JP2006026684A - Solder recovering method and its apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus that effectively reduces working time for recovering solder in the form of an ingot and that dispenses with the need of securing a wide area for the operation. <P>SOLUTION: The apparatus 1 is capable of recovering solid solder in the form of an ingot by solidifying, through forced air cooling, the fused solder taken out from a solder basin. This recovering apparatus 1 is equipped with: several molded containers (containers) 2 which is for pouring the fused solder in and which have a molded inner face so shaped that, when the posture is vertically inverted, the solid solder solidified in the containers is released from them; a forced air cooling means 7 which is designed to be able to blow off an air flow from a fan to the outer face of the containers and to the surface of the solder therein; a molded container holding mechanism which can nearly horizontally hold the containers and which can rotate the containers in the manner of taking the vertically inverted posture all together; and a recovering box 13 which receives the ingot of the solid solder released from the containers. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method and apparatus for recovering solder from the inside of a solder tank, and more particularly, to a novel apparatus capable of efficiently performing work for solidifying molten solder and recovering it as an ingot, and a method for using the apparatus.

  Generally, an operation of collecting solder from the solder tank is performed for replacement of the solder in the solder tank or maintenance and inspection of the solder tank. Conventionally, this collection operation has been performed as follows. A necessary number of containers (for example, bats) for putting molten solder are prepared in advance on the floor near the solder tank. Then, the molten solder in the solder tank is poured into each container using, for example, a metal handle. Then, it is left to stand until the solder in the container is cooled and solidified. When the solder is solidified, each container is manually punched one by one and recovered as a flat solid solder. The collected solder is subjected to quality inspection such as impurity analysis, and the solder of the accepted product is reused.

  However, usually 300 kg of molten solder is contained in the solder tank, so in the conventional technique in which the molten solder transferred into the container is simply left until it is solidified and can be removed from the mold, all the molten solder is removed. It takes a long time to recover, usually several hours. Moreover, since a large number of containers containing high-temperature molten solder are placed on the floor of the workplace, it is not only necessary to secure a large area of the workplace, but there is a risk that workers may burn and get burned. For example, it was not a preferable method from the viewpoint of safety. Further, the floor on which the container is placed may be damaged due to deformation of the solder or melting. Under such circumstances, there has been a demand for a technique for efficiently and safely collecting solder in the solder tank as an ingot, but no such technique has been proposed so far.

The present invention provides a solder recovery method and apparatus capable of solidifying molten solder in a solder tank and recovering it as an ingot efficiently, in a short time and safely, and with a small work area. To do.
The first invention is
It is an apparatus that can solidify molten solder taken out from a solder tank by forced air cooling, and collect solid solder in the form of an ingot,
A container into which the molten solder is poured, and when the posture is turned upside down, several mold containers having a mold inner surface in which the solid solder solidified in the container is removed from the mold;
Forced air cooling means designed to allow an air flow from a fan to be blown against the outer surface of the several mold containers and the solder surface within the mold containers;
A mold container support mechanism that can hold the several mold containers substantially horizontally and can rotate the mold containers together so as to be turned upside down;
The present invention relates to a solder recovery apparatus including a recovery box for receiving an ingot of solid solder that has been unmolded from the several mold containers.
The second invention is
The forced air cooling means is
A blowout fan that is disposed on one side of several mold containers held substantially horizontally and blows an air flow against the several mold containers;
Each of the several mold containers is formed by forming fins on the outer surface from one side of the mold container to the opposite side along the longitudinal direction.
The apparatus of the first invention is characterized in that several mold containers and solder in the mold containers can be forcibly cooled by an air flow flowing from one side to the other side of several mold containers. About.
The third invention is
The forced air cooling means is
A blow-out fan, which is arranged on one side of several mold containers held almost horizontally and blows an air flow against the several mold containers;
A suction fan disposed on the opposite side of the several mold containers for sucking an air flow into the several mold containers;
The apparatus according to the first invention is characterized in that several mold containers and solder in the mold containers can be forcibly cooled by an air flow flowing from one side to the other side of some mold containers.
The fourth invention is
The several mold containers each have fins formed on the outer surface thereof, and the apparatus according to the first invention.
The fifth invention is
Each of the several mold containers is characterized in that fins are formed on the outer surface along the direction of airflow flowing from one side to the other side of the mold container, respectively. .
The sixth invention is
The mold container support mechanism is
A support frame for rotatably supporting the several mold containers;
A stopper capable of stopping the rotation of the several mold containers and holding them almost horizontally;
The first invention is characterized in that when the restraint by the stopper is released, the several mold containers are rotated together by their own weights so as to be turned upside down. Relating to the device.
In a seventh aspect of the present invention, the support frame body is provided with a support shaft that rotatably supports the several mold containers on a surface that is substantially the same as a surface on which the several mold containers are arranged. The present invention relates to an apparatus according to the sixth invention.
The eighth invention is
The mold container support mechanism is
A support frame that rotatably supports the mold containers together;
A rotation mechanism for rotating the support frame so that the several mold containers are vertically inverted together;
The apparatus according to the first aspect of the present invention comprises a control mechanism capable of controlling the rotation of the several mold containers and holding them substantially horizontally.
The ninth invention
The several mold containers are related to the apparatus according to the first invention, characterized in that a measuring line is formed on the inner surface of the mold so that a predetermined weight of molten solder can be poured.
The tenth invention is
The several mold containers are made of a plurality of kinds of materials different depending on the type of molten solder to be poured, and the several mold containers are detachable from the mold container support mechanism. The present invention relates to a device according to the first invention.
The eleventh invention is
Further, the present invention relates to the apparatus according to the first aspect of the invention, characterized by comprising a pumping means for taking out the molten solder from the solder tank.
The twelfth invention is
Comprising at least two sets of the mold containers, the forced cooling means and the mold container support mechanism;
The molten solder taken out from the solder tank is poured into several mold containers, and then the molten solder in the mold containers is solidified by forced air cooling, and then the several mold containers are turned upside down together. According to the first aspect of the invention, it is configured to be able to alternately or simultaneously perform a series of operations of turning and collecting solid solder that has been solidified and removed. Relates to the device.
The thirteenth invention of the present invention is
An injection stage in which molten solder taken out of the solder tank is poured into several mold containers held in a substantially horizontal posture;
A solidification stage in which the molten solder in the several mold containers is solidified by forced air cooling;
A solder recovery method comprising: a recovery step of removing the solid solder solidified in the mold container and recovering it by rotating the several mold containers together so as to have an upside down posture. About.
The fourteenth invention
The method according to the thirteenth invention is characterized in that the forced air cooling is performed by a method in which an air flow from a fan is blown to an outer surface of some mold containers and a solder surface in the mold containers. .
The fifteenth invention
The method according to the thirteenth invention is characterized by being performed using the apparatus according to any one of the first to twelfth inventions.

In the first aspect of the invention, by providing a device for solidifying the molten solder taken out from the solder tank by forced air cooling and collecting it as a solid solder ingot, it is possible to efficiently and quickly collect the solder. This has the advantage that the work area can be reduced. That is, the apparatus is a container into which molten solder is poured, and when the posture is turned upside down, several mold containers having a mold inner surface in which the solid solder solidified in the container is removed from the mold are used. Yes. As a result, the solidification and mold release of the solder can be easily performed for several containers at once, so that the work can be completed in a short time. In addition, the device also employs forced air cooling means designed to allow the air flow from the fan to be blown against the outer surfaces of several mold containers and the solder surfaces within the mold containers. It is possible to solidify the solder quickly, so that the recovery operation can be completed in a short time. In addition, the apparatus is provided with a mold container support mechanism that can hold several mold containers substantially horizontally and can rotate the mold containers together so as to be turned upside down. Accordingly, it is possible to solidify the solder together for several containers at once, and the recovery operation can be performed efficiently and in a short time. Furthermore, the apparatus is provided with a collection box for receiving solid solder ingots that have been unmolded from several mold containers, and the collected ingots can be collected in one place, so the occupied area is small, Therefore, the work area can be reduced.
In the second invention, the forced air cooling means includes a blow-out fan that is disposed on one side of several mold containers that are held substantially horizontally and blows an air flow to the several mold containers. Each of the mold containers is formed by forming fins on the outer surface along the longitudinal direction from one side of the mold container to the opposite side, so that the air flow is guided to the fins. The solder in the container can be efficiently air-cooled.
According to a third aspect of the present invention, the forced cooling means is provided on one side of several mold containers that are held almost horizontally, and a blow-out fan that blows an air flow to the several mold containers, With a suction fan that is arranged on the opposite side of the mold containers and sucks the air flow into the mold containers, the air flow from one side of the mold containers to the other side is more stable. Supplied. Thus, forced cooling can be performed, so that the mold container and the solder in the mold container can be air-cooled more efficiently as a whole.
In the fourth invention, since some of the mold containers are each formed with fins on the outer surface thereof, the air flow can be guided without waste, and thereby the mold containers can be forcibly cooled efficiently.
At this time, as in the fifth invention, when the fins are formed along the direction of the air flow flowing from one side to the other side of several mold containers, the mold containers are more efficiently distributed over the entire mold containers. Can be forced to cool.
In the sixth invention, the mold container support mechanism includes a support frame body that rotatably supports several mold containers, and the rotation of the several mold containers is restrained to hold them almost horizontally. And when the restraint by the stopper is released, the several mold containers are rotated together so as to be turned upside down by their own weight. Yes. With such a configuration, the operation of moving several mold containers from a horizontal holding posture to a vertically inverted posture is smoothly performed. As in the seventh aspect, the support frame has a support shaft that rotatably supports several mold containers on a surface that is substantially the same as the surface on which the several mold containers are arranged. With this configuration, the turning radius of the mold container around the support shaft is reduced, the centrifugal force is suppressed, and the turning is more easily stopped.
The eighth invention relates to another aspect of the mold container support mechanism, and includes a support frame body that rotatably supports several mold containers together, and the several of the mold containers by rotation of the support frame body. A rotation mechanism that allows the mold containers to be turned upside down together, and a control mechanism that can control the rotation of the several mold containers and hold them almost horizontally. . With such a configuration, it is possible to automatically control the turning operation for turning up and down some mold containers and the restraining operation of the turning, and the upside down and the restraining thereof are made more reliable and easy.
According to the ninth invention, some of the mold containers are formed with a measuring line on the inner surface of the mold, so that a predetermined weight of molten solder can be poured. Therefore, a solid solder ingot having a predetermined weight, for example, the same weight as a commercially available product of solid solder can be produced.
In the tenth invention, the several mold containers are made of a plurality of types made of different materials depending on the type of molten solder to be poured, and the several mold containers are attached to and detached from the mold container support mechanism. By being flexible, the mold container can be exchanged according to the type and composition of the solder to be collected, and thus an ingot product that matches the required quality of the solid solder can be produced.
In the eleventh aspect of the present invention, the molten solder can be easily transferred from the solder tank to the mold container by providing a pumping means for taking out the molten solder from the solder tank.
In a twelfth aspect of the invention, there are provided at least two sets of equipment comprising several mold containers, the forced cooling means and the mold container support mechanism, and several pieces of molten solder taken out from the solder bath are provided. After pouring into the mold container, the molten solder in the mold container is solidified by forced air cooling, and then the several mold containers are rotated together so that they are in an upside down posture. Since the series of operations of removing the mold and collecting it can be performed alternately or simultaneously, the solder collecting operation can be performed more efficiently.
The solder recovery method according to the thirteenth invention includes an injection stage in which molten solder taken out from the solder tank is poured into several mold containers held in a substantially horizontal posture, and forced air cooling. A solidification step for solidifying the molten solder in the mold container, and rotating the several mold containers together so as to be upside down, thereby releasing the solid solder solidified in the mold container. And a recovery stage for recovery. By such a method, the operation of solidifying the molten solder in the solder tank and recovering it as an ingot can be performed efficiently, in a short time and safely, and the work area can be reduced. Further, in this method, as a fourteenth invention, forced air cooling is performed by a method of blowing an air flow from a fan to the outer surface of several mold containers and the solder surface in the mold containers. The solder in the mold container is efficiently cooled.

In the present invention, the recovery of the molten solder in the solder tank is performed by pouring the molten solder from the solder tank into several mold containers and forcibly cooling and solidifying the molten solder in the several mold containers. Subsequently, the solid solder thus solidified is removed from the mold container and recovered as an ingot. The solder recovery apparatus of the present invention is used in such a process, and solid solder can be recovered in the form of an ingot by solidifying the molten solder taken out from the solder tank by forced air cooling. The solder recovery apparatus is usually configured by including several mold containers, forced air cooling means, a mold container support mechanism, and a recovery box.

  Some mold containers into which molten solder is poured are generally rectangular parallelepiped containers with an open top surface. However, if there is no problem in handling the device, the outer shape may be close to a cube or others. It may be of the shape. Usually, 2 to 12 mold containers are provided per apparatus, and 4 to 8 mold containers are preferably used from the viewpoint of work efficiency. With respect to the inner surfaces of some of these mold containers, it is required to have a mold inner surface from which solidified solder can be easily removed from the viewpoint of shortening the working time. Since the mold release is performed by reversing the posture of the mold container, specifically, the shape of the inner surface of the mold is a shape that allows the solid solder to escape from the mold by its own weight. Examples of such a shape include a shape in which the inner surface of the mold expands from the bottom to the top of the mold container. It is desirable that some of these mold containers have a structure in which such an air flow contacts efficiently in order to forcibly cool the solder on the inner surface by the air flow. For example, it is a preferred embodiment that some mold containers each have fins formed on the outer surface thereof. More preferably, each of several mold containers is an aspect in which fins are formed on the outer surface along the direction of airflow flowing from one side of the mold container to the opposite side. In this case, the pitch at which the fins are formed is preferably 5 to 20 mm from the viewpoint of efficiently passing air. In addition, in some of these mold containers, a measurement line may be formed on the inner surface of the mold so that a predetermined amount of molten solder can be poured. Furthermore, in response to the recent circumstances in which the quality standards for the solder used are strictly set, each type of container may contain a small amount of other types of solder collected in the collected solder. In order to prevent this, it is more preferable to prepare a plurality of different materials according to the quality of the molten solder to be poured. In this case, because of the necessity of exchanging the mold containers according to the type of solder, the mold containers can be attached to and detached from the mold container support mechanism that holds them. As a means for attaching and detaching the mold container to the mold container support mechanism, the mold container is securely attached so that it does not come off from the mold container support mechanism when the mold container is turned upside down. Such means should be selected, and examples thereof include screws and screw holes or bolts and nuts.

  On the other hand, the forced cooling means is means for forcibly cooling the solder in some mold containers to promote solidification, and the air flow from the fan is changed to the outer surface of some mold containers and in the mold containers. It is designed so that it can be sprayed on the solder surface. In view of the fact that hot solder can be forcibly cooled, the air flow is usually used at a temperature lower than that of the solder, for example at ambient temperature, and of course lower temperatures may be used. . The forced air cooling means needs to be provided with at least a blower fan for blowing an air flow, and such a blower fan is arranged on one side of several mold containers held almost horizontally. Of course, the forced air cooling means may be further provided with a suction fan that sucks the blown air flow opposite to the blower fan on the opposite side of the several mold containers. That is, the forced air cooling means preferably includes the above-described blowing fan and the above-described suction fan, and the several mold containers and the solder in the mold containers by the air flow flowing from one side to the other side of the several mold containers. Is a mode that can be forcibly cooled. As a result, a stable air flow is generated from one side of each mold container to the opposite side, so that the mold containers and the solder in the mold containers can be effectively cooled throughout. It is preferable from the viewpoint of the cooling effect that the forced cooling fans are normally used at a rate of one set per one or two mold containers.

Of the configuration of the apparatus, the mold container support mechanism plays a role of supporting the above-described mold container so that the mold container can be turned upside down. The mold container support mechanism has a structure in which several mold containers can be held so as to be substantially horizontal, and the mold containers can be rotated together so as to be turned upside down. That is, the mold container support mechanism prevents the mold container from rotating unnecessarily during the operation of pouring the molten solder into the mold container, and when removing the solid solder solidified in the container, a plurality of mold containers are used. It is devised to rotate at the same time and collect the solid solder together. A preferable configuration of the mold container support mechanism is that the mold container support mechanism includes a support frame body that rotatably supports several mold containers, and the rotation of the several mold containers is restrained so that they are almost A stopper that can be held horizontally is provided, and when the restraint by the stopper is released as necessary, the several mold containers are rotated together so as to be turned upside down by their own weight. It is a configuration. Further, when several mold containers are rotated, in order to suppress the centrifugal force by making the rotating radius smaller, and to make the restraining by the stopper easy and reliable, there are several support frames. A support shaft for rotatably supporting the mold containers is provided on a surface substantially the same as the surface on which the several mold containers are arranged. Further, as another aspect of the mold container support mechanism, there may be mentioned one provided with a support frame, a rotation mechanism, and a control mechanism, which can automatically control the upside down of the mold container and its restraint. In other words, the support frame supports several mold containers together so as to be rotatable, and the rotation mechanism causes the mold containers to be turned upside down together by the rotation of the support frame. The pivoting and control mechanism controls the pivoting of the several mold containers and can hold them approximately horizontal. One set of mold container support mechanisms is usually used for 2 to 6 mold containers, and preferably one set for 4 mold containers.

  The collection box receives an ingot of solid solder that has been unmolded from several mold containers, and may be integrated with or separate from the apparatus. For example, when the collection box is integrated with the apparatus, one having a drawer structure with respect to the apparatus can be used. In the case of a separate body, for example, if the collection box is equipped with a carriage, the collection box itself can be easily extracted from the apparatus.

  The solder recovery apparatus of the present invention may further include a pumping means for taking out the molten solder from the solder tank. As the drawing-up means, one that can be easily handled by an operator and can secure safety for the purpose of drawing up high-temperature molten solder is suitably selected. For example, a container with a handle such as a metal handle is preferable. Ordinarily, after the molten solder has been pumped out, it is used for subsequent pouring into the mold container. It is still preferred because the amount is accurate.

  The solder recovery apparatus of the present invention can be provided with a plurality of sets of equipment including several mold containers, forced cooling means, and the mold container support mechanism. As a result, the molten solder taken out from the solder tank is poured into several mold containers, and then the molten solder in the mold containers is solidified by forced air cooling, and then the several mold containers are turned upside down together. It is possible to perform a series of operations such as rotating in such a manner that the solid solder is recovered after being released from the mold, alternately or simultaneously for each set of equipment. This improves the efficiency of the solder recovery operation. In the apparatus of the present invention, two to four sets, more preferably two sets of such equipment are provided.

  The present invention also relates to a solder recovery method. That is, the method of the present invention includes a pouring step in which molten solder taken out from a solder tank is poured into several mold containers held in a substantially horizontal posture, and melting in the mold containers by forced air cooling. A solidification step for solidifying the solder, and a recovery step for removing the solid solder solidified in the mold container and recovering it by rotating the several mold containers together so as to be upside down. It has. Preferably, the forced air cooling is performed by a method in which an air flow from a fan is blown to the outer surface of several mold containers and the solder surface in the mold containers.

  Hereinafter, although an example of the method of collect | recovering solder | solder using the solder collection | recovery apparatus of this invention is demonstrated, it should not be interpreted as limiting this invention.

Example 1
In this embodiment, the solder recovery apparatus 1 shown in FIG. 1 is used.
The device 1 has a substantially box shape when viewed as a whole, and has no complicated shape. This is also because it is designed so that the operator can easily handle the device 1 in consideration of moving the device 1 close to the solder tank. And the apparatus 1 equips the upper part with the mold container 2 which pours a solder (refer FIG. 2 (a) and (b)). Each mold container 2 is designed so that the inner surface of the mold has a shape extending from the bottom surface toward the upper part. And the fin 3 is formed in the outer surface of each type | mold container 2 from the one side of the longitudinal direction of the type | mold container 2 to the other side, ie, along the direction of the airflow which flows on an outer surface. Further, a measuring line 4 is formed on the inner surface of the mold so that a predetermined weight of molten solder can be poured into the mold container 2. Each mold container 2 is made of an aluminum casting, and is fixed to the mold container support mechanism 5 on which they are supported by bolts and nuts through holes 6.
The forced air cooling means 7 in the apparatus 1 has two blower fans 8 for blowing an air flow to the set of four mold containers 2 on one side of the set of four mold containers 2 held almost horizontally. And two suction fans 9 for sucking an air flow with respect to the set of four mold containers 2 on the opposite side of the set of four mold containers 2. Two sets are arranged corresponding to the container 2 (see FIG. 1). In this embodiment, the suction fan 9 is provided. However, these suction fans are not necessarily provided and may be arbitrary.
On the other hand, two sets of mold container support mechanisms 5 are used (see FIG. 3), and four mold containers 2 are held for each set. Each mold container support mechanism 5 has a support frame 10 that rotatably supports a set of four mold containers 2, and the four mold containers 2 are prevented from rotating so that they are substantially horizontal. A stopper 11 (not shown) that can be held by the stopper 11 is provided, and when the restraint by the stopper 11 is released as necessary, the four mold containers 2 are vertically inverted together by their own weight. The structure which rotates is adopted. Further, the support frame 10 is provided with a support shaft 12 that rotatably supports the four mold containers 2 on a surface that is substantially the same as the surface on which the four mold containers 2 are arranged.
A recovery box 13 is provided from a substantially central portion to a lower portion of the apparatus 1 so that the solid solder ingot removed from the mold container 2 can be received and accommodated. A handle 14 is formed in the collection box 13, and the collection box 13 itself can be pulled out of the apparatus 1 with the handle 14.

Next, a solder recovery procedure using the apparatus 1 will be described.
The four blowing fans 8 and the suction fans 9 were respectively driven to generate an air flow from the blowing fan 8 side of the eight mold containers 2 toward the suction fan 9 side. Thereafter, this air flow was continuously generated until all the solder recovery operations were completed. Next, the molten solder 16 is taken out from the solder tank using a chrome-plated iron handle as the drawing means 15, and as shown in FIG. 4, the molten solder 16 is attached to one of the four mold containers 2. Poured into one of them. At this time, the molten solder 16 was put up to the measuring line 4 on the inner surface of the mold of the mold container 2. After the molten solder 16 has been put into the remaining three mold containers of the same set, the molten solder 16 was similarly poured into the other set of four mold containers 2 (see FIG. 5). . When all of the two sets of eight mold containers 2 have been filled with the molten solder 16, the solder in one of the four sets of the mold containers 2 previously filled with the molten solder 16 is already cooled and solidified by the air flow. Was. Therefore, the stopper 11 of the mold container support mechanism 5 is released, and as shown in FIG. 6, the lever 17 connected to the support shaft 12 is pulled, and the set of four mold containers 2 is turned upside down to form an ingot. The solid solder was removed from the set of four mold containers 2 at once. As a result, as shown in FIG. 7, the solid solder 18 that was out of shape was stored in the collection box 13. Subsequently, the set of four mold containers 2 after the solder was removed from the mold was returned to the position before being turned upside down, and the molten solder was newly poured into the four mold containers 2. At this time, since the solder in the other set of four mold containers 2 has solidified, by rotating the set of four mold containers and turning upside down, the ingot-shaped solid solder can be turned at once. The mold was removed and recovered. Thereafter, the other set of four mold containers was returned to the original posture, and a new soldering operation was performed. After the above operation was completed, the solder in one of the four mold containers 2 was solidified at this point, so that the mold was removed in the same manner to obtain solid solder. Thereafter, by repeating this process, that is, a process of pouring molten solder into the mold container, a process of solidifying the molten solder in the mold container, and a process of recovering the solidified solder by removing it from the mold, a set of equipment (In the apparatus 1, it consists of a set of four mold containers 2, a set of forced cooling means 7, and a set of mold container support mechanisms 5) and another set of equipment, Alternately. As a result, the time required to complete the collection of all the solder in the solder tank can be dramatically reduced as compared with the conventional method.

Example 2
In this embodiment, a solder recovery method using the solder recovery apparatus 19 according to another aspect of the present invention shown in FIG. 8 will be described. The configuration of the solder recovery device 19 is as follows.
As shown in FIG. 8, a total of 16 pans as the mold containers 2 are used in the solder collection device 19, and these mold containers 2 are made up of four groups, and four sets. Each set of mold containers 2 is held by a mold container support mechanism 20. As shown in the cross-sectional view of FIG. 9, the mold container support mechanism 20 includes four support frame bodies 21 arranged so that the frame forms each side of a square, and a motor and control mechanism 23 ( The support frame 21 supports all 16 mold containers 2 together so as to be rotatable, and the rotation mechanism 22 is rotated by the support frame 21 so that the 16 The mold containers 2 are turned upside down together, and the control mechanism 23 can control the rotation of the 16 mold containers and hold them almost horizontally. Further, the mold container 2 is rotated around a rotation shaft 24 connected to the rotation mechanism 22 together with the support frame body 21 that supports the mold container 2. In addition, in the solder collection | recovery apparatus 19, as shown in FIG. 9, one large blowing fan 25 is provided in the longitudinal direction of the container 2 as a forced cooling means.

Next, a solder recovery method using the solder recovery apparatus 19 will be described.
First, the blower fan 25 was driven to generate an air flow from one side to the opposite side in the longitudinal direction of the eight mold containers 2. Thereafter, this air flow was continuously generated until all the solder recovery operations were completed. Next, the molten solder was taken out from the solder tank using a chrome-plated iron handle as a drawing means, and poured into a set of four mold containers 2. When the molten solder in these mold containers is solidified, the rotating mechanism 22 is driven and rotated by an angle of 90 degrees around the rotating shaft 24, so that a set of four mold containers 2 containing solder is removed. A horizontal orientation was set, and the next adjacent set of four mold containers 2 was set to a horizontal position. Then, molten solder was poured into a set of four mold containers 2 in the horizontal position. After confirming that it was solidified, the rotation mechanism 22 was driven and rotated by an angle of 90 degrees, and the next set of four mold containers 2 was moved to the horizontal position. At this time, the set of four mold containers 2 into which the solder is first poured is in an upside down position from the position when the molten solder is poured, and the already solidified solder is released from the mold four at a time. And was accommodated in the collection box 13 as an ingot. Thereafter, molten solder was poured into a set of four mold containers 2 moved to the horizontal position. Thereafter, the same operation was repeated, and the time required to recover all the molten solder in the solder bath could be significantly shortened compared to the conventional method.

It is a mimetic diagram showing one mode of the solder recovery device of the present invention. (A) is a schematic diagram of a type | mold container, (b) is a cross-sectional schematic diagram in the AA of (a). It is a schematic diagram which shows the type | mold container upside down. It is a schematic diagram which shows the process of pouring molten solder into a type | mold container. It is a schematic diagram which shows the process of cooling a type | mold container by a forced air cooling means. It is a schematic diagram which shows the process of rotating a mold container and turning upside down. It is a schematic diagram which shows the process of collect | recovering ingot-shaped solid solder. It is a schematic diagram which shows another aspect of the solder collection | recovery apparatus of this invention. It is a cross-sectional schematic diagram in the BB line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 19 Solder collection | recovery apparatus 2 type | mold container 3 fin 4 measuring line 5, 20 type | mold container support mechanism 6 hole 7 forced air cooling means 8, 25 blower fan 9 suction fan 10, 21 support frame 11 stopper 12 support shaft 13 collection box 14 Handle 15 Pumping means 16 Melting solder 17 Lever 18 Solid solder 22 Rotating mechanism 23 Control mechanism 24 Rotating shaft

Claims (15)

It is an apparatus that can solidify molten solder taken out from a solder tank by forced air cooling, and collect solid solder in the form of an ingot,
A container into which the molten solder is poured, and when the posture is turned upside down, several mold containers having a mold inner surface in which the solid solder solidified in the container is removed from the mold;
Forced air cooling means designed to allow an air flow from a fan to be blown against the outer surface of the several mold containers and the solder surface within the mold containers;
A mold container support mechanism that can hold the several mold containers substantially horizontally and can rotate the mold containers together so as to be turned upside down;
A solder recovery device comprising a recovery box for receiving an ingot of solid solder that has been unmolded from the several mold containers. The forced air cooling means is
A blowout fan that is disposed on one side of several mold containers held substantially horizontally and blows an air flow against the several mold containers;
Each of the several mold containers is formed by forming fins on the outer surface from one side of the mold container to the opposite side along the longitudinal direction.
The apparatus according to claim 1, wherein several mold containers and solder in the mold containers can be forcibly cooled by an air flow flowing from one side to the other side of some mold containers. The forced air cooling means is
A blow-out fan, which is arranged on one side of several mold containers held almost horizontally and blows an air flow against the several mold containers;
A suction fan disposed on the opposite side of the several mold containers for sucking an air flow into the several mold containers;
The apparatus according to claim 1, wherein several mold containers and solder in the mold containers can be forcibly cooled by an air flow flowing from one side to the other side of some mold containers. 2. The apparatus according to claim 1, wherein each of the plurality of mold containers is formed with fins on an outer surface thereof. 4. The apparatus according to claim 3, wherein each of the plurality of mold containers is formed with fins on the outer surface thereof along a direction of airflow flowing from one side of the mold container to the opposite side. The mold container support mechanism is
A support frame for rotatably supporting the several mold containers;
A stopper capable of stopping the rotation of the several mold containers and holding them almost horizontally;
2. The structure according to claim 1, wherein when the restraint by the stopper is released, the plurality of mold containers are configured to rotate together in a vertically inverted posture by their own weight. apparatus. The support frame is characterized in that a support shaft for rotatably supporting the several mold containers is provided on a surface substantially the same as a surface on which the several mold containers are arranged. The apparatus of claim 6. The mold container support mechanism is
A support frame that rotatably supports the mold containers together;
A rotation mechanism for rotating the support frame so that the several mold containers are vertically inverted together;
The apparatus according to claim 1, further comprising a control mechanism capable of controlling the rotation of the several mold containers and maintaining them substantially horizontally. 2. The apparatus according to claim 1, wherein the several mold containers are formed with measuring lines on the inner surface of the mold so that a predetermined weight of molten solder can be poured. The several mold containers are made of a plurality of kinds of materials different depending on the type of molten solder to be poured, and the several mold containers are detachable from the mold container support mechanism. The device of claim 1, characterized in that: 2. The apparatus according to claim 1, further comprising pumping means for taking out the molten solder from the solder tank. Comprising at least two sets of the mold containers, the forced cooling means and the mold container support mechanism;
The molten solder taken out from the solder tank is poured into several mold containers, and then the molten solder in the mold containers is solidified by forced air cooling, and then the several mold containers are turned upside down together. The apparatus according to claim 1, wherein a series of operations of rotating and collecting solid solder that has been solidified so as to be removed and recovered can be performed alternately or simultaneously. . An injection stage in which molten solder taken out of the solder tank is poured into several mold containers held in a substantially horizontal posture;
A solidification stage in which the molten solder in the several mold containers is solidified by forced air cooling;
A solder recovery method comprising: a step of recovering the solid solder solidified in the mold container by removing the mold by rotating the mold containers together so as to be in an upside down posture together; . 14. The method according to claim 13, wherein the forced air cooling is performed by a method in which an air flow from a fan is blown to the outer surface of several mold containers and a solder surface in the mold containers. 14. A method according to claim 13, characterized in that it is performed using the device according to any one of claims 1-12.

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