JP2006019416A - Circuit original substrate, circuit substrate module manufacturing method and electronic clock - Google Patents

Circuit original substrate, circuit substrate module manufacturing method and electronic clock Download PDF

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JP2006019416A
JP2006019416A JP2004194269A JP2004194269A JP2006019416A JP 2006019416 A JP2006019416 A JP 2006019416A JP 2004194269 A JP2004194269 A JP 2004194269A JP 2004194269 A JP2004194269 A JP 2004194269A JP 2006019416 A JP2006019416 A JP 2006019416A
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circuit
circuit board
tape
circuit pattern
component
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Yuichi Shino
裕一 篠
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Seiko Instruments Inc
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Seiko Instruments Inc
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Priority to JP2004194269A priority Critical patent/JP2006019416A/en
Priority to SG200504119A priority patent/SG118418A1/en
Priority to CN 200510080980 priority patent/CN1716135A/en
Publication of JP2006019416A publication Critical patent/JP2006019416A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the material cost of a tape type flexible circuit original substrate employed for the manufacture of a circuit substrate for a clock. <P>SOLUTION: Circuit substrate forming units 11L, 11R having circuit pattern units 12L, 12R and a common component arranging hole 14, are formed on the tape type flexible circuit original substrate 10 systematically in left-and-right two rows in the lengthwise direction thereof. The neighbored left-and-right circuit substrate forming units 11L, 11R are in the arrangement relation of point symmetry with each other and the common component arranging hole 14 is formed at the intermediate position of the circuit substrate forming units 11L, 11R. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、回路パターン部と部品配置孔とを有する回路基板形成部が長手方向に左右２列に整然と形成された時計用回路基板の製造に用いられるテープ状フレキシブル回路元基板に関する。また、本発明は、回路パターン部と部品配置孔とを有する回路基板形成部が長手方向に左右２列に整然と形成されたテープ状フレキシブル回路元基板の製造工程と、テープ状フレキシブル回路元基板の回路パターン部に電気部品を実装する工程と、テープ状フレキシブル回路元基板から電気部品が実装された回路パターン部を切り離して回路基板モジュールを形成する回路基板分離工程とを含む時計用回路基板モジュールの製造方法に関する。   The present invention relates to a tape-shaped flexible circuit base board used for manufacturing a timepiece circuit board in which circuit board forming parts having a circuit pattern part and component arrangement holes are regularly formed in two rows on the left and right in the longitudinal direction. The present invention also provides a tape-shaped flexible circuit base board manufacturing process in which circuit board forming portions having a circuit pattern portion and component placement holes are regularly formed in two rows on the left and right in the longitudinal direction; A circuit board module for a watch comprising: a step of mounting an electrical component on a circuit pattern portion; and a circuit board separation step of forming a circuit board module by separating the circuit pattern portion on which the electrical component is mounted from a tape-like flexible circuit base board. It relates to a manufacturing method.

時計のムーブメントには、地板や各種の歯車などの機械部品と電気部品が組み込まれている。電気部品には、回路基板、水晶振動子、ＩＣチップ、コイル体などが含まれる。これらの部品は数百もの多さであり、且つサイズはセンチメートル単位のものからミリメートル単位のものまである。従って、時計のムーブメントの製造は、自動化ラインで効率よく行われている。
時計のムーブメントの自動化製造の流れは、例えば特開２００３−２８３０９６号公報（特許文献１）の図６に示されている如く、長尺のテープ状フレキシブル板に搬送用スロット、基板取り付け孔、水晶振動子を配置するための部品配置孔などをプレスの打ち抜き加工によって孔開けし、その後にテープ状フレキシブル板の表面上に銅箔などを貼り付け、公知のフォトリソグラフィ技術を適用して、所定の回路パターン部並びにメッキリード部を含む導体パターンを形成する。次に、上記回路パターン部の表面にメッキリード部を用いてAuなどの電解メッキを施す。その後、メッキリード部の配線経路を打ち抜いてなる切断孔を形成することによって個々の回路パターン部を電気的に分離する。ここまでの工程を経て、長尺のテープ状フレキシブル回路元基板が完成する。
上述の如く、長尺のテープ状フレキシブル回路元基板の製造ラインには、プレス工程、回路パターン作製工程、メッキ工程を含むものである。そして、長尺のテープ状フレキシブル回路元基板の製造ラインの入口には送り側リールが、出口には受け側リールが設置されている。送り側リールに巻回されている長尺のテープ状フレキシブル板は、テープ送り装置によって所定長さだけ間欠的に搬送され、プレス機で打ち抜き加工がなされ、回路パターン形成ラインで回路パターンの形成がなされ、メッキラインでメッキが施される。 従って、受け側リールに巻き取られるときは、長尺のテープ状フレキシブル板には、複数列の所定の回路パターンと所定の打ち抜き加工がなされている。そして、受け側リールに全て巻き取られたときには、長尺のテープ状フレキシブル回路元基板が完成している。
完成された長尺のテープ状フレキシブル回路元基板はリールに巻回されたまま、次の部品実装ラインにセットされ、搬送装置によって所定長さだけ間欠的に搬送される。部品実装ラインでは長尺のテープ状フレキシブル回路元基板の回路パターン上にＩＣチップを実装し、ＩＣチップと回路パターン部との導電接続に問題がないか否かの電気的接続検査が行われる。そして異常がなければ、ＩＣチップをモールドする。更に、水晶振動子が上記部品配置孔の内部に配置されるように、水晶振動子の端子を上記回路パターンに実装し、その後、水晶振動子が正常に発振するか否かの確認、水晶振動子の発振周波数の調整、及び、回路基板全体の電気的検査が行われる。
部品実装ラインからはプレスラインに搬送される。即ち、プレスラインでは、上記回路パターン部をプレスの打ち抜きによって抜き落とし、回路基板モジュールを完成する。ここで、回路基板モジュールとは、回路基板に水晶振動子とＩＣチップが既に実装されたモジュールのことである。この回路基板モジュールは、地板や各種の歯車などの機械部品などと共に時計のムーブメント内に組み込まれる。
ここで、図３を参照して従来の長尺のテープ状フレキシブル回路元基板２０の構造、及びこの長尺のテープ状フレキシブル回路元基板２０を用いた回路基板モジュールの製造方法について説明する。即ち、図３は、回路基板形成部２１Ｌと回路基板形成部２１Ｒが長手方向に左右２列にして整然と形成された従来のテープ状フレキシブル回路元基板２０の一部分を示す。回路基板形成部２１Ｌは、回路パターン部２２Ｌと部品配置孔２４Ｌを有する。回路基板形成部２１Ｒは、回路パターン部２２Ｒと部品配置孔２４Ｒを有する。回路パターン部２２Ｌには回路基板取付け孔２３Ｌが、回路パターン部２２Ｒには回路基板取付け孔２３Ｒがそれぞれ形成されている。更に、テープ状フレキシブル回路元基板２０には、両側の端部に搬送用スロット２５Ｌと２５Ｒが形成されている。図から明らかなように、隣り合う左右の回路基板形成部２１Ｌと２１Ｒは、相互に点対称の配置関係にある。
この従来の長尺のテープ状フレキシブル回路元基板２０を用いた回路基板モジュールの製造方法は、次の通りである。完成された長尺のテープ状フレキシブル回路元基板２０はリールに巻回されたまま、部品実装ラインにセットされ、搬送装置によって所定長さだけ間欠的に搬送される。部品実装ラインではテープ状フレキシブル回路元基板２０の片側、例えば図の右側に整然と形成されている回路パターン部２２Ｒ上にＩＣチップを実装する。更に、水晶振動子が部品配置孔２４の内部に配置されるように、水晶振動子の端子を回路パターン部２２上に実装する。
テープ状フレキシブル回路元基板２０の右側に形成されている全ての回路パターン部２２ＲへのＩＣチップの実装と、水晶振動子の端子の回路パターン部２２Ｒへの実装が完了すると、部品実装ラインからプレスラインに搬送される。プレスラインでは、テープ状フレキシブル回路元基板２０の右側に形成されている全ての回路パターン部２２Ｒがプレスによって抜き落とされ、ここにテープ状フレキシブル回路元基板２０の右側を利用した回路基板モジュールが完成する。同時に、右側の回路パターン部２２Ｒが全て抜き落とされたテープ状フレキシブル回路元基板２０はリールに巻き取られている。このようにして、テープ状フレキシブル回路元基板２０の右側を利用した回路基板モジュールの製造が終了する。
続いて、リールに巻き取られている右側の回路パターン部２２Ｒが全て抜き落とされたテープ状フレキシブル回路元基板２０は、その左側を利用した回路基板モジュールの製造に供される。即ち、テープ状フレキシブル回路元基板２０の左側に形成されている全ての回路パターン部２２ＬへのＩＣチップの実装と、水晶振動子の端子の回路パターン部２２Ｌへの実装、及びプレスラインでの左側に形成されている全ての回路パターン部２２Ｌのプレスによる打ち抜きを経て、テープ状フレキシブル回路元基板２０の左側を利用した回路基板モジュールが完成する。このようにして、テープ状フレキシブル回路元基板２０の左右を順に利用した回路基板モジュールの製造が終了する。 The movement of the watch incorporates mechanical and electrical components such as the main plate and various gears. Electrical components include circuit boards, crystal resonators, IC chips, coil bodies, and the like. These parts are hundreds in size and sizes range from centimeters to millimeters. Therefore, the movement of a watch movement is efficiently performed on an automated line.
For example, as shown in FIG. 6 of Japanese Patent Application Laid-Open No. 2003-283096 (Patent Document 1), the flow of automated manufacturing of a watch movement includes a long tape-like flexible plate, a transport slot, a substrate mounting hole, and a quartz crystal. A part placement hole for placing the vibrator is punched by press punching, and then a copper foil or the like is pasted on the surface of the tape-like flexible board, and a predetermined photolithography technique is applied to A conductor pattern including a circuit pattern portion and a plating lead portion is formed. Next, electrolytic plating of Au or the like is performed on the surface of the circuit pattern portion using a plating lead portion. Thereafter, the individual circuit pattern portions are electrically separated by forming a cut hole formed by punching the wiring path of the plating lead portion. Through the steps so far, a long tape-shaped flexible circuit base substrate is completed.
As described above, a production line for a long tape-shaped flexible circuit base substrate includes a pressing process, a circuit pattern manufacturing process, and a plating process. A feeding reel is installed at the entrance of the production line for the long tape-shaped flexible circuit base substrate, and a receiving reel is installed at the exit. The long tape-shaped flexible board wound around the feed-side reel is intermittently conveyed by a predetermined length by a tape feeder, punched by a press, and a circuit pattern is formed on a circuit pattern forming line. Made and plated at the plating line. Therefore, when wound on the receiving reel, a long tape-shaped flexible plate is subjected to a plurality of rows of predetermined circuit patterns and a predetermined punching process. When all of the tape is wound around the receiving reel, a long tape-shaped flexible circuit base substrate is completed.
The completed long tape-shaped flexible circuit base substrate is set on the next component mounting line while being wound around the reel, and is intermittently conveyed by a predetermined length by the conveying device. In the component mounting line, an IC chip is mounted on a circuit pattern of a long tape-shaped flexible circuit base board, and an electrical connection inspection is performed to determine whether there is a problem in the conductive connection between the IC chip and the circuit pattern portion. If there is no abnormality, the IC chip is molded. In addition, the crystal resonator terminals are mounted on the circuit pattern so that the crystal resonator is placed inside the component placement hole, and then whether or not the crystal resonator oscillates normally is confirmed. Adjustment of the oscillation frequency of the child and electrical inspection of the entire circuit board are performed.
It is conveyed from the component mounting line to the press line. That is, in the press line, the circuit pattern portion is removed by punching to complete a circuit board module. Here, the circuit board module is a module in which a crystal resonator and an IC chip are already mounted on the circuit board. This circuit board module is incorporated in a timepiece movement together with mechanical parts such as a base plate and various gears.
Here, with reference to FIG. 3, the structure of the conventional long tape-shaped flexible circuit base substrate 20 and the manufacturing method of the circuit board module using this long tape-shaped flexible circuit base substrate 20 are demonstrated. That is, FIG. 3 shows a part of a conventional tape-shaped flexible circuit base substrate 20 in which the circuit board forming part 21L and the circuit board forming part 21R are formed in order in two rows on the left and right in the longitudinal direction. The circuit board forming part 21L has a circuit pattern part 22L and a component arrangement hole 24L. The circuit board forming portion 21R includes a circuit pattern portion 22R and a component arrangement hole 24R. A circuit board mounting hole 23L is formed in the circuit pattern portion 22L, and a circuit board mounting hole 23R is formed in the circuit pattern portion 22R. Further, the tape-like flexible circuit base substrate 20 is formed with transfer slots 25L and 25R at both ends. As is apparent from the figure, the adjacent left and right circuit board forming portions 21L and 21R are in a point-symmetric arrangement relationship with each other.
The manufacturing method of the circuit board module using this conventional long tape-shaped flexible circuit base board 20 is as follows. The completed long tape-shaped flexible circuit board 20 is set on a component mounting line while being wound around a reel, and is intermittently conveyed by a predetermined length by a conveying device. In the component mounting line, an IC chip is mounted on a circuit pattern portion 22R that is regularly formed on one side of the tape-like flexible circuit base board 20, for example, the right side of the drawing. Further, the terminals of the crystal resonator are mounted on the circuit pattern portion 22 so that the crystal resonator is disposed inside the component placement hole 24.
When the mounting of the IC chip on all the circuit pattern portions 22R formed on the right side of the tape-shaped flexible circuit base substrate 20 and the mounting of the terminals of the crystal resonator on the circuit pattern portion 22R are completed, the component mounting line is pressed. Conveyed to the line. In the press line, all circuit pattern portions 22R formed on the right side of the tape-shaped flexible circuit base board 20 are removed by pressing, and a circuit board module using the right side of the tape-shaped flexible circuit base board 20 is completed here. To do. At the same time, the tape-shaped flexible circuit base substrate 20 from which all the right circuit pattern portion 22R has been removed is wound on a reel. In this way, the manufacture of the circuit board module using the right side of the tape-shaped flexible circuit base board 20 is completed.
Subsequently, the tape-like flexible circuit base substrate 20 from which all the right circuit pattern portion 22R wound around the reel is removed is used for manufacturing a circuit board module using the left side. That is, the mounting of the IC chip on all the circuit pattern portions 22L formed on the left side of the tape-shaped flexible circuit base substrate 20, the mounting of the crystal resonator terminals on the circuit pattern portion 22L, and the left side in the press line A circuit board module using the left side of the tape-like flexible circuit base board 20 is completed through punching of all the circuit pattern portions 22L formed in the above by pressing. In this way, the manufacture of the circuit board module using the left and right sides of the tape-shaped flexible circuit base board 20 in order is completed.

上述の如く、時計のムーブメントに組み込まれる回路基板モジュールは、自動製造ラインで効率よく製造されているが、製造コストの更なる低減が求められている。
特開２００３−２８３０９６号公報 As described above, the circuit board module incorporated in the movement of the watch is efficiently manufactured on the automatic manufacturing line, but further reduction in manufacturing cost is required.
JP 2003-283096 A

本発明が解決しようとする第１の課題は、回路パターン部と部品配置孔とを有する回路基板形成部が長手方向に左右２列に整然と形成された回路元基板であって、隣り合う左右の回路基板形成部が相互に点対称の配置関係にあるテープ状フレキシブル回路元基板を用いた回路基板モジュールの製造コストを低減することである。本発明が解決しようとする第２の課題は回路元基板の素材コストを低減することである。   A first problem to be solved by the present invention is a circuit base board in which circuit board forming portions having a circuit pattern portion and component placement holes are regularly formed in two columns on the left and right sides, and adjacent left and right circuit boards. It is to reduce the manufacturing cost of a circuit board module using a tape-like flexible circuit base board in which circuit board forming portions are in a point-symmetric arrangement relationship with each other. The second problem to be solved by the present invention is to reduce the material cost of the circuit board.

本発明に係る回路元基板は、配線が形成されている回路パターン部と、前記配線と結合する電子素子を逃がす部品配置孔とを有する回路基板形成部を備え、前記回路基板形成部は、長手方向に左右２列に整然と形成されており、隣り合う左右の前記回路基板形成部は前記部品配置孔を中間に配置し共用化して形成されていることを特徴とする。前記部品配置孔は長手方向に対し斜めにして形成されている。   A circuit board according to the present invention includes a circuit board forming portion having a circuit pattern portion on which wiring is formed and a component placement hole for releasing an electronic element coupled to the wiring, and the circuit board forming portion has a longitudinal shape. The left and right circuit board forming portions adjacent to each other are formed in an orderly manner with the component arrangement holes arranged in the middle. The component arrangement hole is formed obliquely with respect to the longitudinal direction.

また、本発明に係る回路元基板は、ポリイミドを素材としたテープ状フレキシブルな形状であってもよい。   The circuit board according to the present invention may have a tape-like flexible shape made of polyimide.

また、本発明に係る回路基板モジュールの製造方法は、回路パターン部と部品配置孔とを有する回路基板形成部が長手方向に左右２列に整然と形成された上記の回路元基板における左右の前記回路基板形成部のうちのいずれか一方の前記回路基板形成部の前記部品配置孔に電気部品を配置して前記回路パターン部に実装するステップと、前記いずれか一方の回路基板形成部の前記回路パターン部を前記回路元基板から切り離すステップと、前記回路元基板における左右の前記回路基板形成部のうちの他方の前記回路基板形成部の前記部品配置孔に前記電気部品を配置して前記回路パターン部に実装するステップと、前記他方の回路基板形成部の前記回路パターン部を前記回路元基板から切り離すステップと、有する。   The circuit board module manufacturing method according to the present invention includes a circuit board forming portion having a circuit pattern portion and a component arrangement hole, which is formed on the left and right sides of the circuit base board in the longitudinal direction. Placing an electrical component in the component placement hole of one of the circuit board forming portions of the substrate forming portion and mounting the component on the circuit pattern portion; and the circuit pattern of the one of the circuit board forming portions. Separating the circuit part from the circuit board, and arranging the electrical component in the component placement hole of the other circuit board forming part of the circuit board forming part on the left and right sides of the circuit board, and the circuit pattern part. And the step of separating the circuit pattern part of the other circuit board forming part from the circuit base board.

そして、本発明に係る電子時計は、前記時刻を計数し、上記の回路元基板から切り取られた回路基板を有する時刻計数部と、前記時刻計数部で計測された状態を表示するため駆動するに駆動部と、前記駆動部によって時刻を表示する表示部を有する。   The electronic timepiece according to the invention counts the time and is driven to display a time counting unit having a circuit board cut out from the circuit base board and a state measured by the time counting unit. A driving unit; and a display unit for displaying time by the driving unit.

本発明により、テープ状フレキシブル回路元基板の幅を従来の３０％ほど縮小できたので、素材コストを低減することができた。また、本発明により、テープ状フレキシブル回路元基板を用いた回路基板モジュールの製造コストの低減が図られ、その結果、時計のムーブメントの低価格化も実現した。
According to the present invention, the width of the tape-like flexible circuit base substrate can be reduced by about 30% of the conventional one, so that the material cost can be reduced. Further, according to the present invention, the manufacturing cost of the circuit board module using the tape-like flexible circuit base board can be reduced, and as a result, the price of the movement of the watch can be reduced.

本発明に係る時計用回路基板モジュールの製造に用いられるテープ状フレキシブル回路元基板は、回路パターン部と部品配置孔とを有する回路基板形成部が長手方向に左右２列に整然と形成されたテープ状フレキシブル回路元基板であって、隣り合う左右の回路基板形成部が相互に点対称の配置関係にあるテープ状フレキシブル回路元基板において、隣り合う左右の回路基板形成部は部品配置孔を中間に配置し共用化して形成されている。   The tape-shaped flexible circuit base board used for manufacturing the circuit board module for a watch according to the present invention is a tape-shaped circuit board forming portion having a circuit pattern portion and a component arrangement hole formed in an orderly manner in two rows on the left and right. A flexible circuit base board, in which the left and right circuit board forming parts are in a point-symmetric arrangement with each other, the adjacent left and right circuit board forming parts are arranged with component placement holes in the middle. It is formed by sharing.

部品配置孔を共用化して構成した実施例１の時計用回路基板モジュールの製造に用いられる長尺のテープ状フレキシブル回路元基板１０は、図１に示す如く、左側に回路パターン部１２Ｌと共用の部品配置孔１４とをそれぞれ有する回路基板形成部１１Ｌが、右側に回路パターン部１２Ｒと共用の部品配置孔１４とをそれぞれ有する回路基板形成部１１Ｒが、長手方向に左右２列にして整然と形成されたものである。回路パターン部１２Ｌには回路基板取付け孔１３Ｌが、回路パターン部１２Ｒには回路基板取付け孔１３Ｒがそれぞれ形成されている。更に、テープ状フレキシブル回路元基板１０には、両側の端部に搬送用スロット１５Ｌ，１５Ｒが形成されている。
図から明らかなように、隣り合う左右の回路基板形成部１１Ｌと１１Ｒは、相互に点対称の配置関係にある。また、隣り合う左右の回路基板形成部１１Ｌと１１Ｒは部品配置孔１４を中間に配置し共用化して形成されている。共用の部品配置孔１４は略長方形であって長手方向に対し斜めにして形成されている。
図１に示す長尺のテープ状フレキシブル回路元基板１０は、次のような方法で製作される。先ず、素材となるポリイミドの長尺のテープ状フレキシブル板に搬送用スロット１５Ｌと１５Ｒ、回路基板取付け孔１３Ｌと１３Ｒ、水晶振動子を配置するための部品配置孔１４をプレスの打ち抜き加工によって孔開けする。続いて、上記テープ状フレキシブル板の表面上に銅箔などを貼り付け、公知のフォトリソグラフィ技術を適用して、所定の回路パターン部並びにメッキリード部を含む導体パターンを形成する。次に、上記回路パターン部の表面にメッキリード部を用いてAuなどの電解メッキを施す。上述の工程を経て、長尺のテープ状フレキシブル回路元基板１０が完成する。
図３に示す従来のテープ状フレキシブル回路元基板と比較すれば明らかな如く、部品配置孔を共用化して構成した本発明に係るテープ状フレキシブル回路元基板は、従来よりも幅が３０％ほど縮小されている。左右それぞれに必要だった部品配置孔を共用化したので、部品配置孔１個分のスペースを節約できたのである。このため、本発明に係るテープ状フレキシブル回路元基板１０の素材費は著しく削減された。
次に、部品配置孔を共用化して構成した本発明に係る長尺のテープ状フレキシブル回路元基板１０を用いた回路基板モジュールの製造方法を、図２を参照して説明する。図２（ａ）に示す如き長尺のテープ状フレキシブル回路元基板１０はリールに巻回されたまま、部品実装ラインにセットされ、搬送装置によって所定長さだけ間欠的に搬送される。部品実装ラインではテープ状フレキシブル回路元基板１０の右側に整然と形成されている回路パターン部１２Ｒ上にＩＣチップ１６を実装する。更に、水晶振動子１７が部品配置孔１４の内部に配置されるように、水晶振動子１７の端子を回路パターン部１２Ｒに実装する。
図２（ｂ）は、右側に形成されている全ての回路パターン部１２ＲへのＩＣチップ１６の実装と、水晶振動子１７の端子の回路パターン部１２Ｒへの実装が完了した長尺のテープ状フレキシブル回路元基板１０を示す。即ち、片側実装が完了した状態の長尺のテープ状フレキシブル回路元基板１０を示す。
続いて、片側実装が完了した長尺のテープ状フレキシブル回路元基板１０は部品実装ラインからプレスラインに搬送される。プレスラインでは、テープ状フレキシブル回路元基板１０の右側に形成されている全ての回路パターン部１２Ｒがプレスの打ち抜きによって抜き落とされる。抜き落とされた個々の回路パターン部１２Ｒには、ＩＣチップ１６と水晶振動子1７がそれぞれ実装されており、打ち抜きと同時に個々の回路基板モジュールが完成する。また、右側の回路パターン部１２Ｒが全て抜き落とされたテープ状フレキシブル回路元基板１０はリールに巻き取られている。このようにして、テープ状フレキシブル回路元基板１０の右側を利用した回路基板モジュールの製造が終了する。
図２（ｃ）は、右側に形成されている全ての回路パターン部１２Ｒがプレスの打ち抜きによって抜き落とされた長尺のテープ状フレキシブル回路元基板１０を示す。図２（ｃ）から明らかなごとく、長尺のテープ状フレキシブル回路元基板１０には、共用の部品配置孔１４が残されている。
更に続いて、リールに巻き取られている右側の回路パターン部１２Ｒが全て抜き落とされたテープ状フレキシブル回路元基板１０は、その左側に形成されている全ての回路基板形成部１１Ｌを利用した回路基板モジュールの製造に供される。即ち、リールに巻き取られている右側の回路パターン部１２Ｒが全て抜き落とされたテープ状フレキシブル回路元基板１０は部品実装ラインにセットされ、搬送装置によって所定長さだけ間欠的に搬送される。部品実装ラインではテープ状フレキシブル回路元基板１０の左側に整然と形成されている回路パターン部１２Ｌ上にＩＣチップ１６を実装する。更に、水晶振動子１７が共用の部品配置孔１４の内部に配置されるように、水晶振動子１７の端子を回路パターン部１２Ｌに実装する。
図２（ｄ）は、左側に形成されている全ての回路パターン部１２ＬへのＩＣチップ１６の実装と、水晶振動子１７の端子の回路パターン部１２Ｌへの実装が完了した長尺のテープ状フレキシブル回路元基板１０を示す。即ち、残りの片側実装が完了した状態の長尺のテープ状フレキシブル回路元基板１０を示す。
最後に、残りの片側実装が完了した長尺のテープ状フレキシブル回路元基板１０は部品実装ラインからプレスラインに搬送される。プレスラインでは、テープ状フレキシブル回路元基板１０の左側に形成されている全ての回路パターン部１２Ｌがプレスの打ち抜きによって抜き落とされる。抜き落とされた個々の回路パターン部１２Ｌには既にＩＣチップ１６と水晶振動子１７がそれぞれ実装されており、打ち抜きと同時に個々の回路基板モジュールが完成する。また、左側の回路パターン部１２Ｌが全て抜き落とされたテープ状フレキシブル回路元基板１０はリールに巻き取られている。このようにして、テープ状フレキシブル回路元基板１０の左側を利用した回路基板モジュールの製造が終了し、従って、部品配置孔を共用化して構成した本発明に係る長尺のテープ状フレキシブル回路元基板１０を用いた回路基板モジュールの製造が全て完了する。
図２（ｅ）は、左右に形成されている全ての回路パターン部１２Ｌと１２Ｒがプレスの打ち抜きによって抜き落とされた長尺のテープ状フレキシブル回路元基板１０を示す。即ち、部品配置孔を共用化して構成したテープ状フレキシブル回路元基板１０の使用済みの状態を示す。 As shown in FIG. 1, the long tape-shaped flexible circuit base board 10 used for manufacturing the timepiece circuit board module of Example 1 configured by sharing the component arrangement holes is shared with the circuit pattern portion 12L on the left side. A circuit board forming portion 11L having component placement holes 14 is formed, and a circuit board forming portion 11R having a circuit pattern portion 12R and a common component placement hole 14 on the right side is formed in two rows in the longitudinal direction. It is a thing. A circuit board mounting hole 13L is formed in the circuit pattern portion 12L, and a circuit board mounting hole 13R is formed in the circuit pattern portion 12R. Further, the tape-like flexible circuit base substrate 10 is formed with transfer slots 15L and 15R at both ends.
As is apparent from the figure, the adjacent left and right circuit board forming portions 11L and 11R are in a point-symmetric arrangement relationship with each other. Further, the adjacent left and right circuit board forming portions 11L and 11R are formed by arranging the component arrangement holes 14 in the middle and using them in common. The common component arrangement hole 14 is substantially rectangular and is formed obliquely with respect to the longitudinal direction.
The long tape-shaped flexible circuit base substrate 10 shown in FIG. 1 is manufactured by the following method. First, slots 15L and 15R for conveyance, circuit board mounting holes 13L and 13R, and component placement holes 14 for placing crystal resonators are punched in a long tape-like flexible plate made of polyimide as a material by punching a press. To do. Subsequently, a copper foil or the like is attached on the surface of the tape-like flexible plate, and a known photolithography technique is applied to form a conductor pattern including a predetermined circuit pattern portion and a plating lead portion. Next, electrolytic plating of Au or the like is performed on the surface of the circuit pattern portion using a plating lead portion. The long tape-shaped flexible circuit base substrate 10 is completed through the above-described steps.
As apparent from the comparison with the conventional tape-shaped flexible circuit base board shown in FIG. 3, the tape-shaped flexible circuit base board according to the present invention configured by sharing the component arrangement holes is reduced by about 30% in width. Has been. Since the component placement holes needed for the left and right were shared, the space for one component placement hole could be saved. For this reason, the material cost of the tape-shaped flexible circuit base substrate 10 according to the present invention has been significantly reduced.
Next, a method for manufacturing a circuit board module using the long tape-shaped flexible circuit base board 10 according to the present invention configured by sharing the component arrangement holes will be described with reference to FIG. A long tape-shaped flexible circuit base substrate 10 as shown in FIG. 2A is set on a component mounting line while being wound around a reel, and is intermittently conveyed by a predetermined length by a conveying device. In the component mounting line, the IC chip 16 is mounted on the circuit pattern portion 12R that is regularly formed on the right side of the tape-shaped flexible circuit base substrate 10. Further, the terminals of the crystal unit 17 are mounted on the circuit pattern portion 12R so that the crystal unit 17 is arranged inside the component arrangement hole 14.
FIG. 2B shows a long tape shape in which the mounting of the IC chip 16 on all the circuit pattern portions 12R formed on the right side and the mounting of the terminals of the crystal resonator 17 on the circuit pattern portion 12R are completed. 1 shows a flexible circuit board 10. That is, the long tape-like flexible circuit base substrate 10 in a state where the one-side mounting is completed is shown.
Subsequently, the long tape-shaped flexible circuit original substrate 10 on which the one-side mounting is completed is conveyed from the component mounting line to the press line. In the press line, all circuit pattern portions 12R formed on the right side of the tape-shaped flexible circuit base substrate 10 are removed by punching. An IC chip 16 and a crystal resonator 17 are mounted on the individual circuit pattern portions 12R that are removed, and individual circuit board modules are completed simultaneously with the punching. Further, the tape-shaped flexible circuit base substrate 10 from which all the circuit pattern portion 12R on the right side has been removed is wound around a reel. In this way, the manufacture of the circuit board module using the right side of the tape-shaped flexible circuit base board 10 is completed.
FIG. 2C shows the long tape-shaped flexible circuit base substrate 10 in which all the circuit pattern portions 12R formed on the right side are removed by punching. As is clear from FIG. 2C, the common component placement hole 14 remains in the long tape-shaped flexible circuit base board 10.
Subsequently, the tape-like flexible circuit base board 10 from which all the circuit pattern part 12R on the right side wound on the reel has been removed is a circuit using all the circuit board forming parts 11L formed on the left side thereof. It is used for the manufacture of substrate modules. That is, the tape-like flexible circuit base board 10 from which all the right circuit pattern portion 12R wound on the reel is removed is set on the component mounting line and is intermittently conveyed by a predetermined length by the conveying device. In the component mounting line, the IC chip 16 is mounted on the circuit pattern portion 12L that is regularly formed on the left side of the tape-shaped flexible circuit base substrate 10. Furthermore, the terminals of the crystal unit 17 are mounted on the circuit pattern portion 12L so that the crystal unit 17 is disposed inside the shared component placement hole 14.
FIG. 2D shows a long tape shape in which the mounting of the IC chip 16 to all the circuit pattern portions 12L formed on the left side and the mounting of the terminals of the crystal resonator 17 to the circuit pattern portion 12L are completed. 1 shows a flexible circuit board 10. That is, the long tape-shaped flexible circuit base substrate 10 in a state where the remaining one-side mounting is completed is shown.
Finally, the long tape-shaped flexible circuit board 10 on which the remaining one-side mounting is completed is conveyed from the component mounting line to the press line. In the press line, all the circuit pattern portions 12L formed on the left side of the tape-shaped flexible circuit base substrate 10 are removed by punching. The IC chip 16 and the crystal resonator 17 are already mounted on the individual circuit pattern portions 12L that have been removed, and individual circuit board modules are completed simultaneously with the punching. Further, the tape-shaped flexible circuit base substrate 10 from which the left circuit pattern portion 12L has been removed is wound around a reel. In this way, the manufacture of the circuit board module using the left side of the tape-shaped flexible circuit base board 10 is completed. Therefore, the long tape-shaped flexible circuit base board according to the present invention configured by sharing the component arrangement holes is used. The manufacturing of the circuit board module using 10 is completed.
FIG. 2 (e) shows a long tape-shaped flexible circuit base substrate 10 in which all circuit pattern portions 12L and 12R formed on the left and right are removed by stamping. That is, a used state of the tape-shaped flexible circuit base substrate 10 configured by sharing the component arrangement holes is shown.

本発明の実施例１のテープ状フレキシブル回路元基板の部分拡大平面図である。It is a partial enlarged plan view of the tape-shaped flexible circuit base substrate of Example 1 of the present invention. 本発明の実施例１のテープ状フレキシブル回路元基板を用いた時計用回路基板モジュールの製造工程を説明する図である。It is a figure explaining the manufacturing process of the circuit board module for timepieces using the tape-shaped flexible circuit base board of Example 1 of this invention. 従来のテープ状フレキシブル回路元基板の部分拡大平面図である。It is a partial enlarged plan view of a conventional tape-shaped flexible circuit base substrate.

符号の説明Explanation of symbols

１０ フレキシブル回路元基板
１１Ｌ，１１Ｒ 回路基板形成部
１２Ｌ，１２Ｒ 回路パターン部
１３Ｌ，１３Ｒ 回路基板取付け孔
１４ 共用の部品配置孔
１５Ｌ，１５Ｒ 搬送用スロット
１６ ＩＣチップ
１７ 水晶振動子
２０ フレキシブル回路元基板
２１Ｌ，２１Ｒ 回路基板形成部
２２Ｌ，２２Ｒ 回路パターン部
２３Ｌ，２３Ｒ 回路基板取付け孔
２４Ｌ，２４Ｒ 部品配置孔
２５Ｌ，２５Ｒ 搬送用スロット DESCRIPTION OF SYMBOLS 10 Flexible circuit base board 11L, 11R Circuit board formation part 12L, 12R Circuit pattern part 13L, 13R Circuit board mounting hole 14 Common component arrangement hole 15L, 15R Transport slot 16 IC chip 17 Crystal oscillator 20 Flexible circuit base board 21L , 21R Circuit board forming portions 22L, 22R Circuit pattern portions 23L, 23R Circuit board mounting holes 24L, 24R Component placement holes 25L, 25R Transport slots

Claims (5)

配線が形成されている回路パターン部と、前記配線と結合する電子素子を逃がす部品配置孔とを有する回路基板形成部を備え、
前記回路基板形成部は、長手方向に左右２列に整然と形成されており、
隣り合う左右の前記回路基板形成部は前記部品配置孔を中間に配置し共用化して形成されていることを特徴とする回路元基板。 A circuit board forming portion having a circuit pattern portion in which wiring is formed and a component placement hole for releasing an electronic element coupled to the wiring;
The circuit board forming part is formed in order in two rows on the left and right in the longitudinal direction,
Adjacent left and right circuit board forming portions are formed by arranging and arranging the component arrangement holes in the middle. 前記部品配置孔は長手方向に対し斜めにして形成されていることを特徴とする請求項１記載の回路元基板。 2. The circuit board according to claim 1, wherein the component arrangement hole is formed obliquely with respect to the longitudinal direction. 前記回路元基板は、ポリイミドを素材としたテープ状フレキシブルな形状であることを特徴とする請求項１又は２に記載の回路元基板。 The circuit board according to claim 1 or 2, wherein the circuit board has a tape-like flexible shape made of polyimide. 回路パターン部と部品配置孔とを有する回路基板形成部が長手方向に左右２列に整然と形成された請求項１乃至３のいずれかに記載された回路元基板における左右の前記回路基板形成部のうちのいずれか一方の前記回路基板形成部の前記部品配置孔に電気部品を配置して前記回路パターン部に実装するステップと、
前記いずれか一方の回路基板形成部の前記回路パターン部を前記回路元基板から切り離すステップと、
前記回路元基板における左右の前記回路基板形成部のうちの他方の前記回路基板形成部の前記部品配置孔に前記電気部品を配置して前記回路パターン部に実装するステップと、
前記他方の回路基板形成部の前記回路パターン部を前記回路元基板から切り離すステップと、有する回路基板モジュールの製造方法。 4. The circuit board forming portions having circuit pattern portions and component placement holes are formed in order in two rows on the left and right in the longitudinal direction. Placing an electrical component in the component placement hole of any one of the circuit board forming portions and mounting the electrical component on the circuit pattern portion;
Separating the circuit pattern portion of any one of the circuit board forming portions from the circuit base substrate;
Placing the electrical component in the component placement hole in the other circuit board forming part of the left and right circuit board forming parts on the circuit base board and mounting the circuit board on the circuit pattern part;
A step of separating the circuit pattern part of the other circuit board forming part from the circuit base board; and a method of manufacturing a circuit board module. 前記時刻を計数し、請求項１乃至３のいずれかに記載の回路元基板から切り取られた回路基板を有する時刻計数部と、
前記時刻計数部で計測された状態を表示するため駆動するに駆動部と、
前記駆動部によって時刻を表示する表示部と、を有する電子時計。 A time counting unit that counts the time and has a circuit board cut from the circuit base board according to claim 1;
A driving unit for driving to display the state measured by the time counting unit;
An electronic timepiece having a display unit for displaying time by the driving unit.
JP2004194269A 2004-06-30 2004-06-30 Circuit original substrate, circuit substrate module manufacturing method and electronic clock Pending JP2006019416A (en)

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CN 200510080980 CN1716135A (en) 2004-06-30 2005-06-30 Circuit base board, method for producing circuit base board and electronic clock

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FR2626999B1 (en) * 1988-02-05 1993-08-27 Jaeger DEVICE INCLUDING A TRANSMISSION PASSIVE DISPLAY ELEMENT IN PARTICULAR FOR AN ELECTRONIC WATCH OF A MOTOR VEHICLE
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