JP2006062168A - Laminator and laminate manufacturing method using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To laminate two sheetlike materials (a) and (b) so as to obtain a uniform thickness dimension in a laminator constituted so as to press two sheetlike materials (a) and (b) to laminate them by an adhesive (c), to suppress the occurrence of stress caused by bending at the time of pressurization in the sheetlike materials (a) and (b) and the adhesive (c) and to facilitate thickness control. <P>SOLUTION: The laminator is equipped with two stages 10 and 20 having smooth pressing surfaces 11 and 21 and a plurality of the jet orifices 11a and 21a provided to the pressing surfaces 11 and 21 and arranged so that the pressing surfaces 11 and 21 are possitively opposed to each other, holding means 11a, 21a and 70 for holding the sheetlike materials (a) and (b) at a predetermined position with respect to the pressing surfaces 11 and 21 of the respective stages 10 and 20, a pressurization means 30 for pressurizing two sheetlike materials (a) and (b) arranged between the stages 10 and 20 in a lamination direction, a jet means 50 for respectively jetting air from a plurality of the jet orifices 11a and 21a and a curing means 80 for curing the adhesive (c) interposed between two sheetlike materials (a) and (b) when two sheetlike materials (a) and (b) are pressurized by the pressurization means 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a laminating apparatus in which two plate-like bodies are pressed and bonded together with an adhesive, and more particularly, to a countermeasure for equalizing the pressure applied to the plate-like bodies at the time of laminating.

  For example, in the process of manufacturing a liquid crystal display panel, a process of bonding a pixel electrode substrate and a counter electrode substrate together with an adhesive interposed between the two substrates is performed.

Among the conventional laminating apparatuses used in such a laminating process, those described in Patent Literature 1, Patent Literature 2, Patent Literature 3 and the like include two sheets as shown in FIG. 10 (side view). The substrates 100 and 110 are sequentially pressed by a pair of rollers 130 and 140 while being fed in the direction indicated by the arrow in the figure with the adhesive 120 interposed between the two substrates 100 and 110. . Moreover, in what is described in Patent Document 4, as shown in FIG. 11 (side view), the two substrates 210 and 220 mounted on the mounting table 200 are replaced with the two substrates 210 and 220. One roller 240 is moved in the direction indicated by the arrow in the drawing with the adhesive 230 interposed therebetween, and the rollers 240 are sequentially pressed.
JP-A-5-307161 (page 3, Fig. 2) JP 58-134622 (2nd page, Fig. 3) JP 59-16725 (page 4, FIG. 2) Japanese Patent Laid-Open No. 4-178629 (page 2, FIG. 1)

However, the conventional pasting apparatus has the following drawbacks.
1) Since the substrate is pressed linearly by the roller, the portion to be pressed at the central portion in the axial direction of the roller is recessed, and the thickness of the portion to be pressed at both ends in the axial direction tends to increase. .
2) Since the two substrates are locally pressed sequentially, the stress caused by the bending when pressed and recessed tends to remain on the substrate and the adhesive.
3) Since the adhesive is cured immediately before or after being pressed, it is difficult to control the thickness.

  The present invention has been made in view of such a point, and its main purpose is to pressurize two plate-like bodies in a direction in which the two plate-like bodies are bonded together, such as a pixel electrode substrate and a counter electrode substrate of a liquid crystal display panel. In addition, in the laminating apparatus in which the adhesive interposed between the two plate-like bodies is cured and pasted together, by improving the method of applying pressure to each plate-like body, the uniform thickness dimension is obtained. In addition to being able to bond together, it is possible to suppress the occurrence of stress due to bending in the plate-like body and the adhesive, and to facilitate the management of the plate thickness.

  In order to achieve the above object, in the present invention, the pressure applied to the plate-like body is made uniform by pressurizing the two plate-like bodies through a high-pressure gas film.

  Specifically, in the present invention, a laminate is formed by applying pressure in the direction in which two plate-like bodies are bonded together and curing and bonding the adhesive interposed between the two plate-like bodies. It is premised on a laminating apparatus designed to do this.

  And each having a smooth pressurization surface and having a plurality of jet holes provided on the pressurization surface, the two pressurization surfaces arranged so as to face each other, and each of these stages Holding means for holding a plate-like body corresponding to the stage at a predetermined position with respect to the pressing surface; and pressurizing means for pressurizing the two plate-like bodies arranged between the two stages in a bonding direction; An ejection means for ejecting gas from each of the plurality of ejection ports of the stage so that each plate does not come into contact with the pressure surface of the stage corresponding to the plate, and the two plates are the pressurization And a curing means for curing the adhesive interposed between the two plate-like bodies when pressurized by the means.

  In the above configuration, the holding means regulates a slide restricting mechanism for restricting the slide movement of the plate-like body in a direction substantially parallel to the pressure surface of the stage, and a movement of the plate-like body away from the pressure surface of the stage. It can have a separation regulating mechanism. A specific example of the slide restricting mechanism is one that restricts the slide movement of the plate-like member by contacting the peripheral end surface of the plate-like member. On the other hand, as a specific example of the separation regulating mechanism, there is a suction mechanism having a plurality of intake ports provided on the pressurizing surface of the stage and an intake unit that sucks gas through the plurality of intake ports. Can be mentioned.

  As for the pressurizing means, the two stages are provided so as to be relatively movable in the direction in which the two plate-like bodies arranged between the two stages are bonded together, and the two stages are mounted in the bonding direction. In the case where it is provided with a moving means for relative movement, it may be configured by the moving means, or the jetting means may be composed of two plate-like bodies arranged between two stages. You may make it comprise with this jetting means by providing so that a pressurization can be mutually carried out in the bonding direction by the high pressure jet of gas.

  In addition, when at least one of the two plate-like bodies is long, a feeding means for sequentially introducing the long plate-like body between the two stages is provided. In this case, it is preferable that the distance between the inlets of the long plate-shaped body between the two stages is larger than the distance between the pressure surfaces of the two stages.

  Furthermore, as for the curing means, when the adhesive is a UV curable adhesive that cures when irradiated with UV light, UV light can be transmitted through at least one of the two stages. In addition, an irradiation means for irradiating UV light to the UV curable adhesive interposed between the two plate-like bodies can be provided as a curing means, and the adhesive is heated. When the thermosetting adhesive is cured by heating, the gas ejected by the ejection means is heated so that the thermosetting adhesive interposed between the two plates is heated and cured. A heating means can be provided as a curing means.

  According to the present invention, the pressure applied to each plate-like body can be made uniform by pressurizing the two plate-like bodies through the gas film. Therefore, the residual stress of the plate-like body and the adhesive due to such bending can be reduced, and the adhesive can be cured in a pressurized state. Management of the thickness of the laminated body bonded together can be facilitated. In addition, by applying pressure through the gas film, the stage does not need to be brought into contact with the surface of the plate-like body, so that a situation in which the surface of the plate-like body is damaged by such contact can be avoided. There is also a merit.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a side view schematically showing the overall configuration of a bonding apparatus according to an embodiment of the present invention. This bonding apparatus has a plurality of counter electrode substrates that are not yet formed in the manufacturing process of a liquid crystal display panel. A first long sheet a that is continuous in one direction in a divided state and a second long sheet b in which a plurality of pixel electrode substrates are continuous in one direction in an undivided state are used. Each part for one counter electrode substrate in the length sheet a and each part for one pixel electrode substrate in the second long sheet b are sequentially bonded together with a UV curable adhesive c to form a laminate. Used to form the panel body. As the UV effect type adhesive c, a general adhesive which is cured by UV light within a wavelength range of about 200 to 500 nm is used.

  The bonding apparatus includes a pair of upper and lower stages 10 and 20, and the lower surface of the upper stage 10 and the upper surface of the lower stage 20 are pressure surfaces 11 and 21, respectively. Further, the present laminating apparatus is a direction in which the portions of the first and second long sheets a and b introduced between the two stages 10 and 20 are bonded to each other (hereinafter referred to as a pressing direction). ) Is provided as a moving means. The distance between the stages 10 and 20 is gradually increased toward the rear side in the introduction direction (left side in FIG. 1) at the introduction port where the first and second long sheets a and b are introduced. Yes.

  1st and 2nd elongate sheet | seat a, b is hold | maintained so that it can draw | feed out from the winding part arrange | positioned in the one side (left side of FIG. 1) of the upper and lower stages 10 and 20 in the state wound up by roll shape. Has been. The portions of the long sheets a and b fed out from the take-up portion are introduced between the stages 10 and 20 so as to overlap each other vertically. At that time, the UV curable adhesive c is arranged in a predetermined pattern on the second long sheet b at a position immediately before the long sheets a and b are overlapped with each other.

  The other side of the upper and lower stages 10 and 20 (the right side in FIG. 1) is provided so as to sandwich the bonded portion of the long sheets a and b led out between the stages 10 and 20 in the vertical direction. A pair of upper and lower drive rollers 40 serving as feeding means are arranged. These driving rollers 40 are driven to rotate intermittently in synchronism with opposite directions by the driving means (not shown) at the same speed. Each drive roller 40 is in frictional contact with the upper surface of the first long sheet a and the lower surface of the second long sheet b, and thereby the first and second long sheets a and b are respectively brought into contact with each other. It is drawn out from the winding unit and introduced between the upper and lower stages 10 and 20 and led out between the upper and lower stages 10 and 20.

  The pressure surface 11 of the upper stage 10 has a large number (for example, several tens per 10 cm square area) for ejecting air toward the portion of the first long sheet a introduced between the upper and lower stages 10 and 20. The ejection port 11a and a large number of intake ports 11b for sucking air are provided so as to be mixed with each other. On the other hand, the pressurizing surface 21 of the lower stage 20 sucks in the air, and a large number of outlets 21a for ejecting air toward the portion of the second long sheet b introduced between the upper and lower stages 10, 20. Therefore, a large number of intake ports 21b are provided so as to coexist with each other. In the vicinity of the stages 10 and 20, an air supply unit 50 is provided for pressure-feeding the air ejected from the ejection ports 11a and 21a to the ejection ports 11a and 21a. In addition to the air supply unit 50, an air suction unit 80 that communicates with the intake ports 11 b and 21 b and sucks air from the intake ports 11 b and 21 b is provided in the vicinity of the stages 10 and 20. Yes. And in this embodiment, the ejection means in this invention is comprised by the ejection ports 11a and 21a and the air supply part 50, and the inlet port 11b. The separation regulating mechanism in the present invention is configured by 21b and the air suction part 80.

  As shown in the plan view of FIG. 2, four slide restricting pins 60 are suspended from the pressure surface 11 of the upper stage 10. These slide restricting pins 60 are in contact with the sheet width direction side end surfaces of the overlapped portions of the first and second long sheets a and b introduced between the upper and lower stages 10 and 20, and in the sheet width direction of the overlapped portions. The movement of the slide is regulated. Further, as shown in FIG. 3, which is a cross-sectional view taken along the line III-III of FIG. 2, the pressurizing surface 21 of the lower stage 20 has an accommodation hole 61 that can accommodate the lower end portion of the corresponding slide regulating pin 60. The side stage 20 is provided so as to penetrate in the vertical direction, and when the vertical stages 10 and 20 move in the pressing direction, the slide holding pin 61 is accommodated in the corresponding accommodation hole 61 to accommodate the slide. The restriction pin 60 does not interfere with the press operation. In the present embodiment, the slide restriction pin 60 and the accommodation hole 61 constitute a slide restriction mechanism in the present invention.

  The lower stage 20 is made of a material that transmits UV light having a wavelength necessary for curing the UV curable adhesive c (for example, alkali glass, non-alkali glass, transparent vinyl chloride resin, polyethylene, polypropylene, acrylic resin, etc. A UV irradiation unit 90 is provided below the lower stage 20 as irradiation means for irradiating UV light toward the lower stage 20.

  Here, the effect | action of the bonding apparatus comprised as mentioned above is demonstrated.

  The first and second long sheets a and b are sequentially fed out from the holding unit by a predetermined size at the same speed and at the same timing by the operation of the drive rollers 40. Further, each time the second long sheet b is fed out, the UV curable adhesive c is printed on the second long sheet b in a pattern for one liquid crystal display panel.

  Next, a portion of the first long sheet a corresponding to one panel and a portion of the second long sheet b printed with the UV curable adhesive c are introduced between the stages 10 and 20. Is done. At this time, the distance between the stages 10 and 20 is gradually increased toward the rear side in the introduction direction (feeding direction), so that the long sheets a and b are smoothly introduced between the stages 10 and 20. Is done. Each introduced portion is restricted from sliding in the width direction by the four slide restricting pins 60.

  And by the action | operation of the air supply part 50, high pressure air is ejected from each ejection hole 11a, 21a of the upper and lower stages 10 and 20. FIG. Thereby, between the pressurization surface 11 of the upper stage 10 and the introduction part of the 1st elongate sheet a, and between the pressurization surface 21 of the lower stage 20 and the introduction part of the 2nd elongate sheet b, respectively. An air film is formed. At the same time, air is sucked from the intake ports 11 b and 21 b of the upper and lower stages 10 and 20 by the operation of the air suction unit 70. As a result, the first and second long sheets a and b are restricted from being separated from the pressurizing surfaces 11 and 21 while being prevented from contacting the pressurizing surfaces 11 and 21 of the corresponding stages 10 and 20, respectively. As a result, the pressure surfaces 11 and 21 are held at positions floating by a predetermined dimension (about several mm).

  Thereafter, in a state where the operations of the air supply unit 50 and the air suction unit 70 are maintained, both the stages 10 and 20 are overlapped with each other by the operation of the press mechanism 30. Move in the direction to sandwich the part. At this time, the press mechanism 30 moves both stages to a position where a slight gap is ensured between the pressure surfaces 11 and 21 and the overlapping portions of the long sheets a and b. For example, when the thickness dimensions of the long sheets a and b are 0.05 to 0.30 mm and the gap between the long sheets a and b is 2 to 5 μm, 20 moves to a position where a gap of about 2 to 5 mm is secured between the pressure surfaces 11 and 21. Thereby, a pressing force in the laminating direction (for example, 1 to 2 tons when the size of the overlapping portion is 360 × 465 mm) is applied to the overlapping portion of the long sheets a and b.

  Next, UV light is irradiated by the UV irradiation unit 80 while maintaining the above-described pressure state. The UV light sequentially passes through the lower stage 20 and the second long sheet b and reaches the UV curable adhesive c between the first and second long sheets a and b. Thereby, the UV curable adhesive c is cured, and the overlapped portions of the first and second long sheets a and b are bonded together. At this time, the pressurizing force of the stages 10 and 20 is applied to the overlapping portion of the long sheets a and b through the air film. Unlike FIG. 13), it adds uniformly to the whole. Thereby, the bending resulting from local pressurization does not occur, and therefore, stress due to such bending does not occur in the long sheets a and b and the adhesive c.

  Then, after the UV curable adhesive c is cured, the stages 10 and 20 are moved away from each other by the press mechanism 30. At the same time, the air supply unit 50 and the air suction unit 70 stop operating.

  Thereafter, by the operation of the driving roller 40, the bonded portions of the first and second long sheets a and b are led out from the stages 10 and 20, and accordingly, the first and second long sheets a and b. The next part will be introduced between the stages 10 and 20.

  By repeating the above operation, each portion for one counter electrode substrate of the first long sheet a and each portion for one pixel electrode substrate of the second long sheet b are sequentially bonded. After that, each bonded portion is cut to form a panel body of the liquid crystal display panel, and a liquid crystal material is injected into this to obtain a liquid crystal display panel.

  Therefore, according to the present embodiment, the portions of the first and second long sheets a and b are pressed between the upper and lower stages 10 and 20 through the air film so that the portions are bonded to each other. Thus, since the pressure applied to each part of the first and second long sheets a and b can be made uniform, the long sheets a and b do not bend due to pressurization. Since the residual stress of the long sheets a and b and the adhesive c due to the flexible bending can be reduced, and the adhesive c can be cured in a pressurized state, each facing of the first long sheet a It is possible to facilitate the management of the gap of the panel main body in which the electrode substrate portion and each pixel electrode substrate portion of the second long sheet b are bonded together.

  Further, by applying pressure through the air film, the stages 10 and 20 do not need to be in contact with the surfaces of the first and second long sheets a and b. There is also an advantage that it is possible to avoid a situation in which the surfaces of the length sheets a and b are scratched.

  Furthermore, since the two long sheets a and b can be successively bonded while being sequentially fed by the pair of drive rollers 40, high processing ability can be exhibited.

  In the above-described embodiment, the respective portions of the two long sheets a and b are sequentially bonded together, but one pixel electrode substrate and one counter electrode substrate are bonded together. Alternatively, one pixel electrode substrate may be bonded to a portion of one sheet of a counter electrode substrate of a long sheet in which a plurality of counter electrode substrate portions are connected in an undivided state. On the contrary, the counter electrode substrate for one sheet and the part for one pixel electrode substrate of a long sheet in which a plurality of pixel electrode substrate portions are connected in an undivided state may be bonded together. .

  In the above-described embodiment, the pressure surfaces 11 and 21 of the pair of upper and lower stages 10 and 20 are sent to the first and second long sheets a and b with a distance dimension between the pressure surfaces 11 and 21. The shape is formed so as to gradually increase toward the rear in the direction, but if not necessary, the gap dimension between the pair of upper and lower stages 10 and 20 may be made constant.

  In the above embodiment, the slide restricting pin 60 of the slide restricting mechanism is arranged in the area of the pressurizing surfaces 11 and 21 of the stages 10 and 20, but in FIG. 4 (plan view) and its side view. As in Modification 1 shown in FIG. 5, the stages 10 and 20 may be arranged only on both front and rear sides in the feed direction or only on the front side in the feed direction.

  In the above-described embodiment, the case where the plate-like body is a long sheet has been described. In the case where the plate-like body is not a long sheet, FIG. 6 (plan view) and FIG. As in Modification 2 shown in FIG. 7 which is a cross-sectional view taken along the line -VII, the horizontal slide restriction that restricts the slide in the width direction (vertical direction in FIG. 6) of the plate-like plate on one of the upper and lower stages 10 and 20. A pin 60a and a vertical slide restricting pin 60b for restricting sliding in the length direction of the plate-like body (left and right direction in FIG. 6) are provided, and on the other side, accommodating holes that can accommodate the slide restricting pins 60a and 60b, respectively. 61a and 61b can be provided.

  Further, in the above embodiment, the holding means is constituted by the slide restricting mechanism and the separation restricting mechanism. FIG. 9 (plan view) and FIG. 9 which is a sectional view taken along the line IX-IX in FIG. A plurality of adsorbing portions capable of adsorbing the plate-like bodies a and b at appropriate positions (in the illustrated example, four locations corresponding to the four corners of the plate-like body) as in the third modification shown 90 may be provided. Specifically, each suction portion 90 is configured to suck a plate-like body by a vacuum or an adhesive material, and is provided so as to be able to retreat into a storage portion 91 provided in each stage 10, 20 and from the storage portion 91. It is possible to always urge toward the protruding direction. Modification 3 is a case where the two plate-like bodies a and b are not long, and when only one plate-like body is not long, FIG. 10 (plan view) ) And the modified example 4 shown in FIG. 11 which is a cross-sectional view taken along the line XI-XI in FIG. 11, the suction portion 90 is provided only on the stage (in the example shown, the upper stage 10) corresponding to one plate-like body a. The accommodating portion 91 and the urging means may be provided.

  In the above-described embodiment, the case where a UV curable adhesive is used as the adhesive is described. However, a thermosetting adhesive can also be used. However, in that case, instead of the UV light irradiation unit 80, for example, a heating mechanism for heating the gas ejected from the ejection ports 11a and 11b is provided, and the thermosetting adhesive is heated and cured by the heat of the gas. It is preferable to do so.

  Further, in the above embodiment, the two stages 10 and 20 are arranged in the vertical direction, but the arrangement can be appropriately determined as necessary.

  Furthermore, in the above embodiment, a case where a liquid crystal display panel is manufactured has been described. However, the present invention is not limited to a flat panel display such as a plasma display element, an organic or inorganic EL display element, or a field emission display element. In various sensors such as a two-dimensional image detector, the present invention can be applied to a laminating apparatus for laminar glass plates, laminar or long plastic plates, metal foils, metal plates and the like.

It is a vertical side view which shows typically the whole structure of the bonding apparatus which concerns on embodiment of this invention. It is a top view which shows typically the slide control mechanism of a bonding apparatus. It is the III-III sectional view taken on the line of FIG. It is a top view which shows typically the slide control mechanism in the modification 1. FIG. FIG. 5 is a side view of FIG. 4. FIG. 10 is a view corresponding to FIG. 2 schematically showing a slide restricting mechanism in Modification 2. It is the VII-VII sectional view taken on the line of FIG. 10 is a plan view schematically showing a holding mechanism in Modification 3. FIG. It is the IX-IX sectional view taken on the line of FIG. It is a top view which shows typically the holding mechanism in the modification 4. It is the XI-XI sectional view taken on the line of FIG. It is a side view which shows typically the structure of the principal part of the conventional bonding apparatus (patent document). It is a figure equivalent to FIG. 12 which shows typically the structure of the principal part of the other conventional bonding apparatus.

Explanation of symbols

10 Upper stage (stage)
11 Pressurizing surface 11a Spout (ejection means)
11b Intake port (suction mechanism)
20 Lower stage (stage)
21 Pressurizing surface 21a Spout (ejection means)
21b Air inlet (suction mechanism)
30 Press mechanism (moving means)
40 Feed roller (feed means)
50 Air supply part (spouting means)
60 Slide restriction pin (slide restriction mechanism)
61 Housing hole (slide regulating mechanism)
70 Air suction part (holding means)
80 UV irradiation part (irradiation means)
90 Adsorption part (holding means)
a First long sheet (plate)
b Second long sheet (plate)
c UV curable adhesive (adhesive)

Claims (12)

A laminating apparatus that pressurizes two plate-shaped bodies in the direction of bonding and cures and bonds the adhesive interposed between the two plate-shaped bodies to form a laminate. And
Two stages each having a smooth pressure surface and a plurality of jets provided in the pressure surface, and arranged so that the pressure surfaces face each other;
Holding means for holding the plate-like body corresponding to the stage at a predetermined position with respect to the pressing surface of each stage;
A pressurizing means for pressurizing the two plate-like bodies disposed between the two stages in a direction in which the two plates are bonded together;
Jetting means for jetting gas from the plurality of jet nozzles of the stage so that the plate-like bodies do not contact the pressure surface of the stage corresponding to the plate-like body;
And a curing means for curing the adhesive interposed between the two plate-like bodies when the two plate-like bodies are pressurized by the pressurizing means. apparatus. In the bonding apparatus according to claim 1,
The holding means is
A laminating apparatus comprising a slide restricting mechanism for restricting slide movement of the plate-like body in a direction substantially parallel to the pressure surface of the stage. In the bonding apparatus according to claim 2,
The slide regulating mechanism is
A laminating apparatus, wherein the laminating apparatus is provided so as to be in contact with a peripheral end surface of the plate-like body to regulate sliding movement of the plate-like body. In the bonding apparatus according to claim 2,
One of the two stages is arranged with the pressure surface of the stage facing down,
In addition to the slide restricting mechanism, the holding means includes:
A laminating apparatus comprising a separation regulating mechanism for regulating separation of the plate-like body corresponding to the one stage from the pressing surface of the one stage. In the bonding apparatus of Claim 4,
The separation regulating mechanism is
A laminating apparatus comprising: a suction mechanism having a plurality of air inlets provided on the pressure surface of the one stage; and a suction unit that sucks gas from the plurality of air inlets. . In the bonding apparatus according to claim 1,
The two stages are provided so as to be relatively movable in a direction in which the two plate-like bodies arranged between the two stages are bonded together,
A moving means for relatively moving the two stages in the bonding direction;
The said pressurizing means is comprised by the said moving means, The bonding apparatus characterized by the above-mentioned. In the bonding apparatus according to claim 1,
The ejection means is provided so that the two plate-like bodies arranged between the two stages can be pressurized in the bonding direction by high-pressure gas ejection,
The said pressurizing means is comprised by the said ejection means, The bonding apparatus characterized by the above-mentioned. In the bonding apparatus according to claim 1,
At least one of the two plate-like bodies is a long shape,
A laminating apparatus comprising feeding means for sequentially introducing the long plate-like body between the two stages. The laminating apparatus according to claim 8,
The laminating apparatus according to claim 1, wherein a distance dimension between the introduction ports of the long plate-like body between the two stages is larger than a distance dimension between the pressing surfaces of the two stages. In the bonding apparatus according to claim 1,
The adhesive is a UV curable adhesive that is cured by being irradiated with UV light,
At least one of the two stages is provided so as to transmit UV light,
An irradiation means for irradiating the UV curable adhesive interposed between the two plate-like bodies with UV light;
The laminating apparatus, wherein the curing means is constituted by the irradiation means. In the bonding apparatus according to claim 1,
The adhesive is a thermosetting adhesive that cures when heated.
Heating means for heating the gas ejected by the ejection means so that the thermosetting adhesive interposed between the two plate-like bodies is heated and cured;
The laminating apparatus, wherein the curing means includes the heating means. It manufactures the said laminated body using the bonding apparatus of any one of Claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 and 11. A manufacturing method of a layered product.

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