JP2006019168A - Gas discharge panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing technology of a new gas discharge panel in which a large exhaust conductance can be secured at exhausting before filling an ultraviolet ray emitting gas in the gas discharge panel. <P>SOLUTION: The gas discharge panel comprises two sheets of substrates opposed to each other through an internal space of rectangular shape sealed by a sealing material, a barrier rib region provided in the internal space, and a ventilation port opened at the surroundings of the internal space. The barrier rib is formed so that the distance from the sealing material to the barrier rib end part in one of the long side of the substrate near the ventilation port may be longer than the distance from the sealing material to the barrier rib end part in the other long side of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a gas discharge panel such as a plasma display (PDP).

  As a gas discharge panel, an AC plasma display panel (PDP) having a three-electrode surface discharge structure has been commercialized. The gas discharge panel has two substrates facing each other with a rectangular internal space sealed with a sealing material, and a partition region having a plurality of partitions provided in the internal space. In this internal space, a discharge gas is sealed, and the ultraviolet light emission gas is excited by discharge into a plasma state, and the phosphor is made to emit light using the ultraviolet light generated when returning from the plasma state to the original state. However, in order to enclose the ultraviolet light emission gas in the internal space, it is necessary to evacuate the internal space to be in a vacuum state. For this reason, vents are provided in the peripheral part of the internal space. The vent is sealed after exhausting the interior space and sealing the ultraviolet light emission gas in the interior space. In many cases, the gas discharge panel is heated to promote desorption of adsorbed molecules and promote exhaust.

  In a plasma display, exhaust is performed in this way. However, if the conductance of the panel exhaust is low, it cannot be exhausted sufficiently, and impurities such as water, carbon dioxide, and hydrocarbons may remain inside the panel. is there. In such a case, the discharge characteristics of the plasma display deteriorate, and the value as designed is not exhibited, or the life of the panel is shortened. In addition, in order to improve the display performance of panels, PDPs that change the shape of the partition wall from a stripe shape to a grid-like partition wall shape have emerged in recent years. In this case, the exhaust conductance of the panel becomes lower and the exhaust of the panel becomes more difficult. It becomes.

  In order to solve such problems, the improvement in the distance Wl from the long side portion of the sealing material as shown in FIG. 9 to the end portion of the partition wall adjacent to the long side portion improves the exhaust efficiency of the panel. A structure that makes Wl larger than the distance Ws on the short side has been proposed (see, for example, Patent Document 1). However, the distance from the long side part of the sealing material to the end of the partition wall close to the long side part is greater than the distance from the short side part of the sealing material to the partition wall close to the short side part. Therefore, there is a problem that the degree of freedom in determining the size of the peripheral area existing outside the display area is small with respect to the display area of the predetermined PDP.

A method of providing grooves in the non-display areas of the back substrate 3 and the front substrate 2 has also been proposed (see, for example, Patent Document 2). This method is intended to increase the exhaust conductance while suppressing the non-display area as much as possible, and has a feature that it can be manufactured with almost the same number of steps as compared to the conventional manufacturing process. It is claimed. However, this method requires a separate step of forming a groove in the substrate, and there is a problem that the manufacturing cost increases.
JP 2003-217457 A (Claims) JP-A-11-238466 (Claims)

  As described above, the conventional method has a problem that the conductance in the exhaust is small, or as a result of increasing the conductance, the size of the peripheral area is limited with respect to a predetermined display area, and the manufacturing cost is increased. Have

  An object of the present invention is to provide a new technique capable of solving such problems and ensuring a large conductance. Still other objects and advantages of the present invention will become apparent from the following description.

  The conductance in the present invention is a characteristic value defined as the amount of flowing gas divided by a pressure difference with respect to a certain part of the vacuum system. “Exhaust conductance” is referred to as “exhaust conductance” in the present invention.

  According to one embodiment of the present invention, the periphery of two substrates having a long side portion and a short side portion arranged to face each other is sealed with a sealing material, and a plurality of inner spaces between the sealed substrates are provided. In a gas discharge panel provided with a partition wall and provided with a vent on one substrate in a region between the partition and the seal, the sealing material on one long side of the substrate close to the vent A gas discharge panel is provided in which the partition is formed such that the distance from the end of the partition to the end of the partition is greater than the distance from the sealing material on the other long side to the end of the partition.

  According to another aspect of the present invention, the periphery of two substrates having a long side portion and a short side portion arranged opposite to each other is sealed with a sealing material, and the inner space between the sealed substrates is formed. In the gas discharge panel in which a plurality of partition walls are provided and a vent is provided on one of the substrates in the region between the partition and the sealing, the partition wall is viewed from the long side of the substrate close to the vent. There is provided a gas discharge panel in which the center of the formed region is set at a position far from the center of the internal space sealed with the sealing material to form a partition.

  By these aspects, a gas discharge panel with improved panel characteristics can be realized.

  For the gas discharge panel and the manufacturing method thereof, the distance from the sealing material at the long side of the substrate close to the vent to the end of the partition wall is 3 mm or more, and the sealing material at the long side of the substrate close to the vent A recess is formed on at least one of the substrates in the region between the partition wall region, and between the sealing material and the partition wall region on the other long side facing the substrate long side near the vent. Within the region, there is a recess on at least one of the substrates, and the average depth of the recess in the region between the sealing material and the partition wall end in the long side of the substrate close to the vent is the other opposite Substrate in the region between the sealing material and the partition wall region in the long side portion of the substrate that is larger than the average depth of the concave portion of the substrate portion in the region between the sealing material and the partition wall region in the long side portion At the depth of the concave part and the other long side At least one of the depths of the concave portions of the substrate portion in the region between the sealing material and the partition wall region has a depth of 20 μm or more, and the power supply wiring to the address electrode is the long side of the substrate far from the vent hole The concave portion of the substrate portion in the region between the sealing material and the partition wall region in the other long side portion opposite to the substrate long side portion close to the vent hole is provided from the partition wall region. It is preferable to have a portion that gradually becomes deeper toward the sealing material, to form the partition wall region and the recess simultaneously, and to form the partition wall region and the recess by sandblasting or etching.

  According to still another aspect of the present invention, a gas discharge panel display device including the gas discharge panel described above is provided.

  According to the present invention, it is possible to realize a gas discharge panel with improved panel characteristics, in which a new gas discharge panel capable of ensuring a large exhaust conductance is produced before exhausting the ultraviolet light emitting gas into the gas discharge panel.

  Embodiments of the present invention will be described below with reference to the drawings, examples and the like. In addition, these figures, Examples, etc. and description illustrate the present invention, and do not limit the scope of the present invention. It goes without saying that other embodiments may belong to the category of the present invention as long as they match the gist of the present invention. In the drawings, the same reference numeral represents the same element.

  Hereinafter, the PDP will be described as a representative of the gas discharge panel. FIG. 1 shows an exploded view of an example of a conventional PDP, and FIG. 2 shows a cross-sectional view thereof. 1 and 2, a person views the panel from the direction along the arrow. The PDP 1 has a structure in which the front substrate 2 and the rear substrate 3 face each other. In this example, a display electrode 4, a dielectric layer 5, and a protective layer 6 for electrode protection are sequentially laminated on the inner side of the front substrate 2 (the side facing the rear substrate 3). An address electrode 7 and a dielectric layer 8 extending in a direction perpendicular to the display electrode are sequentially laminated on the side facing the substrate 2, and a partition wall (rib) 9 and red, green, and blue There is a phosphor layer 10. In many cases, the dielectric layer 8 may not be provided in the case of applying a voltage between two display electrodes to cause discharge as shown in FIG.

  A discharge space 11 surrounded by the dielectric layer 5, the barrier ribs 9, and the phosphor layer 10 is filled with an ultraviolet light emitting gas such as neon gas or xenon gas. The PDP 1 applies a voltage between two display electrodes to cause a discharge, excites an ultraviolet light emission gas into a plasma state, and utilizes the ultraviolet light generated when returning from the plasma state to the original state. Visible light display is realized by causing the phosphor of the layer 10 to emit light. A color filter, an electromagnetic wave shielding sheet, an antireflection film, etc. are often attached to the PDP. By attaching an interface with a power supply unit and a tuner unit to the PDP, a gas discharge panel display device such as a large television device (plasma television) can be obtained.

  For the substrate of the PDP, soda lime glass, high strain point glass or the like is used. Any material may be used for the address electrode as long as it has conductivity. Usually copper is used. For the dielectric layer, a glass plate, a low melting point glass or the like is used. The partition wall 9 is made of low-melting glass.

  A gas discharge panel according to the present invention includes two substrates facing each other with a rectangular internal space sealed with a sealing material, a partition wall region provided in the internal space, and a peripheral portion of the internal space And a sealing material (hereinafter referred to as “the vent side long side portion”) on one long side portion (hereinafter also referred to as “the vent side long side portion”) of the substrate close to the vent port. The distance from the sealing member to the end of the partition wall is the other long side part facing the long side part (hereinafter, the opposing long knitted part is also called the “opposing long side part”). The partition wall is formed so as to be larger than the distance from the sealing material (hereinafter also referred to as “opposing long side part sealing material”) to the end of the partition wall. If there are a plurality of vents, one of them may be determined. You may judge about all the vents. The vent may be provided on either the front substrate or the rear substrate. The vent is preferably near the intersection of the sealing material on the long side of the substrate and the sealing material on the short side.

  This is schematically shown in FIG. FIG. 3 is a schematic plan view of the PDP. As shown in FIG. 3, the sealing material 31 according to the present invention is between two opposing substrates (a front substrate 2 and a back substrate 3), and forms a closed space. This closed space is the internal space 32. When the ultraviolet light emission gas is sealed in the internal space, the space corresponding to the region where the partition walls are formed becomes the discharge space. However, the internal space is often made rectangular. For example, even if the corner is slightly rounded or partially distorted, it belongs to the category of the rectangular internal space according to the present invention.

  A partition wall region 33 formed by a plurality of partition walls is provided in the internal space 32, and there is a vent 34 that opens to the periphery of the internal space 32. A distance WT1 from the vent-side long side sealing material 311 close to the vent 34 to the end of the partition wall is larger than a distance WT2 from the opposed long-side sealing material 312 to the partition region. A partition wall region 33 is formed.

  In FIG. 3, the partition wall region 33 is formed of a stripe-shaped partition wall. The partition walls may have a wavy stripe pattern or a lattice pattern. FIG. 4 schematically shows striped partition walls having undulations. The three-dimensional shape of the partition is a rectangular parallelepiped, for example, as shown in FIG.

  The partition wall region according to the present invention is a rectangle having a long side parallel to the long side of the rectangle of the internal space sealed by the sealing material, and can include all the partition walls inside the rectangle. Can be defined as the smallest rectangle. Reference numeral 33 in FIG. 3 corresponds to this partition wall region. For some reason, as shown in FIG. 5, when the partition wall is uneven, the partition wall region 33 in FIG. 5 is obtained.

  In the upper right of FIG. 3, there is a vent 34 that opens to the periphery of the internal space according to the present invention. The peripheral portion of the internal space according to the present invention is in the internal space, and for the short side of the rectangle, the distance from the short side is 1/10 or less of the length of the long side, and the rectangle About the long side part side of this means that the distance from the long side is 1/10 or less of the length of a short side. It may be a peripheral portion of the internal space for both the short side and the long side.

  As a result of the examination, it has been found that it is advantageous to improve the exhaust conductance to satisfy WT1> WT2. Further, conventionally, the center of the partition wall region, which is the region where the partition wall is formed, has been arranged so as to coincide with the center of the internal space surrounded by the sealing material of the substrate provided with the partition wall. Such an arrangement is not preferable from the viewpoint of exhaust conductance. Rather, the center of the partition wall region is located farther from the center of the substrate on which the partition wall is provided as viewed from the vent side long-side sealing material. The setting is preferable because the exhaust conductance can be further improved without changing WT1 + WT2. Specifically, as shown in FIG. 6A, the center Y of the partition wall region 33 overlaps the center X of the internal space surrounded by the sealing material of the substrate (in this case, the back substrate 3). As shown in FIG. 6B, the partition wall region 33 is arranged so that the center Y is at a position farther from the center X when viewed from the vent-side long-side sealing material 311. In this way, for example, the exhaust conductance can be further improved while WT1 + WT2 = constant. This means that a gas discharge panel with improved panel characteristics can be realized by relaxing restrictions on the size of the display area of the gas discharge panel.

  In the present invention, “center” means, for example, the intersection of two diagonal lines of a rectangle formed by the partition wall region as shown in FIGS. 6A and 6-B.

  The internal space is generally formed by applying frit glass on either the front substrate or the back substrate to form a sealing material, and then bonding and heating. After that, a vent pipe is attached to the vent, the vent pipe is attached to a vacuum device, the panel is heated while evacuating the inner space through the vent pipe, and the inner space is mainly a protective layer for the front substrate. A gas discharge panel is completed by removing the gas adsorbed on MgO, and then introducing a discharge gas from the vent tube and sealingly cutting the vent tube. When the gas discharge panel having the above configuration is used, a large exhaust conductance can be obtained during the vacuum suction. The exhaust conductance may be improved by 10% or more. For this reason, productivity can be improved and panel characteristics can be improved with little modification of conventional processes.

  As will be described later, it has been found that the exhaust conductance can be rapidly increased as the value of WT1 is increased, and then gradually becomes saturated. It has been found that the distance from the vent side long side sealing member close to the vent to the end of the partition wall, that is, the WT1 is preferably 3 mm or more. However, it should be noted that if WT1 is too large, the partition wall region is narrowed, and thus the light emitting region is narrowed.

  It is desirable that at least one substrate portion in a region between the vent side long side portion sealing material and the partition wall region further has a recess. This is because the conductance can be increased by increasing the cross-sectional area of the corresponding part as will be described later. The cross-sectional shape of the recess may be any.

  Further, the substrate portion in the gap between the facing long side sealing material and the partition wall region can also have a recess. In this case, the average depth of the concave portion of the substrate portion in the gap between the vent-side long-side sealing material and the partition wall region is equal to that of the substrate portion in the region between the opposed long-side sealing material and the partition wall region. It is preferably larger than the average depth of the recesses. This is because the concave portion of the substrate portion in the region between the facing long side portion sealing material and the partition wall region may have a large burden of increasing the volume of the internal space. When the three-dimensional shape of the recess is a rectangular parallelepiped or a slightly rounded rectangular parallelepiped, the average depth can be determined by dividing the total volume of the recess by the opening area.

  Further, the depth of the concave portion of the substrate portion in the region between the vent side long side portion sealing material and the partition wall region and the concave portion of the substrate portion in the region between the opposed long side portion sealing material and the partition wall region It has been found that at least one of the depths preferably has a depth of 20 μm or more.

  Although a concave portion may be provided on the short side portion, care must be taken because the exhaust conductance may not increase for an increase in the amount of gas to be exhausted.

  Conventionally, the address electrode and its power supply wiring are usually arranged on the substrate before the partition is formed. In that case, the address electrode and the power supply wiring are connected to the address electrode on the long side near the vent. When there is a power supply wiring, it is difficult to provide a recess in a region between the vent-side long side portion sealing material and the partition region. Further, if an address electrode or a power supply wiring is to be formed on the substrate after the partition wall is formed, a wiring forming technique corresponding to the complicated shape of the recess is required, and the process becomes complicated. Therefore, from this viewpoint, it is preferable to provide a power supply wiring to the address electrode on the opposite long side.

  Note that the above problem cannot be avoided when the substrate portion in the gap between the facing long side portion sealing material and the partition wall region has a recess. However, in such a case, the concave portion of the substrate portion in the region between the opposing long side sealing material and the partition wall region is a portion that gradually becomes deeper from the partition region toward the opposing long side sealing material. The problem can be reduced by having it. For example, if the recess is formed from the partition wall through a gentle slope portion, the electrode / wiring can be easily formed by sputtering or plating even if the address electrode and the power supply wiring are not coplanar. Because. The slope of the slope is preferably 60 ° or less.

  In the case of producing these recesses, it is reasonable to form the partition wall region and the recesses simultaneously. If there is no power supply wiring to the address electrode on the vent side long side, even if the power supply wiring to the address electrode is formed in advance, the partition wall region and the recess can be formed simultaneously without any problem. In addition, if the address electrode and the power supply wiring are not formed in advance, the boundary region and the recess can be formed at the same time, so that the boundary region between the partition region and the recess can be smoothly connected. Is easy to form. In particular, the formation of the address electrode and the power supply wiring is facilitated by having a portion that gradually becomes deeper from the partition wall region toward the sealing material of the opposing long side portion. Sandblasting or etching is preferably employed for forming the partition wall region and the recess.

  As described above, it is possible to provide a new gas discharge panel manufacturing technique capable of ensuring a large exhaust conductance during exhaust before enclosing the ultraviolet light emitting gas in the gas discharge panel. Specifically, the exhaust conductance can be expected to be improved by 10% or more with almost no modification of the conventional process. In addition, a gas discharge panel with improved panel characteristics can be realized by reducing the restriction on the size of the display area.

  If this gas discharge panel is used, when manufacturing a gas discharge panel display device such as a flat display television device, manufacturing costs can be reduced and yield can be improved. Moreover, since the manufacturing process is easy, quality improvement of the gas discharge panel display device is expected.

Hereinafter, the present invention will be described more specifically with reference to examples. In the following,
WT1: distance from the sealing material on the long side of the substrate close to the vent to the end of the partition wall WT2: distance from the sealing material on the long side of the facing to the end of the partition wall Ws: sealing at the short side of the substrate It is defined as the distance from the stopper to the partition.

[Example 1]
This example is an arrangement example of WT1> WT2 in the PDP. FIG. 3 is a schematic plan view of the embodiment. By making WT1 wider than WT2, the exhaust conductance of the panel can be improved and the exhaust efficiency can be improved. It was found from simulations and experimental results that the exhaust conductance of the panel hardly changed even when WT2 and WTs were changed.

  The effect of the improvement is shown in FIG. FIG. 7 shows a simulation of the relationship between WT1 and the relative value of exhaust conductance when WT2 = 1 mm. The exhaust conductance relative value in this case means a value obtained by dividing the exhaust conductance under a certain condition by the exhaust conductance when WT1 = 1 mm and WT2 = 1 mm are adopted. From this figure, it is understood that when the exhaust conductance is 1.0 when WT1 = WT2 = 1 mm, the exhaust conductance is improved as WT1 is increased. It was also found that WT1 ≧ 3 mm, which is expected to have an improvement effect of about 10% or more, is useful. In this example, the exhaust conductance tends to be saturated when WT1 is 4 to 5 mm or more.

  Conventionally, the center of the partition region and the center of the inner space have been arranged to coincide with the center of the front substrate and the rear substrate, but considering the exhaust conductance, for example, the center of the inner space is left as it is, By setting the center to be far from the center of the internal space when viewed from the vent side long side part sealing material, WT1 can be increased while keeping WT1 + WT2 constant, and the shape of the partition wall region Exhaust conductance can be increased without changing the display area, and thus without narrowing the display area. In some cases, the exhaust conductance can be improved while reducing the non-display area. In addition, if possible, it may be useful that the center of the internal space is located closer to the center of the partition wall region when viewed from the vent-side long-side sealing material.

[Example 2]
In this example, in the PDP, in addition to the condition of WT1> WT2, the substrate portion in the region between the vent side long side portion sealing material and the partition wall region has a recess, and power is supplied to the address electrode. The wiring is for the form provided on the opposite long side.

  FIG. 8A is a schematic plan view of the embodiment of the present invention. As shown in FIG. 8B, which is a schematic cross-sectional view taken along the line AA of FIG. 8-A, the substrate near the vent side long side portion sealing material is processed by sandblasting, etching process, or the like. Form. The recess may be on the front substrate, as shown in FIG. 8C where the portion surrounded by ○ in FIG. 8B is taken out, or on both the front substrate and the back substrate. Exhaust conductance can be increased due to the presence of such a recess. Moreover, the recessed part may be extended beyond the sealing material, as shown to the schematic sectional drawing of FIGS. In this way, the recess can be easily maximized without complicating the configuration.

  In this case, the power supply wiring 82 of the address electrode is preferably provided on the facing long side sealing material 312 side. Since there is no recess on the opposite long side sealing material 312 side, wiring from the address electrode to the power supply wiring can be performed on the same surface, and the process is not complicated.

  In the case of a recess having a shape as shown in the schematic cross-sectional view of FIG. 8D, generally, such a recess can be approximated by a shape in which square conduits are connected in series. At that time, the exhaust conductance C of the rectangular conduit as shown in FIG. 10 is generally expressed by the following mathematical formula in the degree of vacuum in the molecular flow region (on the order of 1 Pa).

C = K × A × B ² / L
Here, A is the width of the rectangular conduit and corresponds to the region between the sealing material and the partition region (W in FIG. 8D). B is the height of the rectangular conduit, and corresponds to the sum of the depth H1 of the recess and the height H2 of the partition wall in FIG. L is the length of the rectangular conduit and corresponds to the length of the recess. K is a correction coefficient.

  As can be seen from this equation, the exhaust conductance C increases by a square when the height of the conduit increases. FIG. 11 shows the relationship between H1 and the exhaust conductance relative value when H2 is 100 μm, 150 μm, and 200 μm, respectively. The exhaust conductance relative value means a value obtained by dividing the exhaust conductance when a certain H1 value is adopted by the exhaust conductance when H1 is 0 μm. From FIG. 11, it can be understood that the improvement effect of H1 decreases as the height of the partition wall increases, but if H1 is 20 μm or more, the exhaust conductance can be improved by 20% or more.

  8A shows an embodiment in which an address driver is provided at the lower part of the drawing and an air vent 34 is provided at the upper part of the drawing. The same effect can be obtained even in a form having a vent in the lower part of the drawing.

[Example 3]
In this example, in the PDP, in addition to the condition of WT1> WT2, the concave portion of the substrate portion in the region between the facing long-side sealing material and the partition wall region is changed from the partition wall region to the facing long-side sealing material. It is an example which has the part which becomes deep gradually toward.

  12A is a schematic perspective view of this example, and FIG. 12B is a schematic cross-sectional view of this example. As a method for forming the partition walls and the recesses as shown in FIGS. 12A and 12B, a method of directly cutting the glass of the substrate directly by sandblasting or etching can be employed. At that time, a gradually deepening portion 91 is provided. Specifically, by performing a process such as sandblasting on a substrate having a vent 34 as shown in the perspective view of FIG. 13-A, as shown in the perspective view of FIG. Then, address wiring is formed as shown in the perspective view of FIG. 13-C. In this case, by subsequently forming the address electrode and the power supply wiring to the address electrode at the same time, it is possible to form the partition wall, the electrode, and the power supply wiring with almost the same or fewer steps as before.

  Compared with the first embodiment, this method increases the number of steps for processing the substrate, but has the advantage that the effect of improving the exhaust conductance is increased. Further, compared with the second embodiment, it is possible to cut simultaneously when the partition walls are formed, so that there is an advantage that the exhaust conductance can be improved without increasing the number of extra steps.

  In addition, the invention shown to the following additional remarks can be derived from the content disclosed above.

(Appendix 1)
The periphery of the two substrates having the long side portion and the short side portion arranged opposite to each other is sealed with a sealing material, and a plurality of partition walls are provided in the internal space between the sealed substrates. In the region between the seals, in the gas discharge panel provided with a vent on one substrate,
The distance between the sealing material and the partition wall end in one long side portion of the substrate close to the vent is more than the distance from the sealing material in the other long side portion of the substrate to the end portion. A gas discharge panel in which the partition walls are formed to be large.

(Appendix 2)
The periphery of the two substrates having the long side portion and the short side portion arranged opposite to each other is sealed with a sealing material, and a plurality of partition walls are provided in the internal space between the sealed substrates. In the region between the seals, in the gas discharge panel provided with a vent on one substrate,
The partition is formed by setting the center of the partition forming region at a position farther from the center of the internal space sealed with the sealing material when viewed from the long side portion of the substrate near the vent. Gas discharge panel.

(Appendix 3)
The gas discharge panel according to appendix 1 or appendix 2, wherein the distance from the sealing material at the long side portion of the substrate close to the vent to the end of the partition wall is 3 mm or more.

(Appendix 4)
The gas discharge panel according to any one of appendices 1 to 3, wherein a concave portion is provided on at least one of the substrates in a region between the sealing material and the partition wall in the long side portion of the substrate close to the vent hole. .

(Appendix 5)
The gas discharge panel according to claim 4, wherein the concave portion is formed so as to gradually become deeper from the end portion of the partition wall toward the sealing material.

(Appendix 6)
6. The gas discharge panel according to appendix 4 or appendix 5, wherein the power supply wiring to the address electrode is provided on the long side portion facing the long side portion of the substrate close to the vent.

(Appendix 7)
Any one of Supplementary notes 1 to 4, wherein a concave portion is provided on at least one substrate in a region between the sealing material and the partition wall in a long side portion facing the long side portion of the substrate close to the vent hole. A gas discharge panel according to claim 1.

(Appendix 8)
The gas discharge panel according to claim 7, wherein the concave portion is formed so as to gradually become deeper from the end portion of the partition wall toward the sealing material.

The typical exploded view of an example of conventional PDP is shown. A schematic cross-sectional view of an example of a conventional PDP is shown. It is a schematic plan view of PDP. It is a figure which shows typically the stripe-shaped partition which has a wave | undulation. It is a schematic diagram which shows the method of determining a partition area | region when there exists unevenness in the position of a partition. It is a schematic diagram which shows the relationship between the center Y of a partition area | region, and the center X of the internal space enclosed with the sealing material of the board | substrate which provided the partition. It is another schematic diagram which shows the relationship between the center Y of a partition area | region, and the center X of the internal space enclosed with the sealing material of the board | substrate which provided the partition. It is a graph which shows the result of having simulated the relationship between WT1 and the relative value of exhaust conductance. It is a typical top view of an embodiment (PDP) of the present invention. It is typical sectional drawing cut | disconnected by AA of FIG. 8-A. It is the figure which took out the part enclosed by (circle) of FIG. 8-B. It is the figure which took out the part enclosed by (circle) of FIG. 8-B. It is the figure which took out the part enclosed by (circle) of FIG. 8-B. It is the typical top view which showed the example of the conventional PDP structure. FIG. 3 is a diagram of a square conduit. It is a graph which shows the relationship between H1 and an exhaust conductance relative value. 6 is a schematic perspective view of a PDP in Example 3. FIG. 6 is a schematic cross-sectional view of a PDP of Example 3. FIG. 10 is a perspective view showing a substrate before the configuration of Example 3 is manufactured. FIG. It is a perspective view which shows the board | substrate after performing processes, such as sandblasting, to the board | substrate of FIG. 13-A. It is a perspective view which shows a mode that the address electrode was formed on the board | substrate of FIG. 13-B.

Explanation of symbols

1 PDP
DESCRIPTION OF SYMBOLS 2 Front substrate 3 Back substrate 4 Display electrode 5 Dielectric layer 6 Protective layer 7 Address electrode 8 Dielectric layer 9 Partition 10 Phosphor layer 11 Discharge space 31 Sealing material 32 Internal space 33 Partition region 34 Vent 311 Vent side length Side sealing material 312 Opposing long side sealing material 81 Recess 82 Address electrode power supply wiring 91 Slightly deeper portion

Claims (5)

The periphery of the two substrates having the long side portion and the short side portion arranged opposite to each other is sealed with a sealing material, and a plurality of partition walls are provided in the internal space between the sealed substrates. In the region between the seals, in the gas discharge panel provided with a vent on one substrate,
The distance between the sealing material and the partition wall end in one long side portion of the substrate close to the vent is more than the distance from the sealing material in the other long side portion of the substrate to the end portion. A gas discharge panel in which the partition walls are formed to be large. The periphery of the two substrates having the long side portion and the short side portion arranged opposite to each other is sealed with a sealing material, and a plurality of partition walls are provided in the internal space between the sealed substrates. In the region between the seals, in the gas discharge panel provided with a vent on one substrate,
The partition wall is formed by setting the center of the region where the partition wall is formed at a position farther from the center of the internal space sealed with the sealing material when viewed from the long side of the substrate near the vent. A gas discharge panel characterized by that.   The gas discharge panel according to claim 1 or 2, wherein a distance from a sealing material in a long side portion of the substrate close to the vent hole to a partition wall end portion is 3 mm or more.   The gas discharge according to any one of claims 1 to 3, wherein a recess is provided on at least one of the substrates in a region between the sealing material and the partition wall in the long side portion of the substrate close to the vent hole. panel.   The gas discharge panel according to claim 4, wherein the concave portion is formed so as to gradually become deeper from the end portion of the partition wall toward the sealing material.

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