on the surface, at least a space on the surface material side in the groove is filled with a filler.

  The cool heat panel according to claim 2 is characterized in that, in claim 1, the thermal conductivity of the filler is 0.1 W / mK or more.

  A cooling heat panel according to a third aspect is characterized in that, in the first or second aspect, the filler is obtained by mixing a filler selected from a metal and an inorganic material into a thermoplastic resin or a thermosetting resin.

  The method for manufacturing a cooling heat panel according to the present invention (Claim 4) is the method according to any one of Claims 1 to 3, wherein a cooling material is disposed in a groove on the surface of the base material, and then a surface material is attached to the surface of the base material. A method for producing a cooling heat panel according to claim 1, wherein the filler is attached to a surface of the surface material on the base material side, and the surface material is brought into contact with the surface of the base material and pressed. Thus, the filler is filled at least in the gap on the surface material side.

  In the cooling heat panel of the present invention, since the filler is filled in at least the gap on the surface material side in the groove provided in the base material, the cooling heat tube and the surface material have a wide area through the filling material. It comes into contact with a so-called flat plate structure with fins. As a result, the heat conduction path from the cooling heat tube to the surface material can be greatly expanded as compared to the conventional cooling heat panel in which the cooling heat tube and the surface material are in linear contact with each other. Cooling heat efficiency to the surface side is improved. For this reason, it is possible to realize energy saving of the cooling heat panel by efficiently cooling to the indoor side only and suppressing the cooling heat to the opposite side as much as possible. In addition, since the filler can be provided in all parts regardless of the straight tube portion or the bent tube portion of the heat-releasing heat tube, the heat-releasing heat efficiency to the surface side can be improved over the entire surface of the heat-releasing heat panel. it can.

  In addition, the cooling heat panel of the present invention is a complicated method for filling the filler by pressing the surface material to which the filler has been attached in advance against the surface of the substrate by the manufacturing method of the cooling heat panel of the present invention. Therefore, it can be manufactured easily and efficiently at a low cost without requiring a complicated operation.

  Embodiments of a cooling heat panel and a method for manufacturing the same according to the present invention will be described below in detail with reference to the drawings.

  The cooling heat panel according to the present invention can be applied to both cooling and heating. Therefore, the cooling heat pipe according to the present invention includes a heating medium such as warm water or a cooling medium such as cold water as a heating medium. Is distributed. In addition, the cooling / heating panel of the present invention is not limited to floor cooling / heating, but is applied to surface cooling / heating applications in various places such as wall cooling / heating and ceiling cooling / heating.

  1 to 3 are enlarged cross-sectional views of a groove portion of a substrate showing an embodiment of a cooling heat panel according to the present invention. The cooling heat panel of the present invention has the same configuration as that of a conventional cooling heat panel except that at least a gap on the surface material side in the groove of the base material is filled with a filler. As shown in FIG. 4 (a), a structure in which a cooling heat pipe 13 for circulating a heat medium is disposed in a groove 12 provided on the surface of a base material 11, and a surface material 14 is bonded to the surface by an adhesive material 15. Has been.

  In the cooling heat panel of FIG. 1, the entire space in the groove 12 of the substrate 11 is filled with the filler 10.

  2 is filled with the filler 10 only in the gap on the surface material side in the groove 12 of the substrate 11.

  The cooling heat panel of FIG. 3 is provided with a cooling heat tube 13A having an oval cross section instead of the circular cooling heat tube of FIG. 1, and the base material 11A has a shape of the cooling heat tube 13A. A groove 12A is formed to follow the above.

  As the filler 10, since it plays a role of a heat conduction path between the cool heat tubes 13 and 13A and the surface material 14, a material having high heat conductivity is desirable, and a heat conductivity of 0.1 W / mK. Above all, it is preferably 0.6 W / mK or more, particularly 1 W / mK or more. The higher the thermal conductivity of the filler 10, the better. However, in the filler that can be used industrially as described later, the upper limit of the thermal conductivity is usually about 6 W / mK or less.

  As shown in FIG. 4, when no filler is provided in the gap in the groove 12, the thermal conductivity of air is 0.02 W / mK, which is the upper limit of heat transfer. Furthermore, the heat transfer between the cooling heat tube and the air and between the air and the surface material also becomes a large heat resistance. Therefore, according to the present invention, by filling this portion with the filler 10, the ease of heat conduction between the cooling heat tubes 13, 13A and the surface material 14 is improved by one digit or more.

  The material of the filler 10 is not particularly limited as long as it conforms to the gist of the present invention, but considering cost and ease of assembly work, EVA (ethylene-vinyl acetate copolymer resin), polyamide resin, etc. Thermosetting resins such as thermoplastic resins, epoxy resins and urethane resins, or those mainly composed of these resins are preferred. Since the thermal conductivity of these resins is about 0.1 to 0.4 W / mK, an effect of improving thermal conductivity sufficient as a filler can be obtained. These resins may be used alone or in combination of two or more.

  In addition, by mixing these resins with fillers such as particles and fibers having high thermal conductivity such as inorganic substances such as graphite, aluminum nitride, silicon carbide, and metals (including alloys) such as copper and aluminum, The thermal conductivity can be increased to an order of magnitude higher. As described above, the higher the thermal conductivity of the filler, the better, and the thermal conductivity of the filler can be increased by increasing the filler content. However, if the filler ratio is too high, the filler is uniformly filled. Is difficult to disperse and the filler tends to be brittle. For this reason, the filler content ratio in the filler may be set as appropriate depending on the desired thermal conductivity and the brittleness of the filler, etc., but usually the lower limit is 3% by weight or more, preferably 5% by weight. More preferably, it is 8% by weight or more, and the upper limit is about 50% by weight or less, preferably about 40% by weight or less. With such a filler content ratio, the thermal conductivity of the filler can be increased to about 6 W / mK, but it is usually preferable that the filler content ratio is such that the thermal conductivity is about 4 W / mK or less.

  If the filler size is excessively large, uniform dispersion becomes difficult. If the filler size is excessively small, the handleability at the time of blending with the resin is deteriorated. Therefore, if the filler is granular, the average particle size is about 0.01 to 10 μm. In the case of a fibrous filler, those having an average fiber length of 0.1 to 100 μm and an average fiber diameter of about 0.01 to 10 nm are preferable. The shape of the filler may be granular, fibrous, flaky, or other irregular shapes. Such a filler may be used individually by 1 type, and may use 2 or more types together.

  In addition to such fillers, the filler can further improve thermal conductivity, improve the filling efficiency into the grooves, improve the uniform dispersibility of the filler, improve the handleability, improve the durability, etc. For the purpose of improving the performance, a thickener, a pigment, a coloring material, an antioxidant, a lubricant, and the like may be included as long as the original properties as a filler are not impaired.

  In the present invention, the filler 10 only needs to be filled in at least the gap on the surface material 14 side in the groove 12 of the substrate 11. Therefore, it is not always necessary to fill the filler 10 so as to fill the entire gap as shown in FIG. 1, but as shown in FIG. 2, the gap on the surface material 14 side in the groove 12, that is, in the groove 12 It may be provided so as to cover only the upper surface side of the cooling heat tube 13.

  However, as shown in FIG. 1, when the entire space in the groove 12 is filled with the filler 10 so as to cover the lower surface side of the cool heat heat tube 13, the heat is transferred from the cool heat heat tube 13 to the back side of the panel. By inducing heat to the panel surface side, the cooling heat efficiency to the surface can be further enhanced.

  As shown in FIG. 2, when the filler 10 is filled only in the space on the surface material 14 side in the groove 12, the amount of the filler is the height in the panel thickness direction of the cooling heat tube 13 (a in FIG. 2). 2), the filling depth of the filler 10 (b in FIG. 2) is 1/3 or more (that is, b ≧ 1/3 × a). In particular, it is preferable to fill so as to satisfy ½ or more (that is, b ≧ ½ × a). If the filler filling depth is excessively small, the effect of improving the cooling heat efficiency toward the surface side according to the present invention cannot be obtained sufficiently. In particular, the width of the groove 12 when the cool heat heat panel is seen through in the thickness direction is equal to the width of the cool heat heat tube 13, and the depth of the groove 12 is equal to the height of the cool heat heat tube 13 in the panel thickness direction. In this case, it is preferable that 70% by volume or more, particularly 100%, of the gap formed between the cool heat heat tube 13 disposed in the groove 12 and the surface material 14 is filled with the filler 10.

  In the cooling heat panel of the present invention, the same components as those of the conventional heat dissipation panel other than the filler can be used.

  Examples of the heating medium that passes through the cooling heat tubes 13 and 13A include warm water, water vapor, heated oil, or antifreeze such as an ethylene glycol aqueous solution or a propylene glycol aqueous solution, and preferably hot water. On the other hand, cold water is usually used as the cooling medium.

  As the cooling heat tubes 13 and 13A, a flexible tube is usually used, and specifically, a resin tube such as a crosslinked polyethylene tube or a polybutene tube, or a metal tube such as a copper tube or a steel tube may be used. Among these, metal pipes have higher thermal conductivity than resin pipes, but they are heavy, have problems such as workability and rusting, and increase costs, so they are used appropriately depending on the application of the cooling heat panel. Is done.

  There is no particular limitation on the cross-sectional shape (cross-section in the direction orthogonal to the length direction) of the heat-releasing heat tube, and it is generally circular as shown in FIG. By adopting an elliptical shape, the contact area between the cool heat heat tube and the surface material can be increased, and the cool heat efficiency to the surface side can be further increased.

  The dimensions of the cooling heat tubes 13 and 13A can be changed depending on the construction object of the cooling heat panel and the kind and temperature of the heat medium to be circulated, but the wall thickness of the cooling heat tubes is usually 1.0 mm or more and 1.5 mm or less. The height in the panel thickness direction is usually about 4 mm or more and 9 mm or less.

  Although the material of the base materials 11 and 11A is not particularly limited, a material made of a foamed synthetic resin having a high heat insulating property is usually preferable. A plate-like body made of a foamed synthetic resin, specifically, a rigid polyurethane foam, a rigid polyethylene Examples include foams, rigid polypropylene foams, polystyrene foams, rigid polyvinyl chloride foams, polymethyl methacrylate foams, polycarbonate foams, polyphenylene oxide foams, foams of polystyrene and polyethylene mixtures. Of these, rigid polyurethane foam, polystyrene foam and the like are suitable. The thicknesses of these plate-like bodies constituting the base materials 11 and 11A are preferably selected within a range of 10 to 50 mm.

  The width of the opening of the grooves 12 and 12A for embedding the cooling heat tubes 13 and 13A on the surfaces of the base materials 11 and 11A is the outer diameter of the cooling heat tubes 13 and 13A (in the cooling heat tube 13A, The same dimension as the width in the panel surface direction) or slightly larger than this is preferable. If the grooves 12 and 12A are formed so that the cross-sectional shape orthogonal to the extending direction is U-shaped, it is convenient when embedding the heat-releasing heat tubes 13 and 13A. The depth of the grooves 12 and 12A varies depending on the filling amount of the filler 10, but is preferably equal to or slightly deeper than the height of the cooling heat tubes 13 and 13A in the panel thickness direction. That is, as shown in FIG. 1, when the filler 10 is provided so as to cover the entire periphery of the cooling heat tube 13, the depth of the groove 12 is set to 0.05 than the height of the cooling heat tube 13 in the panel thickness direction. When the filling material 10 is provided so as to cover only the outer periphery on the surface material 14 side of the cooling heat tube 13 as shown in FIG. 2, the depth of the groove 12 is the cooling heat. It is preferable that the tube 13 has the same height as that of the panel in the thickness direction, and the upper end portion of the cool heat heat tube 13 is brought into contact with the surface material 14 directly or through an adhesive 15.

  By using a metal foil having a high thermal conductivity as the surface material 14, the uniform cooling heat property of the cooling heat panel can be enhanced. Examples of the metal foil include aluminum foil, tin foil, stainless steel foil, and copper foil. Among these, aluminum foil is preferable from the viewpoints of manufacturing difficulty and cost. If the thickness of the metal foil is too thin, the strength is not sufficient. If the thickness is too thick, the product becomes heavy and the cost is increased. Therefore, it is usually preferable to select the thickness within the range of 10 μm to 50 μm.

  Further, the surface material 14 may be made of an inexpensive material such as a resin sheet or paper, or may be a laminated sheet in which a metal foil and a resin sheet are combined. In the case of a composite sheet of metal foil and resin sheet, the metal sheet with high thermal conductivity is brought into contact with the cooling heat tube side, and the resin sheet is arranged on the surface finishing layer side, so that the refinishing and renewability of the finishing material is possible. This is preferable. Examples of the resin sheet include thermoplastic resin sheets such as polyethylene terephthalate, olefin resins such as polyethylene and polypropylene, and styrene resins such as polystyrene and acrylonitrile butadiene styrene copolymer. The thickness of the resin sheet varies depending on whether it is used as a single layer or combined, but is usually 5 μm or more, preferably 10 μm or more, and usually 500 μm or less, preferably 300 μm or less.

  As the adhesive 15 between the surface material 14 and the base materials 11 and 11A, an adhesive such as an acrylic resin may be used, and a hot melt type such as EVA (ethylene-vinyl acetate copolymer resin) or polyamide resin. Or a curable adhesive such as an epoxy resin or a urethane resin may be used.

  In the manufacture of the cooling heat panel of the present invention, as a filling method of the filler, various methods are conceivable depending on the material, filling amount, etc., for example, in the step of installing the cooling heat tube in the groove of the substrate. Before and after, if it is a thermoplastic resin, it is heated and given fluidity, and if it is a thermosetting resin, it is in a liquid before curing or in a flexible uncured state with some fluidity in the groove. Then, if it is a method of covering the surface of the base material with a surface material, it is possible to manufacture a cooling heat panel without excessively costly and labor-intensive as compared with the prior art.

  Moreover, if it is the method of making it adhere by applying a filler etc. to the back surface (base material contact surface side) of a surface material, sticking to a base material installed in a groove, and applying pressure, The filler flows into the gap between the cooling tube and the groove from the back of the surface material to fill the gap, and the filler also acts as an adhesive between the surface material and the base material. An excellent production method.

  In normal cases, a surface finish material having a water-resistant layer and a design layer is further adhered to the surface material of the heat-release panel by using a double-sided adhesive tape or the like.

  In addition, as a manufacturing method of the natural cooling heat panel of this invention, it is not limited to the said method, Moreover, the natural cooling heat panel of this invention does not necessarily need to be completed in a manufacturing factory. For example, it is possible to adopt a method in which each component is brought into the construction site in an independent state and constructed while being assembled on the site.

  The cooling heat panel of the present invention is applied to the surface cooling and heating application in various places of buildings such as floors, walls, ceilings, etc., and energy saving can be achieved due to the high cooling heat efficiency toward the surface side.

It is sectional drawing of the groove part which shows embodiment of the natural heat panel of this invention. It is sectional drawing of the groove part which shows other embodiment of the natural cooling heat panel of this invention. It is sectional drawing of the groove part which shows another embodiment of the natural heat panel of this invention. (A) The figure is sectional drawing which shows the conventional cool-down heat panel, (b) Figure is an expanded sectional view of the groove part of this cool-down heat panel. It is sectional drawing of the groove part which shows the conventional cooling heat panel. It is sectional drawing of the groove part which shows the conventional cooling heat panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Filling material 11, 11A Base material 12, 12A Groove 13, 13A Cooling heat tube 14 Surface material 15 Adhesive material

Claims (4)

Cooling heat comprising a base material, a groove provided on the surface of the base material, a heat-cooling heat pipe disposed in the groove, and a surface material disposed on the surface of the base material In the panel,
A cooling heat panel, wherein a filler is filled in at least a gap on the surface material side in the groove.   2. The cool heat panel according to claim 1, wherein the thermal conductivity of the filler is 0.1 W / mK or more.   3. The cooling heat panel according to claim 1 or 2, wherein the filler is obtained by mixing a thermoplastic resin or a thermosetting resin with a filler selected from a metal and an inorganic material.   It is a method of manufacturing the cooling heat panel of any one of Claims 1 thru | or 3 by sticking a surface material on this base-material surface, after arrange | positioning a cooling-heat tube in the groove | channel on the base-material surface. The filler is attached to the surface of the surface material on the base material side, and the surface material is brought into contact with the surface of the base material and pressurized to fill at least the void on the surface material side. A method for producing a cooling heat panel.

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