JP2006033559A

JP2006033559A - Componnt mounting laminate conductor, and antenna component

Info

Publication number: JP2006033559A
Application number: JP2004211232A
Authority: JP
Inventors: Noriyuki Tako; 紀之多湖; Toshinori Yoshiba; 利紀吉羽; Hiroyasu Sugiyama; 博康杉山; Tatsuji Oku; 達司奥
Original assignee: Sumitomo Electric Industries Ltd
Current assignee: Sumitomo Electric Industries Ltd
Priority date: 2004-07-20
Filing date: 2004-07-20
Publication date: 2006-02-02

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting laminate conductor and an antenna component using the same which reduces the cost by the component mounting using the laminate conductor, and lessens the damage of components by making a bending stress hardly transmitting to a component mounting part. <P>SOLUTION: The component mounting laminate conductor 1 has a component mounting part 5 for mounting a chip-like circuit component 9 between the ends of a pair of band-like conductors 2a, 2b pasted to resin films 3, 4. Area-reduced parts 6 having width areas partly reduced on the conductor plane are formed into the band-like conductors 2a, 2b at near positions of specified distances from the component mounting part 5. The band-like conductors 2a, 2b are formed by punching through a conductive metal foil of over 0.1 mm, the resin films 3, 4 are formed from a heat-resistive resin film. The area-reduced parts 6 are formed by notching the widthwise side edge portions of the band-like conductors 2a, 2b or forming openings in widthwise central portions of the band-like conductors. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、チップ状の回路部品を実装するための部品実装用ラミネート導体と、それを用いたアンテナ部品に関する。 The present invention relates to a component mounting laminate conductor for mounting a chip-shaped circuit component and an antenna component using the same.

近年、携帯電話やパソコン、また、ビデオカメラやデジタルカメラ等の電子機器においては、小型化・軽量化の他に高機能化されている。これに伴って、電子機器内に搭載される回路部品や配線部品の高密度で高信頼性のある実装技術が求められている。フレキシブルプリント回路板（以下、ＦＰＣという）は、厚さが薄く、柔軟性に優れていることから、機器内の狭いスペース部分、湾曲部や回動部のような部分での配線や部品実装に多く用いられている。 In recent years, electronic devices such as mobile phones, personal computers, video cameras, and digital cameras have become more sophisticated in addition to being smaller and lighter. Along with this, there is a demand for high-density and highly reliable mounting technology for circuit components and wiring components mounted in electronic equipment. The flexible printed circuit board (hereinafter referred to as FPC) is thin and excellent in flexibility, so it can be used for wiring and component mounting in narrow spaces, curved parts, and rotating parts in equipment. Many are used.

ＦＰＣは、通常、ポリイミド樹脂等のプラスチックフィルムからなるベースフィルム上に、薄い銅箔を貼り付け、銅箔を選択的にエッチングして所定の配線導体を形成したり、あるいは、めっき処理や導電塗料の印刷等により形成している（例えば、特許文献１参照）。しかし、ＦＰＣの部品実装部分が湾曲されると、配線導体上の回路部品の接続部が剥がれたり、クラックが生じて導通が破断されることがある。また、ＦＰＣの配線導体となる銅箔の厚さは３５μｍ程度と薄く、このため剛性が必要な部分には、別途、厚い導体を接合させる必要がある。さらに、配線導体の形成に露光やエッチング技術等を用いるため、製造コストが高いという問題がある。 FPC usually has a thin copper foil attached to a base film made of a plastic film such as polyimide resin, and the copper foil is selectively etched to form a predetermined wiring conductor, or a plating process or conductive paint. (For example, refer to Patent Document 1). However, when the component mounting portion of the FPC is curved, the connection portion of the circuit component on the wiring conductor may be peeled off or a crack may be generated to break conduction. Moreover, the thickness of the copper foil used as the FPC wiring conductor is as thin as about 35 μm. Therefore, it is necessary to separately join a thick conductor to a portion that requires rigidity. Furthermore, since exposure and etching techniques are used for forming the wiring conductor, there is a problem that the manufacturing cost is high.

このようなＦＰＣを用いた部品実装に対して、配線導体を銅箔板から打抜いてプラスチックフィルムに貼り付けてなるラミネート導体を用いる部品実装も知られている。（例えば、特許文献２参照）。打抜き配線導体からなるラミネート導体は、ＦＰＣからなるラミネート導体に比べて安価に形成することができ、また、バネ性のある導体を用いることにより、配線導体自体に接点機能を持たせたり、接続端子機能を持たせることができる。
特開平７−１７００４８号公報特開２００２−３５８８４６号公報 For such component mounting using FPC, component mounting using a laminate conductor obtained by punching a wiring conductor from a copper foil plate and attaching it to a plastic film is also known. (For example, refer to Patent Document 2). Laminated conductors made of punched wiring conductors can be formed at lower cost than laminated conductors made of FPC, and by using a springy conductor, the wiring conductor itself can have a contact function, Can have a function.
Japanese Patent Laid-Open No. 7-170048 JP 2002-358846 A

しかしながら、ラミネート導体を用いた部品実装で、導体にバネ性を持たせるために厚めの銅箔（例えば、厚さ０.１５ｍｍ程度）を用いると、ハンドリング時にラミネート導体が曲げられたりすると、回路部品又はその接合部が損傷する恐れがある。これは、導体の剛性が大きくなるため、導体を曲げると部品実装部に曲げ応力が伝わり、強度があまり大きくないチップ状の回路部品及びその接合部を損傷させるということにある。これに対し、実装された部品を樹脂で封止する方法も考えられるが、樹脂量や封止形状にバラツキがあると、特性にバラツキが生じるとともに、コストも増加する。 However, if a thick copper foil (for example, about 0.15 mm thick) is used to mount the conductor with a laminated conductor and springs are given to the conductor, the laminated conductor may be bent during handling. Or the joint may be damaged. This is because, since the rigidity of the conductor is increased, bending stress is transmitted to the component mounting portion when the conductor is bent, and the chip-like circuit component and its joint portion which are not so strong are damaged. On the other hand, a method of sealing the mounted component with a resin is also conceivable. However, if there is a variation in the amount of resin or the sealing shape, the characteristics vary and the cost also increases.

本発明は、上述した実情に鑑みてなされたもので、ラミネート導体を用いた部品実装で低コスト化を図るとともに、部品実装部に曲げ応力を伝わりにくくして、部品損傷の発生を低減することができる部品実装用ラミネート導体と、それを用いたアンテナ部品の提供を課題とする。 The present invention has been made in view of the above-described circumstances, and it is possible to reduce the cost by component mounting using a laminated conductor and to reduce the occurrence of component damage by making it difficult to transmit bending stress to the component mounting portion. An object of the present invention is to provide a laminated conductor for mounting components and an antenna component using the same.

本発明による部品実装用ラミネート導体は、樹脂フィルムに貼り付けられた一対の帯状導体の端部間にチップ状の回路部品を実装する部品実装部を有する部品実装用ラミネート導体であって、帯状導体に部品実装部から所定距離はなれた近傍位置に、導体平面の幅面積を部分的に減少させた面積縮小部を形成したものである。帯状導体は、厚さが０.１ｍｍを越える導電金属箔を打ち抜いて形成され、樹脂フィルムは、耐熱性樹脂フィルムで形成される。面積縮小部は、帯状導体の幅方向側縁部分を切欠するか、又は、帯状導体の幅方向中央部分を開口して形成される。また、帯状導体の部品実装部の反対側端部に接点部又は端子部を直接形成し、帯状導体の部品実装部の裏面側に補強板を貼り付けてもよい。 A laminate conductor for component mounting according to the present invention is a laminate conductor for component mounting having a component mounting portion for mounting a chip-like circuit component between the ends of a pair of strip conductors affixed to a resin film. In addition, an area reduction part in which the width area of the conductor plane is partially reduced is formed at a position near a predetermined distance from the component mounting part. The strip conductor is formed by punching a conductive metal foil having a thickness exceeding 0.1 mm, and the resin film is formed of a heat resistant resin film. The area reduction portion is formed by cutting out the widthwise side edge portion of the strip-shaped conductor or opening the central portion in the width direction of the strip-shaped conductor. Further, a contact portion or a terminal portion may be directly formed at the opposite end of the strip-shaped conductor component mounting portion, and a reinforcing plate may be attached to the back side of the strip-shaped conductor component mounting portion.

また、本発明によるアンテナ部品は、上述の部品実装用ラミネート導体を用い、その部品実装部にチップ状のインピーダンス部品を実装して、機器内蔵型アンテナに用いられるアンテナ部品としたものである。 An antenna component according to the present invention is an antenna component used for a built-in antenna by using the above-described laminated conductor for component mounting and mounting a chip-shaped impedance component on the component mounting portion.

本発明によれば、配線導体平面の幅面積を部分的に減少させた面積縮小部によって、これより先の部品実装部には、ハンドリング時に端子部側に加えられる曲げ応力等が伝わりにくくなり、回路部品が損傷したり、或いは、その接合部が剥がれたりするのを防止することができる。また、導体材料に厚いものを用いたり、バネ性のあるものを用いることができるので、導体端部に接点部や端子部を直接形成することが可能となり、さらに、配線導体は、打抜きにより形成するため比較的に低コストで形成することができる。 According to the present invention, due to the area reduction part that partially reduces the width area of the wiring conductor plane, it becomes difficult to transmit bending stress or the like applied to the terminal part side during handling to the component mounting part beyond this, It is possible to prevent the circuit components from being damaged or the joints from being peeled off. In addition, since a thick conductor material or a spring material can be used, it is possible to directly form a contact portion or a terminal portion at the end of the conductor, and the wiring conductor is formed by punching. Therefore, it can be formed at a relatively low cost.

図により本発明の実施形態を説明する。図１（Ａ）はラミネート導体の各構成要素を説明する図、図１（Ｂ）はラミネート導体の概略を説明する図、図２は面積縮小部の種々の形成例を示す図である。図中、１はラミネート導体、２，２ａ，２ｂは帯状導体、３はベースフィルム、４はカバーフィルム、５は部品実装部、５ａは間隙、６は面積縮小部、６ａは切欠、６ｂは開口、７は端子部、８は窓孔、９は回路部品を示す。 An embodiment of the present invention will be described with reference to the drawings. 1A is a diagram for explaining each component of the laminate conductor, FIG. 1B is a diagram for explaining the outline of the laminate conductor, and FIG. 2 is a diagram showing various examples of forming the area reduction portion. In the figure, 1 is a laminated conductor, 2, 2a and 2b are strip conductors, 3 is a base film, 4 is a cover film, 5 is a component mounting part, 5a is a gap, 6 is an area reduction part, 6a is a notch, and 6b is an opening. , 7 are terminal portions, 8 is a window hole, and 9 is a circuit component.

本発明は、リード線状の端子を有しない（リードレス型）チップ状の回路部品を実装するのに用いるラミネート導体で、図１（Ａ）に示すように、樹脂製のベースフィルム３上に帯状導体２を貼り付け、帯状導体２の上面に樹脂製のカバーフィルム４を貼り付けて構成される。帯状導体２は、例えば、アンテナ導体として所望の導体幅を有する帯状に形成され、アンテナ導体長を短縮するためのインピーダンス素子を接続するため、一対の帯状導体２ａと２ｂで形成される。 The present invention is a laminated conductor used for mounting a chip-like circuit component having no lead wire-like terminal (leadless type), as shown in FIG. 1A, on a resin base film 3. The band-shaped conductor 2 is bonded, and a resin cover film 4 is bonded to the upper surface of the band-shaped conductor 2. The strip conductor 2 is formed, for example, in a strip shape having a desired conductor width as an antenna conductor, and is formed by a pair of strip conductors 2a and 2b in order to connect an impedance element for shortening the antenna conductor length.

本発明における帯状導体２は、一対の帯状導体２ａと２ｂとが互いに突き合わされる端部間に、部品実装のための電気的に絶縁分離された間隙５ａを設けた部品実装部５を有する。部品実装部５には、図１（Ｂ）に示すように、リードレスのチップ状の回路部品９が間隙５ａを跨いで接続される。本発明においては、この部品実装部５から所定距離だけ離れた位置に、後述の図２で説明するように、導体平面の幅面積を部分的に減少させた面積縮小部６を形成している。 The strip-shaped conductor 2 according to the present invention has a component mounting portion 5 in which an electrically insulated and separated gap 5a for component mounting is provided between end portions where a pair of strip-shaped conductors 2a and 2b abut each other. As shown in FIG. 1B, a leadless chip-like circuit component 9 is connected to the component mounting portion 5 across the gap 5a. In the present invention, an area reducing portion 6 in which the width area of the conductor plane is partially reduced is formed at a position away from the component mounting portion 5 by a predetermined distance, as will be described later with reference to FIG. .

面積縮小部６は、導体の幅方向の合計寸法を小さくして幅面積を減少させるようにして形成され、この面積縮小部６の導体幅は、結果として減じられる場合もあるが減じられなくてもよい。すなわち、面積縮小部６とは、導体厚さを一定として導体断面積を減じ、導体の剛性が他の部分と比べて小さく曲がり易くされた部分とされる。この面積縮小部６は、部品実装部５の近傍で所定距離はなれた位置に形成され、面積縮小部６から後方側に加えられる曲げを吸収して、その曲げ応力が部品実装部５側に伝わらないようにする。 The area reduction portion 6 is formed so as to reduce the width area by reducing the total dimension in the width direction of the conductor, and the conductor width of the area reduction portion 6 may be reduced as a result, but not reduced. Also good. That is, the area reducing portion 6 is a portion where the conductor thickness is constant and the conductor cross-sectional area is reduced, and the rigidity of the conductor is smaller and easier to bend than other portions. The area reduction part 6 is formed at a position separated by a predetermined distance in the vicinity of the component mounting part 5, absorbs bending applied to the rear side from the area reduction part 6, and the bending stress is transmitted to the component mounting part 5 side. Do not.

帯状導体２ａ，２ｂは、予め打抜き等で形成したものをベースフィルム３に貼り付けて使用されるので、例えば、０.１ｍｍを越える比較的厚い銅、アルミ、リン青銅、ステンレス等の導電性を有する金属箔を用いることができる。導体抵抗があまり問題とされない場合には、バネ性を有する硬質の金属箔を用いることもでき、機械的強度のあるラミネート導体としてハンドリングしやすいものを選ぶことができる。また、帯状導体２の強度が十分ある場合には、部品実装部５の反対の端部には、導電性のメッキ等を付与したり、機械加工を直接施して電気接続用の接点部や端子部を直接形成することもできる。 The strip-shaped conductors 2a and 2b are used by pasting a base film 3 that has been formed in advance by stamping or the like. For example, a relatively thick copper, aluminum, phosphor bronze, stainless steel or the like having a thickness exceeding 0.1 mm is required. The metal foil which has can be used. When the conductor resistance is not a serious problem, a hard metal foil having a spring property can be used, and a laminate conductor having mechanical strength that can be easily handled can be selected. In addition, when the strength of the strip-shaped conductor 2 is sufficient, a conductive plating or the like is applied to the opposite end of the component mounting portion 5, or machining is directly applied to contact portions or terminals for electrical connection. The part can also be formed directly.

帯状導体２を支持し電気的に絶縁するベースフィルム３及びカバーフィルム４として、例えば、ポリイミド、ポリエステルフィルム等の樹脂フィルムを用いることができる。しかし、回路部品を半田付け等で熱を加えた実装する必要があることから、耐熱性のある樹脂フィルムを用いることが望ましい。なお、カバーフィルム４には部品実装のための窓孔８が設けられる。また、このカバーフィルム４は、必ずしも必要とされるものではないが、帯状導体２が狭い配線部分で他の部品との接触を回避し電気絶縁を確保することができる。帯状導体２と樹脂フィルムとの積層接着には、熱硬化性又は熱可塑性の接着剤が用いられる。 As the base film 3 and the cover film 4 that support and electrically insulate the strip-shaped conductor 2, for example, a resin film such as polyimide or polyester film can be used. However, since it is necessary to mount circuit components with heat applied by soldering or the like, it is desirable to use a heat-resistant resin film. The cover film 4 is provided with a window hole 8 for component mounting. Further, the cover film 4 is not necessarily required, but the strip-like conductor 2 can avoid contact with other parts at a narrow wiring portion and ensure electrical insulation. A thermosetting or thermoplastic adhesive is used for laminating and bonding the strip conductor 2 and the resin film.

図２は、面積縮小部６の種々の構成例を示す図で、図２（Ａ）〜図２（Ｃ）は帯状導体の側縁部分を切欠して面積縮小部とする例を示し、図２（Ｄ）〜（Ｆ）は帯状導体の中央部分を開口して面積縮小部とする例を示している。何れの例においても、一対の帯状導体２ａと２ｂの端部間に回路部品９を実装する間隙５ａが設けられ、この間隙５ａの近傍に面積縮小部６が形成されている。 FIG. 2 is a diagram illustrating various configuration examples of the area reduction unit 6, and FIGS. 2A to 2C illustrate examples in which the side edge portion of the strip conductor is cut out to form the area reduction unit. 2 (D) to (F) show examples in which the central portion of the strip conductor is opened to form an area reduction portion. In any example, a gap 5a for mounting the circuit component 9 is provided between the ends of the pair of strip conductors 2a and 2b, and an area reduction portion 6 is formed in the vicinity of the gap 5a.

図２（Ａ）の例は、帯状導体２ａ，２ｂの幅方向の片側側縁部分に切欠６ａを入れて帯状導体の幅を狭め、面積縮小部６としている。この例では、一方の帯状導体２ａ側に設けた切欠６ａに対して、他方の帯状導体２ｂ側の切欠６ａは１８０°回転させた位置、すなわち、点対称となるように設けられている。これに対し、図２（Ｂ）の例は、帯状導体２ａ，２ｂの一方の側縁部分に切欠６ａを入れて帯状導体の幅を狭め、面積縮小部６とする点は同じであるが、一方の帯状導体２ａ側の切欠６ａと他方の帯状導体２ｂ側の切欠６ａが、同じ側縁部分側に形成され、すなわち、線対称となるように設けられている。 In the example shown in FIG. 2A, the area of the strip conductors 2a and 2b is reduced by making a notch 6a in one side edge portion in the width direction to reduce the width of the strip conductor. In this example, the notch 6a on the side of the other strip-shaped conductor 2b is provided so that the notch 6a on the side of the other strip-shaped conductor 2b is rotated 180 °, ie, point-symmetric. On the other hand, the example of FIG. 2B is the same in that the width of the strip conductor is reduced by making a notch 6a in one side edge portion of the strip conductors 2a and 2b to form the area reduction portion 6. The notch 6a on the side of the one strip-shaped conductor 2a and the notch 6a on the side of the other strip-shaped conductor 2b are formed on the same side edge portion side, that is, provided so as to be line symmetric.

図２（Ｃ）の例は、帯状導体２ａ，２ｂの両側縁部分に位置を異ならせて切欠６ａを入れて、帯状導体の幅を中央部分で狭まるようにして面積縮小部６としている。なお、帯状導体２ａ側の切欠６ａと帯状導体２ｂ側の切欠６ａは、線対称で形成した例を示しているが、図２（Ａ）の例と同様に点対称で形成するようにしてもよい。 In the example of FIG. 2C, the area reducing portion 6 is configured such that the positions of the strip conductors 2a and 2b are different from each other on both side edge portions, and the notches 6a are formed so that the width of the strip conductor is narrowed at the center portion. The cutout 6a on the side of the strip-shaped conductor 2a and the cutout 6a on the side of the strip-shaped conductor 2b are shown as being symmetrical with respect to the line. However, similar to the example of FIG. Good.

上記の図２（Ａ）〜図２（Ｃ）に示した切欠６ａは、何れもＵ字状の例を示しているが、半円状、矩形状等の導体幅を狭める形状であれば切欠形状に特に制限はない。切欠６ａにより帯状導体の幅が部分的に狭小となり、この部分の剛性が他の部分と比べて小さくなり、曲がり易くなる。この結果、帯状導体２ａと２ｂの図示されない部分に加えられた曲げ応力等は、部分的に導体幅を狭小とされた面積縮小部６に吸収され、部品実装部には及ばないようにすることができる。 The cutouts 6a shown in FIGS. 2A to 2C are all U-shaped examples. However, the cutouts 6a are not limited as long as the conductor width is narrow, such as semicircular or rectangular. There is no particular limitation on the shape. The width of the strip-shaped conductor is partially narrowed by the notch 6a, the rigidity of this portion is smaller than that of other portions, and it is easy to bend. As a result, bending stress or the like applied to the not-shown portions of the strip-like conductors 2a and 2b is absorbed by the area reduction portion 6 in which the conductor width is partially narrowed and does not reach the component mounting portion. Can do.

図２（Ｄ）の例は、帯状導体２ａ，２ｂの幅方向の中央部分に円形状の開口６ｂを形成して、帯状導体の全体幅を狭めることなく帯状導体の幅面積を部分的に減少させて導体断面積を減じ、面積縮小部６としている。図２（Ｅ）の例は、図２（Ｄ）の開口６ｂを帯状導体の長さ方向に２つ形成したもので、必要に応じ複数設けることができることを示したものである。図２（Ｆ）の例は、開口６ｂを楕円状に形成したもので、図２（Ｅ）のように２つの円形状の開口を設ける代わりに、１つの楕円状の開口で形成することができることを示したものである。 In the example of FIG. 2D, a circular opening 6b is formed at the center in the width direction of the strip conductors 2a and 2b, and the width area of the strip conductor is partially reduced without reducing the overall width of the strip conductor. Thus, the conductor cross-sectional area is reduced to form the area reduction portion 6. The example in FIG. 2E shows that two openings 6b in FIG. 2D are formed in the length direction of the strip-shaped conductor, and a plurality of openings 6b can be provided as necessary. In the example of FIG. 2 (F), the opening 6b is formed in an elliptical shape. Instead of providing two circular openings as shown in FIG. 2 (E), the opening 6b can be formed with one elliptical opening. It shows what can be done.

上記の図２（Ｄ）〜図２（Ｆ）に示した開口６ｂは、円形状、楕円状で示したが、この他に矩形状等の各種の変形開口を用いることができ、導体の幅方向を中央部分の幅面積を狭める形状であれば開口形状に特に制限はない。この開口６ｂにより図２（Ａ）〜図２（Ｃ）の場合と同様に、この部分の剛性が他の部分と比べて小さくなり、曲がり易くなる。この結果、帯状導体２ａと２ｂの図示されない部分に加えられた曲げ応力等は、部分的に導体幅面積を縮小された面積縮小部６で吸収され、部品実装部には及ばないようにすることができる。 Although the opening 6b shown in FIGS. 2D to 2F is shown in a circular shape or an elliptical shape, various modified openings such as a rectangular shape can be used in addition to the width of the conductor. The opening shape is not particularly limited as long as the direction narrows the width area of the central portion. As in the case of FIGS. 2A to 2C, the opening 6b makes the rigidity of this portion smaller than that of the other portions and makes it easier to bend. As a result, bending stress or the like applied to the not-shown portions of the strip-like conductors 2a and 2b is absorbed by the area reduction portion 6 whose conductor width area is partially reduced and does not reach the component mounting portion. Can do.

図３はラミネート導体の製品状態の一例を示す図で、図中、１０は接点部、１０ａは接点突起、１１は曲げ部、１２は補強板を示す。その他の符号は、図１，２で用いたのと同じ符号を用いることにより説明を省略する。図１で説明した構成のラミネート導体１は、その用途に応じて種々の形状に加工することができる。 FIG. 3 is a view showing an example of a product state of a laminated conductor, in which 10 denotes a contact portion, 10a denotes a contact protrusion, 11 denotes a bent portion, and 12 denotes a reinforcing plate. Description of other reference numerals is omitted by using the same reference numerals as those used in FIGS. The laminated conductor 1 having the configuration described with reference to FIG. 1 can be processed into various shapes according to the application.

図３に示すように、帯状導体２の回路部品９が実装される部分と反対側の端部には、例えば、接点突起１０ａを有する接点部１０又は端子部を直接加工で形成することができる。これは、帯状導体２を打ち抜きで形成すると、導体材料に接点体としてのバネ性、加工性に優れた金属箔を用いることができ、別途、接点体を製造したり固定したりする必要がなくなり、安価なラミネート導体の提供を可能とする。接点突起１０ａの形成やその他に曲げ部１１を形成する等の形状加工は、帯状導体２がベースフィルム３及びカバーフィルム４等の樹脂フィルムと積層される前に行なってもよいが、樹脂フィルムとの積層後に行なうようにしてもよい。また、必要に応じ、接点部１０の表面に金メッキ等を施し、電気接触を良好にすることができる。 As shown in FIG. 3, for example, a contact portion 10 having a contact protrusion 10 a or a terminal portion can be formed directly on the end of the strip-shaped conductor 2 opposite to the portion where the circuit component 9 is mounted. . This is because when the strip-like conductor 2 is formed by punching, a metal foil excellent in springiness and workability as a contact body can be used as the conductor material, and there is no need to separately manufacture or fix the contact body. It is possible to provide an inexpensive laminated conductor. The shape processing such as the formation of the contact protrusion 10a and the formation of the bent portion 11 may be performed before the belt-like conductor 2 is laminated with the resin film such as the base film 3 and the cover film 4. You may make it carry out after lamination | stacking. Further, if necessary, the surface of the contact portion 10 can be plated with gold or the like to improve electrical contact.

また、ラミネート導体１の部品実装部５の裏面側に、付加的に補強板１２を貼り付けて使用してもよい。この補強板１２は、例えば、エポキシ樹脂にガラス不織布を織り込んで積層プレスしたガラスエポキシ等で形成され、前述した面積縮小部に達しない範囲の部品実装部を硬直化し、回路部品が跨ぐ間隙部分に撓みや引張り等の応力が加わらないようすることができる。この補強板１２は、回路部品９を実装する前に貼ってもよく、回路部品９を実装した後に貼ってもよい。 Further, a reinforcing plate 12 may be additionally attached to the back side of the component mounting portion 5 of the laminate conductor 1 for use. The reinforcing plate 12 is formed of, for example, glass epoxy obtained by laminating and pressing a glass nonwoven fabric in an epoxy resin, and stiffens the component mounting portion in a range that does not reach the area reduction portion described above. It is possible to prevent stress such as bending and tension from being applied. The reinforcing plate 12 may be pasted before the circuit component 9 is mounted, or may be pasted after the circuit component 9 is mounted.

図４は、上述したラミネート導体を用いて小型のアンテナを構成する一例を示す図である。図中、１３はアンテナ素子シート、１４ａ，１４ｂはアンテナ素子導体、１４ｃは部品実装部、１４ｄは端子部、１５ａ，１５ｂは面積縮小部、１６は樹脂フィルム、１６ａは窓穴、１７はインピーダンス部品、１８はプリント回路基板、１９はグランド導体層、２０ａ，２０ｂ，２０ｃはプリント回路基板搭載部品、２１は入出力端子部を示す。 FIG. 4 is a diagram illustrating an example in which a small antenna is configured using the above-described laminated conductor. In the figure, 13 is an antenna element sheet, 14a and 14b are antenna element conductors, 14c is a component mounting portion, 14d is a terminal portion, 15a and 15b are area reduction portions, 16 is a resin film, 16a is a window hole, and 17 is an impedance component. , 18 is a printed circuit board, 19 is a ground conductor layer, 20a, 20b, and 20c are printed circuit board mounting components, and 21 is an input / output terminal portion.

図４に示す構成のアンテナは、グランド部に対してアンテナ素子部を適当な間隔で配し、グランド部とアンテナ素子部との間に給電手段を接続し、アンテナ素子部にインピーダンス素子を挿入することにより、アンテナ素子部の実質長さを減じて小型化する構成例を示すものである。アンテナ素子部は、アンテナ素子シート１３として形成される。このアンテナ素子シート１３は、アンテナ素子導体１４ａ，１４ｂを樹脂フィルム１６と積層して一体化し、外部接続用の端子部１４ｄを導出するとともに、部品実装部１４ｃにインピーダンス部品１７を実装して構成される。 In the antenna having the configuration shown in FIG. 4, the antenna element portion is arranged at an appropriate interval with respect to the ground portion, a feeding means is connected between the ground portion and the antenna element portion, and an impedance element is inserted into the antenna element portion. Thus, a configuration example in which the substantial length of the antenna element portion is reduced to reduce the size is shown. The antenna element portion is formed as an antenna element sheet 13. This antenna element sheet 13 is constructed by laminating and integrating the antenna element conductors 14a and 14b with the resin film 16, leading out the terminal portion 14d for external connection, and mounting the impedance component 17 on the component mounting portion 14c. The

アンテナ素子導体１４ａ，１４ｂ（例えば、導体厚さが０.１ｍｍ〜０.１５ｍｍ程度、導体幅が２ｍｍ〜３ｍｍ程度）は、図１，２で説明した帯状導体２ａ，２ｂに対応するもので、部品実装部１４ｃは、図１，２で説明した間隙５ｃを設けた部品実装部５と同様な構成となっている。また、アンテナ素子導体１４ａ，１４ｂには、部品実装部１４ｃの近傍に図１，２で説明した面積縮小部６と同様な、切欠による面積縮小部１５ａ又は開口による面積縮小部１５ｂが設けられている。 The antenna element conductors 14a and 14b (for example, the conductor thickness is about 0.1 mm to 0.15 mm and the conductor width is about 2 mm to 3 mm) correspond to the strip conductors 2a and 2b described in FIGS. The component mounting portion 14c has the same configuration as the component mounting portion 5 provided with the gap 5c described with reference to FIGS. The antenna element conductors 14a and 14b are provided with an area reducing portion 15a by notch or an area reducing portion 15b by opening similar to the area reducing portion 6 described in FIGS. 1 and 2 in the vicinity of the component mounting portion 14c. Yes.

部品実装部１４ｃには、インダクタンス（又はキャパシタンス）のチップ状のインピーダンス部品１７（例えば、平面が１ｍｍ×０.５ｍｍ角）が半田付けで実装される。インピーダンス部品１７は、同じ値のもの或いは異なる値のもの複数個を並列接続することで、数値を調整することができる。このため、部品実装部１４ｃは、複数個の部品が実装できるように幅広で形成し、樹脂フィルム１６の部品取付け用の窓穴１６ａも幅広又は複数設けておくとよい。 A chip-like impedance component 17 (for example, a plane is 1 mm × 0.5 mm square) having inductance (or capacitance) is mounted on the component mounting portion 14c by soldering. The impedance component 17 can adjust the numerical value by connecting a plurality of components having the same value or different values in parallel. For this reason, the component mounting part 14c is formed wide so that a plurality of components can be mounted, and the window holes 16a for mounting the components of the resin film 16 may be wide or plural.

アンテナのグランド部は、例えば、送受信回路を形成するプリント回路基板１８のグランド導体層１９を利用することができる。このときのプリント回路基板１８のグランド導体層１９は、プリント回路基板の裏面側のほぼ全面をグランド導体とするベタグランド構造とされる。プリント回路基板１８は、表面側に送受信回路を構成する各種のプリント回路基板搭載部品２０ａ、２０ｂ，２０ｃが実装され、また、所定の回路パターン（図示せず）が形成されている。そして、アンテナ素子シート１３の端子部１４ｄが接続される無線通信の入出力端子部２１も、回路パターンの一部として形成される。 As the ground portion of the antenna, for example, the ground conductor layer 19 of the printed circuit board 18 forming the transmission / reception circuit can be used. At this time, the ground conductor layer 19 of the printed circuit board 18 has a solid ground structure in which almost the entire back surface side of the printed circuit board is a ground conductor. The printed circuit board 18 is mounted with various printed circuit board mounting components 20a, 20b, and 20c constituting a transmission / reception circuit on the surface side, and a predetermined circuit pattern (not shown) is formed. The wireless communication input / output terminal portion 21 to which the terminal portion 14d of the antenna element sheet 13 is connected is also formed as a part of the circuit pattern.

アンテナ素子シート１３は、プリント回路基板１８のグランド導体層１９に対し適当な間隔で配し、その端子部１４ｄをプリント回路基板１８の入出力端子部２１に取付けられた接点ピン等を用いて接続することにより、アンテナとして動作させることができる。なお、プリント回路基板１８のグランド導体層１９を用いずに、アンテナ素子シート１３に対するグランド部として、打抜き又はプリント回路基板等で形成した専用のグランドシートを配してもよい。 The antenna element sheet 13 is arranged at an appropriate interval with respect to the ground conductor layer 19 of the printed circuit board 18, and the terminal portion 14 d is connected using a contact pin or the like attached to the input / output terminal portion 21 of the printed circuit board 18. By doing so, it can be operated as an antenna. Instead of using the ground conductor layer 19 of the printed circuit board 18, a dedicated ground sheet formed by punching or using a printed circuit board or the like may be disposed as a ground portion for the antenna element sheet 13.

図５及び図６は、本発明を評価するための試験方法とその試験結果を説明する図である。試験方法は、図５（Ａ）〜図５（Ｃ）に示すように、回路部品が実装されたラミネート導体試料を試料固定板に垂直になるように支持させ、滑車の回転中心から１０ｍｍ離れた位置に設けたピンが、回路部品の実装位置上方５ｍｍの部分に接触するようにセットする。次いで、滑車に重りを吊下げ、時計回りの回転トルクが生じるように荷重Ｗ（ｇ）を加え、ラミネート導体試料に曲げを与えながら実装されている回路部品が破損する荷重を求めるという方法を用いた。 5 and 6 are diagrams for explaining a test method for evaluating the present invention and a test result thereof. As shown in FIGS. 5 (A) to 5 (C), the test method is such that the laminated conductor sample on which the circuit components are mounted is supported so as to be perpendicular to the sample fixing plate, and is 10 mm away from the rotation center of the pulley. The pin provided at the position is set so as to contact the portion 5 mm above the mounting position of the circuit component. Next, a method is used in which a weight is suspended from the pulley, a load W (g) is applied so as to generate a clockwise rotational torque, and a load that damages the mounted circuit component is obtained while bending the laminate conductor sample. It was.

試験試料としては、図６に示すようにＮｏ.１〜Ｎｏ.５の５種類を作製した。何れの試料も、導体として硬銅箔を用い、その導体幅を２.０ｍｍとし、回路部品が実装される部分の間隙は０.５ｍｍとし、回路部品として幅０.５ｍｍ、長さ１ｍｍの表面実装型部品を用いた。ベースフィルムとなる樹脂フィルムには、厚さ５５μｍのポリイミドフィルムを用い、熱硬化性接着剤を用いて銅箔の片面のみに接着した。また、試料には部品実装部の背面側にガラスエポキシ樹脂で形成した厚さ０.２ｍｍ、幅２ｍｍ、長さ６ｍｍの補強板を貼り付けた試料と貼り付けない場合の２種類を作製して試験した。 As test samples, five types of No. 1 to No. 5 were produced as shown in FIG. Each sample uses a hard copper foil as the conductor, the conductor width is 2.0 mm, the gap where the circuit component is mounted is 0.5 mm, and the circuit component has a width of 0.5 mm and a length of 1 mm. Mounted parts were used. A polyimide film having a thickness of 55 μm was used as a resin film to be a base film, and a thermosetting adhesive was used to adhere only to one side of the copper foil. In addition, two types of samples, a sample with a reinforcing plate of 0.2 mm thickness, 2 mm width and 6 mm length formed with glass epoxy resin on the back side of the component mounting part, and a case where it is not attached are prepared. Tested.

試料Ｎｏ.１とＮｏ.５は、比較例として示すもので、本発明による面積縮小部を有しない均一な帯状の銅箔で形成し、試料Ｎｏ.１は銅箔厚さを０.１５ｍｍ、試料Ｎｏ.５は銅箔厚さを０.１ｍｍとしたものである。図５に示した方法で荷重Ｗを徐々に増加させたとき、試料Ｎｏ.１については、補強板なしの場合は荷重３８.３ｇで、補強板ありの場合は荷重４４.０ｇで、回路部品に破損が生じた。試料Ｎｏ.５については、補強板ありの場合も補強板なしの場合も、荷重２２.０ｇで銅箔に永久曲げが生じ、チップ部品には破損が生じなかった。 Samples No. 1 and No. 5 are shown as comparative examples, and are formed of a uniform strip-shaped copper foil having no area reduction portion according to the present invention. Sample No. 1 has a copper foil thickness of 0.15 mm, Sample No. 5 has a copper foil thickness of 0.1 mm. When the load W is gradually increased by the method shown in FIG. 5, for sample No. 1, the circuit component is 38.3 g without the reinforcing plate and 44.0 g with the reinforcing plate. Damage occurred. For sample No. 5, with or without a reinforcing plate, the copper foil was permanently bent with a load of 22.0 g, and the chip component was not damaged.

試料Ｎｏ.２は、部品実装部付近の形状を図２（Ｅ）の円形開口で面積縮小部を形成した例で、円形開口の位置を間隙中心から５ｍｍとし、円形開口の穴径を１ｍｍφとしたものである。この試料Ｎｏ.２については、補強板なしの場合は荷重３３.０ｇで、補強板ありの場合は荷重３６.５ｇで、銅箔に永久曲げが発生し、チップ部品には破損が生じなかった。 Sample No. 2 is an example in which the area near the component mounting portion is an area reduction portion formed by the circular opening in FIG. 2E. The position of the circular opening is 5 mm from the center of the gap, and the hole diameter of the circular opening is 1 mmφ. It is a thing. For sample No. 2, the load was 33.0 g without the reinforcing plate, the load was 36.5 g with the reinforcing plate, the copper foil was permanently bent, and the chip component was not damaged. .

試料Ｎｏ.３は、部品実装部付近の形状を図２（Ａ）のＵ字状の切欠を銅箔の一方の側縁部分に点対称で形成し面積縮小部とした例である。切欠位置を間隙中心から５ｍｍとし、切欠の底部円弧半径を０.５ｍｍ、銅箔幅が半分の１ｍｍとなるようにしている。この試料Ｎｏ.３については、補強板なしの場合は荷重３３.０ｇで、補強板ありの場合は荷重４０.０ｇで、銅箔に永久曲げが発生し、チップ部品には破損が生じなかった。 Sample No. 3 is an example in which the U-shaped notch in FIG. 2A is formed point-symmetrically on one side edge portion of the copper foil to form an area reduction portion in the vicinity of the component mounting portion. The notch position is 5 mm from the center of the gap, the radius of the bottom arc of the notch is 0.5 mm, and the copper foil width is half, 1 mm. For sample No. 3, the load was 33.0 g without the reinforcing plate, the load was 40.0 g with the reinforcing plate, the copper foil was permanently bent, and the chip component was not damaged. .

試料Ｎｏ.４は、部品実装部付近の形状を図２（Ｂ）のＵ字状の切欠を銅箔の一方の側縁部分に線対称で形成し面積縮小部を形成した例である。切欠位置を試料Ｎｏ.３と同様に、間隙中心から５ｍｍとし、切欠の底部円弧半径を０.５ｍｍ、銅箔幅が半分の１ｍｍとなるようにしたものである。この試料Ｎｏ.４については、補強板なしの場合は荷重３４.５ｇで、補強板ありの場合は荷重３６.５ｇで、銅箔に永久曲げが発生し、チップ部品には破損が生じなかった。 Sample No. 4 is an example in which the U-shaped notch in FIG. 2B is formed in line symmetry on one side edge portion of the copper foil to form an area reduction portion in the vicinity of the component mounting portion. Like the sample No. 3, the notch position is 5 mm from the center of the gap, the bottom arc radius of the notch is 0.5 mm, and the copper foil width is half, 1 mm. With respect to this sample No. 4, the load was 34.5 g without the reinforcing plate, the load was 36.5 g with the reinforcing plate, the copper foil was permanently bent, and the chip component was not damaged. .

以上の試験結果から、試料Ｎｏ.５は、試料Ｎｏ.２〜試料Ｎｏ.４と同様に、チップ部品に破損はなかったものの、銅箔での永久曲げが発生する荷重が小さく、従来のＦＰＣと同様に導体の剛性が小さく、バネ性、加工性に乏しい。したがって、使用導体としては硬銅箔を用いるとしても、厚さが０.１ｍｍを超えるもので形成するのが好ましい。また、本発明の実施形態である試料Ｎｏ.２〜試料Ｎｏ.４については、銅箔の永久曲がりが発生する荷重が比較的大きくでき、回路部品の破損も生じなかった。また、補強板がある場合とない場合の比較では、補強板がある場合の方が、銅箔の永久曲がり発生時点を高めることができ、好ましい使用形態であると言える。 From the above test results, Sample No. 5 is similar to Sample No. 2 to Sample No. 4, although the chip parts were not damaged, but the load causing permanent bending in the copper foil was small, and the conventional FPC As with, the rigidity of the conductor is small, and the springiness and workability are poor. Therefore, even if a hard copper foil is used as the conductor used, it is preferable to form the conductor with a thickness exceeding 0.1 mm. Moreover, about sample No.2-sample No.4 which is embodiment of this invention, the load which the permanent bending of copper foil generate | occur | produced was made comparatively large, and the failure | damage of the circuit component did not arise. Further, in the comparison between the case where the reinforcing plate is present and the case where the reinforcing plate is not present, it can be said that the case where the reinforcing plate is present can increase the time of occurrence of permanent bending of the copper foil, and is a preferable usage form.

本発明によるラミネート導体の概略を説明する図である。It is a figure explaining the outline of the laminate conductor by this invention. 本発明によるラミネート導体の面積縮小部の形成例を示す図である。It is a figure which shows the example of formation of the area reduction part of the laminate conductor by this invention. 本発明によるラミネート導体の構成の一例を示す図である。It is a figure which shows an example of a structure of the laminate conductor by this invention. 本発明によるラミネート導体を用いて構成したアンテナの一例を示す図である。It is a figure which shows an example of the antenna comprised using the laminated conductor by this invention. 本発明を評価するための試験方法を説明する図である。It is a figure explaining the test method for evaluating this invention. 本発明の試験結果を示す図である。It is a figure which shows the test result of this invention.

Explanation of symbols

１…ラミネート導体、２，２ａ，２ｂ…帯状導体、３…ベースフィルム、４…カバーフィルム、５…部品実装部、５ａ…間隙、６…面積縮小部、６ａ…切欠、６ｂ…開口、７…端子部、８…窓孔、９…回路部品、１０…接点部、１０ａ…接点突起、１１…曲げ部、１２…補強板、１３…アンテナ素子シート、１４ａ，１４ｂ…アンテナ素子導体、１４ｃ…部品実装部、１４ｄ…端子部、１５ａ，１５ｂ…面積縮小部、１６…樹脂フィルム、１６ａ…窓穴、１７…インピーダンス部品、１８…プリント回路基板、１９…グランド導体層、２０ａ，２０ｂ，２０ｃ…プリント回路基板搭載部品、２１…入出力端子部。 DESCRIPTION OF SYMBOLS 1 ... Laminated conductor, 2, 2a, 2b ... Strip | belt-shaped conductor, 3 ... Base film, 4 ... Cover film, 5 ... Component mounting part, 5a ... Gap, 6 ... Area reduction part, 6a ... Notch, 6b ... Opening, 7 ... Terminal part, 8 ... Window hole, 9 ... Circuit part, 10 ... Contact part, 10a ... Contact protrusion, 11 ... Bending part, 12 ... Reinforcing plate, 13 ... Antenna element sheet, 14a, 14b ... Antenna element conductor, 14c ... Part Mounting part, 14d ... Terminal part, 15a, 15b ... Area reduction part, 16 ... Resin film, 16a ... Window hole, 17 ... Impedance component, 18 ... Printed circuit board, 19 ... Ground conductor layer, 20a, 20b, 20c ... Print Circuit board mounting parts, 21... Input / output terminal part.

Claims

A laminated conductor for component mounting having a component mounting portion for mounting a chip-shaped circuit component between the ends of a pair of strip conductors attached to a resin film,
A laminated conductor for component mounting, wherein an area reduced portion in which a width area of a conductor plane is partially reduced is formed in a vicinity of the strip conductor at a predetermined distance from the component mounting portion.

The laminated conductor for component mounting according to claim 1, wherein the strip-shaped conductor is formed by punching a conductive metal foil having a thickness exceeding 0.1 mm.

The laminated conductor for component mounting according to claim 1, wherein the resin film is formed of a heat resistant resin film.

The laminated conductor for component mounting according to any one of claims 1 to 3, wherein the area reduction portion is formed by notching a side edge portion in a width direction of the strip conductor.

The laminated conductor for component mounting according to any one of claims 1 to 3, wherein the area reduction portion is formed by opening a central portion in the width direction of the strip conductor.

The laminated conductor for component mounting according to any one of claims 1 to 5, wherein a contact portion or a terminal portion is directly formed at an end portion of the strip-shaped conductor opposite to the component mounting portion.

The laminated conductor for component mounting according to any one of claims 1 to 6, wherein a reinforcing plate is attached to a back surface side of the component mounting portion of the strip conductor.

8. The antenna component according to claim 1, wherein a chip-like impedance component is mounted between the end portions of the strip-shaped conductor.

9. The antenna component according to claim 8, wherein the chip-shaped impedance component is mounted in a plurality of parallel connections.