JP2006032389A - Methods of, and apparatuses for fixing and mounting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fixing method, a mounting method, a fixing apparatus and a mounting apparatus capable of highly precisely connecting a series of terminals of a flexible substrate equipped with wiring to a series of terminals on a display substrate. <P>SOLUTION: The method of fixing a flexible wiring board 14 having a wiring pattern 14P formed to a substrate mount 10 includes a step of providing the flexible wiring board 14 between a first magnetic force generating means 10 of the substrate mount 10 and a second magnetic force generating means 11 opposite to the first magnetic force generating means 10 to generate magnetic force between the first and second means 10 and 11, thereby fixing the flexible wiring board 14 to the substrate mount 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a fixing method, a mounting method, a fixing device, and a mounting device.

  In recent years, mainly in the field of portable electronic devices such as mobile phones, notebook personal computers, and PDAs (Personal data assistance), as the devices become lighter and thinner, the thickness of the built-in wiring board and the density of the wiring are increased. Is being promoted. Further, a technique using a COF (Chip On Film) substrate configured by connecting a driving IC on a flexible substrate is known.

As a method of connecting such a wiring board to a display body such as an LCD (Liquid Crystal Display) or an organic electroluminescence device, an anisotropic conductive film ACF (Anisotoroic Conductive) is provided between the terminal of the display body and the terminal of the wiring board. There is known a mounting technique in which a film is disposed and heated and pressed.
Recently, in mounting a wiring board, a technique for holding the flexible board using a support ring and a technique for fixing the flexible board by vacuum suction have been disclosed (for example, see Patent Documents 1 and 2).
Japanese Patent Laid-Open No. 9-82751 JP 2004-95747 A

However, as the number of terminal electrodes increases, the wiring density increases, or the terminal electrodes become denser, the positions of the terminal electrodes and the wiring patterns to be connected to each other shift in the wiring pattern of the substrate and the terminal electrode connecting portion. As a result, there is a problem that a short circuit occurs.
The present invention has been made to solve the above-described problems, and can connect the terminal row of the flexible substrate provided with wiring and the terminal row of the display substrate with high accuracy. An object is to provide a fixing method, a mounting method, a fixing device, and a mounting device.

The present inventor makes it easy to cause bending and undulation of the flexible substrate by reducing the thickness of the wiring pattern or reducing the thickness of the flexible substrate in order to achieve high definition and thinning. Found it difficult to do.
Furthermore, the thickness of the flexible substrate (for example, 50 to 75 μm in the past) is reduced to about 12 to 30 μm, and the thickness of the wiring pattern (for example, 25 to 20 μm in the past) is reduced to about 7 to 15 μm. As a result, the flexible substrate is more easily deformed, and it has been found that the conventional method cannot be mounted with high accuracy.

Also, when fixing the flexible board to the flexible board mounting base, if the flexible board is fixed by vacuum suction, a part of the flexible board is attracted to the suction hole, and the board is deformed to maintain the regular wiring pattern shape. It became impossible to do so, and it was found that the display terminal portion and the wiring pattern could not be aligned. Furthermore, it has been found that the flexible substrate is bent or wavy by the vacuum suction, and the connection position is shifted.
Therefore, the present inventor has come up with the present invention having the following means based on the above.

In other words, the fixing method of the present invention is a method of fixing a flexible wiring board on which a wiring pattern is formed to a substrate mounting table, and includes a first magnetic force generation means included in the substrate mounting table and the first magnetic force generation. The flexible circuit board is disposed between the second magnetic force generation means and the second magnetic force generation means, and generates the magnetic force between the first magnetic force generation means and the second magnetic force generation means. A flexible wiring board is fixed to the board mounting table.
If it does in this way, a flexible wiring board can be fixed to a substrate mounting base with the magnetic force which arises between the 1st magnetic force generation means and the 2nd magnetic force generation means.

Further, in the fixing method, the second magnetic force generation means has an elastic part on a side in contact with the flexible wiring board, the elastic part and the flexible wiring board are brought into contact, A flexible wiring board is fixed to the board mounting table.
Here, the elastic portion is one in which the flexible wiring board is not damaged by contact with the flexible wiring board.
If it does in this way, it can fix to a substrate mounting stand, without damaging a flexible wiring board.

Further, in the fixing method, the second magnetic force generation means has a convex portion facing the flexible wiring board, and the top of the convex portion and the flexible wiring board are brought into contact with each other. The flexible wiring board is fixed to the substrate mounting table by enlarging the contact area between the second magnetic force generating means and the flexible wiring board.
In this way, while expanding the contact area, by fixing the flexible wiring board to the substrate mounting table, the contact area increases from the top of the convex portion in the second magnetic force generation means toward the peripheral portion. Wrinkles, undulations, and deflections of the flexible wiring board can be removed. In other words, the gap that exists between the substrate mounting table and the flexible wiring board is gradually removed from the top of the convex portion toward the peripheral portion. Thereby, in a flexible wiring board, wrinkles, a wave | undulation, bending, a deformation | transformation, etc. can be reliably fixed to a board | substrate mounting base.

The fixing method is characterized in that one of the first magnetic force generating means and the second magnetic force generating means is a magnet and the other is a ferromagnetic material.
In this way, when the first magnetic force generation means is a magnet, the ferromagnetic material is employed as the second magnetic force generation means. Further, when the first magnetic force generation means is a ferromagnetic body, a magnet is employed as the second magnetic force generation means.

In the fixing method, the magnet is an electromagnet.
Here, the electromagnet can adjust the magnetic force according to the amount of current. Therefore, by using an electromagnet, the adhesive force between the flexible wiring board and the substrate mounting table can be adjusted according to the amount of current supplied to the electromagnet.

Further, the fixing method is characterized in that the flexible wiring board is fixed to the substrate mounting table by the suction force of the vacuum suction means of the substrate mounting table.
If it does in this way, a flexible wiring board can be fixed to a substrate mounting base. Therefore, not only the fixing by the first magnetic force generation means and the second magnetic force generation means but also the flexible wiring board can be fixed complementarily by the suction force of the vacuum suction means.

Further, the fixing method is characterized in that the suction force of the vacuum suction means is released when the convex part of the second magnetic force generation means comes into contact with the flexible wiring board.
Thus, by releasing the suction force of the vacuum suction means, the wrinkles of the flexible wiring board generated around the suction holes of the vacuum suction means are eliminated, and the flexible wiring board becomes flat. In this state, the convex portion of the second magnetic force generating means comes into contact with the flexible wiring board. Therefore, the flexible wiring board can be fixed to the substrate mounting table without causing wrinkles due to the suction force of the vacuum suction means.

The mounting method of the present invention is a method of mounting a flexible wiring board on which a wiring pattern is formed on a display body, and the flexible wiring board is fixed using the fixing method described above. A step of fixing the display body, a step of disposing anisotropic conductive particles or an anisotropic conductive film between a terminal of the display body and the flexible wiring board, and And heating and pressurizing the flexible wiring board to the terminal.
In this way, in the flexible wiring board in a state where bending, undulation, wrinkle, deformation, etc. are prevented, anisotropic conductive particles or anisotropic particles are formed between the terminals of the display body and the flexible wiring board. Therefore, the wiring pattern of the flexible wiring board and the terminal can be bonded with high accuracy.

The fixing device of the present invention is a device for fixing a flexible wiring board on which a wiring pattern is formed to a substrate mounting table, and the flexible wiring board is mounted using the fixing method described above. It is characterized by being fixed to the substrate mounting table.
If it does in this way, a flexible wiring board can be fixed to a substrate mounting base with the magnetic force which arises between the 1st magnetic force generation means and the 2nd magnetic force generation means.

The mounting device of the present invention is a device for mounting a flexible wiring board on which a wiring pattern is formed on a display body, the display body fixing means for fixing the display body, and a terminal of the display body. A heating and pressurizing unit for heating and pressurizing the flexible wiring board and the fixing device described above are provided.
In this way, the flexible wiring board, which is prevented from being bent, swelled, wrinkled, deformed or the like, is heat-bonded to the terminal of the display body, so that the wiring pattern and the terminal of the flexible wiring board can be accurately combined. Can be joined.

The best mode for carrying out the present invention will be described below with reference to the drawings.
In the drawings referred to below, the scales are appropriately changed in order to recognize each member and each layer.

(Film substrate fixing device)
First, a film substrate fixing device (device for fixing a flexible wiring substrate to a substrate mounting table) will be described with reference to FIG. FIG. 1 is a perspective view for explaining a film substrate fixing device.
As shown in FIG. 1, the fixing device 1 includes a substrate mounting table 10, a resin magnet 11, a resin magnet holding unit 12, and a decompression pump 13 as main components. The fixing device 1 temporarily fixes the film substrate (flexible wiring substrate) 14 by the suction and attraction force of the decompression pump 13 and at the same time, the film substrate 14 by the magnetic force acting between the substrate mounting table 10 and the resin magnet 11. Are closely fixed to the substrate mounting table 10.

Next, each component of the fixing device 1 will be described in detail.
The substrate mounting table 10 includes a ferromagnetic body made of a martensitic stainless material. And the said ferromagnetic material functions as a 1st magnetic force production | generation means of this invention, and fixes the film board | substrate 14 to the board | substrate mounting base 10 with the magnetic force which acts between resin magnets.
The ferromagnetic material may be a material that constitutes the substrate platform 10 itself, or may be a material that constitutes a part of the substrate platform 10. Further, when a part of the substrate mounting table 10 is a ferromagnetic material, it is preferable that the ferromagnetic material is provided in the vicinity of a contact portion between the substrate mounting table 10 and the film substrate 14.
Moreover, as a ferromagnetic material, you may employ | adopt another magnetic body, without limiting the said material.

  Further, the substrate mounting table 10 includes a plurality of suction holes (vacuum suction means) 15 at the contact portion with the film substrate 14. The suction hole 15 communicates with the decompression pump 13, and when the decompression pump 13 is driven, the film substrate 14 is attracted to the substrate mounting table 10 and temporarily fixed. In addition, the intake hole 15 is provided at a position where the resin magnet 11 does not overlap with a portion that holds the film substrate 14.

The resin magnet 11 is an elastic body (elastic portion) in which a magnet is contained in a resin material. The resin magnet 11 functions as the second magnetic force generation means of the present invention, and fixes the film substrate 14 to the substrate mounting table 10 by a magnetic force acting between the ferromagnetic material in the substrate mounting table 10. Is. Further, the resin magnet 11 has a convex portion 11 </ b> T directed toward the substrate mounting table 10. The convex portion 11T is bent and has a predetermined curvature.
The resin magnet 11 is provided in the resin magnet holding part 12. The resin magnet holding unit 12 includes a vertical drive mechanism such as a motor or an air cylinder, and moves the resin magnet 11 in the vertical direction of the substrate mounting table 10. Further, the resin magnet holding part 12 is driven and controlled by a control device (not shown).

  The decompression pump 13 is a vacuum suction means of the present invention, and sucks and temporarily fixes the film substrate 14 to the surface of the substrate mounting table 10 through the above-described suction holes. The decompression pump 13 is driven and controlled by a control device (not shown).

  Further, the film substrate 14 is a flexible wiring substrate built in various electronic devices, and has a high-density wiring pattern 14P and is thinned. In the present embodiment, the film substrate 14 has a material thickness of 25 μm and a wiring pattern thickness of 12 μm.

(Fixing method of film substrate)
Next, a method of fixing the film substrate (method of fixing the flexible wiring substrate to the substrate mounting table) will be described with reference to FIGS. 2 and 3 are side views for explaining a method of fixing the film substrate.
First, as shown in FIG. 2, the film substrate 14 is temporarily fixed on the substrate mounting table 10.
Specifically, after the film substrate 14 is placed on the substrate mounting table 10, the decompression pump 13 is driven, whereby the film substrate 14 is sucked from the plurality of suction holes 15 and temporarily fixed to the substrate mounting table 10. Is done. Thereafter, when the vertical drive mechanism provided in the resin magnet holding portion 12 is operated, the resin magnet 11 gradually approaches the substrate mounting table 10, and the convex portion 11 </ b> T of the resin magnet 11 contacts the film substrate 14. Here, the adsorption by the decompression pump 13 is released.

  Furthermore, as shown in FIG. 3, the resin magnet 11 and the substrate mounting table 10 are magnetically attracted when the resin magnet 11 approaches the substrate mounting table 10. Further, by such magnetic attraction, the contact area between the resin magnet 11 and the film substrate 14 gradually increases from the convex portion 11T toward both sides of the resin magnet 11, and the film substrate 14 is It is pinched by. Here, since the contact area gradually increases from the convex portion of the resin magnet 11 toward both sides, the gap between the film substrate 14 and the substrate mounting table 10 is pushed out toward both sides, and the film substrate 14 The substrate mounting table 10 is in close contact. By extruding the air gap, no air gap remains between the film substrate 14 and the substrate mounting table 10.

As described above, in the fixing method and the fixing device 1 of the film substrate 14 in the present embodiment, the film substrate 14 is fixed to the substrate mounting table 10 by the magnetic force acting between the substrate mounting table 10 and the resin magnet 11. be able to.
In addition, since the resin magnet 11 is formed of an elastic body on the side in contact with the film substrate 14, the film substrate 14 can be prevented from being damaged by the contact between the resin magnet 11 and the film substrate 14. Therefore, the film substrate 14 can be fixed to the substrate mounting table 10 without damaging it.

  Further, since the film substrate 14 is fixed to the substrate mounting base 10 while increasing the contact area between the resin magnet 11 and the film substrate 14, the film substrate is directed from the top of the convex portion 11T to the peripheral portion of the resin magnet 11. 14 wrinkles, swells, and deflections can be removed. In other words, the gap existing between the substrate mounting table 10 and the film substrate 14 is gradually removed from the top of the convex portion 11T toward the peripheral portion. Thereby, wrinkles, undulation, bending, deformation, etc. can be prevented, and the film substrate 14 can be securely fixed to the substrate mounting table 10.

Further, since the vacuum pump 13 temporarily fixes the film substrate 14 to the substrate mounting table 10, the film substrate 14 is complementarily mounted not only by the magnetic force adsorption between the resin magnet 11 and the substrate mounting table 10 but also by vacuum adsorption. It can be fixed to the mounting table 10.
Further, in the decompression pump 13, since the vacuum suction is released when the convex portion 11T of the resin magnet 11 comes into contact with the film substrate 14, the wrinkles of the film substrate 14 generated around the suction holes 15 due to the suction suction are eliminated. The film substrate 14 becomes flat. In this state, since the convex portion 11T of the resin magnet 11 contacts the film substrate 14, the film substrate 14 can be fixed to the substrate mounting table 10 without causing wrinkles due to the suction force of the decompression pump 13.

In the present embodiment, the magnetic force is generated between the ferromagnetic material on the substrate mounting table 10 side and the resin magnet 11 to bring the film substrate 14 into close contact with the substrate mounting table 10, but this is limited. It is not a thing. For example, even if the magnetic force is generated between the magnet provided on the substrate mounting table 10 side and the resinous ferromagnetic material arranged opposite to the magnet to bring the film substrate 14 into close contact with the substrate mounting table 10. Good.
Moreover, in this embodiment, you may employ | adopt the structure using an electromagnet as a magnet. Here, since the electromagnet can adjust the magnetic force according to the amount of current, the adhesion between the film substrate 14 and the substrate mounting table 10 can be adjusted according to the amount of current supplied to the electromagnet by using the electromagnet. The power can be adjusted.
In the present embodiment, the substrate mounting table 10 is provided with the intake holes 15 and the film substrate 14 is sucked from the intake holes 15. However, the present invention is not limited to this. For example, a so-called porous chuck may be employed in which a porous part is provided on the substrate mounting table 10 and the film substrate 14 is sucked from the porous part.

(Mounting device)
Next, the mounting apparatus of the present invention will be described.
FIG. 4 is a perspective view showing a schematic configuration of the mounting apparatus.
Since the mounting apparatus according to the present embodiment includes the above-described fixing device 1, the same reference numerals are given to the components in the fixing device 1 to simplify the description.

As shown in FIG. 4, the mounting device 50 includes a display body mounting table (display body fixing means) 51a for fixing the display body 20, a fixing device 1 for mounting the film substrate 14, and the display body mounting table 51a. The display body 20 and the film substrate 14 are configured by a head (heating and pressing means) 52 that heats and pressurizes the display body 20 and the film substrate 14.
Here, the display body mounting table 51 a is arranged to face the head 52 and is fixed to the mounting apparatus 50. In addition, the display body mounting table 51a is provided with an adsorption hole for adsorbing and fixing the display body 20 on its upper surface, and the display body 20 is fixed via the adsorption hole by driving the decompression pump. Yes.
Further, the fixing device 1 is movable in the Y-axis direction and the Z-axis direction in the drawing. Thereby, a part of the film substrate 14 placed on the fixing device 1 can be brought into contact with the terminal portion 21 of the display body 20. Further, as described above, the fixing device 1 includes the resin magnet 11 and the decompression pump 13, and has a plurality of intake holes 15 on the upper surface thereof.

The head 52 is a constant heat type head in which a heating mechanism such as a heater is provided. The head 52 can be set to any temperature within a temperature range of about 200 to 450 ° C. . The bottom surface of the head 52 is formed in a plane. It is preferable that a jig is attached to the bottom surface of the head 52 in order to make the shape of the contact surface variable according to the shape of the substrate connection structure to be manufactured. With this configuration, the contact surface can be set to a square shape, an elongated rectangular shape, or any other shape. The head 52 is attached to a support member 54 via a support column 53.
In addition, the movable shaft of the cylinder 55 is attached to the support member 54. The cylinder 55 is configured to be extendable in the Z-axis direction in the figure, and the axial direction is set in the vertical vertical direction. Accordingly, the support column 53 and the head 52 attached to the support member 54 are integrally moved in the vertical vertical direction by the extension operation of the cylinder 55. The cylinder 55 can apply a pressure of about 1 to 3.5 MPa to the head 52. Accordingly, the head 52 heats and heats the terminal portion of the display body 20 placed on the upper surface of the display body placement base 51a and the terminal portion of the film substrate 14 via an anisotropic conductive film (described later). It comes to press.

(Mounting structure)
Next, a mounting structure mounted by the mounting apparatus will be described.
5A and 5B are diagrams illustrating the mounting structure, in which FIG. 5A is a perspective view for explaining the positional relationship between the display body 20 and the film substrate 14, and FIG. 5B is a side view of the mounting structure. It is.
As shown in FIG. 5, the mounting structure has a structure in which a film substrate 14 is attached to a terminal 21 of a display body 20 via an anisotropic conductive film 22.

  Here, the display body 20 is configured to include the electro-optical element 20a on the substrate. The electro-optical element is a generic term including an element having an electro-optic effect that changes a light transmittance by changing a refractive index of a substance by an electric field, and an element that converts electric energy into optical energy. Examples of the display body including the electro-optical element 20a include a liquid crystal device including a liquid crystal layer, an organic EL device including an organic light emitting functional layer, an electrophoretic device including an electrophoretic display element, plasma emission, and electron emission. And a display device having fluorescence ability (for example, a substrate for PDP, FED, SED), and the like.

  Further, the film substrate 14 is positioned with high accuracy by the fixing device 1 and connected to the display body 20 as described above. The film substrate 14 is configured by forming a wiring pattern 14P by patterning a metal thin film such as Cu on a flexible base substrate 14a such as polyimide. In addition, although illustration is abbreviate | omitted, the film board | substrate 14 may have the structure which mounted not only the wiring pattern 14P but the semiconductor chip not shown, resistance, a capacitor | condenser, and other chip components.

The anisotropic conductive film 22 is an adhesive that can give anisotropy to the conductivity. Here, in the anisotropic conductive film 22, conductive particles (anisotropic conductive particles) 22b are dispersed in the adhesive resin 22a.
The adhesive resin 22a is made of a thermoplastic hot melt resin such as urethane or polyester, or a thermosetting resin such as epoxy.
The conductive particles 22b are made of metal particles such as copper, nickel, gold, and solder, or particles having a particle surface made of styrene resin or the like covered with a conductive layer such as nickel-gold.
Such an anisotropic conductive film 22 composed of the adhesive resin 22a and the conductive particles 22b can be used as necessary for a portion to be electrically connected by controlling the content, shape, size, etc. of the metal particles. When pressure is applied, the adhesive has conductivity in the thickness direction and retains insulation in the surface direction, and functions as an adhesive having anisotropic conductivity.

(Film substrate mounting method)
Next, a mounting method for manufacturing the mounting structure will be described.
In the present embodiment, the film substrate 14 is mounted on the display body 20 by using the mounting device 50 described above.
FIG. 6 is a diagram for explaining a mounting method of the flexible wiring board, and is a cross-sectional view of the mounting structure.
In addition, in the process of fixing the film substrate 14 in this embodiment, it demonstrates suitably with reference to FIG.

First, as shown to Fig.6 (a), the display body 20 is mounted and fixed on the display body mounting base 51a (process which fixes a display body). Further, the film substrate 14 is placed and fixed on the substrate mounting table 10 (step of fixing the flexible wiring substrate).
Specifically, as shown in FIG. 2, after the film substrate 14 is placed on the substrate platform 10, the decompression pump 13 is driven to suck the film substrate 14 from the plurality of suction holes 15. Temporarily fixed to the substrate mounting table 10. Thereafter, when the vertical drive mechanism provided in the resin magnet holding portion 12 is operated, the resin magnet 11 gradually approaches the substrate mounting table 10, and the convex portion 11 </ b> T of the resin magnet 11 contacts the film substrate 14. Here, the adsorption by the decompression pump 13 is released.

  Further, when the resin magnet 11 approaches the substrate mounting table 10, the resin magnet 11 and the substrate mounting table 10 are magnetically attracted. Further, by such magnetic attraction, the contact area of the resin magnet 11 and the film substrate 14 gradually increases from the convex portion 11T toward both sides of the resin magnet 11, and the film substrate 14 has the resin magnet 11 and the substrate mounting table 10 in contact with each other. It is pinched by. Here, since the contact area gradually increases from the convex portion of the resin magnet 11 toward both sides, the gap between the film substrate 14 and the substrate mounting table 10 is pushed out toward both sides, and the film substrate 14 The substrate mounting table 10 is in close contact. By extruding the air gap, no air gap remains between the film substrate 14 and the substrate mounting table 10.

Moreover, in the display body mounting base 51a, the display body 20 is attracted and fixed to the display body mounting base 51a by driving a decompression pump (not shown).
Further, the anisotropic conductive film 22 is pasted on the terminal 21 of the display body 20 (the step of arranging anisotropic conductive particles or anisotropic conductive film between the terminal of the display body and the flexible wiring board). ). Thereby, the anisotropic conductive film 22 covers all the terminals 21 formed on the display body 20.
Next, the fixing device 1 is moved in the Y-axis direction in the figure, and the positions of the display body 20 and the film substrate 14 are determined so that the wiring pattern 14P is positioned above the anisotropic conductive film 22. Further, the wiring pattern 14P is positioned with high accuracy with respect to each of the terminals 21.

Next, as shown in FIG. 6B, the fixing device 1 moves in the Z-axis direction, thereby bringing the wiring pattern 14P and the anisotropic conductive film 22 into contact with each other.
In this state, as shown in FIG. 6C, the cylinder 55 is extended and the head 52 is lowered. As the cylinder 55 extends, the terminal 21 of the display body 20 and the wiring pattern 14P of the film substrate 14 are heated and pressurized through the anisotropic conductive film 22 and connected (flexible to the terminal of the display body). Heating and pressurizing the conductive wiring board).

Such heating and pressurization are performed in a state where the temperature of the head 52 is adjusted to a temperature in the range of about 210 to 450 ° C. so that the temperature of the anisotropic conductive film 22 is about 150 to 230 ° C. . The cylinder 55 is set so that the pressure applied by the head 52 to the film substrate 14 and the like is about 1 to 3.5 MPa. The time for the head 52 to heat and press the film substrate 14 and the like is about 3 to 15 seconds.
Here, since the head 52 presses the film substrate 14 in the direction of the display body 20, anisotropy occurs between the wiring pattern 14 </ b> P formed on the film substrate 14 and the terminal 21 formed on the display body 20. Conductive particles 22b included in the conductive film 22 are deformed and sandwiched. In this state, the adhesive resin 22a is cured by the heat supplied to the anisotropic conductive film 22 by maintaining the degree of curing of the adhesive resin 22a until the curing temperature is reached. Therefore, the film substrate 14 is connected to the display body 20 in a state where the conductive particles 22b are deformed and sandwiched between the wiring pattern 14P and the terminal 21.

  When the above steps are completed, the cylinder 52 is first expanded and contracted to separate the head 52 from the film substrate 14. As described above, when the head 52 is separated, the temperature of the anisotropic conductive film 22 is lowered in a pressurized state. Thereby, the mounting of the display body 20 and the film substrate 14 is completed.

  As described above, in the mounting method and the mounting apparatus according to the present embodiment, since the mounting is performed with the film substrate 14 fixed using the fixing device 1 described in the previous embodiment, bending, undulation, wrinkle, The film substrate 14 in which deformation or the like is prevented can be heat-bonded to the terminal 21 of the display body 20, and the wiring pattern 14P of the film substrate 14 and the terminal 21 can be bonded with high accuracy.

(Electronics)
Next, a projection display device, which is a specific example of an electronic apparatus including the display body 20, will be described with reference to FIG. FIG. 7 is a schematic configuration diagram showing a main part of the projection display device. The projection display device includes the liquid crystal device according to the above-described embodiment as a light modulation unit.

  7, 810 is a light source, 813 and 814 are dichroic mirrors, 815, 816 and 817 are reflection mirrors, 818 is an incident lens, 819 is a relay lens, 820 is an exit lens, and 822, 823 and 824 are liquid crystal devices of the present invention. 825 is a cross dichroic prism, and 826 is a projection lens. The light source 810 includes a lamp 811 such as a metal halide and a reflector 812 that reflects the light of the lamp.

  The dichroic mirror 813 transmits red light contained in white light from the light source 810 and reflects blue light and green light. The transmitted red light is reflected by the reflection mirror 817 and is incident on the light modulation means 822 for red light. The green light reflected by the dichroic mirror 813 is reflected by the dichroic mirror 814 and is incident on the light modulating means 823 for green light. Further, the blue light reflected by the dichroic mirror 813 passes through the dichroic mirror 814. For blue light, in order to prevent light loss due to a long optical path, a light guide means 821 comprising a relay lens system including an incident lens 818, a relay lens 819, and an exit lens 820 is provided. Blue light is incident on the light modulating means 824 for blue light through the light guiding means 821.

The three color lights modulated by the respective light modulation means are incident on the cross dichroic prism 825. The cross dichroic prism 825 is formed by bonding four right-angle prisms. A dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in an X shape at the interface. Yes. These dielectric multilayer films combine the three color lights to form light representing a color image. The synthesized light is projected onto the screen 822 by the projection lens 826 which is a projection optical system, and the image is enlarged and displayed.
Thus, if the liquid crystal device 20 according to the above-described embodiment is used as the light modulation means 822, 823, and 824 of the projection display device, it is possible to provide a projection display device in which failures such as disconnection are suppressed.

Next, another specific example of the electronic apparatus including the display body 20 will be described.
The electronic device has the above-described liquid crystal device 20 as a display unit, and specifically, the one shown in FIG.
FIG. 8A is a perspective view showing an example of a mobile phone. In FIG. 8A, a mobile phone 1000 includes a display unit 1001 using the EL display device 1 described above.
FIG. 8B is a perspective view showing an example of a wristwatch type electronic device. In FIG. 8B, a timepiece 1100 includes a display unit 1101 using the EL display device 1 described above.
FIG. 8C is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 8C, the information processing apparatus 1200 includes an input unit 1201 such as a keyboard, a display unit 1202 using the EL display device 1 described above, and an information processing apparatus main body (housing) 1203.
Each of the electronic devices illustrated in FIGS. 8A to 8C includes the display units 1001, 1101, and 1202 each having the above-described liquid crystal device, so that an electronic device in which failure such as disconnection is suppressed is obtained.
Examples of other electronic devices include video cameras, personal computers, head mounted displays, fax machines with display functions, digital camera finders, portable TVs, DSP devices, PDAs, electronic notebooks, electronic bulletin boards, Monitors, advertising announcement displays, etc.

The perspective view for demonstrating the fixing apparatus of the film substrate in this invention. The side view for demonstrating the fixing method of the film board | substrate in this invention. The side view for demonstrating the fixing method of the film board | substrate in this invention. The perspective view which shows schematic structure of the mounting apparatus in this invention. The figure which shows the mounting structure mounted by the mounting apparatus in this invention. The figure for demonstrating the mounting method in this invention. The figure which shows schematic structure of the projection type display apparatus as an electronic device provided with the mounting structure. FIG. 14 illustrates an electronic device including a mounting structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fixing device 10 Substrate mounting base (first magnetic force generating means)
11 Resin magnet (second magnetic force generating means, elastic part)
11T Convex part 13 Pressure reduction pump (vacuum adsorption means)
14 Film substrate (flexible wiring substrate)
14P Wiring pattern 15 Air intake hole (Vacuum suction means)
20 Display body 21 Terminal 22 Anisotropic conductive film 22b Conductive particle (anisotropic conductive particle)
50 mounting apparatus 51a display body mounting table (display body fixing means)
52 head (heating and pressing means)

Claims (10)

A method of fixing a flexible wiring board on which a wiring pattern is formed to a substrate mounting table,
The flexible wiring board is disposed between the first magnetic force generating means of the substrate mounting table and the second magnetic force generating means facing the first magnetic force generating means,
By generating a magnetic force between the first magnetic force generating means and the second magnetic force generating means,
A fixing method comprising fixing the flexible wiring substrate to the substrate mounting table. The second magnetic force generation means has an elastic part on a side in contact with the flexible wiring board,
The fixing method according to claim 1, wherein the elastic portion and the flexible wiring substrate are brought into contact with each other to fix the flexible wiring substrate to the substrate mounting table. The second magnetic force generation means has a convex portion facing the flexible wiring board,
After the top of the convex portion and the flexible wiring board are brought into contact with each other, the contact area between the second magnetic force generating means and the flexible wiring board is expanded, thereby making the flexible wiring board The fixing method according to claim 1, wherein the fixing is performed on the substrate mounting table.   4. The fixing method according to claim 1, wherein one of the first magnetic force generation means and the second magnetic force generation means is a magnet, and the other is a ferromagnetic material. 5.   The fixing method according to claim 4, wherein the magnet is an electromagnet.   The fixing method according to any one of claims 1 to 5, wherein the flexible wiring board is fixed to the substrate mounting table by an adsorbing force of a vacuum suction means included in the substrate mounting table. When the convex portion of the second magnetic force generating means comes into contact with the flexible wiring board,
The fixing method according to claim 1, wherein the suction force of the vacuum suction means is released. A method of mounting a flexible wiring board on which a wiring pattern is formed on a display body,
Using the fixing method according to claim 1 to fix the flexible wiring board;
Fixing the display body;
Disposing anisotropic conductive particles or anisotropic conductive film between the terminals of the display body and the flexible wiring board;
Heating and pressurizing the flexible wiring board to the terminals of the display body;
The mounting method characterized by including. An apparatus for fixing a flexible wiring board on which a wiring pattern is formed to a substrate mounting table,
A fixing device that fixes the flexible wiring substrate to the substrate mounting table by using the fixing method according to claim 1. An apparatus for mounting a flexible wiring board on which a wiring pattern is formed on a display body,
Display body fixing means for fixing the display body;
Heating and pressurizing means for heating and pressurizing the flexible wiring board to the terminals of the display body;
A fixing device according to claim 9;
A mounting apparatus comprising:

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