JP2006041311A - Wiring board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To sufficiently join a wiring conductor and a thermocouple in a wiring board by preventing the oxidation of the surface of the thermocouple incorporated into the wiring board because the accuracy of a measurement is not deteriorated by noises generated by a wiring, a connecting wire or the like for a measuring instrument, and a drift by a use atmosphere and the stable measurement is enabled without correcting a measuring electromotive force when a temperature is measured at 300°C or lower as the working-temperature region of the wiring board; to easily prevent a malfunction and an operational stop due to the heat of an IC chip loaded on the wiring board as the result; and to obtain the wiring board with the built-in thermocouple maintaining stable characteristics, even to the treatment of chemicals in the wiring board with the built-in thermocouple. <P>SOLUTION: The wiring board has an insulating board 1 formed by laminating a plurality of insulating layers composed of glass ceramics and wiring conductors 2 formed among the surface of the insulating board 1 and the layers of the insulating layers. The wiring board further has the thermocouple 5 electrically connected to the wiring conductors 2. A non-oxidizing layer is formed on a joining surface with the wiring conductors 2 in the thermocouple 5, and a connecting wiring section 7 containing a metal forming the wiring conductors 2 and an alkali metal is formed among the thermocouple 5 and the wiring conductors 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is capable of accurately and stably measuring various reaction temperatures on a wiring board, such as a grooved wiring board for collating, synthesizing, and amplifying a sample such as DNA (deoxyribonucleic acid) or protein. The present invention relates to a wiring board capable of improving analysis reliability and shortening verification time.

  2. Description of the Related Art Conventionally, as a wiring board with a groove for analyzing, collating, synthesizing, and amplifying a specimen such as DNA or protein, a wiring board in which a wiring conductor or a groove is formed on an insulating board made of ceramics is known.

  Such a wiring board is manufactured by a ceramic green sheet (ceramic raw sheet, hereinafter also referred to as a green sheet) lamination method as follows. First, glass powder, resin binder, solvent, plasticizer, etc. are added to and mixed with ceramic raw material powder made of alumina or the like to form a mud, which is then formed into a sheet by the doctor blade method or calendar roll method, etc. And grooves and holes are formed on it by a press punching method or the like. Then, a metal paste obtained by adding and mixing desired glass powder, resin binder, solvent, plasticizer, etc. to metal powder such as tungsten (W), molybdenum (Mo), etc. on the green sheet surface into a predetermined pattern by screen printing. Apply printing. Thereafter, a plurality of the green sheets are laminated to form a laminated body, and the laminated body is fired at a temperature of about 1650 ° C.

  In addition, such a wiring board used for DNA analysis, verification, etc. needs a heating function and a temperature measuring function in order to perform a chain separation operation for decomposing two strands of DNA into one strand. The heating function is generally constituted by a heater made of platinum-rhenium (Pt-Re) or tungsten-rhenium (W-Re), which is a high resistance material, formed inside the wiring board.

  In addition, the temperature measuring function is a thermocouple element such as an alumel-chromel thermocouple, an iron (Fe) -constantan thermocouple, a chromel-constantan thermocouple, a platinum (Pt) -platinum rhodium (Pt-Rh) alloy thermocouple. , A method of measuring the temperature by providing a hole near the temperature measurement part of the wiring board, and inserting a linear thermocouple into the hole, and mounting a thermocouple on the wiring board with a brazing material or heat-resistant adhesive To the wiring board using a method of measuring the temperature by fixing a linear thermocouple to the mounting jig, or using a low softening point glass having a softening point of about 350 to 500 ° C. or a heat resistant adhesive A method of directly fixing and measuring temperature is generally performed.

  However, in the method of directly attaching the thermocouple to the wiring board as described above, it is necessary to secure an area for attaching the thermocouple on the wiring board. Since the area for attaching the pair cannot be secured, it is becoming difficult to use the above method. In particular, in a wiring board with a groove for collating, synthesizing, and amplifying a sample such as DNA, the width of the groove for migrating the sample in a liquid reagent has become smaller year by year. There is a tendency that an area for attaching the element wire to the surface of the wiring board cannot be secured. In addition, since the treatment with a strongly acidic or strongly alkaline chemical is performed in the process of collating, synthesizing, and amplifying the specimen, the metal brazing material and the mounting bracket are eroded by the chemical, so that the use is limited.

Therefore, in recent years, as a method of forming a thermocouple inside a wiring board, a metal paste such as tungsten (W) or molybdenum (Mo) serving as a wiring conductor is printed on a green sheet made of alumina or the like, A method of printing and forming a metal paste of platinum and a platinum-rhodium alloy, laminating green sheets, and firing at about 1650 ° C. has been implemented.
JP 54-137141 A JP-A-11-214127

  However, in the conventional method for forming a thermocouple inside the wiring substrate, a platinum (Pt) -platinum rhodium (Pt-Rh) alloy thermocouple is used as the thermocouple. The generated electromotive force is as small as about 100 to 2400 μV at a temperature of 300 ° C. or less which is the self-heating temperature of the IC chip or the use environment temperature. For this reason, there is a problem that the measurement accuracy is not stabilized due to noise generated by wiring or connection lines of the voltage measuring device or drift due to the use atmosphere, and the measurement electromotive force needs to be corrected and used.

  As a means for solving this problem, the electromotive force at 300 ° C. is 12209 μV, and it is possible to obtain a large electromotive force about five times that of a platinum (Pt) -platinum rhodium alloy (Pt—Rh) thermocouple. An alumel-chromel thermocouple or an iron (Fe) -constantan thermocouple that does not embed the electromotive force in noise generated by wiring or connecting wires of voltage measuring equipment, and provides stable measurement accuracy without correction. It is conceivable to use a thermocouple made of a metal having a relatively low melting point, such as a chromel-constantan thermocouple.

  However, thermocouples made of these relatively low melting point metals have a use limit temperature of about 800 to 1000 ° C. because the melting point of the metal constituting the thermocouple is about 900 to 1700 ° C. As a result, a green sheet made of conventional alumina or the like is printed on a metal paste such as tungsten (W) or molybdenum (Mo) as a wiring conductor and platinum and a platinum rhodium alloy metal paste as a thermocouple. In the method of laminating and firing at about 1650 ° C., the metal contacts of the thermocouple have a problem in that mutual diffusion of the metals constituting the thermocouple progresses and the function as the thermocouple is lost.

In addition, an alumel-chromel thermocouple having an electromotive force at 300 ° C. of 12209 μV and capable of obtaining a large electromotive force about 5 times that of a platinum (Pt) -platinum rhodium alloy (Pt-Rh) thermocouple Taking the manufacturing method of printing or mounting on a sheet and then laminating a plurality of green sheets and firing at about 1650 ° C. as an example, the metal constituting the basic composition of this thermocouple is nickel (Ni). When nickel is heated in air, it combines with oxygen to form nickel oxide (NiO). In this oxidation process, nickel oxide (NiO _1.2 ) having oxygen defects is formed at 950 ° C. or lower. This is because the oxide film is thin and has defects, so that the properties as metallic nickel are maintained. Yes. However, when the temperature exceeds 950 ° C., nickel oxidation proceeds to form nickel oxide (NiO), which has almost no defects in the oxide film and has a very high resistivity of 10 ⁴ Ωcm. Absent. Therefore, when joining with the inner layer wiring conductor of different metal composition inside the wiring board, this nickel oxide film is very stable and inactive, so it cannot be structurally and electrically connected to the inner layer wiring conductor and insulated. There was also a problem.

  On the other hand, as a technique for preventing metal surface oxidation, a relatively chemically stable metal such as gold (Au), platinum (Pt), palladium (Pd), etc., which can prevent metal surface oxidation, is plated or deposited. In this method, a metal surface is used to prevent oxidation. However, this method requires a plating process and a pretreatment process for vapor deposition. In addition, the plating method or the vapor deposition method forms a film on the object by receiving and transferring electrons. Due to the nature of the processing method, there is a possibility that the thickness of the film may be uneven or the film may be chipped. As a result, there is a problem that the surface of the metal that is the object to be formed is oxidized.

Further, as a method of preventing surface oxidation of the metal, a method of firing a firing atmosphere as non-oxidizing atmosphere such as nitrogen (N _2), a method of firing in a reducing atmosphere such as hydrogen (H ₂₎ and nitrogen (N ₂₎ In general, when firing ceramics, the resin binder in the ceramic green sheet is reacted with oxygen (O ₂ ) to vaporize it as carbon dioxide (CO ₂ ), and then fired. If the firing atmosphere is nitrogen (N ₂ ) or a mixed atmosphere of hydrogen (H ₂ ) and nitrogen (N ₂ ), this carbon dioxide (CO ₂ ) is not generated, so carbon (C) remains in the ceramic. This causes a problem of reducing the insulation resistance between the wirings.

  The present invention has been completed to solve the above-described problems of the prior art, and the object of the present invention is to measure the temperature at a temperature of 300 ° C. or less, which is the operating temperature range of the wiring board, in the wiring board having a built-in thermocouple. If this is done, measurement accuracy will not be reduced due to noise generated by the wiring or connection lines of measuring equipment or drift due to the usage atmosphere, and stable measurement can be performed without correcting the measurement electromotive force. By preventing oxidation of the surface of the thermocouple built in the wiring board, the wiring conductor in the wiring board and the thermocouple can be sufficiently bonded. As a result, the heat generated by the IC chip mounted on the wiring board An object of the present invention is to obtain a wiring board having a built-in thermocouple that can easily prevent malfunction and stoppage of operation, and can maintain stable characteristics even with chemical processing.

  A wiring board according to the present invention includes an insulating substrate formed by laminating a plurality of insulating layers made of glass ceramics, a wiring conductor formed between the surface of the insulating substrate and the interlayer of the insulating layer, and the wiring conductor electrically A thermocouple having a non-oxidized layer formed on a joint surface with the wiring conductor, and the metal forming the wiring conductor between the thermocouple and the wiring conductor. And a connection wiring portion including an alkali metal is formed.

  The wiring board of the present invention is preferably characterized in that the wiring conductor is made of at least one of silver, copper, palladium and platinum.

  The wiring board of the present invention is preferably characterized in that the alkali metal is composed of sodium or potassium and is contained in the connection wiring portion as a borate.

  The wiring board of the present invention is preferably characterized in that the connection wiring portion has a width larger than that of the thermocouple.

  The method for manufacturing a wiring board according to the present invention is the above-described method for manufacturing a wiring board according to the present invention, comprising: printing a first conductor paste layer serving as the wiring conductor on a main surface of a glass ceramic green sheet; Printing the second conductor paste layer serving as the connection wiring portion, which comprises the metal and the borohydride salt that covers the main surface of the glass ceramic green sheet and a part of the first conductor paste layer and forms the wiring conductor. And a step of positioning and placing the thermocouple on the main surface of the glass ceramic green sheet and the second conductor paste layer or printing a third conductor paste layer serving as the thermocouple; , A step of pressing and laminating a plurality of glass ceramic green sheets and other glass ceramic green sheets to produce a laminate, and a process for firing the laminate It is characterized in that it comprises and.

  The method for manufacturing a wiring board according to the present invention is preferably characterized in that the wiring conductor is made of at least one of silver, copper, palladium and platinum.

  In the wiring board manufacturing method of the present invention, preferably, the borohydride salt is composed of sodium borohydride or potassium borohydride.

  In the method for manufacturing a wiring board according to the present invention, preferably, the connection wiring portion has a width larger than a width of the thermocouple.

  In the wiring board of the present invention, the thermocouple has a non-oxidized layer on the joint surface with the wiring conductor, and a connection wiring portion made of a metal and an alkali metal forming the wiring conductor is formed between the thermocouple and the wiring conductor. Therefore, since no oxide film exists on the joint surface between the thermocouple and the wiring conductor, the structural and electrical connection between the thermocouple and the wiring conductor can be ensured. In addition, since glass ceramic is used as the insulating layer, a metal having a low melting point and a low resistance, which cannot be melted to form a wiring conductor by firing at 1000 ° C. or higher, can be formed as a wiring conductor. A thermocouple having a large electromotive force made of a metal having a relatively low melting point such as a thermocouple, an iron (Fe) -constantan thermocouple, a chromel-constantan thermocouple, or the like can be used. As a result, due to the noise generated by the wiring and connection lines of measuring instruments due to the low electromotive force of the thermocouple at 300 ° C or lower, which is the operating temperature range in the wiring board on which the IC chip is mounted, drift due to the usage atmosphere It is possible to effectively suppress the problem that the measurement accuracy is not stable, and it is possible to eliminate the necessity of correcting the measurement electromotive force for use.

  Preferably, in the wiring board of the present invention, the wiring conductor is made of at least one of silver, copper, palladium, and platinum, and the wiring conductor is made of a material having a low resistivity of 1.59 to 1.67 μΩcm. It can be transmitted to the measuring device without lowering the electromotive force of the thermocouple, and highly accurate measurement can be performed.

  In the wiring board of the present invention, preferably, the alkali metal in the connection wiring portion is composed of sodium or potassium and is contained in the connection wiring portion as a borate. Therefore, the borate is decomposed at 500 ° C. or more. Therefore, the surface oxide film of the thermocouple can be reduced in a temperature range of 500 to 600 ° C. where the thermocouple and the wiring conductor are sintered.

  In the wiring board of the present invention, preferably, the connection wiring portion has a width larger than that of the thermocouple, so that the junction area of the connection wiring portion with the thermocouple is increased, and the connection wiring portion is connected to the thermocouple. An increase in the resistance value of the joint can be effectively suppressed.

  The method for manufacturing a wiring board according to the present invention includes a step of printing a first conductor paste layer serving as a wiring conductor on a main surface of a glass ceramic green sheet, and a step of printing the main surface of the glass ceramic green sheet and the first conductor paste layer. A step of printing a second conductive paste layer serving as a connection wiring portion, comprising a metal covering a part and forming a wiring conductor and a borohydride salt, a main surface of the glass ceramic green sheet, and a second conductive paste layer A step of printing a third conductive paste layer on which a thermocouple is positioned and placed, or a thermocouple, and a plurality of glass ceramic green sheets and other glass ceramic green sheets are stacked under pressure. And a step of firing the laminate, and in the firing step, the wiring conductor is composed of a metal and a borohydride salt. The borohydride salt in the connecting wiring part can reduce the oxide film on the thermocouple surface and remove the oxide film on the joint surface with the thermocouple wiring conductor. It is possible to easily form a connection wiring portion made of a metal and an alkali metal forming a wiring conductor between the non-oxidized layer and the thermocouple and the wiring conductor.

  Preferably, in the method for producing a wiring board of the present invention, since the borohydride salt is composed of sodium borohydride or potassium borohydride, the decomposition temperature of sodium borohydride or potassium borohydride is 500 ° C. or higher. In the reaction between the thermocouple and the metal of the wiring conductor in the firing step, the oxide film on the surface of the thermocouple can be effectively reduced.

  In the method for manufacturing a wiring board according to the present invention, preferably, the connection wiring portion has a width larger than the width of the thermocouple, so that the junction area between the thermocouple and the connection wiring portion can be increased. The reduction effect of the borohydride salt contained in the wiring portion can be sufficiently distributed to the oxide film on the thermocouple surface, and the oxide film on the thermocouple surface can be effectively reduced.

  As described above, for example, in a grooved wiring board for collating, synthesizing, and amplifying samples such as DNA and protein, various reaction temperatures on the wiring board can be measured accurately and stably, so that the sample is not correctly matched or synthesized. Since it is possible to prevent the occurrence of problems such as defects and a decrease in amplification factor, the reliability of DNA analysis can be improved, and the verification time can be shortened.

  The wiring board of the present invention will be described below. 1 and 2 show an example of an embodiment of a wiring board according to the present invention. FIG. 1 (a) is a partially cutaway perspective view showing a part of an inner layer configuration, and FIG. 1 (b) is a perspective view. FIG. 2 is a cross-sectional view of the wiring board. 1 and 2, reference numeral 1 is an insulating substrate formed by laminating a plurality of insulating layers, 2 is a wiring conductor formed on the upper main surface of the insulating substrate 1, 3 is an inner wiring conductor, 4 is a through conductor, Is a linear thermocouple (thermocouple wire). Further, 6 is joined to the thermocouple 5 to draw out the electromotive force of the thermocouple to the outside, 7 is a connecting wiring portion between the thermocouple and the drawing wiring (wiring conductor) 6, and 8 is chemical resistance protection An IC chip having a film, 9 is a groove for migrating DNA and protein.

In the present invention, the insulating layer 1 is made of a glass ceramic sintered body. The glass-ceramic sintered body is composed of a glass component and a filler component. Examples of the glass component include SiO ₂ —B ₂ O ₃ , SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ , and SiO ₂ —. B ₂ O ₃ —Al ₂ O ₃ —MO system (M represents Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (M ¹ and M ² are the same or different and represent Ca, Sr, Mg, Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (provided that M ¹ And M ² are the same as above), SiO ₂ —B ₂ O ₃ —M ³ ₂ O system (where M ³ represents Li, Na or K), SiO ₂ —B ₂ O ₃ —Al ₂ O _3- M ³ ₂ O system (where M ³ is the same as above), Pb system Glass, Bi glass, etc. are mentioned.

Examples of the filler component include a composite oxide of Al ₂ O ₃ , SiO ₂ , ZrO ₂ and an alkaline earth metal oxide, a composite oxide of TiO ₂ and an alkaline earth metal oxide, Al ₂ O _3. And composite oxides containing at least one selected from SiO ₂ (for example, spinel, mullite, cordierite) and the like.

  The wiring conductor 2, the inner layer wiring conductor 3 and the through conductor 4 are made of, for example, a metallized metal whose main component is a powder of metal such as silver (Ag), copper (Cu), palladium (Pd), platinum (Pt). This metallized metal can be obtained by sintering a conductor paste containing the above metal powder. The insulating substrate 1 made of a glass ceramic sintered body is combined with the firing shrinkage of the conductor paste and the firing shrinkage of the glass ceramic. Glass powder or ceramic powder may be added to the conductor paste. Further, the wiring conductor 2, the inner layer wiring conductor 3 and the through conductor 4 may be different in the kind and amount of glass powder or ceramic powder to be added.

  Examples of the linear thermocouple 5 include an alumel-chromel thermocouple, an iron (Fe) -constantan thermocouple, a chromel-constantan thermocouple, and the like. The best results were obtained.

  The lead-out wiring 6 that is joined to the linear thermocouple 5 and draws the electromotive force of the thermocouple 5 to the outside is made of, for example, a metallized layer containing a metal powder such as silver or copper as a main component. This metallized layer can be obtained by sintering a conductor paste containing the above metal powder. The insulating substrate is made of a glass ceramic sintered body that combines the firing shrinkage of the conductor paste and the firing shrinkage of the glass ceramic. In order to ensure the bonding strength with No. 1, glass powder or ceramic powder may be added to the conductor paste.

The connection wiring portion 7 between the linear thermocouple 5 and the lead wiring 6 is, for example, silver (Ag) and sodium borohydride (NaBH ₄ ), or copper (Cu) and sodium borohydride (NaBH ₄ ). It consists of the metallization layer which has as a main component the powder which consists of. Pattern printing is performed by screen printing or the like on the lead-out wiring 6 made of silver (Ag), copper (Cu), palladium (Pd), platinum (Pt), etc. formed by pattern-printing this metallized layer on a glass ceramic green sheet. Then, the connection wiring part 7 is formed. The connection wiring part 7 should not be formed in the temperature sensitive part of the thermocouple 5, that is, the joining part of alumel and chromel. This is because, for example, when a conductive material contacts across alumel and chromel, the potential difference between alumel and chromel disappears, no electromotive force is generated, and the thermocouple 5 does not function.

Here, the graphs in Table 1 and FIG. 3 below show the results of measuring electromotive force curves at −40 ° C. to 300 ° C. when an alumel-chromel thermocouple is used in the wiring board of the present invention. A characteristic almost in agreement with the theoretical value of power was obtained.

  And the wiring board of this invention is produced as follows. When the insulating substrate 1 of the wiring board of the present invention is made of a glass ceramic sintered body, first, a desired resin binder, plasticizer, organic solvent, etc. are added to and mixed with raw material powder such as ceramic powder, glass powder, etc. None, this is formed into a sheet by a conventionally known doctor blade method or calendar roll method to produce a green sheet. Further, a desired glass powder, a resin binder, a solvent, a plasticizer and the like are added to and mixed with a low melting point metal powder such as copper or silver to prepare a conductor paste.

  Next, in order to form a groove 9 for migrating DNA or protein, a green sheet is applied at a temperature of 50 to 150 ° C. and a pressure of 3 to 200 MPa using a mold or the like having a groove pattern formed in a convex shape. The groove 9 having a predetermined pattern is formed on the surface of the green sheet.

  Next, a through hole for forming the through conductor 4 is formed in the green sheet in which the groove 9 is formed by, for example, a punching method, and the through hole is filled with a conductive paste by, for example, a screen printing method. Subsequently, a conductor paste layer to be the wiring conductor 2, the inner layer wiring conductor 3, and the lead wiring 6 is printed and applied in a predetermined pattern on the surface of each green sheet.

  Next, a through hole for forming the through conductor 4 is formed in the green sheet, which is the lower layer of the green sheet in which the groove 9 is formed, by, for example, a punching method, and the through hole is filled with a conductive paste by a screen printing method. Subsequently, a conductor paste layer to be the wiring conductor 2, the inner layer wiring conductor 3, and the lead wiring 6 is printed and applied in a predetermined pattern on the surface of each green sheet.

Next, a desired glass powder, a resin binder, a solvent, a plasticizer, and the like are added to and mixed with powder composed of silver (Ag) and sodium borohydride (NaBH ₄ ) to prepare a paste for the connection wiring portion 7. In this example, the amount of sodium borohydride (NaBH ₄ ) added was 5 wt% with respect to silver (Ag). Thereafter, the paste for the connection wiring portion 7 is screen-printed so as to overlap a predetermined position of the lead-out wiring 6 to form the connection wiring portion 7. In this example, the connection wiring part 7 was formed by printing at 15 μm.

  In this example, the diameter of the thermocouple 5 is 0.2 mm, and the wiring width of the lead-out wiring 6 is 0.4 mm. Thereafter, the thermocouple 5 is positioned and mounted at a predetermined position of the connection wiring portion 7 on the green sheet, which is the lower layer of the green sheet in which the groove on which the conductor paste is printed and applied, and then at a pressure of 3 to 200 MPa. The green sheet is pressurized and the thermocouple 5 is fixed to the green sheet.

  Next, the green sheet in which the groove 9 is formed and the green sheet corresponding to the lower layer are stacked and laminated, and if necessary, pressed at a temperature of 50 to 100 ° C. and a pressure of 3 to 200 MPa, and about 800 to about 800 Baking at a temperature of 950 ° C. As the firing temperature rises, nickel oxide (NiO) is formed on the surface of the thermocouple 5, but sodium borohydride decomposes at 500 to 600 ° C. to reduce the surface of the thermocouple 5 and form a non-oxidized layer. The thickness of the non-oxidized layer is about 300 to 1000 nm. By this action, the thermocouple 5 and the lead wiring 6 are electrically connected via the connection wiring portion 7.

  Thereafter, a nickel plating layer, a palladium plating layer, a gold plating layer, or the like may be deposited on the surfaces of the wiring conductor 2 and the lead wiring 6 exposed on the main surface of the insulating substrate 1 to prevent corrosion.

  The wiring board of the present invention manufactured as described above includes an insulating substrate 1 formed by laminating a plurality of insulating layers, a wiring conductor 2 formed between the insulating layers and on the surface of the insulating layer, and a wiring conductor 2. And the insulating layer is made of glass ceramics, and the wiring conductor 2 is made of silver, copper or an alloy containing the same as a main component, and is connected to the thermocouple 5 at the connection portion. A connection wiring portion 7 made of silver, palladium, gold, or an alloy containing at least one of them is formed. This makes it possible to accurately and stably measure various reaction temperatures on a wiring board with grooves for verifying, synthesizing, and amplifying a sample such as DNA. Since the problem that the rate is reduced can be prevented, the reliability of DNA analysis can be improved, and the verification time can be shortened.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the connecting wiring portion 7 between the linear thermocouple 5 and the lead wiring 6 is, for example, silver (Ag) and potassium borohydride (KBH ₄ ), or copper (Cu) and potassium borohydride (KBH). ₄ ).

(A), (b) shows an example of embodiment of the wiring board of this invention, (a) is a partial notch perspective view which shows a part of structure of an inner layer, (b) is a perspective view. It is sectional drawing which shows an example of embodiment of the wiring board of this invention. It is a graph which shows the result of having measured the electromotive force curve at the time of using an alumel-chromel thermocouple about the wiring board of this invention.

Explanation of symbols

1: Insulating substrate 2: Wiring conductor 3: Inner layer wiring conductor 4: Through conductor 5: Thermocouple 6: Lead wire 7: Connection wiring portion 8: IC chip 9: Groove

Claims (8)

An insulating substrate formed by laminating a plurality of insulating layers made of glass ceramics, a wiring conductor formed between the surface of the insulating substrate and the interlayer of the insulating layer, and a thermocouple electrically connected to the wiring conductor The thermocouple has a non-oxidized layer formed on a joint surface with the wiring conductor, and includes a connection between the thermocouple and the wiring conductor, and a metal that forms the wiring conductor and an alkali metal. A wiring board having a wiring portion formed thereon. The wiring board according to claim 1, wherein the wiring conductor is made of at least one of silver, copper, palladium, and platinum. 3. The wiring board according to claim 1, wherein the alkali metal is made of sodium or potassium and is contained in the connection wiring portion as a borate. The wiring board according to claim 1, wherein a width of the connection wiring portion is larger than a width of the thermocouple. It is a manufacturing method of the wiring board of Claim 1, Comprising: The process of printing the 1st conductor paste layer used as the said wiring conductor on the main surface of a glass ceramic green sheet, The main surface of the said glass ceramic green sheet, and the said A step of printing a second conductor paste layer serving as the connection wiring portion, which is made of a metal and a borohydride salt covering the part of the first conductor paste layer and forming the wiring conductor; and the glass ceramic green sheet. Positioning and placing the thermocouple on the main surface of the substrate and the second conductor paste layer, or printing a third conductor paste layer serving as the thermocouple, the glass ceramic green sheet and the other Characterized in that it comprises a step of producing a laminate by pressure laminating a plurality of glass ceramic green sheets, and a step of firing the laminate. A method for manufacturing a wiring board. 6. The method of manufacturing a wiring board according to claim 5, wherein the wiring conductor is made of at least one of silver, copper, palladium, and platinum. 7. The method of manufacturing a wiring board according to claim 5, wherein the borohydride salt is made of sodium borohydride or potassium borohydride. The method for manufacturing a wiring board according to claim 5, wherein the connection wiring portion has a width larger than a width of the thermocouple.

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